JP2018091837A - Electronic component conveyance device and electronic component inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component conveyance device capable of accurately determining whether or not an electronic component remains on an electronic component placing section, and an electronic component inspection device.SOLUTION: An electronic component conveyance device comprises: a first holding section being movable in a first direction and a second direction different from the first direction and capable of holding an electronic component; a second holding section being movable in the first direction and the second direction independently from the first holding section and capable of holding the electronic component; a light irradiation section disposed so as to be able to irradiate an electronic component placing section placed with the electronic component with light through between the first holding section and the second holding section; and an imaging section capable of imaging the electronic component placing section irradiated with the light in the first direction. The electronic component conveyance device performs determination whether or not the electronic component is disposed on the electronic component placing section on the basis of an imaging result obtained by imaging it by the imaging section.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic component conveying device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, an electronic component inspection apparatus that inspects electrical characteristics of electronic components such as IC devices is known, and an electronic component conveyance apparatus for conveying an IC device is incorporated in the electronic component inspection apparatus. (For example, refer to Patent Document 1).

  In the electronic component conveying apparatus described in Patent Document 1, an image of a socket (inspection unit) for inspecting an electronic component is taken in a state where the electronic component is not being conveyed, and the image is used as reference image data. Stored in advance. And it is comprised so that the image of a socket may be imaged during conveyance of an electronic component, and the image may be compared with the said reference image data. Thereby, the conveyance abnormality etc. in a socket can be detected.

WO2006 / 109358

  However, in the electronic component inspection apparatus described in Patent Document 1, depending on the positional relationship between the conveyance unit (hand) and the socket, the electronic component inspection apparatus is blocked by the conveyance unit, and it is difficult to image the socket. As a result, there is a possibility of overlooking a conveyance abnormality in the socket.

  The present invention has been made to solve the above-described problems, and can be realized as the following.

The electronic component transport device of the present invention is movable in a first direction and a second direction different from the first direction, and a first gripping unit capable of gripping the electronic component,
A second gripper that is movable in the first direction and the second direction independently of the first gripper and capable of gripping an electronic component;
A light irradiating unit disposed between the first gripping unit and the second gripping unit so as to be able to irradiate light to the electronic component mounting unit on which the electronic component is mounted;
An imaging unit capable of imaging the electronic component placement unit irradiated with the light from the first direction;
Based on the imaging result imaged by the imaging unit, it is determined whether the electronic component is arranged on the electronic component placement unit.

  Thus, it is possible to detect whether or not the electronic component remains on the electronic component placement unit after the electronic component carrying operation with respect to the electronic component placement unit is performed. In particular, since the configuration is such that light is emitted from between the first gripping portion and the second gripping portion to the electronic component placement portion and an image thereof is captured, the first gripping portion and the second gripping portion are provided. Even if it is a structure, it can be detected whether the electronic component remains in the electronic component mounting part.

  In the electronic component transport device of the present invention, it is preferable that the first gripping portion and the second gripping portion are arranged side by side in the second direction.

  Thereby, it can be set as the structure which can move to a 2nd direction, with the 1st holding part and the 2nd holding part arranged in the 2nd direction. Therefore, for example, when the movable range of the first gripping part and the second gripping part extends in the second direction, the movement distance of the first gripping part and the second gripping part can be reduced, Excellent efficiency.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the first grip portion and the second grip portion are simultaneously movable in the second direction.

  Thereby, for example, the first grip portion and the second grip portion can perform different operations. Therefore, conveyance efficiency and inspection efficiency can be improved.

In the electronic component transport device of the present invention, the first gripping portion is positioned between the imaging unit and the electronic component when the electronic component is pressed against the electronic component placement unit,
The second gripping part is preferably located between the imaging part and the electronic part when the electronic part is pressed against the electronic part placing part.

  When the first holding unit or the second holding unit presses the electronic component against the electronic component placement unit, it is difficult for the imaging unit to image the electronic component. When the imaging unit is configured to capture an image only when the electronic component can be imaged, the imaging is performed when the first gripping unit or the second gripping unit presses the electronic component against the electronic component placement unit. Can be omitted, and it is possible to easily set at which timing imaging is omitted.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the light irradiation unit irradiates the light in a direction that intersects at least the first direction and is not orthogonal.

  Thereby, the change in the position of the irradiated light can be easily understood according to the presence or absence of the electronic component. Therefore, it is possible to more accurately detect whether or not the electronic component remains on the electronic component placement portion.

  In the electronic component transport device of the present invention, it is preferable that the direction of the light emitted by the light irradiation unit can be adjusted.

  Thereby, it can respond also to the electronic component mounting part from which the arrangement | positioning location of an electronic component differs, for example.

  In the electronic component transport apparatus according to the present invention, it is preferable that the electronic component transport apparatus includes an irradiation position determination unit that determines whether or not a direction in which the light irradiation unit irradiates the light is a predetermined direction.

  Thereby, it can be judged whether the direction in which a light irradiation part irradiates light is a predetermined direction.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the light irradiation unit irradiates the light with a linear shape extending in the second direction.

  Thereby, in the imaging result which the imaging part imaged, it can make it easy to understand the change of the position of the irradiated light according to the presence or absence of an electronic component. Therefore, it is possible to more accurately detect whether or not the electronic component remains on the electronic component placement portion.

In the electronic component conveying apparatus of the present invention, it is preferable that a plurality of the light irradiation units are provided.
Thereby, light can be irradiated to a plurality of places of the electronic component placement portion. Therefore, it is possible to determine whether or not the electronic component remains on the electronic component placement unit at a plurality of locations on the electronic component placement unit.

In the electronic component transport apparatus according to the present invention, the electronic component placement unit is arranged side by side along a third direction intersecting the first direction and the second direction, and includes a plurality of recesses that store the electronic component. Have
It is preferable that the light irradiation units are arranged side by side along the third direction.
Thereby, the light irradiation direction of each light irradiation part can be made the same direction.

In the electronic component transport apparatus according to the present invention, it is preferable that the electronic component transport apparatus includes a light reflecting unit that reflects the light emitted from the light irradiation unit.
Thereby, the freedom degree of arrangement | positioning of a light irradiation part can be raised.

In the electronic component transport device of the present invention, the light reflecting portion is configured to be rotatable,
The light reflecting portion has a light reflecting surface that reflects the light,
It is preferable that the rotation axis of the light reflecting portion is located on the light reflecting surface.

  Thereby, when rotating the light reflection part and adjusting the irradiation direction of light, the adjustment can be performed accurately.

In the electronic component transport device of the present invention, the light irradiation unit and the light reflection unit are provided in plural,
The light reflecting portions are preferably arranged side by side in a third direction that intersects the first direction and the second direction.

  Thereby, the arrangement form of the light reflecting portion can be simplified, and it contributes to space saving.

  In the electronic component transport apparatus according to the aspect of the invention, it is preferable that the imaging unit has an optical axis that intersects with an extension line in a direction in which the light reflecting units are arranged.

  Thereby, the imaging part can image the part by which the light reflected by each light reflection part was irradiated to the electronic component mounting part.

In the electronic component transport device of the present invention, the electronic component transport device includes a light reflection unit driving unit that rotates the light reflection unit,
Each of the light reflection unit driving units is arranged side by side along a third direction intersecting the first direction and the second direction,
It is preferable that the light reflection unit driving units adjacent to each other in the third direction are arranged so as to be shifted in the second direction.

  Thereby, even if the space | interval of the light reflection part drive parts is made comparatively small, it can prevent that the light reflection part drive parts adjacent in a 3rd direction mutually interfere, and aim at space saving. it can.

  In the electronic component transport device of the present invention, it is preferable to have a position detection unit that detects the position of the first holding unit or the second holding unit.

  Thereby, for example, the position of the first gripping part or the second gripping part when the imaging part can image the electronic component placing part can be detected.

  In the electronic component transport device according to the aspect of the invention, the imaging unit can capture the electronic component placement unit between the first gripping unit and the second gripping unit between the imaging start time and the imaging end time. Preferably there is.

  Thereby, it is possible to prevent the electronic component placement unit from taking an image when blocked by the first gripping part or the second gripping part. Therefore, imaging can be performed without waste.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the light irradiation unit irradiates the light before the imaging start time and stops the light irradiation after the imaging end time.

  Thereby, it can be set as the state which the light irradiation part is irradiating light, while the imaging part is imaging.

  In the electronic component transport device according to the aspect of the invention, it is preferable that the light irradiation unit emits the light when imaging is possible.

  Thereby, for example, it is possible to prevent the electronic component placement unit from capturing an image when blocked by the first gripping part or the second gripping part. Therefore, imaging can be performed without waste.

  In the electronic component transport apparatus of the present invention, it is preferable that the electronic component placement unit is an inspection unit that inspects the electronic component.

  Thereby, it is possible to detect whether or not the electronic component remains in the electronic component placement unit in the inspection unit. Therefore, inspection of electronic parts can be performed efficiently.

  In the electronic component transport device of the present invention, it is preferable that the first direction and the second direction are orthogonal to each other.

  Thereby, the control operation | movement which operates each part of an electronic component conveying apparatus can be performed easily.

In the electronic component transport device of the present invention, the electronic component placement unit has a recess for storing the electronic component,
The concave portion has an inner peripheral surface that inclines with respect to the third direction a direction intersecting with the first direction and the second direction,
It is preferable that an incident angle of the light emitted from the light irradiation unit is smaller than an angle formed between an inner peripheral surface of the recess and the third direction.

  Thereby, light can be irradiated to the electronic component in a recessed part. As a result, it can be detected whether or not the electronic component remains on the electronic component placement portion.

  In the electronic component conveying apparatus of the present invention, it is preferable that the determination can be performed on the electronic component having a thickness of 0.2 mm or more.

  Thereby, even if it is a comparatively thin electronic component, it can be detected whether it remains in the electronic component mounting part.

The electronic component inspection apparatus of the present invention is movable in a first direction and a second direction different from the first direction, and a first gripping part capable of gripping the electronic component,
A second gripper that is movable in the first direction and the second direction independently of the first gripper and capable of gripping an electronic component;
A light irradiating unit disposed between the first gripping unit and the second gripping unit so as to be able to irradiate light to the electronic component mounting unit on which the electronic component is mounted;
An imaging unit capable of imaging the electronic component placement unit irradiated with the light from the first direction;
An inspection unit for inspecting the electronic component,
Based on the imaging result imaged by the imaging unit, it is determined whether the electronic component is arranged on the electronic component placement unit.

  Thus, it is possible to detect whether or not the electronic component remains on the electronic component placement unit after the electronic component carrying operation with respect to the electronic component placement unit is performed. In particular, since the configuration is such that light is emitted from between the first gripping portion and the second gripping portion to the electronic component placement portion and an image thereof is captured, the first gripping portion and the second gripping portion are provided. Even if it is a structure, it can be detected whether the electronic component remains in the electronic component mounting part.

FIG. 1 is a schematic perspective view of a first embodiment of an electronic component inspection apparatus according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in FIG. FIG. 3 is a block diagram of the electronic component inspection apparatus shown in FIG. FIG. 4 is a perspective view showing an inspection area of the electronic component inspection apparatus shown in FIG. FIG. 5 is a perspective view showing an inspection area of the electronic component inspection apparatus shown in FIG. FIG. 6 is a perspective view of a detection unit provided in the electronic component inspection apparatus shown in FIG. FIG. 7 is a view of the detection unit provided in the electronic component inspection apparatus shown in FIG. 1 as viewed from below. FIG. 8 is a side view of a light irradiation unit provided in the electronic component inspection apparatus shown in FIG. FIG. 9 is a diagram for explaining the position of the rotation axis of the mirror included in the light irradiation unit shown in FIG. FIG. 10 is a schematic diagram for explaining the detection principle of the detection unit provided in the electronic component inspection apparatus shown in FIG. FIG. 11 is a cross-sectional view of an inspection unit provided in the electronic component inspection apparatus. FIG. 12 is an image (first image) of a concave portion of the inspection unit provided in the electronic component inspection apparatus shown in FIG. FIG. 13 is an image (first image) of the concave portion of the inspection unit provided in the electronic component inspection apparatus shown in FIG. FIG. 14 is an image (second image) of the concave portion of the inspection unit provided in the electronic component inspection apparatus shown in FIG. FIG. 15 is an image (second image) of the concave portion of the inspection unit provided in the electronic component inspection apparatus shown in FIG. FIG. 16 is a side view of the device transport head of the electronic component inspection apparatus shown in FIG. 1, and is a view for explaining the positional relationship between the device transport head and the detection unit. FIG. 17 is a side view of the device transport head of the electronic component inspection apparatus shown in FIG. 1 for explaining the positional relationship between the device transport head and the detection unit. FIG. 18 is a side view of the device transport head of the electronic component inspection apparatus shown in FIG. 1 for explaining the positional relationship between the device transport head and the detection unit. FIG. 19 is a side view of the device transport head of the electronic component inspection apparatus shown in FIG. 1, and is a view for explaining the positional relationship between the device transport head and the detection unit. FIG. 20 is a flowchart showing the control operation of the control unit provided in the electronic component inspection apparatus shown in FIG. FIG. 21 is a flowchart showing the control operation of the control unit provided in the second embodiment of the electronic component inspection apparatus of the present invention. FIG. 22 is a plan view of an inspection unit provided in the third embodiment of the electronic component inspection apparatus of the present invention. FIG. 23 is a diagram illustrating an image captured by the imaging unit included in the third embodiment of the electronic component inspection apparatus of the present invention. FIG. 24 is a flowchart showing the control operation of the control unit provided in the third embodiment of the electronic component inspection apparatus of the present invention. FIG. 25 is a block diagram of a fourth embodiment of the electronic component inspection apparatus of the present invention. FIG. 26 is a flowchart showing the control operation of the control unit provided in the fifth embodiment of the electronic component inspection apparatus of the present invention. FIG. 27 is a view for explaining the procedure for adjusting the light irradiation position in the fifth embodiment of the electronic component inspection apparatus of the present invention. FIG. 28 is a view for explaining the procedure for adjusting the light irradiation position in the fifth embodiment of the electronic component inspection apparatus of the present invention. FIG. 29 is a plan view of an inspection unit provided in the sixth embodiment of the electronic component inspection apparatus of the present invention. FIG. 30 is a timing chart of the light irradiation unit and the imaging unit in the seventh embodiment of the electronic component inspection apparatus of the present invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component conveying device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<First Embodiment>
Hereinafter, with reference to FIGS. 1-20, 1st Embodiment of the electronic component conveying apparatus and electronic component inspection apparatus of this invention is described. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as “X direction (third direction)”, a direction parallel to the Y axis is also referred to as “Y direction (second direction)”, and a direction parallel to the Z axis is referred to as “Z direction”. (First direction) ". The direction in which the arrow in each direction is directed is called “positive (+)”, and the opposite direction is called “negative (−)”. In addition, the term “horizontal” in the specification of the present application is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to the horizontal as long as transportation of electronic components is not hindered. In addition, the upper side in FIGS. 1, 4 to 11, and 16 to 19 may be referred to as “upper” or “upper”, and the lower side may be referred to as “lower” or “lower”. In particular, since the first direction and the second direction are orthogonal to each other, a control operation for operating each part of the electronic component transport apparatus 10 can be easily performed.

  The electronic component transport apparatus 10 of the present invention is movable in a Z direction that is a first direction and a Y direction that is a second direction that is different from the Z direction, and is capable of gripping the IC device 90 (first transport head 17A). 1 gripper) and the device transport head 17A (first gripper) can be moved independently in the Y and Z directions, and the device transport head 17B (second gripper) capable of gripping the IC device 90 The laser light source 41 (disposed so as to be able to irradiate the laser beam L to the inspection part 16 which is an electronic component placement part on which the IC device 90 is placed through between the device conveyance head 17A and the device conveyance head 17B. And a camera 31 as an imaging unit capable of imaging the inspection unit 16 irradiated with the laser light L from the Z direction, and based on the imaging result captured by the camera 31. , It is judged whether or not the IC device 90 is disposed in the inspection unit 16.

  Thereby, it is possible to detect whether or not the IC device 90 remains in the inspection unit 16 after performing the transport operation of the IC device 90 to the electronic component placement unit. In particular, since the configuration is such that light is emitted from between the device transport head 17A and the device transport head 17B to the inspection unit 16 and an image thereof is captured, the device transport head 17A and the device transport head 17B are included. Even if it exists, it is possible to detect whether or not the IC device 90 remains in the inspection unit 16.

  The electronic component transport apparatus 10 of the present invention is movable in a Z direction that is a first direction and a Y direction that is a second direction that is different from the Z direction, and is capable of gripping the IC device 90 (first transport head 17A). 1 gripper) and the device transport head 17A (first gripper) can be moved independently in the Y and Z directions, and the device transport head 17B (second gripper) capable of gripping the IC device 90 The laser light source 41 (disposed so as to be able to irradiate the laser beam L to the inspection part 16 which is an electronic component placement part on which the IC device 90 is placed through between the device conveyance head 17A and the device conveyance head 17B. A light irradiation unit), a camera 31 as an imaging unit capable of imaging the inspection unit 16 irradiated with the laser light L from the Z direction, and an inspection unit 16 that inspects the IC device 90. For example, based on the imaging result of the camera 31 is captured, it is determined whether or not the IC device 90 is disposed in the inspection unit 16.

  Thereby, the electronic component inspection apparatus 1 which has the advantage of the electronic component conveying apparatus 10 mentioned above is obtained. Further, the electronic component can be transported to the inspection unit 16, and therefore, the inspection unit 16 can inspect the electronic component. In addition, the inspected electronic component can be transported from the inspection unit 16.

  In the present specification, the second luminance only needs to be smaller than the first luminance, and includes a zero state, that is, a state where the light irradiation unit is not irradiating light.

Hereinafter, the configuration of each unit will be described.
As shown in FIGS. 1 and 2, an electronic component inspection apparatus 1 incorporating an electronic component transport apparatus 10 transports electronic components such as an IC device that is a BGA (Ball Grid Array) package, for example. This is an apparatus for inspecting and testing the electrical characteristics of parts (hereinafter simply referred to as “inspection”). In the following, for convenience of explanation, the case where an IC device is used as the electronic component will be described as a representative, and this will be referred to as “IC device 90”. In this embodiment, the IC device 90 has a flat plate shape.

  In addition to the above-mentioned IC devices, for example, “LSI (Large Scale Integration)”, “CMOS (Complementary MOS)”, “CCD (Charge Coupled Device)”, or “modules” in which a plurality of IC devices are packaged. IC "," quartz device "," pressure sensor "," inertial sensor (acceleration sensor) "," gyro sensor "," fingerprint sensor ", and the like.

  Also, the electronic component inspection apparatus 1 (electronic component transport apparatus 10) is used by mounting in advance a so-called “change kit” that is exchanged for each type of IC device 90. This change kit includes a mounting unit on which the IC device 90 is mounted. Examples of the mounting unit include a temperature adjustment unit 12 and a device supply unit 14 described later. In addition to the change kit as described above, the placement unit on which the IC device 90 is placed includes the inspection unit 16 and the tray 200 prepared by the user.

The electronic component inspection apparatus 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, a device collection area (hereinafter simply referred to as “collection area”) A4, The tray removal area A5 is provided, and these areas are divided by each wall as will be described later. Then, the IC device 90 passes through the respective areas in the direction of the arrow α ₉₀ from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3. As described above, the electronic component inspection apparatus 1 includes the handler that is the electronic component conveyance device 10 that conveys the IC device 90 in each region, the inspection unit 16 that performs inspection in the inspection region A3, and the control unit 800. It has become. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.

  In the electronic component inspection apparatus 1, the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 is the front side, and the inspection area A3 is arranged, that is, in FIG. The upper side is used as the back side.

  The tray supply area A1 is a material supply unit to which a tray 200 in which a plurality of untested IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

The supply area A2 is an area where a plurality of IC devices 90 on the tray 200 conveyed from the tray supply area A1 are conveyed and supplied to the inspection area A3. Note that tray transport mechanisms 11A and 11B that transport the tray 200 one by one in the horizontal direction are provided so as to straddle the tray supply area A1 and the supply area A2. The tray transport mechanism 11A is a moving unit that can move the tray 200 together with the IC device 90 placed on the tray 200 in the positive direction in the Y direction, that is, in the direction of the arrow _α11A in FIG. Thereby, the IC device 90 can be stably fed into the supply area A2. The tray transport mechanism 11B is a moving unit that can move the empty tray 200 in the negative direction in the Y direction, that is, in the direction of the arrow _α11B in FIG. Thereby, the empty tray 200 can be moved from the supply area A2 to the tray supply area A1.

  In the supply area A2, a temperature adjustment unit (soak plate (English notation: soak plate, Chinese notation (example): soaking plate)) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. .

  The temperature adjustment unit 12 is configured as a mounting unit on which a plurality of IC devices 90 are mounted, and is referred to as a “soak plate” that can heat or cool the mounted IC devices 90 in a lump. With this soak plate, the IC device 90 before being inspected by the inspection unit 16 can be heated or cooled in advance and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to any one of the temperature adjustment units 12. Note that the temperature adjustment unit 12 as the mounting unit is fixed, so that the temperature can be stably adjusted with respect to the IC device 90 on the temperature adjustment unit 12.

The device transport head 13 is supported so as to be movable in the X direction and the Y direction within the supply region A2, and further has a portion that can also move in the Z direction. As a result, the device transport head 13 transports the IC device 90 between the tray 200 loaded from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and a device supply unit 14 described later. It is possible to carry the IC device 90. In FIG. 2, the movement of the device transport head 13 in the X direction is indicated by an arrow α _13X , and the movement of the device transport head 13 in the Y direction is indicated by an arrow α _13Y .

Tray transporting mechanism 15, the positive side of the X direction empty tray 200 in a state where all of the IC devices 90 is removed in the feed region A2, i.e., a mechanism for conveying the arrow alpha ₁₅ direction. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area where the IC device 90 is inspected. In the inspection area A3, an inspection unit 16 for inspecting the IC device 90 and a device transport head 17 are provided. In addition, a device supply unit 14 that moves so as to straddle the supply region A2 and the inspection region A3 and a device recovery unit 18 that moves so as to straddle the inspection region A3 and the recovery region A4 are also provided.

  The device supply unit 14 is configured as a mounting unit on which the IC device 90 temperature-adjusted by the temperature adjusting unit 12 is mounted, and can transport the IC device 90 to the vicinity of the inspection unit 16 “supply shuttle plate” "Or simply called a" supply shuttle ".

The device supply unit 14 as the mounting portion is between the supply region A2 and the inspection area A3 X direction, i.e., are reciprocally movably supported along an arrow alpha ₁₄ direction. Thereby, the device supply unit 14 can stably transport the IC device 90 from the supply region A2 to the vicinity of the inspection unit 16 in the inspection region A3, and the IC device 90 is moved by the device transport head 17 in the inspection region A3. After being removed, it can return to the supply area A2.

  In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is transported to one of the device supply units 14. Further, like the temperature adjustment unit 12, the device supply unit 14 is configured to be able to heat or cool the IC device 90 placed on the device supply unit 14. Accordingly, the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 can be transported to the vicinity of the inspection unit 16 in the inspection area A3 while maintaining the temperature adjustment state.

The device transport head 17 is an operation unit that grips the IC device 90 in which the temperature adjustment state is maintained and transports the IC device 90 in the inspection area A3. The device transport head 17 is supported so as to be reciprocally movable in the Y direction and the Z direction in the inspection area A3, and is a part of a mechanism called “index arm”. Thereby, the device transport head 17 can transport and place the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16. In FIG. 2, the reciprocating movement of the device transport head 17 in the Y direction is indicated by an arrow α _17Y . The device transport head 17 is supported so as to be reciprocally movable in the Y direction, but is not limited thereto, and may be supported so as to be reciprocally movable in the X direction.

  In addition, the device transport head 17 is movable in a Z direction, which is the first direction, and a Y direction, which is a second direction different from the Z direction, and transports a device as a first gripper that can grip the IC device 90. The head 17 </ b> A and the device transport head 17 </ b> A are movable independently in the Y direction and the Z direction, and have a device transport head 17 </ b> B that is a second gripping part that can grip the IC device 90. In particular, as shown in FIGS. 18 and 19, the device transport head 17 </ b> A and the device transport head 17 </ b> B move in the Z direction independently of each other, so that both the device transport head 17 </ b> A and the device transport head 17 </ b> B are lowered. Thus, it is possible to prevent the imageable area from becoming small.

  The device transport head 17A as the first gripping part and the device transport head 17B as the second gripping part are arranged apart from each other in the Y direction which is the second direction. Accordingly, for example, the device transport head 17A is responsible for transporting the IC device 90 between the device supply unit 14 or the device recovery unit 18 on the −Y side of the test unit 16 and the test unit 16, and the test unit 16 The device transport head 17 </ b> A can transport the IC device 90 between the device supply unit 14 or the device collection unit 18 on the + Y side and the inspection unit 16. Therefore, the movement distance when viewed with the entire device transport head 17 can be reduced, and the transport efficiency is excellent.

  Further, the device transport head 17A as the first gripping part and the device transport head 17B as the second gripping part are simultaneously movable in the Y direction which is the second direction. Thereby, for example, when the device transport head 17A presses the IC device 90, the device transport head 17B operates differently (such as exchange of the IC device 90 with the device supply unit 14 or the device collection unit 18). Can be done and vice versa. Therefore, conveyance efficiency and inspection efficiency can be improved.

  Further, as shown in FIG. 1, the electronic component transport apparatus 10 includes an encoder as a position detection unit that detects the position of the device transport head 17A as the first gripping unit or the device transport head 17B as the second gripping unit. 23. In the present embodiment, the encoder 23 detects the positions of the device transport head 17A and the device transport head 17B in the Y direction and the Z direction, respectively. Thereby, as described later, for example, the positions of the device transport head 17A and the device transport head 17B when the camera 31 can image the inspection unit 16 can be detected. As shown in FIG. 3, the encoder 23 is electrically connected to the control unit 800, and position information of the device transport head 17 </ b> A and the device transport head 17 </ b> B is transmitted to the control unit 800.

  Similar to the temperature adjustment unit 12, the device transport head 17 is configured to be able to heat or cool the gripped IC device 90. Thereby, the temperature adjustment state in the IC device 90 can be continuously maintained from the device supply unit 14 to the inspection unit 16.

  As shown in FIGS. 4 and 5, the inspection unit 16 is an electronic component placement unit that places an IC device 90 that is an electronic component and inspects the electrical characteristics of the IC device 90. When viewed from the Z direction, the inspection unit 16 has a rectangular plate shape extending in the X direction. In addition, the inspection unit 16 has a plurality of (in the present embodiment, 16) recesses 161 for housing the IC device 90. Eight concave portions 161 are provided side by side in the X direction, and the eight rows are arranged in a lattice pattern in which two rows are provided in the Y direction. Moreover, as shown in FIG. 11, each recessed part 161 has the internal peripheral surface tapered. That is, each recess 161 has an inner peripheral surface 162 that is inclined with respect to the X direction, which is the third direction. In the configuration shown in FIGS. 4 and 5, each recess 161 is configured to open to the upper surface of the block body that protrudes from the upper surface of the inspection unit 16 toward the + Z side. However, the present invention is not limited to this. For example, the structure which abbreviate | omits the said block body and open | releases to the upper surface of the test | inspection part 16 may be sufficient.

  A plurality of probe pins (not shown) that are electrically connected to the IC device 90 (not shown) are provided at the bottom of the recess 161. Then, the end of the IC device 90 and the probe pin are electrically connected, that is, the IC device 90 can be inspected by contacting. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. Note that, similarly to the temperature adjustment unit 12, the inspection unit 16 can also heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for the inspection.

  The device collection unit 18 is configured as a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed and can transport the IC device 90 to the collection area A4. It is simply called the “collection shuttle”.

The device collecting section 18, X-direction between the examination region A3 and the collection area A4, i.e., are reciprocally movably supported along the arrow alpha ₁₈ direction. In the configuration shown in FIG. 2, two device collection units 18 are arranged in the Y direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 is one of the device collection units 18. Are transported to and placed. This transport is performed by the device transport head 17.

  The collection area A4 is an area in which a plurality of IC devices 90 that have been inspected in the inspection area A3 and completed the inspection are collected. In the collection area A4, a collection tray 19, a device conveyance head 20, and a tray conveyance mechanism 21 are provided. An empty tray 200 is also prepared in the collection area A4.

  The collection tray 19 is a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed, and is fixed so as not to move in the collection region A4. As a result, the inspected IC device 90 can be stably placed on the collection tray 19 even in the collection area A4 where a relatively large number of various movable parts such as the device transport head 20 are arranged. Become. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

  Three empty trays 200 are also arranged along the X direction. This empty tray 200 is also a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is conveyed and placed on either the recovery tray 19 or the empty tray 200. Thereby, the IC device 90 is classified and collected for each inspection result.

The device transport head 20 is supported so as to be movable in the X direction and the Y direction within the collection area A4, and further has a portion that can also move in the Z direction. Accordingly, the device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. In FIG. 2, the movement of the device transport head 20 in the X direction is indicated by an arrow α _20X , and the movement of the device transport head 20 in the Y direction is indicated by an arrow α _20Y .

Tray transfer mechanism 21, X-direction empty tray 200 is conveyed from the tray removal area A5 in the collection area A4, i.e., a mechanism for conveying the arrow alpha ₂₁ direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.

  The tray removal area A5 is a material removal unit from which the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

In addition, tray transport mechanisms 22A and 22B that transport the tray 200 one by one in the Y direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a moving unit that can reciprocate the tray 200 in the Y direction, that is, the arrow α _22A direction. Thus, the inspected IC device 90 can be transported from the collection area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can move the empty tray 200 for collecting the IC device 90 in the positive direction in the Y direction, that is, in the direction of the arrow α _22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the collection area A4.

  For example, the control unit 800 includes a tray transport mechanism 11A, a tray transport mechanism 11B, a temperature adjustment unit 12, a device transport head 13, a device supply unit 14, a tray transport mechanism 15, an inspection unit 16, and a device transport. The operation of each part of the head 17, the device recovery unit 18, the device transport head 20, the tray transport mechanism 21, the tray transport mechanism 22A, and the tray transport mechanism 22B can be controlled.

  As shown in FIG. 3, the control unit 800 includes a memory 802 (storage unit). The memory 802 includes, for example, an EEPROM (Electrically Erasable Programmable Read-Only Memory) which is a kind of nonvolatile semiconductor memory, and stores various programs such as the above-described inspection.

  As shown in FIG. 3, the control unit 800 determines whether or not the direction in which the laser light source 41, which will be described later, emits the laser light L, is a predetermined direction. Have Thereby, for example, it can be determined whether or not the direction in which the laser light source 41 emits the laser light L is a desired direction.

  The operator can set or confirm the operating conditions of the electronic component inspection apparatus 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is disposed at the upper part on the front side of the electronic component inspection apparatus 1. As shown in FIG. 1, a mouse table 600 on which a mouse is placed is provided on the right side of the tray removal area A5 in the drawing. This mouse is used when operating the screen displayed on the monitor 300.

  In addition, an operation panel 700 is arranged on the lower right side of FIG. The operation panel 700 instructs the electronic component inspection apparatus 1 to perform a desired operation separately from the monitor 300.

  Further, the signal lamp 400 can notify the operating state of the electronic component inspection apparatus 1 and the like by a combination of colors that emit light. The signal lamp 400 is disposed on the electronic component inspection apparatus 1. Note that the electronic component inspection apparatus 1 has a built-in speaker 500, and the operational state of the electronic component inspection apparatus 1 can also be notified by the speaker 500.

  As will be described later, the monitor 300 and the speaker 500 function as a notification unit 24 that notifies the result of the determination as to whether or not the IC device 90 is disposed in the recess 161 of the inspection unit 16. Thereby, the operator of the electronic component transport apparatus 10 can be notified of the determination result.

  In the electronic component inspection apparatus 1, the tray supply area A1 and the supply area A2 are separated by the first partition 231 and the supply area A2 and the inspection area A3 are separated by the second partition 232, The inspection area A3 and the collection area A4 are separated by a third partition wall 233, and the collection area A4 and the tray removal area A5 are separated by a fourth partition wall 234. The supply area A2 and the collection area A4 are also separated by the fifth partition wall 235.

  The outermost exterior of the electronic component inspection apparatus 1 is covered with a cover. Examples of the cover include a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

Next, the detection unit 2 will be described with reference to FIGS.
The detection unit 2 includes a first detection unit 2A and a second detection unit 2B. The first detection unit 2A and the second detection unit 2B are provided on the + Z side of the device transport head 17 (see FIG. 5), and are arranged in this order from the + X direction.

  As shown in FIGS. 4 and 5, each of the first detection unit 2 </ b> A and the second detection unit 2 </ b> B includes an imaging unit 3, a light irradiation unit 4, and an illumination 5. The first detection unit 2A and the second detection unit 2B have the same configuration except that the arrangement positions of the imaging unit 3, the light irradiation unit 4, and the illumination 5 are different. Hereinafter, the first detection unit 2A will be described. A representative explanation will be given.

The imaging unit 3 includes a camera 31 (imaging unit) and a mirror 32.
As the camera 31, for example, a CCD (Charge Coupled Device) camera can be used. Further, the camera 31 is arranged facing the −Y direction. As shown in FIG. 3, the camera 31 is electrically connected to a control unit 800 and its operation is controlled.

  As shown in FIGS. 4 and 5, the mirror 32 is provided on the −Y side of the camera 31. The mirror 32 has a light reflecting surface 321 that reflects light, and is installed in a state where the light reflecting surface 321 is inclined (for example, 45 °) with respect to the Y-axis direction. For this reason, the camera 31 can capture an image on the −Z side via the light reflecting surface 321. That is, the camera 31 can image the inspection unit 16 side.

  In addition, the camera 31 that is an imaging unit is arranged such that its optical axis intersects with an extension line in a direction (X direction) in which mirrors 42 that are light reflection units described later are arranged. As a result, the camera 31 can take an image of a portion where the light reflected by each mirror 42 is irradiated on the inspection unit 16.

  The light irradiation unit 4 is provided corresponding to each of the laser light sources 41 and the laser light L1 emitted from the laser light sources 41, as shown in FIGS. There are four mirrors 42 for reflection, and four motors 43 for rotating each mirror 42. That is, in the light irradiation unit 4, a plurality (four) of laser light sources 41 that are light irradiation units and mirrors 42 that are light reflection units are provided.

  A known laser light source can be used as the laser light source 41, and the color of the emitted laser light L1 is not particularly limited. The laser light source 41 as a light irradiation unit is a linear laser beam whose irradiation shape at the irradiation destination (the inspection device 16 or the IC device 90 on the inspection unit 16) extends in the Y direction (second direction). Irradiates L1 (light). As a result, as will be described later, in the image captured by the camera 31, it is possible to easily understand the change in the position of the irradiated laser light L1 depending on the presence or absence of the IC device 90. Therefore, it is possible to more accurately detect whether or not the IC device 90 remains in the inspection unit 16.

  Further, as shown in FIGS. 3 and 4, the laser light L <b> 1 emitted by the laser light source 41 is configured to include two concave portions 161 arranged in the Y direction in the inspection unit 16 that is the irradiation destination. That is, one laser light source 41 collectively irradiates the two concave portions 161 arranged in the Y-axis direction with the laser light L1. Four (plurality) of such laser light sources 41 (light irradiation units) are provided and arranged side by side along the X direction, which is the third direction. The eight concave portions 161 can be irradiated with the laser light L1. Then, the first detection unit 2A and the second detection unit 2B are provided with a total of eight laser light sources 41, so that each of the 16 concave portions 161 can be irradiated with the laser light L1.

  Moreover, as shown in FIG. 8, when viewed from the Y direction, each laser light source 41 is arranged to be inclined with respect to the X direction. For this reason, it is possible to prevent the laser light source 41 from interfering with the adjacent mirror 42. As a result, the distance in the X direction between the laser light source 41 and the mirror 42 can be made as small as possible, which contributes to the miniaturization of the light irradiation unit 4. In particular, in the electronic component transport apparatus 10, a space is limited on the + Z side of the device transport head 17, and by reducing the size of the light irradiation unit 4, it contributes to the miniaturization of the entire electronic component transport apparatus 10.

  Such a laser light source 41 is electrically connected to the controller 800 and its operation is controlled (see FIG. 3).

  4-9, the light irradiation unit 4 has the mirror 42 as a light reflection part which reflects the laser beam L1 which the laser light source 41 which is a light irradiation part radiate | emitted. Thereby, the laser light source 41 can be arranged regardless of the direction of the laser light source 41. Therefore, the freedom degree of arrangement | positioning of the laser light source 41 can be raised.

  The mirror 42 has a reflection surface 421 that reflects the laser light L1 and is disposed so that the reflection surface 421 faces the laser light source 41 side.

  The mirrors 42 are arranged side by side in the X direction (third direction) intersecting the Z direction (first direction) and the Y direction (second direction). Thereby, while being able to match with the arrangement form of each laser light source 41, the arrangement form of each mirror 42 can be simplified.

  Moreover, the light irradiation unit 4 has four motors 43 as light reflection unit driving units that rotate a mirror 42 as a light reflection unit. Since the mirror 42 is configured to be rotatable, the direction of the reflection surface 421 of the mirror 42 can be adjusted, and the irradiation position of the laser light L1 can be adjusted.

  The mirror 42 is connected to the motor 43 so that the rotation axis O is positioned on the light reflecting surface. Thereby, when rotating the mirror 42 and adjusting the irradiation direction of the laser beam L1, the adjustment can be performed accurately.

  As described above, in the electronic component transport apparatus 10, the direction of the laser light L1 emitted by the laser light source 41 as the light irradiation unit can be adjusted, so that the irradiation position of the laser light L1 in the inspection unit 16 can be adjusted, The arrangement | positioning location of the recessed part 161 can respond also to the test | inspection part different from the structure shown in FIG. 4 and FIG.

  Further, the laser light source 41 that is a light irradiating unit is adjusted to irradiate light in a direction that is at least inclined with respect to the Z direction that is the first direction, that is, intersects and does not orthogonally, as will be described later. As described above, the change in the position of the irradiated laser beam L1 can be easily understood in accordance with the presence or absence of the IC device 90.

  Moreover, each motor 43 as a light reflection part drive part is arrange | positioned along with the X direction which is a 3rd direction. The motors 43 adjacent to each other in the X direction are arranged so as to be shifted in the Y direction, which is the second direction, and have a so-called staggered arrangement. Thereby, even if the distance between the motors 43 in the X direction is relatively small, it is possible to prevent the motors 43 adjacent in the X direction from interfering with each other. As a result, the light irradiation unit 4 can be downsized.

  The illumination 5 (second light irradiation unit) irradiates light L2 having a lower luminance than the laser light L1. The light L2 has a lower directivity than the laser light L1, and is configured to illuminate the entire inspection unit 16. The illumination 5 is a second light irradiation unit (light irradiation unit) that emits light L2 having a lower luminance than the laser light source 41 that is a light irradiation unit. Thereby, it is possible to irradiate the light L2 under an irradiation condition (for example, directivity lower than the laser light L1) that is insufficient for the light emitted from the laser light source 41. The illumination 5 is arranged on the + X side of the light irradiation unit 4. In the present invention, the light irradiation unit includes the laser light source 41 that is the first light irradiation unit and the illumination 5 that is the second light irradiation unit.

  Moreover, the illumination 5 which is a 2nd light irradiation part can adjust the brightness | luminance of the light L2 which the illumination 5 radiate | emits by this because the brightness | luminance of the emitted light can be adjusted. Therefore, an image with better conditions can be used in the determination described later.

  Such a detection unit 2 can detect the presence or absence of the IC device 90 in the recess 161 of the inspection unit 16. Hereinafter, this principle will be described with reference to FIG. 10 to FIG. 13, but since the same detection is performed in each recess 161, detection in one recess 161 will be representatively described.

  FIG. 10 is a diagram schematically showing the detection unit 2 and is a view of the detection unit 2 viewed from the Y direction. In FIG. 10, laser light L <b> 1 is emitted from the laser light source 41 toward the inspection unit 16. When the IC device 90 is placed on the inspection unit 16 (hereinafter, this state is referred to as “residual state”), the laser beam L1 is irradiated to the position P1 on the IC device 90, and this position P1. A line having a linear irradiation shape is formed. On the other hand, when the IC device 90 is not on the inspection unit 16 (hereinafter, this state is referred to as “removed state”), the laser beam L1 is irradiated to the position P2 at the bottom of the concave portion 161 of the inspection unit 16, A line having a linear irradiation shape is formed at the position P2. In this specification, “linear” means a long line such as a single straight line, a set of points separated from each other and aligned in one direction, an ellipse, a rectangle, etc. Say.

  The camera 31 captures an image (first image) in the remaining state and the removed state, respectively. FIG. 12 shows a part of the image D1 captured by the camera 31 in the remaining state, and FIG. 13 shows a part of the image D2 captured by the camera 31 in the removed state.

  As illustrated in FIG. 12, in the image D <b> 1, the line position P <b> 1 on the IC device 90 is shifted to the −X side with respect to the line position P on the upper surface of the inspection unit 16. This is because the upper surface of the IC device 90 is located lower than the upper surface of the inspection unit 16, that is, on the −Z side. Note that a deviation amount in the X direction between the position P and the position P1 is defined as a deviation amount ΔD1.

  On the other hand, as shown in FIG. 13, in the image D <b> 2, the line position P <b> 1 on the bottom of the recess 161 is shifted to the −X side from the line position P on the upper surface of the inspection unit 16. This is because the bottom of the recess 161 is located lower than the upper surface of the inspection unit 16, that is, on the −Z side. Note that a deviation amount in the X direction between the position P and the position P2 is defined as a deviation amount ΔD2.

  Further, the deviation amount ΔD1 is smaller than the deviation amount ΔD2. This is because the upper surface of the IC device 90 is located on the + Z side with respect to the bottom of the recess 161. The electronic component transport apparatus 10 can detect (determine) whether it is a residual state or a removed state, for example, based on whether the shift amount in the images D1 and D2 is the shift amount ΔD1 or the shift amount ΔD2.

  Here, the thinner the thickness Δd of the IC device 90, the more difficult it is to determine whether it is the shift amount ΔD1 or the shift amount ΔD2. Therefore, it is necessary to use the camera 31 having a relatively high resolution to determine whether the IC device 90 is relatively thin or not. Specifically, in FIG. 10, an angle Δα formed by a line segment connecting the position P1 and the center (optical axis) of the camera 31 and a line segment connecting the position P2 and the center (optical axis) of the camera 31. Can be determined whether the remaining state or the removed state. For example, if the thickness Δd of the IC device 90 is known, what angle Δα should be used, and if the resolution of the camera 31 is known, the IC device 90 having the thickness Δd. In order to know whether the above determination is possible, the present inventors have derived the following two formulas (1) and (2).

The angle between the line segment connecting the position P2 and the center (optical axis) of the camera 31 and the X axis is α, the angle between the optical axis of the laser beam L1 and the X axis is β, and the light from the camera 31 When the distance between the shaft and the bottom of the concave portion 161 is d _cam , the thickness Δd of the IC device 90 can be expressed by Equation (1), and the angle Δα can be expressed by Equation (2).

  For example, if the angle Δα is known, the minimum thickness Δd of the IC device 90 that can be determined can be known by substituting it into the equation (1). If the thickness Δd is known, the resolution required for the camera 31 can be known by substituting it into the equation (2).

  It is preferable that the determination can be made for an IC device 90 having a thickness Δd of 0.2 mm or more, and the determination can be made for an electronic component having a thickness of 0.1 mm or more. Is more preferable. Thereby, even if the IC device 90 is relatively thin, it can be detected whether or not the IC device 90 remains in the inspection unit 16. If the thickness Δd is too thin, it is necessary to use a camera 31 with a relatively high resolution, which is expensive.

  Further, as shown in FIG. 11, the incident angle θ1 of the laser light L1 emitted from the laser light source 41 that is the light irradiating unit is based on an angle θ2 formed by the inner peripheral surface 162 of the concave portion 161 and the X direction that is the third direction. Is also small. Thereby, the laser beam L1 can be irradiated into the recess 161. As a result, it can be detected whether or not the IC device 90 remains in the recess 161.

  The determination using the laser beam L1 (first determination) has been described above. The electronic component transport apparatus 10 can make a determination (second determination) using a method different from the first determination. Hereinafter, this will be described with reference to FIGS. 14 and 15.

  14 and 15 show an image (second image) obtained by irradiating the inspection unit 16 with the illumination 5 and illuminating the inspection unit 16 using the camera 31 in this state. FIG. 14 shows a part of the image D1 'in the remaining state, and FIG. 15 shows a part of the image D2' in the removed state.

The electronic component transport apparatus 10 detects (determines) a residual state or a removed state by detecting a difference in color or brightness of the IC device 90 based on the captured images D1 ′ and D2 ′. Can do.
Thus, the electronic component transport apparatus 10 can make the first determination and the second determination.

  Now, in the electronic component transport apparatus 10, it is difficult to secure a space for installing the detection unit 2. For example, even if the detection unit 2 is arranged in the vicinity of the inspection unit 16, that is, at a position away from the inspection unit 16 when viewed from the Z direction, the irradiable range of the laser light L 1 and the light L 2 is limited, or the camera The 31 imageable areas are limited. In view of the above, it is preferable to arrange the head directly above the inspection unit 16, that is, on the + Z side of the inspection unit 16, but the device transport head 17 is provided on the inspection unit 16 + Z side.

  Therefore, in the electronic component transport apparatus 10, the detection unit 2 is arranged on the + Z side of the device transport head 17, and the detection is performed through the gap S between the two device transport heads 17A and 17B. . That is, at least one of the laser light L1 and the light L2 is irradiated toward the inspection unit 16 via the gap S, and an image is captured using the camera 31 via the gap S. It was set as the structure which performs at least one of 2 judgments. Thereby, even if it is the said structure, it can detect (determine) correctly whether it is a residual state or a removal state.

  In addition, since the gap S is relatively narrow, it may be difficult for the camera 31 to image the entire area of the inspection unit 16, particularly the entire region of the inspection unit 16 in the Y-axis direction. Therefore, as shown in FIG. 16, during the movement of the device transport head 17, imaging is performed when eight concave portions 161 on the −Y side among the sixteen concave portions 161 can be imaged, as shown in FIG. 17. In addition, the imaging is performed when the eight concave portions 161 on the + Y side can be imaged. Thereby, even if it is difficult to image the entire area of the inspection unit 16 in the Y-axis direction, each recess 161 can be imaged based on a plurality of images, and whether each recess 161 is in a residual state or a removed state. It can be detected (judged). Note that the position of the device transport head 17 in a state where imaging is possible is detected by the encoder 23, and the encoder value when imaging is possible is stored in the memory 802.

  In the electronic component transport apparatus 10, when the device transport head 17A (first holding unit) presses the IC device 90 against the inspection unit 16 (electronic component placement unit), the device transport head 17A There is a case where it is located between the camera 31 (imaging unit) and the IC device 90 (see FIG. 18). In this case, the device transport head 17A blocks and it becomes difficult to image the eight concave portions 161 on the -Y side. On the other hand, when the device transport head 17B (second gripping unit) presses the IC device 90 against the inspection unit 16 (electronic component placement unit), the device transport head 17B is connected to the camera 31 (imaging unit). It may be located between the IC device 90 (see FIG. 19). In this case, the device transport head 17B blocks and it becomes difficult to image the eight concave portions 161 on the + Y side. When this problem is used, for example, when the camera 31 is configured to capture an image only when the IC device 90 can capture an image, the timing at which imaging is difficult is known. Setting can be performed easily. As a result, it is possible to prevent useless images from being taken.

  In addition, the camera 31 serving as the imaging unit has an inspection unit 16 (from the device transport head 17A (first gripping unit) and the device transport head 17B (second gripping unit) between the imaging start time and the imaging end time. The electronic component placement unit) can be imaged. That is, imaging is omitted when the inspection unit 16 is blocked by the device transport head 17A or the device transport head 17B. Therefore, it is possible to take an image without waste, and it is possible to prevent wasteful increase in image data.

  Next, the control operation of the control unit 800 will be described based on the flowchart shown in FIG. The following control operation is a control operation in a state where the IC device 90 is transported to the inspection unit 16 for inspection and the IC device 90 is removed from the inspection unit 16.

  First, in step S101, the laser light source 41 is operated to irradiate each recess 161 with the laser light L1 (see FIG. 5). At this time, in this embodiment, the illumination 5 is turned off. Thereby, the line of the laser beam L1 can be made to stand out in the image D1 or the image D2 obtained in the next step S102.

  Next, in step S <b> 102, the inspection unit 16 is imaged using the camera 31. Thereby, an image D1 (first image) or an image D2 (first image) as shown in FIG. 12 or 13 can be obtained. Note that the imaging in step S102 is performed in the imaging enabled state shown in FIGS. Note that when the imaging is finished, the irradiation of the laser beam L1 is stopped.

  Next, in step S103, it is determined whether the remaining state or the removed state. In the present embodiment, an image D2 having a deviation amount ΔD2 is acquired in advance and stored in the memory 802, and a determination is made as to whether the residual state or the removal state is based on the deviation amount of the laser light L1 in the image D2. . If it is determined in step S103 that the remaining state is present, the process proceeds to step S105 described later.

  If it is determined in step S104 that the device is in the removed state, it is determined whether or not a gripping abnormality has occurred in the device transport head 17. Note that the gripping abnormality refers to a state in which the device transport head 17 does not grip the IC device 90, for example. This gripping abnormality is performed, for example, by detecting the suction pressure of the device transport head 17.

  If it is determined in step S104 that a gripping abnormality has occurred, that is, if it is determined that the IC device 90 (electronic component) is disposed in the inspection unit 16 that is an electronic component placement unit, the device that is the gripping unit The operation of the transport head 17 is stopped. In step S105, the movement is stopped while holding the IC device 90. Thereby, it is possible to prevent the conveyance operation from being continued in the residual state.

  In step S106, the illumination 5 is turned on to irradiate the entire inspection unit 16 with the light L2.

  Next, in step S <b> 107, the inspection unit 16 is imaged by the camera 31. Thereby, an image D1 ′ (second image) or an image D2 ′ (second image) as shown in FIG. 14 or 15 can be obtained. Note that the imaging in step S107 is performed in the imaging enabled state shown in FIGS.

  Next, in step S108, it is determined whether the residual state or the removed state. In step S108, as described above, based on the captured image D1 'and image D2', a difference in color or brightness of the IC device 90 is detected to determine whether it is in a residual state or a removal state. In the present embodiment, an image D2 'in a removed state is acquired in advance, stored in the memory 802, and compared with the obtained image D1' or image D2 '.

  If it is determined in step S108 that the state is the remaining state, in step S109, the remaining state is notified. This notification is performed by operating the notification unit 24. By this notification, the operator can remove the IC device 90 of the inspection unit 16 and eliminate the remaining state. Then, for example, the operator can press a transport restart button by using the operation panel 700.

  If it is determined in step S110 that the restart button has been pressed, it is determined in step S111 whether it is a residual state or a removed state. In this step, when the restart button is pressed, a new image is taken, and based on the image, it is determined whether it is a residual state or a removal state, as in step S108. If it is determined in step S111 that the state is the removal state, the conveyance is resumed in step S112.

  As described above, in the present embodiment, the determination (first determination) is performed based on the image D1 or the image D2 that is the first image, and then the determination (first determination) is performed based on the image D1 ′ or the image D2 ′ that is the second image. 2 judgment). As described above, since the first image and the second image captured by irradiating light with different luminances are used to determine whether the remaining state or the removed state is obtained in two stages, the determination can be performed more accurately.

  Further, in the electronic component transport apparatus 10, the above determination can be applied to the device transport head 13 and the device transport head 20, but by applying to the device transport head 17 in the inspection area A3, that is, the electronic component mounting. The placement unit is preferably the inspection unit 16 in which the IC device 90 is inspected. Thereby, the inspection unit 16 can determine whether the residual state or the removed state, whereby the IC device 90 can be efficiently inspected.

  As described above, according to the electronic component transport apparatus 10, a first image obtained by imaging the inspection unit 16 (electronic component placement unit) in a state where the laser light source 41 as the light irradiation unit emits the laser beam L 1 having the first luminance. The image D1 or the image D2 that is one image and the image D1 ′ or the image that is the second image obtained by capturing the inspection unit 16 in a state where the laser light source 41 emits the light L2 having the second luminance smaller than the first luminance. Based on at least one of the images D2 ′, it is determined whether or not the IC device 90, which is an electronic component, is arranged in the inspection unit 16.

  Thus, it is possible to detect whether or not the electronic component remains on the electronic component placement unit after the electronic component carrying operation with respect to the electronic component placement unit is performed. In particular, since it is determined whether or not the IC device 90 remains in the inspection unit 16 based on at least one of two images captured by irradiating light with different luminances, the determination is more accurate. Can be done.

  In this embodiment, as an example, the determination in step S111 has been described for the case where the second determination is performed. However, the first determination may be configured, and the first determination and the second determination are sequentially performed. It may be. In particular, when the first determination and the second determination are sequentially performed, that is, when the same control as in steps S101 to S108 is performed in step S111, it can be more accurately determined whether the residual state or the removal state.

  The second luminance only needs to be lower than the first luminance, and includes a zero state, that is, a state where the illumination 5 does not irradiate the light L2.

Second Embodiment
Hereinafter, the second embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to FIG. 21, but the description will focus on the differences from the above-described embodiment, and the same matters will be described. Is omitted.

  This embodiment is substantially the same as the first embodiment except that the control operation of the control unit is different.

  The following control operation is a control operation in a state where the IC device 90 is transported to the inspection unit 16 for inspection and the IC device 90 is removed from the inspection unit 16.

  First, in step S201, it is selected whether to perform the first determination or the second determination. In step S <b> 201, at least one of the irradiation conditions of the laser light source 41 and the illumination 5 that are the light irradiation unit, the color of the inspection unit 16 (electronic component placement unit), the color of the IC device 90 (electronic component), and the resolution of the camera 31. Based on one condition, an image to be used for determining whether the state is the remaining state or the removed state is selected from the first image (images D1 and D2) and the second image (images D1 ′ and D2 ′). As a result, an image with better conditions can be used when determining whether the state is the remaining state or the removed state. Therefore, it is possible to more accurately determine whether or not the IC device 90 remains in the inspection unit 16.

  The irradiation conditions include, for example, the emission angle of the laser light L, the brightness of the laser light L1, the brightness of the light L2, and the like. A calibration curve between these conditions and, for example, the brightness in the inspection area A3 can be stored in the memory 802 in advance, and the determination in step S201 can be performed based on the calibration curve.

  When it is determined in step S201 that the first image is used, in step S202, the laser light source 41 is operated to irradiate each concave portion 161 with the laser light L1 (see FIG. 5).

  In step S203, the inspection unit 16 is imaged using the camera 31. Thereby, an image D1 (first image) or an image D2 (first image) as shown in FIG. 12 or 13 can be obtained.

  Next, in step S204, as in step S103 of the first embodiment, it is determined whether the state is a residual state or a removed state. If it is determined in step S204 that the device is in the remaining state, the operation of the device transport head 17 is stopped in step S205, and the notification unit 24 notifies the remaining state in step S206.

  If it is determined in step S207 that the restart button has been pressed, the operation of the device transport head 17 is restarted in step S208.

  If it is determined in step S201 that the second image is to be used, the illumination 5 is turned on in step S209, and the inspection unit 16 is imaged by the camera 31 in step S210 to obtain a second image. In step S211, it is determined whether the remaining state or the removed state, as in step S108 in the first embodiment. If it is determined in step S211 that the state is the remaining state, the process proceeds to step S205, and the following steps are performed.

  Also in the present embodiment, when it is determined in step S207 that the restart button has been pressed, it is preferable to perform the first determination and the second determination as in the first embodiment before executing step S208. .

<Third Embodiment>
Hereinafter, a third embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to FIGS. 22 to 24. However, the difference from the above-described embodiment will be mainly described, and similar matters will be described. Will not be described.

  This embodiment is substantially the same as the first embodiment except that the control operation of the control unit is different.

  As shown in FIG. 22, in the present embodiment, an illuminance sensor 25 that detects illuminance is provided on the + X side of the inspection unit 16. Although not shown, the illuminance sensor 25 is electrically connected to the control unit 800, and information on the illuminance detected by the illuminance sensor 25 is transmitted to the control unit 800.

  Further, a marker 26 is provided in the vicinity of the end on the −X axis side on the upper surface of the inspection unit 16. The marker 26 is configured by a colored portion having areas with different colors.

  Next, the control operation of the control unit 800 in the present embodiment will be described with reference to the flowchart shown in FIG. 24. The following control operation is performed by carrying the IC device 90 to the inspection unit 16 for inspection. This is a control operation in a state where the IC device 90 is removed from the unit 16.

  First, in step S301, the laser light source 41 and the illumination 5 are turned on. At this time, in order to make the laser light L1 stand out, it is preferable to reduce the luminance of the light L2. However, if the luminance of the light L2 is too small, it may be difficult to make the second determination accurately. .

  Therefore, in step S302, the brightness of at least one of the laser light L1 and the light L2 is adjusted. This adjustment is performed at least one of the laser light source 41 and the illumination 5 according to information on the illuminance detected by the illuminance sensor 25 (brightness in the inspection area A3) or information obtained from the luminance distribution of the image. This is done by adjusting the output.

  In this adjusted state, in step S303, the camera 31 is used to capture an image D3 shown in FIG. This image D3 is larger than the images D1 and D2 shown in FIGS. 12 and 13, and the peripheral portion of the recess 161 is also captured.

  In step S304, it is determined whether the residual state or the removed state. The determination in step S304 is performed in the same manner as step S108 in the first embodiment and step S211 in the second embodiment. In step S304, for example, as shown in FIG. 23, even if the IC device 90 is unintentionally arranged on the upper surface of the inspection unit 16, this can be detected. In this embodiment, this case is also included in the residual state. In particular, when the IC device 90 is unintentionally arranged on the upper surface of the inspection unit 16, the position of the line of the laser light L <b> 1 in the X direction is shifted on the upper surface of the IC device 90 in this embodiment. For this reason, it is possible to accurately detect that the IC device 90 has been unintentionally arranged on the upper surface of the inspection unit 16.

  If it is determined in step S304 that the device is in the remaining state, the operation of the device transport head 17 is stopped in step S305, and the notification unit 24 notifies the remaining state in step S306.

  If it is determined in step S307 that the resume button has been pressed, the operation of the device transport head 17 is resumed in step S308.

  Also in the present embodiment, when it is determined in step S307 that the restart button has been pressed, the first determination and the second determination are performed in the same manner as in the first and second embodiments before executing step S308. Is preferably performed.

<Fourth embodiment>
Hereinafter, the fourth embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to FIG. 25. The description will focus on the differences from the above-described embodiment, and the same matters will be described. Is omitted.

  This embodiment is the same as the first embodiment except that two cameras are provided.

  As shown in FIG. 25, in the present embodiment, the imaging unit includes a camera 31 that is a first imaging unit that captures images D1 and D2 that are first images, and images D1 ′ and D2 ′ that are second images. A camera 33 serving as a second imaging unit for imaging; In other words, in the present embodiment, a dedicated camera 31 that captures the images D1 and D2 and a dedicated camera 33 that captures the images D1 'and D2' are configured. For this reason, the camera 31 can have a relatively high resolution, and the camera 33 can have a lower resolution than the camera 31. As a result, in the second determination, the time required for data exchange between the control unit 800 and the camera 33 can be reduced.

<Fifth Embodiment>
Hereinafter, the fifth embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to FIG. 26. The description will focus on the differences from the above-described embodiment, and the same matters will be described. Is omitted.

  This embodiment is the same as the first embodiment except that the control operation of the control unit 800 is different.

  Hereinafter, the control operation of the control unit 800 in the present embodiment will be described with reference to the flowchart shown in FIG. 26. The following control operation is performed before the IC device 90 is transported to the inspection unit 16 and inspected. This is a control operation to be performed.

  First, as shown in step S401, the illumination 5 is activated to emit light L2. And the test | inspection part 6 is imaged with the camera 31 (step S402). Next, in step S403, the illumination 5 is turned off.

  Next, in step S404, the laser light source 41 is operated to irradiate the inspection unit 16 with the laser light L1, and the inspection unit 16 is imaged by the camera 31 in this state (step S405).

  In step S406, the motor 43 of the mirror 42 is rotated to adjust the irradiation position of the laser light L1. In this adjustment, the center position Pc is determined in the image captured in step S402 (see FIG. 27), the coordinates of the center position Pc are stored, and in the image captured in step S405, the laser beam L1 is Adjustment is performed until it is positioned at Pc (see FIG. 28). Thereby, the laser beam L1 can be irradiated to the recessed part 161 more reliably. In particular, the number and arrangement of the recesses 161 of the inspection unit 16 may vary from test to test. In this case, an image can be acquired in accordance with the position of the recess 161 of the inspection unit 16.

  In the present embodiment, the adjustment of the laser beam L1 is performed based on a calibration curve between the rotation angle of the mirror 32 and the irradiation position of the laser beam L1.

<Sixth Embodiment>
Hereinafter, the sixth embodiment of the electronic component transport apparatus and the electronic component inspection apparatus of the present invention will be described with reference to FIG. 29. The difference from the above-described embodiment will be mainly described, and the same matters will be described. Is omitted.

  This embodiment is the same as the fifth embodiment except that the inspection unit is provided with a marker and a display unit.

  As shown in FIG. 29, in this embodiment, a marker 27 and a display unit 28 are provided on the upper surface of the inspection unit 16.

  The marker 27 is provided at the edge of each recess 161 and indicates the center position Pc of the recess 161 in the X direction. By matching the irradiation position of the laser beam L1 with the marker 27, the imaging in step S402 can be omitted. Therefore, the adjustment process of the irradiation position of the laser beam L1 can be simplified.

  Moreover, the display part 28 is comprised by the two-dimensional barcode, for example. After completion of the adjustment process of the irradiation position of the laser beam L1, the display unit 28 can be read and the irradiation position of the laser beam L1 and the information on the display unit 28 can be linked and stored in the memory 802. Thereby, for example, even if the inspection unit 16 having a different arrangement form of the recess 161 for each inspection is used, the irradiation position of the laser light L1 can be known by reading the display unit 28. That is, the reproducibility of the irradiation position of the laser beam L1 can be improved. Therefore, it is possible to easily adjust the irradiation position of the laser light L1.

<Seventh embodiment>
Hereinafter, the seventh embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to FIG. 30, but the description will focus on the differences from the above-described embodiment, and the same matters will be described. Is omitted.

  This embodiment is the same as the first embodiment except that the light emission timing is different.

  In the present embodiment, the laser light source 41 irradiates the laser light L1 intermittently. In other words, the laser light source 41 is configured to alternately repeat irradiation and stopping of the laser light L1. The laser power in this embodiment is set according to IEC 60825-1: 2014, and JIS is set according to C 6802: 2014. This ensures operator safety.

  In the timing chart shown in FIG. 30, the upper chart in the drawing shows the camera 31, and the lower chart in the drawing shows the laser light source 41. As shown in FIG. 30, in this embodiment, the laser light source 41, which is a light irradiation unit, irradiates the laser light L1 before the imaging start time t1, and irradiates the laser light L1 after the imaging end time t2. Stop. Thereby, while the camera 31 is imaging, it can be set as the state which is irradiating the test | inspection part 16 with the laser beam L1.

  Further, by adopting a configuration in which the laser light source 41, which is a light irradiation unit, irradiates the laser light L1 when imaging is possible, it is possible to prevent the inspection unit from imaging when blocked by the device transport head 17. it can. Therefore, imaging can be performed without waste.

  As mentioned above, although the electronic component conveyance apparatus and electronic component inspection apparatus of this invention were demonstrated about embodiment of illustration, this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus Can be replaced with any structure capable of performing the same function. Moreover, arbitrary components may be added.

  Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  In the electronic component conveying apparatus of the present invention, the imaging unit may capture a full-color image or a monochrome image.

DESCRIPTION OF SYMBOLS 1 ... Electronic component inspection apparatus, 2 ... Detection unit, 2A ... 1st detection unit, 2B ... 2nd detection unit, 3 ... Imaging unit, 4 ... Light irradiation unit, 5 ... Illumination, 10 ... Electronic component conveyance apparatus, 11A ... Tray transport mechanism, 11B ... Tray transport mechanism, 12 ... Temperature adjustment section, 13 ... Device transport head, 14 ... Device supply section, 15 ... Tray transport mechanism, 16 ... Inspection section, 17 ... Device transport head, 17A ... Device transport head , 17B ... Device transport head, 18 ... Device recovery section, 19 ... Recovery tray, 20 ... Device transport head, 21 ... Tray transport mechanism, 22A ... Tray transport mechanism, 22B ... Tray transport mechanism, 23 ... Encoder, 24 ... Notification 25: Illuminance sensor 26 ... Marker 27 27 Marker 28 Display unit 31 Camera 32 Mirror 33 , 41 ... laser light source, 42 ... mirror, 43 ... motor, 90 ... IC device, 161 ... recess, 162 ... inner peripheral surface, 200 ... tray, 231 ... first partition, 232 ... second partition, 233 ... third Bulkhead, 234 ... Fourth bulkhead, 235 ... Fifth bulkhead, 241 ... Front cover, 242 ... Side cover, 243 ... Side cover, 244 ... Rear cover, 245 ... Top cover, 300 ... Monitor, 301 ... Display screen, 321 ... Light Reflection surface, 400 ... signal lamp, 421 ... reflection surface, 500 ... speaker, 600 ... mouse table, 700 ... operation panel, 800 ... control unit, 801 ... irradiation position determination unit, 802 ... memory, A1 ... tray supply area, A2 ... supply area, A3 ... inspection area, A4 ... collection area, A5 ... tray removal area, D1 ... image, D1 '... image, D2 ... image, D2' ... Image, D3 ... Image, L1 ... Laser light, L2 ... Light, O ... Rotation axis, P ... Position, P1 ... Position, P2 ... Position, Pc ... Center position, S ... Gap, S101 ... Step, S102 ... Step, S103 ... Step, S104 ... Step, S105 ... Step, S106 ... Step, S107 ... Step, S108 ... Step, S109 ... Step, S110 ... Step, S111 ... Step, S112 ... Step, S201 ... Step, S202 ... Step, S203 ... Step, S204 ... Step, S205 ... Step, S206 ... Step, S207 ... Step, S208 ... Step, S209 ... Step, S210 ... Step, S211 ... Step, S301 ... Step, S302 ... Step, S303 ... Step, S304 ... Step, S305 Step, S306 ... Step, S307 ... Step, S308 ... Step, S401 ... Step, S402 ... Step, S403 ... Step, S404 ... Step, S405 ... Step, S406 ... Step, t1 ... Imaging start time, t2 ... Imaging end time, .DELTA.D1 ... shift amount, .DELTA.D2 ... shift amount, [Delta] d ... thickness, alpha ... angle, beta ... angle, [Delta] [alpha] ... angle, alpha _{11A ...} arrows, alpha _{11B ...} arrows, alpha _{13X ...} arrows, alpha _{13Y ...} arrows, alpha ₁₄ ... Arrow, α ₁₅ ... Arrow, α _17Y … Arrow, α ₁₈ … Arrow, α _20X … Arrow, α _20Y … Arrow, α ₂₁ … Arrow, α _22A … Arrow, α _22B … Arrow, α ₉₀ … Arrow, θ 1 ... Incident Angle, θ2 ... Angle

Claims (24)

A first gripper that is movable in a first direction and a second direction different from the first direction and capable of gripping an electronic component;
A second gripper that is movable in the first direction and the second direction independently of the first gripper and capable of gripping an electronic component;
A light irradiating unit disposed between the first gripping unit and the second gripping unit so as to be able to irradiate light to the electronic component mounting unit on which the electronic component is mounted;
An imaging unit capable of imaging the electronic component placement unit irradiated with the light from the first direction;
An electronic component transport apparatus that determines whether or not the electronic component is placed on the electronic component placement unit based on an imaging result captured by the imaging unit.   The electronic component conveying apparatus according to claim 1, wherein the first gripping part and the second gripping part are arranged side by side in the second direction.   The electronic component transport apparatus according to claim 1, wherein the first gripping portion and the second gripping portion are simultaneously movable in the second direction. The first gripping part is located between the imaging unit and the electronic component when the electronic component is pressed against the electronic component placement unit,
2. The electronic component conveyance according to claim 1, wherein the second gripping portion is positioned between the imaging unit and the electronic component when the electronic component is pressed against the electronic component mounting portion. apparatus.   The electronic component transport apparatus according to claim 1, wherein the light irradiation unit irradiates the light in a direction that intersects at least the first direction and is not orthogonal.   The electronic component transport apparatus according to claim 1, wherein a direction of the light emitted by the light irradiation unit is adjustable.   The electronic component transport apparatus according to claim 1, further comprising an irradiation position determination unit that determines whether a direction in which the light irradiation unit irradiates the light is a predetermined direction.   The electronic component transport apparatus according to claim 1, wherein the light irradiation unit is configured to irradiate the light with a linear irradiation shape extending in the second direction.   The electronic component transport apparatus according to claim 1, wherein a plurality of the light irradiation units are provided. The electronic component placement portion is arranged side by side along a third direction intersecting the first direction and the second direction, and has a plurality of recesses for storing the electronic components,
The electronic component transport device according to claim 9, wherein the light irradiation units are arranged side by side along the third direction.   The electronic component conveying apparatus according to claim 1, further comprising a light reflecting portion that reflects the light emitted from the light irradiation portion. The light reflecting portion is configured to be rotatable,
The light reflecting portion has a light reflecting surface that reflects the light,
The electronic component transport apparatus according to claim 11, wherein a rotation axis of the light reflecting portion is located on the light reflecting surface. The light irradiation part and the light reflection part are provided in plural,
The electronic component transport apparatus according to claim 11, wherein the light reflecting portions are arranged side by side in a third direction that intersects the first direction and the second direction.   The electronic component conveying apparatus according to claim 13, wherein the imaging unit has an optical axis that intersects an extended line in a direction in which the light reflecting units are arranged. A light reflection unit driving unit for rotating the light reflection unit;
Each of the light reflection unit driving units is arranged side by side along a third direction intersecting the first direction and the second direction,
The electronic component carrying device according to claim 13 or 14, wherein the light reflection unit driving units adjacent to each other in the third direction are shifted in the second direction.   The electronic component transport apparatus according to claim 1, further comprising a position detection unit configured to detect a position of the first grip unit or the second grip unit.   2. The electronic component according to claim 1, wherein the imaging unit is capable of imaging the electronic component placement unit through between the first gripping unit and the second gripping unit between an imaging start time and an imaging end time. Conveying device.   The electronic component transport apparatus according to claim 1, wherein the light irradiation unit irradiates the light before an imaging start time and stops the light irradiation after an imaging end time.   The electronic component transport apparatus according to claim 1, wherein the light irradiation unit emits the light when imaging is possible.   The electronic component carrying device according to claim 1, wherein the electronic component placing unit is an inspection unit that inspects the electronic component.   The electronic component transport apparatus according to claim 1, wherein the first direction and the second direction are orthogonal to each other. The electronic component placement part has a recess for storing the electronic component,
The concave portion has an inner peripheral surface that inclines with respect to the third direction a direction intersecting with the first direction and the second direction,
The electronic component transport apparatus according to claim 1, wherein an incident angle of the light emitted from the light irradiation unit is smaller than an angle formed by an inner peripheral surface of the concave portion and the third direction.   The electronic component transport apparatus according to claim 1, wherein the determination can be performed on the electronic component having a thickness of 0.2 mm or more. A first gripper that is movable in a first direction and a second direction different from the first direction and capable of gripping an electronic component;
A second gripper that is movable in the first direction and the second direction independently of the first gripper and capable of gripping an electronic component;
A light irradiating unit disposed between the first gripping unit and the second gripping unit so as to be able to irradiate light to the electronic component mounting unit on which the electronic component is mounted;
An imaging unit capable of imaging the electronic component placement unit irradiated with the light from the first direction;
An inspection unit for inspecting the electronic component,
An electronic component inspection apparatus that determines whether or not the electronic component is disposed on the electronic component placement unit based on an imaging result captured by the imaging unit.

Images