JP2018093087A - Substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of arranging multiple vacuum processing modules, while maintaining ease of handling of a load lock module and a vacuum processing module.SOLUTION: A substrate processing apparatus includes vacuum processing modules 4A, 4B for processing a substrate W under vacuum atmosphere, where the first substrate transport mechanism 2 of a substrate transport section 20 transports the substrate W under normal pressure atmosphere. A processing unit support section 6 supports a processing unit U including multiple vacuum processing modules 4A, 4B, the substrate transport section 20, and a load lock module 3 provided with a second substrate transport mechanism 33 for transporting the substrate W between respective vacuum processing modules 4A, 4B, and in a state where the load lock module 3 is connected with the substrate transport section 20, a processing unit housing section 7 houses multiple processing units U, supported by the processing unit support section 6, while arranging vertically in multistep.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a technique for installing a processing unit including a load lock module and a vacuum processing module in a substrate processing apparatus.

  In the semiconductor manufacturing process, vacuum processing such as film formation, etching, ashing, and annealing is performed on a semiconductor wafer (hereinafter referred to as “wafer”). In order to perform vacuum processing at high throughput, a vacuum transfer chamber with a polygonal shape in plan view is connected to an EFEM (Equipment Front End Module) via a load lock module, and a vacuum processing module is connected to each side wall of the vacuum transfer chamber A substrate processing apparatus called a multi-chamber system is known.

  On the other hand, recently, due to diversification of semiconductor devices, vacuum processing that requires a long time to complete processing may be required. For example, when forming a NAND circuit which is a three-dimensional memory, an oxide layer and a nitride layer are alternately stacked many times, so that a very long time is required for one film formation process. For this reason, in order to increase the throughput, it is desired to construct a technique for increasing the number of vacuum processing modules provided in the substrate processing apparatus.

  Here, in Patent Document 1, in order to arrange a plurality of processing chambers in which heat treatment, cooling processing, and the like for a substrate are stacked in a vertical direction, a processing apparatus capable of accommodating these processing chambers in multiple stages. A substrate processing apparatus having a frame (first support structure) is described.

  However, in a substrate processing apparatus that performs vacuum processing on a substrate, substrate processing can be performed by combining a load lock module that can freely switch an internal atmosphere between a vacuum atmosphere and a normal pressure atmosphere, and a vacuum processing module. Done. In this regard, even if the vacuum processing modules are stacked and arranged on each stage of the processing apparatus frame described in Patent Document 1, it is not clear where and how the load lock module is preferably arranged, and the vacuum processing on the substrate is not clear. It is impossible to construct a substrate processing apparatus capable of performing the above.

Japanese Patent Laying-Open No. 2006-210767: claim 1, paragraphs 0002 and 0017, FIG.

  The present invention has been made under such circumstances, and an object of the present invention is to process a substrate capable of arranging a plurality of vacuum processing modules while maintaining ease of handling of a load lock module and a vacuum processing module. To provide an apparatus.

The substrate processing apparatus of the present invention is a substrate processing apparatus including a vacuum processing module that processes a substrate in a vacuum atmosphere.
A substrate transport section provided with a first substrate transport mechanism for transporting a substrate in a normal pressure atmosphere;
A vacuum processing module having a vacuum vessel for processing a substrate, and a load lock chamber connected to the vacuum vessel of the vacuum processing module and configured to freely switch an internal atmosphere between a normal pressure atmosphere and a vacuum atmosphere, A load lock module provided with a second substrate transport mechanism for transporting the substrate between the substrate transport unit and the vacuum container; and a processing unit comprising:
A processing unit support for supporting the processing unit;
And a processing unit storage unit that stores a plurality of processing units supported by the processing unit support unit in multiple stages in the vertical direction in a state where the load lock module is connected to the substrate transfer unit. It is characterized by.

  In the present invention, a set of processing units is constituted by a vacuum processing module and a load lock module connected to the vacuum processing module, and the processing unit is supported by the processing unit support portion, and the processing unit is accommodated in the processing unit housing portion. A plurality of processing units are accommodated in multiple stages in the vertical direction. With this configuration, it is possible to move the vacuum processing module and the load lock module, which are used in combination with each other, by moving the processing unit support portion, and handling during maintenance is facilitated.

1 is an external perspective view of a substrate processing apparatus according to an embodiment of the present invention. It is a cross-sectional plan view of the substrate processing apparatus. It is a side view of the outer frame provided in the substrate processing apparatus. It is an external appearance perspective view of the said outer frame. It is a perspective view which shows the state in which the processing unit was integrated in the said outer frame. It is a perspective view which shows the method of incorporating a processing unit in the said outer frame. It is a side view which shows the method of accessing the processing unit of the 1st step. It is a side view which shows the method of accessing the processing unit of a 2nd step. It is a side view which shows the method of accessing the processing unit of a 3rd step. It is the 1st operation view showing the state where the processing unit was pulled out. It is the 2nd operation figure showing the state where the processing unit was connected. It is explanatory drawing which shows the processing unit before positioning. It is explanatory drawing which shows the processing unit positioned. It is a perspective view which shows the structure of the connection part of a processing unit and an atmospheric conveyance block. It is explanatory drawing which shows the other positioning method.

  Hereinafter, the configuration of the substrate processing apparatus according to the embodiment of the present invention will be described with reference to FIGS. As shown in the external perspective view of FIG. 1, the substrate processing apparatus of this example is connected to the EFEM 101 for taking out the wafer W from the carrier C which is a transfer container containing a plurality of wafers W, and is connected to the EFEM 101. And a processing block 102 for performing the above process.

  For example, the EFEM 101 is a load that is a container mounting unit configured such that four carriers C, which are FOUPs (Front Opening Unified Pod), are mounted in the left-right direction (X direction in FIG. 1) when viewed from the front. A port 11 is provided. As shown in FIG. 2, a support portion 10 that supports the carrier C in a state where the bottom surface of the carrier C is positioned is provided on the mounting surface of the carrier C in the load port 11. On the far side of the load port 11, a transfer chamber 13 including a transfer mechanism 12 that transfers a wafer to the carrier C is provided. A fan filter unit (not shown) is provided on the upper surface side of the transfer chamber 13, and the inside of the transfer chamber 13 is, for example, a space of clean air atmosphere at normal pressure. On the side wall surface of the transfer chamber 13 on the side of the load port 11 is provided with a detaching mechanism for detaching a lid provided on the side surface of the carrier C, and an opening / closing door for opening and closing an opening for loading and unloading the wafer W. 14 is provided.

  The delivery mechanism 12 has a structure in which a telescopic joint arm is vertically movable and rotatable on a base body (not shown) that is movable along a traveling rail 15 that extends in the left-right direction when viewed from the load port 11 side. Yes. When the lid of the carrier C is removed by the opening / closing door 14 and the opening is opened, the transfer mechanism 12 enters the carrier C and the wafer W is taken out.

  When viewed from the load port 11, a transfer port (not shown) through which the transfer mechanism 12 passes while holding the wafer W is formed on the back side of the transfer chamber 13. During the period when the wafer W is not delivered by the delivery mechanism 12, the delivery port may be closed by a shutter (not shown) to partition the atmosphere between the EFEM 101 and the processing block 102.

  As shown in FIG. 2, the processing block 102 includes a substrate transfer unit 20 to which the wafer W delivered from the EFEM 101 side is transferred, and an outer frame 7 that houses a plurality of processing units U connected to the substrate transfer unit 20. With. The substrate transfer unit 20 and the outer frame 7 are accommodated in, for example, a housing (FIG. 1).

  As shown in FIG. 2, the substrate transfer unit 20 includes an elongated substrate transfer chamber 200 extending in the front-rear direction when viewed from the EFEM 101. The substrate transfer chamber 200 can connect the processing units U (more specifically, the load lock module 3 in the processing unit U) accommodated in multiple stages in an outer frame 7 described later to the substrate transfer chamber 200. Has a height. A fan filter unit (not shown) is provided on the upper surface side of the substrate transfer chamber 200, and the inside of the substrate transfer chamber 200 is, for example, a space of clean air atmosphere at normal pressure.

  A traveling rail 21 that is a moving path extending in the front-rear direction is provided at the bottom of the substrate transfer chamber 200. Further, a support column 22 configured to be movable in the front-rear direction while being guided by the traveling rail 21 is provided in the substrate transfer chamber 200, and a side surface on the EFEM 101 side of the support column 22 extends along the support column 22. A first substrate transport mechanism 2 configured to be movable up and down is provided.

  In this example, the first substrate transport mechanism 2 has a structure in which, for example, wafer holding portions (not shown) that hold the wafers W one by one are provided in multiple stages in a housing that is open on the entire surface. The first substrate transport mechanism 2 is supported by the support column 22 via a rotation driving unit (not shown) that rotates the casing around the vertical axis. With this configuration, the first substrate transport mechanism 2 can direct the opening surface of the housing to the EFEM 101 side and the left and right side surfaces of the substrate transport chamber 200 in which the outer frame 7 is provided.

  Note that it is not an essential requirement to configure the first substrate transport mechanism 2 by a housing that can accommodate the wafers W in multiple stages. For example, one or a plurality of articulated arms that can be expanded and contracted and rotated may be provided so as to be movable along the traveling rail 21 and ascendable and descendable along the column 22. In this case, a shelf-like wafer placement unit for temporarily placing the wafer W to be delivered may be provided between the EFEM 101 and the substrate transfer unit 20.

A plurality of (three in this example) outer frames 7 are disposed on the left and right sides of the substrate transport unit 20 as viewed from the EFEM 101 side.
Hereinafter, the structure and operation of the outer frame 7 and the processing unit U will be described with reference to FIGS. 3 to 15. In these drawings, when the side wall surface of the substrate transport unit 20 is viewed from the outer frame 7, the substrate The sub-coordinate axes in which the direction approaching the transport unit 20 is the positive direction of the X ′ axis, the right hand side when viewed from the outer frame 7 is the positive direction of the Y ′ axis, and the upper side of the vertical direction is the positive direction of the Z ′ axis are also shown. .

  As shown in FIGS. 3 and 4, the outer frame 7 has a shelf structure in which, for example, two shelf plates 72 are provided at intervals in the vertical direction on a frame body having a framework structure. In the outer frame 7, the space between the floor surface in the processing block 102 and the lower shelf part 72, the space between the lower shelf part 72 and the upper shelf part 72, and the upper part Spaces above the shelf 72 are storage spaces 70A to 70C for storing the processing unit U, respectively.

  The configuration of the processing unit U accommodated in these accommodating spaces 70A to 70C will be described. Each processing unit U includes a load lock module (LLM) 3 and a plurality of, for example, two vacuum processing modules 4A and 4B, through which the wafer W is transferred between the first substrate transfer mechanism 2 via the LLM 3. Is provided.

As shown in FIGS. 2 and 6, the LLM 3 has a structure in which a second substrate transport mechanism 33 is provided in a load lock chamber 32 having a pentagonal plan shape. A connection port portion 34 is provided on one side surface of the load lock chamber 32, and a gate valve G <b> 1 for opening and closing the loading / unloading port 31 through which the wafer W is loaded and unloaded is provided inside the connection port portion 34. . On the other hand, a connecting part 23 is provided on the side wall surface of the substrate transport part 20, and the connecting port part 34 on the LLM 3 side is connected to the connecting part 23. Detailed configurations of the connection port portion 34 and the connection portion 23 and their connection methods will be described in detail later.
For convenience of illustration, in FIG. 2, the description of the connection port portion 34 of the LLM 3 and the connection portion 23 of the substrate transport unit 20 is omitted.

  On the other hand, when viewed from the connection surface with the substrate transport unit 20, on the two surfaces located on the back side of the load lock chamber 32, loading / unloading ports 35 that can be opened and closed by gate valves G2 and G3 are provided. And the vacuum vessel 40 which comprises vacuum processing module 4A, 4B is airtightly connected to the side wall surface of the board | substrate conveyance part 20 in which these entrance / exit 35 was provided.

An exhaust pipe (not shown) is connected to the load lock chamber 32, and the inside of the load lock chamber 32 is evacuated through the exhaust pipe, so that an atmospheric pressure atmosphere (normal pressure atmosphere) and a vacuum atmosphere are interposed. The internal atmosphere can be switched with.
The second substrate transport mechanism 33 provided in the load lock chamber 32 is constituted by, for example, a joint arm configured to be extendable and rotatable about a vertical axis, and has moved to the front of the connection position of the LLM 3. The wafer W is transferred between the first substrate transfer mechanism 2 and the vacuum processing modules 4A and 4B.

  The vacuum containers 40 constituting the vacuum processing modules 4A and 4B perform, for example, film formation that is vacuum processing on the wafer W. The vacuum vessel 40 has a mounting table on which a wafer W to be processed is placed, a processing gas supply unit that supplies a processing gas for film formation into the vacuum vessel 40, and a cleaning device for cleaning the inside of the vacuum vessel 40. A cleaning gas supply unit for supplying a cleaning gas, a plasma generation mechanism for converting the processing gas into plasma when performing film formation using plasma, and the like (not shown) are provided.

  In the processing unit U having the above-described configuration, as shown in FIG. 6, the LLM 3 and the vacuum processing modules 4 </ b> A and 4 </ b> B are supported from the lower surface side, for example, by an inner frame 6 configured as a frame of a framework structure. In the space inside the inner frame 6 (below the processing unit U), a driving mechanism for driving the second substrate transport mechanism 33 in the LLM 3 and a vacuum container 40 of the vacuum processing modules 4A and 4B are provided. Various accessory devices such as a transfer mechanism for transferring the wafer W between the mounting table and the second substrate transfer mechanism 33 on the LLM 3 side are accommodated, but individual illustrations and descriptions thereof are omitted.

2, 3, 5 and the like, the processing unit U is accommodated in the accommodating spaces 70A to 70C in the outer frame 7 while being supported by the inner frame 6, and the LLM 3 of each processing unit U is a substrate. Connected to the transport unit 20. As a result, in the substrate processing apparatus of this example, a total of 18 processing units U accommodated in the six outer frames 7 are connected to the substrate transport unit 20, and 36 vacuum processing modules 4A and 4B are used. Film formation on the wafer W can be performed.
For convenience of illustration, in FIG. 2, the outer frame 7 and the inner frame 6 are simplified and only the frame lines are displayed.

  As shown in FIG. 2, when viewed from the outer frame 7 toward the substrate transfer unit 20, various processes for film formation are performed on the vacuum processing modules 4 </ b> A and 4 </ b> B of each processing unit U on, for example, the left hand side of the outer frame 7. A gas box 81 is provided for supplying gas, a purge gas for discharging unnecessary processing gas, and the like. Further, a power supply box 82 for supplying electric power to various driving devices and plasma generation mechanisms provided in the LLM 3 and the vacuum processing modules 4A and 4B is provided behind the gas box 81 as viewed from the substrate transfer unit 20 side. It has been.

  In the substrate processing apparatus of this example, the gas box 81 and the power supply box 82 are provided in common to a plurality of processing units U (three processing units U in this example) housed in multiple stages in each outer frame 7. ing. As shown in FIG. 2, the gas box 81 and the power supply box 82 are arranged on the side of each outer frame 7 provided in the processing block 102. At this time, as shown in FIG. 2, the arrangement positions of the gas box 81 and the power supply box 82 viewed from the outer frame 7 may be made common. Thereby, supply pipes for processing gas and the like supplied from the gas box 81 to the vacuum processing modules 4A and 4B, and configurations and arrangement paths of power supply lines supplied from the power supply box 82 to the LLM 3 and the vacuum processing modules 4A and 4B Can be shared by all the processing units U.

  In this way, the layout of the outer frames 7, the gas box 81, the power supply box 82, the LLM 3 in the processing unit U, and the layout of the vacuum processing modules 4A and 4B are made common so that the LLM 3 having a common configuration, The substrate processing apparatus can be configured using the vacuum processing modules 4A and 4B, the outer frame 7 and the inner frame 6.

In order to satisfy this requirement, as shown in FIG. 2, the substrate processing apparatus of the present example includes an outer frame 7 arranged three by three with the substrate transport unit 20 interposed therebetween, a gas box 81 attached thereto, and a power supply box 82. Is arranged in a rotationally symmetrical manner across the substrate transport unit 20.
Here, in addition to the gas box 81 and the power supply box 82 described above, the vacuum container 40 of each vacuum processing module 4A, 43B is disposed above the processing unit U stored in the uppermost storage space 70C of the outer frame 7. Although a cleaning gas supply unit for dry cleaning the inside is provided, the cleaning gas supply unit is not shown in this example.

  Further, as shown in FIGS. 6, 10, 12, and the like, a slider portion 61 that supports the inner frame 6 and the processing unit U from the lower surface side is provided on the lower surface side of the inner frame 6. The slider portion 61 of this example is formed of a long and thin plate-like member, and is spaced apart from each other along a direction (X ′ direction) intersecting the alignment direction (Y ′ direction) of the vacuum processing modules 4A and 4B. The book is provided.

As shown in FIGS. 6 to 8, 12, etc., in the processing unit U accommodated in each of the accommodation spaces 70 </ b> A to 70 </ b> C, a plurality of sets of cam followers are provided on the lower surface side of the slider portion 61 along the extending direction of the slider portion 61. 63 (which may be a roller follower) is provided. These cam followers 63 are formed on a groove-like traveling track 74 formed on the shelf plate portion 72 on the outer frame 7 side so as to extend in a direction perpendicular to the side wall surface of the substrate transport unit 20 (direction X ′ in FIG. 6). It functions to move the inner frame 6 along. In these inner frames 6, the slider portion 61 and the cam follower 63 correspond to a moving mechanism that moves the processing unit U. Further, instead of the cam follower (roller follower) 63, the slider portion 61 may be provided with a caster to constitute a moving mechanism. In addition, description of the traveling track | truck 74 is abbreviate | omitted except FIGS.
Furthermore, between each cam follower 63 and the slider part 61, the jack part 62 which is an raising / lowering mechanism for raising / lowering the inner frame 6 is interposed.

  With the above-described configuration, the cam follower 63 moves along the traveling track 74 in the accommodation spaces 70A to 70C, whereby the processing units U (LLM3 and vacuum processing) supported by the inner frame 6 in the respective accommodation spaces 70A to 70C. The modules 4A, 4B) can be moved laterally as a unit.

Furthermore, the processing unit U of this example uses a unit-side exhaust pipe 41 for evacuating the inside of the vacuum vessel 40 by using the horizontal movement and the lifting operation using the moving mechanism and the lifting mechanism described above, A unit-side gas supply pipe 42 for supplying a processing gas or the like to the vacuum vessel 40 can be easily connected to an apparatus-side exhaust pipe 51 or an apparatus-side gas supply pipe 52 disposed on the outer frame 7 side. It has a simple configuration.
For convenience of illustration, the unit side exhaust pipe 41, the unit side gas supply pipe 42, the apparatus side exhaust pipe 51, the apparatus side gas supply pipe 52, and the like described below are diagrams other than FIGS. The description is omitted as appropriate.

  In particular, as shown in FIG. 2, main units of the processing unit U (LLM3 and vacuum processing modules 4A and 4B) are arranged in front of the vacuum processing modules 4A and 4B and on the left and right sides of the LLM3. It is not free space. Therefore, in the substrate processing apparatus of this example, using this empty area, the unit side exhaust pipe 41 and the unit side gas supply pipe 42 which are the processing unit side piping part are connected to the apparatus side exhaust pipe 51 which is the apparatus side piping part, It connects with respect to the apparatus side gas supply pipe | tube 52. FIG.

  As shown in FIGS. 2, 4, 10, and the like, the outer frame 7 penetrates the left and right corner areas (the above-described “empty area”) in the vertical direction toward the substrate transport unit 20 in the vertical direction. One apparatus-side exhaust pipe 51 for vacuum exhaust is arranged one by one. The upper end of each device-side exhaust pipe 51 extends to the accommodation space 70C and is then sealed with a flange lid. Each apparatus-side exhaust pipe 51 passes through the outer frame 7 in the vertical direction through the opening 721 formed in the empty area of the shelf 72, and its lower end is, for example, the lower side of the floor surface of the processing block 102 And connected to the vacuum exhaust line of factory power.

From each apparatus side exhaust pipe 51, branch pipes 511 branch at predetermined height positions in the accommodation spaces 70A to 70C, and the ends of these branch pipes 511 constitute open end portions that open toward the upper surface. In addition, a flange-like connecting member 510 is provided at the opening end.
The branch pipe 511 is provided with a butterfly valve for controlling the pressure in the vacuum vessel 40, but is not shown in this example.

  On the other hand, as shown in FIGS. 2, 10 and the like, a unit side exhaust pipe 41 for evacuating the vacuum vessel 40 is connected to the lower surface side of each vacuum processing module 4A, 4B. The knit side exhaust pipe 41 whose one end is connected to the vacuum vessel 40 extends toward the front side, and the other end has the processing unit U disposed at a connection position where the LLM 3 and the substrate transport unit 20 are connected. At this time, it opens at a position communicating with the opening of the branch pipe 511. A flange-shaped connecting member 410 is also provided at the end of the unit-side exhaust pipe 41.

When the end portion of the unit side exhaust pipe 41 and the end portion of the branch pipe 511 are connected, the opposing surfaces of the flange-like connecting member 510 and the connecting member 410 are airtightly connected via an O-ring (not shown), Furthermore, the connected state can be fixed using a clamping mechanism (not shown). In addition, it is good also as a structure which fastens the connection member 510 and the connection member 410 using a screw etc. not only when using a clamp mechanism.
The connecting member 510 provided in the branch pipe 511 branched from the apparatus-side exhaust pipe 51 on one side is provided at the end of the exhaust pipe (not shown) provided in the load lock chamber 32. An opening connected to a flange-shaped connecting portion (not shown) is formed.

Next, the configuration of a gas supply pipe (device-side gas supply pipe 52, unit-side gas supply pipe 42) will be described. The number of gas supply pipes varies depending on the number of types of gas used for film formation and whether or not purge gas is used. For convenience of illustration, in FIGS. Only one or two pipes are displayed.
As shown in FIGS. 2, 4, 10, and the like, from the gas box 81 arranged adjacent to the outer frame 7, gas supply device-side gas supply pipes are provided at the height positions of the storage spaces 70 </ b> A to 70 </ b> C. 52 (52A, 52B) are extended toward the respective accommodation spaces 70A to 70C by two sets. One set of apparatus-side gas supply pipes 52B extends along the side surface of the outer frame 7 to the front side of the vacuum processing module 4B and to the side position of the LLM 3 (one side of the aforementioned “empty area”). ing.

  The other set of apparatus-side gas supply pipes 52A extends outward toward the substrate transfer section 20 in the opposite direction to the apparatus-side gas supply pipe 52B described above, and then is an outer surface facing the substrate transfer section 20. The drawing direction is changed to the lower side on the front surface of the frame 7 and is drawn to the side surface of the outer frame 7 opposite to the arrangement surface of the gas box 81 so as to bypass the connection portion between the substrate transport unit 20 and the LLM 3. Yes. Further, the apparatus-side gas supply pipe 52A changes the extending direction upward, and then at the same height as the apparatus-side gas supply pipe 52B described above, along the side surface of the outer frame 7, the front side of the vacuum processing module 4A. And it is extended to the side position of LLM3 (the other side of the above-mentioned “empty area”).

  As shown in FIGS. 10 and 11, the apparatus side gas supply pipe 52 (an example of the apparatus side gas supply pipe 52B is shown in FIGS. 10 and 11) arranged at the side position of the LLM 3 is further processed. The connecting pipe 521 is extended toward the inner region of the outer frame 7 (accommodating spaces 70A to 70C) in which the unit U is arranged. And the terminal part of each connection pipe | tube 521 is provided with the block-shaped connection member 520 to which these connection pipe | tubes 521 are connected in common, The flow path corresponding to each connection pipe | tube 521 is in the said connection pipe | tube 521. It is formed and opens toward the upper surface (opening end portion of the apparatus-side gas supply pipe 52B).

  On the other hand, as shown in FIGS. 2, 10 and the like, a plurality of unit side gas supply pipes 42 for supplying a processing gas and the like to the vacuum vessel 40 are connected to the upper surface side of each vacuum processing module 4A, 4B. Yes. Each unit-side gas supply pipe 42 whose one end is connected to the vacuum processing modules 4A and 4B extends toward the front side, and is connected to a common connecting member 420 having a block shape at the other end. . A flow path corresponding to each unit-side gas supply pipe 42 is formed in the connection member 420 and opens toward the lower surface. The connecting member 420 is arranged at a position where the connecting member 520 is connected when the processing unit U is arranged at a connecting position where the LLM 3 and the substrate transport unit 20 are connected.

  The connecting member 520 on the apparatus side gas supply pipe 52 side and the connecting member 420 on the unit side gas supply pipe 42 side are airtightly connected via an O-ring (not shown) or the like. Further, these connecting members 520 and 420 may be connected using screws or the like, or may be a socket structure that can be easily connected and removed.

  As described above, using the moving operation of the processing unit U, the processing unit side piping section (unit side exhaust pipe 41, unit side gas supply pipe 42) on the vacuum processing modules 4A and 4B side, and the outer frame 7 side When connecting the apparatus side piping section (the apparatus side exhaust pipe 51 and the apparatus side gas supply pipe 52), it is necessary to arrange the processing unit U at an accurate position. In this regard, with respect to the arrangement in the front-rear direction (X ′ direction shown in FIGS. 10 and 11) when viewed from the substrate transport unit 20 side, accurate positioning can be performed with the connection of the LLM 3 to the connecting unit 23.

  On the other hand, regarding the positioning in the left-right direction (Y ′ direction shown in FIGS. 12 and 13) when viewed from the substrate transport unit 20 side, there is a possibility that the connection of the LLM 3 to the connecting unit 23 is not sufficient. Therefore, the outer frame 7 and the inner frame 6 of this example are provided with the left and right positioning members (the guide member 73 and the guided member 64).

  As shown in FIGS. 12 and 13, frames that face each other when the processing unit U is inserted up to the connection position with the substrate transport unit 20 on both side surfaces of the frame constituting the outer frame 7 and the inner frame 6. The body members are provided on both the left and right sides when viewed from the substrate transfer unit 20. Then, on the inner side surfaces of both frame members on the outer frame 7 side, when the inner frame 6 is lowered by the jack portion 62 and the LLM 3 is connected to the connecting portion 23, the position of the inner frame 6 in the left-right direction is guided. A guide member 73 having a tapered guide surface is disposed. On the other hand, also on the inner frame 6 side, on the outer surfaces of both opposing members facing the outer frame 7 side, there are provided tapered guided surfaces guided by the guide member 73 when the inner frame 6 is lowered. The guided member 64 is arranged.

Next, the configuration of the connection part on the LLM3 side connected to the substrate transport unit 20 (the coupling unit 23) will be described.
As shown in FIGS. 12 and 14 and the like, a connecting port portion 34 is provided at the front end portion of the LLM 3 connected to the substrate transport portion 20 so as to surround the periphery of the gate valve G1. For example, the connection port portion 34 is configured as a cylindrical member having an inclined edge portion having a shorter upper side than the lower side and inclined on both sides, and having an isosceles trapezoidal shape when viewed from the front.

  On the other hand, on the connecting part 23 side, a connecting port part 231 made of a frame body having an isosceles trapezoidal shape in front view is provided corresponding to the connecting port part 34 on the LLM 3 side. In addition, the loading / unloading port for the wafer W is opened. Specifically, the connection port portion 231 is formed with a step so as to fit inside the upper side and the inclined edge portion of the connection port portion 34. Further, the member on the lower side of the connection port portion 231 protrudes toward the connection port portion 34 so that the member on the lower side of the connection port portion 34 can be placed on the upper surface thereof.

  In addition, the substrate processing apparatus of this example is provided with a control unit (not shown). For example, the control unit includes a computer including a CPU (Central Processing Unit) and a storage unit, and the storage unit includes the contents of film formation performed in the vacuum processing modules 4A and 4B of each processing unit U and the first substrate. A program in which a group of steps (commands) for controlling the transfer order of the wafer W by the transfer mechanism 2 is recorded. This program is stored in a storage medium such as a hard disk, a compact disk, a magnetic optical disk, or a memory card, and installed in the computer therefrom.

The operation of the substrate processing apparatus having the configuration described above will be described.
As shown in FIG. 3 and the like, during normal operation of the substrate processing apparatus, the processing unit U is accommodated in the accommodating spaces 70A to 70C of the outer frames 7 while being supported by the inner frame 6, and the respective processing units. The U LLM 3 is connected to the substrate transfer unit 20.

  When the carrier C containing the wafer W to be processed is placed on the load port 11 of the EFEM 101, the wafer W is taken out from the carrier C by the delivery mechanism 12 and transferred to the first substrate transfer mechanism 2. When a predetermined number of wafers W to be processed are accommodated in the first substrate transport mechanism 2, the first substrate is moved to a position where a processing unit U for forming a film on these wafers W is accommodated. The transport mechanism 2 is moved. Then, the opening surface of the housing constituting the first substrate transport mechanism 2 is directed to the processing unit U side, and the wafer W is transferred to and from the second substrate transport mechanism 33 in the LLM 3 in the processing unit U. The height position of the wafer W to be taken out is adjusted to a possible height.

On the other hand, on the processing unit U side, the gate valve G1 on the substrate transport unit 20 side is opened while the inside of the load lock chamber 32 is in a normal pressure atmosphere, and the joint arm of the second substrate transport mechanism 33 is extended to extend the first. The substrate is moved into the substrate transfer mechanism 2 and the fork of the joint arm is positioned below the wafer W to be received. Thereafter, the first substrate transport mechanism 2 is slightly lowered to receive the wafer W from the holding member in the first substrate transport mechanism 2 to the fork. Prior to the transfer operation of the wafer W, an operation of transferring the wafer W after film formation in the processing unit U to an empty wafer holder of the first substrate transfer mechanism 2 is performed. Also good.
The second substrate transfer mechanism 33 that has received the wafer W retracts the joint arm, closes the gate valve G1, and switches the inside of the load lock chamber 32 to a vacuum atmosphere.

  Next, the gate valves G2 and G3 on the vacuum processing modules 4A and 4B that perform film formation on the wafer W are opened, and the wafer W is loaded into the vacuum container 40 to perform film formation. Regarding how to use the two vacuum processing modules 4A and 4B provided in the processing unit U, for example, during the period in which film formation is performed in the vacuum processing modules 4A and 4B on one side, the vacuum processing module 4B on the other side. Cleaning may be performed by supplying a cleaning gas to 4A. Further, film formation on the wafer W may be performed in parallel by the vacuum processing modules 4A and 4B.

The first substrate transfer mechanism 2 that has transferred the wafer W to the predetermined processing unit U is arranged with the processing unit U that forms a film on another wafer W accommodated in the first substrate transfer mechanism 2. The wafer W is sequentially transferred to the position and transferred. With this operation, film formation on the wafer W can be performed in parallel by the plurality of processing units U provided in the substrate processing apparatus.
When the film formation in the processing unit U is completed, the first substrate transport mechanism 2 is moved to receive the film-formed wafer W from the processing unit U. After that, when a predetermined number of wafers W after film formation are accommodated in the first substrate transport mechanism 2, the first substrate transport mechanism 2 is moved to the EFEM 101 side, and on the path opposite to the time of loading, The wafer W after film formation is returned to the original carrier C.

In the substrate processing apparatus in which film formation is performed on the wafer W based on the above-described procedure, for example, it is necessary to perform maintenance by opening the vacuum container 40 in the vacuum processing modules 4A and 4B provided in any of the processing units U. Suppose that occurs.
In this case, the control unit is set so that the maintenance target processing unit U is removed from the transfer destination of the wafer W by the first substrate transfer mechanism 2, and the inside of the load lock chamber 32 of the LLM 3 is in a normal pressure state. In addition, the vacuum state of the vacuum container 40 of the vacuum processing modules 4A and 4B is released to a state where the vacuum state can be opened. The substrate processing apparatus can continue processing the wafer W by using the processing unit U provided in another outer frame 7 that is not a maintenance target.

  When the predetermined processing unit U is ready for maintenance, the operator P prepares to open the vacuum vessel 40 for the processing unit U. At this time, the content of preparation of the substrate processing apparatus of this example differs depending on the positions of the accommodation spaces 70A to 70C in which the processing unit U is accommodated.

  First, for the processing unit U housed in the lowermost housing space 70A, for example, a cleaning gas supply pipe (not shown) provided on the upper surface side of the vacuum processing modules 4A and 4B is removed. Further, the connection members 410 and 510 between the unit side exhaust pipe 41 and the exhaust pipe (not shown) of the load lock chamber 32 and the branch pipe 511 are released, and further, the unit side gas supply pipe 42 and the connection pipe 521 are connected. The fastening of 420 and 520 is released. After that, the inner frame 6 (processing unit U) is raised using the jack portion 62, and the unit side exhaust pipe 41 and the branch pipe 511, and the unit side gas supply pipe 42 and the connection pipe 521 are cut off. Next, the cam follower 63 is unlocked, and the inner frame 6 and the process supported by the inner frame 6 in the direction away from the substrate transport unit 20 along the traveling track 74 provided on the floor surface in the processing block 102. Pull out unit U. As a result of the above operation, the vacuum containers 40 of the vacuum processing modules 4A and 4B can be opened as shown in FIG. 7, and necessary maintenance is performed by the operator P.

  Next, with respect to the processing unit U accommodated in the middle accommodation space 70B, a mounting table 91 on which the inner frame 6 is mounted is provided at a position where the processing unit U is pulled out. The top plate provided on the upper surface side of the mounting table 91 is arranged so that a surface continuous with the shelf plate portion 72 on the outer frame 7 side is formed, and the shelf plate 72 side travels on the top plate surface. A groove-shaped traveling track (not shown) that is continuous with the track 74 is formed.

  As in the case of the lowermost processing unit U, the cleaning gas supply pipe is removed, and the unit side exhaust pipe 41 and the branch pipe 511 are disconnected, and the unit side gas supply pipe 42 and the connection pipe 521 are disconnected. The inner frame 6 (processing unit U) is raised using the part 62. Next, the cam follower 63 is unlocked, and the cam follower 63 is moved along the traveling track 74 of the top plate of the shelf plate portion 72 and the mounting table 91 to move away from the substrate transport unit 20. The processing unit U supported by 6 is pulled out. As shown in FIG. 8, the worker P gets on the step 92A with the handrail 921 and opens the vacuum containers 40 of the vacuum processing modules 4A and 4B to perform necessary maintenance.

  Finally, for the processing unit U accommodated in the uppermost accommodation space 70C, since the processing unit U is not arranged on the upper side of the processing unit U, a part of the housing that accommodates the processing block 102, By removing the cleaning gas supply pipe, the vacuum processing modules 4A and 4B can be directly accessed. Therefore, as shown in FIG. 9, the worker P gets on the step 92B with the handrail 921 and removes a part of the housing of the processing block 102 and removes the vacuum of the vacuum processing modules 4A and 4B without removing the processing unit U. The container 40 is opened and necessary maintenance is performed.

  Next, the operation of connecting the processing unit U pulled out from the accommodation spaces 70A and 70B to the substrate transfer unit 20 as shown in FIGS. 7 and 8 will be described with reference to FIGS. 10 to 13 show examples of the processing unit U and the inner frame 6 accommodated in the middle accommodation space 70B, but the processing unit U and the inner frame 6 accommodated in the lowermost accommodation space 70A are shown. The operation is the same.

  As shown in FIGS. 8 and 10, when the maintenance is completed for the processing unit U pulled out to the predetermined maintenance position separated from the substrate transfer unit 20, the vacuum containers 40 of the vacuum processing modules 4 </ b> A and 4 </ b> B are closed and recovered from the open state. To do. Next, the cam follower 63 is unlocked, the cam follower 63 is moved along the traveling track 74 of the shelf 72, and the position where the LLM 3 is connected to the substrate transfer unit 20, more specifically, the LLM 3 is connected to the substrate transfer unit 20. The inner frame 6 is pushed back in the lateral direction to the disconnection position above the connection position to be connected. After that, the inner frame 6 is lowered by the jack portion 62, the processing unit U is moved to the connection position, and the connection port portion 34 of the LLM 3 and the connection port portion 231 of the connection portion 23 are fitted to each other. It connects to the board | substrate conveyance part 20 (FIG. 11).

  When the inner frame 6 is moved to the disconnection position in the descending operation from the disconnection position to the connection position, the inner frame 6 is moved toward the guide surface of the two guide members 73 provided on the inner surface of the frame member of the outer frame 7. Each guided surface of the two guided members 64 provided on the outer surface of the frame member of the frame 6 is in a state of facing each other with a gap (FIG. 12).

  Thereafter, when the inner frame 6 is lowered from the disconnection position to the connection position, the guided surfaces of the guided members 64 come into contact with the guide surfaces of the guide members 73. At this time, if the position of the inner frame 6 in the left-right direction is shifted, the guided member 64 moves along the guide surface of the guide member 73, and the inner frame 6 (processing unit U) viewed from the substrate transport unit 20 side. The left-right position is corrected.

  Further, as shown in FIG. 14 in accordance with the lowering operation from the disconnection position to the connection position, the distal end portion of the connection port portion 34 provided in the LLM 3 and the connection port portion 231 on the connection portion 23 side Are fitted, and positioning in the front-rear direction as viewed from the substrate transport unit 20 side is also performed.

At this time, in the connection port portions 34 and 231, the upper side and the lower side extending in the horizontal direction are fitted to each other, whereby a close contact surface can be formed between these members by the lowering operation of the LLM 3. In addition, even if both sides of the connection port portions 34 and 231 are inclined edges, by fitting these sides to each other, the LLM3 can be easily brought into close contact between these members in the descending operation. Can be formed.
In this regard, when both sides of the connection port portions 34 and 231 are edges extending in the vertical direction, it is difficult to form an airtight contact surface only by the lowering operation of the LLM 3.

  When the processing unit U is arranged at an accurate connection position with the configuration described above, the unit side exhaust pipe 41 and the unit side gas supply pipe 42 provided on the processing unit U side are provided on the outer frame 7 side. It is arranged at a position before being separated from the branch pipe 511 and the connection pipe 521. Therefore, the connecting members 410 and 510 of the unit side exhaust pipe 41 and the branch pipe 511 are fastened at the positions, and the unit side gas supply pipe 42 and the exhaust pipe (not shown) of the load lock chamber 32 and the connection pipe 521 are connected. By fastening the connecting members 420 and 520, the processing unit U is ready to start preparation for re-operation.

  The substrate processing apparatus according to the embodiment described above has the following effects. In a state where a plurality of vacuum processing modules 4A and 4B and a set of processing units U are constituted by the LLM 3 connected to these vacuum processing modules 4A and 4B, and the processing units U are supported by the inner frame 6, A plurality of processing units U are accommodated in the outer frame 7 in multiple stages in the vertical direction. With this configuration, by moving the inner frame 6, the vacuum processing modules 4A and 4B and the LLM 3 that are used in combination with each other can be moved together, and handling during maintenance and the like is facilitated.

  Here, the arrangement positions of the guide member 73 and the guided member 64 for positioning the processing unit U in the left-right direction as viewed from the substrate transport unit 20 are not limited to the examples shown in FIGS. For example, in the outer frame 7 schematically shown in FIG. 15, a guide member 73 is provided on the plate surface of the shelf plate portion 72, and a tapered guide surface is directed to the rear side when viewed from the substrate transfer unit 20. A guide member 73 is disposed. On the other hand, for example, the unit-side exhaust pipe 41 located on both sides of the LLM 3 on the processing unit U side is provided with a column portion 66 extending downward, and at the lower end of the column portion 66, toward the guide member 73 side. A guided member 64 is arranged with the tapered guided surface facing.

  The arrangement height position of the guided member 64 is adjusted to a height position where the guided surface of the guided member 64 abuts on the guiding surface of the guiding member 73 when the processing unit U is advanced to the above-described separation position. ing. Therefore, in this example, when the processing unit U extracted in the direction away from the substrate transport unit 20 is moved laterally to the separation position, The guided member 64 contacts the guide member 73 while moving to the separation position, and the position of the processing unit U in the left-right direction is corrected. Then, during the descent operation from the disconnection position to the connection position, the guided surface of the guided member 64 remains in a state where the guided surface of the guided member 64 is in contact with the guiding surface of the guiding member 73. It moves downward along the guide surface 73.

  Further, in the outer frame 7 that accommodates a plurality of processing units U arranged in multiple stages in the vertical direction as shown in FIG. 3, all the processing units U accommodated in the outer frame 7 are supported by the inner frame 6. It is not an essential requirement. For example, the processing unit U accommodated in the uppermost accommodation space 70 </ b> C may be assembled directly to the outer frame 7.

  On the other hand, as described with reference to FIG. 9, the processing unit U arranged on the uppermost stage showing an example in which the maintenance for opening the vacuum vessel 40 that is pulled out from the accommodation space 70 </ b> C in the lateral direction is not performed is also performed on the inner side. Of course, it is possible to select a method to be supported by the frame 6, and further provide a jack portion 62 as a lifting mechanism, a slider portion 61 as a moving mechanism, a cam follower 63, and the like and pull out in the lateral direction. For example, when larger-scale maintenance is required, such as replacement of the vacuum processing modules 4A and 4B and repair of equipment in the LLM 3, the processing unit U is pulled out on the mounting table 91 as in the example shown in FIG. May be necessary.

  Here, the inner frame 6 that supports the processing unit U is not necessarily provided with a permanent lifting mechanism (jack portion 62) or a moving mechanism (slider portion 61, cam follower (roller follower) 63, or caster). For example, when it is necessary to move the processing unit U, an air caster is inserted below the inner frame 6, and the inner frame 6 is lifted by the air caster and separated from the substrate transport unit 20. Lateral movement may be performed.

  Further, in each processing unit U, the number of vacuum processing modules 4A and 4B connected to the LLM 3 is not limited to two, and three or more vacuum processing modules 4 may be connected. Alternatively, two LLMs 3 may be provided in each processing unit U, the vacuum processing module 4A is connected to one LLM3, and the vacuum processing module 4B is connected to the LLM3 with respect to the other LLM3. In addition, the processing unit U may be configured by one LLM 3 and one vacuum processing module 4A.

  In addition, the number of processing units U accommodated in the outer frame 7 that accommodates the processing units U arranged in multiple stages in the vertical direction is not limited to three as in the examples shown in FIGS. For example, there may be two stages, or four or more stages. Also, the arrangement number of the outer frames 7 arranged on the side surface of the substrate transport unit 20 is not limited to three as in the example shown in FIG. 2, but two, or four or more. May be. In addition, for example, one outer frame 7 may be directly connected to the EEFM 101, for example. In this case, the EFEM 101 corresponds to the substrate transport unit, and the delivery mechanism 12 corresponds to the first substrate transport mechanism.

  The configuration of the substrate transfer unit 20 is not limited to the example shown in FIG. 2 in which a plurality of outer frames 7 are arranged on both sides of the elongated linear substrate transfer chamber 200 when viewed in plan. For example, the EFEM 101 may be connected to one surface of the substrate transport unit 20 having a polygonal planar shape, and the outer frame 7 may be radially connected to the other surface.

  In addition, the type of processing performed in the vacuum processing modules 4A and 4B of the processing unit U provided in the substrate processing apparatus is not limited to film formation, and may be etching, ashing, annealing, or the like. Of course.

U processing unit W wafer 2 first substrate transfer mechanism 20 substrate transfer unit 3 load lock module (LLM)
32 Load lock chamber 33 Second substrate transfer mechanism 4A, 4B Vacuum processing module 40 Vacuum container 6 Inner frame 7 Outer frame

Claims (10)

In a substrate processing apparatus equipped with a vacuum processing module for processing a substrate in a vacuum atmosphere,
A substrate transport section provided with a first substrate transport mechanism for transporting a substrate in a normal pressure atmosphere;
A vacuum processing module having a vacuum vessel for processing a substrate, and a load lock chamber connected to the vacuum vessel of the vacuum processing module and configured to freely switch an internal atmosphere between a normal pressure atmosphere and a vacuum atmosphere, A load lock module provided with a second substrate transport mechanism for transporting the substrate between the substrate transport unit and the vacuum container; and a processing unit comprising:
A processing unit support for supporting the processing unit;
And a processing unit storage unit that stores a plurality of processing units supported by the processing unit support unit in multiple stages in the vertical direction in a state where the load lock module is connected to the substrate transfer unit. A substrate processing apparatus.   2. The substrate processing apparatus according to claim 1, further comprising a plurality of processing unit accommodating portions that accommodate the plurality of processing units in the vertical direction and are arranged side by side in the horizontal direction.   The processing unit housed in the processing unit housing portion moves the processing unit laterally between a position where the load lock module is connected to the substrate transport portion and a position where the load lock module is separated from the substrate transport portion. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is supported by a processing unit support portion including a moving mechanism.   The processing unit support section provided with the moving mechanism supports a processing unit arranged in a lower stage than the uppermost stage among a plurality of processing units accommodated in the processing unit accommodation section in the vertical direction. The substrate processing apparatus according to claim 3, wherein:   The processing unit housed in the processing unit housing section moves the processing unit up to a disconnection position above a connection position where the load lock module is connected to the substrate transport section, thereby removing the processing unit from the substrate transport section. The substrate processing apparatus according to claim 1, wherein the load lock module is separated.   The substrate processing apparatus according to claim 5, wherein the processing unit support portion is provided with an elevating mechanism that elevates and lowers the processing unit between the connection position and the disconnection position. The processing unit housing portion is located on both the left and right sides of the processing unit as viewed from the substrate transport portion side, and when the load lock module of the processing unit is lowered from the separation position to the connection position and connected to the substrate transport portion. A guide member provided with a tapered guide surface for positioning the processing unit in the left-right direction; and
The processing unit or the processing unit support portion is provided with a guided member having a tapered guided surface that moves along the guiding surface of the guiding member as the processing unit descends. The substrate processing apparatus according to claim 5 or 6. One end part is connected to the vacuum processing module or the load lock module, and the other end part is opened on the processing unit side piping part on the processing unit side,
An apparatus-side piping section on the processing unit housing section side provided with an opening end connected to the processing unit-side piping section,
The other end of the processing unit side piping section and the opening end of the apparatus side piping section are connected to each other along with the operation of lowering the processing unit from the separation position to the connection position and connecting to the substrate transport section. The substrate processing apparatus according to claim 5, wherein a connecting member is provided. Each of the load lock module and the substrate transport unit is provided with a connection port portion that is fitted to each other in accordance with an operation of lowering the processing unit from the separation position to the connection position and connecting to the substrate transport unit. ,
The connection port portion includes an inclined edge portion extending in a vertically inclined direction that overlaps and adheres vertically when the connection port portions are fitted to each other. 2. The substrate processing apparatus according to 1.   2. The processing unit accommodating portion is configured to be accessible from the upper surface side with respect to a processing unit arranged at the uppermost stage among a plurality of processing units accommodated side by side in the vertical direction. 5. The substrate processing apparatus according to any one of 4 to 4.