JP2018092999A - Circuit board structure - Google Patents

Circuit board structure Download PDF

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Publication number
JP2018092999A
JP2018092999A JP2016233393A JP2016233393A JP2018092999A JP 2018092999 A JP2018092999 A JP 2018092999A JP 2016233393 A JP2016233393 A JP 2016233393A JP 2016233393 A JP2016233393 A JP 2016233393A JP 2018092999 A JP2018092999 A JP 2018092999A
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Japan
Prior art keywords
circuit board
pressing spring
heat radiating
sheet metal
electronic component
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JP2016233393A
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JP6862158B2 (en
Inventor
圭 秋山
Kei Akiyama
圭 秋山
智和 湯淺
Tomokazu Yuasa
智和 湯淺
英毅 相坂
Hideki Aisaka
英毅 相坂
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Toshiba Corp
Dynabook Inc
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Toshiba Corp
Toshiba Client Solutions Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a circuit board structure that does not generate unnecessary electromagnetic waves by resonance.SOLUTION: The circuit board structure comprises: a circuit board; an electronic component that is mounted on the circuit board and generates heat when energized; a heat dissipating sheet metal that comes into contact with the electronic component and cools the electronic component; a pressing spring that pressurizes the heat dissipating sheet metal against the electronic component; and a fixing part that fixes the pressing spring to the circuit board and holds a distance from heat dissipating sheet metal to the pressing spring such that a frequency of electric noise generated by energization of the electronic component does not coincide with a natural frequency of the heat dissipating sheet metal.SELECTED DRAWING: Figure 2

Description

本発明の実施形態は、ＣＰＵの放熱板金を有する回路基板構造に関する。   Embodiments described herein relate generally to a circuit board structure having a heat sink metal plate of a CPU.

製品内部にある導体に、導体形状固有の周波数を持つ電気信号(ノイズ)が流れると電気的形状に応じた固有の共振周波数で振動が起きる。流れた電気信号が空間に不要輻射（ＥＭＩ）として放射される現象（＝共振現象）がある。   When an electrical signal (noise) having a frequency specific to the conductor shape flows through the conductor inside the product, vibration occurs at a resonance frequency that is specific to the electrical shape. There is a phenomenon (= resonance phenomenon) in which a flowed electric signal is radiated into space as unnecessary radiation (EMI).

共振現象が起きると製品は、出荷に必要なＥＭＩ規格をクリアしない可能性が高くなる。そのため共振を起こさない、または、流れる信号と共振周波数を一致させないということが必要となる。   When the resonance phenomenon occurs, the product is more likely not to meet the EMI standard required for shipping. Therefore, it is necessary that resonance does not occur or the flowing signal does not coincide with the resonance frequency.

ＣＰＵの放熱板金は放熱効果を得るため、ＣＰＵに押し付ける必要がある。しかしＣＰＵの真上にネジ留めすることはできない。そのため板バネを用いて放熱板金を押し付けている。   The heat sink metal plate of the CPU needs to be pressed against the CPU in order to obtain a heat dissipation effect. However, it cannot be screwed directly above the CPU. Therefore, the heat radiating metal plate is pressed using a leaf spring.

国際公開第１１／１５８６１５号International Publication No. 11/158615 実用新案登録第３１１３６９１号公報Utility Model Registration No. 3113691 特開２００２−３２４９８９JP 2002-324989

共振が起きた場合にはガスケットを用いて放熱板金と筐体との接地構造を設け、共振対策を行っている。しかし、筐体側に受け止めるための構造が必要であることや周辺部品との接触を避けなければいけない。そのため、筐体への接地構造追加によるコスト増や、ＣＰＵ付近は部品が密集しているため接続箇所を設けることが困難である。   When resonance occurs, a grounding structure between the heat dissipating sheet metal and the housing is provided using a gasket to take measures against resonance. However, a structure for receiving on the housing side is necessary and contact with peripheral parts must be avoided. For this reason, it is difficult to increase the cost due to the addition of a grounding structure to the casing, and to provide a connection location near the CPU because parts are densely packed.

一実施形態において、回路基板構造は、回路基板と、回路基板に搭載され、通電されると発熱する電子部品と、電子部品に接触し電子部品を冷却する放熱板金と、放熱板金を電子部品に押圧させる押付けばねと、押付けばねを回路基板に固定し、電子部品が通電により発する電気的ノイズの周波数と、放熱板金の固有周波数とが一致しないように放熱板金から押付けばねまでの距離を所定の値に保持する固定部とを備えて構成した。   In one embodiment, a circuit board structure includes a circuit board, an electronic component that is mounted on the circuit board and generates heat when energized, a radiator plate that contacts the electronic component and cools the electronic component, and the radiator plate is an electronic component. The pressing spring to be pressed and the pressing spring are fixed to the circuit board, and the distance from the heat sink metal plate to the pressing spring is set to a predetermined distance so that the frequency of electrical noise generated by energization of electronic parts and the natural frequency of the heat sink metal plate do not match. And a fixed part that holds the value.

回路基板を備えたノートＰＣを示す斜視図。The perspective view which shows the notebook PC provided with the circuit board. 第１実施形態の回路基板構造を示す平面図。The top view which shows the circuit board structure of 1st Embodiment. 同回路基板構造を示す斜視図。The perspective view which shows the circuit board structure. 押付けばねを示す平面図。The top view which shows a pressing spring. 放熱板金を示す平面図。The top view which shows a heat sink sheet metal. 回路基板構造の概略を示す側面図。The side view which shows the outline of a circuit board structure. 回路基板構造の概略を示す側面図。The side view which shows the outline of a circuit board structure. 放熱板金から押付けばねまでの距離と共振周波数の関係を示すグラフ。The graph which shows the relationship between the distance from a heat sink sheet metal to a pressing spring, and the resonance frequency. 第２実施形態の回路基板構造を示す斜視図。The perspective view which shows the circuit board structure of 2nd Embodiment.

回路基板構造の実施形態について、図面を用いて説明する。
（第１実施形態）
回路基板構造を有する回路基板１０は、例えば電子機器としてのノートブック型ポータブルコンピュータ（ノートＰＣ）１２に設けられている。図１に、第１実施形態の回路基板構造を備えるノートＰＣ１２を示す。図１は、ノートＰＣ１２を斜め上方から示す斜視図である。 An embodiment of a circuit board structure will be described with reference to the drawings.
(First embodiment)
A circuit board 10 having a circuit board structure is provided, for example, in a notebook portable computer (notebook PC) 12 as an electronic device. FIG. 1 shows a notebook PC 12 having the circuit board structure of the first embodiment. FIG. 1 is a perspective view showing the notebook PC 12 obliquely from above.

図１に示すように、ノートＰＣ１２は、第１ユニット１４と、第２ユニット１６と、ヒンジ部１８とを有する。第１ユニット１４は、例えば電子機器本体である。第１ユニット１４は、第１筐体２０を備えている。   As shown in FIG. 1, the notebook PC 12 includes a first unit 14, a second unit 16, and a hinge portion 18. The first unit 14 is, for example, an electronic device main body. The first unit 14 includes a first housing 20.

図１に示すように、第１筐体２０は、上壁２８と、底壁３０と、周壁（側壁）３２とを有している。第１筐体２０は、電子部品としての第１部品（ＣＰＵ）３４(図２等参照)を有する実施形態に係る回路基板１０を収容している。   As shown in FIG. 1, the first housing 20 has an upper wall 28, a bottom wall 30, and a peripheral wall (side wall) 32. The first housing 20 accommodates the circuit board 10 according to the embodiment having a first component (CPU) 34 (see FIG. 2 and the like) as an electronic component.

第２ユニット１６は、例えば表示部であり、第２筐体２２と、この第２筐体２２に収容された表示装置２４とを備えている。第２筐体２２は、表示装置２４の表示画面が外部に露出する開口部２６を有する。   The second unit 16 is, for example, a display unit, and includes a second housing 22 and a display device 24 accommodated in the second housing 22. The second housing 22 has an opening 26 through which the display screen of the display device 24 is exposed to the outside.

第２筐体２２は、ヒンジ部１８によって、第１筐体２０の後端部に回動可能（開閉可能）に連結されている。これによりノートＰＣ１２は、第１ユニット１４と第２ユニット１６とが重ねられた第１の位置と、第１ユニット１４と第２ユニット１６とが開かれた第２の位置との間で回動可能である。   The second housing 22 is connected to the rear end portion of the first housing 20 by the hinge portion 18 so as to be rotatable (openable and closable). Thereby, the notebook PC 12 rotates between the first position where the first unit 14 and the second unit 16 are overlapped and the second position where the first unit 14 and the second unit 16 are opened. Is possible.

図２、図３に回路基板１０を示す。図２は、回路基板１０の一部を示す平面図、図３は、回路基板１０の一部を示す斜視図である。   The circuit board 10 is shown in FIGS. FIG. 2 is a plan view showing a part of the circuit board 10, and FIG. 3 is a perspective view showing a part of the circuit board 10.

回路基板１０には、ＣＰＵ３４が搭載されている。図２及び図３は、回路基板１０のＣＰＵ３４付近を部分的に示している。ＣＰＵ３４は、通電により発熱する電子部品である。ＣＰＵ３４は、下面に接続端子３５を有している(図６等参照)。ＣＰＵ３４は、接続端子３５を介して回路基板１０に接続されている。ＣＰＵ３４の上面には、放熱板金３６が設けられている。尚、電子部品としては、ＣＰＵ３４に限るものではない。   A CPU 34 is mounted on the circuit board 10. 2 and 3 partially show the vicinity of the CPU 34 of the circuit board 10. The CPU 34 is an electronic component that generates heat when energized. The CPU 34 has a connection terminal 35 on the lower surface (see FIG. 6 and the like). The CPU 34 is connected to the circuit board 10 via the connection terminal 35. A heat radiating metal plate 36 is provided on the upper surface of the CPU 34. Note that the electronic component is not limited to the CPU 34.

放熱板金３６を図５に示す。放熱板金３６は、熱伝導性の良好な金属部材から形成されている。放熱板金３６は、平板状で、一方に第１面３７を有し、第１面３７と反対側の面に第２面３９を有している。図５は、放熱板金３６を第１面３７側から示す平面図である。第１面３７を放熱板金３６の上面とし、第２面３９を放熱板金３６の下面とする。   The heat radiating sheet metal 36 is shown in FIG. The heat radiating metal plate 36 is formed of a metal member having good thermal conductivity. The heat radiating metal plate 36 is flat and has a first surface 37 on one side and a second surface 39 on the surface opposite to the first surface 37. FIG. 5 is a plan view showing the heat radiating metal plate 36 from the first surface 37 side. The first surface 37 is the upper surface of the heat radiating metal plate 36, and the second surface 39 is the lower surface of the heat radiating metal plate 36.

放熱板金３６の第２面３９側に、ＣＰＵ３４が設けられている。放熱板金３６は、ＣＰＵ３４から発生される熱を吸収し、第１筐体２０の空間内に熱を放散させる。放熱板金３６は、ＣＰＵ３４から吸収した熱を空間に放散させるため、所定の面積を有している。   A CPU 34 is provided on the second surface 39 side of the heat radiating metal plate 36. The heat radiating sheet metal 36 absorbs heat generated from the CPU 34 and dissipates heat in the space of the first housing 20. The heat radiating metal plate 36 has a predetermined area in order to dissipate heat absorbed from the CPU 34 into the space.

更に放熱板金３６は、ＣＰＵ３４に取り付けた際、回路基板１０における放熱板金３６の取付位置、ＣＰＵ３４の周囲に隣接して配置されている他の電子部品との干渉を回避する関係、ＣＰＵ３４から吸収した熱を効率よく放散させるため等を考慮して図５に示す形状を有している。図５の点線で、放熱板金３６におけるＣＰＵ３４の取付位置を示す。   Further, when the heat radiating sheet metal 36 is attached to the CPU 34, the position where the heat radiating sheet metal 36 is attached to the circuit board 10, the relationship of avoiding interference with other electronic components arranged adjacent to the periphery of the CPU 34, and absorption from the CPU 34. The shape shown in FIG. 5 is taken into consideration for efficiently dissipating heat. The dotted line in FIG. 5 shows the mounting position of the CPU 34 on the heat radiating sheet metal 36.

具体的には、放熱板金３６は、第１突片４０と中央部４２と後部拡大部４４とを有している。第１突片４０は、中央部４２の前方に設けられ、中央部４２から左方に突出している。放熱板金３６の前後は、図２、図５の紙面に沿い、紙面の上方を前方とし、その逆を後方とする。尚、放熱板金３６における第１突片４０と中央部４２と後部拡大部４４の各区分は、厳密なものではない。   Specifically, the heat radiating sheet metal 36 includes a first protruding piece 40, a central part 42, and a rear enlarged part 44. The first protruding piece 40 is provided in front of the central portion 42 and protrudes leftward from the central portion 42. Before and after the heat radiating sheet metal 36, along the paper surface of FIGS. 2 and 5, the upper side of the paper surface is the front, and the reverse is the rear. In addition, each division of the 1st protrusion piece 40, the center part 42, and the rear expansion part 44 in the heat sink sheet metal 36 is not exact | strict.

中央部４２には、下方（回路基板１０側）に、図５に示すようにＣＰＵ３４が配置される。放熱板金３６の第２面３９が、ＣＰＵ３４の上面に接している。中央部４２の後方に、後部拡大部４４が設けられている。   As shown in FIG. 5, the CPU 34 is disposed in the central portion 42 below (on the circuit board 10 side). A second surface 39 of the heat radiating metal plate 36 is in contact with the upper surface of the CPU 34. A rear enlarged portion 44 is provided behind the central portion 42.

後部拡大部４４は、放熱板金３６の後方に広がっている。中央部４２と後部拡大部４４との間には、切欠き４５が形成されている。切欠き４５は、放熱板金３６を表裏に貫通している。放熱板金３６には、放熱板金３６をＣＰＵ３４に押し付けるための押付けばね５０が設けられている。   The rear enlarged portion 44 extends behind the heat radiating sheet metal 36. A notch 45 is formed between the central portion 42 and the rear enlarged portion 44. The notch 45 penetrates the heat radiating sheet metal 36 on the front and back sides. The heat radiating metal plate 36 is provided with a pressing spring 50 for pressing the heat radiating metal plate 36 against the CPU 34.

次に、押付けばね５０について説明する。図４に押付けばね５０を示す。押付けばね５０は、ばね性を有する金属部材から形成されている。図４に示すように、押付けばね５０は、第１片５２と第２片５４と第３片５６を有している。   Next, the pressing spring 50 will be described. FIG. 4 shows the pressing spring 50. The pressing spring 50 is formed from a metal member having a spring property. As shown in FIG. 4, the pressing spring 50 includes a first piece 52, a second piece 54, and a third piece 56.

第１片５２と第３片５６は、それぞれ第２片５２に対して所定の角度で設けられている。第１片５２と第３片５６は、第２片５２に対してほぼ対称の位置に設けられている。第１片５２と第３片５６の端部で、第２片５４の側と反対側の端部には、ねじ孔５８が設けられている。ねじ孔５８は、雄ねじ６０を通す径を有している。押付けばね５０は、ねじ孔５８に通した雄ねじ６０により回路基板１０に固定される。   The first piece 52 and the third piece 56 are each provided at a predetermined angle with respect to the second piece 52. The first piece 52 and the third piece 56 are provided at substantially symmetrical positions with respect to the second piece 52. A screw hole 58 is provided at the end of the first piece 52 and the third piece 56 and at the end opposite to the second piece 54 side. The screw hole 58 has a diameter through which the male screw 60 is passed. The pressing spring 50 is fixed to the circuit board 10 by a male screw 60 passed through the screw hole 58.

第２片５４には、押圧部６２が２か所に設けられている。尚、第２片５４に設けられる押圧部６２は、２か所に限るものではない。   The second piece 54 is provided with two pressing portions 62. In addition, the pressing part 62 provided in the 2nd piece 54 is not restricted to two places.

押圧部６２は、押付けばね５０を回路基板１０に取り付けると、放熱板金３６の第１面３７に当接する。押付けばね５０は、第１片５２及び第３片５６のねじ孔５８と第２片５４の押圧部６２との間で、ばね性を有し、所定のばね力で放熱板金３６の第１面３７を下方に押圧する。   When the pressing spring 50 is attached to the circuit board 10, the pressing portion 62 contacts the first surface 37 of the heat radiating sheet metal 36. The pressing spring 50 has a spring property between the screw hole 58 of the first piece 52 and the third piece 56 and the pressing portion 62 of the second piece 54, and the first surface of the heat radiating sheet metal 36 with a predetermined spring force. 37 is pressed downward.

これにより、押付けばね５０は、雄ねじ６０で回路基板１０に取り付けられると、放熱板金３６をＣＰＵ３４側に押圧する。放熱板金３６は、第２面３９が押付けばね５０によりＣＰＵ３４に押し付けられ、放熱板金３６とＣＰＵ３４との間に生じる伝熱性が良好になる。   Accordingly, when the pressing spring 50 is attached to the circuit board 10 with the male screw 60, the pressing spring 50 presses the heat radiating sheet metal 36 toward the CPU 34 side. The second surface 39 of the heat radiating sheet metal 36 is pressed against the CPU 34 by the pressing spring 50, and heat transfer between the heat radiating sheet metal 36 and the CPU 34 is improved.

押付けばね５０は、ＣＰＵ３４に隣接して設けられる他の電子部品の取付位置、回路基板１０に形成される配線の敷設状況等によりねじ孔５８の取付位置が特定される。押付けばね５０は、回路基板１０におけるその雄ねじ６０の位置と、放熱板金３６が安定してＣＰＵ３４に押し付けられる押圧部６２の位置関係等から形状が決定されている。   In the pressing spring 50, the mounting position of the screw hole 58 is specified by the mounting position of other electronic components provided adjacent to the CPU 34, the laying status of the wiring formed on the circuit board 10, and the like. The shape of the pressing spring 50 is determined from the position of the male screw 60 on the circuit board 10 and the positional relationship of the pressing portion 62 where the heat radiating sheet metal 36 is stably pressed against the CPU 34.

更に、押付けばね５０は、図６に示すように、回路基板１０から所定の距離Ｈ（「高さ」ともいう）に保持されている。回路基板１０からの押付けばね５０の距離Ｈは、ＣＰＵ３４から発せられる電気的ノイズの周波数と、放熱板金３６が有する、放熱板金３６の形状からくる共振周波数とが一致（共振）しない値に設定されている。   Furthermore, as shown in FIG. 6, the pressing spring 50 is held at a predetermined distance H (also referred to as “height”) from the circuit board 10. The distance H of the pressing spring 50 from the circuit board 10 is set to a value that does not match (resonate) the frequency of electrical noise emitted from the CPU 34 and the resonance frequency of the heat radiating metal plate 36 that comes from the shape of the heat radiating metal plate 36. ing.

次に、放熱板金３６とＣＰＵ３４との共振について説明する。ＣＰＵ３４は、ノートＰＣ１２が作動し通電されると、電気的ノイズを発する。ＣＰＵ３４が発する電気的ノイズは、所定の周波数を有している。放熱板金３６は、放熱板金３６が有する形状から、固有の共振周波数を有している。   Next, resonance between the heat radiating sheet metal 36 and the CPU 34 will be described. When the notebook PC 12 is activated and energized, the CPU 34 generates electrical noise. The electrical noise generated by the CPU 34 has a predetermined frequency. The heat radiating metal plate 36 has a specific resonance frequency from the shape of the heat radiating metal plate 36.

押付けばね５０は、雄ねじ６０により回路基板１０の取付部６１（図６参照）に固定されている。雄ねじ６０と取付部６１が、請求項で言う固定部に相当する。尚、固定部は、ねじに限るものではない。   The pressing spring 50 is fixed to an attachment portion 61 (see FIG. 6) of the circuit board 10 by a male screw 60. The male screw 60 and the attachment portion 61 correspond to a fixing portion referred to in the claims. Note that the fixing portion is not limited to the screw.

放熱板金３６は、その固有の共振振動数が、放熱板金３６からの押付けばね５０の距離、つまり回路基板１０からの押付けばね５０の距離Ｈによって変動することがわかっている。   It has been found that the natural resonance frequency of the heat radiating metal plate 36 varies depending on the distance of the pressing spring 50 from the heat radiating metal plate 36, that is, the distance H of the pressing spring 50 from the circuit board 10.

放熱板金３６においては、図３に示すように、回路基板１０と押付けばね５０の接続点、つまり取付部６１を始点として、取付部６１から押付けばね５０を通り放熱板金３６の端部までの長さを１/４にした長さを波長とした周波数の奇数倍の周波数を共振周波数として共振することが予想される。   In the heat radiating sheet metal 36, as shown in FIG. 3, the connection point between the circuit board 10 and the pressing spring 50, that is, the length from the mounting part 61 through the pressing spring 50 to the end of the heat radiating sheet metal 36 starting from the mounting part 61. It is expected that the resonance frequency is a frequency that is an odd multiple of the frequency with the length of 1/4 being the wavelength.

この共振周波数と放熱板金３６の周辺にある、例えばＣＰＵ３４などの電子部品から発せられるノイズの周波数が一致してしまうと、ＥＭＩとして空間に強く放射されたり、搭載されているアンテナの感度を悪化させてしまうことが発生する。   If the resonance frequency and the frequency of noise emitted from an electronic component such as the CPU 34 around the heat radiating sheet metal 36 coincide with each other, the EMI is strongly radiated into the space or the sensitivity of the mounted antenna is deteriorated. Will occur.

具体的に、図３に、取付部６１から押付けばね５０を経由した放熱板金３６の共振に関する電気経路を、二点鎖線Ａ及びＢで示す。Ａは、放熱板金３６の後部拡大部４４から押圧部６２を通り、押圧部６２から押付けばね５０の第３片５６を通り、第３片５６の雄ねじ６０から回路基板１０に至る経路である。   Specifically, in FIG. 3, an electric path related to resonance of the heat radiating sheet metal 36 from the attachment portion 61 via the pressing spring 50 is indicated by two-dot chain lines A and B. A is a path from the rear enlarged portion 44 of the heat radiating metal plate 36 through the pressing portion 62, through the third piece 56 of the pressing spring 50 from the pressing portion 62, and from the male screw 60 of the third piece 56 to the circuit board 10.

Ｂは、放熱板金３６の第１突片４０の先端から他方の押圧部６２を通り、押付けばね５０の第１片５２を通り、第１片５２の雄ねじ６０から回路基板１０に至る経路である。   B is a path from the tip of the first projecting piece 40 of the heat radiating metal plate 36 to the other pressing portion 62, through the first piece 52 of the pressing spring 50, and from the male screw 60 of the first piece 52 to the circuit board 10. .

放熱板金３６から押付けばね５０までの距離により、放熱板金３６が有する共振周波数が、ＣＰＵ３４から発せられる電気的ノイズの周波数と一致してしまうことがある。   Depending on the distance from the heat dissipating sheet metal 36 to the pressing spring 50, the resonance frequency of the heat dissipating sheet metal 36 may coincide with the frequency of electrical noise emitted from the CPU 34.

ＣＰＵ３４から発せられる電気的ノイズの周波数は、基本的に固定的である。放熱板金３６をＣＰＵ３４に取り付け、押付けばね５０で放熱板金３６を押圧したときの、放熱板金３６の共振周波数が、ＣＰＵ３４から発せられる電気的ノイズの周波数と一致しない放熱板金３６から押付けばね５０までの距離を求める。   The frequency of electrical noise emitted from the CPU 34 is basically fixed. When the heat radiating metal plate 36 is attached to the CPU 34 and the heat radiating metal plate 36 is pressed by the pressing spring 50, the resonance frequency of the heat radiating metal plate 36 does not match the frequency of the electrical noise emitted from the CPU 34 to the pressing spring 50. Find the distance.

放熱板金３６から押付けばね５０までの距離が求められたら、かかる距離になるよう押付けばね５０を回路基板１０に取り付ける。すなわち、押付けばね５０と回路基板１０との距離を、ＣＰＵ３４と放熱板金３６との共振が発生しない所定の距離に設定する。   When the distance from the heat radiating sheet metal 36 to the pressing spring 50 is obtained, the pressing spring 50 is attached to the circuit board 10 so as to be such a distance. That is, the distance between the pressing spring 50 and the circuit board 10 is set to a predetermined distance at which resonance between the CPU 34 and the heat radiating sheet metal 36 does not occur.

図６と図７に、回路基板１０と押付けばね５０との距離を変化させたときの模式図を示す。図６に示す回路基板１０と押付けばね５０との距離Ｈは、図７に示す回路基板１０と押付けばね５０との距離Ｈより大きい。すなわち、図６では、放熱板金３６と押付けばね５０の距離ｈ１が、図７に示す距離ｈ２より大きい。   6 and 7 are schematic views when the distance between the circuit board 10 and the pressing spring 50 is changed. The distance H between the circuit board 10 and the pressing spring 50 shown in FIG. 6 is larger than the distance H between the circuit board 10 and the pressing spring 50 shown in FIG. That is, in FIG. 6, the distance h1 between the heat radiating sheet metal 36 and the pressing spring 50 is larger than the distance h2 shown in FIG.

図８は、押付けばね５０と回路基板１０との距離を変化させたときの放熱板金３６の共振周波数の値である。図８の横軸は、放熱板金３６から押付けばね５０までの距離（ｍｍ）であり、縦軸は、放熱板金３６の共振周波数(ＧＨｚ)の値である。   FIG. 8 shows the value of the resonance frequency of the heat radiating sheet metal 36 when the distance between the pressing spring 50 and the circuit board 10 is changed. The horizontal axis in FIG. 8 is the distance (mm) from the heat radiating sheet metal 36 to the pressing spring 50, and the vertical axis is the value of the resonance frequency (GHz) of the radiating sheet metal 36.

図８のグラフから、放熱板金３６と押付けばね５０との距離が小さいと、共振周波数が高周波側にシフトし、両者間の距離が大きいと、共振周波数が低周波側にシフトすることがわかる。すなわち、回路基板１０と押付けばね５０との距離が大きい、図６に示す距離ｈ１の回路基板構造は、図７に示す距離ｈ２の回路基板構造より、共振周波数が低周波側にシフトする。   From the graph of FIG. 8, it can be seen that when the distance between the heat radiating metal plate 36 and the pressing spring 50 is small, the resonance frequency shifts to the high frequency side, and when the distance between the two is large, the resonance frequency shifts to the low frequency side. That is, in the circuit board structure of the distance h1 shown in FIG. 6 where the distance between the circuit board 10 and the pressing spring 50 is large, the resonance frequency is shifted to the lower frequency side than the circuit board structure of the distance h2 shown in FIG.

このように本実施形態のかかる回路基板構造は、放熱板金３６の形状及び放熱板金３６から押付けばね５０までの距離から導かれる放熱板金３６の共振周波数を、ＣＰＵ３４の電気的ノイズの持つ周波数と容易に異ならせることができる。   As described above, in the circuit board structure according to this embodiment, the resonance frequency of the heat radiating metal plate 36 derived from the shape of the heat radiating metal plate 36 and the distance from the heat radiating metal plate 36 to the pressing spring 50 is easily set to the frequency of the electrical noise of the CPU 34. Can be different.

これにより、本実施形態では、放熱板金３６の共振周波数とＣＰＵ３４の電気的ノイズの持つ周波数とが一致して空間にＥＭＩノイズが放射されてしまうことを防止できる。   Thereby, in this embodiment, it can prevent that the resonant frequency of the heat sink metal plate 36 and the frequency which the electric noise of CPU34 has corresponded, and EMI noise being radiated | emitted in space.

放熱板金３６の形状から導かれる固有の共振周波数と製品としてサポートしている無線周波数とが一致して製品のアンテナ感度を悪化させてしまうことを抑制することができる。   It can be suppressed that the inherent resonance frequency derived from the shape of the heat radiating metal plate 36 coincides with the radio frequency supported as a product to deteriorate the antenna sensitivity of the product.

本実施形態のかかる回路基板構造は、押付けばね５０を第１筐体２０の一部に、電気的に接続させる必要がない。これにより、電気的にショートしてしまうリスク、回路基板１０の取付構造の複雑さ、ＣＰＵ３４や放熱板金３６等を取り付ける手間の増加を抑制できる。   The circuit board structure according to this embodiment does not require the pressing spring 50 to be electrically connected to a part of the first housing 20. As a result, it is possible to suppress the risk of electrical shorting, the complexity of the mounting structure of the circuit board 10, and the increase in labor for mounting the CPU 34, the heat radiating sheet metal 36 and the like.

本実施形態では、例えばシミュレーションを行い、予め放熱板金３６の共振による支障が発生することがない押付けばね５０の回路基板１０からの距離Ｈを求め、回路基板１０を構成する。かかる回路基板構造により、回路基板１０をノートＰＣ１２に組み込むことにより、ノートＰＣ１２から外部に、放熱板金３６の共振による不要な電磁波が発生することを抑制できる。   In the present embodiment, for example, simulation is performed, and the distance H from the circuit board 10 of the pressing spring 50 that does not cause trouble due to resonance of the heat radiating metal plate 36 is obtained in advance to configure the circuit board 10. By incorporating the circuit board 10 into the notebook PC 12 with such a circuit board structure, it is possible to suppress generation of unnecessary electromagnetic waves due to resonance of the heat radiating metal plate 36 from the notebook PC 12 to the outside.

押付けばね５０を、回路基板１０から所定の距離Ｈに取り付けるだけであるので、回路基板１０の構造を簡易にできる。回路基板１０から押付けばね５０までの距離Ｈは予め設定されるため、放熱板金３６の取付作業を簡易化できる。   Since the pressing spring 50 is simply attached at a predetermined distance H from the circuit board 10, the structure of the circuit board 10 can be simplified. Since the distance H from the circuit board 10 to the pressing spring 50 is set in advance, the mounting work of the heat radiating sheet metal 36 can be simplified.

放熱板金３６を第１筐体２０に接続させる必要がなく、アース等の作業が不要となり、構造が簡易となり、又、電気的短絡（ショート）等の発生のおそれを解消できる。   There is no need to connect the heat radiating sheet metal 36 to the first housing 20, work such as grounding is unnecessary, the structure is simplified, and the possibility of occurrence of an electrical short circuit or the like can be eliminated.

ＣＰＵ３４が異なる場合においては、回路基板１０から押付けばね５０までの距離ＨをそれぞれのＣＰＵ３４に適合した値とすることで、共振の発生を容易に解消できる。   When the CPUs 34 are different, the occurrence of resonance can be easily eliminated by setting the distance H from the circuit board 10 to the pressing spring 50 to a value suitable for each CPU 34.

更に、本実施形態では、回路基板１０を設計する評価段階で、押付けばね５０の高さを調整できるよう調整構造を設けておいてもよい。例えば、押付けばね５０を回路基板１０に固定する取付部６１に調整ねじ部を設け、調整ねじ部により押付けばね５０の回路基板１０からの距離Ｈを任意に調整可能とする。   Furthermore, in this embodiment, an adjustment structure may be provided so that the height of the pressing spring 50 can be adjusted at the evaluation stage of designing the circuit board 10. For example, an adjustment screw portion is provided in the attachment portion 61 that fixes the pressing spring 50 to the circuit board 10 so that the distance H of the pressing spring 50 from the circuit board 10 can be arbitrarily adjusted by the adjustment screw portion.

そして、設計段階で押付けばね５０の回路基板１０からの距離Ｈを調整ねじ部により変化させる。押付けばね５０の高さを変化させ、放熱板金３６の共振の状態を検出し、ＣＰＵ３４と放熱板金３６とで共振が発生しない距離Ｈに押付けばね５０を設定する。これによっても、回路基板１０の共振の発生が防止できる。   Then, the distance H of the pressing spring 50 from the circuit board 10 is changed by the adjusting screw portion at the design stage. The height of the pressing spring 50 is changed, the resonance state of the heat radiating metal plate 36 is detected, and the pressing spring 50 is set to a distance H at which no resonance occurs between the CPU 34 and the heat radiating metal plate 36. Also by this, the occurrence of resonance of the circuit board 10 can be prevented.

（第２実施形態）
次に、第２実施形態の回路基板構造について説明する。図９に、第２実施形態にかかる回路基板１０を示す。以下、第１実施形態にかかる回路基板構造と同一の構成については、同一の符号を付し、その説明に代える。 (Second Embodiment)
Next, the circuit board structure of the second embodiment will be described. FIG. 9 shows a circuit board 10 according to the second embodiment. Hereinafter, the same reference numerals are given to the same components as those of the circuit board structure according to the first embodiment, and the description thereof is omitted.

第２実施形態の回路基板構造は、放熱板金３６を固定する雄ねじ６０にスペーサ６４を介在させている。スペーサ６４は、押付けばね５０と回路基板１０の間に設けられている。スペーサ６４は、所定の硬度を有する材質から形成されている。スペーサ６４は、円筒状で、軸方向に所定の距離ｈ３を有している。スペーサ６４の高さ（距離ｈ３）は、スペーサ６４を介して押付けばね５０を回路基板１０に取り付けた際、押付けばね５０で押圧された放熱板金３６が有する固有の周波数が、ＣＰＵ３４が発する電気的ノイズの周波数と一致することのない値である。   In the circuit board structure of the second embodiment, a spacer 64 is interposed in a male screw 60 that fixes the heat radiating metal plate 36. The spacer 64 is provided between the pressing spring 50 and the circuit board 10. The spacer 64 is made of a material having a predetermined hardness. The spacer 64 is cylindrical and has a predetermined distance h3 in the axial direction. The height of the spacer 64 (distance h3) is an electrical frequency generated by the CPU 34 due to the inherent frequency of the heat dissipating sheet metal 36 pressed by the pressing spring 50 when the pressing spring 50 is attached to the circuit board 10 via the spacer 64. It is a value that does not match the noise frequency.

このように、回路基板１０と押付けばね５０との間に所定の高さのスペーサ６４を設けることにより、押付けばね５０に押圧された放熱板金３６が有する固有振動数が、ＣＰＵ３４が発する電気的ノイズの周波数と一致させないことができる。   In this way, by providing the spacer 64 having a predetermined height between the circuit board 10 and the pressing spring 50, the natural frequency of the heat radiating sheet metal 36 pressed by the pressing spring 50 is increased by the electrical noise generated by the CPU 34. It is not possible to match the frequency.

これによっても、放熱板金３６が有する形状から導かれる固有の周波数とＣＰＵ３４の電気的ノイズの持つ周波数とが一致し空間にＥＭＩノイズが放射されてしまうことを防止できる。   Also by this, it is possible to prevent the EMI noise from being radiated into the space because the inherent frequency derived from the shape of the heat radiating metal plate 36 matches the frequency of the electrical noise of the CPU 34.

この他、本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   In addition, although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

１０…回路基板、１２…ノートＰＣ、１４…第１ユニット、１６…第２ユニット、１８…ヒンジ部、２０…第１筐体、２２…第２筐体、２４…表示装置、２６…開口部、２８…上壁、３０…底壁、３２…周壁、３４…第１部品（ＣＰＵ）、３５…接続端子、３６…放熱板金、３７…第１面、３９…第２面、４０…第１突片、４２…中央部、４４…後部拡大部、５２…第１片、５４…第２片、５６…第３片、５８…ねじ孔、６１…取付部、６２…押圧部、６４…スペーサ。   DESCRIPTION OF SYMBOLS 10 ... Circuit board, 12 ... Notebook PC, 14 ... 1st unit, 16 ... 2nd unit, 18 ... Hinge part, 20 ... 1st housing | casing, 22 ... 2nd housing | casing, 24 ... Display apparatus, 26 ... Opening part , 28 ... upper wall, 30 ... bottom wall, 32 ... peripheral wall, 34 ... first component (CPU), 35 ... connection terminal, 36 ... heat sink sheet metal, 37 ... first surface, 39 ... second surface, 40 ... first Projection piece, 42 ... center part, 44 ... rear enlarged part, 52 ... first piece, 54 ... second piece, 56 ... third piece, 58 ... screw hole, 61 ... mounting part, 62 ... pressing part, 64 ... spacer .

Claims (6)

回路基板と、
前記回路基板に搭載され、通電されると発熱する電子部品と、
第１面と前記第１面の反対側に第２面を有し、前記電子部品に前記第２面が接触して前記電子部品を冷却する放熱板金と、
前記放熱板金の前記第１面に当接し、前記放熱板金を前記電子部品に押圧させる押付けばねと、
前記押付けばねを前記回路基板に固定し、前記電子部品が通電により発する電気的ノイズの周波数と、前記放熱板金の固有周波数とが一致しないように前記放熱板金から前記押付けばねまでの距離を保持する固定部と、を備えた回路基板構造。 A circuit board;
Electronic components mounted on the circuit board and generating heat when energized,
A heat dissipating sheet metal having a second surface on the opposite side of the first surface and the first surface, the second surface contacting the electronic component and cooling the electronic component;
A pressing spring that contacts the first surface of the heat radiating metal plate and presses the heat radiating metal plate against the electronic component;
The pressing spring is fixed to the circuit board, and the distance from the heat radiating sheet metal to the pressing spring is maintained so that the frequency of electrical noise generated by the electronic component when energized does not match the natural frequency of the heat radiating sheet metal. A circuit board structure including a fixing portion. 回路基板と、
前記回路基板に搭載され、通電されると発熱する電子部品と、
第１面と前記第１面の反対側に第２面を有し、前記電子部品に前記第２面が接触して前記電子部品を冷却する放熱板金と、
前記放熱板金の前記第１面に当接し、前記放熱板金を前記電子部品に押圧させる押付けばねと、
前記電子部品が通電により発する電気的ノイズの周波数と前記放熱板金の固有周波数とが一致しないように前記回路基板と前記押付けばねとの間にスペーサを有する、前記押付けばねを前記回路基板に固定する固定部と、を備えた回路基板構造。 A circuit board;
Electronic components mounted on the circuit board and generating heat when energized,
A heat dissipating sheet metal having a second surface on the opposite side of the first surface and the first surface, the second surface contacting the electronic component and cooling the electronic component;
A pressing spring that contacts the first surface of the heat radiating metal plate and presses the heat radiating metal plate against the electronic component;
The pressing spring is fixed to the circuit board having a spacer between the circuit board and the pressing spring so that the frequency of electrical noise generated by energization of the electronic component does not match the natural frequency of the heat radiating sheet metal. A circuit board structure including a fixing portion. 前記固定部は、前記放熱板金から前記押付けばねまでの距離が変更可能である請求項１に記載の回路基板構造。   The circuit board structure according to claim 1, wherein the fixing portion is capable of changing a distance from the heat radiating sheet metal to the pressing spring. 前記固定部は、前記回路基板に螺合する雄ねじであり、前記スペーサは、中心に前記雄ねじを通す円筒状である請求項２に記載の回路基板構造。   3. The circuit board structure according to claim 2, wherein the fixing portion is a male screw that is screwed into the circuit board, and the spacer has a cylindrical shape through which the male screw passes. 前記回路基板と前記押付けばねとの接続点を始点とし、前記始点から前記押付けばねを通り前記放熱板金の端部を終点とした連続する経路の１/４の長さを波長とする周波数の奇数倍の周波数と、前記電子部品が通電により発生する周波数とを異ならせた請求項１〜４のいずれか１項に記載の回路基板構造。   An odd number of frequencies having a wavelength of 1/4 of a continuous path starting from a connection point between the circuit board and the pressing spring and passing through the pressing spring from the starting point to an end of the heat radiating sheet metal The circuit board structure according to any one of claims 1 to 4, wherein a double frequency and a frequency generated by energization of the electronic component are different. 前記電子部品は、電子機器の筐体内に収納されるＣＰＵである請求項５に記載の回路基板構造。   The circuit board structure according to claim 5, wherein the electronic component is a CPU housed in a casing of an electronic device.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004327840A (en) * 2003-04-25 2004-11-18 Sony Corp Electronic apparatus
JP2009147382A (en) * 2009-03-25 2009-07-02 Toshiba Corp Electronic apparatus
JP2012084599A (en) * 2010-10-07 2012-04-26 Hitachi Ltd Heat sink connection body
WO2016051720A1 (en) * 2014-09-30 2016-04-07 パナソニックＩｐマネジメント株式会社 Shield cover and electronic apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004327840A (en) * 2003-04-25 2004-11-18 Sony Corp Electronic apparatus
JP2009147382A (en) * 2009-03-25 2009-07-02 Toshiba Corp Electronic apparatus
JP2012084599A (en) * 2010-10-07 2012-04-26 Hitachi Ltd Heat sink connection body
WO2016051720A1 (en) * 2014-09-30 2016-04-07 パナソニックＩｐマネジメント株式会社 Shield cover and electronic apparatus

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