JP2019132983A - Method for manufacturing heating member - Google Patents

Abstract

To provide a method for manufacturing a heating member capable of forming a highly accurate metal pattern.SOLUTION: A method for manufacturing a heating member 10 for heating a body to be heated comprises the steps of: forming a plating base pattern 14b including a plating catalyst and a binder by discharging a coating material for forming a plating base including the plating catalyst and the binder onto a base layer 12 by an inkjet dispenser; and forming a metal pattern 14a on a plating base of the plating base pattern 14b by plating the plating base pattern 14b.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for manufacturing a heating member, and more particularly to a method for manufacturing a heating member suitably used in a fixing process of an electrophotographic apparatus.

  In electrophotographic equipment such as copying machines, printers, and facsimiles that employ an electrophotographic system, a toner image is formed on a recording medium (such as paper), and this is heated and pressed by a heating member (fixing member) to be fixed. An image is formed. This fixing process accounts for most of the power consumption of electrophotographic equipment. For this reason, the improvement of a heating member is calculated | required from a viewpoint of energy saving.

  For example, in Patent Document 1, conventionally, a heater is incorporated in a hollow metal shaft and the outer peripheral surface of an elastic material layer provided around the hollow metal shaft is heated using this heater as a heat source. Proposal to shorten the warm-up time of the fixing device and save energy by using a rotating rotating body that has a metal pattern that can be heated and energized on the outer or inner surface of a cylindrical body made of doing. The metal pattern is formed by applying a conductive paste containing metal to the outer peripheral surface or inner peripheral surface of the cylindrical body.

Japanese Patent No. 5544801

  The method of applying a conductive paste to form a metal pattern is inferior in the precision of the thin line portion. As a result, there is a problem that temperature unevenness is likely to occur.

  The problem to be solved by the present invention is to provide a method for manufacturing a heating member capable of forming a highly accurate metal pattern.

  In order to solve the above-mentioned problems, a heating member manufacturing method according to the present invention is a heating member manufacturing method for heating an object to be heated, which is based on a coating for forming a plating base containing a plating catalyst and a binder by an ink jet dispenser. And a step of forming a plating base containing a plating catalyst and a binder in a pattern by discharging onto the plating base, and a step of plating the plating base formed in a pattern to form a metal pattern on the plating base. This is the gist.

  At this time, the viscosity of the coating for forming a plating base is preferably in the range of 1.0 to 1000 mPa · s. And it is preferable that the internal diameter of the nozzle from which the ink of the said inkjet dispenser is discharged exists in the range of 0.05-0.3 mm.

  According to the method for manufacturing a heating member according to the present invention, the above-described plating base is formed in a pattern by discharging the coating base-forming coating material onto the base layer by an inkjet dispenser. It can be formed into a thin line. And, since the metal pattern is formed on the plating base by performing plating on the pattern-shaped plating base formed with high precision, the patterning accuracy is improved as compared with the conventional method of forming the metal pattern by applying the conductive paste, Temperature unevenness is improved.

  At this time, if the viscosity of the coating base forming coating is within a specific range, the coating base bleeding is suppressed and the coating leveling is improved when the plating base forming coating is discharged onto the base layer. Thereby, a patterned plating base can be formed with higher accuracy. And when the internal diameter of the nozzle from which the ink of the inkjet dispenser is discharged is within a specific range, the pattern-like plating base can be formed into a fine line with high accuracy.

It is the external appearance schematic diagram (a) of the heating member which concerns on one Embodiment of this invention, and a part (b) of radial direction cross section. It is an expanded view of a heating member. It is process drawing of the manufacturing method of the heating member which concerns on one Embodiment of this invention. It is a schematic diagram explaining the evaluation method of surface temperature nonuniformity.

  The heating member according to the present invention is used to heat the object to be heated. As long as the object to be heated is heated, the type of the object to be heated is not particularly limited. Examples of the object to be heated include unfixed toner transferred to a recording medium such as paper in an electrophotographic apparatus such as a copying machine, a printer, and a facsimile machine. In this case, the heating member is used as a heating member (fixing member) in the fixing process of the electrophotographic apparatus. Examples of the heating member (fixing member) in the electrophotographic apparatus include a fixing belt formed in a cylindrical shape, a fixing roll formed in a roll shape on the outer periphery of the shaft body, and the like. In terms of durability, the fixing belt and the fixing roll preferably have a seamless structure that is seamless in the circumferential direction.

  Fig.1 (a) is an external appearance schematic diagram of the heating member which concerns on one Embodiment of this invention. FIG.1 (b) is a part of radial cross section of the heating member. FIG. 2 is a development view of the heating member.

  As shown in FIG. 1A, the heating member 10 is formed in a cylindrical shape and has a seamless structure that is seamless in the circumferential direction. As shown in FIG. 1B, the heating member 10 has a base layer 12 and a heat generating portion.

  The base layer 12 is a base of the heating member 10. The base layer 12 is formed in a cylindrical shape and has a seamless structure that is seamless in the circumferential direction. The base layer 12 can be formed of an organic polymer or the like.

  The heat generating portion is a portion that generates heat when energized. As shown in FIG. 2, the heat generating portion is composed of a metal pattern 14 a in the heat generating region l. The metal pattern 14a is a resistance heating element and generates heat when energized. This type of heating member has high heat transfer efficiency, and can quickly raise the surface temperature of the heating member to a predetermined temperature after the start of energization to the resistance heating element, so that the rise is quick.

  The metal pattern 14a is made of a metal wire having a uniform width and may extend along the axial direction of the heating member 10 as shown in FIG. 2 or may have a ring shape in the circumferential direction. . Further, it may be spiral in the axial direction. The metal pattern 14a is formed by this repeating structure. The shape of the metal pattern 14a is not particularly limited. The heating member 10 is configured to generate heat uniformly on its outer peripheral surface, and is configured to prevent temperature unevenness. The end portions of the metal pattern 14 a are connected to power supply portions (electrodes) 18 a and 18 b disposed at the end portions of the heat generating region in the axial direction of the heating member 10. The metal wire is formed by plating as will be described later.

  On the base layer 12 under the metal pattern 14a, there is a plating base pattern 14b. The plating base pattern 14b is a base for forming the metal pattern 14a by plating. The plating base pattern 14b includes at least a plating catalyst necessary for performing plating. The plating base pattern 14b is in contact with the metal pattern 14a and the base layer 12, respectively. The plating base pattern 14b is equal in width to the metal pattern 14a and is formed in the same pattern shape as the metal pattern 14a.

  The heating member 10 can be manufactured by the manufacturing method according to the present invention. Below, embodiment of the manufacturing method which concerns on this invention is described.

  The manufacturing method according to the present invention includes a step of forming a plating base containing a plating catalyst and a binder in a pattern by discharging a coating base forming coating containing a plating catalyst and a binder onto the base layer 12 by an inkjet dispenser, and a pattern Plating the formed plating base (plating base pattern 14b) to form a metal pattern 14a on the plating base.

  First, as shown in FIG. 3A, the base layer 12 is prepared. The base layer 12 can be formed using a base layer forming material containing an organic polymer. When the base layer 12 is cylindrical (belt-shaped), the base layer forming material (paint) is applied to the outer peripheral surface of a cylindrical or columnar mold and dried. You may heat-process as needed. Examples of the coating method include a dip coating method, a dispenser coating method (nozzle coating method), a roll coating method, and a ring coating method. When the base layer 12 is in a roll shape, the base layer forming material (kneaded material) is injected into a roll molding die and heat-treated. Alternatively, the base layer forming material (kneaded material) is extruded.

  The organic polymer of the base layer 12 is preferably an organic polymer having excellent heat resistance. Examples of the organic polymer of the base layer 12 include polyamideimide, modified polyamideimide, polyimide, modified polyimide, polyethersulfone, fluororesin, and polycarbonate. These may be used individually by 1 type as an organic polymer of the base layer 12, and may be used in combination of 2 or more type. Of these, polyamideimide, modified polyamideimide, polyimide, modified polyimide, and the like are more preferable from the viewpoint of excellent rigidity and improved durability.

  The base layer 12 may contain additives and the like. Examples of the additive include a mold release agent, a flame retardant, a filler, a leveling agent, and an antifoaming agent.

  The thickness of the base layer 12 is not particularly limited, but is preferably in the range of 20 to 200 μm from the viewpoint of durability and manufacturability. More preferably, it exists in the range of 25-140 micrometers, More preferably, it exists in the range of 30-80 micrometers.

  Next, as shown in FIG. 3B, a plating base is formed in a pattern on the base layer 12 to form a plating base pattern 14b. The plating base pattern 14b is formed by discharging a plating base forming paint containing a plating catalyst and a binder onto the base layer 12 by an inkjet dispenser. The plating base forming coating material discharged onto the base layer 12 may be dried and heat-treated as necessary. After the plating base pattern 14b is formed, a degreasing process, a cleaning process, or the like may be performed. The plating base pattern 14b is a coating film containing a plating catalyst and a binder.

  An inkjet dispenser is effective for forming fine lines because it can eject a small amount of liquid (ink) from a nozzle from which ink is ejected. In addition, since the liquid (ink) can be accurately and accurately supplied by the dispenser, the thickness and width of the formed fine line are excellent. As the inkjet dispenser, a piezoelectric inkjet dispenser, a thermal inkjet dispenser, a spray valve inkjet dispenser, or the like can be used.

  A piezo-type inkjet dispenser is a type in which a piezo element is attached to a nozzle from which ink is ejected, and a voltage is applied to the piezo element to deform the piezo element to eject ink out of the nozzle. In the piezo type, the deformation amount of the piezo element is controlled by voltage, so that the ink discharge amount and the liquid size can be precisely controlled. In addition, since it is not necessary to apply heat at the time of ink ejection from the mechanism of ejection, it is not limited to ink with little thermal deterioration, and can be applied to a wide range of inks, and is not easily influenced by the use environment.

  The thermal inkjet dispenser is a type that ejects ink out of the nozzle by generating bubbles in the ink in the nozzle from which the ink is ejected by heating. The thermal type has a relatively simple head structure and has few physical mechanisms, so that it is easy to increase the printing speed.

  The spray valve type inkjet dispenser is a valve discharge system including a valve, a controller, and a liquid agent tank, and controls the amount of liquid agent (ink) supplied from the liquid agent tank by opening and closing the valve by a signal from the controller. The valve discharge system closes the valve to block the flow of the liquid agent (ink), and enables more reliable quantitative application. The spray valve type can be accurately applied in the form of a mist with a minute amount of micro-pressure air.

  The inner diameter of the nozzle from which ink is discharged from the inkjet dispenser is preferably in the range of 0.05 to 0.3 mm. When the inner diameter of the nozzle is within a specific range, the plating base pattern 14b can be formed into a fine line with high accuracy.

  The viscosity of the coating for forming a plating base is preferably in the range of 1.0 to 1000 mPa · s. When the viscosity of the coating base forming paint is 1.0 mPa · s or more, the coating base forming paint can be prevented from bleeding when the coating base forming paint is discharged onto the base layer 12. From this point of view, the viscosity of the coating for forming a plating base is more preferably 10 mPa · s or more. Further, when the viscosity of the coating foundation forming paint is 1000 mPa · s or less, the leveling of the coating film is improved when the plating foundation forming paint is discharged onto the base layer 12. From this viewpoint, the viscosity of the coating for forming a plating base is more preferably 200 mPa · s or less. And when the coating foundation coating paint has a viscosity in the range of 1.0 to 1000 mPa · s, when the coating foundation forming paint is discharged onto the base layer 12, the bleeding of the coating film is suppressed. Leveling is improved. Thereby, the plating base pattern 14b can be formed with higher accuracy. The viscosity of the coating for forming a plating base can be adjusted by adjusting the solid content concentration. The viscosity of the coating for forming a plating base can be measured with a B-type viscometer. The viscosity of the coating for forming a plating base is a value at normal temperature (room temperature).

  The plating catalyst only needs to have a catalytic ability necessary for plating on the plating base. Examples of such a catalyst metal include Pt group metals such as Pd and Pt, Ag, Au, and alloys thereof. These may be used individually by 1 type as a catalyst metal for plating, and may be used in combination of 2 or more types. Among these, Pd, Pt, Ag, and alloys thereof are more preferable from the viewpoint of superior catalytic ability. Pd is particularly preferable.

  Examples of the binder include polyimide, polyamideimide, modified polyamideimide, modified polyimide, polyethersulfone, fluororesin, and polycarbonate.

  In the coating for forming a plating base, the solid content concentration of the plating catalyst is preferably 1.0% by mass or more from the viewpoint of plating efficiency and the like. More preferably, it is 5.0 mass% or more. Moreover, it is preferable that it is 20 mass% or less from viewpoints, such as the dispersibility of a plating catalyst and the adhesiveness with the metal wire of the metal pattern 14a. More preferably, it is 10 mass% or less.

  The thickness of the plating base of the plating base pattern 14b is not particularly limited, but is preferably 0.05 μm or more from the viewpoints of adhesion and uniformity with the metal wire of the base layer 12 and the metal pattern 14a. . More preferably, it is 0.1 micrometer or more, More preferably, it is 0.3 micrometer or more. Moreover, it is preferable that it is 5.0 micrometers or less from viewpoints, such as economical efficiency. More preferably, it is 3.0 micrometers or less, More preferably, it is 1.0 micrometers or less.

  Next, as shown in FIG. 3C, plating is performed to form a metal pattern 14a on the plating base pattern 14b. The metal pattern 14a can be formed by electroless metal plating. Electroless metal plating is performed using a plating solution. If necessary, it may be washed with water after plating.

  The plating solution contains metal ions, reducing agents, complexing agents, pH buffering agents and the like. The metal ions are plating metal ions. Examples of the plating metal include Cu, Ni, Ag, Pd, Sn, Au, and alloys thereof. Among these, Cu, Ni, Ag, and alloys thereof are more preferable from the viewpoint of excellent adhesion to the plating base. Further, Ni and Ni alloys are particularly preferable from the viewpoints of catalytic activity with respect to the catalytic metal of the plating base and adhesion to the plating base.

  Examples of the reducing agent include hypophosphorous acid, hypophosphite, dimethylamine borane, hydrazine and the like. Among these, hypophosphorous acid and hypophosphite are preferable from the viewpoint of the stability of the plating solution. Examples of pH buffering agents include lactic acid, acetic acid, and succinic acid.

  Examples of complexing agents include carboxylic acids and amine compounds. As a complexing agent, only carboxylic acid may be used, only an amine compound may be used, or carboxylic acid and an amine compound may be used in combination. Examples of the carboxylic acid include citric acid, malic acid, tartaric acid, ethylenediaminetetraacetic acid (EDTA), and the like. Examples of the amine compound include glycine, alanine, ethylenediamine, propanediamine, and the like.

  The thickness of the metal wire of the metal pattern 14a is not particularly limited, but is preferably 0.1 μm or more from the viewpoint of heat generation efficiency. More preferably, it is 0.3 micrometer or more, More preferably, it is 0.5 micrometer or more. Moreover, 10 micrometers or less are preferable from viewpoints, such as a softness | flexibility. More preferably, it is 5.0 micrometers or less, More preferably, it is 3.0 micrometers or less.

  The width of the metal line of the metal pattern 14a is preferably 0.1 mm or more from the viewpoints of manufacturability and heat generation efficiency. More preferably, it is 0.3 mm or more, More preferably, it is 0.5 mm or more. Moreover, 10 mm or less is preferable from the viewpoint of easily reducing temperature unevenness. More preferably, it is 5.0 mm or less, More preferably, it is 3.0 mm or less.

  The distance between the metal lines of the metal pattern 14a is preferably 0.01 mm or more from the viewpoints of manufacturability and heat generation efficiency. More preferably, it is 0.05 mm or more, More preferably, it is 0.1 mm or more. Moreover, 1.0 mm or less is preferable from the viewpoint of easily reducing temperature unevenness. More preferably, it is 0.5 mm or less, More preferably, it is 0.3 mm or less.

  According to the manufacturing method of the present invention having the above-described configuration, the above-described plating base is formed in a pattern by discharging the above-described coating for forming a plating base onto the base layer 12 by an inkjet dispenser. It can be formed into fine lines with accuracy. Since the metal pattern 14a is formed on the plating base by performing plating on the pattern-shaped plating base formed with high accuracy, the patterning accuracy is improved as compared with the conventional case where the metal pattern is formed by applying the conductive paste. , Temperature unevenness is improved. Moreover, durability is also improved by being seamless.

  Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

  For example, in the above embodiment, plating may be further formed by electrolytic plating on the metal pattern 14a formed by electroless metal plating. In addition, a coating layer may be formed in the heat generation region in the axial direction of the heating member 10 so as to cover the metal pattern 14a over the entire circumference. The coating layer can be formed of, for example, an insulating material, a rubber elastic material, a fluororesin material, or the like.

  Moreover, the metal pattern 14a is not limited to the structure of the said embodiment, It can be made into various pattern shapes.

  Hereinafter, the present invention will be described in detail using Examples and Comparative Examples.

<Base layer forming material>
Toyobo Polyamideimide Varnish “Vilomax HR-16NN (solid content: 14.0%)” was prepared.

<Plating undercoat paint>
“Metalloid” manufactured by IOX was prepared as a coating for forming a plating base. The viscosity of the liquid is 80 mPa · s.

<Degreasing liquid>
A degreasing solution was prepared by mixing 200 ml of an alkaline degreasing agent (Okuno Pharmaceutical Co., Ltd., “OPC-190 Cleaner”), 1200 ml of 3% by weight caustic soda, and 600 ml of ion-exchanged water.

<Conditioner liquid>
As a conditioner solution, 50 ml / L of a cationic surface conditioner (Okuno Pharmaceutical Co., Ltd., “Condizer FR Conch”) was used.

<Conductive paste material>
As the conductive paste material, a material prepared by the following procedure was used. Rubber (A) in which 5 parts by mass of Kyowamag # 30 (manufactured by Kyowa Chemical Industry) and 5 parts by mass of calzette (manufactured by Kyokuto Kasei Kogyo) are kneaded with two rolls for 20 minutes with respect to 100 parts by mass of Daiel G555 (manufactured by Daikin Industries). Was made. Subsequently, 100 parts by weight of rubber (A) was cut into 2 to 3 mm squares, and 5 parts by weight of acetic acid and 245 parts by weight of methyl ethyl ketone were combined in advance with a 5-minute impeller, and mixed with an air stirrer. The mixture was stirred for 30 minutes to obtain a solution (B). Furthermore, 500 parts by mass of 10% Ag coat 2L3 (Fukuda Metal Foil Powder Industry), 26 parts by mass of Duranate SBN-70D (Asahi Kasei Chemicals), and 510 parts by mass of methyl ethyl ketone with respect to 350 parts by mass of the solution (B), The conductive paste material was prepared by stirring for 2 minutes by hand stirring using a stirring rod.

<Electroless metal plating solution>
By mixing nickel sulfate hexahydrate: 26 g / L, sodium hypophosphite monohydrate (reducing agent): 32 g / L, sodium citrate dihydrate (complexing agent): 30 g / L An electroless metal plating solution was obtained.

<Preparation of base layer>
A base layer forming material was applied to the surface of an aluminum cylindrical pipe having a diameter of 40 mm and an axial length of 450 mm by a dip coating method and dried at 230 ° C. for 60 minutes. The pulling speed at the time of coating was 100 mm / second. Thereby, a cylindrical base layer (thickness 80 μm) made of polyamideimide (PAI) was formed on the outer peripheral surface of the cylindrical pipe.

<Preparation of plating base pattern and patterning formation of Example 1>
Using a Nordson 781mini series spray valve (nozzle orifice 0.1 mm), a coating for forming a plating base was patterned on the base layer in a linear pattern with a width of 1.0 mm and an interval of 0.2 mm, and heat-treated at 120 ° C. for 15 minutes. Further, heat treatment was performed at 240 ° C. for 15 minutes. As a result, a plating base pattern (thickness 0.5 μm) was formed on the base layer. Thereafter, it was immersed in a degreasing solution at 65 ° C. for 5 minutes and then washed with pure water. Then, it was immersed in an electroless metal plating solution (plating solution temperature: 84 ° C., plating time: 2 minutes), and then rinsed with pure water. As a result, a metal pattern (nickel plating, thickness 1.0 μm) patterned into a linear shape having a width of 1.0 mm and an interval of 0.2 mm was formed on the plating base. Thus, the heating member of Example 1 having the pattern shape shown in FIG. 2 was produced.

<Preparation of plating base pattern and patterning formation of Examples 2 to 4>
The pattern shape shown in FIG. 2 is obtained in the same manner as in Example 1 except that the viscosity of the spray orifice nozzle orifice and the coating base forming coating material is changed as shown in Table 1, and the line width is changed as shown in Table 1. The heating member of Examples 2-4 was produced.

<Patterning of Comparative Example 1>
The conductive paste material is coated on the base layer in a linear shape with a digital dispenser (Musashi Engineering MPP-1) having a width of 1.0 mm, an interval of 0.2 mm, and a thickness of 30 μm, and then heated at 200 ° C. for 60 minutes. It was. Thus, a heating member of Comparative Example 1 having the pattern shape shown in FIG. 2 was produced.

  About the produced heating member, line width variation and temperature variation were measured, and the accuracy of the metal pattern was evaluated. The measuring method is as follows. The evaluation results are shown in Table 1.

(Measurement of line width variation)
Observe with a microscope about 10 arbitrary positions of the metal pattern patterned in a line, especially when the error is within ± 5% of the target line width “◎”, error is ± 10% The case where the error was within ± 10% was rated as “good”, the case where the error was over ± 10%, “△”, and the case where the error was over ± 20%, “X”.

(Measurement of temperature unevenness)
As shown in FIG. 4, a simple evaluation system having a measurement work 1, an oscilloscope 3, an AC power supply 4, and a thermography 5 was created. Black body spray 2 (Japan Sensor Co., Ltd. “JSC-3”) was applied to the surface of measurement workpiece 1 (produced heating member) so as to expose only the end portion. Copper tape was attached to both ends of the measurement workpiece 1 to form electrode portions, a frequency of 100 Hz and an applied voltage of 50 V were applied, and the surface of the measurement workpiece 1 was measured with the thermography 5. The distance from the surface of the measurement workpiece 1 to the thermography 5 was 500 mm. Especially good when the surface temperature unevenness of the workpiece 1 is 5 ° C. or less “」 ”, good when it is over 5 ° C. and 10 ° C. Slightly inferior “Δ” and those exceeding 20 ° C. were regarded as defective “x”.
AC power supply: NF circuit design block BP4610
-Thermography: Nippon Avionics S30

  In Comparative Example 1, a metal pattern is formed by applying a conductive paste. For this reason, the line width variation of the metal line of a metal pattern and the temperature nonuniformity of a heating member are large, and the accuracy of a metal pattern is inferior. On the other hand, in the embodiment, a plating base pattern is formed by applying a coating for forming a plating base using an inkjet dispenser, and electroless plating is performed on the plating base to form a metal pattern. For this reason, the line width variation of the metal line of a metal pattern and the temperature nonuniformity of a heating member are small, and the precision of a metal pattern is excellent. Among the examples, when the nozzle diameter is 0.05 to 0.3 mm, or when the viscosity of the coating for forming the plating base is 1.0 to 1000 mPa · s, the line width variation or heating of the metal line of the metal pattern The temperature unevenness of the member becomes smaller, and the accuracy of the metal pattern is better.

  As mentioned above, although the Example of this invention was described, this invention is not limited to the said Example at all, A various change is possible within the range which does not deviate from the meaning of this invention.

DESCRIPTION OF SYMBOLS 10 Heating member 12 Base layer 14a Metal pattern 14b Plating ground pattern

Claims (3)

A method of manufacturing a heating member for heating an object to be heated,
A step of forming a plating base containing a plating catalyst and a binder in a pattern by discharging a coating base forming coating containing a plating catalyst and a binder onto the base layer by an inkjet dispenser;
And a step of performing plating on the plating base formed in a pattern to form a metal pattern on the plating base.   2. The method for manufacturing a heating member according to claim 1, wherein a viscosity of the coating for forming a plating base is in a range of 1.0 to 1000 mPa · s.   3. The method for manufacturing a heating member according to claim 1, wherein an inner diameter of a nozzle from which ink of the inkjet dispenser is discharged is in a range of 0.05 to 0.3 mm.

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