JP2018021235A - Film deposition unit for sputtering device, and film deposition apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film deposition unit for a sputtering device having a structure in which exhaust balance is hardly disturbed, even when a target is reciprocated to a magnet unit.SOLUTION: A film deposition unit FU for a sputtering device is provided with a target 2 formed by bonding a backing plate 3 to a support plate 1, a magnet unit 5, and driving means 8 for reciprocating the target to the magnet unit along the support plate. A cover body 9 fixed and arranged on the support plate, for covering the target and the backing plate at a space over the target, is further provided, and an opening 93 to which the target faces is formed on an upper wall part 92 of the cover body.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a film forming unit for a sputtering apparatus and a film forming apparatus having at least one film forming unit for the sputtering apparatus, and more specifically, for a magnetron sputtering apparatus in which a target is reciprocated with respect to a magnet unit. About things.

  A film forming unit for this type of sputtering apparatus is known from Patent Document 1, for example. This is provided with a box-shaped casing (displacement part) mounted on the inner wall surface of the vacuum chamber where film formation is performed, and a displacement plate is provided on the side of the casing facing the inside of the vacuum chamber. . A backing plate having a target as a cathode bonded to one surface is fixed to the displacement plate via a support. In addition, a magnet unit that is located inside an opening provided in the displacement plate and that causes a leakage magnetic field to act on the target surface is fixedly disposed in the support.

  The inside of the casing is divided into two chambers by partition walls, and one chamber communicates with the space on the target side through the through-hole formed in the casing, that is, the vacuum chamber in which film formation is performed by evacuation. The other chamber is provided with a drive motor, the drive shaft of the drive motor passes through the partition wall and protrudes into one chamber, a connecting rod is provided at the tip of the protruding drive shaft, and the connecting rod is connected to the displacement plate. ing. When the drive motor is driven, the backing plate fixed to the displacement plate via the support plate, and thus the target moves relative to the magnet unit. As a result, a rare gas for discharge or reactive gas during reactive sputtering is introduced into the vacuum chamber, and the target is moved while the target is sputtered by applying a predetermined power having a negative potential, for example. The relative position of the magnet unit and the deposition plate (anode) that is located on the side of the target and protrudes into the vacuum chamber does not change, and changes in the plasma state such as plasma position and density on the surface of the target are suppressed. It is done.

  Here, an exhaust pipe leading to a vacuum pump is connected to a predetermined position of the vacuum chamber, and while the target is sputtered by introducing a rare gas for discharge or a reactive gas at the time of reactive sputtering into the vacuum chamber, the inside of the vacuum chamber is Always evacuated. However, when the target is reciprocated with respect to the magnet in a vacuum atmosphere as in the above conventional example, the exhaust is caused depending on whether the target is on one side of the reciprocating direction or the other side of the reciprocating direction with respect to the magnet. There is a problem in that the exhaust conductance in the vacuum chamber leading to the tube changes and the exhaust balance is lost. In such a case, in particular, when the film is formed by reactive sputtering, the distribution of the reaction gas introduced into the vacuum chamber changes, so that the film quality of the formed thin film tends to be nonuniform.

International Publication No. 2014/080815

  In view of the above, the present invention provides a film forming unit for a sputtering apparatus having a structure in which the exhaust balance is not easily lost even when the target is reciprocated with respect to the magnet unit, and a film forming apparatus including a plurality of film forming units for the sputtering apparatus. It is an object of the present invention to provide an apparatus.

  In order to solve the above-mentioned problem, a support plate that is detachably attached to the opening of the vacuum chamber is provided, and a target having a backing plate bonded to the lower surface on one side of the support plate, and a backing plate A film forming unit for a sputtering apparatus of the present invention having a magnet unit that is disposed between a plate and a support plate and causes a leakage magnetic field to act on the target. Drive means for reciprocating the target along the support plate with respect to the magnet unit is further provided, and further includes a cover body that is fixedly arranged on the support plate and covers the target and the backing plate with a space on the target. An opening for the target to face is formed in the upper wall portion of the cover body.

  According to the present invention, when the film forming unit is attached to the vacuum chamber and evacuated by the vacuum pump, the support plate and the cover body are surrounded mainly through the opening formed in the upper wall portion of the cover body (that is, reciprocating). The space in which there is a moving target and plasma is formed) is evacuated. For this reason, even if the target is reciprocated, the exhaust conductance from the space hardly changes. As a result, a predetermined thin film can be formed with good film quality uniformity by reactive sputtering. Here, the cover body is provided on a support plate, and the support plate is usually attached to a vacuum chamber that is grounded. For this reason, the cover body itself is at a ground potential, and when sputtering is performed by applying power to the target, the upper wall portion of the cover body located at the periphery of the opening serves as an anode and can be stably discharged. it can.

  In the present invention, in the case of including two targets having a rectangular outline that are arranged side by side in the same plane and reciprocate in conjunction with the driving means, the cover body has an opening corresponding to each target. What is necessary is just to employ | adopt the structure provided with the isolation plate which is formed and isolates the space on each target mutually. In this case, each of the targets is long in a direction perpendicular to the reciprocating direction, and a gas nozzle is provided on the side wall of the cover body along the long side of the target, and the gas injected from the gas nozzle toward the side wall Is introduced into the space above the target in the cover body through the gas holes drilled in the side wall surface, the reaction gas distribution in the space on the target hardly changes even when the target is reciprocated. It is advantageous.

  In order to solve the above-described problem, a film forming apparatus of the present invention includes at least one film forming unit for the sputtering apparatus and a vacuum chamber, and is provided for the sputtering apparatus on the wall surface of the vacuum chamber via the support plate. The film forming unit is mounted, and an exhaust port that communicates with the vacuum pump is provided symmetrically with respect to the center of the cover body in the support or the wall surface portion of the vacuum chamber located around the cover body. According to this, the space surrounded by the support plate and the cover body can be isotropically exhausted through the opening formed in the upper wall portion of the cover body, which is advantageous. In the case where a plurality of film forming units for the sputtering apparatus described above are provided, the apparatus further includes a drum disposed in the vacuum chamber and a conveying means for conveying the sheet-like substrate through the drum. A plurality of partition plates are provided that are attached to the vacuum chamber via the support plate so that a plurality of membrane units are positioned around the drum, and each part in the vacuum chamber in which each film formation unit is provided is separated into the atmosphere. In this way, a film forming apparatus can be configured.

The perspective view explaining the film-forming unit of the embodiment of the present invention. Sectional drawing in alignment with the II-II line | wire of FIG. 1 which has a target in a starting point position. Sectional drawing which follows the III-III line of FIG. FIG. 4 is a cross-sectional perspective view taken along line IV-IV in FIG. 3. Sectional drawing corresponding to FIG. 2 shown in the state which moved the target to the folding | turning position. Sectional drawing explaining the structure of the film-forming apparatus provided with two or more of the film-forming units of this invention. Sectional drawing explaining the structure of the film-forming apparatus which concerns on a modification.

  Hereinafter, embodiments of a film forming unit for a magnetron sputtering apparatus and a film forming apparatus according to the present invention will be described with reference to the drawings. In the following, it is assumed that the film forming unit FU shown in FIG. 1 is attached to and detached from the opening of the vacuum chamber (not shown), and terms indicating directions such as “up” and “down” are based on this posture. The direction in which the target reciprocates with a fixed stroke with respect to the magnet unit will be described as the X-axis direction, and the longitudinal direction of the target perpendicular to the X-axis direction will be described as the Y-axis direction.

  1 to 4, FU is a film forming unit for a magnetron sputtering apparatus according to an embodiment of the present invention, and can be closely attached to a peripheral portion of a lower surface opening of a vacuum chamber (not shown) through a vacuum seal 11. A support plate 1 that is long and rectangular in the X-axis direction is provided. On the support plate 1, two targets 2a and 2b having the same shape and having a rectangular outline extending in the Y-axis direction are juxtaposed in the X-axis direction. The targets 2a and 2b are appropriately selected according to the composition of the thin film to be formed on the substrate (not shown) disposed in the vacuum chamber. As shown in FIG. 2, backing plates 3a and 3b having the same shape and a rectangular outline larger than the targets 2a and 2b are joined to the lower surfaces of the targets 2a and 2b, respectively. A refrigerant passage 31 is formed inside the backing plates 3a and 3b. By supplying a refrigerant such as cooling water to the refrigerant passage 31, the targets 2a and 2b can be cooled during sputtering. And each target 2a, 2b is stored in the target case 4 in the state joined to backing plate 3a, 3b.

  The target case 4 is configured by a box body 42 having an open upper surface, which is partitioned into two chambers by a partition wall 41 extending in the Y-axis direction, and a lid plate 43 attached on the box body 42. A spacer 44 made of an insulating material is provided inside the bottom surface of the box body 42, and the backing plates 3 a and 3 b are fixedly disposed on the spacer 44. The cover plate 43 has two first openings that surround the outer peripheries of the targets 2a and 2b with a gap when the targets 2a and 2b are stored in the box 42 while being bonded to the backing plates 3a and 3b. 43a and 43b are established.

  Two second openings 42 a and 42 b that are long in the X-axis direction are formed on the bottom surface of the box body 42. In this case, the lengths of the second openings 42a and 42b in the X-axis direction are determined according to the reciprocating stroke of the targets 2a and 2b. As shown in FIG. 3, sliders 45 are respectively provided on the lower surfaces of the box bodies 42 located at both ends in the Y-axis direction, and each slider 45 is a pair that is long on the support plate 1 in the X-axis direction. The rail member 12 is slidably engaged. As a result, the target case 4 is held on the support plate 1, and the target case 4 and thus the targets 2a and 2b are interlocked with each other along a pair of rail members 12 by a driving means described later with a constant stroke in the X-axis direction. Reciprocates.

  On the support plate 1, magnet units 5a and 5b having the same configuration are positioned below the targets 2a and 2b, respectively, and protrude into the box 42 through the second openings 42a and 42b. Each is fixedly arranged via Each of the magnet units 5a and 5b includes a yoke 52 that is long in the Y-axis direction and has a rectangular outline, and a central magnet 53 and a peripheral magnet 54 that is disposed so as to surround the central magnet 53 on the upper surface of the yoke 52. And are provided. As the central magnet 53 and the peripheral magnet 54, neodymium magnets having the same magnetization are used. For example, a bar-shaped one having a substantially square cross section formed integrally can be used. Thereby, each of the closed-loop leakage magnetic fields balanced on the targets 2a and 2b can be applied.

  Further, refrigerant supply pipes 32a, 33a and discharge pipes 32b, 33b communicating with the refrigerant passage 31 project downward from both ends of the backing plates 3a, 3b in the Y-axis direction. As shown in FIG. 4, the supply pipes 32 a and 33 a and the discharge pipes 32 b and 33 b are made of metal and have the same form, and the first part 321 extending downward from the refrigerant passage 31 and the first part 321. The second portion 322 extends in the X-axis direction from the lower end. In this case, the second part 322 of the supply pipe 32a of the one backing plate 3a, the second part 322 of the supply pipe 33a of the other backing plate 3b, and the second part 322 of the discharge pipe 32b of the one backing plate 3a. And the second portion 322 of the discharge pipe 33b of the other backing plate 3b are provided so as to extend in the opposite directions from the first portion 321 on the same line in the X-axis direction. Moreover, the attachment flange 323 is formed in the edge part of the 2nd part 322, respectively, the coupling 6 protrudes from the outer surface of the attachment flange 323, and piping from the equipment side outside a figure can be connected now. The joint 6 is also connected with an output cable K from a sputtering power source Ps appropriately selected from a DC power source, a high-frequency power source and the like according to the types of the targets 2a and 2b (see FIG. 2), and supply pipes 32a and 33a. Alternatively, DC power or high frequency power having a negative potential can be applied from the discharge pipes 32b and 33b to the targets 2a and 2b through the backing plates 3a and 3b. In the present embodiment, the joint 6 is a component part of the supply pipes 32a and 33a and the discharge pipes 32b and 33b.

  Further, the support plate 1 is provided with two slit holes 13 that are long in the X-axis direction through which the supply pipes 32 a and 33 a and the discharge pipes 32 b and 33 b are inserted, and the target case 4 is formed on the support plate 1. In the state in which is installed, the first portions 321 of the supply pipes 32a, 33a and the discharge pipes 32b, 33b extending from the backing plates 3a, 3b are inserted through the slit holes 13 so as to protrude downward. The length of the slit hole 13 in the X-axis direction is fixed according to the reciprocating stroke of the targets 2a and 2b. The lower surface of the support plate 1 surrounds the first portion 321 of the supply pipes 32a and 33a and the discharge pipes 32b and 33b which are inserted through the slit hole 13 and protrude downward, including the slit hole 13. Two cap bodies 71 are provided to be kept airtight. Each cap body 71 includes a supply pipe 32a of one backing plate 3a, a supply pipe 33a of another backing plate 3b, and a discharge pipe 32b of one backing plate 3a and a discharge pipe 33b of another backing plate 3b. I try to enclose each one. In addition, each cap body 71 is provided with a through hole 71 a through which the second portion 322 passes, and the second portion 322 protruding from the cap body 71 is covered between the cap body 71 and each mounting flange 323. The bellows pipes 72 having the same form that are kept airtight are respectively extrapolated. In this case, the through hole 71a of the cap body 71 is hermetically held by sealing means (not shown) provided on one flange 72a of the bellows pipe 72, and the other flange 72b of the bellows pipe 72 is connected to the inner surface of the mounting flange 323. Are joined via a sealing means 72c.

  Driving means 8 is provided on the lower surface of the support plate 1. As shown in FIG. 4, the driving means 8 includes a motor 81 attached to the center of the lower surface of the support plate 1, a feed screw 82 connected to the motor 81 as a drive unit, and a drive screwed to the feed screw 82. The operation rod 83 is provided as a part, and both end portions of the operation rod 83 are connected to mounting flanges 323 of the supply pipe 33a and the discharge pipe 33b of the other backing plate 3b, respectively. As a result, the targets 2a and 2b have one side in the X-axis direction (that is, the position close to the right side with respect to the magnet units 5a and 5b shown in FIG. 2) as the starting point of the reciprocating motion. When the screw 82 is rotated in one direction, the operation pipe 83 moves the supply pipe 33a and the discharge pipe 33b of the other backing plate 3b to move toward the other side in the X-axis direction (left side in FIG. 2). Along with this, the magnet case 4 moves, and the targets 2a and 2b reach the folding point on the other side in the X-axis direction (that is, the position closer to the left side with respect to the magnet units 5a and 5b shown in FIG. 5). . At this time, when separated from the atmosphere by the expanding and contracting bellows pipe 72, that is, when the support plate 1 is attached to the vacuum chamber and film formation is performed by sputtering in a vacuum, the magnet case is maintained while maintaining the vacuum atmosphere in the vacuum chamber. 4 moves. When the targets 2a and 2b reach the folding point on the other side in the X-axis direction, the feed screw 82 is reversed by the motor 81, and the supply pipe 33a and the discharge pipe 33b of the other backing plate 3b are interlocked with each other by the operating rod 83. Along with this, the magnet case 4 moves and the targets 2a and 2b return to their starting points. By repeating this operation, the targets 2a and 2b are reciprocated. The driving means 8 is not limited to the one having the above-described configuration, and the form thereof is not limited as long as the targets 2a and 2b can be moved synchronously.

  Furthermore, a cover body 9 is provided on the support plate 1 to surround the targets 2a and 2b with a space above them. The cover body 9 has a box shape with an open lower surface, and is fixedly arranged in a state where the lower end thereof is in contact with the support plate 1 over the entire circumference. An isolating plate 91 is provided in the cover body 9 so as to isolate a space 94a in which one target 2a exists from a space 94b in which another target 2b exists. In the upper wall portion 92 of the cover body 9, two openings 93a and 93b respectively facing the targets 2a and 2b are formed. Thereby, when the film forming unit FU was attached to the vacuum chamber and the vacuum pump connected to the vacuum chamber was operated to evacuate, the support plate 1 and the cover body 9 were surrounded mainly through the openings 93a and 93b. The spaces 94a and 94b (that is, there are reciprocating targets and plasma is formed) are evacuated.

  Two gas nozzles Gn1 and Gn2 are provided on the outer surfaces of the side wall portions 95a and 95b located in the X-axis direction of the cover body 9, respectively. Each of the gas nozzles Gn1, Gn2 has a length along the Y-axis direction of the targets 2a, 2b, and the injection ports Gnh for injecting gas toward the side walls 95a, 95b of the cover body 9 are arranged at predetermined intervals in the X-axis direction. It is installed. In this case, the upper gas nozzle Gn1 is for introducing a rare gas for discharge, and the lower gas nozzle Gn2 is for introducing a reactive gas. Gas holes 96a and 96b are formed in the side wall portions 95a and 95b of the cover body 9 so as to face the injection ports Gnh of the gas nozzles Gn1 and Gn2, respectively. The diameter of each gas hole 96a, 96b is set to be equal to or larger than the diameter of the injection port Gnh, and the gas holes 96a, 96b are located at the same height as the upper surface of the target 2a, 2b or from the upper surface of the target 2a, 2b. It is provided in the side wall parts 95a and 95b of the cover body 9 so that it may be located upward, and the attachment position of each gas nozzle Gn1 and Gn2 is determined according to this. As a result, when discharge rare gas and reaction gas are injected from the injection ports Gnh of the gas nozzles Gn1 and Gn2, the discharged discharge rare gas and reaction gas mainly enter the cover body 9 through the gas holes 96a and 96b. They are introduced into the spaces 94a and 94b located above the targets 2a and 2b, respectively, and exhausted from the openings 93a and 93b of the upper wall portion 92 of the cover body 9, respectively. The diameter and number of the injection ports Gnh of the gas nozzles Gn1 and Gn2 with respect to the side wall portion of the cover body 9 are appropriately selected in consideration of the volume of the vacuum chamber, the exhaust capacity of the vacuum pump, and the like. A description will be given of an example in which the gas holes 96a and 96b are formed in the side wall portions 95a and 95b of the cover body 9 so as to face each other. However, the present invention is not limited to this example. A gas hole can also be comprised by the slit-shaped long hole which opposes.

  According to the above embodiment, the rare gas for discharge and the reactive gas are introduced into the spaces 94a and 94b located above the targets 2a and 2b in the cover body 9 through the gas holes 96a and 96b, and the openings 93a. 93b, the discharge conductance when the rare gas for discharge and the reactive gas introduced through the gas holes 96a, 96b are exhausted from the openings 93a, 93b even if the targets 2a, 2b are reciprocated. Hardly changes. In addition, since the distribution of the reaction gas in the spaces 94a and 94b hardly changes, a thin film can be formed with good film quality uniformity by reactive sputtering. In the present embodiment, the height position equivalent to the upper surfaces of the targets 2a and 2b includes the case where the gas holes 96a and 96b are positioned below the upper surfaces of the targets 2a and 2b within a range in which the exhaust conductance hardly changes. . Here, the cover body 9 is in contact with the support plate 1, and the support plate 1 is usually attached to a grounded vacuum chamber. For this reason, the cover body 9 itself becomes a ground potential, and when the targets 2a and 2b are powered on and sputtered, the upper wall portion 92 of the cover body 9 located at the periphery of the openings 93a and 93b serves as an anode. Can be discharged stably.

  Moreover, in the said embodiment, in the state which attached the film-forming unit FU to the vacuum chamber via the support plate 1 which can be attached or detached to the opening of a vacuum chamber, each joint 6 of supply pipe 32a, 33a and discharge pipe 32b, 33b. If a pipe (not shown) from the equipment side is connected to the refrigerant, the refrigerant can be circulated through the backing plates 3a and 3b. Therefore, the film forming unit FU can be made simple and easy to maintain. Further, when the inside of the vacuum chamber is evacuated, it is only necessary to evacuate only the portion surrounded by the cap body 71. Therefore, it is not necessary to use a large vacuum pump for evacuating the vacuum chamber. In addition, since the driving means 8 for driving the targets 2a and 2b is installed in the atmosphere outside the vacuum chamber, it is not necessary to use an expensive vacuum means as the driving means 8.

  In particular, in the above embodiment, the second portion 322 of the supply pipe 32a of the one backing plate 3a, the second portion 322 of the supply pipe 33a of the other backing plate 3b, and the discharge pipe 32b of the one backing plate 3a. By adopting a configuration in which the second part 322 and the second part 322 of the discharge pipe 33b of the other backing plate 3b are positioned on the same line, and the bellows pipe 72 of the same form is extrapolated to each second part 322, Since the differential pressure between the atmospheric pressure and the vacuum pressure can be canceled when the targets 2a and 2b are reciprocated by the drive means 8, and the drive means 8 does not need to be responsible for the differential pressure, for example, the motor 81 of the drive means 8 is Since only a small rated torque is required and no force against the vacuum pressure is required, it is not necessary to give the operating rod 83 a strong strength, and the feed screw 82 is thin. It requires only. As a result, further cost reduction can be achieved. In addition, if the driving means 8, for example, the motor 81 fails for some reason, it simply returns to the position where the spring force of each bellows pipe 72 located on the same line is antagonized. High safety can be obtained without the need for structural or electrical damage prevention means for preventing the drive part from being damaged.

  By the way, in the case of a drive system that reciprocates the parts in vacuum (targets 2a and 2b in the above embodiment) by a motor arranged in the atmosphere, the motor is regenerated in a pressure receiving direction in which vacuum pressure acts on the parts. There are an operation and a power running operation in the counter pressure direction against the vacuum pressure. From an energy standpoint, this can be said that power running is energy input and regenerative operation is equivalent to energy recovery. Here, in this type of conventional drive system, during regenerative operation, for example, it is generally designed to release heat as heat by a resistor provided in a motor drive circuit, which corresponds to a vacuum pressure. All the electric power to be changed into heat, and the electric power burden is large. On the other hand, in the above embodiment, only the electric power against the frictional force is consumed during the regenerative operation, and the electric power burden can be reduced. In addition, since an inexpensive general-purpose drive system can be used, the equipment cost can be reduced, which is advantageous.

  As mentioned above, although embodiment of this invention was described, this invention is not limited above. In the above-described embodiment, the case where two targets 2a and 2b are used has been described as an example. However, the present invention can also be applied to the case where a single target is used, and the case where three targets 2a and 2b are used. However, the present invention can be used to make the film forming unit FU simple and easy to maintain. Furthermore, in the above embodiment, the case where the targets 2a and 2b are stored in the magnet case 4 has been described as an example. However, the present invention is not limited to this, and the support plate is electrically insulated from the support plate. As long as it can be reciprocated with respect to the magnet unit, the form is not limited. In addition, the drive system of the said embodiment which reciprocates the targets 2a and 2b as components in a vacuum with the motor 81 arrange | positioned in air | atmosphere is diverted as a drive system of components, such as a gate valve installed in a vacuum. You can also.

  By the way, when the magnet units 5a and 5b are constituted by the central magnet 53 provided on the upper surface of the yoke 52 and the peripheral magnet 54 surrounding the central magnet 53 as in the above embodiment, a rare gas for discharge is introduced. When power is applied to the targets 2a and 2b, plasma is generated along the racetrack, but the electron density in the plasma tends to increase locally at the corners of the racetrack. In such a case, if the magnet units 5a and 5b are fixedly arranged on the support plate 1 below the targets 2a and 2b, respectively, the X-axis direction of the targets 2a and 2b with respect to the magnet units 5a and 5b. Although the targets 2a and 2b are eroded substantially uniformly in the X-axis direction by the relative movement to the target, the targets 2a and 2b at the ends in the Y-axis direction of the targets 2a and 2b corresponding to the corner portions of the racetrack. Is locally eroded. As a result, the targets 2a and 2b reach the end of life at an early stage, and the utilization efficiency of the targets 2a and 2b is poor.

  Therefore, a drive shaft that penetrates the Y-axis direction long slit hole formed in the support plate 1 is connected to the back surface of the yoke 52, and the magnet unit 5a, via the drive shaft is driven by a drive source provided in the atmosphere. 5b is preferably configured to be relatively movable in the Y-axis direction with respect to the targets 2a and 2b. In this case, the drive source has a position where the magnet units 5a, 5b and the targets 2a, 2b are concentric as a starting position, and a position moved from the starting position by a predetermined stroke in the Y-axis direction is a folding position. The magnet units 5a and 5b are moved relative to each other between the starting position and the folding position. Thereby, the local erosion of the targets 2a and 2b can be avoided, and the targets 2a and 2b can be eroded almost uniformly over the entire surface until the life end. As a result, the usage efficiency of the targets 2a and 2b can be improved.

  As the drive source, the drive system of the above-described embodiment in which the targets 2a and 2b as components in a vacuum are reciprocated by a motor 81 arranged in the atmosphere can be used. The relative movement of the targets 2a and 2b with respect to the magnet units 5a and 5b is not performed during sputtering of the targets 2a and 2b so that the film forming conditions do not change excessively. For example, according to the integrated input power to the targets 2a and 2b, It is preferable to appropriately move the magnet units 5a and 5b between the starting position and the folding position. In this case, the stroke of the relative movement of the magnet units 5a and 5b with respect to the targets 2a and 2b and the staying time at the starting position or the turn-back position are, for example, the erosion area and the erosion speed when sputtering the targets 2a and 2b at the starting position. Can be set appropriately based on this. The moving positions of the magnet units 5a and 5b are not limited to the above three points, and can be increased as appropriate according to the erosion state of the targets 2a and 2b. For example, when the film formation conditions do not change excessively, the magnet units 5a and 5b can be appropriately reciprocated at a predetermined speed between the folding positions during sputtering of the targets 2a and 2b.

Next, referring to FIG. 6, it will be described deposition apparatus SM ₁ which comprises two of the sputtering apparatus for film formation unit FU. In addition, the same code | symbol shall be used about the same member and element as the said embodiment. Deposition device SM ₁ is provided with a vacuum chamber 100 that allow formation of a vacuum atmosphere. Two openings are opened in the bottom portion of the vacuum chamber 100 at a predetermined interval in the X-axis direction which is the reciprocating direction of the targets 2a and 2b, and the vacuum seal 11 of the support plate 1 is formed at the peripheral edge of each opening. The film forming unit FU for the sputtering apparatus is mounted so that the is closely attached.

  The support 1 of the film forming unit FU for each sputtering apparatus is positioned at the midpoint of the Y-axis direction on both outer sides in the X-axis direction of the cover body 9, that is, two symmetrically with respect to the center of the cover body 9. Exhaust ports Po, Po are opened and connected to a vacuum pump (not shown) via an exhaust pipe Ep. Thereby, the internal space of the cover body 9 is isotropically exhausted through the openings 93a and 93b, and in this case, the exhaust conductance when exhausted from the openings 93a and 93b hardly changes. Then, a substrate S such as a glass substrate is disposed opposite to a predetermined position in the vacuum chamber 100 facing both the targets 2a and 2b, and the targets 2a and 2b are sputtered by the film forming units FU for each sputtering apparatus, thereby forming the substrate. A predetermined thin film is formed on one side of S. Note that, depending on the area of the substrate S to be formed, a single film forming unit FU for the sputtering apparatus may be provided. Note that if the exhaust port Po is provided so as to face the internal space of the cover body 9, the exhaust conductance may change. Therefore, the exhaust port Po is formed on the support plate 1 or the vacuum located outside the cover body 9. The position and number of exhaust ports are not limited to those described above as long as they are provided on the wall portion of the chamber 100. For example, exhaust when exhausted from the openings 93a and 93b depending on the presence or absence of the substrate S. It is set as appropriate so that the conductance does not change.

Next, with reference to FIG. 7, illustrating another film-forming apparatus SM ₂ comprising a plurality of deposition units FU for the sputtering apparatus. In principle, the same reference numerals are used for the same members and elements as those in the above embodiment. Deposition apparatus SM ₂ is provided with a vacuum chamber 100 that allow formation of a vacuum atmosphere. In the vacuum chamber 100, a drum 200 around which a sheet-like base material Sw is wound, and a transport unit 300 that transports the sheet-like base material Sw at a predetermined speed are provided. Although not specifically illustrated and described, the drum 200 is pivotally supported by the wall of the vacuum chamber 100, and during the film formation, a refrigerant is circulated therein so that the sheet-like substrate Sw can be cooled during the film formation. Yes.

  The conveying unit 300 includes a driving motor (not shown) to feed out the sheet-like base material Sw, and a winding unit that includes a driving motor (not shown) to wind up the film-formed sheet-like base material Sw. 302, and the sheet-like substrate Sw fed from the feeding unit 301 is guided around the drum 200 through the guide roller 303, and is conveyed to the winding unit 302 through the guide roller 304 and wound. It has come to be taken. The vacuum chamber 100 is partitioned by a partition plate 401 into an upper transfer chamber 100a where the transfer means 300 is provided and a lower film formation chamber 100b where the cooling drum 200 and the film formation unit FU are provided. In this case, the partition plate 401 plays a role as an adhesion preventing plate. The film forming unit FU for the sputtering apparatus is mounted on the wall surface of the vacuum chamber 100 that partitions the film forming chamber 100b so as to be positioned around the drum 200.

  The sputtering apparatus film forming unit FU is attached so that the vacuum seal 11 of the support plate 1 is in close contact with the peripheral edge of the opening provided at a predetermined position of the vacuum chamber 100. Further, in the vacuum chamber 100, other partition plates 402 are provided in order to separate the atmosphere in the portions in the vacuum chamber 100 where the sputtering apparatus film forming units FU are provided. In this case, exhaust ports Po1, Po2, Po3 are opened on the wall surface of the vacuum chamber 100 that partitions the transfer chamber 100a and the wall surface of the vacuum chamber 100 that partitions the film forming chamber 100b, and are illustrated via the exhaust pipe Ep. It is connected to the omitted vacuum pump. In addition to this, in the present embodiment, the support 1 of each film forming unit FU for the sputtering apparatus is also positioned at the midpoint of the Y-axis direction on both outer sides of the cover body 9 in the X-axis direction, and the exhaust ports Po4, Po5. Is connected to a vacuum pump (not shown) via an exhaust pipe Ep. As a result, the portion in the vacuum chamber 100 in which the film forming units FU for the sputtering apparatus are provided is reliably separated from the atmosphere, and isotropically evacuated from the openings 93a and 93b. And while carrying the sheet-like base material Sw at a constant speed, by sputtering the targets 2a and 2b by the film forming units FU for each sputtering apparatus, a predetermined laminated film is formed on one surface of the sheet-like base material Sw. A film is formed.

FU ... Sputtering apparatus film forming unit, 1 ... support plate, 13 ... slit hole, 2a, 2b ... target, 3a, 3b ... backing plate, 31 ... refrigerant path, 32a, 33a ... supply pipe, 33a, 33b ... discharge pipe 5a, 5b ... magnet unit, 71 ... cap body, 72 ... bellows tube, 8 ... drive means, 82 ... feed screw (drive unit), 83 ... operating rod (drive unit), 9 ... cover body, 91 ... isolation plate , 92 ... upper wall part, 93a, 93b ... opening, 95a, 95b ... side wall part of cover body, 96a, 96b ... gas hole, Gn1 ... gas nozzle (rare gas for discharge), Gn2 ... gas nozzle (reactive gas), Gnh ... Spray port, Ps ... sputter power supply, K ... output cable, SM ... film forming device, 200 ... drum, 300 ... sheet-like substrate conveying device, 401, 402 ... partition plate.

Claims (5)

A detachable support plate is provided at the opening of the vacuum chamber, with one side of the support plate facing up, a target having a backing plate bonded on the lower surface, and between the backing plate and the support plate. A film forming unit for a sputtering apparatus having a magnet unit that is arranged and causes a leakage magnetic field to act on the target,
In the apparatus further comprising driving means for reciprocating the target along the support plate with respect to the magnet unit while power is applied to the target from the sputtering power source and the target is sputtered.
The cover is fixedly arranged on the support plate, has a space on the target and covers the target and the backing plate, and has an opening for the target to be formed on the upper wall of the cover. Film forming unit for sputtering equipment. The film forming unit for a sputtering apparatus according to claim 1, comprising two targets having a rectangular outline that are arranged in parallel in the same plane and reciprocate in conjunction with a driving means.
2. The film forming unit for a sputtering apparatus according to claim 1, wherein the cover body is provided with an opening corresponding to each target, and provided with an isolation plate that isolates a space on each target from each other.   Each target is long in a direction orthogonal to the reciprocating direction, and a gas nozzle is provided on the side wall of the cover body along the long side of the target, and the gas injected from the gas nozzle toward the side wall is on the side 3. The film forming unit for a sputtering apparatus according to claim 2, wherein the film forming unit is introduced into a space above the target in the cover body through a gas hole formed in the wall surface. In the film-forming apparatus which has at least one film-forming unit for sputtering devices of any one of Claims 1-3,
A sputtering chamber film forming unit is mounted on the wall surface of the vacuum chamber via the support plate, and a support body located around the cover body or an exhaust port leading to the vacuum pump covers the wall surface portion of the vacuum chamber. A film forming apparatus characterized by being provided symmetrically with respect to the center of the body. A drum disposed in the vacuum chamber; and a transport unit configured to transport the sheet-like base material through the drum, and the vacuum chamber includes a plurality of film forming units for the sputtering apparatus positioned around the drum. 5. The film forming apparatus according to claim 4, further comprising a plurality of partition plates that are mounted via a support plate and each separates the atmosphere in a vacuum chamber in which each film forming unit is provided.

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