JP2018042271A - Image pickup device unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such a problem that the position of an image pickup device is deviated by biasing force of a dustproof rubber.SOLUTION: An image pickup device unit includes: an image pickup device package which is provided with an imaging chip for light-receiving a subject luminous flux and comprises a surface and a wall on which the subject luminous flux is incident; and a support member which supports the wall of the image pickup device package. In the image pickup device unit, the wall forms a surrounded space by projecting from the periphery of the image pickup device package, and the image pickup chip is housed in the space, and the support member may support the image pickup device package in contact with the periphery.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an image sensor unit.

There is known an image pickup device in which a dust-proof rubber is provided between a light receiving surface of the image pickup device and an optical filter.
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Patent Laid-Open No. 2006-1000087

  When the image sensor package is sealed with dust-proof rubber, the position of the image sensor may be shifted due to the urging force of the dust-proof rubber.

  An image pickup device unit according to a specific aspect of the present invention includes an image pickup device package provided with an image pickup chip that receives a subject light beam, and a support that supports the image pickup device package on a side opposite to a surface on which the subject light beam is incident. A member, an optical member that transmits the subject light beam, an elastic member that is interposed between the optical member and the support member and seals between the optical member and the support member, and a surface of the image sensor package on which the subject light beam is incident. A biasing member that biases the optical member toward the support member without applying a force.

  The summary of the invention does not enumerate all the features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a perspective view of the image sensor unit concerning this embodiment. It is a disassembled perspective view of the image sensor unit concerning this embodiment. It is AA sectional drawing of the image pick-up element unit in FIG. It is the elements on larger scale which showed typically the B section of the image sensor unit in FIG. It is the elements on larger scale which showed typically the modification of the B section of the image sensor unit in FIG. It is the elements on larger scale which showed typically the modification of the B section of the image sensor unit in FIG. It is the elements on larger scale which showed typically the modification of the B section of the image sensor unit in FIG.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a perspective view of an image sensor unit 10 according to the present embodiment. As shown in the figure, the direction from the subject side toward the image sensor unit 10 is defined as the Z axis plus direction, and the direction toward the right side of the image sensor unit 10 when viewed from the Z axis plus direction on the plane orthogonal to the Z axis is defined as the X axis. A direction toward the upper side of the image sensor unit 10 when viewed from the plus direction and the Z-axis plus direction is defined as a Y-axis plus direction. In the following several figures, the coordinate axes are displayed so that the orientation of each figure can be understood with reference to the coordinate axes of FIG.

  The image pickup device unit 10 according to the present embodiment is used by being incorporated in an image pickup apparatus such as a digital camera or a digital video camera. The image sensor unit 10 includes a support member 14, an optical member 16, a biasing member 20, and a screw 22.

  The urging member 20 is fixed to the surface on the negative side of the Z axis of the support member 14 by screws 22. The optical member 16 is disposed in the space between the support member 14 and the biasing member 20. As will be described in detail later, an imaging element package and an elastic member are further arranged in the space between the support member 14 and the biasing member 20.

  FIG. 2 is an exploded perspective view of the image sensor unit 10 according to the present embodiment. The image sensor unit 10 includes an image sensor package 12, a support member 14, an optical member 16, an elastic member 18, an urging member 20, and a screw 22 as main constituent members.

  The support member 14 is disposed on the negative side of the Z-axis of the image sensor package 12. The elastic member 18 is disposed on the negative side of the Z axis of the support member 14. The optical member 16 is disposed on the negative side of the Z axis of the elastic member 18. The urging member 20 is disposed on the negative side of the optical member 16 on the Z axis.

  The image pickup device package 12 has a peripheral edge portion 24 and a wall portion 26. The peripheral portion 24 is formed to extend from the end surface on the Z-axis plus side of the image pickup device package 12 in a hook shape in the Y-axis plus direction and the Y-axis minus direction. The wall portion 26 is formed to project annularly in the Z-axis minus direction. A specific structure of the wall portion 26 will be described later.

  The image pickup device package 12 further includes a protective glass 28 as a translucent member. The protective glass 28 is a glass plate disposed in parallel to the XY plane. The protective glass 28 is disposed at the end on the negative side of the Z axis of the image sensor package 12. The image pickup device package 12 is mounted on the surface of the substrate 30 on the negative side of the Z axis.

  The support member 14 is formed of a metal plate such as SUS. The support member 14 has an insertion hole 32 through which the wall portion 26 is inserted. The insertion hole 32 is formed to be slightly larger than the outer shape of the wall portion 26. Further, the insertion hole 32 is formed smaller than the outer shape of the peripheral edge portion 24.

  The wall portion 26 is inserted into the insertion hole 32 from the Z axis plus side of the support member 14. The support member 14 supports the image pickup device package 12 by using, for example, an adhesive on the surface opposite to the surface on which the subject luminous flux is incident. A part of the wall portion 26 and the protective glass 28 are exposed from the insertion hole 32.

  The insertion hole 32 is formed smaller than the outer shape of the peripheral edge portion 24. Accordingly, the peripheral edge 24 abuts on the support member 14 without coming out of the insertion hole 32. That is, the displacement of the image pickup device package 12 in the Z-axis direction is restricted by the support member 14. The peripheral edge 24 is fixed to the support member 14 with an adhesive, for example.

  The elastic member 18 is formed of rubber, for example. The elastic member 18 has an opening 34 in the XY plane. The elastic member 18 is a rubber plate having a thickness in the Z-axis direction. The outer periphery of the protective glass 28 is inserted through the opening 34. The opening 34 is formed smaller than the outer shape of the protective glass 28. Therefore, the elastic member 18 surrounds and adheres to the outer periphery of the protective glass 28.

  The optical member 16 is a low-pass filter, for example. The optical member 16 is used for the purpose of reducing the occurrence of moire.

  The urging member 20 is formed of a metal plate such as SUS. The urging member 20 has an opening 36 in the XY plane. The dimension in the Z-axis direction from the Z-axis plus side surface of the biasing member 20 to the Z-axis minus side surface of the support member 14 is the dimension in the Z-axis direction of the elastic member 18 and the dimension in the Z-axis direction of the optical member 16. It is smaller than the dimension added.

  Therefore, when the biasing member 20 is fixed to the support member 14 using the screw 22, the biasing member 20 biases the optical member 16 in the plus direction of the Z axis. Then, the optical member 16 biases the elastic member 18 in the plus direction of the Z axis. Therefore, the elastic member 18 is in close contact with the optical member 16 on the surface on the negative side of the Z axis. Similarly, the elastic member 18 is in close contact with the support member 14 on the Z-axis plus side surface.

  As will be described in detail later, the elastic member 18 is in close contact with the outer periphery of the protective glass 28, the Z-axis minus side surface of the support member 14, and the Z-axis plus side surface of the optical member 16. Therefore, the elastic member 18 can form a sealed space between the optical member 16 and the protective glass 28.

  FIG. 3 is a cross-sectional view taken along line AA of the image sensor unit 10 in FIG. The image pickup device package 12 has a base portion 23. The base part 23 is a rectangular flat plate parallel to the XY plane. The wall portion 26 is formed to project annularly from the base portion 23 in the negative Z-axis direction. The base part 23 and the wall part 26 form an enclosed space. The image pickup device package 12 accommodates an image pickup chip 27 for receiving a subject light beam in a space formed by the base portion 23 and the wall portion 26. The imaging chip is disposed on the surface on the negative side of the Z-axis of the base part 23 in the space formed by the base part 23 and the wall part 26.

  The protective glass 28 is fixed to the wall portion 26 by, for example, an adhesive. The protective glass 28 closes the space formed by the base part 23 and the wall part 26. Therefore, the protective glass 28 can protect the imaging chip 27 from foreign matters such as dust.

  In FIG. 3, the inner peripheral surface of the elastic member 18 is in close contact with the side surface of the protective glass 28. Since the elastic member 18 is attached so as to surround the outer periphery of the protective glass 28, the elastic member 18 is also in close contact with the protective glass 28 in the Y-axis direction as well.

  The elastic member 18 is interposed between the optical member 16 and the support member 14. The elastic member 18 is biased by the biasing member 20 via the optical member 16. Therefore, the elastic member 18 is in close contact with the optical member 16 and the support member 14 in the Z-axis direction.

  The elastic member 18 surrounds and adheres to the outer periphery of the protective glass 28. Therefore, the elastic member 18 can form a sealed space between the optical member 16 and the protective glass 28. Therefore, foreign matter such as dust is less likely to enter between the optical member 16 and the protective glass 28.

  In the present embodiment, the example in which the imaging element package 12 is attached to the surface on the negative side of the Z axis of the support member 14 through the insertion hole 32 has been shown. The wall portion 26 is inserted through the insertion hole 32. Therefore, the dimension in the Z-axis direction when the imaging element package 12 is attached to the support member 14 is the dimension in the Z-axis direction of the imaging element package 12. That is, the dimension in the Z-axis direction is smaller than when the imaging element package 12 is attached to the surface on the negative side of the Z-axis of the support member 14. That is, the image sensor unit 10 can be reduced in size.

  FIG. 4 is a partially enlarged view schematically showing a B part of the image sensor unit 10 in FIG. 3. The elastic member 18 includes a base portion 19, a first contact portion 38 and a second contact portion 40. The base portion 19 is formed along the shape of the insertion hole 32 in the XY plane. The first contact portion 38 is formed in a protruding shape from the surface on the negative side of the Z axis of the base portion 19. The first contact portion 38 is formed in a region excluding a region corresponding to the insertion hole 32, that is, outside the insertion hole 32 as illustrated. The first contact portion 38 is formed so as to surround the protective glass 28.

  The urging member 20 urges the optical member 16 in the Z-axis plus direction. Accordingly, the optical member 16 is in close contact with the first contact portion 38.

  Since the urging force in the positive direction of the Z-axis by the urging member 20 acts outside the insertion hole 32 as indicated by the white arrow, the support member 14 receives it. Therefore, the urging member 20 does not apply an urging force in the Z-axis plus direction to the image sensor package 12.

  The second contact portion 40 is formed extending from the base portion 19 in the plus direction of the X axis. The second contact portion 40 is formed so as to surround the outer periphery of the protective glass 28. The second contact portion 40 has an opening in the XY plane that is smaller than the outer shape of the protective glass 28. Therefore, the second contact portion 40 is in close contact with the outer periphery of the protective glass 28 over the entire periphery.

  Generally, if a support member is provided with an insertion hole so that a part of the imaging package passes through and the imaging package is supported on the back side of the support member (the surface on the Z-axis plus side), the thickness of the entire unit in the optical axis direction Can be reduced. However, when the imaging package is urged from the surface side (Z-axis minus side surface) to form a sealed space, the imaging package is pressed unevenly due to individual differences of the urging members or a load during assembly. There was a case. In this case, surface tilt may occur in which the imaging surface of the imaging package is inclined with respect to the optical axis. Furthermore, the adhesive that adheres the imaging package and the support member may peel off.

  In the present embodiment, the urging member 20 urges the optical member 16 toward the support member 14 without applying an urging force to the surface of the image pickup device package 12 on which the subject luminous flux is incident. Generation | occurrence | production of peeling of an adhesive agent can be avoided as much as possible.

  According to the present embodiment, the second contact portion 40 comes into contact with the side surface of the protective glass 28. The second contact portion is a part of the elastic member 18 and is formed to extend toward the center side. Therefore, it is difficult to transmit the urging force indicated by the arrow to the portion where the second contact portion 40 and the protective glass 28 are in close contact with each other. That is, the side surface of the protective glass 28 is unlikely to receive an urging force in the Z-axis plus direction. Therefore, according to the structure of the image pickup device unit 10 in the present embodiment, the image pickup device package 12 is not easily tilted and the adhesive is not easily peeled off.

  FIG. 5 is a partial enlarged view schematically showing a modified example of the B part of the image sensor unit 10 in FIG. 3. 5A and 5B, the elastic member 18 includes the outer periphery of the protective glass 28, the Z-axis minus side surface of the support member 14, and the Z-axis plus side surface of the optical member 16. Close contact with. That is, the elastic member 18 can form a sealed space between the optical member 16 and the protective glass 28 as in the imaging element unit 10 described with reference to FIG. In addition, since the main elements in the following modifications are the same as those of the image sensor unit 10 described in the above embodiment, the same elements are denoted by the same reference numerals, and the description thereof is omitted.

  FIG. 5A is a diagram schematically showing a modified example of the elastic member 18 in an enlarged manner. The elastic member 18 includes a base portion 19, a first contact portion 38 and a second contact portion 44. The second contact portion 44 extends from the base portion 19 in the plus direction of the X axis and is formed with a protrusion 45 at the tip. The protrusion 45 is formed so as to surround the outer periphery of the protective glass 28. The inner periphery of the protrusion 45 is formed smaller than the protective glass 28 in the XY plane. Therefore, the protrusion 45 is in close contact with the outer periphery of the protective glass 28.

  The protrusion 45 is formed relatively small with respect to the base portion 19. Therefore, in FIG. 5A, the protrusion 54 is in close contact with the side surface of the protective glass 28. In addition, since the protrusion 45 surrounds the outer periphery of the protective glass 28, it is similarly urged by the side surface of the protective glass 28 in the X axis plus direction, the Y axis plus direction, and the Y axis minus direction.

  The second contact portion 44 is formed such that the protrusion 45 is easily deformed in the X-axis direction. Therefore, when the outer periphery of the protective glass 28 urges the protrusion 45, the protrusion 45 is deformed. However, since the force accompanying the deformation of the protrusion 45 is not transmitted to the base portion 19, the base portion 19 is not deformed. That is, the second contact portion 44 can apply an urging force to the XY plane via the protrusion 45, but does not apply an urging force in the Z-axis direction. Therefore, the second contact portion 44 does not apply an urging force in the Z-axis direction to the imaging element package 12.

  By providing the protrusion 45 on the second contact portion 44, the biasing member 20 can be easily deformed into the XY plane as compared with the structure described in FIG. Therefore, the adhesion between the protective glass 28 and the elastic member 18 can be improved.

  FIG. 5B is a schematic enlarged view showing still another modified example of the elastic member 18. The elastic member 18 includes a base portion 19, a first contact portion 38 and a second contact portion 47. The second contact portion 47 extends from the base portion 19 in the plus direction of the X axis, and further has a protrusion 48 and a groove portion 49. The protrusion 48 is formed so as to surround the outer periphery of the protective glass 28. The inner periphery of the protrusion 48 is formed smaller than the protective glass 28 in the XY plane. Therefore, the protrusion 48 is in close contact with the outer periphery of the protective glass 28.

  The groove portion 49 is formed in an annular shape on the XY plane and has a depth in the Z-axis direction. The second contact portion 47 is formed by the groove portion 49 so that the protrusion 48 is easily deformed in the X-axis direction. Therefore, when the outer periphery of the protective glass 28 urges the protrusion 48, the protrusion 48 is deformed. However, since the force accompanying the deformation of the protrusion 48 is not transmitted to the base portion 19, the base portion 19 is not deformed. That is, the second contact portion 47 can apply an urging force to the XY plane via the protrusion 48, but does not apply an urging force in the Z-axis direction. Therefore, the second contact portion 47 does not apply an urging force in the Z-axis direction to the image sensor package 12.

  By providing the groove portion 49 and the protrusion 48 in the second contact portion 47, the biasing member 20 is more easily deformed into the XY plane than the structure described in FIG. Therefore, the adhesion between the protective glass 28 and the elastic member 18 can be improved. Furthermore, since the inner wall surface of the protrusion 48 contacts the protective glass 28 in the second contact portion 47, the contact surface becomes wider and the sealing performance can be improved.

  FIG. 6 is a partial enlarged view schematically showing a modification of the B part of the image sensor unit in FIG. In the above embodiment, the elastic member 18 has shown the example which forms the sealed space between the optical member 16 and the image pick-up element package 12 by surrounding the outer periphery of the protective glass 28, and closely_contact | adhering. However, the elastic member 18 may form a sealed space between the optical member 16 and the imaging element package 12 by surrounding and closely contacting the wall surface of the wall portion 26. 6, the elastic member 18 is in close contact with the wall surface of the wall portion 26, the Z-axis minus side surface of the support member 14, and the Z-axis plus side surface of the optical member 16. That is, the elastic member 18 can form a sealed space between the optical member 16 and the image pickup device package 12 in the same manner as the image pickup device unit 10 described with reference to FIG. In addition, since the main elements in the following modifications are the same as those of the image sensor unit 10 described in the above embodiment, the same elements are denoted by the same reference numerals, and the description thereof is omitted.

  FIG. 6A is a partial enlarged view schematically showing a modification corresponding to the image sensor unit 10 shown in FIG. The elastic member 18 includes a base portion 19, a first contact portion 38, and a second contact portion 42. The second contact portion 42 is formed so as to extend from the base portion 19 in the X axis plus direction and further in the Z axis plus direction. The inner periphery of the second contact portion 42 is formed smaller than the outer shape of the wall portion 26 in the XY plane. The second contact portion 42 is disposed in the gap between the support member 14 and the wall surface of the wall portion 26. Therefore, the second contact portion 42 is in close contact with the wall surface of the wall portion 26.

  The wall portion 26 has higher rigidity than the side surface of the protective glass 28. Therefore, it is preferable that the second contact portion 42 forms a sealed space between the optical member 16 and the imaging element package 12 by surrounding and closely contacting the wall surface of the wall portion 26. Since the elastic member 18 is in close contact with the wall surface of the wall portion 26, the urging force of the elastic member 18 is not applied to the protective glass 28. Therefore, the protective glass 28 is hardly peeled off from the wall portion 26. Further, from the viewpoint of not damaging the protective glass 28, the elastic member 18 is preferably in close contact with the wall surface of the wall portion 26 instead of the outer periphery of the protective glass 28.

  FIG. 6B is a partially enlarged view schematically showing a modification corresponding to the image sensor unit 10 shown in FIG. The elastic member 18 includes a base portion 19, a first contact portion 38 and a second contact portion 46. The second contact portion 46 is formed to extend from the base portion 19 in the X axis plus direction and further in the Z axis plus direction. The second contact portion 46 has a protrusion 52 in a region extending in the Z-axis plus direction. The protrusion 52 is formed so as to surround the wall surface of the wall portion 26. The protrusion 52 is formed smaller than the outer shape of the wall portion 26 in the XY plane. Therefore, the protrusion 52 is in close contact with the outer wall surface of the wall portion 26.

  The protrusion 52 is formed to be relatively small with respect to the base portion 19. Therefore, in FIG. 6B, the protrusion 52 is in close contact with the wall surface of the wall portion 26. In addition, since the protrusion 52 surrounds the wall surface of the wall part 26, it is urged | biased similarly to the X-axis plus direction, the Y-axis plus direction, and the Y-axis minus direction by the wall surface.

  The second contact portion 46 is formed such that the protrusion 52 is easily deformed in the X-axis direction. Therefore, when the wall portion 26 urges the protrusion 52, the protrusion 52 is deformed. However, since the force accompanying the deformation of the protrusion 52 is not transmitted to the base 19, the base 19 is not deformed. That is, the second contact portion 46 can apply an urging force to the XY plane through the protrusion 52, but does not apply an urging force in the Z-axis direction. Therefore, the second contact portion 46 does not apply an urging force in the Z-axis direction to the imaging element package 12.

  By providing the protrusion 52 on the second contact portion 46, the urging member 20 is more easily deformed to the XY plane than the structure described in FIG. Therefore, the adhesion between the protective glass 28 and the elastic member 18 can be improved.

  FIG. 6C is a partially enlarged view schematically showing a modification corresponding to the image sensor unit 10 shown in FIG. The elastic member 18 includes a base portion 19, a first contact portion 38 and a second contact portion 50. The second contact portion 50 is formed to extend from the base portion 19 in the X-axis plus direction and further in the Z-axis plus direction. The second contact portion 50 is formed having a groove 51 and a protrusion 54 in a region extending in the Z-axis plus direction. The protrusion 54 is formed so as to surround the wall surface of the wall portion 26. The protrusion 54 is formed smaller than the outer shape of the wall portion 26 in the XY plane. Therefore, the protrusion 54 is in close contact with the outer wall surface of the wall portion 26.

  The groove 51 is annular in the XY plane and is formed with a depth in the Z-axis direction. The second contact portion 50 is formed by the groove 51 so that the protrusion 52 is easily deformed in the X-axis direction. Therefore, when the wall surface of the wall portion 26 biases the protrusion 54, the protrusion 54 is deformed. However, since the force accompanying the deformation of the protrusion 54 is not transmitted to the base portion 19, the base portion 19 is not deformed. That is, the second contact portion 50 can apply an urging force to the XY plane via the protrusion 54, but does not apply an urging force in the Z-axis direction. Therefore, the second contact portion 50 does not apply an urging force in the Z-axis direction to the imaging element package 12.

  FIG. 7 is a partial enlarged view schematically showing still another modification of the image sensor unit 10. In the present embodiment, the elastic member 18 and the sealing member 62 form a sealed space between the optical member 16 and the imaging element package 12. In the modification shown in FIG. 7 as well, the elastic member 18 is in close contact with the Z-axis minus side surface of the support member 14 and the Z-axis plus side surface of the optical member 16. The sealing member 62 is in close contact with the outer periphery of the image sensor package 12. That is, the elastic member 18 can form a sealed space between the optical member 16 and the image pickup device package 12 in the same manner as the image pickup device unit 10 described with reference to FIGS. In addition, since the main elements in this embodiment are the same as those of the image sensor unit 10 described in the above embodiments, the same elements are denoted by the same reference numerals and description thereof is omitted.

  In FIG. 7A, the elastic member 18 seals between the optical member 16 and the support member 14. Further, the sealing member 62 seals between the protective glass 28 and the elastic member 18. The elastic member 18 has an opening 34 formed along the insertion hole 32 in the XY plane.

  The sealing member 62 is, for example, an O-ring. The sealing member 62 is disposed between the wall surface of the opening 34 and the outer peripheral surface of the protective glass 28. The sealing member 62 surrounds and adheres to the outer peripheral surface of the protective glass 28. A biasing force is applied to the sealing member 62 by the side surface of the protective glass 28. Similarly, the urging force is applied to the sealing member 62 by the elastic member 18. The sealing member 62 surrounds the protective glass 28. The opening 34 of the elastic member 18 surrounds the sealing member 62. Therefore, a sealed space can be formed between the optical member 16 and the protective glass 28 by the elastic member 18 and the sealing member 62.

  In addition, since the sealing member 62 can use an O-ring of a general shape, the shape can be simplified and the component cost can be reduced. Further, the elastic member 18 may be an O-ring like the sealing member 62. By using an O-ring, the elastic member 18 can be simplified in shape, and the cost of parts can be reduced.

  In the above embodiment, the sealing member 62 has been shown as being disposed in close contact between the protective glass 28 and the elastic member 18. However, when the side surface of the insertion hole 32 faces the protective glass 28, the sealing member 62 may be disposed in close contact with the side surface of the protective glass 28 and the insertion hole 32.

  FIG. 7B is a diagram showing a modification of the image sensor unit 10 in FIG. The elastic member 18 seals between the optical member 16 and the support member 14. Further, the sealing member 62 seals between the wall surface of the wall portion 26 and the insertion hole 32.

  The sealing member 62 is, for example, an O-ring. The sealing member 62 is disposed on the side surface of the wall portion 26 and the insertion hole 32 that faces the wall portion 26. The sealing member 62 surrounds and adheres to the outer peripheral surface of the wall portion 26. A biasing force is applied to the sealing member 62 by the wall surface of the wall portion 26. Similarly, a biasing force is applied to the sealing member 62 by the support member 14. The sealing member 62 surrounds the wall surface of the wall portion 26. The insertion hole 32 surrounds the sealing member 62. Therefore, a sealed space can be formed between the optical member 16 and the imaging element package 12 by the insertion hole 32 and the sealing member 62. The sealing member 62 is biased to the side surface of the support member 14 that is harder than the elastic member 18. Therefore, the adhesion can be improved.

  In the above embodiment, an example in which the image sensor package 12 includes the protective glass 28 has been described. When the image pickup device package 12 does not have the protective glass 28, the elastic member 18 may be disposed in close contact with the optical member 16, the support member 14, and the wall surface of the wall portion 26. Thereby, the elastic member 18 can form a sealed space between the optical member 16 and the imaging device package 12.

  When the sealing member 62 is used for the image pickup device package 12 that does not have the protective glass 28, the sealing member 62 is in close contact with the outer wall of the wall portion 26 as shown in FIG. do it. The elastic member 18 and the sealing member 62 can form a sealed space between the optical member 16 and the image pickup device package 12.

  In the above embodiment, the shapes of the first contact portion and the second contact portion are determined such that the urging force in the Z-axis direction and the urging force in the side surface direction of the imaging element package 12 do not affect each other. However, the first contact portion and the second contact portion are not limited to the shapes described in the above embodiment, and can be various shapes.

  The elastic member 18 may be formed by two-color molding. If the elastic member 18 is formed by two-color molding, the elastic forces of the first contact portion and the second contact portion can be made different from each other.

  The elastic member 18 may be formed of conductive rubber. Electrical grounding can be performed by using conductive rubber. Thereby, the image sensor unit 10 can prevent malfunction due to static electricity.

  In the above embodiment, the example in which the optical member 16 is a low-pass filter has been shown. However, in the case of an image sensor unit that does not use an optical filter such as a low-pass filter, the optical member 16 may be a glass plate. By using a glass plate as the optical member 16, the space between the glass plate and the image pickup device package 12 is sealed. Therefore, it is difficult for foreign matter such as dust to adhere to the image pickup device package 12.

  In the above embodiment, the example in which the support member 14 is formed of a metal material has been shown. Since the image pickup device package 12 generates heat, the support member 14 is preferably formed of a metal material from the viewpoint of heat dissipation. However, the support member 14 may be formed of a resin material. If the support member 14 is formed of a resin material, the cost can be reduced.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

DESCRIPTION OF SYMBOLS 10 Image sensor unit, 12 Image sensor package, 14 Support member, 16 Optical member, 18 Elastic member, 19 Base part, 20 Energizing member, 22 Screw, 23 Base part, 24 Peripheral part, 26 Wall part, 27 Imaging chip , 28 Protective glass, 30 Substrate, 32 Insertion hole, 34, 36 Opening part, 38 First contact part, 40, 42, 44, 46, 47, 50 Second contact part, 45, 48, 52, 54 Projection part, 49, 51 Groove, 62 Sealing member

Claims (5)

An imaging chip package provided with an imaging chip for receiving a subject luminous flux, and having a surface on which the subject luminous flux is incident and a wall;
A support member for supporting the wall portion of the imaging element package;
An image sensor unit comprising: The wall portion protrudes from a peripheral portion of the image pickup device package to form an enclosed space,
The imaging chip is provided in the space,
The imaging device unit according to claim 1, wherein the support member is in contact with the peripheral edge portion and supports the imaging device package.   The imaging device unit according to claim 1, wherein the support member supports the wall portion of the imaging device package via an elastic member. The image pickup device package has a light transmissive member arranged with a gap from the image pickup chip,
The image sensor unit according to claim 3, wherein the elastic member is in close contact with a side surface of the translucent member to support the image sensor package. The support member has a hole through which the wall portion is inserted;
An optical member that is disposed on a side of the imaging device package on which the subject luminous flux is incident and transmits the subject luminous flux;
5. The imaging element unit according to claim 1, further comprising a pressing member that presses an outer side of a region corresponding to the hole of the support member among the optical members.

Images