JP2018032863A - Insulative gate type field-effect transistor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method, by which various semiconductor devices such as a semiconductor electronic device, a semiconductor light-emitting device, and a semiconductor light-receiving device which have a high breakdown voltage and a high output can be readily manufactured by use of Si substrates.SOLUTION: A semiconductor device manufacturing method comprises the steps of: growing a first semiconductor layer (13) having a hexagonal crystal structure on a first substrate (11); forming a plurality of seeds in the stripe pattern by etching the first semiconductor layer (13) in a stripe pattern until the first substrate (11) is etched; performing treatment on a surface of the first substrate (11) after the seed formation so that the semiconductor layer having a hexagonal crystal structure is substantially not grown; and growing a second semiconductor layer (16) having a hexagonal crystal structure from the respective seeds in a crosswise direction.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method of manufacturing a semiconductor device, an insulated gate field effect transistor, a method of manufacturing an insulated gate field effect transistor, a method of manufacturing a semiconductor light emitting device, and a method of manufacturing a solar cell, for example, a gallium nitride (GaN) based semiconductor It is suitable for application to an insulated gate field effect transistor, semiconductor light emitting device or solar cell using

  The importance of electrical energy is increasing for the realization of an energy-saving society, and in the 21st century, more and more are going to depend on electricity. The key devices of electrical / electronic equipment are semiconductor elements such as transistors and diodes. Therefore, the energy saving performance of these semiconductor elements is very important. Currently, silicon (Si) semiconductor elements are responsible for power conversion elements, but the performance of the Si semiconductor elements has been improved to the limit of their physical properties, and it is difficult to achieve further energy savings.

  Accordingly, research and development of power conversion elements using wide gap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) instead of Si have been energetically performed. Among them, GaN has physical properties that are far superior to SiC in terms of power efficiency and voltage resistance, and therefore, research and development of GaN-based semiconductor elements are actively conducted.

  As the GaN-based semiconductor element, a field effect transistor (FET) type lateral type, that is, an element having a configuration in which a traveling channel is formed in parallel with a substrate has been developed. For example, an undoped GaN layer is several μm thick on a base substrate made of sapphire, SiC, or the like, and an AlGaN layer having an Al composition of about 25% is laminated on the AlGaN / GaN heterointerface. It is an element that utilizes the generated two-dimensional electron gas (2DEG). This element is usually called an HFET (hetero-junction FET).

  Now, as a power conversion element, in order to replace a Si power semiconductor element such as an existing insulated gate bipolar transistor (IGBT) or a power MOS transistor with a GaN-based semiconductor element, the manufacturing cost is low enough to meet the performance. There must be. However, it is considered difficult to use a sapphire substrate or a SiC substrate as a GaN-based semiconductor growth substrate in order to manufacture a GaN-based semiconductor element in terms of substrate cost.

  Therefore, since the Si substrate has a large diameter and low cost, it is considered that the GaN-based semiconductor element on the Si substrate can outperform the Si power semiconductor element in the price / performance ratio.

  A conventional GaN-based HFET formed on a Si substrate is shown in FIG. As a GaN-based semiconductor growth technique on a Si substrate, a metal organic chemical vapor deposition (MOCVD) method is generally used. The manufacturing method of this GaN-based HFET is as follows.

  As shown in FIG. 29, first, an AlN film 102 is grown on a Si (111) substrate 101 to a thickness of about several tens to 100 nm. The AlN film 102 is for preventing a chemical reaction between the GaN-based semiconductor layer grown later and the Si (111) substrate 101.

  Next, an AlN / GaN or AlN / AlGaN pair, for example, a pair having a thickness of 5 nm / 20 nm is epitaxially grown to about 200 layers (total thickness is about 5 μm) to form the buffer layer 103. This buffer layer 103 is for improving the crystal quality of the GaN-based semiconductor layer epitaxially grown thereon and preventing warpage, cracks and the like.

  Next, a GaN layer 104 having a thickness of approximately 1 μm, an AlGaN layer 105 having a thickness of approximately 20 to 30 nm, and a GaN cap layer 106 having a thickness of approximately 5 nm are sequentially epitaxially grown on the buffer layer 103.

  A two-dimensional electron gas (2DEG) (not shown) is automatically generated at the AlGaN / GaN interface between the AlGaN layer 105 and the GaN layer 104 due to the polarization effect due to strain, and is used as an electron channel.

  Using the substrate formed as described above, a GaN-based HFET is manufactured as follows.

First, an insulating film 107 such as a SiN film or a SiO ₂ film is formed on the GaN cap layer 106 as a surface protective film.

  Next, a resist pattern having an opening in a portion corresponding to the element isolation region formation portion is formed on the insulating film 107 by photolithography, and then B (boron), Ga (gallium), By ion-implanting elements such as N (nitrogen), C (carbon), Cr (chromium), and Fe (iron), the AlN film 102, the buffer layer 103, the GaN layer 104, and the AlGaN in the opening portion of the resist pattern. The layer 105 and the GaN cap layer 106 are increased in resistance to form an element isolation region 108 made of a high resistance layer.

  Next, after forming a resist pattern having openings in portions corresponding to the source electrode and drain electrode formation portions by photolithography, the insulating film 107 and the GaN cap layer 106 are sequentially etched using the resist pattern as a mask. Openings 109 and 110 are formed.

  Next, after depositing ohmic metal on the entire surface of the substrate, the resist pattern is removed together with the ohmic metal film formed thereon by a lift-off method. After the lift-off, ohmic metal films having the same shape as the openings 109 and 110 are left in the source electrode and drain electrode formation portions on the AlGaN layer 105. Thereafter, heat treatment is performed to improve the ohmic contact characteristics of the ohmic metal film. Thus, the source electrode 111 and the drain electrode 112 are formed.

Next, the gate electrode 113 is formed over the insulating film 107. Thereafter, although illustration is omitted, formation of the extraction electrode and plating for lowering the resistance of the extraction electrode are performed, and finally a protective film such as a SiO ₂ film is formed on the surface.

The above-described conventional GaN-based HFET formed on the Si substrate has the following problems.
(1) The substrate warps and cracks occur, and the yield is significantly reduced.
(2) The thickness of the GaN-based semiconductor layer (AlN film 102, buffer layer 103, GaN layer 104, AlGaN layer 105, and GaN cap layer 106) is actually 3 to 5 μm, but at this thickness, the drain electrode The withstand voltage between 112 and the Si (111) substrate 101 is insufficient, and if the thickness of the GaN-based semiconductor layer is increased to ensure the withstand voltage, the problem (1) occurs.

The problems (1) and (2) will be described in more detail. In GaN (0001) and Si (111), the lattice constants in the substrate surface differ from each other by about 16%, and the difference in thermal expansion coefficient is as large as 3 × 10 ⁻⁶ / K. For this reason, a very large stress is generated in the GaN-based semiconductor layer during growth, and a large amount of threading dislocations are generated. The threading dislocation density is about 10 ⁹ to 10 ¹¹ cm ^−2, which is an order of magnitude higher than the threading dislocation density of the GaN-based semiconductor layer grown on the sapphire substrate. Therefore, the breakdown voltage in the vertical direction is smaller than expected from the physical property values due to the presence of threading dislocations in the GaN-based semiconductor layer. In a GaN-based semiconductor element on a Si substrate, the thickness of the GaN-based semiconductor layer needs to be about 5 μm or more in order to ensure, for example, about 1000 V as a breakdown voltage between the Si substrate and the GaN-based semiconductor element. .

  A major problem with a substrate in which a GaN-based semiconductor layer is grown on a Si substrate is that the thermal expansion coefficient of Si is smaller than that of a GaN-based semiconductor, so the GaN-based semiconductor layer shrinks when returning from high temperature to room temperature, thereby The GaN-based semiconductor layer receives a tensile force, warps greatly in a concave shape, and is severely cracked.

  As a technique for alleviating the warp and crack, several hundred ultra-thin film pairs of about AlN (5 nm) / GaN (20 nm) are stacked, or AlGaN layers having different Al compositions are sequentially stacked, and the total is about 3 to 5 μm. When a buffer layer having a thickness of 10 mm is formed, the degree of warping and cracking is relatively relaxed.

  In order to reduce warpage and cracks, it is necessary to reduce the thickness of the buffer layer 103, the GaN layer 104, the AlGaN layer 105, and the like. However, the withstand voltage between the drain electrode 112 and the Si (111) substrate 101 is reduced. It cannot be secured.

The following techniques have been proposed as conventional techniques for improving the breakdown voltage when manufacturing a GaN-based semiconductor element on a Si substrate.
(1) Thickening the buffer layer 103 (see Non-Patent Documents 1 to 3)
(2) Etching of Si substrate directly under the element (see Non-Patent Document 4)
(3) Crystal growth on SOI (Silicon on Insulator) substrate (see Non-Patent Document 5)
(4) Bonding of insulating substrates (see Non-Patent Documents 6 and 7)

  (1) is the most common method for improving the breakdown voltage. As shown in FIG. 28, a thick AlN / GaN multilayer film having a thickness of about 5 to 6 μm is used as the buffer layer 103. It is said that when an AlGaN / GaN element layer having a thickness of about 1.0 to 1.5 μm is formed on this thick AlN / GaN multilayer film, the breakdown voltage between the element and the substrate is improved to about 1.8 kV. However, such a thick crystal growth leads to an increase in cost and cannot be employed. On the contrary, as the thickness of the buffer layer 103 increases, the distance from the drain electrode 112 to the Si (111) substrate 101 increases, so that the electromagnetic shielding effect is reduced and the current collapse increases. As a result, the device performance is lowered, which is not practical. In addition, the warpage of the substrate increases, and the yield decreases.

  As for (2), as shown in FIG. 29, the Si (111) substrate 101 directly under the element is removed by etching to form an opening 101a. Although the breakdown voltage can be improved by removing the Si (111) substrate 101 immediately under the element including the drain electrode 112 having a high breakdown voltage, no effect has been reported experimentally. It seems that the breakdown voltage is determined through the remaining Si (111) substrate 101 that has not been removed, and there is a further contrivance. In general, in the case of a power device, the device area is large, and the Si substrate exists only around the chip, which may cause difficulty in device fabrication.

As for (3), as shown in FIG. 30, on the SOI substrate in which the Si layer 203 is formed on the SiO ₂ film 202 formed on the Si substrate 201, the AlN film 102, the buffer layer 103, the GaN layer 104, A GaN-based semiconductor layer such as the AlGaN layer 105 is grown. In this case, since the SiO ₂ film 202 is responsible for a certain proportion of the applied voltage and reduces the voltage applied to the GaN-based semiconductor layer and the Si substrate 201, this is a method that can potentially be expected to improve the breakdown voltage. However, the use of an SOI substrate causes an increase in cost and a deterioration in thermal conductivity due to the SiO ₂ film 202 which is an insulating film.

  As for (4), as shown in FIG. 30, after the GaN-based semiconductor layer is grown on the Si substrate, the Si substrate is removed by some method and bonded to an insulating substrate 301 such as a sapphire substrate or a glass substrate. According to this method, high breakdown voltage can be expected, but sapphire substrates and glass substrates have poor thermal conductivity and cannot be applied to high output elements. Furthermore, as for the bonding of the GaN-based semiconductor layer and the insulating substrate, direct bonding is difficult at present and it is necessary to interpose an adhesive layer therebetween, but this further deteriorates the heat conduction characteristics. In addition, since contamination and defects exist at the bonding interface between the GaN-based semiconductor layer and the insulating substrate, there is a great possibility that this will lead to an increase in leakage current between the source electrode 111 and the drain electrode 112. This leads to lower reliability and lower yield.

W.Huang, T.P.Chow, Y.Niiyama, T.Nomura, and S.Yoshida, "Lateral Implanted RESURF GaN MOSFETs with BV Up to 2.5kV," in Proc. 20th ISPSD (2008), 291 Selvaraj, SL; Suzue, T.; Egawa, T., "Breakdown Enhancement of AlGaN / GaN HEMTs on 4-in silicon by Improving the GaN Quality on Thick Buffer Layers" IEEE Electron Device Letters, 30, No. 6, (2009 ) 587 Rowena, IB; Selvaraj, SL; Egawa, T., "Buffer Thickness Contribution to Supress Vertical Leakage Current With High Breakdown Field (2.3MV / cm) for GaN on Si" Electron Device Letters, 32, No. 11, (2011) 1534 Srivastava, P.; Das, J.; Visalli, D.; Van Hove, M.; Malinowski, PE; Marcon, D.; Lenci, S.; Geens, K.; Kai Cheng; Leys, M.; Decoutere, S.; Mertens, RP, Borghs, G., "Record Breakdown Voltage (2200V) of GaN DHFETs on Si With 2-um Buffer Thickness by Local Substrate Removal" Electron Device Letters, 32, No. 1, (2011) p. 30 S.Tripathy, L.S.Wang, S.J.Chua, "Characterization of GaN layers grown on silicon-on-insulator substrates" Applied Surface Science, 253 (2006) 236-240 Srivastava, P .; Das, J .; Visalli, D .; Derluyn, J .; Van Hove, M .; Malinowski, PE; Marcon, D .; Geens, K .; Kai Cheng; Degroote, S .; Leys, M.; Germain, M.; Decoutere, S.; Mertens, RP, Borghs, G., "Silicon Substrate Removal of GaN DHFETs for Enhanced (<1100V) Breakdown voltage", Electron Device Letters, 31, No. 8, ( 2010) p.851 Bin Lu; Palacios, T., "High Breakdown (1500V) AlGaN / GaN HEMTs by Substrate-Transfer Technology", Electron Device Letters, 31, No. 9, (2010) p. 951

  As described above, in the currently proposed technique, an optimum technique for manufacturing a high-voltage, high-output GaN-based semiconductor element with a high yield using a Si substrate has not been proposed.

  The object of the present invention is to solve the above-mentioned problems of the prior art at once.

That is, the problem to be solved by the present invention is that of a semiconductor element that can easily manufacture various semiconductor elements such as a high-voltage and high-power semiconductor electronic element, semiconductor light-emitting element, and semiconductor light-receiving element using a Si substrate. It is to provide a manufacturing method.
Another problem to be solved by the present invention is a method of manufacturing an insulated gate field effect transistor capable of easily manufacturing a high withstand voltage and high output insulated gate field effect transistor using a Si substrate, and this manufacturing method. It is to provide an insulated gate field effect transistor that can be manufactured.

  Another problem to be solved by the present invention is to provide a method for manufacturing a semiconductor light emitting device, which can easily manufacture a semiconductor light emitting device having a high withstand voltage and a high output using a Si substrate.

  Another problem to be solved by the present invention is to provide a method for manufacturing a semiconductor light emitting device, which can easily manufacture a high voltage and high output solar cell using a Si substrate.

In order to solve the above problems, the present invention provides:
Growing a first semiconductor layer having a hexagonal crystal structure on a first substrate;
Forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched;
Treating the surface of the first substrate after forming the seed so that a semiconductor layer having a hexagonal crystal structure does not substantially grow;
And a step of laterally growing a second semiconductor layer having a hexagonal crystal structure from each of the seeds.
Typically, the semiconductor element manufacturing method includes, for example, a step of laterally growing a second semiconductor layer and then providing a second substrate on the second semiconductor layer, a seed, and a second semiconductor. And a step of peeling the first substrate from the layer and the second substrate. Alternatively, in this method of manufacturing a semiconductor element, for example, after the second semiconductor layer is laterally grown, a third semiconductor layer having a hexagonal crystal structure is formed on the entire surface so as to cover the second semiconductor layer. A step of growing, a step of providing a second substrate on the third semiconductor layer, and a step of peeling the first substrate from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate. Also have. The second semiconductor layer and the third semiconductor layer include one or more types of semiconductor layers having the same or different conductivity types. In one example, after the first semiconductor layer is grown and before the seed is formed, an insulating film is formed on the first semiconductor layer, and the insulating film and the first semiconductor layer are formed on the first substrate. A seed is formed by etching in stripes until is etched. If necessary, the second semiconductor layer may be grown in the lateral direction with the insulating film remaining on the seed. Alternatively, for example, in the step of forming the seed, the first substrate is etched to a depth of 1 μm or more. By doing so, for example, a gap through which the etchant permeates is created when the first substrate is peeled (separated), and etching is facilitated. Further, typically, the step of treating the semiconductor layer having a hexagonal crystal structure so as not to grow substantially is a step of oxidizing or nitriding the first substrate. Alternatively, in the step of forming the seed, the aspect ratio (column height / column width) of the cross section of the stripe-shaped column made of the first substrate formed by etching the first substrate is 1. The first substrate is etched until the above is reached or until the height of the stripe-shaped column made of the first substrate is 4 μm or more. By doing so, it is possible to obtain an effect of preventing the stripe-like pillars made of the first substrate from being broken and causing cracks or the like to enter the semiconductor layer constituting the element. Preferably, the step of peeling the first substrate from the seed, the second semiconductor layer, and the second substrate, or the first step from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate. The step of peeling the substrate is a step of wet etching the first substrate. By doing so, the first substrate can be peeled (separated) with little damage to the second semiconductor layer or the third semiconductor layer.
The semiconductor element may be basically any type, for example, a semiconductor electronic element, a semiconductor light emitting element, a semiconductor light receiving element, or the like. The semiconductor electronic device includes, for example, an insulated gate field effect transistor, a superjunction insulated gate field effect transistor, a field stop insulated gate bipolar transistor, a composite of a superjunction insulated gate field effect transistor and a field stop insulated gate bipolar transistor. An element, a Schottky barrier diode (SBD), a pn junction diode, or the like.
When the semiconductor element is a semiconductor light emitting element (for example, a semiconductor laser or a light emitting diode) or a semiconductor light receiving element (for example, a solar cell or a photodiode), for example, the second semiconductor layer includes at least one n-type semiconductor. And a p-type semiconductor layer including at least one p-type semiconductor layer. The cathode electrode is provided connected to the n-type semiconductor layer, and the anode electrode is provided connected to the p-type semiconductor layer. When the semiconductor element is a Schottky barrier diode, for example, the third semiconductor layer includes at least one non-doped or n ⁻ type semiconductor layer and at least one n type semiconductor layer (n type contact layer). A Schottky electrode connected to the non-doped or n ⁻ -type semiconductor layer on the first semiconductor layer and the second semiconductor layer side of the third semiconductor layer is provided. Of these, an ohmic electrode is provided connected to the n-type semiconductor layer on the surface opposite to the first semiconductor layer and the second semiconductor layer. Alternatively, when the semiconductor element is a Schottky barrier diode, for example, the second semiconductor layer includes at least one p-type or p ⁻ -type semiconductor layer, and the third semiconductor layer includes at least 1 p ^- type semiconductor layer. Including at least one non-doped or n ⁻ type semiconductor layer and at least one n-type semiconductor layer (n-type contact layer), and among the third semiconductor layers, the first semiconductor layer and the second semiconductor layer A Schottky electrode is provided connected to the side surface and the p-type or p ⁻ -type semiconductor layer of the second semiconductor layer, and is opposite to the first semiconductor layer and the second semiconductor layer of the third semiconductor layer An ohmic electrode is provided connected to the n-type semiconductor layer on the side surface. When the semiconductor element is an insulated gate field effect transistor (MOSFET), for example, the first semiconductor layer includes at least one n-type semiconductor layer, and the second semiconductor layer includes at least one layer. The above p-type semiconductor layer is included, and the third semiconductor layer includes at least one or more non-doped or n ⁻ -type semiconductor layers and at least one or more n-type semiconductor layers (n-type contact layers). The source electrode is provided connected to the n-type semiconductor layer of the first semiconductor layer, the gate electrode is provided on the p-type semiconductor layer of the second semiconductor layer with an insulating film interposed therebetween, and the third semiconductor layer A drain electrode is provided connected to the n-type semiconductor layer. When the semiconductor element is an insulated gate field effect transistor or a superjunction insulated gate field effect transistor, for example, the first semiconductor layer includes at least one n-type semiconductor layer, and the second semiconductor layer The semiconductor layer includes at least one p-type semiconductor layer and at least one p ⁻ type semiconductor layer, and the third semiconductor layer includes at least one non-doped or n ⁻ type semiconductor layer. And at least one n-type semiconductor layer, the source electrode is provided connected to the n-type semiconductor layer of the first semiconductor layer, and the p-type semiconductor layer and the p ⁻ -type semiconductor layer of the second semiconductor layer A gate electrode is provided over the insulating film, and a drain electrode is provided connected to the n-type semiconductor layer of the third semiconductor layer. When the semiconductor element is a superjunction insulated gate field effect transistor, for example, the first semiconductor layer includes at least one n-type semiconductor layer, and the second semiconductor layer includes at least one layer. P-type semiconductor layer and at least one p ⁻ type semiconductor layer, and the third semiconductor layer includes at least one non-doped or n ⁻ type semiconductor layer and at least one n type semiconductor layer. Layer (n-type contact layer), connected to the n-type semiconductor layer of the first semiconductor layer and provided with a source electrode, on the p-type semiconductor layer and the p ⁻ -type semiconductor layer of the second semiconductor layer A gate electrode is provided through an insulating film, a drain electrode is provided connected to the n-type semiconductor layer of the third semiconductor layer, and the thicknesses of the p-type semiconductor layer and the p ⁻ -type semiconductor layer of the second semiconductor layer A, the above-mentioned non-conductive third layer Flop or n ^- when the thickness of the type semiconductor layer was B, A / B is less than 1 less than 0.5. When the semiconductor element is a field stop insulated gate bipolar transistor, for example, the first semiconductor layer includes at least one or more n-type semiconductor layers, and the second semiconductor layer includes at least one or more layers. A p-type semiconductor layer is included, and the third semiconductor layer includes at least one non-doped or n ⁻ type semiconductor layer, at least one n-type semiconductor layer (field stop layer), and at least one p-type semiconductor layer. A semiconductor layer is included, connected to the n-type semiconductor layer of the first semiconductor layer, a source electrode is provided, a gate electrode is provided on the p-type semiconductor layer of the second semiconductor layer via an insulating film, A drain electrode is provided connected to the p-type semiconductor layer of the third semiconductor layer. When the semiconductor element is a composite element of a superjunction insulated gate field effect transistor and a field stop insulated gate bipolar, for example, the first semiconductor layer includes at least one n-type semiconductor layer, The semiconductor layer 2 includes at least one p-type semiconductor layer and at least one p ⁻ type semiconductor layer, and the third semiconductor layer includes at least one non-doped or n ⁻ type semiconductor layer. The semiconductor layer includes at least one n-type semiconductor layer (field stop layer) and at least one p-type semiconductor layer, and is connected to the n-type semiconductor layer of the first semiconductor layer to provide a source electrode. , p-type semiconductor layer of the second semiconductor layer and the p ^- type semiconductor layer on the formed gate electrode through the insulating film, the third semiconductor layer p-type semiconductor layer connected to the drain electrode of the set Is, p-type semiconductor layer of the second semiconductor layer and the p ^- type the thickness A of the semiconductor layer, the third semiconductor layer n of ^- when the thickness of the type semiconductor layer and B, A / B is 0. 5 or more and less than 1.
The first substrate may be basically any type, but is preferably a Si substrate. The first semiconductor layer, the second semiconductor layer, and the third semiconductor layer may be basically composed of any semiconductor, but typically, a nitride-based III-V group compound Made of semiconductor. Alternatively, the first semiconductor layer, the second semiconductor layer, and the third semiconductor layer are made of at least one group III element selected from the group consisting of B, Al, Ga, and In and N, P, and As. And a group III-V compound semiconductor composed of at least one group V element selected from the group consisting of:
In addition, this invention
Growing a first semiconductor layer having a hexagonal crystal structure on a first substrate;
Forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched;
Treating the surface of the first substrate after forming the seed so that a semiconductor layer having a hexagonal crystal structure does not substantially grow;
Laterally growing a second semiconductor layer having a hexagonal crystal structure from each seed so as not to contact each other;
Growing a third semiconductor layer having a hexagonal crystal structure over the entire surface so as to cover the second semiconductor layer;
Providing a second substrate on the third semiconductor layer;
And a step of separating the first substrate from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate.

In addition, this invention
Growing a first semiconductor layer having a hexagonal crystal structure on a first substrate;
Forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched;
Treating the surface of the first substrate after forming the seed so that a semiconductor layer having a hexagonal crystal structure does not substantially grow;
Laterally growing a second semiconductor layer having a hexagonal crystal structure from each seed so as not to contact each other;
Growing a third semiconductor layer having a hexagonal crystal structure over the entire surface so as to cover the second semiconductor layer;
Providing a second substrate on the third semiconductor layer;
Peeling the first substrate from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate;
A stripe-shaped first recess extending in the longitudinal direction of the seed is formed at a central portion in the width direction of the seed, and a stripe-shaped second extending in the longitudinal direction of the seed is formed between adjacent seeds. Forming a recess of
Forming a source electrode in the first recess and forming a gate electrode in the second recess via a gate insulating film;
Providing a third substrate on the source electrode and gate electrode sides;
Peeling the second substrate from the third semiconductor layer;
And forming a drain electrode on the third semiconductor layer. A method for manufacturing an insulated gate field effect transistor.

  In this method of manufacturing an insulated gate field effect transistor, for example, in the step of forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched. The first substrate is etched until the aspect ratio of the cross-section of the stripe-shaped column made of the first substrate formed by etching one substrate is 1 or more, preferably 2 or more. . By doing so, a force can be applied to the stripe-shaped pillars during the growth of the third semiconductor layer to facilitate the destruction.

  Typically, for example, after growing a first semiconductor layer having a hexagonal crystal structure on a first substrate, and before forming the plurality of striped seeds, the first semiconductor An insulating film is formed on the layer, and the plurality of striped seeds are formed by etching the insulating film and the first semiconductor layer in a stripe shape until the first substrate is etched.

The first semiconductor layer, the second semiconductor layer, and the third semiconductor layer having a hexagonal crystal structure may be, for example, ZnO, α-ZnS, α-CdS, α, in addition to nitride III-V compound semiconductors. -CdSe or the like may be used. Nitride III-V compound semiconductor is most commonly _{Al X B y Ga 1-xyz} In z As u N 1-uv P v ( however, 0 ≦ x ≦ 1,0 ≦ y ≦ 1,0 ≦ z ≦ 1,0 ≦ u ≦ 1,0 ≦ v ≦ 1,0 ≦ x + y + z <1,0 ≦ u + v consists <1), more specifically, _{Al X B y Ga 1-xyz} in z N ( provided that , 0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ z ≦ 1, 0 ≦ x + y + z <1), typically Al _X Ga _1-xz In _z N (where 0 ≦ x ≦ 1, 0 ≦ z ≦ 1).

  The first substrate may be basically (technical) as long as a crystalline nitride III-V compound semiconductor layer can be grown, but from an industrial viewpoint ( The Si substrate is preferred because of its price, large diameter, and obtained device characteristics.

  The second semiconductor layer may be grown in the lateral direction with the insulating film remaining on the seed. Further, for example, a fourth semiconductor layer of the first conductivity type and a fifth semiconductor layer of the second conductivity type are sequentially grown as the first semiconductor layer. For example, the second semiconductor layer has the second conductivity type, and the third semiconductor layer has the first conductivity type, but the present invention is not limited to this. If necessary, the third semiconductor layer has a contact layer having an impurity concentration higher than that of the third semiconductor layer as the uppermost layer. Alternatively, the contact layer may be grown thick and used as the second substrate. Similarly, the third semiconductor layer may be grown thick and used as the second substrate.

In addition, this invention
A plurality of striped fourth n-type semiconductor layers having a hexagonal crystal structure;
A plurality of p-type fifth semiconductor layers provided to cover each of the fourth semiconductor layers and not to contact each other;
An n-type sixth semiconductor layer that covers the plurality of fifth semiconductor layers and is provided as a continuous film so as to fill a portion between the fifth semiconductor layers adjacent to each other;
A source electrode provided in the fourth semiconductor layer;
A gate electrode provided on the fifth semiconductor layer via a gate insulating film;
An insulated gate field effect transistor having a drain electrode provided on a surface opposite to the surface on which the source electrode and the gate insulating film of the sixth semiconductor layer are provided.

In addition, this invention
A plurality of striped n-type seventh semiconductor layers having a hexagonal crystal structure;
A plurality of n-type eighth semiconductor layers provided to cover each of the seventh semiconductor layers and not to contact each other;
A plurality of p-type ninth semiconductor layers provided so as to cover each of the eighth semiconductor layers and not to contact each other;
An n-type tenth semiconductor layer provided as a continuous film so as to cover the plurality of ninth semiconductor layers and fill a portion between the ninth semiconductor layers adjacent to each other;
A source electrode provided on a surface of the seventh semiconductor layer opposite to the ninth semiconductor layer;
A gate electrode provided on a surface on the seventh semiconductor layer side of the tenth semiconductor layer in a portion between the ninth semiconductor layers adjacent to each other via a gate insulating film;
A drain electrode provided on a surface opposite to the surface on which the source electrode and the gate insulating film of the tenth semiconductor layer are provided;
The band gap of the ninth semiconductor layer is an insulated gate field effect transistor larger than the band gaps of the eighth semiconductor layer and the tenth semiconductor layer.

In addition, this invention
A plurality of striped n-type eleventh semiconductor layers having a hexagonal crystal structure;
A plurality of p-type twelfth semiconductor layers provided to cover each of the eleventh semiconductor layers and not to contact each other;
A plurality of p ⁻ -type thirteenth semiconductor layers provided so as to cover each of the twelfth semiconductor layers and not to contact each other;
An n-type fourteenth semiconductor layer provided as a continuous film so as to cover the plurality of thirteenth semiconductor layers and fill a portion between the thirteenth semiconductor layers adjacent to each other;
A p-type fifteenth semiconductor layer provided on the fourteenth semiconductor layer;
A source electrode provided in the eleventh semiconductor layer;
A gate electrode provided on the twelfth semiconductor layer and the thirteenth semiconductor layer with a gate insulating film interposed therebetween;
An insulated gate field effect transistor having a drain electrode provided on the fifteenth semiconductor layer.
This insulated gate field effect transistor can be used as a superjunction insulated gate field effect transistor.

In addition, this invention
A plurality of striped n-type sixteenth semiconductor layers having a hexagonal crystal structure;
A plurality of p-type seventeenth semiconductor layers provided to cover each of the sixteenth semiconductor layers and not to contact each other;
An n-type eighteenth semiconductor layer provided as a continuous film so as to cover the plurality of seventeenth semiconductor layers and fill a portion between the seventeenth semiconductor layers adjacent to each other;
An n-type nineteenth semiconductor layer provided on the eighteenth semiconductor layer;
A p-type twentieth semiconductor layer provided on the nineteenth semiconductor layer;
A source electrode provided on a surface of the sixteenth semiconductor layer opposite to the seventeenth semiconductor layer;
A gate electrode provided on the seventeenth semiconductor layer via a gate insulating film;
An insulated gate field effect transistor having a drain electrode provided on the twentieth semiconductor layer.
This insulated gate field effect transistor can be used as an insulated gate bipolar transistor.

In addition, this invention
A plurality of striped n-type twenty-first semiconductor layers having a hexagonal crystal structure;
A plurality of p-type twenty-second semiconductor layers provided so as to cover each of the twenty-first semiconductor layers and not to contact each other;
A plurality of p-type twenty-third semiconductor layers provided to cover each of the twenty-second semiconductor layers and not to contact each other;
An n-type twenty-fourth semiconductor layer provided as a continuous film so as to cover the plurality of twenty-third semiconductor layers and fill a portion between the twenty-third semiconductor layers adjacent to each other;
An n-type 25th semiconductor layer provided on the 24th semiconductor layer;
A p-type twenty-sixth semiconductor layer provided on the twenty-fifth semiconductor layer;
A source electrode provided in the twenty-first semiconductor layer;
A gate electrode provided on the twenty-second semiconductor layer and the twenty-third semiconductor layer via a gate insulating film;
An insulated gate field effect transistor having a drain electrode provided on the twenty-sixth semiconductor layer.
This insulated gate field effect transistor can be used as a composite element of a superjunction insulated gate field effect transistor and an insulated gate bipolar transistor.

In addition, this invention
A plurality of striped n-type 27th semiconductor layers having a hexagonal crystal structure;
A plurality of p-type twenty-eighth semiconductor layers provided so as to cover each of the twenty-seventh semiconductor layers and not to contact each other;
A plurality of p-type 29th semiconductor layers provided to cover each of the 28th semiconductor layers and not to contact each other;
An n-type 30th semiconductor layer provided as a continuous film so as to cover the plurality of 29th semiconductor layers and fill a portion between the 29th semiconductor layers adjacent to each other;
An n-type 31st semiconductor layer provided on the 30th semiconductor layer;
A p-type thirty-second semiconductor layer provided on the thirty-first semiconductor layer;
A source electrode provided on a surface of the thirtieth semiconductor layer opposite to the twenty-eighth semiconductor layer;
A gate electrode provided on the twenty-eighth semiconductor layer and the twenty-ninth semiconductor layer via a gate insulating film;
An insulated gate field effect transistor having a drain electrode provided on the thirty-second semiconductor layer.

In addition, this invention
Growing a first semiconductor layer having a hexagonal crystal structure on a first substrate;
Forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched;
Treating the surface of the first substrate after forming the seed so that a semiconductor layer having a hexagonal crystal structure does not substantially grow;
Laterally growing a second semiconductor layer having a hexagonal crystal structure from each seed so as not to contact each other;
Growing a third semiconductor layer having a hexagonal crystal structure over the entire surface so as to cover the second semiconductor layer;
Providing a second substrate on the third semiconductor layer;
And a step of separating the first substrate from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate.

In addition, this invention
Growing a first semiconductor layer having a hexagonal crystal structure on a first substrate;
Forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched;
Treating the surface of the first substrate after forming the seed so that a semiconductor layer having a hexagonal crystal structure does not substantially grow;
Laterally growing a second semiconductor layer having a hexagonal crystal structure from each seed so as not to contact each other;
Growing a third semiconductor layer having a hexagonal crystal structure constituting a light emitting element structure on the entire surface so as to cover the second semiconductor layer;
Attaching a second substrate on the third semiconductor layer;
Peeling the first substrate from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate;
Forming a first electrode and a second electrode on both surfaces of the third semiconductor layer before or after peeling the first substrate, respectively. It is a manufacturing method of a semiconductor light emitting element.

  In the invention of the method for manufacturing a semiconductor light emitting device, what has been described in relation to the method for manufacturing an insulated gate field effect transistor is valid as long as it is not contrary to the properties thereof.

In addition, this invention
Growing a first semiconductor layer having a hexagonal crystal structure on a first substrate;
Forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched;
Treating the surface of the first substrate after forming the seed so that a semiconductor layer having a hexagonal crystal structure does not substantially grow;
Laterally growing a second semiconductor layer having a hexagonal crystal structure from each seed so as not to contact each other;
Growing a third semiconductor layer having a hexagonal crystal structure over the entire surface so as to cover the second semiconductor layer;
Providing a second substrate on the third semiconductor layer;
And a step of peeling the first substrate from the seed, the second semiconductor layer, the third semiconductor layer and the second substrate.

In addition, this invention
Growing a first semiconductor layer having a hexagonal crystal structure on a first substrate;
Forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched;
Treating the surface of the first substrate after forming the seed so that a semiconductor layer having a hexagonal crystal structure does not substantially grow;
Laterally growing a second semiconductor layer having a hexagonal crystal structure from each seed so as not to contact each other;
Growing a third semiconductor layer having a hexagonal crystal structure constituting a solar cell structure over the entire surface so as to cover the second semiconductor layer;
Attaching a second substrate on the third semiconductor layer;
Peeling the first substrate from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate;
Forming a first electrode and a second electrode on both surfaces of the third semiconductor layer before or after peeling the first substrate, respectively. It is a manufacturing method of a solar cell.

In the invention of the method for manufacturing a solar cell, what has been described in relation to the method for manufacturing an insulated gate field effect transistor is valid as long as it does not contradict its properties.
The fourth to thirty-second semiconductor layers are made of the same semiconductor as the first to third semiconductor layers.

  According to the present invention, a semiconductor electronic device, a semiconductor light emitting device, and a semiconductor light receiving device having a high withstand voltage and a high output can be easily manufactured using a Si substrate. Alternatively, according to the present invention, it is possible to easily manufacture an insulated gate field effect transistor, a semiconductor light emitting device, or a solar cell having a high withstand voltage and a high output using a Si substrate.

It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 2nd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of GaN-type MOSFET by 3rd Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 4th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 4th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 4th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 4th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 4th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of GaN-type MOSFET by 5th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of GaN-type MOSFET by the 6th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by the 7th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by the 8th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 9th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type MOSFET by 10th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the non latch-up IGBT type GaN-type MOSFET by 11th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of IGBT and SJ type GaN-type MOSFET by 12th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the non latch-up IGBT and SJ type GaN-type MOSFET by 13th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type semiconductor light-emitting device by 14th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type solar cell by 15th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the GaN-type Schottky barrier diode by 16th Embodiment of this invention. It is sectional drawing which shows the GaN-type HFET of a 1st prior art example. It is sectional drawing which shows the GaN-type HFET of a 2nd prior art example. It is sectional drawing which shows the GaN-type HFET of a 3rd prior art example. It is sectional drawing which shows the GaN-type HFET of the 4th prior art example. It is sectional drawing which shows the GaN-type HFET of the 5th prior art example.

Hereinafter, modes for carrying out the invention (hereinafter referred to as embodiments) will be described.
<1. First Embodiment>
A method for manufacturing a vertical type GaN-based MOSFET according to the first embodiment will be described.

As shown in FIG. 1A, a low-temperature buffer layer 12 made of AlN, GaN, or the like is grown on a first substrate 11 made of a Si substrate or the like by a metal organic chemical vapor deposition (MOCVD) method at a temperature of about 500 ° C., for example. Then, the n ⁺ -type GaN layer 13 is grown on the low-temperature buffer layer 12 at a temperature of, for example, about 1000 to 1100 ° C., for example, 1050 ° C. by the MOCVD method. The thickness of the low temperature buffer layer 12 is not particularly limited, but is generally 10 to 50 nm, for example, 20 nm. The thickness of the n ⁺ -type GaN layer 13 is selected as necessary, and is, for example, 0.1 to 2 μm. The n ⁺ -type GaN layer 13 is doped with, for example, Si as an n-type impurity, and the impurity concentration is, for example, about 1 × 10 ¹⁸ to 1 × 10 ¹⁹ cm ⁻³ .

Next, as shown in FIG. 1B, an insulating film such as a SiO ₂ film or a SiN film or an etching mask 14 is formed on the n ⁺ -type GaN layer 13 by, for example, a vacuum deposition method or a CVD method. When the insulating film or the etching mask 14 is removed later, a metal film, a resist film, or the like can be used as the insulating film or the etching mask 14.

Next, as shown in FIG. 1C, a stripe-shaped resist pattern (not shown) having a predetermined shape is formed on the insulating film or etching mask 14 by photolithography, and then, for example, reactive ion etching is performed using this resist pattern as a mask. The insulating film or the etching mask 14 is patterned in a stripe shape by a dry etching method such as (RIE) method. Thereafter, the resist pattern is removed. The longitudinal direction of the striped insulating film or etching mask 14 is preferably selected in the <1-100> direction or the <11-20> direction of the n ⁺ -type GaN layer 13.

Next, as shown in FIG. 2A, etching is performed until the first substrate 11 is etched to a depth D by a dry etching method or a wet etching method using the stripe-shaped insulating film or etching mask 14 thus formed as a mask. . For example, when the first substrate 11 is a Si substrate, the n ⁺ -type GaN layer 13 and the low-temperature buffer layer 12 are etched by a dry etching method such as the RIE method, and the first substrate 11, that is, the Si substrate is wet. Etching is performed by an etching method. By this etching, the n ⁺ -type GaN layer 13, the low-temperature buffer layer 12, and the uppermost portion of the first substrate 11 are patterned in a stripe shape. The widths of the striped n ⁺ -type GaN layer 13 and the low-temperature buffer layer 12 are, for example, 2 to 10 μm. Further, the distance between the n ⁺ -type GaN layer 13 and the n ⁺ -type GaN layer 13 adjacent to each other is, for example, 6 to 20 μm. The etching depth D of the first substrate 11 is selected to be 0.2 μm or more, for example, and is generally selected to be 0.2 μm or more and 20 μm or less. The striped n ⁺ -type GaN layer 13 becomes a seed (seed crystal) for subsequent growth.

  Next, as shown in FIG. 2B, the insulating film or the etching mask 14 is removed by wet etching or the like.

Next, as shown in FIG. 2C, a growth preventing film 15 is formed on the surface of the first substrate 11 exposed by etching. As the growth preventing film 15, for example, a SiO _x film (including a SiO ₂ film) or a SiN _x film (including a Si ₃ N ₄ film) is used. As a method for forming the growth prevention film 15, an oxidation method, a nitridation method, a CVD method, or the like can be used, which is appropriately selected according to the type of the first substrate 11 and the like. For example, when the first substrate 11 is a Si substrate, the SiO _x film is formed, for example, by oxidizing the surface of the Si substrate by a thermal oxidation method or a plasma oxidation method. An example of thermal oxidation conditions is 1000 ° C. and 30 minutes in an O ₂ atmosphere in an oxidation furnace. As an example of plasma oxidation conditions, oxygen plasma is irradiated at a substrate temperature of 300 to 1000 ° C. in a plasma enhanced chemical vapor deposition (PECVD) furnace. When oxidizing the surface of the Si substrate, the surface of the n ⁺ -type GaN layer 13 is prevented from being excessively oxidized. The SiN _x film is formed, for example, by nitriding the surface of the Si substrate by a thermal nitridation method or a plasma nitridation method. As an example of thermal nitriding conditions, nitriding is performed in a MOCVD furnace in an NH ₃ atmosphere at a temperature of 1000 ° C. or higher for 10 minutes. As an example of plasma nitriding conditions, nitrogen plasma is irradiated at a substrate temperature of 300 to 1000 ° C. in a PECVD furnace.

Next, as shown in FIG. 3A, the p-type GaN layer 16 is laterally grown (ELO (Epitaxial Lateral Overgrowth)) by, for example, MOCVD using the n ⁺ -type GaN layer 13 as a seed. At this time, the growth preventing film 15 is formed on the surface of the first substrate 11, and the growth of GaN is extremely suppressed on the growth preventing film 15, so that the p-type GaN is formed using the n ⁺ -type GaN layer 13 as a seed. Layer 16 can be grown laterally. The lateral growth of the p-type GaN layer 16 is stopped before the p-type GaN layers 16 laterally grown from the adjacent n ⁺ -type GaN layers 13 come into contact with each other. By selecting the conditions for lateral growth of the p-type GaN layer 16 (temperature, pressure, growth rate, etc.), the growth surfaces (facets) on both sides of the p-type GaN layer 16 and the vertical / horizontal growth ratio can be controlled. The p-type GaN layer 16 is doped with, for example, Mg as a p-type impurity, and the impurity concentration is, for example, 1 × 10 ¹⁸ to 1 × 10 ²¹ cm ⁻³ .

Next, as shown in FIG. 3B, an n-type GaN layer 17 is grown on the entire surface by, for example, MOCVD until it becomes a continuous film, and an n ⁺ -type GaN contact having an impurity concentration higher than that of the n-type GaN layer 17 is further formed thereon. Layer 18 is grown. During the growth of these n-type GaN layer 17 and n ⁺ -type GaN contact layer 18, dislocations generated from the interface between the n ⁺ -type GaN layer 13 and the low-temperature buffer layer 12 propagate upward, resulting in threading dislocations 19. . The density of the threading dislocations 19 is generally 1 × 10 ⁻⁸ to 1 × 10 ⁻¹⁰ m ⁻² . Similarly, threading dislocations 19 are also generated at the meeting portion where the n-type GaN layers 17 that are laterally grown from the p-type GaN layers 16 adjacent to each other contact each other. The n-type GaN layer 17 is doped with, for example, Si as an n-type impurity, and the impurity concentration is, for example, 1 × 10 ¹⁵ to 1 × 10 ¹⁷ cm ⁻³ . The n ⁺ -type GaN contact layer 18 is doped with, for example, Si as an n-type impurity, and the impurity concentration is, for example, 1 × 10 ¹⁸ to 1 × 10 ¹⁹ cm ⁻³ . The thicknesses of the n-type GaN layer 17 and the n ⁺ -type GaN contact layer 18 are selected as necessary. The thickness of the n-type GaN layer 17 is, for example, 3 to 20 μm, and the thickness of the n ⁺ -type GaN contact layer 18 is For example, it is 10 to 100 nm.

Next, as shown in FIG. 4, a second substrate 21 is attached on the n ⁺ -type GaN contact layer 18 via an adhesive layer 20. The adhesive layer 20 is appropriately selected according to the type of the second substrate 21. For example, a resist, wax, ceramic binder, or the like is used. As long as the second substrate 21 is a substrate resistant to wet etching using phosphoric acid (H ₂ PO ₄ ), potassium hydroxide (KOH), sodium chloride (NaOH) or the like performed in a later step, in particular. Although it is not limited and is selected as necessary, for example, a sapphire (Al ₂ O ₃ ) substrate can be used, and if the surface is protected with a protective layer (eg, resist layer) resistant to wet etching, metal A substrate, another substrate, or the like can be used. As the metal substrate, for example, one made of copper (Cu), CuW, Mo or the like can be used, and as the other substrate, for example, one made of Si, AlN, AlSi or the like can be used.

Next, the first substrate 11 is separated from the low-temperature buffer layer 12, so that the first substrate 11 is converted to the n ⁺ -type GaN layer 13, the n-type GaN layer 17, and the p-type on the second substrate 21. Peel from the GaN layer 16 and the n ⁺ -type GaN contact layer 18. Specifically, for example, after the growth prevention film 15 is removed by etching, the first substrate 11 is wet-etched. In this wet etching, an etching solution penetrates into a groove having a depth D formed on the uppermost portion of the first substrate 11, and is formed in a stripe shape made of the first substrate 11 below the n ⁺ -type GaN layer 13. The first substrate 11 can be peeled from the n ⁺ -type GaN layer 13, the n-type GaN layer 17 and the p-type GaN layer 16 on the second substrate 21 by removing the pillars by etching. For example, when the first substrate 11 is a Si substrate, wet etching is performed using hydrofluoric acid (HF + HNO ₃ ), KOH, tetramethylammonium hydroxide (TMAH), or the like. The first substrate 11 may be removed by polishing or wet etching from the back surface of the first substrate 11. If necessary, the first substrate 11 may be left as it is without being peeled or removed.

Next, as shown in FIG. 5, a resist pattern 22 having a predetermined shape in which a portion corresponding to the central portion of the n ⁺ -type GaN layer 13 is opened in a stripe shape by photolithography is applied to the n ⁺ -type GaN layer 13 and the n-type GaN. It is formed on the layer 17 and the p-type GaN layer 16. Next, using this resist pattern 22 as a mask, the n ⁺ -type GaN layer 13 is dry-etched to a depth that reaches at least the p-type GaN layer 16 to form a recess 23. Next, the resist pattern 22 is removed. Thereafter, in order to electrically activate p-type impurities in the p-type GaN layer 16, annealing is performed at 800 ° C. for 20 minutes in a nitrogen atmosphere, for example. The formation of the recess 23 reaching the p-type GaN layer 16 facilitates the desorption of hydrogen from the p-type GaN layer 16 in this annealing step, and the contact between the gate electrode to be formed later and the p-type GaN layer 16. The purpose is to take.

Next, as shown in FIG. 6, a gate insulating film 25 is formed on the entire surface of the n ⁺ -type GaN layer 13, the n-type GaN layer 17, and the p-type GaN layer 16 in which the recesses 23 are formed. As the gate insulating film 25, for example, a SiO ₂ film, a SiN film, an Al ₂ O ₃ film, a HfO ₂ film, or a laminated film thereof can be used. The gate insulating film 25 can be formed by a film forming method that does not damage the base, for example, a vacuum evaporation method, an atomic layer deposition method (ALD method), or the like. Next, a predetermined portion of the gate insulating film 25 on the n ⁺ -type GaN layer 13 is removed by etching to form an opening 25a. Next, after a metal film is formed on the entire surface by, for example, a vacuum deposition method or a sputtering method, the metal film is patterned into a predetermined shape, thereby forming a source electrode and a gate electrode on the entire surface including the inside of the recess 23. A metal film is formed. This metal film is selected as necessary, and for example, a Ni / Ti / Pt / Au multilayer film can be used. Next, the metal film is patterned into a predetermined shape by etching, thereby forming a source electrode 26 in the recess 23 and a gate insulating film 25 on the p-type GaN layer 16 and the n-type GaN layer 17. A gate electrode 27 is formed. Next, an insulating film 28 such as a SiO ₂ film is formed on the entire surface of the source electrode 26 and the gate electrode 27 by, for example, vacuum deposition. Next, an opening 28 a is formed in a predetermined portion of the insulating film 28 on the source electrode 26. Next, a metal film is formed on the entire surface of the insulating film 28 by, for example, a vacuum deposition method or a sputtering method, and the source pad electrode 29 is formed by patterning the metal film into a predetermined shape as necessary. Next, the third substrate 30 is bonded onto the source pad electrode 29. The third substrate 30 is selected as necessary, but a ceramic substrate or a metal substrate having good thermal conductivity is preferably used. Specifically, for example, Si, AlN, Cu, CuW, AlSi , SiC or the like can be used. Thereafter, the adhesive layer 20 and the second substrate 21 are peeled from the n ⁺ -type GaN contact layer 18. The second substrate 21 can be reused (recycled) as necessary.

Next, as shown in FIG. 7, the uppermost portion of the n ⁺ -type GaN contact layer 18 and the n-type GaN layer 17 in a predetermined portion including a portion where threading dislocations 19 are concentrated above the n ⁺ -type GaN layer 13. The upper portion is removed by etching to form a recess 31. Next, after an insulating film 32 such as a SiO ₂ film is formed on the entire surface by, for example, a vacuum deposition method or a sputtering method, the insulating film 32 is patterned into a predetermined shape by etching so that only the concave portion 31 and the vicinity thereof. leave. Thereafter, a metal film is formed on the entire surface of the insulating film 33 and the n ⁺ -type GaN contact layer 18 by, for example, a vacuum deposition method or a sputtering method, and the metal film is patterned into a predetermined shape as necessary to drain the electrode 33. Form. In this case, the upper part of the portion where threading dislocations 19 are concentrated is covered with the insulating film 33, and the drain electrode 33 is not in direct contact with the portion where threading dislocations 19 are concentrated. Leakage current through 19 can be reduced.

  As described above, the intended vertical GaN-based MOSFET can be manufactured. This vertical GaN-based MOSFET can widen a depletion layer over a wide range in the n-type GaN layer 17 on the drain electrode 33 side by selecting the impurity concentration and thickness of the n-type GaN layer 17. It can be.

  As described above, according to the first embodiment, a vertical GaN-based MOSFET having a high withstand voltage and a high output can be realized without using an IGBT or a super junction (SJ). In addition, since this vertical GaN-based MOSFET can be easily manufactured using a Si substrate, the manufacturing cost can be reduced.

<2. Second Embodiment>
In the second embodiment, a method for manufacturing a vertical GaN-based MOSFET will be described.

  As shown in FIG. 8A, in the method of manufacturing the vertical GaN-based MOSFET according to the second embodiment, the first substrate 11 is etched sufficiently deeply, specifically, for example, after the etching. The remaining first substrate 11 is etched so that stripe columns having an aspect ratio of 1 or more are formed. The etching depth D of the first substrate 11 is, for example, 4 to 30 μm. A growth preventing film 15 is formed on the surface of the first substrate 11 exposed by the etching of the first substrate 11 as in the first embodiment.

Next, as shown in FIG. 8B, a p-type GaN layer 17 is laterally grown using the n ⁺ -type GaN layer 13 as a seed, and then an n-type GaN layer 18 is grown on the entire surface until it becomes a continuous film. In this case, in the cooling stage after the growth of the n-type GaN layer 18, the first substrate 11 and the n-type GaN are caused by the difference in thermal expansion coefficient between the first substrate 11 made of, for example, a Si substrate and the n-type GaN layer 18. Stress is generated in both layers 17. When the thermal expansion coefficient of the n-type GaN layer 17 is larger than that of the first substrate 11 made of a Si substrate or the like, tensile stress is generated in the n-type GaN layer 17 and cracks are likely to occur. However, since the aspect ratio of the cross section of the stripe-shaped column made of the first substrate 11 is 1 or more and mechanically weak, the tensile stress generated in the n-type GaN layer 17 is reduced by breaking the column. Thus, cracks and the like can be prevented from occurring.

  Thereafter, the process proceeds in the same manner as in the first embodiment to manufacture the intended vertical GaN-based MOSFET.

  According to the second embodiment, advantages similar to those of the first embodiment can be obtained.

<3. Third Embodiment>
In the third embodiment, an SJ vertical GaN-based MOSFET and a manufacturing method thereof will be described.

As shown in FIG. 9, in the third embodiment, after forming a striped n ⁺ -type GaN layer 13 as in the first embodiment, this n ⁺ -type GaN layer 13 is used as a seed. A p-type GaN layer 16 is grown in the lateral direction. Next, after growing the p-type GaN layer 34 so as to cover the p-type GaN layer 16, the n-type GaN layer 17 is grown until it becomes a continuous film, and the n ⁺ -type GaN contact layer 18 is further formed thereon. Grow. By controlling the impurity concentration (hole concentration), height (thickness), width, etc. of the p-type GaN layer 34, a good superjunction is realized by the n-type GaN layer 17 and the p-type GaN layer 34. Can do. The p-type GaN layer 16 is doped with, for example, Mg as a p-type impurity, the impurity concentration is, for example, 1 × 10 ¹⁹ to 1 × 10 ²¹ cm ⁻³ , and the p-type GaN layer is doped with, for example, Mg as a p-type impurity. The impurity concentration is, for example, 1 × 10 ¹⁷ to 1 × 10 ²⁰ cm ⁻³ . The impurity concentration (hole concentration), height (thickness), width, etc. of the p-type GaN layer 34 are controlled by, for example, a Ga raw material (trimethylgallium (TMG) or the like) used during growth or Mg dopant as a p-type impurity. Supply amount of cyclopentadienyl (Cp ₂ Mg, etc.), V / III ratio (III raw material (ratio of supply amount of group V raw material (Ga raw material) to supply amount of ammonia (NH ₃ )), growth temperature, This can be performed by controlling growth conditions such as pressure, etc. If necessary, an n ⁺ -type GaN contact layer is used for electrical activation of p-type impurities such as Mg doped in the p-type GaN layer 34. After growing 18, a groove reaching the p-type GaN layer 34 from the n ⁺ -type GaN contact layer 18 is formed, and in this state, for example, annealing is performed at 800 ° C. for 20 minutes in a nitrogen atmosphere. Then, the hydrogen taken into the p-type GaN layer 34 during the growth may be released to the outside as hydrogen gas, and then the process is advanced to the drain electrode 33 as in the first embodiment.

  As described above, the intended SJ vertical GaN-based MOSFET can be manufactured.

  According to the third embodiment, in addition to the same advantages as those of the first embodiment, a superjunction is formed by the n-type GaN layer 17 and the p-type GaN layer 34. The depletion layer can be spread over the entire channel layer between the drain electrode 33, whereby the withstand voltage of the vertical GaN-based MOSFET can be greatly improved.

<4. Fourth Embodiment>
In the fourth embodiment, a method for manufacturing an SJ vertical GaN-based MOSFET will be described.

As shown in FIG. 10, after forming a striped n ⁺ -type GaN layer 13 as in the first embodiment, a p-type GaN layer 16 is laterally grown using this n ⁺ -type GaN layer 13 as a seed. Let Next, after growing the p-type GaN layer 34 so as to cover the p-type GaN layer 16, the n-type GaN layer 17 is grown until it becomes a continuous film, and the n ⁺ -type GaN contact layer 18 is further formed thereon. Grow. As in the third embodiment, the n-type GaN layer 18 and the p-type GaN layer 34 are controlled by controlling the impurity concentration (hole concentration), height (thickness), width, and the like of the p-type GaN layer 34. As a result, it is possible to realize a good super junction. The p-type GaN layer 17 is doped with, for example, Mg as a p-type impurity, the impurity concentration is, for example, 1 × 10 ¹⁹ to 1 × 10 ²¹ cm ⁻³ , and the p-type GaN layer is doped with, for example, Mg as a p-type impurity. The impurity concentration is, for example, 1 × 10 ¹⁷ to 1 × 10 ²⁰ cm ⁻³ .

Next, as shown in FIG. 11, after the second substrate 21 is attached to the n ⁺ -type GaN contact layer 18 via the adhesive layer 20 in the same manner as in the first embodiment, The substrate 11 is peeled off.

Next, as shown in FIG. 12, a predetermined shape is formed on the n ⁺ -type GaN layer 13, the p-type GaN layer 16, the p-type GaN layer 34, and the n-type GaN layer 17 as in the first embodiment. After the resist pattern 22 is formed, the n ⁺ -type GaN layer 13 is etched using the resist pattern 22 as a mask to form a recess 23.

Next, as shown in FIG. 13, the gate insulating film 25, the opening 25a, the source electrode 23, the gate electrode 24, the insulating film 28, the opening 28a, and the source pad electrode 29 are formed in the same manner as in the first embodiment. Then, after attaching the third substrate 30 to the source pad electrode 29, the adhesive layer 20 and the second substrate 21 are peeled from the n ⁺ -type GaN contact layer 18.

  Next, as shown in FIG. 14, an opening 31 is formed, an insulating film 32 is formed in the opening 31, and then a drain electrode 33 is formed.

  Thus, the intended SJ vertical GaN-based MOSFET is manufactured.

  According to the fourth embodiment, the same advantages as those of the third embodiment can be obtained.

<5. Fifth Embodiment>
In the fifth embodiment, a method for manufacturing an SJ vertical GaN-based MOSFET will be described.

  As shown in FIG. 15, in the fifth embodiment, the p-type GaN layer 34 is grown thinner than in the fourth embodiment. Others are the same as in the fourth embodiment.

  According to the fifth embodiment, the same advantages as in the fourth embodiment can be obtained.

<6. Sixth Embodiment>
In the sixth embodiment, a method for manufacturing IGBT and SJ vertical GaN-based MOSFETs will be described.

As shown in FIG. 16, the sixth embodiment is the same as the fourth embodiment except that a p ⁺ -type GaN contact layer 35 is grown on the n-type GaN layer 17 instead of the n ⁺ -type GaN contact layer 18. This is the same as the embodiment. The p ⁺ -type GaN contact layer 35 is doped with, for example, Mg, and the impurity concentration is, for example, 1 × 10 ¹⁹ to 1 × 10 ²¹ cm ⁻³ .

According to the sixth embodiment, in addition to the same advantages as those of the first embodiment, the following advantages can be obtained. That is, the structure equivalent to the IGBT can be obtained by the structure in which the p ⁺ -type GaN contact layer 35 is provided on the n-type GaN layer 17. Therefore, it is possible to simultaneously obtain the conductivity modulation effect of the IGBT and the depletion layer region expansion effect that is a feature of the super junction MOSFET, and to realize an ultra-low on-resistance and high breakdown voltage IGBT and SJ vertical GaN-based MOSFET. Can do.

<7. Seventh Embodiment>
In the seventh embodiment, a method for manufacturing a vertical GaN-based MOSFET will be described.

As shown in FIG. 17, in the seventh embodiment, after growing the low-temperature buffer layer 12 and n ⁺ -type GaN layer 13 on the first substrate 11, on the n ⁺ -type GaN layer 13 and subsequently A p ⁺ -type GaN layer 36 is grown. Next, an insulating film or etching mask 14 is formed on the p ⁺ -type GaN layer 36. Next, the insulating film or the etching mask 14 is patterned in a stripe shape. Next, etching is performed until the first substrate 11 is etched by a depth D using the stripe-shaped insulating film or etching mask 14 thus formed as a mask. By this etching, the p ⁺ -type GaN layer 36, the n ⁺ -type GaN layer 13, the low-temperature buffer layer 12, and the uppermost portion of the first substrate 11 are patterned in a stripe shape. Next, a growth preventing film 15 is formed on the surface of the first substrate 11 exposed by etching. Next, the p-type GaN layer 34 is laterally grown using the n ⁺ -type GaN layer 13 and the p ⁺ -type GaN layer 36 as seeds. At this time, since there is formed a growth-preventing film 15 on the surface of the first substrate 11, the GaN growth on the growth preventing layer 15 is extremely suppressed, p-type GaN and n ⁺ -type GaN layer 13 as a seed Layer 34 can be grown laterally. The lateral growth of the p-type GaN layer 34 is stopped before the p-type GaN layers 16 laterally grown from the adjacent n ⁺ -type GaN layers 13 come into contact with each other. Next, the n-type GaN layer 17 is grown on the entire surface until it becomes a continuous film by MOCVD, for example, and an n ⁺ -type GaN contact layer 18 having an impurity concentration higher than that of the n-type GaN layer 17 is further grown thereon. An insulating film or etching mask 14 is provided on the p-type GaN layer 16, and threading dislocations 19 in which dislocations generated from the interface between the n ⁺ -type GaN layer 13 and the low-temperature buffer layer 12 penetrate the p-type GaN layer 16 are Since the p-type GaN layer 34, the n-type GaN layer 17 and the n ⁺ -type GaN contact layer 18 are grown, the threading dislocations 19 are transferred from the p-type GaN layer 16 to the p-type by being stopped by the insulating film or the etching mask 14. Propagation to the n-type GaN layer 34, the n-type GaN layer 17 and the n ⁺ -type GaN contact layer 18 can be prevented. In this case, threading dislocations 19 existing in the p-type GaN layer 34, the n-type GaN layer 17, and the n ⁺ -type GaN contact layer 18 are laterally formed from the left and right formed in the upper portion of the central portion of the insulating film or the etching mask 14. The density of threading dislocations 19 is extremely low, present only in the meeting part between the directionally grown p-type GaN layers 16 and the meeting part where the n-type GaN layers 17 laterally grown from the adjacent p-type GaN layers 34 contact each other. .

  Thereafter, the process proceeds in the same manner as in the first embodiment, and the target SJ vertical GaN-based MOSFET is manufactured.

According to the seventh embodiment, in addition to the same advantages as those of the first embodiment, threading dislocations 19 existing in the p-type GaN layer 16, the n-type GaN layer 17, and the n ⁺ -type GaN contact layer 18 are provided. As a result, the breakdown voltage of the SJ vertical GaN-based MOSFET can be improved and the leakage current can be greatly reduced.

<8. Eighth Embodiment>
In the eighth embodiment, a method for manufacturing a vertical GaN-based MOSFET will be described.

As shown in FIG. 18, in the eighth embodiment, the thickness of the n ⁺ -type GaN contact layer 18 grown on the n-type GaN layer 17 is sufficiently large, for example, 100 to 400 μm. The second substrate 21 is not used. For the growth of the n ⁺ -type GaN contact layer 18, hydride vapor phase epitaxial growth or halide vapor phase epitaxial growth (HVPE) method can be used in addition to the MOCVD method. In this case, since the thickness of the n-type GaN layer 17 and the n ⁺ -type GaN contact layer 18 is extremely large, after the growth of the n-type GaN layer 17 and the n ⁺ -type GaN contact layer 18, the n ⁺ -type GaN is cooled in the cooling stage. The stripe-shaped column formed of the first substrate 11 below the layer 13 is broken, and the first substrate 11 is peeled off.

  Thereafter, the process proceeds in the same manner as in the first embodiment, and the target SJ vertical GaN-based MOSFET is manufactured.

  According to the eighth embodiment, in addition to the same advantages as those of the first embodiment, the second substrate 21 is not required, so that the manufacturing cost of the SJ vertical GaN-based MOSFET is further reduced. It is possible to obtain the advantage that it can be achieved.

<9. Ninth Embodiment>
In the ninth embodiment, a method for manufacturing a vertical GaN-based MOSFET will be described.

As shown in FIG. 19, in the ninth embodiment, the n-type GaN layer 40 is laterally grown using the n ⁺ -type GaN layer 13 as a seed in the same manner as in the first embodiment, and subsequently undoped or After the p-type AlGaInN layer 41 is grown, the n-type GaN layer 17 is grown until it becomes a continuous film, and the n ⁺ -type GaN contact layer 18 is further grown thereon.

Next, a second substrate 21 (not shown in FIG. 19) is bonded onto the n ⁺ -type GaN contact layer 18 via an adhesive layer 20 (not shown in FIG. 19).

Next, the gate insulating film 25 is formed on the entire surface of the n ⁺ -type GaN layer 13, the n-type GaN layer 40, the undoped or p-type AlGaInN layer 41, and the n-type GaN layer 17.

Next, a resist pattern 22 (not shown in FIG. 19) having a predetermined shape in which a portion corresponding to the central portion of the n ⁺ -type GaN layer 13 is opened in a stripe shape by photolithography is applied to the n ⁺ -type GaN layer 13, n The GaN layer 40 is formed on the undoped or p-type AlGaInN layer 41 and the n-type GaN layer 17. Next, using the resist pattern 22 as a mask, the gate insulating film 25 is wet etched to form an opening 25a. Next, after forming a metal film on the entire surface by, for example, vacuum evaporation or sputtering, the source electrode 26 is formed on the n ⁺ -type GaN layer 13 inside the opening 25a by patterning the metal film into a predetermined shape. A gate electrode 27 is formed on the gate insulating film 25 in a portion between the n ⁺ -type GaN layer 13 and the n ⁺ -type GaN layer 13 adjacent to each other. Next, an insulating film 28 such as a SiO ₂ film is formed on the entire surface by, eg, vacuum evaporation. Next, an opening 28 a is formed in a predetermined portion of the insulating film 28 on the source electrode 26. Next, a metal film is formed on the entire surface of the insulating film 28 by, for example, a vacuum deposition method or a sputtering method, and the source pad electrode 29 is formed by patterning the metal film into a predetermined shape as necessary. Next, the third substrate 30 is bonded onto the source pad electrode 29. The third substrate 30 is selected as necessary. Preferably, in addition to a solder made of AuSn or the like, a ceramic substrate or a metal substrate having a good thermal conductivity, specifically, for example, Si, AlN, A material made of Cu, CuW, AlSi, SiC, or the like can be used. Thereafter, the adhesive layer 20 and the second substrate 21 are peeled from the n ⁺ -type GaN contact layer 18.

Next, the upper portions of the n ⁺ -type GaN contact layer 18 and the n-type GaN layer 17 at predetermined portions including the portion where the threading dislocations 19 are concentrated and located above the n ⁺ -type GaN layer 13 are removed by etching. 31 is formed. Next, after an insulating film 32 such as a SiO ₂ film is formed on the entire surface by, for example, a vacuum deposition method or a sputtering method, the insulating film 32 is patterned into a predetermined shape by etching so that only the concave portion 31 and the vicinity thereof. leave. Thereafter, a metal film is formed on the entire surface of the insulating film 33 and the n ⁺ -type GaN contact layer 18 by, for example, a vacuum deposition method or a sputtering method, and the metal film is patterned into a predetermined shape as necessary to drain the electrode 33. Form.

  As described above, the target normally-off vertical GaN-based MOSFET can be manufactured. FIG. 19 schematically shows the movement path of electrons from the source electrode 26 to the drain electrode 33 when the vertical GaN-based MOSFET is on by arrows.

  According to the ninth embodiment, a normally-off type vertical GaN-based MOSFET with high breakdown voltage and high output can be manufactured at low cost.

<10. Tenth Embodiment>
In the tenth embodiment, a method for manufacturing an FS (Field Stop) -IGBT vertical GaN-based MOSFET will be described.

As shown in FIG. 20, in the tenth embodiment, after growing up to the n-type GaN layer 17 in the same manner as in the first embodiment, an n ⁺ -type GaN layer serving as a field stop layer thereon. 42 and p ⁺ -type GaN layer 43 are grown sequentially. The p ⁺ -type GaN layer 43 is doped with, for example, Mg, and the impurity concentration is, for example, 1 × 10 ¹⁸ to 1 × 10 ²¹ cm ⁻³ .

  Thereafter, the target FS-IGBT vertical GaN-based MOSFET is manufactured in the same manner as in the first embodiment.

As shown in FIG. 20, in this FS-IGBT vertical GaN-based MOSFET, a current flows through a pn junction formed by a p ⁺ -type GaN layer 43 and an n ⁺ -type GaN layer 42, whereby photons (hν) are generated. The conductivity modulation effect that the on-resistance is lowered by generating carriers (electron (e ⁻ ) -hole (e ⁺ )) in the n-type GaN layer 17 generated by the incidence of the photons and increasing carriers. Is obtained.

  According to the tenth embodiment, a high breakdown voltage and high output FS-IGBT vertical GaN-based MOSFET can be manufactured at low cost.

<11. Eleventh Embodiment>
In the eleventh embodiment, a method for manufacturing an FS-non-latch-up-IGBT vertical GaN-based MOSFET will be described.

As shown in FIG. 22, in the eleventh embodiment, after the p-type GaN layer 16 is laterally grown using the n ⁺ -type GaN layer 13 as a seed in the same manner as the first embodiment, the n-type is then grown. The GaN layer 17 is grown until it becomes a continuous film, and an n ⁺ -type GaN layer 42 and a p ⁺ -type GaN layer 43 that become field stop layers are further grown thereon.

Next, a second substrate 21 (not shown in FIG. 20) is bonded onto the n ⁺ -type GaN contact layer 18 via an adhesive layer 20 (not shown in FIG. 20).

Next, a gate insulating film 25 is formed on the entire surface of the n ⁺ -type GaN layer 13, the p-type GaN layer 16 and the n-type GaN layer 17.

Next, a resist pattern 22 (not shown in FIG. 22) having a predetermined shape in which a portion slightly shifted from the n ⁺ -type GaN layer 13 is opened in a stripe shape by photolithography is applied to the n ⁺ -type GaN layer 13 and the p-type GaN. It is formed on the layer 16 and the n-type GaN layer 17. Next, using the resist pattern 22 as a mask, the gate insulating film 25 is wet etched to form an opening 25a. Next, after forming a metal film on the entire surface by, for example, vacuum deposition or sputtering, the metal film is patterned into a predetermined shape, so that the emitter electrode is also used on the n ⁺ -type GaN layer 13 inside the opening 25a. A source electrode 26 is formed, and a gate electrode 27 is formed on the gate insulating film 25 in the p-type GaN layer 16 portion. Next, an insulating film 28 such as a SiO ₂ film is formed on the entire surface by, eg, vacuum evaporation. Next, an opening 28 a is formed in a predetermined portion of the insulating film 28 on the source electrode 26. Next, a metal film is formed on the entire surface of the insulating film 28 by, for example, a vacuum deposition method or a sputtering method, and the source pad electrode 29 is formed by patterning the metal film into a predetermined shape as necessary. Next, a third substrate 30 is attached to the entire surface of the source pad electrode 29. The third substrate 30 is selected as necessary. Preferably, in addition to a solder made of AuSn or the like, a ceramic substrate or a metal substrate having a good thermal conductivity, specifically, for example, Si, AlN, A material made of Cu, CuW, AlSi, SiC, or the like can be used. Thereafter, the adhesive layer 20 and the second substrate 21 are peeled from the n ⁺ -type GaN contact layer 18.

Next, the uppermost portions of the p ⁺ -type GaN layer 43, the n ⁺ -type GaN layer 42, and the n-type GaN layer 17 in a predetermined portion including the portion where the threading dislocations 19 are concentrated and present above the n ⁺ -type GaN layer 13. Are removed by etching to form the recess 31. Next, after an insulating film 32 such as a SiO ₂ film is formed on the entire surface by, for example, a vacuum deposition method or a sputtering method, the insulating film 32 is patterned into a predetermined shape by etching so that only the concave portion 31 and the vicinity thereof. leave. Thereafter, a metal film is formed on the entire surface of the insulating film 33 and the p ⁺ -type GaN layer 43 by, for example, a vacuum deposition method or a sputtering method, and the drain electrode 33 is formed by patterning the metal film into a predetermined shape as necessary. Form.

  As described above, the target FS-non-latch-up-IGBT vertical GaN-based MOSFET can be manufactured.

In the FS-non-latch-up IGBT vertical GaN-based MOSFET, a conductivity modulation effect that reduces the on-resistance is obtained as in the tenth embodiment, and in addition, the n-type channel layer is turned on. by having the structure pinch-off by the depletion layer 44 spreads GaN layer 17 occurs, the source - drain current is limited to less than the latch-up current can be avoided latchup, during off, constituting the collector p ⁺ The n ⁺ -type GaN layer 42 can prevent the depletion layer 44 from reaching the type GaN layer 43 side.

  According to the eleventh embodiment, a high breakdown voltage and high output FS-non-latch-up-IGBT vertical GaN-based MOSFET can be manufactured at low cost.

<12. Twelfth Embodiment>
In the twelfth embodiment, a method of manufacturing an FS-IGBT-SJ vertical GaN-based MOSFET will be described.

As shown in FIG. 23, in the twelfth embodiment, similarly to the third embodiment, a p-type GaN layer 16 is laterally grown using the n ⁺ -type GaN layer 13 as a seed, and further p-type GaN is grown. After the layer 34 is grown, the n-type GaN layer 17 is grown until it becomes a continuous film, and the n ⁺ -type GaN layer 42 and the p ⁺ -type GaN layer 43 that become field stop layers are further grown thereon.

  Thereafter, the target FS-IGBT-SJ vertical GaN-based MOSFET is manufactured in the same manner as in the third embodiment.

  In this FS-IGBT-SJ vertical GaN-based MOSFET, the conductivity modulation effect that lowers the on-resistance as in the tenth embodiment, and the depletion layer obtained by super-junction as in the third embodiment An enlargement effect can be obtained. That is, this FS-IGBT-SJ vertical GaN-based MOSFET can realize a vertical GaN-based MOSFET with ultra-low on-resistance and high breakdown voltage.

  According to the twelfth embodiment, a high breakdown voltage and high output FS-IGBT-SJ vertical GaN-based MOSFET can be manufactured at low cost.

<13. Thirteenth Embodiment>
In the thirteenth embodiment, a method for manufacturing an FS-non-latch-up-IGBT-SJ vertical GaN-based MOSFET will be described.

As shown in FIG. 24, in the thirteenth embodiment, similarly to the third embodiment, a p-type GaN layer 16 is laterally grown using the n ⁺ -type GaN layer 13 as a seed, and p-type GaN is further grown. After the layer 34 is grown, the n-type GaN layer 17 is grown until it becomes a continuous film, and the n ⁺ -type GaN layer 42 and the p ⁺ -type GaN layer 43 that become field stop layers are further grown thereon.

  Thereafter, the process proceeds in the same manner as in the eleventh embodiment to manufacture the target FS-non-latch up-IGBT-SJ vertical GaN-based MOSFET.

  According to the thirteenth embodiment, a high breakdown voltage and high output FS-non-latch-up-IGBT-SJ vertical GaN-based MOSFET can be manufactured at low cost.

<14. Fourteenth Embodiment>
In the fourteenth embodiment, a method for manufacturing a GaN-based semiconductor light-emitting element will be described.

As shown in FIG. 24, in the fourteenth embodiment, after forming a striped n ⁺ -type GaN layer 13 in the same manner as in the first embodiment, the n ⁺ -type GaN layer 13 is used as a seed to form an n A type GaN layer 40 is grown laterally. Next, an n-type AlGaN cladding layer 51 is grown on the entire surface until it becomes a continuous film, and further, for example, an active layer having an In _x Ga _1-x N / In _y Ga _1-y N multiple quantum well (MQW) structure. 52 and a p-type AlGaN cladding layer 53 are grown sequentially. In general, a p ⁺ -type GaN contact layer is further grown on the p-type AlGaN cladding layer 53.

Next, the second substrate 21 is attached to the p-type AlGaN cladding layer 53 or the p ⁺ -type GaN contact layer thereon via the adhesive layer 20.

Next, by separating the first substrate 11 and the low-temperature buffer layer 12, the first substrate 11 is changed to the n ⁺ -type GaN layer 13, the n-type GaN layer 40 and the n-type on the second substrate 21. Peel from the AlGaN cladding layer 51.

Next, an n-side electrode (not shown) is formed on the surfaces of the n ⁺ -type GaN layer 13, the n-type GaN layer 40, and the n-type AlGaN cladding layer 51 exposed by peeling off the first substrate 11.

Next, the third substrate 30 is attached to the entire surface of the n-side electrode. Thereafter, the adhesive layer 20 and the second substrate 21 are peeled from the p-type AlGaN cladding layer 53 or the p ⁺ -type GaN contact layer thereon.

Next, a p-side electrode is formed on the p-type AlGaN cladding layer 53 or the p ⁺ -type GaN contact layer thereon. When the semiconductor light emitting device is a semiconductor laser, for example, the upper part of the p-type AlGaN cladding layer 53 is patterned into a striped ridge shape, and then a p-side electrode is formed so as to contact the ridge portion.

  Thereafter, a target GaN-based semiconductor light-emitting device is manufactured according to a conventionally known method for manufacturing a GaN-based semiconductor laser or a GaN-based light-emitting diode.

  According to the fourteenth embodiment, a GaN-based semiconductor laser or a GaN-based light emitting diode can be easily manufactured using a Si substrate, and the manufacturing cost can be reduced.

<15. Fifteenth Embodiment>
In the fifteenth embodiment, a method for manufacturing a GaN-based solar cell will be described.

As shown in FIG. 27, in the fifteenth embodiment, after forming a striped n ⁺ -type GaN layer 13 in the same manner as in the first embodiment, the n ⁺ -type GaN layer 13 is used as a seed to form an n A type GaN layer 40 is grown laterally. Next, the n-type AlGaN layer 61 is grown on the entire surface until it becomes a continuous film, and for example, an i-type AlGaN layer 62 and a p-type AlGaN layer 63 are sequentially grown thereon. A p ⁺ -type GaN contact layer is generally grown on the p-type AlGaN layer 63.

Next, the second substrate 21 is attached to the p-type AlGaN layer 63 or the p ⁺ -type GaN contact layer thereon via the adhesive layer 20.

Next, by separating the first substrate 11 and the low-temperature buffer layer 12, the first substrate 11 is changed to the n ⁺ -type GaN layer 13, the n-type GaN layer 40 and the n-type on the second substrate 21. Peel from the AlGaN cladding layer 51.

Next, a cathode electrode (not shown) is formed on the surfaces of the n ⁺ -type GaN layer 13, the n-type GaN layer 40, and the n-type AlGaN cladding layer 51 exposed by peeling off the first substrate 11.

Next, the third substrate 30 is attached to the entire surface of the cathode electrode. Thereafter, the adhesive layer 20 and the second substrate 21 are peeled from the p-type AlGaN layer 63 or the p ⁺ -type GaN contact layer thereon.

Next, an anode electrode is formed on the p-type AlGaN layer 53 or the p ⁺ -type GaN contact layer thereon.

  Thereafter, a necessary post-process is performed to manufacture a target GaN-based solar cell.

  According to the fifteenth embodiment, the GaN-based solar cell can be easily manufactured using the Si substrate, and the manufacturing cost can be reduced.

<16. Sixteenth Embodiment>
In the sixteenth embodiment, a method for manufacturing a vertical GaN-based Schottky barrier diode will be described.

As shown in FIG. 26, in the sixteenth embodiment, a striped n ⁺ -type GaN layer 13 is formed in the same manner as in the first embodiment, and then the n ⁺ -type GaN layer 13 is used as a seed for p. A type GaN layer 16 is grown laterally. Next, an n-type GaN layer 17 is grown on the entire surface until it becomes a continuous film, and an n ⁺ -type GaN contact layer 18 is further grown thereon.

Next, the portion corresponding to the portion between the n ⁺ -type GaN layers 13 adjacent to each other in the n ⁺ -type GaN contact layer 18 is removed by etching to form an opening 18 a, and then SiO ₂ is formed inside the opening 18 a. An insulating film 71 such as a film is formed, and the threading dislocation 19 is covered with the insulating film 71.

Next, a substrate in which an ohmic electrode 72 is provided on the second substrate 21 is prepared, and the ohmic electrode 72 side on the second substrate 21 is pasted on the n ⁺ -type GaN contact layer 18.

Next, the first substrate 11 is separated from the low-temperature buffer layer 12 by separating the first substrate 11 from the n ⁺ -type GaN layer 13, the p-type GaN layer 16 and the n-type on the second substrate 21. Peel from the GaN layer 17.

Next, an insulating film 73 such as a SiO ₂ film is formed so as to cover the n ⁺ -type GaN layer 13 in which the threading dislocation 19 is exposed on the surface exposed by peeling off the first substrate 11, and then this insulating film A Schottky electrode 74 is formed so as to be in contact with the p-type GaN layer 16 and the n-type GaN layer 17 which are not covered with 73.

  As described above, the intended vertical GaN-based Schottky barrier diode can be manufactured.

  According to the sixteenth embodiment, a vertical GaN-based Schottky barrier diode can be easily manufactured using a Si substrate, and the manufacturing cost can be reduced.

  Although the embodiment of the present invention has been specifically described above, the present invention is not limited to the above-described embodiment, and various modifications based on the technical idea of the present invention are possible.

  For example, the numerical values, structures, shapes, materials, processes, and the like given in the above-described embodiments are merely examples, and different numerical values, structures, shapes, materials, processes, and the like may be used as necessary. Further, two or more of the first to sixteenth embodiments may be combined as necessary.

DESCRIPTION OF SYMBOLS 11 ... 1st board | substrate, 12 ... Low-temperature buffer layer, 13 ... n ⁺ type GaN layer, 14 ... Insulating film or etching mask, 15 ... Growth prevention film, 16 ... p-type GaN layer, 17 ... n-type GaN layer, 18 ... n ⁺ type GaN contact layer, 19 ... threading dislocation, 20 ... adhesive layer, 21 ... second substrate, 22 ... resist pattern, 23, 24 ... recess, 25 ... gate insulating film, 25a ... opening, 26 ... source electrode 27 ... Gate electrode, 28 ... Insulating film, 29 ... Source pad electrode, 30 ... Third substrate, 31 ... Opening, 32 ... Insulating film, 33 ... Drain electrode, 34 ... P-type GaN layer, 35 ... P ⁺ type GaN contact layer, 36 ... p ⁺ -type GaN layer, 37 ... n-type GaN layer, 39 ... AlGaInN layer, 40 ... n-type GaN layer, 41 ... undoped or p-type AlGaInN layer, 42 ... n ⁺ -type GaN layer, 43 ... p ⁺ -type Ga Layer, 44 ... depletion layer, 45 ... recess, 46 ... two-dimensional electron gas, 51 ... n-type AlGaN cladding layer, 52 ... active layer, 53 ... p-type AlGaN cladding layer, 61 ... n-type AlGaN layer, 62 ... i-type AlGaN layer, 63 ... p-type AlGaN layer, 71, 73 ... insulating film, 72 ... ohmic electrode, 74 ... Schottky electrode

Claims (44)

Growing a first semiconductor layer having a hexagonal crystal structure on a first substrate;
Forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched;
Treating the surface of the first substrate after forming the seed so that a semiconductor layer having a hexagonal crystal structure does not substantially grow;
And a step of laterally growing a second semiconductor layer having a hexagonal crystal structure from each of the seeds. After laterally growing the second semiconductor layer,
Providing a second substrate on the second semiconductor layer;
The method of manufacturing a semiconductor device according to claim 1, further comprising a step of peeling the first substrate from the seed, the second semiconductor layer, and the second substrate. After laterally growing the second semiconductor layer,
Growing a third semiconductor layer having a hexagonal crystal structure over the entire surface so as to cover the second semiconductor layer;
Providing a second substrate on the third semiconductor layer;
The method for manufacturing a semiconductor device according to claim 1, further comprising a step of peeling the first substrate from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate.   After growing the first semiconductor layer and before forming the seed, an insulating film is formed on the first semiconductor layer, and the insulating film and the first semiconductor layer are formed on the first substrate. The method of manufacturing a semiconductor element according to claim 1, wherein the seed is formed by etching in a stripe shape until etching is performed.   5. The method of manufacturing a semiconductor device according to claim 1, wherein in the step of forming the seed, the first substrate is etched to a depth of 1 μm or more.   6. The semiconductor device according to claim 1, wherein the step of treating the semiconductor layer having a hexagonal crystal structure so as not to substantially grow is a step of oxidizing or nitriding the first substrate. Manufacturing method.   In the step of forming the seed, the aspect ratio of the cross section of the stripe-shaped column made of the first substrate formed by etching the first substrate becomes 1 or more, or the first 5. The method of manufacturing a semiconductor device according to claim 1, wherein the first substrate is etched until a height of a stripe-shaped column made of the substrate becomes 4 μm or more.   The method of manufacturing a semiconductor element according to claim 4, wherein the second semiconductor layer is grown in a lateral direction with the insulating film left on the seed.   3. The method of manufacturing a semiconductor element according to claim 2, wherein the step of peeling the first substrate from the seed, the second semiconductor layer, and the second substrate is a step of wet-etching the first substrate.   4. The step of removing the first substrate from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate is a step of wet etching the first substrate. A method for manufacturing a semiconductor device.   The method of manufacturing a semiconductor element according to claim 1, wherein the semiconductor element is a semiconductor electronic element, a semiconductor light emitting element, or a semiconductor light receiving element.   The second semiconductor layer includes at least one n-type semiconductor layer and at least one p-type semiconductor layer, and is connected to the n-type semiconductor layer and provided with a cathode electrode. The method for manufacturing a semiconductor element according to claim 1, wherein an anode electrode is provided connected to the type semiconductor layer. The third semiconductor layer includes at least one or more non-doped or n ⁻ -type semiconductor layers and at least one or more n-type semiconductor layers, and of the third semiconductor layers, the first semiconductor layer And a Schottky electrode connected to the non-doped or n ⁻ -type semiconductor layer on the surface of the second semiconductor layer, wherein the first semiconductor layer and the second semiconductor of the third semiconductor layer are provided. 4. The method of manufacturing a semiconductor element according to claim 3, wherein an ohmic electrode is provided connected to the n-type semiconductor layer on the surface opposite to the layer. The second semiconductor layer includes at least one or more p-type or p ⁻ -type semiconductor layers, and the third semiconductor layer includes at least one or more non-doped or n ⁻ -type semiconductor layers and at least one layer. N-type semiconductor layers equal to or more than one layer, and of the third semiconductor layer, the first semiconductor layer and the surface on the second semiconductor layer side, and the p-type or p-type of the second semiconductor layer A Schottky electrode is provided connected to the ⁻ type semiconductor layer, and is connected to the n type semiconductor layer on the surface of the third semiconductor layer opposite to the first semiconductor layer and the second semiconductor layer. 4. The method of manufacturing a semiconductor element according to claim 3, wherein an ohmic electrode is provided. The first semiconductor layer includes at least one n-type semiconductor layer, the second semiconductor layer includes at least one p-type semiconductor layer, and the third semiconductor layer. Includes at least one non-doped or n ⁻ -type semiconductor layer and at least one n-type semiconductor layer, and the source electrode is connected to the n-type semiconductor layer of the first semiconductor layer. A gate electrode is provided on the p-type semiconductor layer of the second semiconductor layer via an insulating film, and a drain electrode is provided connected to the n-type semiconductor layer of the third semiconductor layer. Item 4. A method for manufacturing a semiconductor device according to Item 3. The first semiconductor layer includes at least one n-type semiconductor layer, and the second semiconductor layer includes at least one p-type semiconductor layer and at least one p ⁻ -type semiconductor. And the third semiconductor layer includes at least one or more non-doped or n ⁻ -type semiconductor layers and at least one or more n-type semiconductor layers, and the n of the first semiconductor layer is n A source electrode is provided connected to the p-type semiconductor layer, a gate electrode is provided on the p-type semiconductor layer and the p ⁻ -type semiconductor layer of the second semiconductor layer via an insulating film, and the third semiconductor 4. The method of manufacturing a semiconductor element according to claim 3, wherein a drain electrode is provided connected to the n-type semiconductor layer of the layer. The first semiconductor layer includes at least one n-type semiconductor layer, and the second semiconductor layer includes at least one p-type semiconductor layer and at least one p ⁻ -type semiconductor. And the third semiconductor layer includes at least one or more non-doped or n ⁻ -type semiconductor layers and at least one or more n-type semiconductor layers. A source electrode is provided connected to the n-type semiconductor layer, a gate electrode is provided on the p-type semiconductor layer and the p ⁻ -type semiconductor layer of the second semiconductor layer via an insulating film, and the third electrode A drain electrode is provided connected to the n-type semiconductor layer of the semiconductor layer,
When the thickness of the p-type semiconductor layer and the p ⁻ type semiconductor layer of the second semiconductor layer is A, and the thickness of the non-doped or n ⁻ type semiconductor layer of the third semiconductor layer is B, A 4. The method of manufacturing a semiconductor device according to claim 3, wherein / B is 0.5 or more and less than 1. The first semiconductor layer includes at least one n-type semiconductor layer, the second semiconductor layer includes at least one p-type semiconductor layer, and the third semiconductor layer. Includes at least one non-doped or n ⁻ -type semiconductor layer, at least one n-type semiconductor layer and at least one p-type semiconductor layer, and the n-type semiconductor layer of the first semiconductor layer. A source electrode is provided, a gate electrode is provided on the p-type semiconductor layer of the second semiconductor layer via an insulating film, and is connected to the p-type semiconductor layer of the third semiconductor layer. 4. The method of manufacturing a semiconductor device according to claim 3, wherein a drain electrode is provided. The first semiconductor layer includes at least one n-type semiconductor layer, and the second semiconductor layer includes at least one p-type semiconductor layer and at least one p ⁻ -type semiconductor. The third semiconductor layer includes at least one non-doped or n ⁻ type semiconductor layer, at least one n type semiconductor layer, and at least one p type semiconductor layer. A source electrode connected to the n-type semiconductor layer of the first semiconductor layer, and a gate over the p-type semiconductor layer and the p ⁻ -type semiconductor layer of the second semiconductor layer via an insulating film An electrode is provided, connected to the p-type semiconductor layer of the third semiconductor layer, and a drain electrode is provided;
When the thickness of the p-type semiconductor layer and the p ⁻ type semiconductor layer of the second semiconductor layer is A, and the thickness of the n ⁻ type semiconductor layer of the third semiconductor layer is B, A / B The method for manufacturing a semiconductor device according to claim 3, wherein the value is 0.5 or more and less than 1. 5.   The method for manufacturing a semiconductor device according to claim 1, wherein the first substrate is a Si substrate.   21. The method of manufacturing a semiconductor element according to claim 1, wherein the first semiconductor layer, the second semiconductor layer, and the third semiconductor layer are made of a nitride-based III-V group compound semiconductor.   The first semiconductor layer, the second semiconductor layer, and the third semiconductor layer each include at least one group III element selected from the group consisting of B, Al, Ga, and In, N, P, and As. 21. The method of manufacturing a semiconductor device according to claim 1, comprising a group III-V compound semiconductor comprising at least one group V element selected from the group consisting of: Growing a first semiconductor layer having a hexagonal crystal structure on a first substrate;
Forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched;
Treating the surface of the first substrate after forming the seed so that a semiconductor layer having a hexagonal crystal structure does not substantially grow;
Laterally growing a second semiconductor layer having a hexagonal crystal structure from each seed so as not to contact each other;
Growing a third semiconductor layer having a hexagonal crystal structure over the entire surface so as to cover the second semiconductor layer;
Providing a second substrate on the third semiconductor layer;
And a step of peeling the first substrate from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate. Growing a first semiconductor layer having a hexagonal crystal structure on a first substrate;
Forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched;
Treating the surface of the first substrate after forming the seed so that a semiconductor layer having a hexagonal crystal structure does not substantially grow;
Laterally growing a second semiconductor layer having a hexagonal crystal structure from each seed so as not to contact each other;
Growing a third semiconductor layer having a hexagonal crystal structure over the entire surface so as to cover the second semiconductor layer;
Providing a second substrate on the third semiconductor layer;
Peeling the first substrate from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate;
A stripe-shaped first recess extending in the longitudinal direction of the seed is formed at a central portion in the width direction of the seed, and a stripe-shaped second extending in the longitudinal direction of the seed is formed between adjacent seeds. Forming a recess of
Forming a source electrode in the first recess and forming a gate electrode in the second recess via a gate insulating film;
Providing a third substrate on the source electrode and gate electrode sides;
Peeling the second substrate from the third semiconductor layer;
Forming a drain electrode on the third semiconductor layer; and a method of manufacturing an insulated gate field effect transistor.   The first semiconductor layer is formed by etching the first substrate in a step of forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched. 26. The method of manufacturing an insulated gate field effect transistor according to claim 24 or 25, wherein the first substrate is etched until an aspect ratio of a cross section of the stripe-shaped column made of the first substrate becomes 1 or more. .   After a first semiconductor layer having a hexagonal crystal structure is grown on a first substrate, an insulating film is formed on the first semiconductor layer before forming the plurality of stripe seeds 26. The plurality of stripe-shaped seeds are formed by etching the insulating film and the first semiconductor layer in a stripe pattern until the first substrate is etched. Of manufacturing an insulated gate field effect transistor.   27. The insulated gate field effect transistor according to claim 23, wherein the first semiconductor layer, the second semiconductor layer, and the third semiconductor layer are made of a nitride III-V compound semiconductor. Manufacturing method.   The method for manufacturing an insulated gate field effect transistor according to any one of claims 23 to 27, wherein the first substrate is a Si substrate.   29. The method of manufacturing an insulated gate field effect transistor according to any one of claims 23 to 28, wherein the second semiconductor layer is laterally grown in a state where the insulating film is left on the seed.   30. The insulated gate electric field according to claim 23, wherein a fourth semiconductor layer of a first conductivity type and a fifth semiconductor layer of a second conductivity type are sequentially grown as the first semiconductor layer. Effect transistor manufacturing method.   31. The method for manufacturing an insulated gate field effect transistor according to claim 23, wherein the second semiconductor layer is of a second conductivity type, and the third semiconductor layer is of a first conductivity type.   32. The method of manufacturing an insulated gate field effect transistor according to claim 23, wherein the third semiconductor layer has a contact layer having an impurity concentration higher than that of the third semiconductor layer as an uppermost layer.   The method for manufacturing an insulated gate field effect transistor according to claim 32, wherein the contact layer is used as the second substrate.   The method for manufacturing an insulated gate field effect transistor according to any one of claims 23 to 33, wherein the third semiconductor layer is used as the second substrate. Growing a first semiconductor layer having a hexagonal crystal structure on a first substrate;
Forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched;
Treating the surface of the first substrate after forming the seed so that a semiconductor layer having a hexagonal crystal structure does not substantially grow;
Laterally growing a second semiconductor layer having a hexagonal crystal structure from each seed so as not to contact each other;
Growing a third semiconductor layer having a hexagonal crystal structure over the entire surface so as to cover the second semiconductor layer;
Providing a second substrate on the third semiconductor layer;
And a step of peeling the first substrate from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate. Growing a first semiconductor layer having a hexagonal crystal structure on a first substrate;
Forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched;
Treating the surface of the first substrate after forming the seed so that a semiconductor layer having a hexagonal crystal structure does not substantially grow;
Laterally growing a second semiconductor layer having a hexagonal crystal structure from each seed so as not to contact each other;
Growing a third semiconductor layer having a hexagonal crystal structure constituting a light emitting element structure on the entire surface so as to cover the second semiconductor layer;
Attaching a second substrate on the third semiconductor layer;
Peeling the first substrate from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate;
Forming a first electrode and a second electrode on both surfaces of the third semiconductor layer before or after the first substrate is peeled off or after the first substrate is peeled off. Method. Growing a first semiconductor layer having a hexagonal crystal structure on a first substrate;
Forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched;
Treating the surface of the first substrate after forming the seed so that a semiconductor layer having a hexagonal crystal structure does not substantially grow;
Laterally growing a second semiconductor layer having a hexagonal crystal structure from each seed so as not to contact each other;
Growing a third semiconductor layer having a hexagonal crystal structure over the entire surface so as to cover the second semiconductor layer;
Providing a second substrate on the third semiconductor layer;
A step of peeling the first substrate from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate. Growing a first semiconductor layer having a hexagonal crystal structure on a first substrate;
Forming a plurality of stripe-shaped seeds by etching the first semiconductor layer in a stripe shape until the first substrate is etched;
Treating the surface of the first substrate after forming the seed so that a semiconductor layer having a hexagonal crystal structure does not substantially grow;
Laterally growing a second semiconductor layer having a hexagonal crystal structure from each seed so as not to contact each other;
Growing a third semiconductor layer having a hexagonal crystal structure constituting a solar cell structure over the entire surface so as to cover the second semiconductor layer;
Attaching a second substrate on the third semiconductor layer;
Peeling the first substrate from the seed, the second semiconductor layer, the third semiconductor layer, and the second substrate;
Forming a first electrode and a second electrode on both surfaces of the third semiconductor layer before peeling the first substrate or after peeling the first substrate, respectively. . A plurality of striped fourth n-type semiconductor layers having a hexagonal crystal structure;
A plurality of p-type fifth semiconductor layers provided to cover each of the fourth semiconductor layers and not to contact each other;
An n-type sixth semiconductor layer that covers the plurality of fifth semiconductor layers and is provided as a continuous film so as to fill a portion between the fifth semiconductor layers adjacent to each other;
A source electrode provided in the fourth semiconductor layer;
A gate electrode provided on the fifth semiconductor layer via a gate insulating film;
An insulated gate field effect transistor having a drain electrode provided on a surface opposite to the surface on which the source electrode and the gate insulating film of the sixth semiconductor layer are provided. A plurality of striped n-type seventh semiconductor layers having a hexagonal crystal structure;
A plurality of n-type eighth semiconductor layers provided to cover each of the seventh semiconductor layers and not to contact each other;
A plurality of p-type ninth semiconductor layers provided so as to cover each of the eighth semiconductor layers and not to contact each other;
An n-type tenth semiconductor layer provided as a continuous film so as to cover the plurality of ninth semiconductor layers and fill a portion between the ninth semiconductor layers adjacent to each other;
A source electrode provided on a surface of the seventh semiconductor layer opposite to the ninth semiconductor layer;
A gate electrode provided on a surface on the seventh semiconductor layer side of the tenth semiconductor layer in a portion between the ninth semiconductor layers adjacent to each other via a gate insulating film;
A drain electrode provided on a surface opposite to the surface on which the source electrode and the gate insulating film of the tenth semiconductor layer are provided;
The insulated gate field effect transistor, wherein the band gap of the ninth semiconductor layer is larger than the band gaps of the eighth semiconductor layer and the tenth semiconductor layer. A plurality of striped n-type eleventh semiconductor layers having a hexagonal crystal structure;
A plurality of p-type twelfth semiconductor layers provided to cover each of the eleventh semiconductor layers and not to contact each other;
A plurality of p ⁻ -type thirteenth semiconductor layers provided so as to cover each of the twelfth semiconductor layers and not to contact each other;
An n-type fourteenth semiconductor layer provided as a continuous film so as to cover the plurality of thirteenth semiconductor layers and fill a portion between the thirteenth semiconductor layers adjacent to each other;
An n-type fifteenth semiconductor layer provided on the fourteenth semiconductor layer;
A source electrode provided in the eleventh semiconductor layer;
A gate electrode provided on the twelfth semiconductor layer and the thirteenth semiconductor layer with a gate insulating film interposed therebetween;
An insulated gate field effect transistor having a drain electrode provided on the fourteenth semiconductor layer. A plurality of striped n-type sixteenth semiconductor layers having a hexagonal crystal structure;
A plurality of p-type seventeenth semiconductor layers provided to cover each of the sixteenth semiconductor layers and not to contact each other;
An n-type eighteenth semiconductor layer provided as a continuous film so as to cover the plurality of seventeenth semiconductor layers and fill a portion between the seventeenth semiconductor layers adjacent to each other;
An n-type nineteenth semiconductor layer provided on the eighteenth semiconductor layer;
A p-type twentieth semiconductor layer provided on the nineteenth semiconductor layer;
A source electrode provided on a surface of the sixteenth semiconductor layer opposite to the seventeenth semiconductor layer;
A gate electrode provided on the seventeenth semiconductor layer via a gate insulating film;
An insulated gate field effect transistor having a drain electrode provided on the twentieth semiconductor layer. A plurality of striped n-type twenty-first semiconductor layers having a hexagonal crystal structure;
A plurality of p-type twenty-second semiconductor layers provided so as to cover each of the twenty-first semiconductor layers and not to contact each other;
A plurality of p-type twenty-third semiconductor layers provided to cover each of the twenty-second semiconductor layers and not to contact each other;
An n-type twenty-fourth semiconductor layer provided as a continuous film so as to cover the plurality of twenty-third semiconductor layers and fill a portion between the twenty-third semiconductor layers adjacent to each other;
An n-type 25th semiconductor layer provided on the 24th semiconductor layer;
A p-type twenty-sixth semiconductor layer provided on the twenty-fifth semiconductor layer;
A source electrode provided in the twenty-first semiconductor layer;
A gate electrode provided on the twenty-second semiconductor layer and the twenty-third semiconductor layer via a gate insulating film;
An insulated gate field effect transistor having a drain electrode provided on the twenty-sixth semiconductor layer. A plurality of striped n-type 27th semiconductor layers having a hexagonal crystal structure;
A plurality of p-type twenty-eighth semiconductor layers provided so as to cover each of the twenty-seventh semiconductor layers and not to contact each other;
A plurality of p-type 29th semiconductor layers provided to cover each of the 28th semiconductor layers and not to contact each other;
An n-type 30th semiconductor layer provided as a continuous film so as to cover the plurality of 29th semiconductor layers and fill a portion between the 29th semiconductor layers adjacent to each other;
An n-type 31st semiconductor layer provided on the 30th semiconductor layer;
A p-type thirty-second semiconductor layer provided on the thirty-first semiconductor layer;
A source electrode provided on a surface of the thirtieth semiconductor layer opposite to the twenty-eighth semiconductor layer;
A gate electrode provided on the twenty-eighth semiconductor layer and the twenty-ninth semiconductor layer via a gate insulating film;
An insulated gate field effect transistor having a drain electrode provided on the thirty-second semiconductor layer.

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