JP2018019001A - Film-like heat conduction member and electronic apparatus enclosure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film-like heat conduction member capable of conducting heat from a heating element of a first enclosure toward a second enclosure, by winding around the hinge of a foldable electronic apparatus enclosure, while improving retention property of film winding shape, and pastability of film end to the enclosure.SOLUTION: A film-like heat conduction member includes a first region and a second region elongating in the longitudinal direction, and a connection region elongating while inclining for the longitudinal direction, and connecting the first and second regions. The first region and second region are formed so that the width of the first region does not overlap the width of the second region when extended in the longitudinal direction. The film-like heat conduction member is a laminate film, and the laminate film includes a graphite film, an isolating layer placed on the surface of the laminate film, and an adhesive layer placed on the back side of the laminate film.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a film-like heat conducting member and an electronic device casing including the same.

  2. Description of the Related Art Conventionally, electronic devices such as personal computers have air cooling fans, heat radiating fans, heat sinks, heat pipes, heat spreaders, and the like as heat radiating means for efficiently releasing heat generated by internal electronic components to the outside.

  In patent document 1, what utilized the high thermal conductivity which a graphite sheet shows as an example of the thermal radiation means which can be used with folding electronic devices, such as a notebook personal computer, is proposed. Specifically, in this document, an electronic device casing includes a first casing (body casing) having a heating element, and a second casing (display) that opens and closes by a hinge portion and includes a heat dissipation section. Part housing), a heat conduction path connected to one end of the heat dissipation part, and arranged across the first case and the second case, and a first case connected to the heat conduction path. Including a heat receiving portion that receives the heat generated in step 1, and the heat conduction path portion is formed of a graphite sheet.

  Furthermore, it is described that the heat conduction path portion has a structure in which an insulating sheet is laminated on one side or both sides of a graphite sheet and wound. As a specific example of the winding structure, it is described that one end of a wound strip-shaped graphite sheet is cut from the center portion to form a pair of connection portions, and one of the connection portions is a first casing. It is described that the heat spreader on the heating element in the (main body housing) is brought into contact with the other and the other is connected to the heat radiating portion in the second housing (display housing).

JP 2004-179675 A

  In the graphite sheet winding structure described in FIG. 14 or FIG. 16 of Patent Document 1, only one end of the graphite sheet is pulled out to the outside of the winding structure, and the other end is placed inside the winding structure and wound. Due to the structure, there is a problem in the holding property of the winding shape, and there is a problem in that the winding tends to loosen and the reliability is low when the electronic device casing is repeatedly opened and closed.

  In addition, when the connecting portion 12a-1 extending upward in the winding structure of FIG. 14 or FIG. 16 is fixed to the heat radiating portion 101 as shown in FIG. 18, the connecting portion 12a-1 is placed on the winding portion 13. Therefore, there is a problem that the fixing operation is difficult, and the connecting portion 12a-1 is easily detached from the heat radiating portion 101 even after fixing.

  In view of the above situation, the present invention is capable of transferring heat from the heating element of the first casing to the second casing by being wound around the hinge portion of the foldable electronic device casing, It is an object of the present invention to provide a film-like heat conducting member with improved winding shape retention and adhesion of a film end to a housing, and an electronic device housing including the same.

The present invention is a film-like heat conducting member,
The film-like heat conducting member includes a first region and a second region that extend in the longitudinal direction, and a connection region that extends at an inclination with respect to the longitudinal direction and connects the first region and the second region,
The first region and the second region are formed so as not to overlap with the width of the second region when the width of the first region is extended in the longitudinal direction,
The film-like heat conducting member is a laminated film,
The said laminated | multilayer film is related with a film-form heat conductive member containing the graphite film, the insulating layer arrange | positioned at the surface of the said laminated film, and the adhesion layer arrange | positioned at the back surface of the said laminated film.

  Preferably, the film-like heat conductive member further includes an extension region connected to the first region and / or the second region at an end in a longitudinal direction, and the extension region includes the first region and / or the first region. Or it has a width wider than the width of the second region.

Further, the present invention is an electronic device casing,
The electronic device casing includes a first casing having a heating element, a second casing, a cylindrical hinge portion that connects the first casing and the second casing so as to be opened and closed, and the insulating layer. The film-like heat conducting member according to claim 1, wherein the film-like heat conducting member is wound around the hinge portion in the connection region toward the hinge portion side.
One end of both ends of the film-like heat conducting member in the longitudinal direction is fixed to the vicinity of the heating element by the adhesive layer, and the other end is fixed to the second casing by the adhesive layer. Also related to the body.

  When the film-like heat conducting member of the present invention is wound around the hinge portion at the connection region at the center of the film, both ends of the film are pulled out to the outside of the winding structure and fixed to the vicinity of the heating element or the second housing. be able to. Therefore, the roll shape retention of the film is good and the reliability is excellent.

  In addition, since both ends of the film protrude from the same side with respect to the winding structure when wound around the hinge part, it is easy to affix both ends to the vicinity of the heating element or the second housing, respectively. Hard to peel off later. Furthermore, since the adhesive layer on the back surface of the film faces the same direction with respect to the film surface at both ends of the film, the attaching operation is facilitated also from this viewpoint.

  Furthermore, the film-like heat conducting member of the present invention is bent over the heat conducting member by opening and closing the first housing and the second housing when the film-like heat conducting member is wound around a cylindrical hinge portion and mounted on a foldable electronic device housing. The stress is reduced and the bending resistance of the heat conducting member can be improved.

  In the case where the film-like heat conductive member of the present invention has an extended region, the end area of the laminated film is enlarged, and as a result, the contact area between the laminated film end and the heating element and / or the second housing is increased. Since it can expand, thermal conductivity and heat dissipation can be improved.

Schematic of the film-like heat conducting member according to the first embodiment of the present invention expanded and seen from the top surface of the film The conceptual diagram which shows the state which wound the film-like heat conductive member of FIG. 1 around the hinge part. The top view which shows an example of the electronic device housing | casing which mounts the film-form heat conductive member of FIG. 1 in the state wound around the hinge part FIG. 3 is a side sectional view taken along line AA ′ of FIG. Schematic of the film-like heat conducting member according to the second embodiment of the present invention, as seen from the top surface of the film. Schematic of the film-like heat conducting member according to the third embodiment of the present invention that is unfolded and viewed from the top surface of the film

  Below, based on each figure, the form for implementing this invention is demonstrated concretely.

  FIG. 1 is a schematic view of the film-like heat conductive member according to the first embodiment of the present invention expanded from the top surface of the film, and FIG. 2 is a state in which the film-like heat conductive member of FIG. FIG.

  The film-like heat conducting member 11 of the present invention is made of a film and has a shape in which an elongated band meanders by cutting an upper left region and a lower right region from a rectangle as shown in FIG. More specifically, the film-like heat conducting member 11 has two substantially rectangular regions that extend linearly in the longitudinal direction at both ends, that is, a first region 12 and a second region 13, and And a connection region 14 extending at an angle to the direction. The first area 12 and the second area 13 are connected by a connection area 14. There is no seam between the regions, and the regions are integrally formed.

  In this embodiment, the 1st area | region 12 and the 2nd area | region 13 are located in the both ends in the longitudinal direction of a film. The film-like heat conducting member of the present invention is wound around the hinge portion 21 as shown in FIG. 2 in the connection region 14 located between the first region 12 and the second region 13.

  The vertical direction in FIG. 1 is the longitudinal direction of the film, and the horizontal direction in FIG. 1 is the width direction of the film. The longitudinal direction of the film is a direction perpendicular to the lateral width direction (axial direction) of the hinge portion 21 when the film-like heat conductive member is wound around the hinge portion 21. The film-like heat conducting member 11 is wound around the hinge portion 21 so that the width direction of the film faces the same direction as the lateral width direction of the hinge portion 21. The width 11a of the film-like heat conducting member is less than the lateral width 21a of the cylindrical hinge portion around which the film-like heat conducting member 11 is wound so that both ends in the width direction of the film-like heat conducting member 11 do not protrude from both ends of the hinge portion 21 when wound. And The width 11a of the film-like heat conductive member refers to a width orthogonal to the longitudinal direction from the outer side of the first region to the outer side of the second region.

  The length 11b of the film-like heat conducting member is such that the film-like heat conducting member 11 is wound around the hinge portion 21, and the longitudinal ends of the film-like heat conducting member 11 are extended to the vicinity of the heating element and the second casing, respectively. It is sufficient if the length is sufficient. Accordingly, the width and length of the film-like heat conducting member 11 can vary greatly depending on the size of the electronic device casing on which the film-like heat conducting member 11 is mounted. As an example, the width 11a is about 80 mm and the length 11b. Is about 200 mm. Note that the width 11a may be larger than the length 11b, but even in this case, as described above, the longitudinal direction of the film refers to a direction orthogonal to the lateral width direction of the hinge portion 21 during winding, and the width direction of the film Indicates the same direction as the horizontal width direction of the hinge portion 21 during winding.

  The first region and the second region have widths 12a and 13a, respectively. The width of both regions is such that when the width 12a of the first region is extended in the longitudinal direction, it does not overlap with the width 13a of the second region, that is, the sum of the width 12a of the first region and the width 13a of the second region is the film. It is set so as not to be larger than the width 11a of the heat conductive member. In FIG. 1, although the sum of the width 12a of the first region and the width 13a of the second region is equal to the width 11a of the film-like heat conducting member, it may be smaller than the width 11a of the film-like heat conducting member. Good. That is, the relational expression: width 11a of the film-like heat conducting member ≧ first area width 12a + second area width 13a is satisfied. As a result, as shown in FIG. 2, the film-like heat conducting member 11 is wound around the hinge portion 21 at the connection region 14, and the first region 12 and the second region 13 which are both ends of the film are drawn out to the outside of the winding structure. be able to. If this relationship is not satisfied, the structure shown in FIG. 2 cannot be realized.

  Since both ends in the longitudinal direction of the film-like heat conducting member of the present invention are drawn out of the winding structure without being wound around the hinge portion 21, the first region and the second region located at both ends in the longitudinal direction of the film generate heat. It becomes possible to extend to the vicinity of the body and the second housing. Thereby, the heat generated from the heating element reaches the second housing via the film-like heat conducting member of the present invention, and can be thermally diffused outside there.

  Since the film-like heat conductive member 11 is wound around the hinge portion 21 in the connection region 14, the portion wound around the hinge portion 21 is inclined with respect to the lateral width direction of the hinge portion as shown in FIG. Yes. On the other hand, since the portions drawn out from the winding structure are the first region 12 and the second region 13 that extend linearly in the longitudinal direction, they extend so as to be orthogonal to the lateral width direction of the hinge portion. ing. In FIG. 2, the back surface of the film is shown in black.

  The film-like heat conducting member of the present invention has a structure in which only the central part of the film is wound around the hinge portion, unlike the conventional structure in which one end of the film is placed on the innermost side of the winding structure and wound. Therefore, even after the electronic device casing is repeatedly opened and closed, the initial winding shape can be satisfactorily maintained inside the casing, and the reliability is excellent.

  Both end portions of the hinge portion 21 protrude outward from the end portion in the width direction of the film-like heat conducting member 11, and the protruding both end portions can be fitted into a display unit casing 32 described later.

  The hinge part 21 is a columnar member formed of a metal such as aluminum. In order to reduce the weight, a hollow cylindrical shape is preferable. Moreover, you may have a notch part in a part of cylinder.

  The number of times the film heat conducting member of the present invention is wound around the hinge portion is not particularly limited. However, as the number of times of winding increases, the thermal conductivity of the film-like heat conducting member decreases, so it is preferable that the number of windings is small. Most preferably, as shown in FIG. In addition, according to the winding method of the present invention, the winding shape can be satisfactorily maintained even with only one winding, and the bending stress applied to the heat conducting member is reduced by opening and closing the electronic device casing, The bending resistance of the conductive member can be improved.

  In FIG. 2, both longitudinal ends of the film-like heat conducting member of the present invention protrude from the lower side of the hinge portion 21, and all the adhesive layers on the back surface of the film are arranged on the lower surface side of the film in FIG. 2. Therefore, the work of sticking both ends in the longitudinal direction of the film-like heat conducting member to the vicinity of the heating element or the second housing is easy, and there is an advantage that it is difficult to peel off after the sticking.

  The film-like heat conducting member of the present invention is composed of a laminated film. This laminated film has at least an insulating layer located on the surface of the laminated film, a graphite film layer, and an adhesive layer located on the back surface of the laminated film.

  Since the graphite film is excellent in thermal conductivity, the film-like thermal conductive member of the present invention can exhibit high thermal conductivity by using it as a thermal conductive member. The graphite film is a material having both high thermal conductivity and flexibility, and can be manufactured by baking a polymer film at a high temperature of 2400 ° C. or more to graphitize it. Although it does not specifically limit as a polymer film which can be used for manufacture of a graphite film, For example, a polyimide, polyamide, polyoxadiazole, polybenzothiazole, polybenzobisthiazole, polybenzoxazole, polybenzobisoxazole, polyparaphenylene vinylene , Polybenzimidazole, polybenzobisimidazole, polythiazole and the like. In particular, a polyimide film is preferable. The thickness of the graphite film single layer that can be used in the present invention is preferably about 5 μm to 100 μm.

  The insulating layer on the surface side of the laminated film is a layer that does not have adhesiveness or tackiness at least on the outside, and can be formed from a known resin material. Although it does not specifically limit as a concrete resin material, For example, a polyethylene terephthalate (PET), a polyimide (PI), polyetheretherketone (PEEK) etc. are mentioned. Since the insulating layer on the surface side of the laminated film and the hinge portion 21 are in contact with each other, polyimide and polyether ether ketone are preferable from the viewpoint of friction resistance.

  The film-like heat conducting member is wound around the hinge part 21 with the insulating layer facing the hinge part 21 so that the insulating layer contacts the hinge part 21. For this reason, the graphite film does not directly contact the hinge portion and is protected from friction with the hinge portion. Furthermore, since the film-like heat conducting member of the present invention is wound without being fixed to the hinge portion, the bending stress applied to the heat conducting member is reduced by opening and closing the electrical equipment casing, and the film-like heat conducting member is bent. Resistance can be ensured.

  When laminating the insulating layer on the graphite film, for example, there are a method of heat-sealing a thermoplastic resin film to the graphite film, and a method of bonding a resin film having an adhesive layer or an adhesive layer on one side to the graphite film. It is done. From the viewpoint of flexibility, the latter method is preferred.

  The insulating layer is preferably provided on the surface of the film-like heat conducting member which can come into contact with the hinge portion, but more preferably on the entire surface of the film-like heat conducting member.

  Furthermore, by disposing the adhesive layer on the back side of the laminated film, the film-like heat conducting member of the present invention can be fixed to the vicinity of the heating element and the second housing. The pressure-sensitive adhesive layer may be formed by applying a pressure-sensitive adhesive, or may be a pressure-sensitive adhesive layer previously formed on the surface of the resin film layer, such as a cellophane tape.

  The adhesive layer need not be disposed on the entire back surface of the film-like heat conductive member of the present invention, and may be disposed on a part of the back surface. At this time, it is preferable that the adhesive layer is disposed in the vicinity of the heating element and in the vicinity of both ends of the film-like heat conducting member so as to be fixed to the second housing. In places where the adhesive layer is not disposed, layers other than the adhesive layer may be exposed on the back side of the laminated film.

  The laminated film has a laminated structure in which at least the three layers described above are laminated. In this laminated film, the graphite film may be contained not only in one layer but also in two or more layers. It is preferable that two or more layers of graphite film are included because the thermal conductivity of the film-like heat conducting member can be increased. However, if the number of layers of the graphite film is too large, the flexibility of the film-like heat conducting member is lowered, and there is a possibility that the winding around the hinge portion may be hindered. Most preferably, the graphite film contains two or three layers. The graphite films can be fixed by interposing an adhesive layer between the graphite films. Moreover, the additional insulating layer and / or adhesion layer may be contained in the laminated film.

Although it does not specifically limit, the following can be illustrated as a preferable laminated structure. In this laminated structure, an adhesive layer for integrating them may be disposed between the graphite film and the insulating layer.
・ (Front side): Insulating layer / graphite film / adhesive layer / graphite film / insulating layer / adhesive layer: (back side)
・ (Front side): Insulating layer / graphite film / adhesive layer / graphite film / adhesive layer / graphite film / insulating layer / adhesive layer: (back side)

  The thickness of the entire laminated film can be appropriately determined in consideration of the ease of winding around the hinge portion, and is not particularly limited, but is preferably about 15 μm to 300 μm, for example. When a plurality of graphite film layers are included, the total thickness of the graphite film layers is preferably, for example, about 5 μm to 160 μm from the viewpoint of heat transfer and flexibility.

  The laminated film having a special shape of the present invention can be produced integrally by cutting an unnecessary portion after producing a rectangular laminated film.

  FIG. 3 is a plan view showing an example of an electronic device housing on which the film-like heat conducting member of FIG. 1 is wound around a hinge portion. FIG. 4 is a cross-sectional view taken along the line AA ′ of FIG. It is a sectional side view.

  The electronic device casing 30 shown in FIG. 3 is a foldable notebook personal computer. The casing includes a main body casing (first casing) 31 and a display casing (second casing) 32. The main casing 31 and the display casing 32 are cylindrical hinges. They are connected by the unit 21. The central portion of the hinge portion 21 is held by the main body housing 31, and both end portions are fitted in the display housing 32 without being fixed. By rotating the display housing 32 around the hinge 21, the display housing 32 can be opened and closed with respect to the main body housing 31.

  As described above, the film-like heat conducting member of FIG. 1 is wound around the hinge portion 21, the first region 12 extends inside the main body housing 31, and the second region 13 is the display housing. 32 extends into the interior.

  The main body housing 31 incorporates a printed wiring board on which a microprocessor (heating element) 33 and the like are mounted, a keyboard 34 and the like. A heat diffusion plate (heat spreader) 35 made of a highly heat conductive material such as aluminum, copper, or graphite film is fixed to the upper portion of the microprocessor. In addition, an HDD (Hard Disk Drive), a PCMCIA (Personal Computer Memory Card International Association) card, a battery, and the like are disposed in the main body housing 31, but illustration is omitted.

  The first region 12 extending from the hinge portion 21 is disposed on the heat diffusion plate 35 and is fixed to the heat diffusion plate 35 by an adhesive layer on the back surface of the film. Thus, the first region 12 becomes a heat receiving portion that receives the heat generated from the heating element via the heat diffusion plate 35. However, the arrangement of the heat diffusion plate 35 may be omitted and the first region 12 may be in direct contact with the heating element. When the heat diffusion plate 35 is not provided, the first region 12 may be connected to the printed wiring board. The heat received in the first region 12 is transferred to the second region 13 through the connection region 14.

  A display panel 36 such as a liquid crystal display is mounted on the display unit housing 32. A heat radiating portion 37 is disposed on most of the bottom portion of the display unit casing 32 on the back side of the display panel. The heat radiating part 37 is formed of a high thermal conductivity material such as aluminum, copper, graphite film or the like.

  A second region 13 extending from the hinge portion 21 is disposed on the heat radiating portion 37, and is fixed to the heat radiating portion 37 by an adhesive layer on the back surface of the film. The second region 13 serves as a heat exhaust unit that transfers the heat transmitted from the first region 12 to the heat radiating unit 37. When the heat radiating part 37 is not provided, the second region 13 may be directly attached to the bottom surface of the display unit housing 32.

  With the above configuration, the heat generated in the main body housing 31 with a large calorific value can be moved to the display housing 32 with a small calorific value and efficiently dissipated from the display housing 32. Become.

  The film-like heat conducting member 11 of FIG. 1 described above is an embodiment composed of only the first region 12, the second region 13, and the connection region 14, but the film-like heat conducting member of the present invention is It may include a wide expansion region connected to the outside of the first region and / or the second region (the end side in the film longitudinal direction). This embodiment will be described with reference to FIGS.

  FIG. 5 is a schematic view in which the film-like heat conducting member according to the second embodiment of the present invention is expanded and viewed from the upper surface of the film. This embodiment is different from the embodiment of FIG. 1 in that extended regions 15 and 16 are arranged outside the first region 12 and the second region 13, respectively. In this embodiment, it is not the first region 12 and the second region 13 but the extended regions 15 and 16 that are located at both ends in the longitudinal direction of the film.

  The width of the extension region 15 and the width of the extension region 16 are larger than the width 12a of the first region and the width 13a of the second region, respectively. By providing such an extended region, it is possible to increase the contact area between the heat diffusing plate 35 and the heat radiating part 37 and the film-like heat conducting member, and to carry out heat transfer and heat radiating more efficiently.

  In order to fix the expansion regions 15 and 16 to the heat diffusion plate 35 and the heat radiating portion 37, it is preferable that an adhesive layer is disposed on the back surface of the expansion region.

  In FIG. 5, the width of the expansion region 15 and the width of the expansion region 16 are larger than the width 11a of the film-like heat conduction member, but are not limited to this and smaller than the width 11a of the film-like heat conduction member. May be. However, in the embodiment including the extended region as shown in FIG. 5, the width 11a of the film-like heat conducting member does not include the width of the extended region.

  In FIG. 5, the extended area is arranged outside the first area 12 and the second area 13. However, the present invention is not limited to this, and an extended area is provided in one of the first area 12 and the second area 13. It is not necessary to arrange an extended area on the other side.

  FIG. 6 is a schematic view in which the film-like heat conducting member according to the third embodiment of the present invention is expanded and viewed from the upper surface of the film. This embodiment is the same as the embodiment shown in FIG. 5 in that the expansion regions 15 and 16 are arranged outside the first region 12 and the second region 13, respectively. The difference is that the size of the extended region 16 arranged in the above is greatly increased to be approximately the same as the size of the heat radiating portion 37. Thereby, the exhaust heat from a film-form heat conductive member can be implemented more efficiently.

  When such an enormous expansion area is used, the expansion area 16 itself can be used as a heat dissipation section without separately disposing the heat dissipation section 37. That is, the extended region 16 may be directly fixed to the display unit casing 32 or indirectly fixed to the display unit casing 32 via the heat radiating unit 37.

  In any of the embodiments of FIGS. 5 and 6, the winding method around the hinge portion 21 is the same as that of the first embodiment. That is, the film-like heat conductive member is wound around the hinge portion 21 in the connection region 14, and the first region 12, the second region 13, and the extended regions 15, 16 are drawn out from the winding structure. By having the first region 12 and the second region 13 that linearly extend in the longitudinal direction, the hinge portion 21 can be wound even if the expansion regions 15 and 16 are added.

  5 and 6 may be larger than the length in the longitudinal direction of the film, even in this case, the longitudinal direction and the width direction of the film are the same as those in FIG. As in the case of, the determination is made based on the relationship with the lateral width direction of the hinge portion 21 when the film is wound around the hinge portion 21.

DESCRIPTION OF SYMBOLS 11 Film-shaped heat conductive member 12 1st area | region 13 2nd area | region 14 Connection area | regions 15 and 16 Expansion area | region 21 Hinge part 30 Electronic device housing | casing 31 Main-body part housing | casing (1st housing | casing)
32 Display housing (second housing)
33 Microprocessor (heating element)
34 Keyboard 35 Heat diffusion plate (heat spreader)
36 Display panel 37 Heat dissipation part

Claims (3)

A film-like heat conducting member,
The film-like heat conducting member includes a first region and a second region that extend in the longitudinal direction, and a connection region that extends at an inclination with respect to the longitudinal direction and connects the first region and the second region,
The first region and the second region are formed so as not to overlap with the width of the second region when the width of the first region is extended in the longitudinal direction,
The film-like heat conducting member is a laminated film,
The laminated film is a film-like heat conducting member including a graphite film, an insulating layer arranged on the surface of the laminated film, and an adhesive layer arranged on the back surface of the laminated film.   The film-like heat conducting member further includes an extension region connected to the first region and / or the second region at an end in a longitudinal direction, and the extension region includes the first region and / or the first region. The film-like heat conducting member according to claim 1, having a width wider than the width of the two regions. An electronic device housing,
The electronic device casing includes a first casing having a heating element, a second casing, a cylindrical hinge portion that connects the first casing and the second casing so as to be opened and closed, and the insulating layer. The film-like heat conducting member according to claim 1, wherein the film-like heat conducting member is wound around the hinge portion in the connection region toward the hinge portion side.
One end of both ends of the film-like heat conducting member in the longitudinal direction is fixed to the vicinity of the heating element by the adhesive layer, and the other end is fixed to the second casing by the adhesive layer. body.

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