|
JPH11217237A
(ja)
*
|
1996-03-25 |
1999-08-10 |
Nippon Sheet Glass Co Ltd |
レーザ加工用ガラス基材及びレーザ加工方法
|
|
JP3957010B2
(ja)
*
|
1997-06-04 |
2007-08-08 |
日本板硝子株式会社 |
微細孔を有するガラス基材
|
|
JP2000301372A
(ja)
|
1999-04-23 |
2000-10-31 |
Seiko Epson Corp |
透明材料のレーザ加工方法
|
|
US7301621B2
(en)
*
|
1999-06-10 |
2007-11-27 |
Aradigm Corporation |
Method and device for non-destructive analysis of perforations in a material
|
|
JP3797068B2
(ja)
*
|
2000-07-10 |
2006-07-12 |
セイコーエプソン株式会社 |
レーザによる微細加工方法
|
|
US20040013951A1
(en)
|
2001-04-02 |
2004-01-22 |
Jun Wang |
Method for machining translucent material by laser beam and machined translucent material
|
|
JP2003226551A
(ja)
*
|
2002-02-05 |
2003-08-12 |
Nippon Sheet Glass Co Ltd |
微細孔を有するガラス板およびその製造方法
|
|
JP4267240B2
(ja)
*
|
2002-02-22 |
2009-05-27 |
日本板硝子株式会社 |
ガラス構造物の製造方法
|
|
US7880117B2
(en)
*
|
2002-12-24 |
2011-02-01 |
Panasonic Corporation |
Method and apparatus of drilling high density submicron cavities using parallel laser beams
|
|
JP2004291026A
(ja)
*
|
2003-03-27 |
2004-10-21 |
Seiko Epson Corp |
脆性材料の穴あけ加工方法およびその装置
|
|
JP2005088023A
(ja)
|
2003-09-12 |
2005-04-07 |
Seiko Epson Corp |
透明体の加工方法
|
|
JP2005118821A
(ja)
|
2003-10-16 |
2005-05-12 |
Olympus Corp |
超短パルスレーザ加工方法
|
|
US20050087522A1
(en)
*
|
2003-10-24 |
2005-04-28 |
Yunlong Sun |
Laser processing of a locally heated target material
|
|
MX2007001159A
(es)
*
|
2004-07-30 |
2007-09-25 |
Mitsuboshi Diamond Ind Co Ltd |
Metodo para formar una grieta media en un sustrato y aparato para formar una grieta media en un sustrato.
|
|
US7598167B2
(en)
*
|
2004-08-24 |
2009-10-06 |
Micron Technology, Inc. |
Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures
|
|
US8394301B2
(en)
*
|
2006-06-02 |
2013-03-12 |
Electro Scientific Industries, Inc. |
Process for forming panel with an optically transmissive portion and products related thereto
|
|
US20080093775A1
(en)
*
|
2006-08-19 |
2008-04-24 |
Colorado State University Research Foundation |
Nanometer-scale ablation using focused, coherent extreme ultraviolet/soft x-ray light
|
|
CN101610870B
(zh)
*
|
2007-10-16 |
2013-09-11 |
三星钻石工业股份有限公司 |
脆性材料基板的u形槽加工方法以及使用该方法的去除加工方法、打孔加工方法和倒角方法
|
|
SG10201506370VA
(en)
*
|
2008-09-30 |
2015-09-29 |
Hoya Corp |
Glass substrate for a magnetic disk and magnetic disk
|
|
US9346130B2
(en)
*
|
2008-12-17 |
2016-05-24 |
Electro Scientific Industries, Inc. |
Method for laser processing glass with a chamfered edge
|
|
JP5414467B2
(ja)
*
|
2009-11-09 |
2014-02-12 |
キヤノン株式会社 |
レーザ加工方法
|
|
WO2012008577A1
(ja)
*
|
2010-07-16 |
2012-01-19 |
株式会社フジクラ |
基体、及び基体の製造方法
|
|
JP2013209223A
(ja)
*
|
2010-07-27 |
2013-10-10 |
Asahi Glass Co Ltd |
半導体チップ実装用のガラス基板へのアブレーション加工の方法
|
|
US20120168412A1
(en)
*
|
2011-01-05 |
2012-07-05 |
Electro Scientific Industries, Inc |
Apparatus and method for forming an aperture in a substrate
|
|
JP2013146780A
(ja)
*
|
2012-01-23 |
2013-08-01 |
Mitsuboshi Diamond Industrial Co Ltd |
脆性材料基板のレーザ加工方法
|
|
WO2013130608A1
(en)
*
|
2012-02-29 |
2013-09-06 |
Electro Scientific Industries, Inc. |
Methods and apparatus for machining strengthened glass and articles produced thereby
|
|
JP5896411B2
(ja)
*
|
2012-05-14 |
2016-03-30 |
国立研究開発法人産業技術総合研究所 |
レーザー誘起背面式の透明基板微細加工を行う加工装置
|
|
JP6238675B2
(ja)
*
|
2013-10-10 |
2017-11-29 |
キヤノン株式会社 |
レーザ加工方法及びインクジェットヘッドの製造方法
|
|
US10017410B2
(en)
*
|
2013-10-25 |
2018-07-10 |
Rofin-Sinar Technologies Llc |
Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses
|
|
US11053156B2
(en)
*
|
2013-11-19 |
2021-07-06 |
Rofin-Sinar Technologies Llc |
Method of closed form release for brittle materials using burst ultrafast laser pulses
|
|
US9517929B2
(en)
*
|
2013-11-19 |
2016-12-13 |
Rofin-Sinar Technologies Inc. |
Method of fabricating electromechanical microchips with a burst ultrafast laser pulses
|
|
US20150166393A1
(en)
*
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser cutting of ion-exchangeable glass substrates
|
|
US9687936B2
(en)
*
|
2013-12-17 |
2017-06-27 |
Corning Incorporated |
Transparent material cutting with ultrafast laser and beam optics
|
|
US10717670B2
(en)
*
|
2015-02-10 |
2020-07-21 |
Nippon Sheet Glass Company, Limited |
Glass for laser processing and method for producing perforated glass using same
|
|
KR20170131638A
(ko)
*
|
2015-03-27 |
2017-11-29 |
코닝 인코포레이티드 |
가스 투과성 유리창 및 이의 제작방법
|
|
US10366904B2
(en)
*
|
2016-09-08 |
2019-07-30 |
Corning Incorporated |
Articles having holes with morphology attributes and methods for fabricating the same
|