JP2018085477A - 電気製品 - Google Patents
電気製品 Download PDFInfo
- Publication number
- JP2018085477A JP2018085477A JP2016228898A JP2016228898A JP2018085477A JP 2018085477 A JP2018085477 A JP 2018085477A JP 2016228898 A JP2016228898 A JP 2016228898A JP 2016228898 A JP2016228898 A JP 2016228898A JP 2018085477 A JP2018085477 A JP 2018085477A
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- circuit board
- connector terminal
- substrate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 113
- 238000009429 electrical wiring Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
【解決手段】表面および裏面の少なくとも一方に電子部品10を実装した複数の電子回路基板1−1,1−2,1−3,1−4を積層して構成された基板積層体8を備える電気製品であって、複数の電子回路基板は、互いに隣接する2つの電子回路基板のうちの一方の電子回路基板と、他方の電子回路基板と、を含み、基板積層体8は、一方の電子回路基板と他方の電子回路基板とを互いに積層する際に、一方の電子回路基板と他方の電子回路基板とを互いに位置決めするための位置決め手段4,5を有する。
【選択図】図1
Description
1−1 電子回路基板(第1層)
1−2 電子回路基板(第2層)
1−3 電子回路基板(第3層)
1−4 電子回路基板(第4層)
2 コネクタ端子(メスまたはレセプタクル)
3 コネクタ端子(オスまたはプラグ)
4 位置決めピン(位置決め手段)
5 嵌合穴(位置決め手段)
6 バー
7 載置台(取付部)
8 基板積層体
9 マーキング部
10 電子部品
Claims (7)
- 表面および裏面の少なくとも一方に電子部品を実装した複数の電子回路基板を積層して構成された基板積層体を備える電気製品であって、
前記複数の電子回路基板は、互いに隣接する2つの前記電子回路基板のうちの一方の電子回路基板と、他方の電子回路基板と、を含み、
前記基板積層体は、前記一方の電子回路基板と前記他方の電子回路基板とを互いに積層する際に、前記一方の電子回路基板と前記他方の電子回路基板とを互いに位置決めするための位置決め手段を有する、電気製品。 - 前記一方の電子回路基板が、前記他方の電子回路基板に先端を向けて設けられた位置決めピンと、電気コネクタの一方のコネクタ端子と、を有し、
前記他方の電子回路基板が、前記位置決めピンが嵌合する嵌合穴と、前記一方の電子回路基板に先端を向けて設けられ、前記一方のコネクタ端子と接続する他方のコネクタ端子と、を有する、請求項1記載の電気製品。 - 前記一方の電子回路基板が、電気コネクタの一方のコネクタ端子を有し、
前記他方の電子回路基板が、前記一方のコネクタ端子と接続する他方のコネクタ端子を有し、
前記一方のコネクタ端子および前記他方のコネクタ端子は、前記一方の電子回路基板と前記他方の電子回路基板とを互いに積層する際に、前記一方の電子回路基板と前記他方の電子回路基板とを互いに位置決めする機能を有する、請求項1記載の電気製品。 - 前記裏面に前記他方のコネクタ端子を有する電子回路基板が、前記他方のコネクタ端子に対応する前記表面の部分に、前記基板積層体の組立時または分解時にロボットにより把持される把持部を有する、請求項2または3に記載の電気製品。
- 前記一方のコネクタ端子および前記他方のコネクタ端子が、オス端子およびメス端子であり、或いはプラグおよびレセプタクルである、請求項2乃至4のいずれか一項に記載の電気製品。
- 前記基板積層体の最下層の電子回路基板を取り付ける取付部を備え、
前記取付部が、前記最下層の電子回路基板に先端を向けて設けられた位置決めピンを有し、
前記最下層の電子回路基板が、前記取付部の前記位置決めピンが嵌合する嵌合穴を有する、請求項1乃至5のいずれか一項に記載の電気製品。 - 前記取付部が、前記基板積層体を収納する容器と一体に成形されたものである、請求項6記載の電気製品。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016228898A JP6883978B2 (ja) | 2016-11-25 | 2016-11-25 | 電気製品 |
US16/464,311 US20190387625A1 (en) | 2016-11-25 | 2017-11-24 | Electric product |
CN201780072854.2A CN110326370B (zh) | 2016-11-25 | 2017-11-24 | 电气产品 |
DE112017005993.3T DE112017005993T5 (de) | 2016-11-25 | 2017-11-24 | Elektrisches Produkt |
PCT/JP2017/042163 WO2018097229A1 (ja) | 2016-11-25 | 2017-11-24 | 電気製品 |
KR1020197017807A KR20190089923A (ko) | 2016-11-25 | 2017-11-24 | 전기 제품 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016228898A JP6883978B2 (ja) | 2016-11-25 | 2016-11-25 | 電気製品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018085477A true JP2018085477A (ja) | 2018-05-31 |
JP6883978B2 JP6883978B2 (ja) | 2021-06-09 |
Family
ID=62195955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016228898A Active JP6883978B2 (ja) | 2016-11-25 | 2016-11-25 | 電気製品 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20190387625A1 (ja) |
JP (1) | JP6883978B2 (ja) |
KR (1) | KR20190089923A (ja) |
CN (1) | CN110326370B (ja) |
DE (1) | DE112017005993T5 (ja) |
WO (1) | WO2018097229A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102010400B1 (ko) * | 2018-06-20 | 2019-08-13 | 한국알프스 주식회사 | 다층기판 입력장치 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111246655B (zh) * | 2020-01-07 | 2021-01-26 | 深圳市江霖电子科技有限公司 | 点触式隔热pcb板 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5996888U (ja) * | 1982-12-20 | 1984-06-30 | 日本電気株式会社 | 電子機器収容装置 |
JPS6384097A (ja) * | 1986-09-29 | 1988-04-14 | 株式会社日立製作所 | プリント基板間接続法 |
JPH01104796U (ja) * | 1987-12-30 | 1989-07-14 | ||
JPH0485589U (ja) * | 1990-11-30 | 1992-07-24 | ||
JPH0626297U (ja) * | 1992-08-28 | 1994-04-08 | 株式会社安川電機 | 回路基板収納装置 |
JP2007280839A (ja) * | 2006-04-10 | 2007-10-25 | Hitachi Kokusai Electric Inc | 電子機器 |
JP2011198917A (ja) * | 2010-03-18 | 2011-10-06 | Honda Motor Co Ltd | ジャンクションボックス |
US20140206151A1 (en) * | 2013-01-24 | 2014-07-24 | Infineon Technologies Ag | Method for Producing a Semiconductor Module Arrangement |
JP2014138070A (ja) * | 2013-01-16 | 2014-07-28 | Fujitsu Ltd | 回路基板の連結装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04280497A (ja) | 1991-03-08 | 1992-10-06 | Nissan Motor Co Ltd | 音響機器の自動組立装置 |
JP2012208306A (ja) * | 2011-03-29 | 2012-10-25 | Nitto Denko Corp | 光電気混載基板およびその製法 |
-
2016
- 2016-11-25 JP JP2016228898A patent/JP6883978B2/ja active Active
-
2017
- 2017-11-24 WO PCT/JP2017/042163 patent/WO2018097229A1/ja active Application Filing
- 2017-11-24 US US16/464,311 patent/US20190387625A1/en not_active Abandoned
- 2017-11-24 CN CN201780072854.2A patent/CN110326370B/zh active Active
- 2017-11-24 DE DE112017005993.3T patent/DE112017005993T5/de not_active Withdrawn
- 2017-11-24 KR KR1020197017807A patent/KR20190089923A/ko not_active Application Discontinuation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5996888U (ja) * | 1982-12-20 | 1984-06-30 | 日本電気株式会社 | 電子機器収容装置 |
JPS6384097A (ja) * | 1986-09-29 | 1988-04-14 | 株式会社日立製作所 | プリント基板間接続法 |
JPH01104796U (ja) * | 1987-12-30 | 1989-07-14 | ||
JPH0485589U (ja) * | 1990-11-30 | 1992-07-24 | ||
JPH0626297U (ja) * | 1992-08-28 | 1994-04-08 | 株式会社安川電機 | 回路基板収納装置 |
JP2007280839A (ja) * | 2006-04-10 | 2007-10-25 | Hitachi Kokusai Electric Inc | 電子機器 |
JP2011198917A (ja) * | 2010-03-18 | 2011-10-06 | Honda Motor Co Ltd | ジャンクションボックス |
JP2014138070A (ja) * | 2013-01-16 | 2014-07-28 | Fujitsu Ltd | 回路基板の連結装置 |
US20140206151A1 (en) * | 2013-01-24 | 2014-07-24 | Infineon Technologies Ag | Method for Producing a Semiconductor Module Arrangement |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102010400B1 (ko) * | 2018-06-20 | 2019-08-13 | 한국알프스 주식회사 | 다층기판 입력장치 |
Also Published As
Publication number | Publication date |
---|---|
CN110326370B (zh) | 2022-07-05 |
KR20190089923A (ko) | 2019-07-31 |
JP6883978B2 (ja) | 2021-06-09 |
DE112017005993T5 (de) | 2019-08-08 |
CN110326370A (zh) | 2019-10-11 |
WO2018097229A1 (ja) | 2018-05-31 |
US20190387625A1 (en) | 2019-12-19 |
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