JP2018051949A - Transfer device, transfer method and method for production of liquid discharge head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer device capable of restraining such risks that the film of an adhesive breaks to generate variation in the thickness of the adhesive, or a desired adhesive pattern is not obtained when an adhesive film is formed on the opening of a transfer plate in transfer of the adhesive.SOLUTION: A transfer device has a transfer plate 60 which is equipped with a transfer surface 61 on which a first opening 62 is provided, and is movable between an adhesive feeding part bringing the transfer surface to adherence of an adhesive 57 to the transfer surface 61 including the periphery of the first opening 62, and the member on which the adhesive 57 adhered to the transfer surface 61 is transferred. Besides, the transfer plate 60 is equipped with a second opening 63 communicating with the first opening 62 on a side face 64 which is different from the transfer surface 61 and is located ahead in a direction heading for the member from the adhesive feeding part.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a transfer device that transfers an adhesive, a transfer method that transfers an adhesive, and a method of manufacturing a liquid discharge head that discharges liquid.

  Various methods are known as a method of providing an adhesive on a workpiece in a desired amount or pattern. For example, a transfer plate formed in a desired pattern is pressed against an adhesive on a rotary stage that is controlled so as to have a constant thickness by a squeegee or the like, and is attached to the transfer plate, and the transfer plate is pressed against a workpiece. A “transfer method” for transferring an adhesive is known. This transfer method is widely used when a large number of the same pattern is formed because the pattern is determined by the shape of the transfer plate.

  Patent Document 1 describes that a recording element substrate that performs recording by ejecting a liquid and a support member that supports the recording element are bonded via an adhesive transferred using a transfer method.

JP 2006-334804 A

  In the above-described transfer method, when a transfer plate for transferring an adhesive has an opening on the transfer surface, and the transfer plate is transferred with the adhesive attached around the opening, the following problems occur. That is, when the adhesive is attached to the transfer surface and separated from the rotary stage, an adhesive film may be stretched over the opening of the transfer surface. Then, when the adhesive film ruptures on the rotary stage, the adhesive is reattached to the rotary stage, resulting in variations in the thickness of the adhesive on the rotary stage, and a desired amount of the film is transferred during the next transfer. The adhesive may not be transferred. Further, when the adhesive film ruptures on the work to which the adhesive is transferred, the adhesive may adhere to a place other than the desired pattern.

  Therefore, the present invention aims to suppress the risk that the adhesive stretched on the opening of the transfer plate will rupture, resulting in variations in the thickness of the adhesive, or the inability to obtain a desired adhesive pattern. To do.

  The transfer apparatus according to the present invention is a transfer plate having a surface provided with a first opening, an adhesive supply unit that attaches an adhesive to the surface including the periphery of the first opening, and the surface. In the transfer apparatus having the transfer plate movable between the member to which the adhered adhesive is transferred, the transfer plate is a surface different from the surface, and is directed from the adhesive supply unit to the member. A second opening that communicates with the first opening is provided on a front surface in the direction.

  According to the present invention, when the adhesive film is stretched over the opening of the transfer plate during the transfer of the adhesive, the adhesive film is ruptured, resulting in variations in the thickness of the adhesive, or the desired adhesion. The fear that the pattern of the agent cannot be obtained can be suppressed.

It is a figure which shows the transfer plate of 1st Embodiment. It is a schematic diagram for demonstrating a mounting apparatus. It is a schematic diagram for demonstrating the movement of a transcription | transfer plate, and the pattern of the transferred adhesive agent. It is a perspective view which shows a liquid discharge head. FIG. 6 is a perspective view showing a recording element unit. FIG. 4 is a diagram for explaining a configuration of a recording element substrate. It is a figure which shows the transcription | transfer plate of 2nd Embodiment.

  Hereinafter, a liquid discharge head that discharges liquid will be described as an example to which the present invention can be applied. Specifically, an adhesive transfer device and a transfer method will be described by taking an example of transferring an adhesive used for bonding a recording element substrate constituting a liquid discharge head and a support member to the support member. Note that the member to which the adhesive is transferred is not limited to the support member of the liquid ejection head, and the transfer apparatus and transfer method of the present invention can be used for transferring the adhesive to other members.

(Liquid discharge head)
The configuration of the recording head 40 (liquid ejection head) mounted on an ink jet printer or the like will be described with reference to FIGS. FIG. 4 is a perspective view showing the recording head 40. FIG. 5A is a perspective view showing the entire recording element unit 10 constituting the recording head 40, and FIG. 5B is an exploded perspective view showing the recording element unit 10. FIG. 6 is a perspective view showing the recording element substrate 1 constituting the recording element unit 10, and a part thereof is broken for explaining the configuration.

  As shown in FIG. 4, the recording head 40 includes a chip tank unit 20 including the recording element unit 10 and a tank holder 30 that stores an ink tank, and these are assembled. As shown in FIG. 5, the recording element unit 10 includes a recording element substrate 1, a support member 2, an auxiliary plate 3, and an electric wiring substrate 4.

  The electrical wiring board 4 is a laminated body of a tape base material, wiring, and a cover layer, and is a wiring member for sending an electrical signal for ejecting ink to the recording element substrate 1. An example of the electric wiring board 4 is a TAB tape. The electrical wiring substrate 4 is provided with a device hole corresponding to the recording element substrate 1, and further an inner lead is exposed from the device hole.

  The recording element unit 10 can be manufactured as follows. First, the auxiliary plate 3 is bonded to the support member 2, then the recording element substrate 1 is bonded to the support member 2, and then the electric wiring substrate 4 is bonded to the auxiliary plate 3, and the recording element substrate 1 and the electric wiring substrate are bonded. 4 to make electrical connection. For example, when a TAB tape is used as the electrical wiring board 4, the inner leads of the electrical wiring board 4 and the electrode portions 18 of the recording element substrate 1 can be joined by inner lead bonding (ILB). In order to protect the recording element substrate 1 from ink corrosion and external impact, the outer periphery of the recording element substrate 1 is sealed with a first sealant 5. Further, the front side of the electrical connection portion between the recording element substrate 1 and the electrical wiring substrate 4 is sealed with the second sealant 6.

  The recording element unit 10 manufactured in this way is positioned accurately with the chip tank 11, and both are fixed with screws. Thereafter, an electrical connection is made between the external signal input terminal of the electric wiring board 4 and the PWB board 12 that receives an electric pulse serving as a recording signal for ejecting ink from the printer body. The external input terminal side of the electric wiring board 4 is bent according to the outer shape of the chip tank 11, and the PWB board 12 is fixed to the chip tank 11 by heat caulking. In this way, the chip tank unit 20 is completed.

  The chip tank 11 is provided with a positioning portion for assembling the recording element unit 10 and a supply path for ink supplied to the recording element unit 10. A filter is welded to the supply path, and a seal rubber is assembled around it. It has been.

  As shown in FIG. 6, the recording element substrate 1 includes a discharge port forming member 14 in which a discharge port 13 is formed, and a Si substrate 16 having a thickness of 0.5 to 1.0 mm in which a supply port 15 is formed. Have. The discharge port forming member 14 is formed of a resin material, and the discharge port 13 and the flow path are formed by using a photolithography technique. The Si substrate 16 is connected to a row of heaters 17 which are ejection elements (recording elements) arranged in a staggered pattern on both sides of the supply port 15, and to the heater 17 by electric wiring, and is electrically connected to the outside. An electrode portion 18 that is a connection pad for connection is provided. Au stud bumps are formed on the connection pads.

(First embodiment)
A process for mounting and bonding the recording element substrate 1 to the support member 2 will be described with reference to FIGS. 1A is a perspective view showing a transfer plate 60 of the present embodiment, FIG. 1B is a cross-sectional view taken along line IB-IB in FIG. 1A, and FIG. 1C is a transfer plate. FIG. 6 is a top view showing 60 transfer surfaces 61. FIG. 2 is a plan view showing an outline of the mounting device 50. 3A is a schematic diagram for explaining the movement of the transfer plate 60, and FIG. 3B is a diagram showing a pattern of the adhesive 57 transferred to the support member 2. As shown in FIG.

  First, as shown in FIG. 2, the support member 2 is supplied from the supply unit 51, and the recording element substrate 1 is supplied from the supply unit 52. By the fingers of the SCARA robot 53, the support member 2 is supplied to the transfer positioning table 56 adjacent to the rotation stage 55 (adhesive supply unit) of the adhesive transfer device 54, and the recording element substrate 1 is supplied to the image processing stage 58.

  Next, the support member 2 supplied to the transfer positioning table 56 of the adhesive transfer device 54 abuts against the positioning plate provided on the transfer positioning table 56 by alternately operating the clamps in the X direction and the Y direction. Is positioned. Thereafter, the support member 2 is sucked by a suction hole provided in the transfer positioning table 56 and fixed to the transfer positioning table 56.

  Next, as shown in FIG. 3A, the adhesive 57 is transferred to the support member 2 using the transfer plate 60. This transfer is performed as follows. First, the transfer plate 60 is lowered and the adhesive 57 on the rotary stage 55 is attached to the transfer surface 61 of the transfer plate 60 (attachment step). Then, the transfer plate 60 is raised and separated from the rotary stage 55. Next, the transfer plate 60 to which the adhesive 57 is attached is moved to above the support member 2 fixed to the transfer positioning table 56 (moving step). Further, the transfer plate 60 is lowered to transfer the adhesive 57 to the support member 2 (transfer process). The transfer plate 60 is configured to be movable between the upper side of the rotary stage 55 and the upper side of the support member 2 in order to repeatedly transfer the adhesive 57 to the support member 2. In the present embodiment, as the adhesive 57, an ultraviolet curable adhesive is used as an example.

  The support member 2 to which the adhesive 57 has been transferred using the transfer plate 60 in this way is transferred from the transfer positioning table 56 to the bonding table 71 of the bonding apparatus 70 by the SCARA robot 53. The recording element substrate 1 placed on the image processing stage 58 recognizes the alignment mark formed on the recording element substrate 1 by image processing, and corrects the orientation in the X, Y, and Θ directions. . Next, ultraviolet rays are irradiated to the adhesive 57 transferred to the support member 2 by the ultraviolet irradiation unit 73. The recording element substrate 1 whose orientation has been corrected by the image processing is rotated and moved above the support member 2 on the bonding table 71 while being held by the suction fingers 72. Thereafter, the recording element substrate 1 and the support member 2 are brought into contact with each other by the adsorbing fingers 57 by the suction fingers 72, and the recording element substrate 1 and the support member 2 are bonded together.

  In this way, a series of steps such as supply of the recording element substrate 1 and the support member 2, transfer of the adhesive 57 to the support member 2, and bonding of the recording element substrate 1 and the support member 2 are repeated.

  In this embodiment, as shown in FIGS. 1A to 1C, an opening 62 (first opening) is provided on the transfer surface 61 of the transfer plate 60, and the transfer plate 60 is shown in FIG. The pattern of the adhesive 57 as shown in FIG. If the adhesive 57 is attached to such a portion including the periphery of the opening 62 of the transfer surface 61, a film of the adhesive 57 may be stretched in the region of the opening 62 of the transfer surface 61 in some cases. In particular, if a pattern of the adhesive 57 that surrounds the vicinity of the opening 62 is attached to the transfer surface 61, the film of the adhesive 57 is easily stretched on the opening 62.

  In view of this, the transfer plate 60 of this embodiment is provided with an opening 63 (second opening) on the side face 64 that communicates with the opening 62 of the transfer surface 61. As shown in FIG. 3A, the side surface 64 provided with the opening 63 is formed when the transfer plate 60 moves from above the rotation stage 55 to above the support member 2 fixed on the transfer positioning table 56. It is a surface located in front. By providing the opening 63 in this way, when the transfer plate 60 moves from above the rotation stage 55 to above the support member 2, an air flow from the opening 63 on the side surface 64 toward the opening 62 on the transfer surface 61 is generated. . This flow of air makes it possible to rupture the film of the adhesive 57 stretched in the region of the opening 62. Therefore, the film of the adhesive 57 can be easily ruptured while the transfer plate 60 moves from above the rotation stage 55 to above the support member 2, and the rupture of the film of the adhesive 57 occurs on the rotation stage 55 or on the support. The fear of occurring on the member 2 can be suppressed. Further, in the present embodiment, since air can be flowed with a simple configuration, the adhesive 57 is provided without providing a complicated mechanism for flowing air from the opening 62 side of the transfer plate 60 into the space inside the transfer plate 60. The film can be ruptured.

  In the present embodiment, since a plurality of recording element substrates 1 are bonded to the support member 2, openings 62 are provided corresponding to the respective recording element substrates 1. An opening 62 is provided. In the case of such a configuration, it is preferable that an opening 63 communicating with each of the plurality of openings 62 is provided. This is because it is possible to easily generate an air flow from each opening 63 toward each opening 62. Further, in order to reliably rupture the film of the adhesive 57, it is preferable that the moving speed of the transfer plate 60 when moving from above the rotating stage 55 to above the supporting member 2 is 350 mm / sec or more.

  Further, in order to make the film of the adhesive 57 easier to rupture, it is preferable that the opening area of the opening 63 is equal to or larger than the opening area of the opening 62, and the opening area of the opening 63 is larger than the opening area of the opening 62. It is more preferable to enlarge it. On the other hand, there is a possibility that the opening area of the opening 63 cannot be sufficiently secured depending on the shape of the transfer plate 60, but the opening area of the opening 63 is the opening area of the opening 62 in order to surely rupture the film of the adhesive 57. It is preferable that it is 1/10 or more of the area.

  In this embodiment, the opening 62 is provided at a position away from the outer edge of the transfer surface 61, but a part of the opening 62 may be connected to the outer edge of the transfer surface 61.

(Second Embodiment)
In this embodiment, the adhesive is transferred using a transfer plate having a configuration different from that of the above-described embodiment. Other apparatus configurations, adhesive transfer, a method of bonding the support member and the recording element substrate, and the like can be the same as those in the above-described embodiment, and thus description thereof is omitted.

  FIG. 7A is a perspective view showing the transfer plate 80 of the present embodiment, and FIG. 7B is a cross-sectional view taken along the line VIIB-VIIB in FIG. 7A. The transfer plate 80 of the present embodiment is different from the above-described embodiment in the configuration of the communication path in which the opening 82 of the transfer surface 81 and the opening 83 of the side surface 84 communicate with each other. Specifically, the upper surface 86 of the communication path 85 that connects the opening 82 and the opening 83 is an inclined surface. The upper surface 86 is inclined with respect to the transfer surface 81 and the side surface 84. Thus, by making the upper surface 86 of the communication path 85 an inclined surface, when the transfer plate 80 moves from above the rotation stage 55 to above the support member 2, the opening 83 opens from the opening 83 as compared to the above embodiment. An air flow can be easily formed in a direction toward 82. Thereby, when the film | membrane of the adhesive agent 57 stretches in the area | region of the opening 82 of the transfer surface 81, the adhesive agent 57 can be more easily ruptured during the transfer plate 80 movement.

(Example)
Using the transfer plate 60 shown in FIGS. 1A to 1C, the adhesive 57 was transferred to the support member 2 and applied. As the transfer plate 60, one having the same area of the opening 62 provided on the transfer surface 61 and the opening 63 provided on the side surface 64 was used. As the adhesive 57, an ultraviolet curable adhesive KR-825-24M (manufactured by ADEKA Corporation) was used. Further, the thickness of the adhesive 57 on the rotary stage 55 was adjusted with a squeegee so that the weight of the adhesive 57 after being transferred to the support member 2 was 5.6 mg.

  As shown in FIG. 3A, when the adhesive 57 is attached to the transfer plate 60 and the transfer plate 60 is separated from the rotary stage 55, the adhesive 57 enters the opening 62 of the transfer surface 61 of the transfer plate 60. The film was stretched. Thereafter, the transfer plate 60 was moved at a speed of 350 mm / sec from above the rotation stage 55 to above the support member 2 fixed to the transfer positioning table 56 with the opening 63 of the transfer plate 60 facing the front in the traveling direction. Then, an air flow from the opening 63 toward the opening 62 was generated, and the film of the adhesive 57 stretched on the opening 62 was ruptured during the movement of the transfer plate 60. Thereafter, the transfer plate 60 that reached above the transfer positioning table 56 was lowered to transfer the adhesive 57 to the support member 2.

  Since the film of the adhesive 57 ruptured while the transfer plate 60 moved between the upper part of the rotary stage 55 and the upper part of the support member 2, the scattered adhesive 57 did not reattach on the rotary stage 55. . Further, the ruptured adhesive 57 was not scattered on the support member 2, and a desired pattern of the adhesive 57 could be transferred to the support member 2. Further, as a result of confirmation after a series of operations until the recording element substrate 1 and the support member 2 were bonded together, the scattered adhesive 57 was not reattached to the rotary stage 55. Therefore, there is no variation in the thickness of the adhesive 57 on the rotary stage 55, and the adhesive 57 having a desired thickness can be adhered to the transfer plate 60 during the next transfer.

DESCRIPTION OF SYMBOLS 1 Recording element board | substrate 2 Support member 40 Recording head 55 Rotation stage 57 Adhesive 60 Transfer plate 61 Transfer surface 62 Opening 63 Opening 64 Side

Claims (10)

A transfer plate having a surface provided with a first opening, wherein an adhesive supply unit attaches an adhesive to the surface including the periphery of the first opening, and the adhesive attached to the surface is transferred. A transfer apparatus having the transfer plate movable between the member and
The transfer plate is a surface different from the surface, and includes a second opening communicating with the first opening on a surface positioned in front of the adhesive supply unit toward the member. Transfer device.   The transfer device according to claim 1, wherein the transfer plate includes a plurality of the first openings and the second openings communicating with the plurality of first openings, respectively.   The transfer apparatus according to claim 1, wherein an area of the second opening is 1/10 or more of an area of the first opening.   4. The transfer device according to claim 1, wherein an area of the second opening is equal to or larger than an area of the first opening. 5.   The transfer plate is separated from the adhesive supply unit after the adhesive is attached to the surface, moves from above the adhesive supply unit to above the member, and contacts the member via the adhesive. The transfer device according to claim 1, wherein the transfer device transfers the adhesive to the member.   The transfer apparatus according to claim 5, wherein a speed of the transfer plate moving from above the adhesive supply unit to above the member is 350 mm / sec or more. The transfer plate includes a communication path that communicates the first opening and the second opening;
The upper surface of the communication path is inclined with respect to the surface provided with the first opening and the surface provided with the second opening. The transfer apparatus according to 1.   Transfer of adhesive to support member when assembling a liquid discharge head having an element substrate including an ejection element for ejecting liquid and a support member to which the element substrate is bonded via an adhesive The transfer device according to claim 1, wherein the transfer device is used in a printer. In a transfer method of transferring an adhesive to a member using a transfer plate,
In the adhesive supply unit, an attaching step of attaching an adhesive to a portion including the periphery of the first opening on the surface of the transfer plate provided with the first opening;
In the state where the transfer plate and the adhesive supply part are separated from each other and the surface provided with a second opening which is different from the surface and communicates with the first opening faces forward. A moving step of moving the transfer plate above the member;
A transfer step of bringing the transfer plate and the member into contact with each other through an adhesive, and transferring the adhesive to the member;
A transfer method characterized by comprising: In a method of manufacturing a liquid ejection head, comprising: an element substrate including an ejection element for ejecting liquid; and a support member to which the element substrate is bonded via an adhesive.
In the adhesive supply section, an adhesion step of attaching an adhesive to a portion of the surface of the transfer plate provided with the first opening and including the periphery of the first opening;
In the state where the transfer plate and the adhesive supply part are separated from each other and the surface provided with a second opening which is different from the surface and communicates with the first opening faces forward. A moving step of moving the transfer plate to above the support member;
A transfer step of bringing the transfer plate and the support member into contact with each other via an adhesive, and transferring the adhesive to the support member;
Bonding the element substrate and the support member via an adhesive;
A method of manufacturing a liquid discharge head, comprising:

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