JP2018001563A - Liquid jet head and liquid jetting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent adhesion of a liquid, which is discharged from a head part 2, onto an electronic component 6a which is mounted on a flexible circuit board 4.SOLUTION: A liquid jet head 1 has a terminal row 3 in which plural terminals T are arranged, and comprises a head part 2 which discharges droplets according to a driving signal inputted to the terminal row 3, and a flexible circuit board 4 on which a wiring row 5, which is electrically connected to the terminal row 3, and an electronic component 6a, which is electrically connected to the wiring row 5, are mounted. The flexible circuit board 4 comprises a mounting area 4a for mounting the electronic component 6a and a folding area 4b which covers the electronic component 6a by folding thereof.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a liquid ejecting head and a liquid ejecting apparatus for ejecting and recording droplets on a recording medium.

  In recent years, an ink jet type liquid ejecting head has been used in which ink droplets are ejected onto recording paper or the like to record characters and figures, or a liquid material is ejected onto the surface of an element substrate to form a functional thin film. In this method, a liquid such as ink or a liquid material is supplied from a liquid tank to a channel of a liquid ejecting head via a supply pipe, and pressure is applied to the liquid in the channel to discharge the liquid from a nozzle communicating with the channel. When ejecting droplets, the liquid ejecting head and the recording medium are moved to record characters and figures, or a functional thin film or a three-dimensional structure having a predetermined shape is formed.

  The liquid ejecting head ejects droplets such as ink from nozzles and records on a recording medium. When ejecting droplets, droplets fly toward the non-recording medium, and sprayed liquid drifts around the head portion and adheres to the circuit board. When the liquid has conductivity, the liquid adheres to the circuit board and current leaks, causing malfunction. In order to prevent this, measures such as applying an insulating protective film to the surface of the conductive pattern of the circuit board and covering the circuit board and electronic components mounted on the circuit board by attaching a head cover are taken. ing.

  For example, in Patent Document 1, it is possible to prevent a liquid from entering between a piezoelectric unit for discharging droplets and a flexible wiring unit that transmits a drive signal to the piezoelectric unit and causing a short circuit between the electrodes. Measures are taken. The wiring unit is stacked on the piezoelectric unit, and a large number of electrodes of the wiring unit and a large number of electrodes of the piezoelectric unit are simultaneously electrically connected by thermocompression bonding via bumps sandwiched therebetween. At this time, a groove is formed in the outer peripheral portion of the wiring unit, a sealing material is introduced into the groove, and the outer periphery of the crimping region, that is, the electrode connection region is sealed with the sealing material. This prevents ink from entering the electrode connection region.

JP 2009-107266 A

  The atomized liquid floating around the head has a small particle size. Therefore, even if the head cover is provided to cover the circuit board, liquid may enter the head cover through a slight gap and adhere to the circuit board. Moreover, when mounting an electronic component on a flexible circuit board, the electrode for mounting the electronic component is exposed to the outside. If liquid adheres to the exposed portion, it may cause current leakage or malfunction. In order to prevent this current leakage, a method of applying a coating agent to the surface of the substrate can be considered, but problems such as dissolution or peeling of the coating agent by the liquid to be discharged may remain. Moreover, although the method of patent document 1 describes sealing about the area | region where a wiring unit and a piezoelectric body unit electrically connect, the method of sealing the exposed electrode which mounts an electronic component in a flexible circuit board May not be applicable.

  The liquid ejecting head of the present invention has a terminal row in which a plurality of terminals are arranged, a head unit that ejects liquid droplets according to a drive signal input to the terminal row, and a wiring that is electrically connected to the terminal row And a flexible circuit board on which an electronic component electrically connected to the wiring row is mounted, and the flexible circuit board covers the electronic component by folding back with a mounting area for mounting the electronic component. And a folded area.

  The flexible circuit board is made of polyimide.

  Further, the outer edge of the folded area is bonded to the mounting area.

  In addition, an adhesive pattern is provided on each of the outer edge portion and the facing portion of the mounting region facing the outer edge portion, and the adhesive pattern of the outer edge portion and the adhesive pattern of the facing portion are bonded via solder. did.

  Further, the width of the folded region in the reference direction is wider than the width of the mounting region in the reference direction, with a direction in which the plurality of terminals are arranged as a reference direction.

  Further, a substrate is provided on the side of the flexible circuit board opposite to the side on which the electronic component is mounted, and an outer edge portion of the folded region is bonded to the substrate.

  Further, the direction in which the plurality of terminals are arranged is defined as a reference direction, and a broken line formed by folding the folded region is parallel to the reference direction.

  In addition, with the direction in which the plurality of terminals are arranged as a reference direction, a broken line formed by folding the folded region intersects the reference direction.

  In addition, another electronic component is mounted on the folded region, and the electronic component and the other electronic component are covered by folding the folded region.

  The liquid ejecting apparatus of the present invention includes any one of the liquid ejecting heads described above, a moving mechanism that relatively moves the liquid ejecting head and the recording medium, a liquid supply pipe that supplies liquid to the liquid ejecting head, A liquid tank for supplying the liquid to the liquid supply pipe.

  A liquid jet head according to the present invention includes a terminal row in which a plurality of terminals are arranged, a head unit that discharges liquid droplets according to a drive signal input to the terminal row, and a wiring row that is electrically connected to the terminal row. And a flexible circuit board for mounting an electronic component electrically connected to the wiring row. The flexible circuit board includes a mounting area for mounting the electronic component and a folded area for covering the electronic component by folding. Thereby, it is possible to easily prevent the liquid ejected from the head portion from adhering without coating the electronic component mounted on the flexible circuit board and the electrode connected to the electronic component or installing an additional protective cover. be able to.

FIG. 3 is an explanatory diagram of a liquid ejecting head according to the first embodiment of the invention. 4 is a schematic cross-sectional view of a portion XX of the liquid jet head according to the first embodiment of the present invention. FIG. FIG. 10 is an explanatory diagram of a liquid jet head according to a second embodiment of the present invention. FIG. 10 is an explanatory diagram of a liquid jet head according to a third embodiment of the present invention. FIG. 10 is a schematic diagram illustrating a state in which a folded area of a flexible circuit board of a liquid jet head according to a fourth embodiment of the present invention is open. FIG. 10 is a schematic perspective view of a liquid ejecting apparatus according to a fifth embodiment of the invention.

(First embodiment)
FIG. 1 is an explanatory diagram of a liquid jet head 1 according to the first embodiment of the present invention. FIG. 1A is a schematic diagram showing a state in which the folded region 4b of the flexible circuit board 4 is opened and the head portion 2 and the flexible circuit board 4 are separated, and FIG. FIG. 6 is a schematic diagram showing a state in which the folded region 4b is folded back along the broken line B to the mounting region 4a and the mounting region 4a is connected to the head unit 2. FIG. 2 is a schematic cross-sectional view of the portion XX in FIG.

  As shown in FIGS. 1 and 2, the liquid ejecting head 1 includes a terminal row 3 in which a plurality of terminals T are arranged, and a head unit 2 that ejects liquid droplets according to a drive signal input to the terminal row 3. And a wiring line 5 electrically connected to the terminal line 3, and a flexible circuit board 4 on which an electronic component 6 a electrically connected to the wiring line 5 is mounted. The flexible circuit board 4 includes a mounting area 4a for mounting the electronic component 6a and a folded area 4b that covers the electronic component 6a by folding. As a result, the liquid ejected from the head part 2 can be applied to the electronic component 6a or the electronic component 6a mounted on the flexible circuit board 4 without coating the electrode connected to the electronic component 6a or the electronic component 6a. It is possible to easily prevent adhesion to the electrode connected to the electronic component 6a.

  This will be specifically described. The flexible circuit board 4 includes a mounting area 4a on which the electronic component 6a is mounted, a folded area 4b that covers the electronic component 6a by folding it back, an external circuit, and recording data from the external circuit. And an external connection region 4c for transmitting to the network. The mounting area 4a includes a wiring row 5 composed of a large number of wiring patterns Hb arranged in the reference direction K. As shown in FIG. 1A, when the flexible circuit board 4 is opened and viewed from the vertical direction of the board surface, the folded area 4b continuously extends upward from the mounting area 4a, and the external connection area 4c is the mounting area. The wiring line 5 extends continuously to the left from 4a, and the wiring row 5 is located at the lower end of the mounting region 4a.

  The folded region 4b includes an adhesive pattern 7b on the outer edge G of the surface Sa. The mounting region 4a includes the adhesive pattern 7a at a position facing the adhesive pattern 7b when the folded region 4b is folded back to the surface Sa side of the mounting region 4a. The adhesion patterns 7a and 7b can be formed by plating nickel, gold or the like on the copper foil or copper foil. As shown in FIG. 2, the surface Sa of the mounting region 4 a further includes a plurality of wiring patterns Ha from which part or all of the surface is exposed, and some of the wiring patterns Ha pass through the through-electrodes 12 and the mounting region 4 a. Are electrically connected to the wiring pattern Hb located on the back surface Sb of the substrate. The wiring pattern Hb on the back surface Sb of the mounting region 4a is covered with the protective film 13. The electronic component 6a is mounted on the plurality of wiring patterns Ha by wire bonding or planar mounting.

  The folded region 4b is folded along the fold line B, and the adhesive pattern 7b in the folded region 4b and the adhesive pattern 7a in the mounting region 4a are bonded via the solder 10. As shown in FIG. 1, in the case of the present embodiment, the broken line B formed by folding the folded region 4 b is parallel to the reference direction K. The adhesive patterns 7a and 7b after being folded have a U shape, and the opening side of the U shape is the broken line B side. The external connection region 4 c has an L shape in a plan view when viewed from the vertical direction of the substrate surface of the flexible circuit board 4, and the tip of the L-shaped base is the left side of the mounting region 4 a, that is, between the broken line B and the wiring row 5. The connector 9 is provided at the upper end of the L-shape.

  The flexible circuit board 4 can use a base substrate 11 made of a polyimide film, and includes a wiring pattern Ha and a wiring pattern Hb on the front surface Sa and the back surface Sb of the base substrate 11, respectively. The wiring patterns Ha and Hb can be formed by plating nickel, gold or the like on a copper foil or copper foil. The adhesive patterns 7a and 7b on the surface Sa and the wiring pattern Ha can be simultaneously formed by photolithography and etching processes. The wiring pattern Hb on the rear surface Sb is aggregated at the lower end of the mounting area 4a and constitutes a wiring row 5 arranged in the reference direction K. The wiring patterns Ha and Hb are covered with a protective film 13 made of a polyimide film or the like. The protective film 13 is removed from the wiring pattern Ha in a region electrically connected to the electronic component 6a. The folding region 4b covers the electronic component 6a mounted on the mounting region 4a by folding along the folding line B. The head unit 2 includes a terminal row 3 arranged in the reference direction K. The wiring row 5 of the flexible circuit board 4 and the terminal row 3 of the head part 2 are electrically connected. More specifically, the protective film 13 is removed from the surface of the large number of wiring patterns Hb constituting the wiring row 5 and electrically connected to each of the numerous terminals T constituting the terminal row 3.

  For example, when the electronic component 6a is a driver IC that generates a driving signal for driving the head unit 2, the wiring pattern of the electrode terminals and lead wires of the driver IC and the region electrically connected to the electrode terminals and lead wires Ha is exposed on the surface Sa side of the mounting region 4a. A large number of wiring patterns Hb on the back surface Sb of the mounting region 4a are covered with the protective film 13, and the wiring patterns Hb of the wiring row 5 from which the protective film 13 is removed are covered with the head portion 2 with an adhesive interposed therebetween. Even if the ejected liquid adheres, there is no problem that an electrical short circuit or an electrical signal leaks.

  The adhesive patterns 7 a and 7 b can be formed by a copper foil pattern, and the adhesive pattern 7 a and the adhesive pattern 7 b can be bonded by the solder 10. The copper foil pattern can be formed by patterning a copper foil placed on the surface Sa of the base substrate 11 through a photolithography process and an etching process. Cream solder can be used as the solder 10. Cream solder is applied to the adhesive pattern 7 a and / or the adhesive pattern 7 b, heated and melted to adhere the adhesive pattern 7 a and the adhesive pattern 7 b with the solder 10. Cream solder includes conductors such as Sn, Ag, and Pb. Further, Au—Sn solder may be used. If the adhesive pattern 7a in the mounting region 4a and the adhesive pattern 7b in the folded region 4b are continuously formed, the folded region 4b is folded back, and the adhesive pattern 7a and the adhesive pattern 7b are heated and bonded via the solder 10, the electronic component 6a And the wiring pattern Ha can be completely sealed by the flexible circuit board 4. Since the polyimide constituting the base substrate 11 of the flexible circuit board 4 is excellent in solution resistance and chemical resistance, a liquid discharged from the head unit 2 to the area of the electronic component 6a covered by the folded area 4b, for example, ink Ink mist generated by ejection or ink adhering during the operation does not enter.

  As a result, the electronic component 6 a can be completely shielded from the external space by the flexible circuit board 4, and the cover that covers the electronic component 6 a in the mounting region 4 a and the wiring pattern Ha connected to the electronic component 6 a separately from the flexible circuit board 4. In addition, liquid-proof properties against liquids such as ink discharged from the head unit 2 can be ensured without the need for a mold member. Therefore, even when a conductive liquid is used, an electrical signal does not leak, and malfunction can be prevented.

  In the present embodiment, the adhesive pattern 7a and the adhesive pattern 7b are formed of a copper foil pattern and bonded by the solder 10, but the present invention is not limited to this configuration. For example, instead of the adhesive patterns 7a and 7b made of copper foil, an adhesive is disposed on the outer edge G of the folded region 4b or the facing portion F of the mounting region 4a, and the outer edge G of the folded region 4b and the mounting region 4a. You may adhere | attach the opposing part F through an adhesive agent. Further, in this embodiment, the wiring row 5 in which a large number of wiring patterns Hb are aggregated is installed on the back surface Sb opposite to the front surface Sa of the mounting area 4a on which the electronic component 6a is mounted. It is not limited to. The electronic component 6a in the mounting area 4a and the wiring row 5 aggregated by the wiring pattern Ha may be installed on the same surface Sa, and the head unit 2 may be bonded from the surface Sa side of the mounting area 4a.

  Further, in this embodiment, the folded region 4b is folded back to the mounting region 4a and the adhesive pattern 7a and the adhesive pattern 7b are adhered to completely shield the electronic component 6a from the external space. It is not limited to. Adhesive patterns 7a and 7b are not provided in a part of the adhesive patterns 7a and 7b, for example, the folded region 4b and the region on the wiring row 5 side of the mounting region 4a, but only in the vicinity of both sides between the broken line B and the wiring row 5 7a and an adhesive pattern 7b are provided. Then, the folded region 4b may be folded back to the mounting region 4a to bond the adhesive pattern 7a and the adhesive pattern 7b near the left and right sides. In this case, on the wiring line 5 side where the adhesive patterns 7a and 7b are not provided, a gap is formed between the folded region 4b and the mounting region 4a. However, since the folded region 4b covers the electronic component 6a, the electronic component 6a and the wiring pattern The liquid adhering to Ha is reduced. Further, when the gap between the folded region 4b on the wiring row 5 side and the mounting region 4a is narrow, even if liquid adheres to the narrow gap on the wiring row 5 side, the narrow gap is blocked by the liquid capillary phenomenon, The liquid cannot enter the region of the electronic component 6a where the space between the mounting region 4a and the folded region 4b is wide, and the liquidproof property for the electronic component 6a and the electrode connected to the electronic component 6a is ensured. Moreover, it can replace with a polyimide film as the base substrate 11 of the flexible circuit board 4, and can use another synthetic resin film and another flexible substrate.

  Further, in the connection structure between the flexible circuit board 4 and the head portion 2, in the present embodiment, a plurality of wiring patterns Hb in the wiring row 5 and a plurality of terminals T in the terminal row 3 are arranged in a row in the reference direction K, respectively. However, the present invention is not limited to this connection structure. A plurality of wiring patterns Hb in the wiring row 5 are two-dimensionally arranged in a direction intersecting the reference direction K and the reference direction K. Similarly, a plurality of terminals T in the terminal row 3 intersect the reference direction K and the reference direction K. It may be a connection structure that is two-dimensionally arranged in the direction in which it is to be performed.

(Second embodiment)
FIG. 3 is an explanatory diagram of the liquid jet head 1 according to the second embodiment of the present invention. FIG. 3A is a schematic diagram showing a state in which the folded region 4b of the flexible circuit board 4 is opened and the head portion 2 and the flexible circuit board 4 are separated. FIG. FIG. 4 is a schematic diagram showing a state in which the folded region 4b is folded back along the broken line B to the mounting region 4a and the mounting region 4a is connected to the head portion 2. The difference from the first embodiment is that a broken line B between the mounting region 4a and the folded region 4b intersects the reference direction K, and the other configuration is the same as that of the first embodiment. Therefore, in the following description, differences from the first embodiment will be mainly described. The same portions or portions having the same function are denoted by the same reference numerals.

  As shown in FIG. 3, the liquid ejecting head 1 includes a terminal row 3 in which a plurality of terminals T are arranged in a reference direction K, and a head unit 2 that ejects liquid droplets according to a drive signal input to the terminal row 3. And a flexible circuit board 4 having a wiring row 5 electrically connected to the terminal row 3 and mounting an electronic component 6 a electrically connected to the wiring row 5. The flexible circuit board 4 includes a mounting area 4a for mounting the electronic component 6a and a folded area 4b that covers the electronic component 6a by folding. Here, the broken line B formed by folding the folding region 4b intersects the reference direction K. More specifically, the polygonal line B and the reference direction K are orthogonal.

  This will be specifically described. The flexible circuit board 4 includes a mounting area 4a on which the electronic component 6a is mounted, a folded area 4b that covers the electronic component 6a by folding it back, an external circuit, and recording data from the external circuit. And an external connection region 4c for transmitting to the network. As shown in FIG. 3A, when the flexible circuit board 4 is opened and viewed from the vertical direction of the board surface, the folded area 4b continuously extends rightward from the mounting area 4a, and the external connection area 4c is The wiring line 5 extends continuously upward from the mounting area 4a, and the wiring row 5 is positioned below the mounting area 4a. Adhesive patterns 7b and 7a are provided on the outer edge portion G of the surface Sa of the folded region 4b and the facing portion F of the surface Sa of the mounting region 4a that faces when the folded region 4b is folded. The folded region 4b is folded, and the adhesive pattern 7b in the folded region 4b and the adhesive pattern 7a in the mounting region 4a are bonded via the solder 10.

  As a result, as in the first embodiment, the electronic component 6a mounted on the flexible circuit board 4 and the electrode connected to the electronic component 6a are coated or the head portion 2 can be used without installing an additional protective cover. It is possible to easily prevent the liquid to be discharged from adhering to the electronic component 6a or the electrode connected to the electronic component 6a. In the present embodiment, since the external connection region 4c is connected to the upper side of the mounting region 4a, the left and right widths of the flexible circuit board 4 can be configured to be narrower than in the first embodiment.

  In addition, since the material of the flexible circuit board 4, the configuration and material of the adhesive patterns 7a and 7b, the wiring row 5 and the head portion 2 are the same as those in the first embodiment, the description thereof is omitted. Similarly to the first embodiment, the folded region 4b may be folded and bonded to the mounting region 4a without providing a part of the bonding patterns 7a and 7b.

(Third embodiment)
FIG. 4 is an explanatory diagram of the liquid jet head 1 according to the third embodiment of the present invention. FIG. 4A is a schematic view showing a state in which the folded region 4b of the flexible circuit board 4 is opened and the head portion 2 and the flexible circuit board 4 are separated. FIG. FIG. 4 is a schematic diagram showing a state in which the folded region 4b is folded back along the broken line B to the mounting region 4a and the mounting region 4a is connected to the head portion 2. The same portions or portions having the same function are denoted by the same reference numerals.

  As shown in FIG. 4, the liquid ejecting head 1 includes a terminal row 3 in which a plurality of terminals T are arranged in the reference direction K, and a head portion 2 that ejects liquid droplets according to a drive signal input to the terminal row 3. And a flexible circuit board 4 for mounting an electronic component 6a electrically connected to the wiring array 5 and an electronic component 6a of the flexible circuit board 4 are mounted. And a substrate 8 positioned on the back surface Sb opposite to the front surface Sa.

  This will be specifically described. The flexible circuit board 4 includes a mounting area 4a on which the electronic component 6a is mounted, a folded area 4b that covers the electronic component 6a by folding it back, an external circuit, and recording data from the external circuit. And an external connection region 4c for transmitting to the network. As shown in FIG. 4A, in a plan view when the flexible circuit board 4 is opened and viewed from the vertical direction of the board surface, the folded area 4b continuously extends upward from the mounting area 4a, and the external connection area 4c is mounted. The wiring line 5 extends continuously to the left from the region 4a, the wiring line 5 is located below the mounting region 4a, and the substrate 8 is on the back surface Sb opposite to the front surface Sa on which the electronic component 6a of the mounting region 4a is mounted. Connect via adhesive. Therefore, if a material having high thermal conductivity, such as a metal material, is used as the substrate 8, a function of radiating heat from the electronic component 6a can be provided.

  The width of the folded region 4b in the reference direction K is wider than the width of the mounting region 4a in the reference direction K. Moreover, the board | substrate 8 is provided with the width | variety which protrudes from the both sides of the reference direction K of the mounting area | region 4a at least. An adhesive pattern 7b is provided on the outer edge G of the folded region 4b. As shown in FIG. 4B, the folded region 4b is folded along a fold line B parallel to the reference direction K, and the substrate 8 protruding from the outer edge G of the folded region 4b and the mounting region 4a, that is, the outer edge G. And the facing portion F of the substrate 8 facing each other are bonded via an adhesive. As a result, the liquid ejected from the head part 2 can be applied to the electronic component 6a or the electronic component 6a mounted on the flexible circuit board 4 without coating the electrode connected to the electronic component 6a or the electronic component 6a. It is possible to easily prevent adhesion to the electrode connected to the electronic component 6a.

  Also in the present embodiment, the adhesive pattern 7b of the folded region 4b can be configured by a copper foil pattern. In addition, a conductive pattern is placed on the facing portion F of the substrate 8 that is opposed when the outer edge G of the folded region 4b and the folded region 4b are folded, and the folded region 4b is folded to connect the adhesive pattern 7b and the conductive pattern of the substrate 8 together. It can be bonded via the solder 10. When the substrate 8 is a metal substrate, the adhesive pattern 7b in the folded region 4b and the substrate 8 can be directly connected by solder paste or the like. In addition, the adhesive pattern 7b is provided on the outer edge G in the vicinity of the upper side of the folded region 4b as in the first embodiment, and the outer edge G of the folded region 4b and the mounting region 4a facing when the folded region 4b is folded. The adhesive pattern 7 a may be disposed in the facing portion F, and the adhesive pattern 7 b in the folded region 4 b and the adhesive pattern 7 a in the mounting region 4 a may be bonded via the solder 10.

  As a result, the electronic component 6a can be shielded from the external space by the flexible circuit board 4, and the head portion can be obtained without requiring a cover or a mold member that covers the electronic component 6a in the mounting region 4a separately from the flexible circuit board 4. The liquid-proof property with respect to the liquid discharged from 2 can be ensured. Therefore, even when a conductive liquid is used, an electrical signal does not leak, and malfunction can be prevented.

  If the adhesive patterns 7b and 7a are not provided in a part of the adhesive patterns 7a and 7b, for example, the outer edge G on the upper side of the folded area 4b and the facing part F on the wiring array 5 side of the mounting area 4a, respectively. On the side 5, a gap is formed between the folded region 4 b and the mounting region 4 a. However, since the folded region 4 b covers the electronic component 6 a, the liquid attached to the electronic component 6 a and the wiring pattern Ha is reduced. Further, when the gap between the folded region 4b on the wiring row 5 side and the mounting region 4a is narrow, even if liquid adheres to the narrow gap on the wiring row 5 side, the narrow gap is blocked by the liquid capillary phenomenon, The liquid cannot enter the region of the electronic component 6a where the space between the mounting region 4a and the folded region 4b is wide, and the liquidproof property for the electronic component 6a and the electrode connected to the electronic component 6a is ensured.

  Moreover, although this embodiment is a case where the broken line B between the mounting area | region 4a and the folding | turning area | region 4b is parallel to the reference direction K like 1st embodiment, this invention is mounted like 2nd embodiment. This can be applied when a broken line B between the region 4a and the folded region 4b intersects the reference direction K. That is, when the folded area 4b is folded, the upper side or the left side of the folded area 4b protrudes outside the upper side or the left side of the mounting area 4a, and an adhesive pattern is formed on the outer edge G of the protruding area. 7b may be provided and bonded to the substrate 8 located on the back side of the mounting area 4a and protruding from the upper side or the left side of the mounting area 4a.

(Fourth embodiment)
FIG. 5 is a schematic diagram illustrating a state in which the folded region 4b of the flexible circuit board 4 of the liquid jet head 1 according to the fourth embodiment of the present invention is open. The difference from the flexible circuit board 4 of the first embodiment is that the folded region 4b mounts another electronic component 6b on the surface Sa, and the other configuration is the same as that of the first embodiment. The same portions or portions having the same function are denoted by the same reference numerals.

  As shown in FIG. 5, the flexible circuit board 4 is connected to an external circuit, a mounting region 4a for mounting an electronic component 6a on the surface Sa, a folded region 4b for mounting another electronic component 6b on the surface Sa, and an external circuit. An external connection area 4c for transmitting recording data and the like to the mounting area 4a. By folding the folded region 4b, the electronic component 6a and the other electronic component 6b are covered so as to be wrapped inside. The mounting area 4a includes a wiring row 5 composed of a large number of wiring patterns Hb arranged in the reference direction K. The folded region 4b continuously extends upward from the mounting region 4a, the external connection region 4c continuously extends leftward from the mounting region 4a, and the wiring row 5 is positioned below the mounting region 4a. Adhesive patterns 7b and 7a are provided on opposing portions F of the surface Sa of the mounting region 4a that face each other when the outer edge G of the surface Sa of the folded region 4b and the folded region 4b are folded. By folding back the folded region 4b, the adhesive pattern 7b in the folded region 4b and the adhesive pattern 7a in the mounting region 4a are bonded via the solder 10. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  Thereby, the electronic component 6a and other electronic components 6b can be completely shielded from the external space. As a result, the electronic component 6a mounted on the flexible circuit board 4, the other electronic component 6b or the electronic component 6a, without coating the electrode connected to the other electronic component 6b, or without installing an additional protective cover, It is possible to easily prevent the liquid discharged from the head unit 2 from adhering to the electronic component 6a, the other electronic component 6b, the electronic component 6a, and the electrode connected to the other electronic component 6b.

  As in the first embodiment, instead of bonding the bonding patterns 7a and 7b with the solder 10, the outer edge portion G of the folded region 4b and the facing portion F of the mounting region 4a are bonded using an adhesive. May be. In addition, the adhesive patterns 7a and 7b are not provided in a part of the adhesive patterns 7a and 7b, for example, the folded region 4b and the region on the wiring row 5 side of the mounting region 4a, but only near both sides between the broken line B and the wiring row 5. The adhesive patterns 7a and 7b may be provided, and the folded area 4b may be folded back to the mounting area 4a to bond the adhesive pattern 7a and the adhesive pattern 7b. Further, the folded region 4b may be configured as in the second embodiment, and another electronic component 6b may be mounted on the surface Sa of the folded region 4b.

(Fifth embodiment)
FIG. 6 is a schematic perspective view of a liquid ejecting apparatus 50 according to the fifth embodiment of the present invention. The liquid ejecting apparatus 50 uses the liquid ejecting head 1 according to any one of the first to fourth embodiments. The liquid ejecting apparatus 50 includes a moving mechanism 63 that reciprocates the liquid ejecting heads 1 and 1 ′, liquid supply pipes 53 and 53 ′ that supply liquid to the liquid ejecting heads 1 and 1 ′, and liquid supply pipes 53 and 53 ′. Liquid tanks 51 and 51 'for supplying liquid to the liquid crystal.

  This will be specifically described. The liquid ejecting apparatus 50 includes a pair of conveying units 61 and 62 that convey a recording medium 54 such as paper in the main scanning direction, liquid ejecting heads 1 and 1 ′ that eject liquid to the recording medium 54, and a liquid tank 51. , 51 ′, pumps 52, 52 ′ for supplying the liquid stored in the liquid supply pipes 53, 53 ′ and a moving mechanism for scanning the liquid jet heads 1, 1 ′ in the sub-scanning direction perpendicular to the main scanning direction. 63 etc.

  The pair of conveying means 61 and 62 includes a grid roller and a pinch roller that extend in the sub-scanning direction and rotate while contacting the roller surface. A grid roller and a pinch roller are moved around an axis by a motor (not shown), and the recording medium 54 sandwiched between the rollers is conveyed in the main scanning direction. The moving mechanism 63 connects a pair of guide rails 56, 57 extending in the sub-scanning direction, a carriage unit 58 that can slide along the pair of guide rails 56, 57, and the carriage unit 58 to move in the sub-scanning direction. An endless belt 59 is provided, and a motor 60 that rotates the endless belt 59 via a pulley (not shown) is provided.

  The carriage unit 58 mounts a plurality of liquid ejecting heads 1, 1 ′, and ejects four types of liquid droplets, for example, yellow, magenta, cyan, and black. The liquid tanks 51 and 51 'store liquids of corresponding colors and supply them to the liquid jet heads 1 and 1' via the pumps 52 and 52 'and the liquid supply pipes 53 and 53'. Each liquid ejecting head 1, 1 ′ ejects droplets of each color according to the drive signal. An arbitrary pattern is recorded on the recording medium 54 by controlling the timing of ejecting the liquid from the liquid ejecting heads 1, 1 ′, the rotation of the motor 60 that drives the carriage unit 58, and the conveyance speed of the recording medium 54. I can.

  In this embodiment, the moving mechanism 63 moves the carriage unit 58 and the recording medium 54 to perform recording. However, instead of this, the carriage unit is fixed and the moving mechanism is the recording medium. May be a liquid ejecting apparatus that moves and records two-dimensionally. That is, the moving mechanism may be any mechanism that relatively moves the liquid ejecting head and the recording medium.

DESCRIPTION OF SYMBOLS 1 Liquid ejecting head 2 Head part 3 Terminal row 4 Flexible circuit board, 4a Mounting area, 4b Folding area, 4c External connection area 5 Wiring row 6a Electronic component, 6b Other electronic components 7a, 7b Adhesive pattern 8 Substrate 9 Connector 10 Solder 11 Base substrate 12 Through electrode 13 Protective film T Multiple terminals, K Reference direction, B Broken line Ha, Hb Wiring pattern, G outer edge portion, F facing portion, Sa surface, Sb back surface

Claims (10)

A head section having a terminal array in which a plurality of terminals are arranged, and ejecting liquid droplets according to a drive signal input to the terminal array;
A flexible circuit board having a wiring row electrically connected to the terminal row and mounting an electronic component electrically connected to the wiring row;
The flexible circuit board is a liquid ejecting head including a mounting region for mounting the electronic component and a folded region that covers the electronic component by folding.   The liquid ejecting head according to claim 1, wherein the flexible circuit board is made of polyimide.   The liquid ejecting head according to claim 1, wherein an outer edge portion of the folded region adheres to the mounting region.   4. The method according to claim 3, wherein an adhesive pattern is provided on each of the outer edge portion and the opposing portion of the mounting region that faces the outer edge portion, and the adhesive pattern on the outer edge portion and the adhesive pattern on the opposing portion are bonded via solder. The liquid jet head described.   The liquid ejecting head according to claim 1, wherein a width in the reference direction of the folded region is wider than a width in the reference direction of the mounting region, with a direction in which the plurality of terminals are arranged as a reference direction.   The liquid ejecting head according to claim 1, further comprising a substrate on a side opposite to the side on which the electronic component is mounted of the flexible circuit board, and an outer edge portion of the folded region is bonded to the substrate. .   7. The liquid jet head according to claim 1, wherein a fold line formed by folding the folded region is parallel to the reference direction, with a direction in which the plurality of terminals are arranged as a reference direction.   7. The liquid jet head according to claim 1, wherein a broken line formed by folding the folding region intersects the reference direction with a direction in which the plurality of terminals are arranged as a reference direction.   9. The liquid jet head according to claim 1, wherein another electronic component is mounted in the folded region, and the electronic component and the other electronic component are covered by folding the folded region. A liquid jet head according to any one of claims 1 to 9,
A moving mechanism for relatively moving the liquid ejecting head and the recording medium;
A liquid supply pipe for supplying a liquid to the liquid ejecting head;
And a liquid tank that supplies the liquid to the liquid supply pipe.

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