JP2018093070A - Circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit module capable of restraining solder cracking, while maintaining the height of a shield cover.SOLUTION: In a circuit module 100 including an electronic component 40, a circuit board 30 having a mounting surface 31, a shield frame 10, and a shield cover 20, the shield frame 10 has a first shroud 11 abutting on the mounting surface 31, a second shroud 12 extending from the first shroud 11 in the direction opposite to the mounting surface 31, and a plane 13 extending from the first shroud 11, in parallel with the mounting surface 31 while having a prescribed height H1 for the mounting surface 31. The shield cover 20 is attached to the first shroud 11 by pressure welding, the end 11a of the first shroud 11 on the mounting surface 31 side is soldered to the mounting surface 31, and the height H1 of the plane 13 from the mounting surface 31 is set lower than the height H2 of the second shroud 12 from the mounting surface 31.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a circuit module, and more particularly to a circuit module in which a shield cover is attached in pressure contact with a shield frame.

  Conventionally, there is a circuit module that includes a circuit board on which an electronic circuit is formed, a shield frame, and a shield cover, and the shield cover is attached in pressure contact with the shield frame. As such a conventional circuit module, a circuit module device 900 described in Patent Document 1 below is known. The circuit module device 900 will be described with reference to FIG.

  As shown in FIG. 7, the circuit module device 900 includes a substrate 903, a shield frame 901 that can be attached so as to surround an electrical component 904 arranged on the substrate 903, and a shield that is attached to a predetermined position of the shield frame 901. The shield frame 901 is bent at a predetermined angle with respect to the plane portion 901a and the plane portion 901a, and is attached so as to surround the electrical component 904 disposed on the substrate 903. The shield cover 902 is attached to the shield frame 901 so as to cover the electrical component 904 on the substrate 903. The plane portion 901a described above has a function of suppressing deformation in the horizontal direction of a bent portion that is a side plate portion of the shield frame 901.

  The shield cover 902 has a structure that fits substantially at the same height as the shield frame 901 so that it does not protrude beyond the height of the shield frame 901. The shield cover 902 is attached to the shield frame 901 so as to cover the surface of the shield frame 901, and the lower end portion of the shield cover 902 is pressed and fitted near the center in the vertical direction of the shield frame 901.

  With such a structure, the thickness can be reduced and the shield cover 902 can be prevented from dropping undesirably from the shield frame 901.

JP 2006165201 A

  However, in a circuit module such as the circuit module device 900, since the flat portion of the shield frame is formed near the upper end portion of the side plate portion, the distance from the lower end portion of the side plate portion to the flat portion increases. The lower end portion of the portion is easily deformed as compared with the vicinity of the upper end portion of the side plate portion. Therefore, when stress is applied to the side plate portion when the side plate portion and the shield cover are fitted, the lower end portion of the side plate portion may be deformed in the horizontal direction. Therefore, when the side plate portion and the substrate are soldered, there is a possibility that solder cracking may occur in the soldered portion between the side plate portion and the substrate. In addition, if the height of the shield cover is lowered to reduce the distance from the lower end portion of the side plate portion to the flat portion, the horizontal deformation of the lower end portion of the side plate portion can be suppressed. The distance between the circuit board and the component on the board becomes too close, which may affect the electrical characteristics of the component. In addition, when there are tall parts such as an IC, an electric field capacitor, and a crystal oscillator, it is difficult to reduce the height of the shield cover itself.

  The present invention has been made in view of such a state of the art, and an object thereof is to provide a circuit module capable of suppressing solder cracking while maintaining the height of a shield cover.

  In order to solve the above problems, a circuit module of the present invention has an electronic component, a circuit board having a mounting surface on which the electronic component is mounted, an opening, and surrounds the electronic component on the mounting surface. A circuit module comprising: a shield frame attached to the shield frame; and a shield cover attached to the shield frame so as to cover the opening, wherein the shield frame is in contact with the mounting surface. And a second side plate extending from the first side plate and extending in a direction opposite to the mounting surface, and extending from the first side plate and having a predetermined height with respect to the mounting surface. A plane portion extending in parallel, and the shield cover is attached by being pressed against the first side plate portion, and an end portion on the mounting surface side of the first side plate portion is soldered to the mounting surface. Attached Height from the mounting surface of the flat portion has a characteristic that it has, is set lower than the height from the mounting surface of the second side plate portion.

  The circuit module configured as described above maintains the height of the shield cover by the second side plate portion extending from the first side plate portion, and the horizontal portion of the first side plate portion by the plane portion extending from the first side plate portion. The deformation in the direction can be suppressed. Moreover, since the height of the flat surface portion from the mounting surface is set lower than the height of the second side plate portion, the height of the flat portion from the mounting surface is set to the same height as the height of the second side plate portion. Then, the distance from the end portion on the mounting surface side of the first side plate portion to the flat surface portion is reduced to the end portion on the mounting surface side of the first side plate portion when the first side plate portion and the shield cover are fitted. Can be reduced. As a result, solder cracks can be suppressed while maintaining the height of the shield cover.

  Further, in the above configuration, the end portion on the mounting surface side of the shield cover is provided with a pressure contact claw portion that is in pressure contact with the first side plate portion, and the first side plate portion includes the It has the characteristic that the convex part for fitting is provided in the position corresponding to the nail | claw part for press contact.

  In the circuit module configured in this manner, the press-fitting claw portion provided on the shield cover and the fitting convex portion provided on the first side plate portion are fitted, so that the shield cover can be prevented from coming off from the shield frame. .

  In the above configuration, the shield frame and the shield cover are each formed of a metal plate material.

  In the circuit module configured in this way, the shield frame and the shield cover are formed of a metal plate material, so that they are firmly fitted to each other as compared with the case where the shield frame and the shield cover are formed of synthetic resin or the like. Can be combined.

  In the above configuration, the planar portion is provided with a shield wall that constitutes a shield structure within the shield frame, and the shield wall extends from the planar portion in the direction of the mounting surface. It is characterized by comprising one shield wall and a second shield wall extending from the flat portion and extending in a direction opposite to the mounting surface.

  In the circuit module configured as described above, the first shield wall extends from the flat portion in the direction of the mounting surface, and the second shield wall extends from the flat portion in the direction opposite to the mounting surface. A shield structure can be easily formed in the frame.

  The circuit module of the present invention maintains the height of the shield cover by the second side plate portion extending from the first side plate portion, and horizontally extends the first side plate portion by the flat portion extending from the first side plate portion. Deformation can be suppressed. Moreover, since the height of the flat surface portion from the mounting surface is set lower than the height of the second side plate portion, the height of the flat portion from the mounting surface is set to the same height as the height of the second side plate portion. Then, the distance from the end portion on the mounting surface side of the first side plate portion to the flat surface portion is reduced to the end portion on the mounting surface side of the first side plate portion when the first side plate portion and the shield cover are fitted. Can be reduced. As a result, solder cracks can be suppressed while maintaining the height of the shield cover.

It is a perspective view of a circuit module in an embodiment of the present invention. It is a top view of a circuit module. It is a side view of a circuit module. It is a perspective view which shows the structure of the shield frame of a circuit module. It is an expanded sectional view of a circuit module. It is a perspective view which shows the structure of the shield frame of the circuit module in a modification. It is a disassembled perspective view of the circuit module apparatus which concerns on a prior art example.

[Embodiment]
Hereinafter, the present invention will be described with reference to the drawings. A circuit module 100 according to an embodiment of the present invention is, for example, a vehicle-mounted high-frequency wireless circuit module. The use of the circuit module of the present invention is not limited to the embodiments described below, and can be changed as appropriate. In the present specification, for convenience, the right side, the left side, the rear side, the front side, the upper side, and the lower side may be described in the description for each drawing. This indicates the -X side, + Y side, -Y side, + Z side, and -Z side, and does not limit the installation direction of the product or the direction during use.

  First, the configuration of the circuit module 100 will be described with reference to FIGS. 1 to 5. FIG. 1 is a perspective view of a circuit module 100 according to an embodiment of the present invention, FIG. 2 is a plan view of the circuit module 100, and FIG. 3 is a side view of the circuit module 100. 4 is a perspective view showing the structure of the shield frame 10 of the circuit module 100, and FIG. 5 is an enlarged cross-sectional view of the circuit module 100 as seen from the line AA in FIG. 2 to 4, only the outline of the shield cover 20 is indicated by a two-dot chain line in order to make the internal structure of the circuit module 100 easier to see. Further, the circuit board 30 in FIG. 4 also shows only its outline by a two-dot chain line.

  As illustrated in FIG. 1, the circuit module 100 includes an electronic component 40, a circuit board 30, a shield frame 10, and a shield cover 20, and is configured in a rectangular shape in plan view. The shield frame 10 and the shield cover 20 are each formed of a metal plate material.

  As shown in FIG. 2, the circuit board 30 has a mounting surface 31 on which the electronic component 40 is mounted. In the present embodiment, the circuit board 30 is a flat board having a rectangular shape in plan view having an upper surface and a lower surface extending in the horizontal direction, and the upper surface of the circuit board 30 is the mounting surface 31 described above. The electronic component 40 includes a short component 41 such as a chip component and a tall component 43 such as an IC, an electric field capacitor, or a crystal oscillator.

  The shield frame 10 has an opening 10 a and is attached on the mounting surface 31 of the circuit board 30 so as to surround the electronic component 40 described above. The shield cover 20 is attached to the shield frame 10 so as to cover the opening 10a of the shield frame 10.

  As shown in FIGS. 3 and 4, the shield frame 10 extends from the first side plate portion 11 in contact with the mounting surface 31 of the circuit board 30 and extends upward, that is, the mounting surface. The second side plate portion 12 extends in the direction opposite to the direction 31, and the flat portion 13 extends from the first side plate portion 11 and extends in the horizontal direction, that is, parallel to the mounting surface 31. .

  The first side plate portion 11 is formed in a rectangular shape in plan view, and is disposed along the four sides of the mounting surface 31 of the circuit board 30 that is also formed in a rectangular shape in plan view. That is, the end 11 a on the mounting surface 31 side is in contact with the mounting surface 31. The second side plate portion 12 and the plane portion 13 extend from the first side plate portion 11, but the second side plate portion 12 is a portion excluding the portion where the plane portion 13 of the first side plate portion 11 extends. From there, it extends upward.

  The plane portion 13 is an inner plane formed so as to bridge the substantially central portions of two opposing sides and the other one side among the four sides of the first side plate portion 11 having a rectangular shape in plan view. It is comprised by the part 13a and the corner side plane part 13b formed in each inside four corners of the 1st side board part 11. As shown in FIG. The inner plane portion 13a may have a shape that bridges only two opposite sides, or may have a shape that bridges all four sides. By providing the plane portion 13 including the inner side plane portion 13a and the corner side plane portion 13b in the shield frame 10, it is possible to maintain strength against stress applied to the shield frame 10 from the front-rear direction or the left-right direction. Deformation of the shape of the frame 10 can be prevented.

  The distance between the upper surface of each of the inner plane portion 13a and the corner plane portion 13b of the plane portion 13 and the mounting surface 31 of the circuit board 30, that is, the height of the plane portion 13 is set to a predetermined height H1. ing.

  The height of the upper end portion 12a of the second side plate portion 12 from the mounting surface 31 of the circuit board 30, that is, the height H2 of the second side plate portion 12 is set to a predetermined height. As shown, it is set to be higher than the height of the tall component 43 described above. Further, the height H1 of the planar portion 13 from the mounting surface 31 of the circuit board 30 is set to be lower than the height H2 of the second side plate portion 12. In the circuit module 100, the height H <b> 1 of the flat surface portion 13 is set to substantially half of the height H <b> 2 of the second side plate portion 12.

  Further, the height obtained by subtracting the plate thickness of the planar portion 13 from the height H1 of the planar portion 13 is the height of the short component 41 such as the chip component in the electronic component 40 described above, as shown in FIG. It is set higher than this. Therefore, as shown in FIG. 2, the short component 41 can be arranged below the plane portion 13 (the inner plane portion 13a and the corner side plane portion 13b). In addition, the tall component 43 can be disposed on the mounting surface 31 of the circuit board 30 in a place where the planar portion 13 is not formed in plan view.

  As shown in FIG. 5, the end portion 11 a on the mounting surface 31 side of the first side plate portion 11 is soldered to the mounting surface 31 with solder 35. Soldering between the end portion 11 a on the mounting surface 31 side of the first side plate portion 11 and the mounting surface 31 of the circuit board 30 is performed at a plurality of predetermined locations around the first side plate portion 11. As a result, the shield frame 10 is firmly fixed to the circuit board 30.

  The lower end portion of the shield cover 20, that is, the end portion 20 a on the mounting surface 31 side, is provided with a pressing claw portion 21 that is pressed against the first side plate portion 11, and the first side plate portion 11 includes The fitting convex portion 11 b is provided at a position corresponding to the pressure contact claw portion 21.

  By pressing the end portion 20a on the mounting surface 31 side of the shield cover 20 to the first side plate portion 11 in the shield frame 10, the press-contact claw portion 21 is fitted to the fitting convex portion 11b. The shield cover 20 is firmly attached to the shield frame 10 by the press-fitting claw portion 21 being fitted to the fitting convex portion 11b.

  Next, the configuration of a circuit module 110 according to a modification of the embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of the circuit module 110, and FIG. 6 is a perspective view showing the structure of the shield frame 50 of the circuit module 110. In FIG. 6, only the outline of the shield cover 20 and the circuit board 30 is indicated by a two-dot chain line in order to make the structure of the shield frame 50 easier to see. Further, the difference between the circuit module 100 and the circuit module 110 described above is only the structure of the shield frame 50, and the other structure is the same as that of the circuit module 100. Therefore, a part of the description is omitted except for the differences.

  As illustrated in FIG. 1, the circuit module 110 includes an electronic component 40, a circuit board 30, a shield frame 50, and a shield cover 20, and is configured in a rectangular shape in plan view. The shield frame 50 and the shield cover 20 are each formed of a metal plate material.

  As shown in FIG. 6, the shield frame 50 has an opening 50 a and is attached on the mounting surface 31 of the circuit board 30. The shield cover 20 is attached to the shield frame 50 so as to cover the opening 50a of the shield frame 50.

  The shield frame 50 is in contact with the mounting surface 31 of the circuit board 30, and the second side plate 51 extends from the first side plate 51 and extends upward, that is, in a direction opposite to the mounting surface 31. A side plate portion 52 and a flat portion 53 extending from the first side plate portion 51 and extending in parallel to the mounting surface 31 are configured.

  The plane portion 53 is an inner plane formed so as to bridge the substantially central portions of the two opposite sides and the other one side among the four sides of the first side plate portion 51 having a rectangular shape in plan view. It is formed by a portion 53a and a corner side plane portion 53b formed inside each of the four corners of the first side plate portion 51.

  The distance between the upper surface of each of the inner plane portion 53a and the corner side plane portion 53b of the plane portion 53 and the mounting surface 31 of the circuit board 30, that is, the height of the plane portion 53 is set to a predetermined height H1. The height H1 is set lower than the height H2 of the second side plate portion 52. In the circuit module 110, the height H1 of the flat surface portion 53 is set to approximately half of the height H2 of the second side plate portion 52.

  In the circuit module 110, a shield wall 55 constituting a shield structure in the shield frame 50 is provided on the flat portion 53. The shield wall 55 is provided between the blocks considered to be shielded from each other.

  The shield wall 55 extends from the inner flat surface portion 53a of the flat surface portion 53 of the shield frame 50 and extends from the inner flat surface portion 53a and the first shield wall 55a extending downward, that is, toward the mounting surface 31. The second shield wall 55b extends upward, that is, in a direction opposite to the mounting surface 31. By providing the shield wall 55 including the first shield wall 55a and the second shield wall 55b on the shield frame 50, the blocks can be easily shielded. Moreover, the structure is simple and easy to process as compared to the case where such a shield wall is formed separately from the shield frame 50.

  Hereinafter, the effect by having set it as this embodiment is demonstrated.

  The circuit module 100 maintains the height of the shield cover 20 by the second side plate portion 12 that extends from the first side plate portion 11, and the planar portion 13 that extends from the first side plate portion 11 causes the first side plate portion 11 to Deformation in the horizontal direction can be suppressed. Moreover, since the height H1 of the flat surface portion 13 from the mounting surface 31 is set lower than the height H2 of the second side plate portion 12, the height H1 of the flat surface portion 13 from the mounting surface 31 is set to the height of the second side plate portion 12. Compared with the case where the height is set to the same height as H2, the distance from the end portion 11a on the mounting surface 31 side of the first side plate portion 11 to the flat portion 13 is reduced, so that the first side plate portion 11 and the shield cover 20 are reduced. The stress to the end portion 11a on the mounting surface 31 side of the first side plate portion 11 at the time of fitting with can be reduced. As a result, solder cracks can be suppressed while maintaining the height of the shield cover 20.

  Further, since the press-fitting claw portion 21 provided on the shield cover 20 and the fitting convex portion 11b provided on the first side plate portion 11 are fitted, the shield cover 20 can be prevented from coming off the shield frame 10.

  Further, since the shield frame 10 and the shield cover 20 are formed of a metal plate material, the shield frame 10 and the shield cover 20 can be firmly fitted to each other compared to the case where the shield frame 10 and the shield cover 20 are formed of synthetic resin or the like. it can.

  The circuit module 110 is formed by extending the first shield wall 55a from the flat portion 53 in the direction of the mounting surface 31 and extending the second shield wall 55b from the flat portion 53 in the direction opposite to the mounting surface 31. Therefore, the shield structure can be easily configured in the shield frame 50.

  As described above, the circuit module of the present invention maintains the height of the shield cover by the second side plate portion extending from the first side plate portion, and the first side plate by the plane portion extending from the first side plate portion. The deformation of the part in the horizontal direction can be suppressed. Moreover, since the height of the flat surface portion from the mounting surface is set lower than the height of the second side plate portion, the height of the flat portion from the mounting surface is set to the same height as the height of the second side plate portion. Then, the distance from the end portion on the mounting surface side of the first side plate portion to the flat surface portion is reduced to the end portion on the mounting surface side of the first side plate portion when the first side plate portion and the shield cover are fitted. Can be reduced. As a result, solder cracks can be suppressed while maintaining the height of the shield cover.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

DESCRIPTION OF SYMBOLS 10 Shield frame 10a Opening part 11 1st side plate part 11a End part 11b Convex convex part 12 2nd side plate part 12a End part 13 Plane part 13a Inner plane part 13b Corner side plane part 20 Shield cover 20 Shield cover 20a End part 21 Pressure contact Claw portion 30 Circuit board 31 Mounting surface 35 Solder 40 Electronic component 41 Short component 43 Tall component 50 Shield frame 50a Opening 51 First side plate portion 52 Second side plate portion 53 Plane portion 53a Inner plane portion 53b Corner side Plane portion 55 Shield wall 55a First shield wall 55b Second shield wall 100 Circuit module 110 Circuit module H1 Height H2 Height

Claims (4)

An electronic component, a circuit board having a mounting surface on which the electronic component is mounted, a shield frame having an opening and surrounding the electronic component on the mounting surface, and so as to cover the opening A circuit module comprising a shield cover attached to the shield frame,
The shield frame includes a first side plate that is in contact with the mounting surface, a second side plate that extends from the first side plate and extends in a direction opposite to the mounting surface, and the first side plate. And a plane portion extending in parallel with a predetermined height with respect to the mounting surface,
The shield cover is attached by being pressed against the first side plate portion, and the end portion on the mounting surface side of the first side plate portion is soldered to the mounting surface,
The height of the flat surface portion from the mounting surface is set lower than the height of the second side plate portion from the mounting surface,
A circuit module characterized by that. A pressure contact claw portion that is in pressure contact with the first side plate portion is provided at an end portion on the mounting surface side of the shield cover, and the first side plate portion corresponds to the pressure contact claw portion. An engaging projection is provided at a position,
The circuit module according to claim 1. The shield frame and the shield cover are each formed of a metal plate material,
The circuit module according to claim 1, wherein the circuit module is a circuit module. The flat portion is provided with a shield wall that constitutes a shield structure within the shield frame,
The shield wall includes a first shield wall extending from the flat portion and extending in the direction of the mounting surface, and a second shield wall extending from the flat portion and extending in a direction opposite to the mounting surface.
The circuit module according to any one of claims 1 to 3, wherein the circuit module is provided.

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