JP2018094595A5 - - Google Patents

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Publication number
JP2018094595A5
JP2018094595A5 JP2016241323A JP2016241323A JP2018094595A5 JP 2018094595 A5 JP2018094595 A5 JP 2018094595A5 JP 2016241323 A JP2016241323 A JP 2016241323A JP 2016241323 A JP2016241323 A JP 2016241323A JP 2018094595 A5 JP2018094595 A5 JP 2018094595A5
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JP
Japan
Prior art keywords
solder
soldering
gas
tip
processing apparatus
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Application number
JP2016241323A
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English (en)
Japanese (ja)
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JP6818973B2 (ja
JP2018094595A (ja
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Priority to JP2016241323A priority Critical patent/JP6818973B2/ja
Priority claimed from JP2016241323A external-priority patent/JP6818973B2/ja
Publication of JP2018094595A publication Critical patent/JP2018094595A/ja
Publication of JP2018094595A5 publication Critical patent/JP2018094595A5/ja
Application granted granted Critical
Publication of JP6818973B2 publication Critical patent/JP6818973B2/ja
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JP2016241323A 2016-12-13 2016-12-13 半田処理装置 Active JP6818973B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016241323A JP6818973B2 (ja) 2016-12-13 2016-12-13 半田処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016241323A JP6818973B2 (ja) 2016-12-13 2016-12-13 半田処理装置

Publications (3)

Publication Number Publication Date
JP2018094595A JP2018094595A (ja) 2018-06-21
JP2018094595A5 true JP2018094595A5 (cg-RX-API-DMAC10.html) 2019-11-28
JP6818973B2 JP6818973B2 (ja) 2021-01-27

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ID=62634176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016241323A Active JP6818973B2 (ja) 2016-12-13 2016-12-13 半田処理装置

Country Status (1)

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JP (1) JP6818973B2 (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020006405A (ja) * 2018-07-09 2020-01-16 株式会社パラット 半田付け装置および半田付け方法

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