JP2018101647A - Laser light source module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser light source module capable of evenly distributing a current to a plurality of LD elements while suppressing a divergence angle of a light beam.SOLUTION: In the laser light source module, a LD array includes: a plurality of arranged LDs (4). Each sub-mount includes a first conductive pattern (122a) connected to one electrode (8) of the LD; and a second conductive pattern (123a) connected to the other electrode (2). A first feeding portion (222a) on a side of a first feeding terminal is provided on a first end side in an arrangement direction of the LD in the first conductive pattern. A second feeding portion (223a) on a second feeding terminal side is provided on a second end portion side in an arrangement direction of the second conductive pattern.SELECTED DRAWING: Figure 3

Description

  The present technology relates to a laser light source module.

  In an optical device such as a digital cinema projector, a plurality of laser light source modules are installed as light sources in order to obtain a required light output. A plurality of laser diode (laser diode, or LD) arrays are mounted on the laser light source module. The LD array may also be referred to as a multi-emitter LD bar.

  In these optical devices, an optical coupling member such as an optical fiber for coupling light output from the laser light source module is a main factor that determines the manufacturing cost of the optical device. Therefore, by increasing the light output of the single laser light source module before combining, and reducing the number of laser light source modules required in optical equipment, the opportunity to combine the light output from multiple laser light source modules is provided. Since it can be reduced, the required optical coupling member can be reduced. Therefore, the manufacturing cost per optical output of the optical device can be reduced. For the above reasons, there is a demand for a laser light source module having a high light output alone.

  Conventionally, for example, in Patent Document 1 or Patent Document 2, for example, a plurality of LD arrays are arranged in one axial direction on the same plane, and light is coupled to a fiber by two types of lenses, so that high light output can be obtained. A structure is disclosed.

  For example, Patent Document 3 or Patent Document 4 discloses a module structure that can improve light output by mounting a plurality of LD arrays on each side of a common holding member in a module. Has been.

  Further, for example, Patent Document 5 discloses a module structure in which a plurality of LD arrays are mounted on a step-shaped holding member.

  Further, for example, Patent Document 6 discloses a structure in which a plurality of LD arrays are mounted on the side surfaces of the respective holding members, and the surfaces of the holding members on which the LD arrays are mounted are arranged close to each other. ing. According to this structure, the light output can be improved, and the light beam divergence angle (Etendue) can be kept small. Furthermore, the heat radiation efficiency by each holding member can be improved, and the fall of the light emission efficiency of a laser element can be suppressed.

JP 2003-158332 A JP 2002-202442 A JP-A-6-222296 JP 2004-077779 A JP 2007-142439 A Japanese Patent Application No. 2014-094689

  However, in the structure shown in Patent Document 1 or Patent Document 2 or the like, since the light emitting point spreads in a uniaxial direction, that is, in a direction parallel to the emitter array, the spread angle (Etendue) of the synthesized light beam is large in that direction. Become. Therefore, if the number of the predetermined LD arrays is exceeded, there is a problem that the light coupling loss at the time of fiber coupling increases and the light emission efficiency is lowered.

  Further, in the structure shown in Patent Document 3 or Patent Document 4 or the like, a plurality of LD arrays are held by one holding member, and therefore the distance between the LD arrays cannot be reduced. Therefore, since the spread angle of the light beam (Etendue) increases in the direction of each LD array, there is a problem in that the optical coupling loss at the time of fiber coupling increases and the light emission efficiency decreases.

  Further, in the structure shown in Patent Document 5 or the like, since a step-shaped holding member is used, it is difficult to downsize the entire module.

  In the structure shown in Patent Document 6 and the like, since power is supplied from both ends of the LD array, a large amount of current flows through the LD elements at both ends among the plurality of LD elements in the LD array. Current is not evenly distributed to the LD elements. Therefore, there exists a problem that the luminous efficiency as a laser light source module falls.

  The present technology is intended to solve the above-described problems, and a laser light source capable of suppressing a current distribution bias to a plurality of LD elements while suppressing a light beam spread angle (Etendue). It is about modules.

  A laser light source module according to an aspect of the present technology includes at least one set of laser diode arrays arranged to face each other, a submount on which each of the laser diode arrays is arranged, and at least one set of the laser diode arrays. A first feed terminal and a second feed terminal arranged on a side; each laser diode array comprises a plurality of laser diodes arranged; each submount is one of the plurality of laser diodes A first conductive pattern electrically connected to the first electrode and a second conductive pattern formed apart from the first conductive pattern and electrically connected to the other electrode of the plurality of laser diodes. A plurality of laser diodes in the first conductive pattern. A first power supply location on the first power supply terminal side is provided at a position on the first end portion side in the arrangement direction, which is a line direction, and the first end portion in the arrangement direction in the second conductive pattern. A second feeding point on the second feeding terminal side is provided at a position on the second end side opposite to the first feeding terminal.

  A laser light source module according to an aspect of the present technology includes at least one set of laser diode arrays arranged to face each other, a submount on which each of the laser diode arrays is arranged, and at least one set of the laser diode arrays. A first feed terminal and a second feed terminal arranged on a side; each laser diode array comprises a plurality of laser diodes arranged; each submount is one of the plurality of laser diodes A first conductive pattern electrically connected to the first electrode and a second conductive pattern formed apart from the first conductive pattern and electrically connected to the other electrode of the plurality of laser diodes. A plurality of laser diodes in the first conductive pattern. A first power supply location on the first power supply terminal side is provided at a position on the first end portion side in the arrangement direction, which is a line direction, and the first end portion in the arrangement direction in the second conductive pattern. A second feeding point on the second feeding terminal side is provided at a position on the second end side opposite to the first feeding terminal.

  According to such a configuration, one electrode of the laser diode in the laser diode array is connected to the first power supply terminal from the first power supply location on the first conductive pattern, and the other electrode of the laser diode in the laser diode array is connected. Is connected to the second power supply terminal from the second power supply point on the second conductive pattern. Here, the 1st electric power feeding location and the 2nd electric power feeding location are located in the edge part side on the opposite side in the sequence direction of a some laser diode. Therefore, in each laser diode, the electrical resistance based on the distance to the first power feeding location and the electrical resistance based on the distance to the second power feeding location cancel each other's electrical resistance magnitude imbalance. Therefore, the deviation between the laser diodes is small in the total value of these electric resistances. That is, it is possible to suppress a bias in current distribution with respect to a plurality of laser diodes.

  The objectives, features, aspects and advantages of the present technology will become more apparent from the detailed description and the accompanying drawings provided below.

It is a top view which illustrates the composition of the laser light source module about an embodiment. It is a side view which illustrates the composition of the laser light source module about an embodiment. It is an expanded view which illustrates the structure of the laser light source module regarding embodiment. It is a front view which illustrates the structure of LD assembly. It is a side view which illustrates the structure of LD assembly. It is a top view which illustrates the composition of LD assembly. It is a front view which illustrates the structure of LD array. It is a top view which illustrates the structure of LD array. It is a rear view which illustrates the structure of LD array. It is a side view which illustrates the structure of LD array. It is a front view which illustrates the composition of a submount. It is a rear view which illustrates the composition of a submount. It is a side view which illustrates the composition of a submount. It is a figure which illustrates the electric current distribution in each LD assembly using the expanded view of the laser light source module illustrated in FIG. It is a top view which illustrates the composition of the conventional laser light source module. It is a side view which illustrates the structure of the conventional laser light source module. It is a side view which illustrates the structure of the conventional laser light source module seen from the direction different from FIG. It is a figure which illustrates the current distribution in each LD assembly using the side view of the conventional laser light source module illustrated in FIG. The power supply and heat dissipation will be described using a plan view of the configuration of the laser light source module according to the embodiment. The power supply and heat dissipation will be described using a side view of the configuration of the laser light source module according to the embodiment. The power supply and heat dissipation will be described using a plan view of the configuration of a conventional laser light source module. A description of power supply and heat dissipation will be given using a side view of the configuration of a conventional laser light source module. It is a figure which illustrates the structure of the laser light source module regarding embodiment.

  Embodiments will be described below with reference to the accompanying drawings. Note that the drawings are schematically shown, and the mutual relationship between the sizes and positions of the images shown in different drawings is not necessarily described accurately, and can be changed as appropriate. Moreover, in the description shown below, the same code | symbol is attached | subjected and shown in the same component, and it is the same also about those names and functions. Therefore, the detailed description about them may be omitted.

  In the explanation given below, terms that mean a specific position and direction such as “top”, “bottom”, “side”, “bottom”, “front” or “back” may be used. However, these terms are used for convenience in order to facilitate understanding of the contents of the embodiment, and are not related to the direction in which they are actually implemented.

<First Embodiment>
<Configuration>
Hereinafter, the laser light source module according to the present embodiment will be described.

  1, 2 and 3 are diagrams illustrating the configuration of the laser light source module according to this embodiment. FIG. 1 is a plan view illustrating the configuration of a laser light source module according to this embodiment. FIG. 2 is a side view illustrating the configuration of the laser light source module according to this embodiment.

  FIG. 3 is a development view illustrating the configuration of the laser light source module according to this embodiment. Specifically, the LD assembly 1b is rotated counterclockwise on the paper surface of FIG. 1, and is further arranged on the right side of the LD assembly 1a in FIG. 1, so that the LD array 11a and the LD array 11b can be seen in front. In this state, the power supply terminal 22 and the power supply terminal 23 arranged adjacent to each other in FIG. 1 are positioned on opposite sides of the LD assembly 1a and the LD assembly 1b. To do. Each configuration will be described later.

  As shown in FIGS. 1, 2 and 3, the laser light source module includes a stem base 21, a power supply terminal 22 (+ electrode side), a power supply terminal 23 (−electrode side), an LD assembly 1a, and an LD. Assembly 1b.

  The stem base 21 is a plate-like member obtained by applying gold plating to a material having high thermal conductivity such as Cu. On the stem base 21, the LD assembly 1a and the LD assembly 1b are arranged to face each other, and both the LD assemblies are positioned. The stem base 21 radiates heat generated by the LD assembly 1a and the LD assembly 1b.

  The power supply terminal 22 is inserted into a hole 21 a provided in the stem base 21. The power supply terminal 23 is inserted into a hole 21 b provided in the stem base 21. The power supply terminal 22 and the power supply terminal 23 are electrically insulated from the stem base 21. The gap between the hole 21a of the stem base 21 and the power supply terminal 22 is filled with, for example, low melting point glass as the sealing material 24a. Similarly, the gap between the hole 21b of the stem base 21 and the power supply terminal 23 is filled with, for example, low melting point glass as the sealing material 24b.

  In addition, both the power supply terminal 22 and the power supply terminal 23 are disposed on the side of the surface of the one LD assembly that faces the other LD assembly. That is, both the power supply terminal 22 and the power supply terminal 23 are arranged on one side of the surface of the one LD assembly that faces the other LD assembly, and the other of the surfaces of the one LD assembly that faces the other LD assembly. Neither the feeding terminal 22 nor the feeding terminal 23 is arranged on the side.

  4, 5 and 6 are diagrams illustrating the configuration of the LD assembly. FIG. 4 is a front view illustrating the configuration of the LD assembly. FIG. 5 is a side view illustrating the configuration of the LD assembly. FIG. 6 is a plan view illustrating the configuration of the LD assembly. 4, 5, and 6 show the LD assembly 1 a, the LD assembly 1 b has a corresponding configuration.

  The LD assembly 1a has an LD light emission function. As shown in FIGS. 4, 5, and 6, the LD assembly 1a includes an LD array 11a, a submount 12a, and a holding block 13a. The LD assembly 1b includes an LD array 11b, a submount 12b, and a holding block 13b.

  The submount 12a has an electrical insulation function and a heat transfer function. As shown in FIGS. 4, 5 and 6, the submount 12a includes a flat plate-shaped electric insulator 121a, two conductive patterns 122a and a conductive pattern 123a formed on the surface of the electric insulator 121a. And a conductive pattern 124a formed over the entire back surface of the electrical insulator 121a. The electrical insulator 121a is formed of a material having high thermal conductivity, for example, a ceramic material such as silicon carbide (SiC) or aluminum nitride (AlN). Similarly, the submount 12b covers the entire surface of the flat electrical insulator 121b, the two conductive patterns 122b and 123b formed on the surface of the electrical insulator 121b, and the back surface of the electrical insulator 121b. And a conductive pattern 124b formed.

  The power supply terminal 22 is electrically connected to the conductive pattern 122a in the LD assembly 1a via the conductive ribbon 3 such as Au. Thereby, the power supply terminal 22 and the LD assembly 1a are electrically connected.

  The power supply terminal 23 is electrically connected to the conductive pattern 123b in the LD assembly 1b via the conductive ribbon 3 such as Au. Thereby, the power supply terminal 23 and the LD assembly 1b are electrically connected.

  Furthermore, the conductive pattern 123a in the LD assembly 1a and the conductive pattern 122b in the LD assembly 1b are electrically connected via the conductive ribbon 3 such as Au.

  The holding block 13a bears a heat transfer function. The holding block 13a is formed, for example, by applying gold plating or the like to a material having a high thermal conductivity such as Cu. The shape of the holding block 13a is a three-dimensional shape having a lower surface in contact with the stem base 21 and at least one side surface formed perpendicular to the lower surface, for example, a rectangular parallelepiped.

  At least one side surface of the holding block 13a functions as a mounting surface for the LD element. Further, the holding block 13a and the stem base 21 are joined via solder. Here, it is preferable that the solder for joining the holding block 13a and the stem base 21 has a lower melting point than the solder used when joining the holding block 13a and the submount 12a.

  The submount 12a is mounted on the side surface of the holding block 13a. Specifically, the conductive pattern 124a of the submount 12a is mounted in contact with the side surface of the holding block 13a via solder.

  The LD array 11a is mounted on the surface of the conductive pattern 122a on the side opposite to the side in contact with the side surface of the holding block 13a of the submount 12a. The conductive pattern 122a and the LD array 11a are joined via solder.

  7, 8, 9 and 10 are diagrams illustrating the configuration of the LD array. FIG. 7 is a front view illustrating the configuration of the LD array. FIG. 8 is a plan view illustrating the configuration of the LD array. FIG. 9 is a rear view illustrating the configuration of the LD array. FIG. 10 is a side view illustrating the configuration of the LD array.

  As shown in FIGS. 7, 8, 9, and 10, the LD array 11a includes a plurality of LD elements 4 arranged on a semiconductor substrate such as GaAs or AlGaN at regular intervals, and the end surface of the semiconductor substrate. The laser diode in which the light emitting point 40 of each LD element 4 is formed. In the LD array 11a, laser light parallel to the main surface of the semiconductor substrate is emitted from the light emitting point 40 of each LD element 4.

  The N-side electrode 2 of the LD array 11a is a single electrode. In the N-side electrode 2, a conductive wire connection portion 41 corresponding to each light emitting point 40 is provided. The P-side electrode 8 of the LD array 11 a is a plurality of electrodes corresponding to the light emitting points of the LD elements 4.

  11, 12 and 13 are diagrams illustrating the configuration of the submount. FIG. 11 is a front view illustrating the configuration of the submount. FIG. 12 is a rear view illustrating the configuration of the submount. FIG. 13 is a side view illustrating the configuration of the submount.

  In the submount 12a, the conductive pattern 122a and the conductive pattern 123a formed on the surface of the electrical insulator 121a are arranged apart from each other. The LD array 11a is disposed in contact with the conductive pattern 122a. The P-side electrode 8 of the LD array 11a is electrically connected to the conductive pattern 122a. At this time, the optical axis of the laser light emitted from the LD element 4 in the LD array 11a is parallel to the mounting surface of the holding block 13a, and the main surface of the stem base 21 that contacts the lower surface of the holding block 13a. Is perpendicular to.

  The conductive pattern 123a is connected to each conductive wire connection portion 41 in the N-side electrode 2 of the LD array 11a through a conductive wire 14 such as Au.

  In this case, the thermal expansion coefficient of the LD array 11a is maintained at α1 and the thermal expansion coefficient of the submount 12a is maintained at α2 in order to alleviate thermal stress generated during soldering and to ensure durability against temperature fluctuation. Assuming that the coefficient of thermal expansion of the block 13a is α3,

  It is preferable to satisfy.

  In this embodiment, the LD assembly 1a and the LD assembly 1b are arranged so that the optical axes of the laser beams emitted from the LD elements 4 in each LD array are parallel to each other before the stem base 21 is joined to each other. And it positions so that the main surface of each LD array may become mutually parallel. And it fixes on the stem base 21 in the state positioned in that way.

  With such a configuration, the LD array 11a and the LD array 11b can be arranged close to each other. Accordingly, the spread angle (Etendue) of the light beam synthesized from the laser beams emitted from the respective LD arrays is kept small. As a result, it is possible to reduce optical coupling loss when the output light beam is coupled to the optical fiber.

  Further, according to the above configuration, one holding block 13a is provided for each LD array 11a. Therefore, a large bonding area between the holding block and the stem base 21 can be ensured. In addition, good heat transfer from each LD array to the stem base 21 can be realized. As a result, the heat dissipation efficiency of the LD array 11a is increased, and a decrease in light emission efficiency due to heat generation in the LD element 4 can be suppressed.

  FIG. 14 is a diagram illustrating current distribution in each LD assembly, using a development view of the laser light source module illustrated in FIG. 3. The arrows shown in the figure indicate the flow of current.

  As illustrated in FIG. 14, in the power supply method according to the present embodiment, first, power is supplied from the power supply terminal 22 to the conductive pattern 122 a on the LD assembly 1 a via the conductive ribbon 3. At this time, the connection location between the conductive ribbon 3 and the conductive pattern 122a is a power supply location 222a. The power feeding point 222a is located on one side of the conductive pattern 122a in the arrangement direction of the LD elements 4 (the side where the power feeding terminal 22 is arranged in FIG. 14). Then, power is supplied from the conductive pattern 122 a to the LD array 11 a on the LD assembly 1 a via the P-side electrode 8. On the LD array 11a, power is supplied to the conductive pattern 123a from the conductive wire connection portions 41 in the N-side electrode 2 of the LD elements 4 arranged at equal intervals through the conductive wires 14.

  Further, power is supplied from the conductive pattern 123 a on the LD assembly 1 a to the conductive pattern 122 b on the LD assembly 1 b via the conductive ribbon 3. At this time, the connection location between the conductive ribbon 3 and the conductive pattern 123a is a power supply location 223a. The power feeding location 223a is located on the other side in the arrangement direction of the LD elements 4 on the conductive pattern 123a (the side opposite to the side where the power feeding terminal 22 is arranged in FIG. 14). In addition, a connection point between the conductive ribbon 3 and the conductive pattern 122b is a power supply point 222b. The power feeding point 222b is located on one side of the conductive pattern 122b in the arrangement direction of the LD elements 4 (the side where the power feeding terminal 22 is arranged in FIG. 14). Then, power is supplied from the conductive pattern 122 b to the LD array 11 b on the LD assembly 1 b through the P-side electrode 8. Then, power is supplied to the conductive pattern 123b through the conductive wire 14 from each conductive wire connection portion 41 in the N-side electrode 2 of the LD element 4 arranged at equal intervals on the LD array 11b.

  Then, power is supplied to the power supply terminal 23 through the conductive ribbon 3 from the conductive pattern 123b on the LD assembly 1b. At this time, the connection location between the conductive ribbon 3 and the conductive pattern 123b is a power supply location 223b. The power feeding point 223b is located on the other side in the arrangement direction of the LD elements 4 (on the side opposite to the side where the power feeding terminal 22 is arranged in FIG. 14) on the conductive pattern 123b.

  With this configuration, in the LD element 4 on the LD assembly 1a, the electrical resistance based on the distance to the end of the conductive ribbon 3 (the feeding point 222a) on the conductive pattern 122a, and the conductive pattern 123a The total value of the electrical resistance based on the distance to the end of the conductive ribbon 3 (the feeding point 223a) is less biased between the LD elements 4. For example, the LD element 4 arranged closest to the power supply terminal 22 has an electrical resistance based on the distance to the end of the conductive ribbon 3 (power supply location 222a) on the conductive pattern 122a. Among them, the electric resistance based on the distance to the end of the conductive ribbon 3 (the feeding point 223a) on the conductive pattern 123a is the largest among the plurality of LD elements 4 arranged. Thus, in each LD element 4, the electrical resistance based on the distance to the conductive ribbon 3 end (power feeding location 222a) on the conductive pattern 122a and the conductive ribbon 3 end (power feeding location 223a) on the conductive pattern 123a. The electrical resistance based on the distance up to ()) cancels out the imbalance in the magnitude of the electrical resistances, so that the bias between the LD elements 4 is small in the total value of these electrical resistances. . Similarly, in the LD element 4 on the LD assembly 1b, the electrical resistance based on the distance to the end of the conductive ribbon 3 on the conductive pattern 122b (feeding point 222b), and the conductive ribbon 3 on the conductive pattern 123b. The total value of the electrical resistance based on the distance to the end (feeding point 223b) is less biased between the LD elements 4. Therefore, it is possible to suppress the bias of current distribution to the plurality of LD elements 4 on each LD array.

  It is desirable that the power feeding point be provided at a position where the total value of the electrical resistance is completely equal between the LD elements 4 as in the power feeding point 222a and the power feeding point 223a in the LD assembly 1a.

  Similarly, even when the number of LD elements 4 arranged on each LD array changes, it is possible to suppress a bias in current distribution to a plurality of LD elements 4.

  Further, the conductive pattern 122a and the conductive pattern 123a in the submount 12a are arranged in a direction perpendicular to the arrangement direction at one end in the arrangement direction in which the plurality of LD elements 4 are arranged on the electrical insulator 121a. It is formed with a width. That is, the conductive pattern 122a and the conductive pattern 123a have a portion formed along one end in the arrangement direction of the plurality of LD elements 4. Similarly, the conductive pattern 122b and the conductive pattern 123b in the submount 12b are perpendicular to the arrangement direction at the other end in the arrangement direction in which the plurality of LD elements 4 are arranged on the electrical insulator 121b. Are formed with a width. That is, the conductive pattern 122b and the conductive pattern 123b have a portion formed along the other end in the arrangement direction of the plurality of LD elements 4.

  With such a structure, the degree of freedom in arranging the conductive ribbon 3 is improved. Therefore, the degree of freedom is also increased when the feeding point is provided at a position where the total value of the electrical resistance is completely equal between the LD elements 4.

  Further, by increasing the number of conductive ribbons 3, the resistance value between the power supply terminal and the LD array can be reduced. Further, by using a wide conductive ribbon, the resistance value between the power supply terminal and the LD array can be reduced. As a result, the current value that can be supplied to the LD array can be increased.

  In addition, since the process flow can be unified in the uniaxial direction in the process of bonding the conductive ribbon 3, the allowable value of the current supplied to the laser light source module is increased and the workability of the laser light source module is improved. Can do.

  FIGS. 15, 16 and 17 are diagrams illustrating the configuration of a conventional laser light source module. FIG. 15 is a plan view illustrating the configuration of a conventional laser light source module. FIG. 16 is a side view illustrating the configuration of a conventional laser light source module. FIG. 17 is a side view illustrating the configuration of a conventional laser light source module viewed from a direction different from that in FIG. FIG. 17 is a side view of the LD assembly 1c as viewed from the LD array 11c side.

  As shown in FIGS. 15, 16, and 17, the laser light source module includes a stem base 21, a power supply terminal 22a, a power supply terminal 23a, an LD assembly 1c, and an LD assembly 1d.

  On the stem base 21, the LD assembly 1c and the LD assembly 1d are arranged to face each other, and both the LD assemblies are positioned. The stem base 21 radiates heat generated by the LD assembly 1c and the LD assembly 1d.

  The power supply terminal 22 a is inserted into a hole 21 c provided in the stem base 21. The power supply terminal 23 a is inserted into a hole 21 d provided in the stem base 21. The power supply terminal 22a and the power supply terminal 23a are electrically insulated from the stem base 21. The gap between the hole 21c of the stem base 21 and the power supply terminal 22a is filled with, for example, low melting point glass as the sealing material 24c. Similarly, the gap between the hole 21d of the stem base 21 and the power supply terminal 23a is filled with, for example, low melting point glass as the sealing material 24d.

  In addition, the power supply terminal 22a and the power supply terminal 23a are arranged one by one on the side of the surface of the one LD assembly that faces the other LD assembly. That is, one power supply terminal 22a and one power supply terminal 23a are arranged on one side of the surface of one LD assembly that faces the other LD assembly, and the surface of the one LD assembly that faces the other LD assembly. One power supply terminal 22a and one power supply terminal 23a are also arranged on the other side.

  The LD assembly 1c has an LD light emission function. The LD assembly 1c includes an LD array 11c, a submount 12c, and a holding block 13c. The LD assembly 1d includes an LD array 11d, a submount 12d, and a holding block 13d.

  The submount 12c has an electrical insulation function and a heat transfer function. The submount 12c is formed over the entire surface of the flat-shaped electrical insulator 121c, the two conductive patterns 122c and the conductive pattern 123c formed on the surface of the electrical insulator 121c, and the back surface of the electrical insulator 121c. And a conductive pattern 124c. The electrical insulator 121c is formed of a material having high thermal conductivity, for example, a ceramic material such as silicon carbide (SiC) or aluminum nitride (AlN). Similarly, the submount 12d covers the entire surface of the flat electrical insulator 121d, the two conductive patterns 122d and 123d formed on the surface of the electrical insulator 121d, and the back surface of the electrical insulator 121d. And a conductive pattern 124d formed.

  The power supply terminal 22a is electrically connected to the conductive pattern 122c in the LD assembly 1c through a conductive ribbon 3c such as Au. Thereby, the power supply terminal 22a and the LD assembly 1c are electrically connected. The power supply terminals 22a are arranged on both sides of the LD assembly 1c, and the conductive ribbon 3c connected to each power supply terminal 22a is electrically connected to the conductive pattern 122c from both sides. Connected. That is, the connection places between the conductive ribbon 3c and the conductive pattern 122c are the power supply point 222c and the power supply point 322c. The feeding point 222c is located on one side (the left side in FIG. 17) of the LD elements 4 in the arrangement direction on the conductive pattern 122c. The feeding point 322c is located on the other side (the right side in FIG. 17) in the arrangement direction of the LD elements 4 on the conductive pattern 122c.

  The power supply terminal 23a is electrically connected to the conductive pattern 123c in the LD assembly 1c via a conductive ribbon 3d such as Au. Thereby, the power supply terminal 23a and the LD assembly 1c are electrically connected. The power supply terminals 23a are arranged on both sides of the LD assembly 1c, and the conductive ribbon 3d connected to each power supply terminal 23a is electrically connected to the conductive pattern 123c from both sides. Connected. That is, the connection place between the conductive ribbon 3d and the conductive pattern 123c is the power supply point 223c and the power supply point 323c. The power feeding point 223c is located on one side (left side in FIG. 17) in the arrangement direction of the LD elements 4 on the conductive pattern 123c. The power feeding point 323c is located on the other side (the right side in FIG. 17) of the LD elements 4 in the arrangement direction on the conductive pattern 123c.

  The holding block 13c bears a heat transfer function. The holding block 13c is formed, for example, by applying gold plating or the like to a material having high thermal conductivity such as Cu.

  At least one side surface of the holding block 13c functions as a mounting surface for the LD element. Further, the holding block 13c and the stem base 21 are joined via solder.

  The submount 12c is mounted on the side surface of the holding block 13c. Specifically, the conductive pattern 124c of the submount 12c is mounted in contact with the side surface of the holding block 13c via solder.

  The LD array 11c is mounted on the surface of the conductive pattern 122c on the side opposite to the side in contact with the side surface of the holding block 13c of the submount 12c. The conductive pattern 122c and the LD array 11c are joined via solder.

  In the submount 12c, the conductive pattern 122c and the conductive pattern 123c formed on the surface of the electrical insulator 121c are arranged apart from each other. The LD array 11c is disposed in contact with the conductive pattern 122c. The P-side electrode of the LD array 11c is electrically connected to the conductive pattern 122c. At this time, the optical axis of the laser light emitted from the LD element 4 in the LD array 11c is parallel to the mounting surface of the holding block 13c and is in contact with the lower surface of the holding block 13c. Is perpendicular to.

  The conductive pattern 123c is connected to the N-side electrode 2 of the LD array 11c through a conductive wire 14 such as Au.

  FIG. 18 is a diagram illustrating current distribution in each LD assembly using a side view of the conventional laser light source module illustrated in FIG.

  As illustrated in FIG. 18, in the conventional power feeding method, first, power is supplied from the power supply terminals 22a arranged on both sides to the conductive pattern 122c on the LD assembly 1c via the conductive ribbon 3c. The Then, power is supplied from the conductive pattern 122c to the LD array 11c on the LD assembly 1c through the P-side electrode. On the LD array 11c, power is supplied to the conductive pattern 123c from the conductive wire connection portions 41 in the N-side electrode 2 of the LD elements 4 arranged at equal intervals through the conductive wires 14. Here, in each LD element 4, power is supplied mainly from the power supply terminal 22a having a lower electrical resistance, that is, the power supply terminal 22a having a closer power supply location.

  Then, power is supplied from the conductive pattern 123c on the LD assembly 1c to the power supply terminal 23a via the conductive ribbon 3d. Here, power is supplied from each LD element 4 mainly to the power supply terminal 23a having a lower electrical resistance, that is, the power supply terminal 23a having a closer power supply location.

  With this configuration, in the LD element 4 on the LD assembly 1c, the electrical resistance based on the distance to the end of the conductive ribbon 3c (the feeding point 222c or the feeding point 322c) on the conductive pattern 122c, and the conductivity The total value of the electrical resistance based on the distance to the end of the conductive ribbon 3d (the feeding point 223c or the feeding point 323c) on the pattern 123c is biased in each LD element 4. That is, the electrical resistance of the LD element 4 arranged at a position close to the side where the feeding terminal 22a and the feeding terminal 23a are arranged, for example, the LD element 4 located at the left end or the LD element 4 located at the right end in FIG. The total value is smaller than the total value of the electrical resistances related to the LD element 4 arranged at a position far from the side where the feeding terminal 22a and the feeding terminal 23a are arranged, for example, the LD element 4 located near the center in FIG. Become. Further, in the LD element 4 on the LD assembly 1d, an electrical resistance based on the distance to the end of the conductive ribbon 3c (the feeding point 222c or the feeding point 322c) on the conductive pattern 122d, and the conductive ribbon on the conductive pattern 123d. The total value of the electrical resistance based on the distance to the 3d end (the feeding point 223c or the feeding point 323c) is biased in each LD element 4. Therefore, on each LD array, an equal current is not distributed to each LD element 4, and more than the LD element 4 arranged at a position close to the side where the feeding terminal 22a and the feeding terminal 23a are arranged. Current flows. As a result, the heat distribution and the luminance of light emission of each LD element 4 become non-uniform, and the light emission efficiency decreases.

  19 and 20 are diagrams for explaining the power supply and heat dissipation of the laser light source module according to the present embodiment. FIG. 19 is a diagram illustrating power supply and heat dissipation using a plan view of the configuration of the laser light source module according to the present embodiment. FIG. 20 explains power feeding and heat dissipation using a side view of the configuration of the laser light source module according to the present embodiment.

  In the laser light source module, in general, in order to prevent condensation due to heat generation during use, the cover 5 is installed on the side of the stem base 21 where the LD assembly is installed, and hermetically sealed.

  Thereby, on the side where the LD assembly of the stem base 21 is installed, the end portion connected to the current source 7 of the power supply terminal 22, the end portion connected to the current source 7 of the power supply terminal 23, and the heat dissipation member 6 are further provided. Cannot be connected, and inevitably, these are installed on the side opposite to the side where the LD assembly of the stem base 21 is installed, that is, on the back side.

  In the laser light source module according to the present embodiment, the power supply terminal 22 and the power supply terminal 23 are both disposed on the side of the surface of the one LD assembly that faces the other LD assembly. Therefore, the area where the heat radiating member 6 is arranged and the area where the power supply terminal and its wiring are arranged do not overlap in plan view.

  21 and 22 are diagrams for explaining power supply and heat dissipation of a conventional laser light source module. FIG. 21 explains power feeding and heat dissipation using a plan view of a configuration of a conventional laser light source module. FIG. 22 is a side view of the configuration of a conventional laser light source module, and will explain power supply and heat dissipation.

  In the conventional laser light source module, the feeding terminal 22a and the feeding terminal 23a are arranged one by one on the side of the surface of the one LD assembly that faces the other LD assembly. Therefore, the region where the heat dissipating member 6a is disposed and the region where the power supply terminal is disposed overlap in plan view. Therefore, for example, a restriction is imposed on the size, particularly the height of the heat dissipating member 6a in order to secure a region where the power supply terminals are arranged. This makes the design constraint in an optical device in which a plurality of laser light source modules are used more severe.

  Moreover, it becomes difficult to operate the said laser light source module on appropriate conditions by said restrictions.

Second Embodiment
<Configuration>
The laser light source module according to this embodiment will be described. In the following, the same components as those described in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted as appropriate.

  FIG. 23 is a diagram illustrating the configuration of the laser light source module according to this embodiment. The laser light source module according to this embodiment includes two sets of power supply terminals 22 and 23 and four sets of LD assemblies (eight LD assemblies) on the stem base 21.

  An LD assembly 1e, an LD assembly 1f, an LD assembly 1g, and an LD assembly 1h, which are two sets of LD assemblies connected to one set of the feeding terminal 22 and the feeding terminal 23, are the two LD assemblies shown in the first embodiment. Another set of LD assembly 1a and LD assembly 1b is electrically connected in series. The LD assembly 1e and the LD assembly 1g are a set of LD assemblies, and the LD assembly 1f and the LD assembly 1h are a set of LD assemblies. One set of LD assemblies and the other set of LD assemblies are arranged adjacent to each other along the arrangement direction of the LD elements 4. In addition, both the power supply terminal 22 and the power supply terminal 23 are disposed at one end of the two LD assemblies in the arrangement direction of the LD elements 4.

  The LD assembly 1e includes an LD array 11e, a submount 12e, and a holding block 13e. Although not shown here, the submount 12e includes a flat-shaped electrical insulator 121e, two conductive patterns 122e and 123e formed on the surface of the electrical insulator 121e, and an electrical insulator 121e. And a conductive pattern 124e formed on the entire back surface. Furthermore, the conductive pattern 122e is provided with a power feeding point 222e, and the conductive pattern 123e is provided with a power feeding point 223e. In the submount 12e, the conductive pattern 122e and the conductive pattern 123e formed on the surface of the electrical insulator 121e are arranged apart from each other.

  The LD assembly 1f includes an LD array 11f, a submount 12f, and a holding block 13f. Although not shown here, the submount 12f includes a flat-shaped electrical insulator 121f, two conductive patterns 122f and 123f formed on the surface of the electrical insulator 121f, and an electrical insulator 121f. And a conductive pattern 124f formed over the entire back surface. Further, the conductive pattern 122f is provided with a power feeding point 222f, and the conductive pattern 123f is provided with a power feeding point 223f. In the submount 12f, the conductive pattern 122f and the conductive pattern 123f formed on the surface of the electrical insulator 121f are arranged apart from each other.

  The LD assembly 1g includes an LD array 11g, a submount 12g, and a holding block 13g. Although not shown here, the submount 12g includes a plate-shaped electrical insulator 121g, two conductive patterns 122g and 123g formed on the surface of the electrical insulator 121g, and an electrical insulator 121g. And a conductive pattern 124g formed over the entire back surface. Furthermore, the conductive pattern 122g is provided with a power feeding point 222g, and the conductive pattern 123g is provided with a power feeding point 223g. In the submount 12g, the conductive pattern 122g and the conductive pattern 123g formed on the surface of the electrical insulator 121g are arranged apart from each other.

  The LD assembly 1h includes an LD array 11h, a submount 12h, and a holding block 13h. Although not shown here, the submount 12h includes a plate-shaped electrical insulator 121h, two conductive patterns 122h and a conductive pattern 123h formed on the surface of the electrical insulator 121h, and an electrical insulator 121h. And a conductive pattern 124h formed over the entire back surface. Furthermore, the conductive pattern 122h is provided with a power feeding point 222h, and the conductive pattern 123h is provided with a power feeding point 223h. In the submount 12h, the conductive pattern 122h and the conductive pattern 123h formed on the surface of the electrical insulator 121h are arranged apart from each other.

  Specifically, power is first supplied from the power supply terminal 22 to the conductive pattern 122e on the LD assembly 1e via the conductive ribbon 3. At this time, the connection location between the conductive ribbon 3 and the conductive pattern 122e is a power supply location 222e. The power feeding location 222e is located on one side (the side where the power feeding terminal 22 is arranged in FIG. 23) on the conductive pattern 122e in the arrangement direction of the LD elements 4. Then, power is supplied from the conductive pattern 122e to the LD array 11e on the LD assembly 1e through the P-side electrode. On the LD array 11e, power is supplied to the conductive pattern 123e through the conductive wire 14 from each conductive wire connecting portion in the N-side electrode of the LD element 4 arranged at equal intervals.

  Then, power is supplied from the conductive pattern 123e on the LD assembly 1e to the conductive pattern 122f on the LD assembly 1f via the conductive ribbon 3. At this time, the connection location between the conductive ribbon 3 and the conductive pattern 123e is a power feeding location 223e. The power feeding location 223e is located on the other side in the arrangement direction of the LD elements 4 on the conductive pattern 123e (the side opposite to the side where the power feeding terminal 22 is arranged in FIG. 23). Further, the connection point between the conductive ribbon 3 and the conductive pattern 122f is a power supply point 222f. The power feeding point 222f is located on one side of the conductive pattern 122f in the arrangement direction of the LD elements 4 (the side where the power feeding terminal 22 is arranged in FIG. 23). Then, power is supplied from the conductive pattern 122f to the LD array 11f on the LD assembly 1f via the P-side electrode. On the LD array 11f, power is supplied to the conductive pattern 123f from the conductive wire connecting portions of the N-side electrodes of the LD elements 4 arranged at equal intervals through the conductive wires 14.

  Then, power is supplied from the conductive pattern 123 f on the LD assembly 1 f to the conductive pattern 122 h on the LD assembly 1 h via the conductive ribbon 3. At this time, the connection location between the conductive ribbon 3 and the conductive pattern 123f is a power supply location 223f. The power feeding point 223f is located on the other side in the arrangement direction of the LD elements 4 (on the side opposite to the side where the power feeding terminal 22 is arranged in FIG. 23) on the conductive pattern 123f. Further, the connection point between the conductive ribbon 3 and the conductive pattern 122h is a feeding point 222h. The feeding point 222h is located on one side of the conductive pattern 122h in the arrangement direction of the LD elements 4 (on the side opposite to the side where the feeding terminal 22 is arranged in FIG. 23). Then, power is supplied from the conductive pattern 122h to the LD array 11h on the LD assembly 1h via the P-side electrode. On the LD array 11h, power is supplied to the conductive pattern 123h via the conductive wire 14 from each conductive wire connecting portion in the N-side electrode of the LD element 4 arranged at equal intervals.

  Then, power is supplied from the conductive pattern 123 h on the LD assembly 1 h to the conductive pattern 122 g on the LD assembly 1 g via the conductive ribbon 3. At this time, the connection location between the conductive ribbon 3 and the conductive pattern 123h is a power supply location 223h. The feeding point 223h is located on the other side (the side where the feeding terminal 22 is arranged in FIG. 23) in the arrangement direction of the LD elements 4 on the conductive pattern 123h. Moreover, the connection location of the conductive ribbon 3 and the conductive pattern 122g is a feeding location 222g. The feeding point 222g is located on one side in the arrangement direction of the LD elements 4 on the conductive pattern 122g (the side opposite to the side where the feeding terminal 22 is arranged in FIG. 23). Then, power is supplied from the conductive pattern 122g to the LD array 11g on the LD assembly 1g via the P-side electrode. On the LD array 11g, power is supplied to the conductive pattern 123g through the conductive wires 14 from the conductive wire connecting portions of the N-side electrodes of the LD elements 4 arranged at equal intervals.

  Then, power is supplied from the conductive pattern 123 g on the LD assembly 1 g to the power supply terminal 23 via the conductive ribbon 3. At this time, the connection location between the conductive ribbon 3 and the conductive pattern 123g is a feeding location 223g. The feeding point 223g is located on the other side (the side where the feeding terminal 22 is arranged in FIG. 23) on the conductive pattern 123g in the arrangement direction of the LD elements 4.

  Due to such a configuration, the deviation between the LD elements 4 becomes small in the total value of the electrical resistance of the LD elements 4 on each LD assembly. Therefore, it is possible to suppress the bias of current distribution to the plurality of LD elements 4 on each LD array.

  Further, according to the configuration shown in the present embodiment, eight LD assemblies can be aggregated and arranged in a narrower space than when a plurality of LD assemblies shown in the first embodiment are arranged as they are.

  In addition, both the power supply terminal 22 and the power supply terminal 23 are disposed on the side of the surface of the one LD assembly that faces the other LD assembly. Therefore, the region where the heat dissipating member is disposed (the back surface of each LD assembly) and the region where the power supply terminal is disposed do not overlap in plan view.

  In the present embodiment, an example relating to eight LD assemblies has been described. However, the number of LD assemblies connected to one set of power supply terminals 22 and 23 and the number of sets of power supply terminals 22 and power supply terminals 23 can be freely changed. be able to. Even in this case, the basic configuration is not changed, and thus the above-described characteristics can be realized.

<Effect>
Below, the effect by said embodiment is illustrated.

  According to the above embodiment, the laser light source module includes at least one pair of LD arrays, for example, the LD array 11a and the LD array 11b, the submount 12a and the submount 12b, and the power supply terminal 22 included in the first power supply terminal. And a power supply terminal 23 included in the second power supply terminal.

  The LD array 11a and the LD array 11b are arranged to face each other. An LD array 11a is disposed on the submount 12a. The LD array 11b is disposed on the submount 12b.

  The power supply terminal 22 is arranged on the side of a set of LD arrays, for example, the LD array 11a and the LD array 11b. The power supply terminal 23 is disposed on the side of a set of LD arrays, for example, the LD array 11a and the LD array 11b.

  The LD array 11 a includes a plurality of arranged LDs, for example, LD elements 4. The LD array 11b includes a plurality of arranged LDs, for example, LD elements 4.

  The submount 12a includes a first conductive pattern, for example, a conductive pattern 122a, and a second conductive pattern, for example, a conductive pattern 123a.

  The conductive pattern 122 a is electrically connected to one electrode of the plurality of LD elements 4, for example, the P-side electrode 8. The conductive pattern 123a is formed apart from the conductive pattern 122a, and is electrically connected to the other electrode of the plurality of LD elements 4, for example, the N-side electrode 2.

  The submount 12b includes a first conductive pattern, for example, a conductive pattern 122b, and a second conductive pattern, for example, a conductive pattern 123b.

  The conductive pattern 122 b is electrically connected to one electrode of the plurality of LD elements 4, for example, the P-side electrode 8. The conductive pattern 123b is formed apart from the conductive pattern 122b, and is electrically connected to the other electrode of the plurality of LD elements 4, for example, the N-side electrode 2.

  In the conductive pattern 122a, a first feeding point, for example, a feeding point 222a, which is an electrical position on the feeding terminal 22 side, is located at a position on the first end side in the arrangement direction in which the plurality of LD elements 4 are arranged. Provided. Further, in the conductive pattern 122b, a first feeding point, for example, a feeding point, electrically connected to the feeding terminal 22 at a position on the first end side in the arrangement direction, which is the direction in which the plurality of LD elements 4 are arranged. 222b is provided.

  A second feeding point, for example, a feeding point 223a, which is an electrical position on the feeding terminal 23 side, is provided at a position on the second end side opposite to the first end in the arrangement direction in the conductive pattern 123a. In addition, a second power feeding point, for example, a power feeding point 223b, electrically connected to the power feeding terminal 23 is provided at a position on the second end side opposite to the first end in the arrangement direction in the conductive pattern 123b. It is done.

  According to such a configuration, for example, the P-side electrode 8 of the LD element 4 in the LD array 11a is connected to the power supply terminal 22 from the power supply location 222a on the conductive pattern 122a, and N of the LD element 4 in the LD array 11a The side electrode 2 is connected to the power supply terminal 23 from the power supply location 223a on the conductive pattern 123a. Here, the power feeding point 222 a and the power feeding point 223 a are located on the opposite end side in the arrangement direction of the plurality of LD elements 4. Therefore, in each LD element 4, the electrical resistance based on the distance to the feeding point 222a and the electrical resistance based on the distance to the feeding point 223a cancel each other out of the magnitude of the electrical resistance. The total value of these electric resistances is less biased between the LD elements 4. That is, it is possible to suppress a bias in current distribution with respect to the plurality of LD elements 4.

  In addition, since at least one set of LD arrays is arranged to face each other, the LD arrays can be arranged close to each other. Therefore, the spread angle (Etendue) of the light beam synthesized from the laser beams emitted from the LD elements can be kept small.

  In addition, since one holding block is provided for each LD array, a large bonding area between the holding block and the stem base can be ensured. Therefore, good heat transfer from the LD array to the stem base can be realized. Therefore, the heat dissipation efficiency of the laser element is increased, and a decrease in light emission efficiency due to heat generation of the laser element can be suppressed.

  Note that configurations other than these configurations can be omitted as appropriate, but the above-described effects can be produced even when at least one other configuration shown in this specification is added as appropriate.

  Further, according to the above-described embodiment, the sum of the electric resistance generated between the power feeding point 222a and the LD element 4 and the electric resistance generated between the power feeding point 223a and the LD element 4 is equal to each other in the LD array 11a. It is equal between the LD elements 4.

  According to such a configuration, the total value of the electrical resistance based on the distance to the feeding point 222 a and the electrical resistance based on the distance to the feeding point 223 a in each LD element 4 is equal among the LD elements 4. . That is, the current can be equally distributed to the plurality of LD elements 4.

  Further, according to the above embodiment, the sum of the distance between the power feeding point 222a and the LD element 4 and the distance between the power feeding point 223a and the LD element 4 is the distance between the LD elements 4 in the LD array 11a. Are equal.

  According to such a configuration, the total value of the electrical resistance based on the distance to the feeding point 222 a and the electrical resistance based on the distance to the feeding point 223 a in each LD element 4 is equal among the LD elements 4. . That is, the current can be equally distributed to the plurality of LD elements 4.

  Moreover, according to said embodiment, both the electric power feeding terminal 22 and the electric power feeding terminal 23 are arrange | positioned at the side of the same side of LD array 11a, for example.

  In one set of LD arrays, the conductive pattern 123a of the submount 12a on which the opposing LD array 11a is arranged on the side opposite to the side on which the feeding terminal 22 and the feeding terminal 23 are arranged is arranged on the other side. It is electrically connected to the conductive pattern 122b of the submount 12b on which the LD array 11b is disposed.

  In the conductive pattern 122a of the submount 12a on which the one LD array 11a is disposed, a power feeding point 222a that is electrically connected to the power feeding terminal 22 at a position on the first end side in the arrangement direction of the plurality of LD elements 4. Is provided.

  In the conductive pattern 123b of the submount 12b on which the other LD array 11b is disposed, a power feeding point 223b that is electrically connected to the power feeding terminal 23 is provided at a position on the second end side in the arrangement direction.

  According to such a configuration, both the power supply terminal 22 and the power supply terminal 23 are arranged on the same side of the LD array. For this reason, the peripheral region of the LD array that is assumed to generate heat does not overlap with the region where the power supply terminal and its wiring are arranged in plan view. Therefore, it is possible to suppress the influence of heat on the power supply terminal and its wiring and operate the laser light source module under appropriate conditions.

  Further, according to the above embodiment, the conductive pattern 122a is formed along the side on the first end portion side of the submount 12a. The conductive pattern 122b is formed along the side on the first end side of the submount 12b.

  The conductive pattern 123a is formed along the side on the second end side of the submount 12a. In addition, the conductive pattern 123b is formed along the side on the second end side of the submount 12b.

  According to such a structure, the freedom degree at the time of providing the electric power feeding location 222a and the electric power feeding location 223a improves. Therefore, the degree of freedom is also increased when the feeding point 222a and the feeding point 223a are provided at positions where the total value of the electrical resistance is completely equal between the LD elements 4.

  Further, according to the above embodiment, the laser light source module includes a plurality of sets of LD arrays, for example, the LD array 11e, the LD array 11f, the LD array 11g, and the LD array 11h, which are arranged to face each other.

  One set of LD arrays, for example, LD array 11e and LD array 11g, and another set of LD arrays, for example, LD array 11f and LD array 11h, are adjacent to each other along the arrangement direction of the plurality of LD elements 4. Arranged.

  The feeding terminal 22 and the feeding terminal 23 are both arranged on the same side of the plurality of sets of LD arrays.

  One set of LD arrays, for example, the LD array 11f and the LD array 11h, are arranged on the side opposite to the side where the power supply terminal 22 and the power supply terminal 23 are arranged. The conductive pattern 123f is electrically connected to the conductive pattern 122h of the submount 12h on which the opposite LD array 11h is arranged.

  A pair of adjacent LD arrays, for example, the LD array 11e and the LD array 11f, includes the conductive pattern 123e of the submount 12e on which one adjacent LD array 11e is disposed, and the other adjacent LD array 11f. The submount 12f is electrically connected to the conductive pattern 122f.

  The power supply terminal 22 is connected to one opposing LD array, for example, the submount 12e on which the LD array 11e is disposed, at one end where the power supply terminal 22 and the power supply terminal 23 are disposed. A power feeding location 222e that is electrically connected to the power feeding terminal 22 is provided at a position on the first end side in the arrangement direction in the conductive pattern 122e of the submount 12e.

  The power supply terminal 23 is connected to a submount 12g on which the other LD array facing one end, for example, the LD array 11g, on which the power supply terminal 22 and the power supply terminal 23 are disposed, is disposed. A power supply location 223g that is electrically connected to the power supply terminal 23 is provided at a position on the second end side in the arrangement direction of the conductive pattern 123g of the submount 12g.

  According to such a configuration, the LD assemblies can be concentrated and arranged in a narrower space than when a plurality of LD assemblies are arranged as they are.

<Modification>
In the above-described embodiment, the material, material, size, shape, relative arrangement relationship, implementation condition, and the like of each component may be described. It is not limited to what is described in the book. Therefore, innumerable modifications not illustrated are assumed within the scope of the present technology. For example, the case where at least one component is modified, added or omitted, and further, the case where at least one component in at least one embodiment is extracted and combined with the components of other embodiments are included. It is.

  In addition, as long as no contradiction arises, “one or more” components described as being provided with “one” in the above-described embodiment may be provided. Furthermore, each component is a conceptual unit, and one component consists of a plurality of structures, one component corresponds to a part of the structure, and a plurality of components. And the case where the component is provided in one structure. Each component includes a structure having another structure or shape as long as the same function is exhibited.

  Also, the descriptions in this specification are referred to for all purposes related to the present technology, and none of them is admitted to be prior art.

  Further, in the above embodiment, when a material name or the like is described without being particularly specified, the material includes other additives, for example, an alloy or the like unless a contradiction arises. .

  1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h LD assembly, 2 N side electrode, 3, 3c, 3d Conductive ribbon, 4 LD element, 5 Cover, 6, 6a Heat radiation member, 7 Current source, 8 P side electrode, 11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h LD array, 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h Submount, 13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h Holding block, 14 Conductive wire, 21 Stem base, 21a, 21b, 21c, 21d Hole, 22, 22a, 23, 23a Power supply terminal, 24a, 24b, 24c, 24d Sealing material, 40 Light emitting point 41 Conductive wire connection part, 121a, 121b, 121c, 121d, 121e, 121f, 121g 121h Electrical insulator, 122a, 122b, 122c, 122d, 122e, 122f, 122g, 122h, 123a, 123b, 123c, 123d, 123e, 123f, 123g, 123h, 124a, 124b, 124c, 124d, 124e, 124f, 124g , 124h Conductive pattern, 222a, 222b, 222c, 222e, 222f, 222g, 222h, 223a, 223b, 223c, 223e, 223f, 223g, 223h, 322c, 323c

Claims (6)

At least one set of laser diode arrays disposed opposite each other;
A submount on which each of the laser diode arrays is disposed;
A first power supply terminal and a second power supply terminal disposed on a side of at least one set of the laser diode array;
Each said laser diode array comprises a plurality of laser diodes arranged,
Each said submount is
A first conductive pattern electrically connected to one electrode of the plurality of laser diodes;
A second conductive pattern formed apart from the first conductive pattern and electrically connected to the other electrode of the plurality of laser diodes,
In the first conductive pattern, a first feeding point on the first feeding terminal side is provided at a position on the first end side in the arrangement direction, which is a direction in which the plurality of laser diodes are arranged,
In the second conductive pattern, a second feeding point on the second feeding terminal side is provided at a position on the second end side opposite to the first end in the arrangement direction.
Laser light source module. The sum of the electric resistance generated between the first power feeding point and the laser diode and the electric resistance generated between the second power feeding point and the laser diode is equal between the laser diodes,
The laser light source module according to claim 1. The sum of the distance between the first power feeding point and the laser diode and the distance between the second power feeding point and the laser diode is equal between the laser diodes,
The laser light source module according to claim 1 or 2. The first feeding terminal and the second feeding terminal are both disposed on the same side of the set of the laser diode arrays,
The set of the laser diode arrays includes the second submount on which the one laser diode array facing each other is disposed on a side opposite to a side where the first power supply terminal and the second power supply terminal are disposed. A conductive pattern is electrically connected to the first conductive pattern of the submount on which the other laser diode array facing the other is disposed;
The laser light source module according to any one of claims 1 to 3. The first conductive pattern includes a portion along the side on the first end side in each of the submounts,
The second conductive pattern includes a portion along a side of the second end side in each of the submounts.
The laser light source module according to any one of claims 1 to 4. Comprising a plurality of sets of the laser diode arrays arranged opposite to each other;
One set of the laser diode arrays and another set of the laser diode arrays are arranged adjacent to each other along the arrangement direction of the plurality of the laser diodes,
The first feeding terminal and the second feeding terminal are both disposed on the same side of the plurality of sets of the laser diode arrays,
The set of the laser diode arrays includes the second submount on which the one laser diode array facing each other is disposed on a side opposite to a side where the first power supply terminal and the second power supply terminal are disposed. A conductive pattern is electrically connected to the first conductive pattern of the submount on which the opposite laser diode array is disposed;
The laser diode arrays adjacent to each other are arranged such that the second conductive pattern of the submount in which the one adjacent laser diode array is disposed is the second conductive pattern of the submount in which the other adjacent laser diode array is disposed. Electrically connected to the first conductive pattern;
The laser light source module according to any one of claims 1 to 5.

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