JP2018087790A - Positioning pressurization mechanism of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To acquire positioning and entire surface pressurization without any interference between mechanism components, and without any stranding of a semiconductor device onto peripheral components in a positioning pressurization mechanism of a semiconductor device.SOLUTION: A positioning pressurization mechanism of a semiconductor device comprises a cooling plate 12 with a stage 11 including a mounting part of a semiconductor device 1 fixed thereon, and a positioning mechanism 110 that is disposed opposite to the semiconductor device mounting part of the stage 11, and positions the semiconductor device on the stage. The positioning mechanism 110 includes a positioning guide 25 in which a semiconductor device side mounted to the stage is in a tapered shape 25a, a probe 24 fixed to the positioning guide 25 and pressure-contacted to the semiconductor device 1, and a floating mechanism 100 for horizontally and movably holding the probe 24.SELECTED DRAWING: Figure 1

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning and pressing mechanism used in a semiconductor test of a chip-shaped semiconductor device, and in particular, a semiconductor device used in energization evaluation in which a large amount of direct current is applied to a power semiconductor device as a semiconductor device. The present invention relates to a positioning and pressing mechanism.

In energization evaluation in which a large current is passed through a conventional semiconductor device, the semiconductor device is placed and positioned on a positioning plate having a hole in the center (see, for example, Patent Document 1).
Although not energized with a large current, there is a method for positioning a semiconductor device with upper and lower floating plates with tapered surfaces (see, for example, Patent Document 2).

JP-A-2006-11862 (page 6, pages 48 to 7, line 3, FIG. 1) Japanese Patent Laying-Open No. 2006-234448 (page 4, page 48-5, line 2, FIG. 1)

  In the evaluation in which a large current is applied as in Patent Document 1, the semiconductor device and the probe contact surface generate heat. In order to suppress heat generation, measures are taken by increasing the contact area by increasing the size of the probe (referred to as a pressure plate in the literature) larger than that of the semiconductor device. By taking this measure, the load is evenly applied to the semiconductor device, so that there is an effect of preventing damage such as cracking. However, in this method, since the probe is larger than the semiconductor device and is arranged up to the upper portion of the positioning plate, it is necessary to make the positioning plate height lower than that of the semiconductor device so as not to interfere with the probe during pressurization. However, since the semiconductor device is thin (for example, t = 0.3 mm), it cannot be reduced beyond the thickness of the semiconductor device, and this is not a reliable solution. In addition, when mounting a semiconductor device on this apparatus, there is a problem of climbing on the positioning plate if the mounting position is shifted.

  Further, in the positioning method as disclosed in Patent Document 2, since the upper and lower probe sizes are smaller than the semiconductor device, the entire surface cannot be pressurized. As a solution, it can be easily considered that the probe size is made larger than that of the semiconductor device. For that purpose, the opening of the lower floating plate needs to be wider than the probe so as not to interfere with the probe. However, since the probe is larger in size than the semiconductor device, the semiconductor device falls from the opening, which is not a solution. .

  The present invention has been made to solve the above-described problems, and there is no interference between the components of the positioning and pressing mechanism, and the semiconductor device does not run on peripheral components. An object of the present invention is to provide a positioning and pressing mechanism for a semiconductor device that can be pressed.

The semiconductor device positioning and pressing mechanism according to the present invention is arranged so as to face the semiconductor device mounting portion of the stage and the cooling plate to which the stage having the semiconductor device mounting portion is fixed, and to position the semiconductor device on the stage. A positioning mechanism is provided.
The semiconductor device mounted on the stage includes a positioning guide having a tapered shape, a probe fixed to the positioning guide and in pressure contact with the semiconductor device, and a floating mechanism that holds the probe movably in the horizontal direction.

  The semiconductor device positioning and pressing mechanism according to the present invention includes a cooling plate to which a stage having a semiconductor device mounting portion is fixed, and a semiconductor device mounting portion on the stage. The positioning mechanism includes a probe that moves up and down when the semiconductor device is pressurized and pressurizes and contacts the semiconductor device, and a semiconductor that is supported by the probe so as to move in the horizontal XY plane and is mounted on the stage. The device side has a plurality of positioning guides tapered.

  According to this invention, there is no interference between the components of the positioning and pressing mechanism, and the semiconductor device positioning and pressing mechanism capable of positioning the semiconductor device and pressurizing the entire surface without getting on the peripheral components can be obtained. .

Schematic front view (a), AA cross-sectional view (b), top view (c), and floating mechanism of AA cross section showing a semiconductor device positioning and pressing mechanism according to the first embodiment of the present invention. It is an enlarged view (d). It is a figure which shows the operation | movement procedure in the positioning pressure mechanism of the semiconductor device concerning Embodiment 1 of this invention. It is sectional drawing which shows the stage of the positioning pressurization mechanism of the semiconductor device concerning Embodiment 2 of this invention. They are sectional drawing (a) which shows the floating mechanism of the positioning pressurization mechanism of the semiconductor device concerning Embodiment 3 of this invention, and BB sectional drawing (b). They are the front schematic diagram (a) which shows the positioning pressurization mechanism of the semiconductor device concerning Embodiment 4 of this invention, and AA sectional drawing (b). It is a figure which shows the operation | movement procedure in the positioning pressurization mechanism of the semiconductor device concerning Embodiment 4 of this invention.

Embodiment 1 FIG.
A semiconductor device positioning and pressing mechanism according to Embodiment 1 of the present invention will be described below with reference to FIGS.
FIG. 1 shows a configuration diagram of a positioning and pressing mechanism for a semiconductor device according to Embodiment 1 of the present invention. FIG. 1 (a) is a schematic front view, and FIG. 1 (b) is an A view in FIG. FIG. 1C is a diagram showing the cross section taken from the left, FIG. 1C is a diagram showing the top surface, and FIG. 1D is an enlarged view of the floating mechanism of the AA cross section.

In FIG. 1, a semiconductor device 1 is an object to be evaluated, and has electrodes on the front surface (XY plane on the Z-axis plus side) and the back surface (XY plane on the Z-axis minus side). The semiconductor device 1 is placed on the stage 11 by hand or a handling device.
The positioning and pressing mechanism includes a stage 11, a cooling plate 12, a pressing shaft 21, a holder 22, a connector 23, a probe 24, and a positioning guide 25.

The stage 11 has a block shape and is installed on the back side of the semiconductor device 1. The semiconductor device 1 is mounted on the stage 11, and the surface of the stage 11 and the semiconductor device 1 are in contact with each other. The XY plane (horizontal plane) size of the stage 11 is made larger than the XY plane (horizontal plane) size of the semiconductor device 1 (for example, 0.1 mm longer in the X and Y directions). Examples of the material of the stage 11 include aluminum, copper, and carbon that have high thermal conductivity and conductivity. However, the upper surface corner portion that comes into contact with the positioning guide 25 described later is repeatedly rubbed and may be worn. For this reason, it is preferable that the upper surface corner of the stage 11 is subjected to a coating process for improving wear resistance and lubricity while ensuring conductivity. The surface of the stage 11 is polished to reduce the surface roughness in order to increase the contact area with the semiconductor device 1.

  A cooling plate 12 is fixed under the stage 11. The cooling plate 12 serves to cool the semiconductor device 1 through the stage 11 with heat generated in the semiconductor device 1 during energization. For this reason, in order to improve the thermal conductivity of the contact surface between the stage 11 and the cooling plate 12, it is preferable to reduce the mutual surface roughness and increase the contact area. The cooling plate 12 is connected to an electrode terminal 52 (a terminal to which one of the positive electrode and the negative electrode of the power supply is connected) of the energization unit 51. Examples of the material of the cooling plate 12 include aluminum, copper, and carbon having high thermal conductivity and conductivity. Although not shown in FIG. 1, the refrigerant circulates in the cooling plate 12 with a chiller, and the heat of the cooling plate 12 is released.

  A pressure shaft 21 is provided above the semiconductor device 1. Although not shown in FIG. 1, the pressure shaft 21 is connected to a driving component that generates a force such as a servo motor, and moves up and down in the Z direction (vertical direction). A holder 22 is fixed under the pressure shaft 21. The holder 22 is disposed with a space immediately above the semiconductor device 1. The outer shape of the holder 22 shown in FIG. 1 is a cylindrical shape, but may be a block shape, for example. The material of the holder 22 may be a material that can withstand (not plastically deform) a compressive force (for example, 500 N) due to a downward (Z-axis minus) load transmitted from the pressure shaft 21. For example, a metal such as iron or aluminum is used. Can be mentioned.

  Inside the holder 22, there is a space in which the cross-sectional shape of the ZY plane and the ZX plane is T-shaped and the upper portion of the connector 23 described later can be accommodated, and a part of the connector 23 is accommodated and held in this space. The connector 23 has a configuration in which two cylindrical objects having different diameters are overlapped, a cylindrical object having a large diameter is accommodated in the holder 22, and a lower part of the cylindrical object having a small diameter projects downward from the holder 22. Become. The connector 23 may be a stack of two blocks of different sizes. The diameter of the lower cylindrical object constituting the connector 23 is not particularly limited as long as the probe 24 is not plastically deformed during pressurization and the entire surface of the semiconductor device 1 can be uniformly pressed, but the diameter is preferably larger than the width of the semiconductor device 1. Stable and uniform pressurization is possible. The material of the connector 23 only needs to be a material that can withstand the compressive force caused by the downward (Z-axis minus) load transmitted from the pressure shaft 21, and examples thereof include metals such as iron and aluminum.

The connector 23 is in contact with the holder 22 at the contact surface 100d as shown in FIG. When the connector 23 is arranged so as to be aligned with the center of the holder 22, there are a Y ₁ mm gap 100 a and a gap 100 b around the circumference of the connector 23 in both the larger and smaller diameters. There is a Z ₁ mm gap 100c above the connector 23, and the gap 100c only needs to have a gap fit (for example, 0.01 mm to 0.1 mm units). As a result, the connector 23 does not drop from the holder 22 and can move ± Y ₁ mm in the XY direction (horizontal direction), and the holder 22 and the connector 23 constitute the floating mechanism 100. A probe 24 is fixed to the lower part of the connector 23. The outer shape of the probe 24 has a block shape, and the size of the XY plane (horizontal plane) is larger than the size of the XY plane (horizontal plane) of the semiconductor device.

  The probe 24 is disposed with a space right above the semiconductor device 1, that is, facing the semiconductor device 1 so that the pressure contact with the semiconductor device 1 is made when the pressure shaft 21 is lowered (Z-axis minus direction). ing. In order to increase the contact area with the semiconductor device 1, the back surface of the probe 24 is polished to reduce the surface roughness. The material of the probe 24 has high thermal conductivity and is conductive like the cooling plate 12, and aluminum or copper which is a soft material is better than the carbon tool steel which is a general material of the probe 24. By using a soft material, it is deformed in the elastic region in accordance with the surface shape (surface roughness, parallelism deviation) of the semiconductor device 1 during pressurization, and contacts the entire surface of the semiconductor device 1. As a result, the electrical resistance of the contact portion is reduced, a stable energization test can be performed, and heat generation can be suppressed.

  The probe 24 is connected to an electrode terminal 52 (a terminal opposite to the electrode terminal 52 connected to the cooling plate 12) of the energization unit 51. Thereby, when the probe 24 is lowered and brought into contact with the semiconductor device 1, the probe 24, the semiconductor device 1, the stage 11, and the cooling plate 12 come into contact with each other, so that the current flowing from the energization unit 51 can be conducted to the semiconductor device 1. . A positioning guide 25 is fixed to each of the four sides (X-axis plus side and minus side, Y-axis plus side and minus side) of the back surface of the probe 24.

  The outer shape of the positioning guide 25 has a block shape, and the upper surface is in contact with the probe 24. Since each positioning guide 25 has the same shape, the details will be described with the positioning guide 25 installed on the Y-axis plus side in FIG. The positioning guide 25 on the Y axis plus side in FIG. 1B corresponds to the front positioning guide 25 in FIG. 1A, and the length of the positioning guide 25 in the X direction is longer than the length of the probe 24 in the X direction. short. The length of the positioning guide 25 in the Z direction is shorter than the sum of the lengths in the same direction of the semiconductor device 1 and the stage 11. The length of the positioning guide 25 in the Y direction is not particularly specified as long as a tapered surface 25a described later can be secured and the semiconductor device 1 or the stage 11 is not plastically deformed when contacting the semiconductor device 1 or the stage 11 and the positioning performance is not adversely affected.

  A tapered surface 25a is provided at the lower corner of the positioning guide 25 on the Y axis minus side. When the semiconductor device 1 and the probe 24 are misaligned with respect to the stage 11, the tapered surface 25 a plays a role of attracting each of them to position them. The angle of the taper surface 25a is not particularly specified as long as the semiconductor device 1 and the probe 24 can be positioned, and examples thereof include 45 deg to 60 deg in the clockwise direction from the XY plane. In addition, if the length in the Z direction is provided on the surface on the negative side of the Y-axis of the positioning guide 25 parallel to the XZ plane so that the length in the Z direction can be secured more than the thickness of the semiconductor device 1, the semiconductor device 1 can be accurately positioned. It becomes possible.

  The material of the positioning guide 25 is not particularly limited. However, when a wear-resistant metal is used because it rubs against the semiconductor device 1 and the stage 11, or when it is necessary to consider weight reduction, the wear resistance of aluminum is improved. It is good to apply a coating treatment. Four positioning guides 25 are used, and the taper surface 25a of each positioning guide 25 is installed in a state facing the inner lower part so as to contact the semiconductor device 1 and the stage 11. The interval between the positioning guides 25 facing each other is provided wider than the width of the stage 11 (for example, an interval longer than the width of the stage 11 by 0.1 mm), and is attached at a symmetrical position from the center of the probe 24.

The floating mechanism 100, the probe 24, and the positioning guide 25 described above constitute the positioning mechanism 110, and the positioning mechanism 110 and the pressure shaft 21 constitute the pressure mechanism 120.
In the energization evaluation, the electrode terminal 52 of the energization unit 51 is connected to the cooling plate 12 and the probe 24, and a direct current is passed between the front surface electrode and the back surface electrode of the semiconductor device 1 through the stage 11 to Evaluate characteristics.

Next, the positioning procedure of the semiconductor device 1 and the probe 24 will be described based on FIG.
FIG. 2 is a diagram showing an operation flow in the positioning and pressing mechanism of the semiconductor device according to the first embodiment of the present invention. FIG. 2A shows the positioning mechanism with respect to the stage 11 at the position where the pressing mechanism 120 is raised. 110 is a diagram in which the semiconductor device 1 is displaced in the Y axis minus direction, FIG. 2B is a diagram in which the positioning mechanism 110 is lowered and is in contact with the semiconductor device 1, and FIG. 2 is further lowered to come into contact with the stage 11, FIG.
) Is a view in which the positioning mechanism 110 is further lowered and the semiconductor device 1 is positioned, and FIG. 2E is a view in which the positioning mechanism 110 is further lowered and the probe 24 and the semiconductor device 1 are in contact with each other and are pressurized. .

As shown in FIG. 2A, for example, the case where the semiconductor device 1 is mounted with being shifted in the Y axis plus direction with respect to the stage 11 and the probe 24 is shifted in the Y axis minus direction will be described.
First, when the probe 24 is lowered, the tapered surface 25a of the positioning guide 25 on the Y axis plus side comes into contact with the semiconductor device 1 as shown in FIG. 2B, and the semiconductor device 1 moves toward the center of the probe 24. Start. When the probe 24 is further lowered, the semiconductor device 1 moves toward the center of the probe 24 as it is, but the taper surface 25a of the positioning guide 25 on the Y-axis plus side and the angle of the stage 11 as shown in FIG. And the probe 24 starts moving together with the semiconductor device 1 toward the center of the stage 11 (moving in the positive direction of the Y axis).

  When the probe 24 is lowered as it is, the semiconductor device 1 and the probe 24 are positioned at the center of the stage 11 as shown in FIG. Thereafter, when the probe 24 is further lowered, as shown in FIG. 2E, the back surface of the probe 24 and the surface of the semiconductor device 1 come into contact with each other. Thereafter, the gap 100c between the holder 22 and the connector 23 disappears, and the pressure shaft 21 The downward pressing load is transmitted to the semiconductor device 1 through the holder 22, the connector 23, and the probe 24 and can be pressurized.

  Even if the position of the semiconductor device 1 is deviated from the stage 11 by the semiconductor device positioning and pressing mechanism according to the first embodiment described above, the semiconductor device 1 is automatically positioned at the center of the stage 11. The entire surface can be pressurized. In addition, even if the relative position of the stage 11 in the XY direction (horizontal direction) is shifted, the probe 24 automatically moves to the center of the stage 11, so there is no interference between the components of the positioning mechanism 110. The semiconductor device 1 can be positioned and pressed without the semiconductor device 1 climbing over the peripheral components.

Embodiment 2. FIG.
Next, a semiconductor device positioning and pressing mechanism according to Embodiment 2 of the present invention will be described with reference to FIG.
FIG. 3 is a cross-sectional view of the stage 11 and the cooling plate 12 in the positioning and pressing mechanism of the second embodiment. In FIG. 3, a plurality of vacuum suction holes 11 a are provided on the upper surface of the stage 11, and the vacuum suction holes 11 a are evacuated from the bottom side of the cooling plate 12 so that the semiconductor device 1 is sucked onto the surface of the stage 11. is there. Other configurations are the same as those of the first embodiment shown in FIG.

  When the semiconductor device 1 is positioned, the positioning guide 25 is lowered, so that a downward load is applied to the semiconductor device 1, and there is a possibility that the semiconductor device 1 rotates and tilts around the corner of the stage 11. In order to prevent this, the semiconductor device 1 is placed on the stage 11 by arranging vacuum suction holes 11a of arbitrary diameter and number on the stage 11 (for example, φ1 mm, 2 holes in the X direction and 2 holes in the Y direction). It can be prevented from adsorbing and tilting.

Embodiment 3 FIG.
Next, a semiconductor device positioning and pressing mechanism according to Embodiment 3 of the present invention will be described with reference to FIG.
4A is a sectional view of the holder 22 and the connector 23 in the positioning and pressing mechanism according to the third embodiment, and FIG. 4B is a view of the BB section of FIG. 4A as viewed from above. .
In FIG. 4, compression springs 30 are provided in the gap 100a between the outer periphery of the cylindrical shape having a large diameter of the connector 23 and the inner periphery of the holder 22, respectively, in the positive and negative directions of the X axis and the Y axis. .

  When installing the compression spring 30, holes 22 a and 23 a that are larger than the diameter of the compression spring 30 and shallower than half of the total length of the compression spring 30 are respectively formed in the positive and negative directions of the X axis and Y axis of the connector 23 and the holder 22. Provide. Then, the respective end portions of the compression spring 30 are inserted into the holes 22a and 23a, and the compression spring 30 is attached. The entire length of the compression spring 30 is selected so that the compression spring 30 attached has a compression load. Other configurations are the same as those of the first embodiment shown in FIG.

In the connector 23 according to the first embodiment, when the connector 23 has a shape in which two cylindrical objects are stacked, the connector 23 rotates around the Z axis, so that the positioning guide 25 fixed via the probe 24 also rotates. In addition, the phase with the stage 11 may be shifted.
In order to prevent this, as shown in FIG. 4, the compression spring 30 is inserted into the gap 100a between the outer periphery of the cylindrical shape having a large diameter of the connector 23 and the inner periphery of the holder 22 in the positive and negative directions of the X and Y axes. This can be solved by providing them respectively.
As an alternative to the compression spring 30, a tension spring is also possible. A similar effect can be obtained by providing the connector 23 and the holder 22 with a rod-like post that hooks the end of the tension spring.

  Thereby, even if the connector 23 rotates about the Z axis by an external force, when the external force becomes zero, the connector 23 returns to the original phase due to the load generated by each compression spring 30. Even if the connector 23 is displaced in the X-axis or Y-axis direction by an external force, the displacement-side compression spring 30 is compressed, the repulsive force is increased, and the connector 23 can return to the original position.

Embodiment 4 FIG.
Next, a semiconductor device positioning and pressing mechanism according to Embodiment 4 of the present invention will be described with reference to FIGS.
FIG. 5 shows a block diagram of a positioning and pressing mechanism for a semiconductor device according to Embodiment 4 of the present invention. FIG. 5 (a) is a schematic front view, and FIG. 5 (b) is A in FIG. 5 (a). It is a figure which shows -A cross section from the left.

In FIG. 5, a joint plate 44 is provided instead of the floating mechanism 100 including the holder 22 and the connector 23 of the first embodiment, and the pressure shaft 21 is fixed to the surface of the joint plate 44 and the probe 24 is fixed to the back surface.
Next, the positioning guide 25 and the positioning guide slide mechanism 40 for guiding the semiconductor device 1 to the center position of the stage 11 will be described. The positioning guide slide mechanism 40 includes a stepped shaft 41, a cylindrical bush 42, and a compression spring 43, and is provided for each positioning guide 25.

Four positioning guides 25 are provided on the side surface of the probe 24. Since all the positioning guides 25 have the same shape, the details will be described with reference to the positioning guide 25 installed on the Y-axis plus side in FIG. 5B. . The lower corner of the positioning guide 25 on the Y-axis minus side is provided with a tapered surface 25a as in the first embodiment.
In the positioning guide slide mechanism 40, the axis of the stepped shaft 41 is fixed to the front side and the back side of the probe 24 in the direction parallel to the Y axis on the Y axis plus side surface. A positioning guide 25 to which a cylindrical bush 42 is attached is attached to the stepped shaft 41 on the Y axis minus side, and a compression spring 43 is attached to the Y axis plus side in a compressed state.
The positioning guide slide mechanism 40, the probe 24, and the positioning guide 25 described above constitute the positioning mechanism 110, and the positioning mechanism 110 and the pressure shaft 21 constitute the pressure mechanism 120.

  With this configuration, the positioning guide 25 is pressed by the compression spring 43 to the negative side of the Y axis and comes into contact with the probe 24. The interval between the positioning guides 25 facing each other is made 1 mm to 3 mm narrower than the width of the stage 11. On the surface on the Y axis minus side of the positioning guide 25, the surface that contacts the side surface of the probe 24 has a concave shape (a step is provided on the Y axis plus side). Due to this shape, even if the interval between the positioning guides 25 facing each other in the positioning operation described later is widened, there is no gap between the back surface (pressing surface) of the probe 24 and the positioning guide 25, so that the entire semiconductor device 1 can be pressurized. it can.

In the positioning guide 25 of the first embodiment, the gap between the facing positioning guides 25 is wider than the width of the stage 11, so that a gap is formed on the opposite side where the positioning guide 25 and the stage 11 come into contact during positioning. For example, in the positioning at the position of FIG. 2, when the semiconductor device 1 is shifted from FIG. 2C to FIG. 2D where the semiconductor device 1 is positioned, the positioning guide 25 is pushed and positioned. Therefore, a gap is formed between the Y-axis negative side positioning guide 25 and the stage 11. There is a case where the semiconductor device 1 protrudes from the stage 11 to the Y-axis minus side by this gap and cannot be fully pressed.
In order to solve this, in the invention of the fourth embodiment, the floating mechanism 100 (the holder 22 and the connector 23) is replaced with the joint plate 44, the probe 24 is fixed to the joint plate 44, and the positioning guide slide mechanism is fixed to the probe 24. By 40, the positioning guide 25 is supported so as to be movable in the horizontal direction.

Next, the positioning procedure of the semiconductor device 1 and the probe 24 will be described with reference to FIG.
FIG. 6 is a diagram showing an operation flow in the positioning and pressing mechanism for a semiconductor device according to the fourth embodiment of the present invention. FIG. 6 (a) shows the pressurization to the stage 11 at the position where the pressing mechanism 120 is raised. FIG. 6B is a diagram in which the mechanism 120 is displaced in the Y-axis minus direction, and the semiconductor device 1 is displaced in the Y-axis plus direction. FIG. 6B is a diagram in which the pressurizing mechanism 120 is lowered and the semiconductor device 1 is in contact with one side. FIG. 6D is a view in which the pressurizing mechanism 120 is further lowered to contact both ends of the semiconductor device 1. FIG. 6D is a diagram in which the pressurizing mechanism 120 is further lowered to expand the positioning guide 25. FIG. 6 (e) is a diagram in which the positioning guide 25 is in contact with the stage 11 on the same axis, and FIG. Diagrams position is changed positioned well.

In the positioning operation of FIG. 6, for example, as shown in FIG. 6A, the semiconductor device 1 is mounted with being shifted in the Y axis plus direction with respect to the stage 11, and the probe 24 is shifted in the Y axis minus direction. .
As shown in FIG. 6B, the probe 24 descends, the tapered surface 25a of the positioning guide 25 on the Y axis plus side contacts the semiconductor device 1, and the semiconductor device 1 starts moving toward the center of the probe 24. To do. When the probe 24 is further lowered, as shown in FIG. 6C, the taper surface 25 a of the Y-axis minus side positioning guide 25 and the stage 11 come into contact with each other, and the semiconductor device 1 moves to the center of the probe 24. When the probe 24 is further lowered, as shown in FIG. 6D, the interval between the positioning guides 25 extends to the width of the semiconductor device 1 and the positioning guide 25 on the Y axis plus side comes into contact with the stage 11. When the probe 24 is further lowered, as shown in FIG. 6E, the positioning guides 25 on both sides maintain a space along the stage 11 without a gap, so that the semiconductor device 1 is positioned without protruding to the stage 11.

As described above, in the invention of the fourth embodiment, the distance between the positioning guides 25 changes according to the size of the stage 11, so that the entire surface can be pressurized without generating a gap between the stage 11 and the positioning guide 25. Does not damage device 1. Even if the relative position between the probe 24 and the stage 11 is deviated, the positioning guide 25 moves along the horizontal XY plane following the end surface of the stage 11, so that they do not interfere with each other.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the embodiments, and various design changes can be made. Within the scope of the present invention, each embodiment is described. These embodiments can be freely combined, and each embodiment can be modified or omitted as appropriate.

1: semiconductor device, 11: stage, 11a: vacuum suction hole, 12: cooling plate,
21: Pressurizing shaft, 22: Holder, 23: Connector, 24: Probe,
25: Positioning guide, 25a: Tapered surface, 30: Compression spring,
40: Positioning guide slide mechanism, 41: Stepped shaft, 42: Bush,
43: compression spring, 44: joint plate, 51: current-carrying part, 52: electrode terminal,
100: Floating mechanism 110: Positioning mechanism 120: Pressure mechanism

Claims (9)

  A cooling plate that fixes a stage having a semiconductor device mounting portion, and a positioning mechanism that is disposed facing the semiconductor device mounting portion of the stage and positions the semiconductor device on the stage, the positioning mechanism including: The semiconductor device mounted on the stage has a tapered positioning guide, a probe fixed to the positioning guide and in pressure contact with the semiconductor device, and a floating mechanism for holding the probe movably in the horizontal direction. Positioning and pressing mechanism for semiconductor devices.   2. The semiconductor device positioning and pressing mechanism according to claim 1, wherein an outer shape of the probe is a block shape, and the positioning guide is fixed to each of the four sides thereof.   The floating mechanism is arranged with a space above the semiconductor device and can be moved in the horizontal direction so as not to fall because a part of the holder is housed in the inner space of the holder and moved up and down when pressurized. The semiconductor device positioning and pressing mechanism according to claim 1, wherein the positioning and pressing mechanism is configured by a connector that is held by the connector and fixes the probe.   4. The semiconductor device positioning and pressing mechanism according to claim 1, wherein a horizontal size of the probe is larger than a horizontal size of the semiconductor device. 5.   5. The semiconductor device positioning and pressing mechanism according to claim 1, wherein the stage is provided with a hole for vacuum-sucking the semiconductor device on a contact surface with the semiconductor device.   4. The semiconductor device positioning and pressing mechanism according to claim 3, wherein a spring is provided between the holder of the floating mechanism and the connector.   A cooling plate that fixes a stage having a semiconductor device mounting portion, and a positioning mechanism that is disposed facing the semiconductor device mounting portion of the stage and positions the semiconductor device on the stage, the positioning mechanism including: A probe that moves up and down when the semiconductor device is pressurized and pressurizes and contacts the semiconductor device, and is supported by the probe so as to move in a horizontal XY plane, and the semiconductor device side mounted on the stage is tapered. A positioning and pressing mechanism for a semiconductor device having a plurality of positioning guides.   The semiconductor device according to claim 7, wherein the positioning guide is supported on the side surface of the probe so as to be movable in a horizontal direction by a spring attached to a stepped shaft fixed to the side surface of the probe in a compressed state. Positioning and pressing mechanism.   9. The semiconductor device positioning and pressing mechanism according to claim 7, wherein a horizontal size of the probe is larger than a horizontal size of the semiconductor device.

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