JP2018098387A - Substrate processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing device which can be easily handled during maintenance or the like and in which multiple vacuum processing modules can be disposed.SOLUTION: A substrate processing device comprises: a substrate transport part 20; and a processing unit housing part 7 for housing multiple processing units U while arranging them side by side in a vertical direction, each processing unit including first and second vacuum processing modules 4A and 4B for processing a substrate and a load lock module 3. In a view of a stage inside of the processing unit housing part 7 from an upper surface side, by the side of the load lock module 7, first through-piping 51A is disposed in a region R between the substrate transport part and the first vacuum processing module 4A, and second through-piping 51B is disposed in a region R between the substrate transport part 20 and the second vacuum processing module 4B. Further, traverse piping 51 and 832 are connected to the first and second vacuum processing modules 4A and 4B in each of the processing units U and disposed so as to cross stages 70A to 70C of the processing unit housing part 7.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a technique for arranging a processing unit including a load lock module and a vacuum processing module in a substrate processing apparatus.

  In the semiconductor manufacturing process, vacuum processing such as film formation, etching, ashing, and annealing is performed on a semiconductor wafer (hereinafter referred to as “wafer”). In order to perform vacuum processing at high throughput, a vacuum transfer chamber with a polygonal shape in plan view is connected to an EFEM (Equipment Front End Module) via a load lock module, and a vacuum processing module is connected to each side wall of the vacuum transfer chamber A substrate processing apparatus called a multi-chamber system is known.

  On the other hand, recently, due to diversification of semiconductor devices, vacuum processing that requires a long time to complete processing may be required. For example, when forming a NAND circuit which is a three-dimensional memory, an oxide layer and a nitride layer are alternately stacked many times, so that a very long time is required for one film formation process. For this reason, in order to increase the throughput, it is desired to construct a technique for increasing the number of vacuum processing modules provided in the substrate processing apparatus.

  Here, in Patent Document 1, in order to arrange a plurality of processing chambers in which heat treatment, cooling processing, and the like for a substrate are stacked in a vertical direction, a processing apparatus capable of accommodating these processing chambers in multiple stages. A substrate processing apparatus having a frame (first support structure) is described.

  However, in a substrate processing apparatus that performs vacuum processing on a substrate, substrate processing can be performed by combining a load lock module that can freely switch an internal atmosphere between a vacuum atmosphere and a normal pressure atmosphere, and a vacuum processing module. Done. In this regard, the technique described in Patent Document 1 merely describes a technique for simply stacking the processing chambers. For this reason, it is preferable to stack and arrange the vacuum processing module and load lock module, and at that time, how to connect various pipes for processing gas supply and evacuation. It is not clear whether it is sufficient, and a substrate processing apparatus capable of performing vacuum processing on the substrate cannot be constructed.

Japanese Patent Laying-Open No. 2006-210767: claim 1, paragraphs 0002 and 0017, FIG.

  The present invention has been made under such circumstances, and an object of the present invention is to provide a substrate processing apparatus that can be easily handled during maintenance and that can be provided with a plurality of vacuum processing modules. There is.

The substrate processing apparatus of the present invention is a substrate processing apparatus including a plurality of vacuum processing modules for processing a substrate in a vacuum atmosphere.
A substrate transport section provided with a first substrate transport mechanism for transporting a substrate in a normal pressure atmosphere;
A first vacuum processing module and a second vacuum processing module that are provided side by side in a horizontal direction when viewed from the substrate transport unit side, and the first and second vacuums are provided. A substrate is connected between the substrate transfer unit and each vacuum vessel in a load lock chamber that is connected to each vacuum vessel of the processing module and is configured to be able to switch an internal atmosphere between a normal pressure atmosphere and a vacuum atmosphere. A load lock module provided with a second substrate transport mechanism for transport, and a processing unit comprising:
Each of the load lock modules connected to the substrate transport unit, a processing unit storage unit that stores a plurality of the processing units arranged in multiple stages in the vertical direction,
The first vacuum processing modules of the plurality of processing units arranged in multiple stages are connected in common, and a first through pipe disposed so as to penetrate the processing unit housing portion in the vertical direction; A second through pipe connected to the second vacuum processing module of the processing unit in common, and arranged to penetrate the processing unit housing portion in the vertical direction;
A transverse pipe connected to the first and second vacuum processing modules in each processing unit and arranged to traverse each stage of the processing unit accommodating portion;
When the inside of the step of the processing unit accommodating portion is viewed from the upper surface side, the first through pipe is on the side of the load lock module, and is between the substrate transfer portion and the first vacuum processing module. The second through pipe is disposed on a side of the load lock module and in a region between the substrate transfer unit and the second vacuum processing module. To do.

  The present invention relates to piping provided in a processing unit housing portion in which a plurality of processing units including first and second vacuum processing modules and a load lock module are housed, and penetrates the processing unit housing portion in the vertical direction. The first and second through pipes arranged as described above and the transverse pipe arranged so as to cross each stage of the processing unit accommodating portion are arranged. With this configuration, it becomes easy to access various pipes that are dispersedly arranged in the processing unit accommodating portion, and a substrate processing apparatus with good maintainability can be configured.

1 is an external perspective view of a substrate processing apparatus according to an embodiment of the present invention. It is a cross-sectional plan view of the substrate processing apparatus. It is a side view of the outer frame provided in the substrate processing apparatus. It is a top view of the processing unit accommodated in the outer frame. It is an external appearance perspective view of the said outer frame. It is a perspective view which shows the state in which the processing unit was integrated in the said outer frame. It is the 1st operation view showing the state where the processing unit was pulled out. It is the 2nd operation figure showing the state where the processing unit was connected.

  The configuration of the substrate processing apparatus according to the embodiment of the present invention will be described below with reference to FIGS. As shown in the external perspective view of FIG. 1, the substrate processing apparatus of this example is connected to the EFEM 101 for taking out the wafer W from the carrier C which is a transfer container containing a plurality of wafers W, and is connected to the EFEM 101. And a processing block 102 for performing the above process.

  For example, the EFEM 101 is a container mounting unit configured such that four carriers C, which are FOUPs (Front Opening Unified Pod), are mounted, for example, in the left-right direction (X direction in FIG. 1) when viewed from the front. A load port 11 is provided. As shown in FIG. 2, a support portion 10 that supports the carrier C in a state where the bottom surface of the carrier C is positioned is provided on the mounting surface of the carrier C in the load port 11. On the far side of the load port 11, a transfer chamber 13 including a transfer mechanism 12 that transfers a wafer to the carrier C is provided. A fan filter unit (not shown) is provided on the upper surface side of the transfer chamber 13, and the inside of the transfer chamber 13 is, for example, a space of clean air atmosphere at normal pressure. On the side wall surface of the transfer chamber 13 on the side of the load port 11 is provided with a detaching mechanism for detaching a lid provided on the side surface of the carrier C, and an opening / closing door for opening and closing an opening for loading and unloading the wafer W. 14 is provided.

  The delivery mechanism 12 has a structure in which a telescopic joint arm is vertically movable and rotatable on a base body (not shown) that is movable along a traveling rail 15 that extends in the left-right direction when viewed from the load port 11 side. Yes. When the lid of the carrier C is removed by the opening / closing door 14 and the opening is opened, the transfer mechanism 12 enters the carrier C and the wafer W is taken out.

  When viewed from the load port 11, a transfer port (not shown) through which the transfer mechanism 12 passes while holding the wafer W is formed on the back side of the transfer chamber 13. During the period when the wafer W is not delivered by the delivery mechanism 12, the delivery port may be closed by a shutter (not shown) to partition the atmosphere between the EFEM 101 and the processing block 102.

  As shown in FIG. 2, the processing block 102 includes a substrate transfer unit 20 to which the wafer W delivered from the EFEM 101 side is transferred, and an outer frame 7 that houses a plurality of processing units U connected to the substrate transfer unit 20. With. The substrate transfer unit 20 and the outer frame 7 are accommodated in, for example, a housing (FIG. 1).

  As shown in FIG. 2, the substrate transfer unit 20 includes an elongated substrate transfer chamber 200 extending in the front-rear direction when viewed from the EFEM 101. The substrate transfer chamber 200 can connect the processing units U (more specifically, the load lock module 3 in the processing unit U) accommodated in multiple stages in an outer frame 7 described later to the substrate transfer chamber 200. Has a height. A fan filter unit (not shown) is provided on the upper surface side of the substrate transfer chamber 200, and the inside of the substrate transfer chamber 200 is, for example, a space of clean air atmosphere at normal pressure.

  A traveling rail 21 that is a moving path extending in the front-rear direction is provided at the bottom of the substrate transfer chamber 200. Further, a support column 22 configured to be movable in the front-rear direction while being guided by the traveling rail 21 is provided in the substrate transfer chamber 200, and a side surface on the EFEM 101 side of the support column 22 extends along the support column 22. A first substrate transport mechanism 2 configured to be movable up and down is provided.

  In this example, the first substrate transport mechanism 2 has a structure in which, for example, wafer holding portions (not shown) that hold the wafers W one by one are provided in multiple stages in a housing that is open on the entire surface. The first substrate transport mechanism 2 is supported by the support column 22 via a rotation driving unit (not shown) that rotates the casing around the vertical axis. With this configuration, the first substrate transport mechanism 2 can direct the opening surface of the housing to the EFEM 101 side and the left and right side surfaces of the substrate transport chamber 200 in which the outer frame 7 is provided.

  Note that it is not an essential requirement to configure the first substrate transport mechanism 2 by a housing that can accommodate the wafers W in multiple stages. For example, one or a plurality of articulated arms that can be expanded and contracted and rotated may be provided so as to be movable along the traveling rail 21 and ascendable and descendable along the column 22. In this case, a shelf-like wafer placement unit for temporarily placing the wafer W to be delivered may be provided between the EFEM 101 and the substrate transfer unit 20.

A plurality of (three in this example) outer frames 7 are disposed on the left and right sides of the substrate transport unit 20 as viewed from the EFEM 101 side.
Hereinafter, the configuration and operation of the outer frame 7 and the processing unit U will be described with reference to FIGS. 3 to 8. In these drawings, when the side wall surface of the substrate transport unit 20 is viewed from the outer frame 7, the substrate The sub-coordinate axes in which the direction approaching the transport unit 20 is the positive direction of the X ′ axis, the right hand side when viewed from the outer frame 7 is the positive direction of the Y ′ axis, and the upper side of the vertical direction is the positive direction of the Z ′ axis are also shown. .

  As shown in FIGS. 3 and 5, the outer frame 7 has a shelf structure in which, for example, two shelf plates 72 are provided at intervals in the vertical direction on a frame body having a framework structure. In the outer frame 7, the space between the floor surface in the processing block 102 and the lower shelf part 72, the space between the lower shelf part 72 and the upper shelf part 72, and the upper part Spaces above the shelf 72 are storage spaces 70A to 70C for storing the processing unit U, respectively.

  The configuration of the processing unit U accommodated in these accommodating spaces 70A to 70C will be described. Each processing unit U includes a plurality of, for example, two vacuum processing modules (first processing units) for transferring wafers W between the load lock module (LLM) 3 and the first substrate transfer mechanism 2 via the LLM 3. A vacuum processing module 4A and a second vacuum processing module 4B).

As shown in FIGS. 2 and 4, the LLM 3 has a structure in which a second substrate transport mechanism 33 is provided in a load lock chamber 32 having a pentagonal plan shape. A connection port portion 34 is provided on one side surface of the load lock chamber 32, and a gate valve G <b> 1 for opening and closing the loading / unloading port 31 through which the wafer W is loaded and unloaded is provided inside the connection port portion 34. . On the other hand, a connecting part 23 is provided on the side wall surface of the substrate transport part 20, and the connecting port part 34 on the LLM 3 side is connected to the connecting part 23.
For convenience of illustration, in FIG. 2, the description of the connection port portion 34 of the LLM 3 and the connection portion 23 of the substrate transport unit 20 is omitted.

  On the other hand, when viewed from the connection surface with the substrate transport unit 20, on the two surfaces located on the back side of the load lock chamber 32, loading / unloading ports 35 that can be opened and closed by gate valves G2 and G3 are provided. And the vacuum vessel 40 which comprises 1st, 2nd vacuum processing module 4A, 4B is airtightly connected to the side wall surface of the board | substrate conveyance part 20 in which these entrance / exit 35 was provided. That is, the first and second vacuum processing modules 4A and 4B are provided side by side in the horizontal direction when viewed from the substrate transfer unit 20 side.

An exhaust pipe (not shown) is connected to the load lock chamber 32, and the inside of the load lock chamber 32 is evacuated through the exhaust pipe, so that an atmospheric pressure atmosphere (normal pressure atmosphere) and a vacuum atmosphere are interposed. The internal atmosphere can be switched with.
The second substrate transport mechanism 33 provided in the load lock chamber 32 is constituted by, for example, a joint arm configured to be extendable and rotatable about a vertical axis, and has moved to the front of the connection position of the LLM 3. The wafer W is transferred between the first substrate transfer mechanism 2 and the first and second vacuum processing modules 4A and 4B.

  The vacuum containers 40 constituting the first and second vacuum processing modules 4A and 4B perform, for example, film formation, which is vacuum processing, on the wafer W. The vacuum vessel 40 has a mounting table on which a wafer W to be processed is placed, a processing gas supply unit that supplies a processing gas for film formation into the vacuum vessel 40, and a cleaning device for cleaning the inside of the vacuum vessel 40. A cleaning gas supply unit for supplying a cleaning gas, a plasma generation mechanism for converting the processing gas into plasma when performing film formation using plasma, and the like (not shown) are provided.

  As shown in FIG. 6, the processing unit U having the above-described configuration is such that the LLM 3 and the first and second vacuum processing modules 4 </ b> A and 4 </ b> B are disposed on the lower surface side by the inner frame 6 configured as a frame of a frame structure, for example. It is supported from. In the space inside the inner frame 6 (below the processing unit U), there is a drive mechanism for driving the second substrate transport mechanism 33 in the LLM 3 and vacuum containers for the first and second vacuum processing modules 4A and 4B. Various incidental devices such as a delivery mechanism for delivering the wafer W between the mounting table provided in 40 and the second substrate transport mechanism 33 on the LLM 3 side are accommodated. The description is omitted.

2, 3, 6 and the like, the processing unit U is accommodated in the accommodating spaces 70A to 70C in the outer frame 7 while being supported by the inner frame 6, and the LLM 3 of each processing unit U is a substrate. Connected to the transport unit 20. As a result, in the substrate processing apparatus of this example, a total of 18 processing units U housed in the six outer frames 7 are connected to the substrate transport unit 20 and 36 first and second vacuum processing modules are connected. Film formation on the wafer W can be performed using 4A and 4B.
For convenience of illustration, in FIGS. 2 and 4, the outer frame 7 and the inner frame 6 are simplified and only the frame lines are displayed.

  As shown in FIG. 2, when viewed from the outer frame 7 toward the substrate transfer unit 20, for example, on the left hand side of the outer frame 7, the first and second vacuum processing modules 4 </ b> A and 4 </ b> B of each processing unit U are provided. A gas box 81 is provided for supplying various processing gases for film formation and a purge gas for discharging unnecessary processing gases. Further, behind the gas box 81 as viewed from the substrate transfer unit 20 side, power is supplied to various drive devices and plasma generation mechanisms provided in the LLM 3 and the first and second vacuum processing modules 4A and 4B. Power supply box 82 is provided.

  In the substrate processing apparatus of this example, the gas box 81, the power supply box 82, and the plasma box 83 include a plurality of processing units U (three processing units U in this example) housed in multiple stages in each outer frame 7. Is provided in common. As shown in FIG. 2, the gas box 81 and the power supply box 82 are arranged on the side of each outer frame 7 provided in the processing block 102. At this time, as shown in FIG. 2, the arrangement positions of the gas box 81 and the power supply box 82 viewed from the outer frame 7 may be made common. As a result, supply piping such as processing gas supplied from the gas box 81 to the first and second vacuum processing modules 4A and 4B, and from the power supply box 82 to the LLM3, the first and second vacuum processing modules 4A and 4B. The configuration and arrangement path of the supply line of the supplied power can be shared by all the processing units U.

  As shown in FIG. 5, the first and second vacuum processing modules 4 </ b> A are located above the uppermost accommodation space 70 </ b> C of each outer frame 7 and at the right-hand position on the near side as viewed from the substrate transport unit 20. 4B (each vacuum vessel 40) is provided with a plasma box 83 for supplying remote plasma as a cleaning gas. The arrangement position of the plasma box 83 is also shared by the outer frames 7, so that a remote plasma supply pipe (described later) is supplied from the plasma box 83 to the first and second vacuum processing modules 4A and 4B. The remote plasma supply pipe 831 and the remote plasma branch pipe 832) can be shared by all the processing units U.

  Thus, the layout of each outer frame 7, the gas box 81, the power supply box 82, and the plasma box 83 and the layout of the LLM 3, the first and second vacuum processing modules 4A and 4B in the processing unit U are made common. Thus, the substrate processing apparatus can be configured using the LLM 3, the first and second vacuum processing modules 4 </ b> A and 4 </ b> B, the outer frame 7 and the inner frame 6 having a common configuration.

  In order to satisfy this requirement, as shown in FIG. 2, the substrate processing apparatus of the present example includes an outer frame 7 arranged three by three with the substrate transport unit 20 interposed therebetween, a gas box 81 attached thereto, and a power supply box 82. Is arranged in a rotationally symmetrical manner across the substrate transport unit 20.

  Further, as shown in FIGS. 6 and 7, a slider portion 61 that supports the inner frame 6 and the processing unit U from the lower surface side is provided on the lower surface side of the inner frame 6. The slider portion 61 of the present example is configured by an elongated plate-like member, along a direction (X ′ direction) that intersects the arrangement direction (Y ′ direction) of the first and second vacuum processing modules 4A and 4B, Two are provided at intervals.

For example, in the processing units U accommodated in the accommodating spaces 70 </ b> A to 70 </ b> C, a plurality of sets of cam followers (or roller followers) may be provided on the lower surface side of the slider portion 61 along the extending direction of the slider portion 61. (Not shown). These cam followers follow a groove-like running track 74 formed on the shelf plate portion 72 on the outer frame 7 side so as to extend in a direction orthogonal to the side wall surface of the substrate transport unit 20 (direction X ′ in FIG. 6). The inner frame 6 is moved. In these inner frames 6, the slider portion 61 and the cam follower correspond to a moving mechanism that moves the processing unit U. Moreover, it may replace with a cam follower (roller follower) and may provide a caster in the slider part 61, and may comprise a moving mechanism. In addition, the description of the traveling track 74 is omitted except for FIG.
Furthermore, between each cam follower and the slider part 61, the jack part 62 which is an raising / lowering mechanism for raising / lowering the inner frame 6 is interposed.

  With the above-described configuration, the cam followers move along the traveling track 74 in the accommodation spaces 70A to 70C, so that the processing units U (LLM3 and the first, first, and second) supported by the inner frame 6 in each of the accommodation spaces 70A to 70C. The second vacuum processing modules 4A, 4B) can be moved laterally as a unit.

On the other hand, as described above, various pipes are connected to the LLM 3 and the first and second vacuum processing modules 4A and 4B constituting the processing unit U. In a state where these pipes are connected. The processing unit U cannot be moved.
Therefore, the processing unit U of this example uses a unit-side exhaust pipe 41 for evacuating the inside of the vacuum vessel 40 using the horizontal movement and the lifting operation using the moving mechanism and the lifting mechanism described above, The unit-side gas supply pipe 42 for supplying a processing gas or the like to the vacuum vessel 40 can be easily detached from the apparatus-side exhaust pipe 51 and the apparatus-side gas supply pipe 52 arranged on the outer frame 7 side. It has a simple configuration.

  In addition, even if various pipes are removed and the processing unit U can be moved in the lateral direction, if the pipes are arranged at positions that interfere with the movement path of the processing unit U, the processing unit U is moved. I can't let you. In addition, when the outer frame 7 is required to be configured as compact as possible, there may be a case where an empty area is reduced in a state where a plurality of processing units U are accommodated. At this time, even if there is an area where the piping can be arranged without interfering with the moving path of the processing unit U, a sufficiently wide space cannot be secured, and all the pipes are concentrated in the area. As a result, the gap between the pipes may be narrowed, and maintenance of each pipe may not be performed.

Therefore, in the substrate processing apparatus of this example, the processing units U are arranged horizontally by classifying the pipes connected to the LLM 3 and the first and second vacuum processing modules 4A and 4B and distributing them in different areas. While maintaining a movable state in the direction, the pipe arrangement with good maintainability is realized.
For convenience of illustration, a unit side exhaust pipe 41, a unit side gas supply pipe 42, an apparatus side exhaust pipe 51 (first apparatus side exhaust pipe 51A, second apparatus side exhaust pipe 51B) and apparatus side described below The gas supply pipe 52, the remote plasma supply pipe 831, the remote plasma branch pipe 832, etc. are omitted as appropriate in the drawings other than FIGS.

  4, when the inside (accommodation spaces 70A to 70C) of the outer frame 7 is viewed from the upper surface side, the left and right sides of the LLM 3 are the first and second sides. Between the vacuum processing modules 4A and 4B and the substrate transfer unit 20, there is an empty area R in which the main unit (LLM3 and the first and second vacuum processing modules 4A and 4B) of the processing unit U is not disposed. . Therefore, in the substrate processing apparatus of this example, using this empty area, the unit side exhaust pipe 41 and the unit side gas supply pipe 42 which are processing unit side piping parts are connected to the apparatus side exhaust pipe 51 ( The first apparatus side exhaust pipe 51A, the second apparatus side exhaust pipe 51B), and the apparatus side gas supply pipe 52 (52A, 52B) are connected.

As shown in FIGS. 2, 5, 7, etc., the first device-side exhaust pipe 51 </ b> A for evacuating the empty space R described above in the outer frame 7 so as to penetrate the outer frame 7 in the vertical direction. The second apparatus-side exhaust pipe 51B is provided. The upper ends of the first and second device-side exhaust pipes 51A and 51B extend into the uppermost accommodation space 70C and are then sealed with a flange lid. These first and second apparatus side exhaust pipes 51A, 51B pass through the outer frame 7 in the vertical direction through the opening 721 formed in the empty area R of the shelf 72, and the lower end thereof is, for example, On the lower side of the floor of the processing block 102, it is connected to a vacuum exhaust line for factory power.
Note that it is not an essential requirement that the first and second apparatus-side exhaust pipes 51 </ b> A and 51 </ b> B are entirely disposed inside the empty area R. For example, a part of these pipes 51A and 51B may protrude beyond the outer edge of the first and second vacuum processing modules 4A and 4B (outside the empty area R).

From the first and second apparatus-side exhaust pipes 51A and 51B, branch pipes 511 branch at predetermined height positions in the accommodation spaces 70A to 70C, and the ends of these branch pipes 511 face the upper surface. An opening end portion that opens is provided, and a flange-like connecting member 510 is provided at the opening end portion.
The branch pipe 511 is provided with a butterfly valve for controlling the pressure in the vacuum vessel 40, but is not shown in this example.

  On the other hand, as shown in FIGS. 4 and 7, a unit side exhaust pipe 41 for evacuating the vacuum vessel 40 is connected to the lower surfaces of the first and second vacuum processing modules 4A and 4B. Yes. The knit side exhaust pipe 41 whose one end is connected to the vacuum vessel 40 extends toward the front side, and the other end has the processing unit U disposed at a connection position where the LLM 3 and the substrate transport unit 20 are connected. At this time, the opening is opened at a position communicating with the opening of the branch pipe 511 arranged in the empty area R described above. A flange-shaped connecting member 410 is also provided at the end of the unit-side exhaust pipe 41.

When the end portion of the unit side exhaust pipe 41 and the end portion of the branch pipe 511 are connected, the opposing surfaces of the flange-like connecting member 510 and the connecting member 410 are airtightly connected via an O-ring (not shown), Furthermore, the connected state can be fixed using a clamping mechanism (not shown). In addition, it is good also as a structure which fastens the connection member 510 and the connection member 410 using a screw etc. not only when using a clamp mechanism.
In addition, the connecting member 510 provided in the branch pipe 511 branched from the one apparatus-side exhaust pipe 51 (for example, the second apparatus-side exhaust pipe 51B) has the above-described disadvantage provided in the load lock chamber 32. An opening connected to a flange-like connecting portion (not shown) provided at the end of the illustrated exhaust pipe is formed.

With these configurations, the first apparatus-side exhaust pipe is provided to the first vacuum processing module 4A of the processing units U arranged in multiple stages (three stages in this example) vertically in the outer frame 7. 51A are connected in common. Similarly, the second apparatus side exhaust pipe 51B is commonly connected to the second vacuum processing modules 4B of the processing units U arranged in multiple stages.
In this example, the first device-side exhaust pipe 51A corresponds to a first through pipe, and the second device-side exhaust pipe 51B corresponds to a second through pipe.

Next, the configuration of a gas supply pipe (device-side gas supply pipe 52, unit-side gas supply pipe 42) will be described. The number of gas supply pipes varies depending on the number of types of gases used for film formation and whether or not purge gas is used, but for convenience of illustration, in FIGS. Only one or two pipes are displayed.
As shown in FIGS. 2, 5, 7, etc., from the gas box 81 disposed adjacent to the outer frame 7, gas supply device side gas supply pipes are provided at the height positions of the respective accommodation spaces 70 </ b> A to 70 </ b> C. 52 (52A, 52B) are extended toward the respective accommodation spaces 70A to 70C by two sets. One set of apparatus-side gas supply pipes 52B extends along the side surface of the outer frame 7 to the front side of the vacuum processing module 4B and to the side position of the LLM 3 (one side of the above-described “empty area R”). It is out.

  The other set of apparatus-side gas supply pipes 52A extends outward toward the substrate transfer section 20 in the opposite direction to the apparatus-side gas supply pipe 52B described above, and then is an outer surface facing the substrate transfer section 20. The drawing direction is changed to the lower side on the front surface of the frame 7 and is drawn to the side surface of the outer frame 7 opposite to the arrangement surface of the gas box 81 so as to bypass the connection portion between the substrate transport unit 20 and the LLM 3. Yes. Further, the apparatus-side gas supply pipe 52A has the first vacuum processing module 4A along the side surface of the outer frame 7 at the same height as the apparatus-side gas supply pipe 52B described above after changing the extending direction upward. And to the side position of the LLM 3 (the other side of the above-mentioned “empty area R”).

  As shown in FIGS. 7 and 8, the apparatus side gas supply pipe 52 (an example of the apparatus side gas supply pipe 52B is shown in FIGS. 7 and 8) disposed at the side position of the LLM 3 is further processed. The connecting pipe 521 is extended toward the inner region of the outer frame 7 (accommodating spaces 70A to 70C) in which the unit U is arranged. And the terminal part of each connection pipe | tube 521 is provided with the block-shaped connection member 520 to which these connection pipe | tubes 521 are connected in common, The flow path corresponding to each connection pipe | tube 521 is in the said connection pipe | tube 521. It is formed and opens toward the upper surface (opening end portion of the apparatus-side gas supply pipe 52B).

  On the other hand, as shown in FIGS. 4 and 7, etc., a plurality of unit side gas supply pipes for supplying a processing gas and the like to the vacuum vessel 40 are provided on the upper surface side of the first and second vacuum processing modules 4A and 4B. 42 is connected. Each unit-side gas supply pipe 42 whose one end is connected to the first and second vacuum processing modules 4A and 4B is extended toward the front side, and then is connected to a common block-shaped connecting member at the other end. 420 is connected. A flow path corresponding to each unit-side gas supply pipe 42 is formed in the connection member 420 and opens toward the lower surface. The connecting member 420 is arranged at a position where the connecting member 520 is connected when the processing unit U is arranged at a connecting position where the LLM 3 and the substrate transport unit 20 are connected.

  The connecting member 520 on the apparatus side gas supply pipe 52 side and the connecting member 420 on the unit side gas supply pipe 42 side are airtightly connected via an O-ring (not shown) or the like. Further, these connecting members 520 and 420 may be connected using screws or the like, or may be a socket structure that can be easily connected and removed.

With these configurations, when the apparatus-side gas supply pipe 52 (52A, 52B) is viewed as a unit, the apparatus-side gas supply pipe 52 crosses each stage (accommodating spaces 70A to 70C) of the outer frame 7. It can be said that it is disposed and connected to the first and second vacuum processing modules 4A and 4B.
In this example, the apparatus side gas supply pipe 52 (52A, 52B) corresponds to a transverse pipe.

Finally, pipes for supplying the remote plasma generated in the plasma box 83 to the first and second vacuum processing modules 4A and 4B when cleaning the vacuum vessel 40 (remote plasma supply pipe 831, remote plasma branch pipe) 832) will be described.
As shown in FIG. 5, a remote plasma supply pipe 831 is connected to the plasma box 83 disposed on the upper side of the uppermost accommodation space 70 </ b> C. The remote plasma supply pipe 831 extends along the side surface of the outer frame 7 toward the far side in the lateral direction when viewed from the substrate transfer unit 20, and then extends downward in the center position of the side surface of the outer frame 7. And is extended to the height position of the lowermost storage space 70A.

  From the remote plasma supply pipe 831 extending in the vertical direction, the remote plasma branch is at a height slightly above the first and second processing modules 4A and 4B accommodated in the respective stages (accommodating spaces 70A to 70C). The pipe 832 branches in the lateral direction. Each remote plasma branch pipe 832 extends in the lateral direction along the direction in which the first and second processing modules 4A and 4B of the processing unit U are arranged, and is provided on the first and second processing modules 4A and 4B side. Are connected to the connecting portion 43 (FIG. 6 shows an example of the accommodation space 70B).

  The remote plasma branch pipe 832 is connected via a joint 833 and can be removed from the middle. Therefore, when the processing unit U is moved in the lateral direction and pulled out from the outer frame 7, a part of the remote plasma branch pipe 832 is removed from the first and second processing modules 4A and 4B. Avoiding interference with travel paths.

Based on the above-described configuration, the remote plasma branch pipe 832 is also disposed so as to traverse each stage (accommodating spaces 70A to 70C) of the outer frame 7, and is connected to the first and second vacuum processing modules 4A and 4B. It can be said that it is connected and corresponds to cross piping.
For convenience of illustration, the remote plasma supply pipe 831 and the remote plasma branch pipe 832 are not shown in FIG.

  In addition, the substrate processing apparatus of this example is provided with a control unit (not shown). For example, the control unit includes a computer having a CPU (Central Processing Unit) and a storage unit, and the storage unit performs film formation performed by the first and second vacuum processing modules 4A and 4B of each processing unit U. A program in which a group of steps (commands) for controlling the contents and the transfer order of the wafer W by the first substrate transfer mechanism 2 is recorded. This program is stored in a storage medium such as a hard disk, a compact disk, a magnetic optical disk, or a memory card, and installed in the computer therefrom.

The operation of the substrate processing apparatus having the configuration described above will be described.
As shown in FIG. 3 and the like, during normal operation of the substrate processing apparatus, the processing unit U is accommodated in the accommodating spaces 70A to 70C of the outer frames 7 while being supported by the inner frame 6, and the respective processing units. The U LLM 3 is connected to the substrate transfer unit 20.

  When the carrier C containing the wafer W to be processed is placed on the load port 11 of the EFEM 101, the wafer W is taken out from the carrier C by the delivery mechanism 12 and transferred to the first substrate transfer mechanism 2. When a predetermined number of wafers W to be processed are accommodated in the first substrate transport mechanism 2, the first substrate is moved to a position where a processing unit U for forming a film on these wafers W is accommodated. The transport mechanism 2 is moved. Then, the opening surface of the housing constituting the first substrate transport mechanism 2 is directed to the processing unit U side, and the wafer W is transferred to and from the second substrate transport mechanism 33 in the LLM 3 in the processing unit U. The height position of the wafer W to be taken out is adjusted to a possible height.

On the other hand, on the processing unit U side, the gate valve G1 on the substrate transport unit 20 side is opened while the inside of the load lock chamber 32 is in a normal pressure atmosphere, and the joint arm of the second substrate transport mechanism 33 is extended to extend the first. The substrate is moved into the substrate transfer mechanism 2 and the fork of the joint arm is positioned below the wafer W to be received. Thereafter, the first substrate transport mechanism 2 is slightly lowered to receive the wafer W from the holding member in the first substrate transport mechanism 2 to the fork. Prior to the transfer operation of the wafer W, an operation of transferring the wafer W after film formation in the processing unit U to an empty wafer holder of the first substrate transfer mechanism 2 is performed. Also good.
The second substrate transfer mechanism 33 that has received the wafer W retracts the joint arm, closes the gate valve G1, and switches the inside of the load lock chamber 32 to a vacuum atmosphere.

  Next, the gate valves G2 and G3 on the first and second vacuum processing modules 4A and 4B that perform film formation on the wafer W are opened, and the wafer W is loaded into the vacuum vessel 40 to perform film formation. Regarding the method of using the first and second vacuum processing modules 4A and 4B provided in the processing unit U, for example, during the period in which film formation is performed in the vacuum processing modules 4A and 4B on one side, Cleaning may be performed by supplying a cleaning gas to the vacuum processing modules 4B and 4A. In addition, film formation on the wafer W may be performed in parallel in the first and second vacuum processing modules 4A and 4B.

The first substrate transfer mechanism 2 that has transferred the wafer W to the predetermined processing unit U is arranged with the processing unit U that forms a film on another wafer W accommodated in the first substrate transfer mechanism 2. The wafer W is sequentially transferred to the position and transferred. With this operation, film formation on the wafer W can be performed in parallel by the plurality of processing units U provided in the substrate processing apparatus.
When the film formation in the processing unit U is completed, the first substrate transport mechanism 2 is moved to receive the film-formed wafer W from the processing unit U. After that, when a predetermined number of wafers W after film formation are accommodated in the first substrate transport mechanism 2, the first substrate transport mechanism 2 is moved to the EFEM 101 side, and on the path opposite to the time of loading, The wafer W after film formation is returned to the original carrier C.

In the substrate processing apparatus in which film formation is performed on the wafer W based on the above-described procedure, for example, the vacuum container 40 is opened by the first and second vacuum processing modules 4A and 4B provided in one of the processing units U. Then, consider the case where maintenance is required.
In this case, the control unit is set so that the maintenance target processing unit U is removed from the transfer destination of the wafer W by the first substrate transfer mechanism 2, and the inside of the load lock chamber 32 of the LLM 3 is in a normal pressure state. In addition, the vacuum state of the vacuum containers 40 of the first and second vacuum processing modules 4A and 4B is released to a state where they can be opened. The substrate processing apparatus can continue processing the wafer W by using the processing unit U provided in another outer frame 7 that is not a maintenance target.

When a predetermined processing unit U is ready for maintenance, an operator prepares to open the vacuum container 40 for the processing unit U.
For example, the case of preparing for maintenance in the processing unit U housed in the middle housing space 70B will be described. First, the operator first branches the remote plasma branch connected to the first and second vacuum processing modules 4A and 4B. A part of the pipe 832 is removed. Next, as shown in FIG. 7, a mounting table 91 on which the inner frame 6 is mounted is provided at a position where the processing unit U is pulled out. The top plate provided on the upper surface side of the mounting table 91 is arranged so that a surface continuous with the shelf plate portion 72 on the outer frame 7 side is formed, and the shelf plate 72 side travels on the top plate surface. A groove-shaped traveling track (not shown) that is continuous with the track 74 is formed.

  Then, the unit side exhaust pipe 41 and the branch pipe 511, the unit side gas supply pipe 42 and the connection pipe 521 are disconnected, and the inner frame 6 (processing unit U) is raised using the jack portion 62. Next, the cam follower is unlocked, the cam follower is moved along the traveling path 74 of the top plate of the shelf 72 and the mounting table 91, and the inner frame 6 and the inner frame 6 are moved away from the substrate transfer unit 20. Pull out the supported processing unit U.

At this time, the first and second apparatus side exhaust pipes 51A and 51B arranged in the empty area R so as to penetrate the outer frame 7 in the vertical direction are left on the outer frame 7 side, and the processing unit U is moved to the outside. Pulled out.
Thereafter, the operator gets on a stepping platform (not shown) to open the vacuum containers 40 of the first and second vacuum processing modules 4A and 4B, and performs necessary maintenance.

  Further, in the case of the processing unit U accommodated in the lowermost accommodation space 70A, the operation on the processing unit U accommodated in the middle accommodation space 70B except that the processing unit U is moved to the floor in the processing block 102. It is the same.

  Further, with respect to the processing unit U accommodated in the uppermost accommodation space 70 </ b> C, the processing unit U is not arranged on the upper side of the processing unit U. Therefore, an operator on a step board or the like removes a part of the housing for housing the processing block 102 and a part of the remote plasma branch pipe 832, so that the first and second vacuum processing modules 4 </ b> A and 4 </ b> B are directly used. Can be accessed.

  Next, an operation of connecting the processing unit U drawn out from the accommodation spaces 70A and 70B to the substrate transport unit 20 will be described with reference to FIGS. 7 and 8 show examples of the processing unit U and the inner frame 6 accommodated in the middle accommodation space 70B, but the operation of the processing unit U and the inner frame 6 accommodated in the lowermost accommodation space 70A. Is the same.

As shown in FIG. 7, when the maintenance is completed for the processing unit U drawn out to the predetermined maintenance position separated from the substrate transport unit 20, the vacuum containers 40 of the first and second vacuum processing modules 4A and 4B are closed. Restore from the open state. Next, the cam follower is unlocked, the cam follower is moved along the traveling track 74 of the shelf 72, and the position where the LLM 3 is connected to the substrate transport unit 20, more specifically, the LLM 3 is connected to the substrate transport unit 20. The inner frame 6 is pushed back in the lateral direction to the disconnection position above the connection position.
After that, the inner frame 6 is lowered by the jack portion 62, the processing unit U is moved to the connection position, and the connection port portion 34 of the LLM 3 and the connection port portion 231 of the connection portion 23 are fitted to each other. It connects to the board | substrate conveyance part 20 (FIG. 8).

Further, along with the lowering operation from the disconnection position to the connection position, the leading end portion of the connection port portion 34 provided in the LLM 3 and the connection port portion 231 (not shown) provided on the connection portion 23 side are fitted, and the substrate The LLM 3 is connected to the transport unit 20.
When the processing unit U is connected to the substrate transfer unit 20, the unit side exhaust pipe 41 and the unit side gas supply pipe 42 provided on the processing unit U side are connected to the branch pipe 511 and the connection pipe provided on the outer frame 7 side. It is arranged at a position before being separated from 521. Therefore, the connecting members 410 and 510 of the unit side exhaust pipe 41 and the branch pipe 511 are fastened at the positions, and the unit side gas supply pipe 42 and the exhaust pipe (not shown) of the load lock chamber 32 and the connection pipe 521 are connected. By connecting the connecting members 420 and 520 and connecting the removed remote plasma branch pipe 832 to the first and second vacuum processing modules 4A and 4B, the processing unit U can start preparation for re-operation. It becomes a state.

  The substrate processing apparatus according to the embodiment described above has the following effects. With respect to the piping provided in the processing unit housing portion 7 in which a plurality of processing units U including the first and second vacuum processing modules 4A and 4B and the load lock module 3 are housed, the processing unit housing portion 7 is moved in the vertical direction. The first and second apparatus-side exhaust pipes 51A and 51B (first and second through pipes) disposed so as to penetrate through and the respective stages of the processing unit accommodating portion 7 (accommodating spaces 70A to 70C). The apparatus side gas supply pipe 52 and the remote plasma branch pipe 832 (transverse pipe) arranged so as to cross are arranged separately. With this configuration, access to various pipes (the first and second apparatus side exhaust pipes 51A and 51B, the apparatus side gas supply pipe 52, and the remote plasma branch pipe 832) that are distributed in the processing unit accommodating portion 7 is performed. Thus, a substrate processing apparatus with good maintainability can be configured.

  In the substrate processing apparatus, the first and second apparatus side exhaust pipes 51A and 51B are one of the pipes having the largest diameter. Therefore, the first and second apparatus-side exhaust pipes 51A and 51B are arranged on the left and right sides of the LLM 3 and between the first and second vacuum processing modules 4A and 4B and the substrate transport unit 20. By accommodating in the region R, the enlargement of the outer frame 7 can be suppressed.

  Here, in the outer frame 7 that accommodates a plurality of processing units U arranged in multiple stages in the vertical direction as shown in FIG. 3, all the processing units U accommodated in the outer frame 7 are supported by the inner frame 6. Is not an essential requirement. For example, the processing unit U accommodated in the uppermost accommodation space 70 </ b> C may be assembled directly to the outer frame 7.

  On the other hand, as already described, the inner frame 6 also supports the processing unit U arranged on the uppermost stage showing an example in which the maintenance of opening the vacuum vessel 40 that is pulled out from the accommodation space 70C in the lateral direction is not performed. It goes without saying that a technique may be selected, and a jack portion 62 that is a lifting mechanism, a slider portion 61 that is a moving mechanism, a cam follower, and the like may be provided and pulled out in the lateral direction. For example, when larger-scale maintenance is required, such as replacement of the first and second vacuum processing modules 4A and 4B and repair of the equipment in the LLM 3, it is necessary to pull out the processing unit U on the mounting table 91. There is also.

  Here, the inner frame 6 that supports the processing unit U is not necessarily provided with a permanent lifting mechanism (jack section 62) or a moving mechanism (slider section 61, cam follower (roller follower) or caster). For example, when it is necessary to move the processing unit U, an air caster is inserted below the inner frame 6, and the inner frame 6 is lifted by the air caster and separated from the substrate transport unit 20. Lateral movement may be performed.

  Furthermore, the number of accommodating stages of the processing units U in the outer frame 7 that accommodates the processing units U arranged in multiple stages in the vertical direction is not limited to three as in the examples shown in FIGS. For example, there may be two stages, or four or more stages. Also, the arrangement number of the outer frames 7 arranged on the side surface of the substrate transport unit 20 is not limited to three as in the example shown in FIG. 2, but two, or four or more. May be. In addition, for example, one outer frame 7 may be directly connected to the EEFM 101, for example. In this case, the EFEM 101 corresponds to the substrate transport unit, and the delivery mechanism 12 corresponds to the first substrate transport mechanism.

  The configuration of the substrate transfer unit 20 is not limited to the example shown in FIG. 2 in which a plurality of outer frames 7 are arranged on both sides of the elongated linear substrate transfer chamber 200 when viewed in plan. For example, the EFEM 101 may be connected to one surface of the substrate transport unit 20 having a polygonal planar shape, and the outer frame 7 may be radially connected to the other surface.

  In addition, the type of processing performed in the first and second vacuum processing modules 4A and 4B of the processing unit U provided in the substrate processing apparatus is not limited to film formation, and etching, ashing, annealing, etc. Of course, it may be.

R Empty area U Processing unit W Wafer 2 First substrate transport mechanism 20 Substrate transport unit 3 Load lock module (LLM)
32 Load lock chamber 33 Second substrate transport mechanism 34 Connection port portion 4A, 4B Vacuum processing module 40 Vacuum container 51A First apparatus side exhaust pipe 51B Second apparatus side exhaust pipe 52, 52A, 52B
Device side gas supply pipe 6 Inner frame 7 Outer frames 70A to 70C
Housing space 831 Remote plasma supply piping 832 Remote plasma branch piping

Claims (6)

In a substrate processing apparatus provided with a plurality of vacuum processing modules for processing a substrate in a vacuum atmosphere,
A substrate transport section provided with a first substrate transport mechanism for transporting a substrate in a normal pressure atmosphere;
A first vacuum processing module and a second vacuum processing module that are provided side by side in a horizontal direction when viewed from the substrate transport unit side, and the first and second vacuums are provided. A substrate is connected between the substrate transfer unit and each vacuum vessel in a load lock chamber that is connected to each vacuum vessel of the processing module and is configured to be able to switch an internal atmosphere between a normal pressure atmosphere and a vacuum atmosphere. A load lock module provided with a second substrate transport mechanism for transport, and a processing unit comprising:
Each of the load lock modules connected to the substrate transport unit, a processing unit storage unit that stores a plurality of the processing units arranged in multiple stages in the vertical direction,
The first vacuum processing modules of the plurality of processing units arranged in multiple stages are connected in common, and a first through pipe disposed so as to penetrate the processing unit housing portion in the vertical direction; A second through pipe connected to the second vacuum processing module of the processing unit in common, and arranged to penetrate the processing unit housing portion in the vertical direction;
A transverse pipe connected to the first and second vacuum processing modules in each processing unit and arranged to traverse each stage of the processing unit accommodating portion;
When the inside of the step of the processing unit accommodating portion is viewed from the upper surface side, the first through pipe is on the side of the load lock module, and is between the substrate transfer portion and the first vacuum processing module. The second through pipe is disposed on a side of the load lock module and in a region between the substrate transfer unit and the second vacuum processing module. Substrate processing apparatus.   2. The substrate processing apparatus according to claim 1, further comprising a plurality of processing unit housing portions that house the plurality of processing units and are arranged side by side in the horizontal direction.   The processing unit accommodated in the processing unit accommodating portion is laterally moved in a direction in which the load lock module is separated from the substrate transfer portion, leaving the first and second through pipes on the processing unit accommodating portion side. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is configured to be movable.   The processing unit configured to be movable in the lateral direction is supported by a processing unit support portion accommodated in the processing unit housing portion together with the processing unit, and the processing unit is moved to the processing unit during the lateral movement. The substrate processing apparatus according to claim 3, wherein the substrate processing apparatus moves while being supported by the support portion.   The processing unit housed in the processing unit housing section moves the processing unit up to a disconnection position above a connection position where the load lock module is connected to the substrate transport section, thereby removing the processing unit from the substrate transport section. The substrate processing apparatus according to claim 1, wherein the load lock module is separated. One end part is connected to the vacuum processing module or the load lock module, and the other end part is opened on the processing unit side piping part on the processing unit side,
An apparatus-side piping section on the processing unit housing section side provided with an opening end connected to the processing unit-side piping section,
The other end of the processing unit side piping section and the opening end of the apparatus side piping section are connected to each other along with the operation of lowering the processing unit from the separation position to the connection position and connecting to the substrate transport section. A connecting member is provided,
The substrate processing apparatus according to claim 5, wherein the apparatus-side piping section is at least one of the first and second through pipes or the transverse pipe.