JP2006289820A - Mount apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mount apparatus which improves the adhesiveness of recording elements by temporarily fixing the recording elements while highly precisely limiting an irradiation region of UV light which temporarily fixes the recording elements to an element substrate by an adhesive. <P>SOLUTION: A longitudinal outside dimension of a finger which sucks and sticks the recording elements to the element substrate is larger than the recording element. The finger itself has slits consisting of through holes for irradiation of UV light. The slits are formed in the vicinity of outside both ends of the recording element to cast the UV light onto the adhesive coming out of the periphery of both ends of the recording element. A suction part, a blocking part and through-hole slits for temporary fixation are formed integrally in the finger. Therefore, the finger can temporarily fix the recording elements while highly precisely limiting the irradiation region. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting device for highly accurately bonding and fixing a recording element of an ink jet head to an element substrate, and particularly to a finger used for fixing and fixing a recording element.

  FIG. 6 shows an ink jet recording head according to the present invention.

  The recording head 500 is configured by assembling a recording element unit 10 (see FIG. 4), a chip tank unit 501 that is an assembly of chip tanks, and a tank holder 502 that houses a plurality of ink tanks 503.

  As shown in the exploded perspective view of FIG. 4, the recording element unit 10, which is a component of the chip tank unit, receives the electrical signals from the recording elements 201 and 202 having nozzle arrays for ejecting ink and the printer body. The wiring board 401 includes an electric wiring tape 401 having an external signal input terminal, an element substrate 100 on which the recording element is mounted by bonding, and a macula member 301 to which the electric wiring tape is bonded.

  The chip tank is provided with a recording element assembly positioning portion and an ink supply path to the recording element unit. A filter is welded to the ink supply path, and a seal rubber is assembled around the ink supply path (not shown). .

  The recording element unit is positioned accurately with the chip tank and fixed with screws. Thereafter, an external signal input terminal of the electrical wiring tape is electrically connected to a PWB substrate that receives an electrical signal from the printer body.

  The electrical connection portion is sealed with the first sealant 11 and the second sealant 12 in order to protect it from ink corrosion and external impact (see FIG. 5). The first sealant mainly seals the outer peripheral portion of the recording element, and the second sealant seals the front side of the connection portion between the recording element and the electric wiring tape. After sealing, the external input terminal side of the electric wiring tape is bent according to the outer shape of the chip tank, and the PWB is fixed to the chip tank by heat caulking. Thus, the chip tank unit is completed.

  Next, the recording element unit 10 will be described with reference to FIG.

  The recording element unit includes an element substrate 100, a second substrate 301, recording elements 201 and 202, and a potential wiring tape 401. The recording element is bonded to the element substrate and a chip mount unit bonded with high accuracy. An electric wiring tape is adhered to the entire surface of the second substrate, and then the periphery of the recording element unit and the electrical connection portion are sealed.

  The recording elements 201 and 202 have a known structure as a side shooter type bubble jet (registered trademark) substrate. As shown in FIG. 7, a long groove-like through-hole is formed in an Si substrate 202b having a thickness of 0.5 to 1 mm as an ink flow path. An ink supply port 202c, a heater row 202d which is a discharge means arranged in a staggered pattern on each side of the ink supply port, and connection pads connected to the heater by electric wiring and on both outer sides of the substrate It has the electrode part 202e arranged. Au stud bumps are formed on the connection pads. The nozzle row 202a is formed of a resin material by a photolithography technique.

  The electrical wiring tape 401 is a laminated body of a tape base material, wiring, and a cover layer, and applies an electrical signal for ejecting ink to the recording elements 201 and 202. One example is a TAB tape. Inner leads in which wiring is exposed to the device holes are provided at the element connection portions corresponding to the sides of the device holes corresponding to the recording elements. The electrical wiring tape is bonded and fixed to the tank surface via an adhesive layer on the cover layer side.

  The electric wiring tape 401 and the recording elements 201 and 202 are electrically connected to each other via a thermosonic bonding method or an anisotropic conductive tape. In the case of a TAB tape, inner lead bonding (ILB) by a thermosonic bonding method is suitable. In the illustrated recording element unit, the inner lead of the electrical wiring tape 401 and the stud bump on the recording element are ILB bonded.

  Then, a sealant is applied to the electrical joint and the side surface of the recording element in order to prevent external impact and ink adhesion. As the sealant, a thermosetting type is generally used, and sealing of the side surface of the recording element and sealing of the electrical connection part are two types of adhesives (FIGS. 5 (11, 12)) having different physical properties and curing conditions, respectively. Sealed. When the encapsulant thus applied is cured, the recording element unit is completed.

  Next, the mounting process will be described.

  The mounting process is a process of attaching the recording element to the recording element with high accuracy. High accuracy is required because it is a core process for determining the position of the ejection port for ejecting ink in the inkjet head. Specifically, the absolute accuracy for determining the position of the recording element with respect to the reference of the element substrate and the relative positional accuracy indicating the positional relationship between the recording elements.

  Although the mounting is performed in the process steps of component supply → adhesive transfer → temporary fixing → additional UV irradiation → work discharge → heat curing, the present invention relates to a finger used for temporary fixing, particularly for bonding of recording elements.

  FIG. 3 shows the finger unit of the mounting device.

  FIG. 3B is a side view showing the finger unit.

  The finger unit is attached with a finger 5a for adsorbing and adhering the recording element and a work cradle for positioning and adsorbing the element substrate via a guide 5g, and an unillustrated adsorption hole is machined. In this manner, the recording element is mounted on the element substrate by sandwiching both the fingers from the top and bottom with the finger serving as the recording element and the work cradle holding the element substrate.

FIG. 3A is a plan view showing a conventional finger, and FIG. 3B is a side view of the finger. As shown in FIG. 1 (a), the conventional finger has an adsorbing portion that adsorbs when the recording element is transported and bonded, and UV light is irradiated to cure the adhesive in a short time. Both ends are exposed outside the finger adsorption part. Thus, the outer shape of the finger is smaller than the outer shape of the recording element. Therefore, at the time of temporary fixing, the recording element is pressed against the element substrate to which the adhesive has been supplied in advance by a technique such as transfer or dispensing so that it protrudes from the outer periphery of the recording element. The recording element was temporarily fixed by curing (see, for example, Patent Document 1).
JP-A-11-170542

  In addition to fixing the recording element on the element substrate, the function of the adhesive used for bonding the recording elements is to release the heat of the recording element when discharging ink to the element substrate. The role of sealing to prevent ink from leaking is also important. It is important that the adhesive is surely filled around the ink flow path, and it is desirable that the thickness of the adhesive is as thin as possible for heat dissipation.

  In the temporary fixing, first, alignment is performed to correct the position while performing image processing on the alignment mark provided on the recording element attracted by the finger. Next, the recording element is pressed and bonded to the element substrate to which the adhesive has been supplied in advance, so that the adhesive protrudes from the outer peripheral portion of the recording element. At this time, as shown in FIG. 1A, both ends of the recording element are irradiated with UV light 401a to cure the adhesive and temporarily fix the recording element.

  However, if the UV light at the time of temporary fixing is excessively irradiated, curing of the adhesive applied not only to the outer periphery of the recording element but also to other portions proceeds. Therefore, it has been a problem to limit the irradiation region of the UV light so as to cure the adhesive at a desired location in temporarily fixing the recording element.

  An object of the present invention is to temporarily fix a recording element by UV light irradiation, to cure the adhesive in a short time and to bond the recording element, and to require the minimum necessary UV light required for temporary fixing. It is to provide a mounting device having fingers that can be irradiated only in a place.

In order to solve the above-mentioned problems, the present invention provides a mounting apparatus for high-precision bonding and fixing a semiconductor component with an adhesive.
To the finger that sucks and bonds the semiconductor component,
An adsorption part for adsorbing semiconductor components;
A light shielding portion that is at least larger than the outer shape of the recording element;
A through-hole slit for temporary fixing,
Is provided.

  According to the invention, it is possible to irradiate the UV light irradiated at the time of temporary fixing in the mount of the recording element by limiting to the minimum necessary irradiation region.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to examples.

  A first embodiment of the present invention will be described.

  In the mounting process, the recording elements 201 and 202 are bonded and fixed to the bonded assembly of the macro member 301 and the element substrate 100 with high accuracy. Specifically, an absolute accuracy that defines the bonding position of the recording element with respect to the reference of the element substrate 101 and a relative accuracy that defines the relative position of the plurality of recording elements are required. This is because it is a core process for defining the position of the ejection port for ejecting ink in the inkjet recording head.

  As the adhesive, a UV / thermosetting combined curing type is used. It consists of an epoxy resin, a photo / thermal polymerization initiator, and an epoxy silane coupling agent.

  The process for mounting the recording element on the element substrate will be described below.

  FIG. 2 is a plan view showing an outline of the mounting apparatus according to the present invention.

1. The component supply 1 is a temporary storage base for recording elements, and is provided with suction holes for sucking the recording elements. When the recording element is supplied, it is fixed by suction. Reference numeral 2 denotes a temporary placement base for the element substrate, which is brought into contact with an abutment pin or the like to determine the temporary placement position of the element substrate.

2. Adhesive application Supplies the adhesive to the joined body of the element substrate and the macula member. The element substrate placed on the temporary placement table is sucked by an element substrate transfer finger (not shown) and transferred from the temporary placement table to the transfer positioning table 3. At this time, the positioning clamps in the x direction and the y direction are alternately operated to position the element substrate against the positioning pins provided on the transfer positioning table from the x direction and the y direction, and then provided on the transfer positioning table. Adsorb and fix in the suction holes.

  The adhesive (ultraviolet / heat combined curing type) is spread thinly on the rotary stage 4a in advance with a thickness of about 0.1 mm. The rotating stage rotates at a constant speed in the direction of the arrow (arrow), and a thin adhesive layer is formed on the transfer stage by a squeegee set with a gap of about 0.1 mm. The adhesive is transferred by the lowering and raising of the transfer pin 4b, and transferred and supplied to the joined body of the macula member and the element substrate.

3. Image processing / alignment The element substrate supplied with the adhesive in the above-described transfer process 2 is adsorbed by an element substrate transfer finger (not shown) and transferred from the transfer positioning table to the work receiving table (FIG. 3) 5b on the index unit. The

  Similarly, the recording element attracted to the temporary placing table of the recording element 1 is moved back and forth by moving the temporary placing table back and forth and transferred to the fingers.

  The index that adsorbs the recording element to the finger rotates in the direction of the alignment unit 7 while maintaining the state. Therefore, the recording element is transferred from the finger to the alignment unit in order to align the recording element.

  The recording element delivered to the alignment unit is fixed by suction, and the x-direction, y-direction, and θ are corrected while recognizing the image of the alignment mark arranged on the recording element, and driven to a predetermined accuracy. When a plurality of recording elements are provided, the operation 3 is sequentially performed for each chip.

4). Bonding / Temporary UV Irradiation When the image processing at the bonding position of the recording element is completed, the recording element is delivered to the finger again. The recording element is bonded to the joined member of the macula member and the element substrate while holding the position of the recording element by the finger adsorption, and the adhesive is spread on the element substrate and protrudes from the outer periphery of the recording element. At this time, the recording element is temporarily fixed by curing the adhesive that protrudes by irradiation with UV light.

5. Additional UV irradiation An ink liquid chamber (AE) is formed on the silicon substrate constituting the recording element. In the temporary fixing, the adhesive in the outer peripheral portion of the recording element, particularly in the region irradiated with UV light is cured, but the adhesive existing between the recording element and the element substrate not directly irradiated with UV light remains uncured. . Therefore, UV light irradiation is added so that the uncured adhesive does not crawl up from the AE and clog the discharge port. In particular, UV light is applied to the end of the AE that tends to creep.

6). Heat cure In order to cure and fix the portion that is not cured with UV light, heat in a clean oven set at 150 ° C. and heat for a predetermined time.

  Thus, a mount unit that is a joined body of the recording element and the element substrate is completed.

  FIG. 1 is a plan view showing a state of fingers and temporary fixing.

  FIG. 1A is a plan view showing a conventional finger and a spreading method 401c of an adhesive at the time of bonding and an irradiation region 401a of UV light.

  The finger 401b is smaller than the longitudinal outer dimension of the recording element, and both ends of the recording element are exposed. Then, UV light is applied to the end portions (four locations) of the recording element, and the recording element is temporarily fixed. An area within a broken line 401b is an adsorption portion of the recording element, and an adsorption groove of a normal finger is provided in an area that does not reach the ejection port.

  FIG.1 (b) is the finger in this invention.

  The longitudinal outer dimension of the finger is larger than that of the recording element, and the finger itself has a slit 401e formed of a through hole for UV light irradiation. The slits are provided in the vicinity of both ends of the outer shape of the recording element so that the adhesive protruding from the outer periphery of both ends of the recording element can be irradiated. Further, since the finger is formed integrally with the suction portion that sucks the recording element, it can be provided with high accuracy. Furthermore, since the slit can be formed according to the difference in the size of the recording element, the common design of the fingers is possible.

  A second embodiment of the present invention will be described.

  FIG. 8 is a side view showing a state of temporary fixing of the recording element, FIG. 8 (a) is a conventional temporary fixing, and FIG. 8 (b) is a side view showing a second embodiment of the present invention.

  As shown in FIG. 8A, conventionally, the recording element is overlapped from the finger, and UV light is irradiated to the protruding adhesive. On the apparatus, as shown in the figure, irradiation is performed with a slight angle (θ = 20 ° or less) instead of the vertical direction. Furthermore, as the UV illuminance is set to be high at this time, it is understood that the curing of the adhesive in the region not directly irradiated with light, that is, the adhesive existing between the back surface of the recording element and the element substrate proceeds. Yes.

  Therefore, in the second embodiment of the present invention, as shown in FIG. 9, a UV fixing slit for temporary fixing is limited to a specific location.

  For example, FIG. 9A is limited to the corner of the recording element. FIG. 9B is limited to the central portion of the end of the recording element. In this way, by limiting the optimum UV irradiation region according to the size (length and width) of the recording element, the curing of the adhesive with UV light in temporarily fixing the recording element is limited to the minimum necessary. This uncured adhesive can be cured by heat curing to obtain strong adhesiveness.

  The finger according to the present invention is formed in the same part as the suction portion of the recording element, so that the irradiation area can be set with high accuracy, and the irradiation area required for temporarily fixing the recording element independent of the change in the size of the recording element. Can be set.

(A) is a figure which shows the conventional finger, (b) is a figure which shows the finger in this invention, (c) is a top view which shows the conventional finger Schematic plan view showing a mounting device in the present invention (A) Side view of finger, (b) Side view showing finger unit FIG. 3 is an exploded perspective view showing components of the recording element unit according to the present invention. The perspective view which shows the recording element unit in this invention The perspective view which shows the inkjet recording head in this invention 1 is an exploded perspective view showing components of a recording element in the present invention. (A) is a side view showing conventional temporary fixation, (b) is a side view showing temporary fixation in the present invention. The top view of the finger explaining 2nd Example of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Temporary placement stand 2 Recording element placement stand 3 Transfer positioning stand 4a Rotating stage 4b Transfer pin 5 Index unit 5a Finger 5b Index receiving stand 5c Recording element adsorption hole 5d Recording element adsorption surface 5e Wear-resistant component 5f Adsorption air Joint 5g Guide 6 Index unit 7 Alignment unit 10 Recording element unit 11 Adhesive 1
12 Adhesive 2
100 element substrate 201 recording element (color)
202 Recording element (black)
301 Second substrate 401 Electric wiring tape 401a UV light irradiation area 401b Finger 401c Adhesive spreading method 401d Cover layer 401e Slit

Claims (5)

In a mounting device for high-precision bonding and fixing of semiconductor components with adhesives,
To the finger that sucks and bonds the semiconductor component,
An adsorption part for adsorbing semiconductor components;
A light shielding portion that is at least larger than the outer shape of the recording element;
A through-hole slit for temporary fixing,
A mounting device characterized by comprising:   The mounting device according to claim 1, wherein the through-hole slit is formed integrally with the suction portion in the finger and is provided at a plurality of positions with high accuracy.   The mounting device according to claim 1, wherein a through-hole slit is formed in the finger at a position corresponding to at least one of the outer regions of the recording element.   The mounting apparatus according to claim 1, wherein the adhesive is a thermosetting UV curable adhesive.   The mounting device is a mounting device for an ink jet head, wherein a recording element having a discharge port for discharging ink and a discharge generating element formed on a silicon substrate is bonded and fixed on the element substrate with high precision by an adhesive. Item 2. The mounting device according to Item 1.

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