JP3864987B2 - Flexible wiring board connection structure - Google Patents

Description

  The present invention relates to a connection structure for a flexible wiring board of an ink jet head in an ink jet recording apparatus.

  In a conventional ink jet recording apparatus, for example, four color ink cartridges of cyan, magenta, yellow, and black are used for color printing. The head holder that accommodates and holds these ink cartridges is provided with four inkjet heads for ejecting ink of each color, a circuit board for driving them, and the like. They are connected via a substrate and configured as a head unit. Then, ink is supplied from the ink cartridge to the ink jet head, and ink is ejected from the ejection nozzle to perform recording.

  As the recording quality has improved in recent years, the density of jet nozzles has increased, and the head terminals of inkjet heads and the terminal lands of flexible wiring boards connected to these head terminals have been adjusted accordingly. The arrangement is also increased in density. For this reason, when each head terminal and each terminal land are joined with a conductive brazing material such as solder, for example, each terminal land is limited within a limited arrangement area so that a solder bridge is not formed between adjacent solders. In order to ensure a sufficient distance therebetween, for example, in Patent Document 1, the terminal lands are arranged in a staggered manner. Then, as in Patent Document 2, solder is formed thinly on each terminal land, and the solder is heated and melted in a state where the head terminal is overlaid on the terminal land, so that each terminal land and each head terminal are joined. It is carried out.

Japanese Patent Laid-Open No. 7-50498 JP 9-46031 A

  However, in order to arrange the spray nozzles with a higher density, the terminal lands of the flexible wiring board must be arranged with a higher density. For this purpose, the shape and the arrangement interval of the terminal lands are accurately formed. In addition, the thickness and shape of the solder must be accurately formed thereon, and the head terminals must be accurately aligned. Nevertheless, there is a high possibility that the adjacent terminal lands will be short-circuited by the solder bridge. There was a problem with poor yield. In particular, in order to arrange the terminals at high density, the terminal lands are arranged in a staggered manner, and the conductors for connecting to the terminal lands are arranged between the terminal lands. Accuracy was required and manufacturing costs were high.

  The present invention was made to solve the above problems, and by devising the connection structure between each terminal land and each head terminal of the flexible wiring board, the arrangement density of each terminal land and each head terminal is increased, And it aims at providing the connection structure of the flexible wiring board of the inkjet head which can prevent a short circuit.

  In order to achieve the above object, the invention according to claim 1 is directed to a flexible wiring board connection structure for a plurality of head terminals for applying a driving voltage for ejecting ink to each of a plurality of channels provided in an inkjet head. A plurality of surface electrodes are provided in a row on the surface of the inkjet head, each surface electrode is formed in a substantially strip shape, and each head terminal is arranged in one column direction of the surface electrode. The flexible wiring board is alternately arranged in a staggered manner near one end and the other end in the longitudinal direction of the surface electrode, and the flexible wiring board includes a strip-shaped insulator having flexibility and the plurality of the inkjet heads. Corresponding to each of the head terminals, a plurality of terminal lands arranged on the insulator, and the plurality of terminal lands on the insulator, respectively. To be connected independently, and a plurality of conductors which are to wire to thread through the terminal lands of the other columns, and the terminal lands and the head terminals are electrically connected.

  The invention according to claim 2 is the flexible wiring board connection structure according to claim 1, wherein each of the head terminals is shorter than the surface electrode in the longitudinal direction of the surface electrode and extends in the width direction of the surface electrode. It is wider than the surface electrode.

  According to a third aspect of the present invention, in the flexible wiring board connection structure according to the first or second aspect, the surface electrodes are arranged in a staggered manner with the surface electrodes of the adjacent rows, and in each row of the surface electrodes, The head terminals are arranged in a staggered pattern.

  According to a fourth aspect of the present invention, in the flexible wiring board connection structure according to any one of the first to third aspects, the terminal land and the head terminal are electrically connected by heating and melting a conductive brazing material. Connected, the brazing material can flow onto the surface electrode from between the terminal land and the head terminal.

  The invention according to claim 5 is the flexible wiring board connection structure according to any one of claims 1 to 4, wherein the insulator of the flexible wiring board is formed with the wiring and the terminal land on one surface thereof. A through hole is formed to expose the terminal land to the head terminal.

  The invention according to claim 6 is the flexible wiring board connection structure according to any one of claims 1 to 4, wherein the flexible wiring board covers and covers the wiring and the terminal land formed on the insulator. A thin film is formed, and an exposure hole for exposing the terminal land to the head terminal is formed in the insulating thin film.

  According to a seventh aspect of the present invention, in the flexible wiring board connection structure according to the fifth or sixth aspect, an area where the terminal land is exposed is smaller than an area of the head terminal.

  According to an eighth aspect of the present invention, in the flexible wiring board connection structure according to any one of the first to seventh aspects, the surface electrode includes a drive electrode provided in a row corresponding to the plurality of channels. It is connected.

  According to a ninth aspect of the present invention, in the flexible wiring board connection structure according to the fifth aspect, the inkjet head further includes a surface electrode connected to a ground electrode on the surface.

  According to a tenth aspect of the present invention, in the flexible wiring board connection structure according to the eighth aspect, the surface electrode is connected to the drive electrode through a through hole.

  According to an eleventh aspect of the present invention, in the connection structure for a flexible wiring board according to the ninth aspect, the surface electrode is connected to the ground electrode through a through hole.

  The invention according to claim 12 is the flexible wiring board connection structure according to claim 10 or 11, wherein the through hole is connected to the center of the surface electrode.

  According to a thirteenth aspect of the present invention, in the flexible wiring board connection structure according to the ninth or eleventh aspect, the inkjet head includes a piezoelectric sheet on which the drive electrode is disposed and a piezoelectric sheet on which the ground electrode is disposed. And a piezoelectric actuator in which the two are bonded together.

  In the connection structure of the flexible wiring board according to the first aspect of the present invention, a plurality of substantially strip-shaped surface electrodes are provided in a row on the surface of the ink jet head, and each head terminal has one row direction of the surface electrode. Alternately arranged in a staggered manner near one end and the other end in the longitudinal direction of the surface electrode, and further connected independently to a plurality of terminal lands connected to each of the head terminals in the flexible wiring board. Since a plurality of conductors are wired so as to sew between terminal lands in other rows, a large number of head terminals can be arranged with high density.

  The connection structure of the flexible wiring board of the invention according to claim 2 is such that each head terminal is shorter than the surface electrode in the longitudinal direction of the surface electrode and wider than the surface electrode in the width direction of the surface electrode. It is electrically connected to the terminal land of the wiring board.

  In the flexible wiring board connection structure according to the third aspect of the invention, the surface electrodes are arranged in a staggered manner with the surface electrodes in the adjacent rows, and the head terminals are arranged in a staggered manner in each row of the surface electrodes. A large number of head terminals can be arranged with high density.

  In the connection structure of the flexible wiring board according to the fourth aspect of the invention, the terminal land and the head terminal can be electrically connected by heating and melting the conductive brazing material. At that time, the surplus brazing material can escape from between the terminal land and the head terminal onto the surface electrode, and the surplus brazing material can prevent a short circuit between adjacent head terminals.

  In the flexible wiring board connection structure of the invention according to claim 5, wiring and terminal lands are formed on one surface of the insulator of the flexible wiring board, and a through hole is formed to expose the terminal land to the head terminal. Therefore, the conductor and the terminal land can be separated from the head terminal by the insulator, and the adjacent conductor and terminal land are not short-circuited. Therefore, even if the head terminals and terminal lands are arranged at a high density, the tolerance accuracy of the arrangement can be lowered, and a single-sided board can be used as a flexible wiring board, which simplifies the production process and reduces the production cost. Can be reduced.

  In the flexible wiring board connection structure of the invention according to claim 6, an insulating thin film is formed on the flexible wiring board so as to cover the wiring and terminal land formed on the insulator, and the terminal land is used as a head terminal on the insulating thin film. Since the exposed hole to be exposed is formed, the conductor and the terminal land can be separated from the head terminal by the insulator, and the adjacent conductor and terminal land are not short-circuited. Therefore, even if the head terminals and terminal lands are arranged at a high density, the tolerance accuracy of the arrangement can be lowered, and a single-sided board can be used as a flexible wiring board, which simplifies the production process and reduces the production cost. Can be reduced.

  In the connection structure of the flexible wiring board according to the seventh aspect of the present invention, the area where the terminal land is exposed is smaller than the area of the head terminal, so that the configuration of the fifth or sixth aspect can be satisfactorily realized.

  In the flexible wiring board connection structure according to the eighth aspect of the present invention, the surface electrode is connected to the drive electrode provided in a row corresponding to the plurality of channels. In the flexible wiring board connection structure of the invention according to claim 9, a surface electrode connected to the ground electrode is further provided on the surface of the inkjet head. In the flexible wiring board connection structure of the invention according to claim 10, the surface electrode connected to the drive electrode is connected to the drive electrode through a through hole. In the flexible wiring board connection structure according to an eleventh aspect of the invention, the surface electrode connected to the ground electrode is connected to the ground electrode through a through hole. In the flexible wiring board connection structure according to the twelfth aspect of the invention, each through hole is connected to the center of each surface electrode. In the flexible wiring board connection structure according to the thirteenth aspect of the present invention, the inkjet head includes a piezoelectric actuator in which a piezoelectric sheet on which a drive electrode is disposed and a piezoelectric sheet on which a ground electrode is disposed are bonded together. Therefore, the configuration described in claim 1 and the like can be satisfactorily realized.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a connection state of the inkjet head 10, the flexible wiring board 13, and the driver circuit board 50. FIG. 2 is a plan view of the inkjet head 10, the flexible wiring board 13, and the driver circuit board 50. FIG. 3 is an enlarged perspective view of a part of the inkjet head 10.

  As shown in FIG. 1, one end of a strip-shaped flexible wiring substrate 13 is connected to the inkjet head 10, and a driver IC 51 for controlling a drive voltage applied to the inkjet head 10 is mounted on the other end. A circuit board 50 is connected.

  As shown in FIG. 2, the inkjet head 10 has a substantially rectangular shape in plan view, and the flexible wiring board 13 has a width corresponding to the substantially long side direction of the inkjet head 10 at one end so as to cover the upper surface thereof. Connected. The flexible wiring board 13 is extended with a band width on the other end side, and terminals 53 for connecting to the driver circuit board 50 are arranged in a line along the band width direction. The substantially rectangular driver circuit board 50 is connected to a control circuit (not shown) of the ink jet recording apparatus from a connector 52 provided at the edge opposite to the connection side with the terminal 53.

  As shown in FIG. 3, the inkjet head 10 includes a cavity unit 11 in which substantially rectangular metal plates and the like are stacked, and a piezoelectric actuator 12.

  A plurality of injection nozzles (not shown) are disposed on the synthetic resin plate 11a disposed in the lowermost layer (the −Z direction side in the drawing) of the nine laminated plates constituting the cavity unit 11, and the longitudinal direction of the plate 11a. Four rows are drilled along the direction (Y-axis direction in the figure), and each pair of two rows is in a staggered arrangement. In the uppermost metal plate 11 b, a plurality of channels 23 corresponding to the respective injection nozzles are arranged in a staggered manner in the longitudinal direction of the plate 11 c in the same manner as the respective injection nozzles. Connected to the nozzle. These channels 23 are each extended by a predetermined distance from the position of the communication path 25 in the short direction of the plate 11b. The metal plates stacked between the plates 11a and 11b have manifolds (not shown) extending in the longitudinal direction corresponding to the respective rows of the channels 23. In order to supply ink to each channel 23 of the corresponding row, the ink is connected to a position opposite to the communication path 25 of each channel 23 through the ink passage 30. Each manifold is connected to an ink supply hole 31 opened at one end in the longitudinal direction of the cavity unit 11, and ink is introduced into the manifold through the ink supply hole 31. Further, a filter 32 is stretched so as to cover each ink supply hole 31.

  The piezoelectric actuator 12 has a piezoelectric sheet 12 a on which a plurality of drive electrodes (not shown) corresponding to the respective channels 23 are arranged, and a ground electrode (not shown) arranged on almost the entire surface except the periphery of the through hole 41. The piezoelectric sheets 12b provided are alternately stacked and joined, and each drive electrode is connected to the corresponding surface electrode 39 provided on the surface of the uppermost piezoelectric sheet 12c through the through hole 41, The ground electrode is connected to the surface electrode 40 on the piezoelectric sheet 12c through the through hole 42. As with the channel 23, the surface electrodes 39 and 40 are provided in four rows along the longitudinal direction of the piezoelectric sheet 12a, and the two pairs of pairs are arranged in a staggered manner.

  Next, the structure of the connection portion between the inkjet head 10 and the flexible wiring board 13 will be described with reference to FIGS. FIG. 4 is a plan view of the surface electrode 39 on the piezoelectric sheet 12c in which the vicinity of the portion A in FIG. 2 is enlarged. FIG. 5 is a plan view of the terminal land 60 on the flexible wiring board 13 in which the vicinity of the portion B in FIG. 2 is enlarged. FIG. 6 is an enlarged cross-sectional view of the vicinity of the terminal land 60 on the flexible wiring board 13.

  As shown in FIG. 4, the surface electrodes 39 arranged on the uppermost piezoelectric sheet 12c of the piezoelectric actuator 12 of the inkjet head 10 are arranged in four rows in the longitudinal direction of the piezoelectric sheet 12c as described above. Of these, two rows (two rows in the Y-axis direction in FIG. 3) are paired and arranged in a staggered manner (the right hand side in the drawing is the driver circuit board 50 side shown in FIG. 1). Each surface electrode 39 has a substantially band shape, and the size thereof is provided in the piezoelectric sheet 12a (see FIG. 3) connected through the through hole 41 provided in the substantially central position of the surface electrode 39, respectively. Is substantially the same as the corresponding drive electrode (not shown). In addition, substantially rectangular head terminals 45 are provided on the respective surface electrodes 39 in accordance with the positions of the corresponding electrodes (terminal lands 60 described later) of the flexible wiring board 13. The head terminal 45 is configured to be wide in the width direction of the surface electrode 39 and short in the length direction, and alternately close to one end in the longitudinal direction in one row of the surface electrode 39 (one row in the Y-axis direction in the figure). Alternatively, they are arranged near the other end, that is, in a staggered manner.

  The flexible wiring board 13 is a board in which a copper foil is fixed on one surface of an insulator 13a made of a strip-shaped polyimide film, and a wiring pattern is provided by etching or the like (see FIG. 2). As described above, the terminal land 60 is provided at one end of the insulator 13a at a position corresponding to each head terminal 45. As shown in FIG. 5, each terminal land 60 is provided at an end portion of each individual conductive wire 61 forming the wiring pattern, and the terminal lands 60 are sewn between the arrangement positions, Conductive wires 61 connected to other terminal lands 60 are disposed (the right-hand side in the drawing is the driver circuit board 50 side shown in FIG. 1). Then, the end of each conductor 61 opposite to the side where the terminal land 60 is connected is connected to each of the terminals 53 arranged in the width direction at the other end of the insulator 13a. ing.

  As shown in FIG. 6, the insulator 13a of the flexible wiring board 13 is provided with a terminal land 60 on one surface (the surface on the + Z direction side in the figure), and from the other surface side, for example, a laser The through hole 62 is formed by a known processing method such as processing, plasma etching processing, or electrolytic etching processing. The terminal land 60 is exposed to the other surface side (the −Z direction side in the drawing) of the flexible wiring board 13 through the through hole 62. Further, the through hole 62 is formed so that the size of the exposed portion of the terminal land 60 (the portion surrounded by the broken line indicating the through hole 62 in FIG. 5) is slightly smaller than the outer periphery of the terminal land 60. Further, the area of the exposed portion is configured to be smaller than the area of the head terminal 45 of the inkjet head 10.

  Next, an embodiment of a method for connecting the inkjet head 10 having the above structure and the flexible wiring board 13 will be described with reference to FIGS. Each figure is an enlarged cross-sectional view of the vicinity of the terminal land 60 on the flexible wiring board 13.

  As described above, the flexible wiring board 13 connected to the ink jet head 10 is subjected to a process such as etching on the copper foil fixed on one surface of the insulator 13a, so that a plurality of terminal lands shown in FIG. 60, a wiring pattern composed of a lead wire 61 and a terminal 53 that are independently connected to each other is formed (wiring process), and a through hole 62 for exposing each terminal land 60 to the other surface side of the insulator 13a. Is formed (perforation process).

  Next, as shown in FIG. 7, a conductive brazing material, for example, solder 63 is printed from the other surface side (the −Z direction side in the drawing) of the flexible wiring board 13 by a known method such as printing, and the through hole The solder 63 is placed on the terminal land 60 exposed from 62 (placement step). Then, as shown in FIG. 8, the whole of the flexible wiring board 13 on which the solder 63 is placed is heated with infrared rays or a laser to soften the solder 63 at a temperature higher than the melting point thereof, thereby It is made to adapt so that it may cover the whole exposed part of 60 (the part enclosed with the broken line which shows the through-hole 62 in FIG. 5). Thereafter, the solder 63 joined to the terminal land 60 is once cooled and solidified (reflow process).

  Next, as shown in FIG. 9, the flexible wiring board 13 is placed on the upper surface (piezoelectric actuator) of the inkjet head 10 so that each terminal land 60 of the flexible wiring board 13 faces the head terminal 45 of the corresponding inkjet head 10. 12 on the surface of the piezoelectric sheet 12c side), the solder 63 is melted by heating. In this heat treatment, the flexible wiring board 13 is overlaid on the inkjet head 10 in a direction opposite to the vertical direction in the placing process. However, since the solder 63 is joined to the terminal land 60 in the reflow process, even if the flexible wiring board 13 is turned upside down, the placed solder 63 is not peeled off. Then, when the solder 63 is heated and melted, the solder 63 becomes familiar with the head terminal 45 that is in close contact with the flexible wiring board 13 and the inkjet head 10 and spreads over the entire surface, so that the terminal land 60 and the head terminal 45 is joined (connection process).

  By the way, as described above, since the area of the exposed portion of the terminal land 60 is smaller than the area of the head terminal 45 of the inkjet head 10, the head terminal when the flexible wiring board 13 and the inkjet head 10 are overlaid. The edge of 45 is blocked by the outer periphery of the through-hole 62, and the facing surfaces of the head terminal 45 and the terminal land 60 do not come into close contact with each other. However, the opening area of the through hole 62 formed by the above-described opening method of the through hole 62 is widened toward the other surface side (the −Z direction in FIG. 9) in the thickness direction of the flexible wiring board 13. Since it is configured, the head terminal 45 may push out the solder 63 in the through hole 62 when the flexible wiring board 13 and the inkjet head 10 are overlapped. In this case, the solder 63 leaking out around the head terminal 45 can flow out and spread on the surface electrode 39 connected to the head terminal 45. In other words, the surface electrode 39 functions as a so-called escape pattern for preventing the solder 63 from flowing out toward the adjacent head terminal 45 by utilizing the fact that the metals easily adhere to each other.

  In the flexible wiring board 13 configured as described above, if the amount of the solder 63 placed on the terminal land 60 is large in the placing step, the solder 63 leaks from the facing portion between the terminal land 60 and the head terminal 45 to the periphery. If this is not enough, the amount necessary to fill the gap between the terminal land 60 and the head terminal 45 and connect them will be insufficient, resulting in poor connection. Therefore, as a minimum amount of the solder 63 to be placed, as shown in FIG. 10R> 0, when the reflow process is completed, the bottom area of the solder 63 is approximately the exposed portion of the terminal land 60. The height is approximately equal to or greater than the cylindrical volume which is about the thickness of the flexible wiring board 13, and the maximum amount is, as shown in FIG. The volume is preferably enough to fill the entire through hole 62.

  Next, a method for connecting the inkjet head 10 and the flexible wiring board 13 according to another embodiment will be described with reference to FIGS. Each figure is an enlarged cross-sectional view of the vicinity of the terminal land 60 on the flexible wiring board 13 according to another embodiment.

  As shown in FIG. 12, in the flexible wiring board 13 according to another embodiment, a copper foil is bonded onto one surface of the insulator 13a of the flexible wiring board 13 as in the above embodiment, and etching or the like is performed. A wiring pattern is formed by the processing (wiring process). Then, the entire surface of the insulator 13a on which the wiring pattern is formed (the surface on the −Z direction side in the figure) is covered with a thin film resist 66 such as a photoresist or a dry film. Then, the terminal land 60 and the conductive wire 61 (see FIG. 5) formed on the insulator 13a are protected from being short-circuited. The resist 66 is provided with exposed holes 67 formed at positions facing the terminal lands 60, and the opening area of the exposed holes 67 is similar to that of the through holes 62. It is designed to be slightly smaller than the outer peripheral area (coating process). The resist 66 is an “insulator film” in the present invention.

  Next, as shown in FIG. 13, the solder 63 is printed and placed at the position of the terminal land 60 exposed from the exposure hole 67 of the resist 66 covering the terminal land 60 (placement step). Then, as shown in FIG. 14, the entire flexible wiring board 13 is heated to soften the solder 63, and is adapted to spread over the entire exposed portion of the terminal land 60 as described above. Then, it is once cooled to solidify the solder 63 (reflow process).

  Next, as shown in FIG. 15, the flexible wiring board 13 has a bonding land between the terminal land 60 of the flexible wiring board 13 and the corresponding head terminal 45 of the inkjet head 10 facing each other as described above. The terminal lands 60 and the head terminals 45 are joined by the solder 63 melted by the heat treatment and aligned with the inkjet head 10 (13).

  As described above, the method of joining the head terminal 45 of the inkjet head 10 and the terminal land 6 of the flexible wiring board 13 includes a penetration formed in the insulator 13a of the flexible wiring board 13 of the former embodiment. The terminal land 60 exposed from the hole 62 is bonded to the head terminal 45 with the solder 63, and the exposed hole 67 formed in the resist 66 covering the wiring pattern of the flexible wiring board 13 of the latter embodiment is exposed. There is a method of joining the terminal land 60 to the head terminal 45 with the solder 63.

  In the flexible wiring board 13 of the former embodiment, the terminal land 60 is placed on the other surface side in accordance with the position of each terminal land 60 included in the wiring pattern formed on one surface of the insulator 13a. A through hole 62 for exposing is formed, and each terminal land 60 and each corresponding head terminal 45 are joined by solder 63 through the through hole 62. Moreover, although the conducting wire 61 is arrange | positioned between each terminal land 60 on the insulator 13a, since it will be arrange | positioned on the surface on the opposite side to the joint surface with the inkjet head 10, it is an inkjet head. 10, the position where the head terminals 45 are arranged does not interfere with the adjacent head terminals 45, that is, a distance relationship in which a solder bridge is not easily formed between the adjacent head terminals 45 due to leakage of the solder 63 during bonding. Just be in position. Therefore, the terminal land 60 and the head terminal 45 facing each other are not short-circuited even if they are designed and produced with a reduced tolerance tolerance in the direction orthogonal to the joining direction.

  In the flexible wiring board 13 of the latter embodiment, the wiring pattern formed on one surface of the insulator 13 a is covered with the resist 66, and the wiring pattern is formed from the exposed hole 67 drilled in the resist 66. Each terminal land 60 is exposed. Similarly to the former embodiment, the terminal lands 60 and the corresponding head terminals 45 are joined by the solder 63 through the exposed holes 67. The conducting wire 61 passing between the terminal lands 60 is covered with a resist 66, so that it does not short-circuit with the head terminal 45, and the tolerance accuracy of the positions of the terminal lands 60 and the head terminals 45 facing each other is lowered. Design and production can be done.

  In any of the above embodiments, a single-sided board in which a wiring pattern is mounted only on one side can be used as the flexible wiring board 13. Further, both the terminal lands 60 and the head terminals 45 are arranged in a zigzag pattern, and the flexible wiring board 13 and the inkjet head 10 are joined over a wide range at the opposite portions while the joints are close to each other. As a result, the external force applied to the joining portion can be dispersed, so that the joining strength can be increased.

  Needless to say, the present invention can be modified in various ways. For example, when the amount of the solder 63 to be printed and placed in the placing step is large, when the joining step is executed in a state where a predetermined gap is provided on the joining surface between the flexible wiring board 13 and the inkjet head 10, FIG. As described above, the solder 63 between the terminal land 60 and the head terminal 45 forms a columnar shape and can be connected to each other. In this case, a protrusion (not shown) is provided in accordance with, for example, the formation of the head terminal 45 on the piezoelectric sheet 12c, and the distance between the flexible wiring board 13 and the inkjet head 10 is kept close. Prevent it.

  In the present embodiment, a resist film may be further applied on the wiring pattern formed on one surface of the insulator 13a to enhance safety against troubles such as a short circuit. Alternatively, the wiring pattern may be formed so that the positions of the terminal lands 60 and the through holes 62 coincide with each other by performing the wiring process after providing the through holes 62 in the insulator 13a by the drilling process. Further, in the reflow process and the connection process, the solder 63 is melted by a heating process to the whole, but pressing such as a heat bar or local heating using a laser or the like may be used. Further, the solder 63 may be mounted by dipping the flexible wiring board 13 with the jetted solder instead of the mounting process and the reflow process.

FIG. 1 is a plan view showing a connection state of the inkjet head 10, the flexible wiring board 13, and the driver circuit board 50. FIG. 2 is a plan view of the inkjet head 10, the flexible wiring board 13, and the driver circuit board 50. FIG. 3 is an enlarged perspective view of a part of the inkjet head 10. FIG. 4 is a plan view of the surface electrode 39 on the piezoelectric sheet 12c in which the vicinity of the portion A in FIG. 2 is enlarged. FIG. 5 is a plan view of the terminal land 60 on the flexible wiring board 13 in which the vicinity of the portion B in FIG. 2 is enlarged. FIG. 6 is an enlarged cross-sectional view of the vicinity of the terminal land 60 on the flexible wiring board 13. FIG. 7 is an enlarged cross-sectional view of the vicinity of the terminal land 60 on the flexible wiring board 13. FIG. 8 is an enlarged cross-sectional view of the vicinity of the terminal land 60 on the flexible wiring board 13. FIG. 9 is an enlarged cross-sectional view of the vicinity of the terminal land 60 on the flexible wiring board 13. FIG. 10 is a diagram illustrating the minimum amount of the solder 63 placed on the flexible wiring board 13. FIG. 11 is a diagram showing the maximum amount of the solder 63 placed on the flexible wiring board 13. FIG. 12 is an enlarged cross-sectional view of the vicinity of the terminal land 60 on the flexible wiring board 13 according to another embodiment. FIG. 13 is an enlarged cross-sectional view of the vicinity of the terminal land 60 on the flexible wiring board 13 according to another embodiment. FIG. 14 is an enlarged cross-sectional view of the vicinity of the terminal land 60 on the flexible wiring board 13 according to another embodiment. FIG. 15 is an enlarged cross-sectional view of the vicinity of the terminal land 60 on the flexible wiring board 13 according to another embodiment. FIG. 16 is a diagram showing a modification of the method for joining the flexible wiring board 13 and the inkjet head 10.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Inkjet head 13 Flexible wiring board 13a Insulator 23 Channel 45 Head terminal 50 Driver circuit board 60 Terminal land 61 Conductor 62 Through-hole 63 Solder 66 Resist 67 Exposed hole

Claims (13)

A connection structure of a flexible wiring board to a plurality of head terminals for applying a driving voltage for ejecting ink to each of a plurality of channels provided in an inkjet head,
A plurality of surface electrodes are provided in a row on the surface of the inkjet head, each surface electrode is formed in a substantially strip shape, and each head terminal is alternately arranged in one column direction of the surface electrode. Located near one end in the longitudinal direction of the surface electrode and near the other end, arranged in a staggered pattern,
The flexible wiring board includes a strip-shaped insulator having flexibility, a plurality of terminal lands arranged on the insulator corresponding to each of the plurality of head terminals of the inkjet head, and the insulation A plurality of conductors that are independently connected to each of the plurality of terminal lands on the body and wired so as to sew between the terminal lands in other rows;
A connection structure of a flexible wiring board in which the terminal land and the head terminal are electrically connected.   The connection structure of the flexible wiring board according to claim 1, wherein each head terminal is shorter than the surface electrode in the longitudinal direction of the surface electrode and wider than the surface electrode in the width direction of the surface electrode.   The connection of the flexible wiring board according to claim 1, wherein the surface electrodes are arranged in a staggered manner with the surface electrodes in adjacent rows, and the head terminals are arranged in a staggered manner in each row of the surface electrodes. Construction.   The terminal land and the head terminal are electrically connected by heating and melting a conductive brazing material, and the brazing material flows out from between the terminal land and the head terminal onto the surface electrode. The connection structure of the flexible wiring board according to any one of claims 1 to 3.   5. The insulator according to claim 1, wherein the insulator of the flexible wiring board has the wiring and the terminal land formed on one surface thereof, and a through hole that exposes the terminal land to the head terminal. A connection structure of a flexible wiring board according to claim 1.   In the flexible wiring board, an insulating thin film is formed so as to cover the wiring and the terminal land formed in the insulator, and an exposure hole for exposing the terminal land to the head terminal is formed in the insulating thin film. The connection structure of the flexible wiring board in any one of Claim 1 to 4.   7. The flexible wiring board connection structure according to claim 5, wherein an area where the terminal land is exposed is smaller than an area of the head terminal.   The flexible wiring board connection structure according to claim 1, wherein the surface electrode is connected to a drive electrode provided in a row corresponding to the plurality of channels.   The connection structure of the flexible wiring board according to claim 8, wherein the inkjet head is further provided with a surface electrode connected to a ground electrode on the surface.   The flexible wiring board connection structure according to claim 8, wherein the surface electrode is connected to the drive electrode through a through hole.   The flexible wiring board connection structure according to claim 9, wherein the surface electrode is connected to the ground electrode through a through hole.   The flexible wiring board connection structure according to claim 10, wherein the through hole is connected to a center of the surface electrode. 12. The flexible printed circuit board according to claim 9, wherein the inkjet head includes a piezoelectric actuator in which a piezoelectric sheet on which the driving electrode is disposed and a piezoelectric sheet on which the ground electrode is disposed are bonded together. Connection structure.

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