JP2018006102A - High-frequency heating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-frequency heating apparatus capable of performing heat treatment on both sides of an object to be heated and furthermore forming burnt deposits thereon without using other heat sources such as a heater.SOLUTION: Disclosed is a high-frequency heating apparatus 100 which includes: a first surface wave excitation body 103a, a second surface wave excitation body 103b; a first high-frequency power supply part 110a; a second high-frequency power supply part 110b; and a high-frequency power generation part 120. The first surface wave excitation body 103a and the second surface wave excitation body 103b are installed at positions opposite to each other so as to sandwich an object 102 to be heated.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a high-frequency heating device including a surface wave exciter using a periodic structure.

  2. Description of the Related Art Conventionally, there has been disclosed a technique related to a high frequency heating apparatus that supplies high frequency power to a surface wave exciter using a periodic structure and heats an object to be heated such as food.

  For example, Patent Document 1 discloses a high-frequency heating that can burn a food surface by supplying microwaves to a surface wave transmission line by utilizing the characteristics of surface waves that are strongly heated on the side close to the surface wave exciter. An apparatus is disclosed.

  Patent Document 2 discloses a heating cooker that can heat the upper surface of food by providing a radiant heating source at a position opposite to the surface wave exciter so as to burn the food.

Japanese Utility Model Publication No. 56-98 JP-A-8-210653

  However, among the above-described conventional configurations, particularly in Patent Document 1, since the characteristics of the surface wave that is strongly heated on the side close to the surface wave excitation body are utilized, the portion near the surface wave excitation body is strongly heated, A food with a small thickness is sufficiently heated. However, since the heating becomes weaker as the distance from the surface wave exciter is increased, there is a high possibility that a food with a thickness is insufficiently heated. Moreover, it is difficult to burn the surface of the food opposite to the surface wave exciter regardless of the thickness of the food.

  Moreover, in patent document 2, the whole food can be heated by providing a radiation heating source in the position facing a surface wave exciter, and supplementing the weak part in a surface wave heating with radiation heating, The half-face of the surface wave exciter for food can be burnt, but since it is necessary to equip two kinds of heating sources, the structure becomes complicated and a large electric power is required.

  The present invention solves the above-described conventional problems, and in a high-frequency heating apparatus provided with a surface wave exciter, both surfaces of an object to be heated have a simple structure without using another heat source such as a heater. An object of the present invention is to provide a high-frequency heating apparatus capable of performing heat treatment.

  In order to solve the above-described conventional problems, a high-frequency heating device of the present invention includes a high-frequency power generation unit that generates high-frequency power, and a plurality of surface wave excitations that propagate the high-frequency power by surface waves to heat the object to be heated. A body, a high frequency power supply unit that supplies the high frequency power to the surface wave excitation body, and an installation base on which the object to be heated is installed, and the plurality of surface wave excitation bodies sandwich the object to be heated As shown in FIG.

With this configuration, high-frequency power is supplied to a plurality of surface wave exciters installed at opposite positions so as to sandwich the object to be heated, and the object to be heated is heated with high-frequency power that propagates through the surface wave exciter with surface waves. Therefore, both surfaces of the object to be heated can be heat-treated with a simple structure without using another heat source with high power consumption such as a heater.

  The high-frequency heating device of the present invention heats the object to be heated with the high-frequency power propagating by the surface wave through a plurality of surface wave exciters that are disposed so as to sandwich the object to be heated. Without using another heat source with high power consumption such as a heater, both surfaces of the object to be heated can be heat-treated.

A block diagram showing a basic configuration of the high-frequency heating device according to the first embodiment. Block diagram showing the configuration of the high-frequency power supply unit The figure which shows operation | movement of the high frequency heating apparatus of Embodiment 1. The block diagram which shows the basic composition of the high frequency heating apparatus of Embodiment 2. FIG. The figure which shows operation | movement of the high frequency heating apparatus of Embodiment 2. The block diagram which shows the basic composition of the high frequency heating apparatus of Embodiment 3. The figure which shows operation | movement of the high frequency heating apparatus of Embodiment 3. The figure which shows the mode of change of the surface concentration degree of the electric field when the frequency of the high frequency power is changed

  A first aspect of the invention includes a high-frequency power generation unit that generates high-frequency power, a plurality of surface wave excitation bodies that propagate the high-frequency power by surface waves to heat the object to be heated, and the high-frequency power that is generated by the surface wave excitation. A high-frequency power supply unit that supplies the body, and an installation base on which the object to be heated is installed, and the plurality of surface wave exciters are installed at positions facing each other so as to sandwich the object to be heated. Therefore, both surfaces of the object to be heated can be heat-treated with a simple structure without using another heat source with high power consumption such as a heater.

  In a second aspect of the invention, in the first aspect of the invention, since the high-frequency power is supplied from the high-frequency power generator only to one of the plurality of surface wave exciters, The number can be reduced, and both surfaces of the object to be heated can be heat-treated with a simpler configuration.

  In the third invention, particularly in the first invention, since the high-frequency power is supplied from the high-frequency power generator to each of the plurality of surface wave exciters, the state of heating in each surface wave exciter is determined. It is possible to control in more detail, and it is possible to further improve the finished quality by heating the object to be heated.

  In a fourth aspect of the present invention, in particular, in any one of the first to third aspects, the high-frequency power generator is a variable-frequency high-frequency oscillator that generates high-frequency power of a set frequency. The frequency of the high-frequency power supplied to the can be varied, so the state of heating of the object to be heated can be changed according to preference by changing the propagation state of the high-frequency power propagating through the surface wave exciter with surface waves. Can be made.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the embodiments.

(Embodiment 1)
FIG. 1 is a block diagram showing a basic configuration of a high-frequency heating device 100 according to Embodiment 1 of the present invention.

A high-frequency heating apparatus 100 shown in FIG. 1 is a high-frequency heating apparatus that heats an object to be heated 102 installed on an installation table 101, and includes a first surface wave excitation body 103a and a second surface wave excitation body 103b. The first high-frequency power supply unit 110a, the second high-frequency power supply unit 110b, and the high-frequency power generation unit 120 are provided. Further, the first surface wave exciter 103a and the second surface wave exciter 103b are installed at positions facing each other so as to sandwich the object to be heated 102 therebetween.

  In FIG. 1, the high frequency heating apparatus 100 includes two surface wave excitation bodies, two high frequency power supply units, and one high frequency power generation unit. And the number of high frequency electric power generation parts is not limited to this. For example, the number of surface wave exciters may be four, and an object to be heated may be sandwiched from four directions. At least one of the high frequency power generation unit and the high frequency power supply unit may be in one surface wave exciter. There may be two or more.

  In FIG. 1, the high frequency power generated by the high frequency power generation unit 120 is supplied to the first surface wave exciter 103a via the first high frequency power supply unit 110a and then through the second high frequency power supply unit 110b. Are supplied to the two surface wave exciters 103b. Then, the high frequency power supplied to the first surface wave excitation body 103a and the second surface wave excitation body 103b propagates through the surface wave excitation bodies by surface waves and heats the object to be heated 102. In the following description, the first surface wave exciter 103a and the second surface wave exciter 103b are not particularly distinguished from the first high frequency power supply unit 110a and the second high frequency power supply unit 110b. The wave exciter 103 and the high frequency power supply unit 110 may be described.

  The high-frequency power generation unit 120 is a high-frequency transmitter that outputs high-frequency power having a frequency (for example, a microwave) and power suitable for heating the object to be heated 102. For example, it may be composed of a magnetron and an inverter power supply circuit, or may be composed of a solid state oscillator and a power amplifier.

  A magnetron is a type of oscillation vacuum tube that generates a powerful non-coherent microwave, which is a type of radio wave, and is often used for high output applications of several hundred watts to several kilowatts such as radars and microwave ovens. Since a high voltage of several kilovolts is necessary for driving the magnetron, an inverter power supply is generally used as a drive power supply for the magnetron. The inverter power supply is a power supply circuit composed of a converter circuit having a rectifying function and an inverter circuit having a step-up (or step-down) function and an output frequency conversion function, and is a technique widely used for lighting devices and motor control.

  On the other hand, a solid-state oscillator is a semiconductor oscillation circuit in which a feedback circuit is configured by a high-frequency electronic component such as a transistor, a capacitor, an inductor, and a resistor, and is a technique widely used in low-power output oscillators such as communication equipment. . In recent years, high-frequency power output from solid-state oscillators has a high output of about 50 watts, but is generally about several tens to several hundreds of milliwatts, and is several hundred watts for use in heat treatment applications. Therefore, generally, high frequency power output from a solid-state oscillator is amplified by a power amplifier such as a transistor.

  The high frequency power supply unit 110 corresponds to a power connection unit that supplies the high frequency power generated by the high frequency power generation unit 120 to the surface wave exciter 103. The configuration of the high frequency power supply unit 110 will be described later.

The surface wave exciter 103 is formed of a metal periodic structure in which impedance elements are periodically arranged with a metal plate, or a dielectric plate. For example, in a metal periodic structure, a stub type surface wave exciter in which a plurality of metal flat plates are arranged on a metal flat plate in a direction to stand toward the object to be heated, or an interdigital device in which metal flat plates are punched in a cross-finger shape. A type surface wave exciter can be used, and an alumina plate or a bakelite plate can be used as the dielectric plate.

  The surface wave exciter 103 can propagate the high frequency power supplied from the high frequency power generation unit 120 via the high frequency power supply unit 110 in a surface wave and concentrate the high frequency power near the surface. As a result, the installation table 101 is provided in the vicinity of the surface wave exciter 103, and the object to be heated 102 is installed on the installation table 101, whereby the surface wave exciter 103 concentrates on the surface near the surface, The article to be heated 102 is heated.

  Here, the configuration of the first high-frequency power supply unit 110a and the second high-frequency power supply unit 110b in the present embodiment will be described with reference to the drawings.

  FIG. 2 is a block diagram illustrating an example of the configuration of the first high-frequency power supply unit 110a.

  In the drawing, the configuration when the high frequency power generated by the high frequency power generation unit 120 is guided to the first high frequency power supply unit 110a using the rectangular waveguide 130 is shown.

  The rectangular waveguide 130 is the most common waveguide, and is a metal tube having a square (generally rectangular) cross-sectional shape, and is a hollow waveguide mainly used for microwave transmission. is there. The electromagnetic wave propagates in the tube while forming an electromagnetic field corresponding to the shape, size, wavelength or frequency in the tube.

  In order to supply the high-frequency power propagated from the high-frequency power generator 120 to the first surface wave exciter 103a by the rectangular waveguide 130, the rectangular waveguide 130 and the first surface wave exciter 103a are tapered. By connecting with the rectangular waveguide 131 having a shape, reflection at the joint is reduced, and loss can be reduced. The first high-frequency power supply unit 110a includes a part of the rectangular waveguide 130, a tapered rectangular waveguide 131, and a part of the surface wave exciter 103, as shown by the broken line in FIG. Has been.

  As a result, the high-frequency power generated by the high-frequency power generation unit 120 and guided to the first high-frequency power supply unit 110a via the rectangular waveguide 130 is transmitted through the tapered rectangular waveguide 131 to the first. Is efficiently supplied to the surface wave exciter 103a. Note that the second high-frequency power supply unit 110b has the same configuration as the first high-frequency power supply unit 110a, and a description thereof will be omitted.

  With the configuration as described above, the high-frequency heating device 100 according to the present embodiment converts the high-frequency power generated by the high-frequency power generation unit 120 into the first high-frequency power supply unit 110a and the second high-frequency power supply unit 110b. Then, the first surface wave exciter 103a and the second surface wave exciter 103b are propagated by surface waves by being supplied to the first surface wave exciter 103a and the second surface wave exciter 103b. By using the high-frequency power to be applied, heat treatment can be performed on both surfaces of the object to be heated 102 installed on the installation table 101 without using another heat source such as a heater, and further, both sides of the object to be heated 102 are burnt. Can also be attached.

  In particular, when using the heater of the conventional example, if the object to be heated is burnt, power consumption is about 800 W to 1000 W. However, when using the high frequency power generator in the present invention, the power consumption is low. Since it only takes about 100W to 200W, it has excellent energy saving performance. In addition, although the surface and the inside of the object to be heated become a hard texture in the heater, if the surface wave exciter is used in the overall configuration of the present invention, the surface of the object to be heated is hardened but the inside becomes a soft finish. , Can produce a different texture than when using a heater.

  Next, the operation | movement which heat-processes the to-be-heated material 102 of the above-mentioned high frequency heating apparatus 100 is demonstrated.

  FIG. 3 shows the surface wave exciter 103 when the high frequency power generated by the high frequency power generator 120 is supplied to the surface wave exciter 103 shown in FIG. 3 schematically shows the state of the electric field intensity distribution in the vicinity of the surface of each surface wave exciter 103 of the high-frequency power propagating in FIG.

  FIG. 3A shows the first surface when the high-frequency power generated by the high-frequency power generator 120 is supplied to the first surface wave exciter 103a via the first high-frequency power supply unit 110a. FIG. 3B shows the electric field intensity distribution 140a in the vicinity of the surface of the wave exciter 103a. FIG. 3B shows the first surface wave exciter 103a with the high frequency power generated by the high frequency power generator 120 as the first high frequency. The object to be heated 102 is heated by the electric field strength distribution 140b in the vicinity of the surface of the first surface wave exciter 103a when the object to be heated 102 is installed on the installation table 101 by being supplied through the power supply unit 110a. In FIG. 3C, the second surface wave exciter 103b is disposed so as to sandwich the object to be heated 102 with respect to the first surface wave exciter 103a, and is generated by the high frequency power generator 120. Generated high frequency power, the first The surface wave exciter 103a is supplied via the first high-frequency power supply unit 110a, and the second surface wave exciter 103b is supplied via the second high-frequency power supply unit 110b so that the installation table 101 is covered. The state in which the object to be heated 102 is heated by the electric field intensity distribution 140c in the vicinity of the surfaces of the first surface wave exciter 103a and the second surface wave exciter 103b when the heated object 102 is installed is shown respectively. ing.

  Here, the electric field strength distributions 140a, 140b, and 140c represent the strength of the electric field by the density of the color, and the darker the color, the stronger the electric field.

  As shown in FIG. 3A, when the high-frequency power generated by the high-frequency power generation unit 120 is supplied to the first surface wave exciter 103a via the first high-frequency power supply unit 110a, the first surface wave The high frequency power supplied to the exciter 103a propagates through the first surface wave exciter 103a as a surface wave, so that the electric field strength distribution 140a in the vicinity of the surface of the first surface wave exciter 103a is The electric field in the vicinity of the surface of the surface wave excitation body 103a becomes strong, and the electric field has a distribution that becomes exponentially weak as the distance from the surface of the first surface wave excitation body 103a increases.

  Further, as shown in FIG. 3B, the high-frequency power generated by the high-frequency power generator 120 is applied to the first surface wave exciter 103a in a state where the object to be heated 102 is installed on the installation table 101. When supplied through one high-frequency power supply unit 110a, the electric field intensity distribution 140b near the surface of the first surface wave exciter 103a is the same as that of FIG. Since the electric field in the vicinity of the surface of the first surface wave excitation body 103a increases and the electric field becomes weaker as the distance from the surface of the first surface wave excitation body 103a increases, the portion of the object 102 to be heated close to the first surface wave excitation body 103a (to be heated) The lower surface portion of the object 102 is heated intensively and the portion far from the first surface wave exciter 103a (the upper surface portion of the object to be heated 102) is heated very weakly or hardly heated.

Further, as shown in FIG. 3C, in a state where the object to be heated 102 is installed on the installation table 101, the second surface wave is interposed between the first surface wave excitation body 103a and the object to be heated 102. The exciter 103b is disposed, and the high-frequency power generated by the high-frequency power generator 120 is transferred to the first surface wave exciter 103a via the first high-frequency power supplier 110a. When supplied to the second surface wave exciter 103b through the first surface wave exciter 103b, the electric field strength distribution 140c in the space between the first surface wave exciter 103a and the second surface wave exciter 103b is Since the electric field in the vicinity of the surfaces of the exciter 103a and the second surface wave exciter 103b becomes strong and the electric field becomes weak as the distance from the surface increases, the respective first surface wave exciters 103 of the object to be heated 102 have a distribution. The portions close to the second surface wave exciter 103b (upper and lower surface portions of the object to be heated 102) are intensively and strongly heated and are sandwiched between the first surface wave exciter 103a and the second surface wave exciter 103b. The intermediate portion of the space (the intermediate layer portion of the object to be heated 102) is in a state of being weakly heated. Thereby, both surfaces of the object to be heated 102 installed on the installation table 101 can be subjected to heat treatment, and further, the upper surface and the lower surface part of the object to be heated 102 can be mainly scorched.

  In addition, by using surface wave exciters having the same excitation frequency for the plurality of surface wave exciters 103, the design of the apparatus is facilitated, and the heating state by each surface wave exciter is balanced, and the finished product is finished. Quality can be improved.

  The excitation frequency of the surface wave exciter is determined by the material used, physical structure dimensions, and the like. For example, in the stub type surface wave exciter described above, the excitation frequency of the surface wave exciter can be changed by changing the height dimension of a plurality of metal flat plates arranged on the metal flat plate or the interval dimension of the metal flat plates. A surface wave exciter having a desired excitation frequency can be formed. In principle, the excitation frequency of the surface wave exciter increases as the height of the metal flat plate decreases, and increases as the distance between the metal flat plates decreases. By doing so, a surface wave exciter having a desired excitation frequency can be formed.

  In the present invention, the surface wave exciter having the same excitation frequency may be used for the plurality of surface wave exciters 103 by adjusting the excitation frequency of the surface wave exciter as described above.

  In the high-frequency heating device 100 of FIG. 1, the first high-frequency power supply unit 110 a and the second high-frequency power supply unit 110 b are provided for the first surface wave excitation body 103 a and the second surface wave excitation body 103 b. Although it is described that the high-frequency power from the high-frequency power generator 120 is supplied from the same direction in the same direction, the high-frequency power to the first surface wave exciter 103a and the second surface wave exciter 103b is supplied. The supply direction may be the reverse direction or other directions.

(Embodiment 2)
Embodiment 2 of the present invention will be described below with reference to the drawings.

  In the description of the second embodiment, components having the same functions as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted. Also, the description of the contents having the same functions and effects as those of the first embodiment is omitted.

  FIG. 4 is a block diagram showing a configuration of the high-frequency heating device 200 according to Embodiment 2 of the present invention.

  The high-frequency heating device 200 shown in the figure is different from the high-frequency heating device 100 according to the first embodiment shown in FIG. 1 in place of the first surface wave excitation body 103a and the second surface wave excitation body 103b. 1 surface wave excitation body 203a and second surface wave excitation body 203b, a high frequency power supply section 210 instead of the first high frequency power supply section 110a and the second high frequency power supply section 110b, and a high frequency power generation section A high frequency power generation unit 220 is provided instead of 120.

  In FIG. 4, the high-frequency heating device 200 includes two surface wave exciters, one high-frequency power supply unit, and one high-frequency power generation unit. The numbers of wave exciters, high frequency power supply units, and high frequency power generation units are not limited to this.

The high frequency power generated by the high frequency power generation unit 220 is supplied to the first surface wave exciter 203a via the high frequency power supply unit 210. The high-frequency power supplied to the first surface wave excitation body 203a propagates through the first surface wave excitation body 203a by surface waves to heat the object to be heated 102, and also the first surface wave excitation body 203a. A part of the high-frequency power propagating through the surface wave is also supplied to the second surface wave excitation body 203b disposed at a position facing the first surface wave excitation body 203a by spatial coupling. Then, the object to be heated 102 is heated by propagating the second surface wave exciter 203b with the surface wave. In the following description, the first surface wave exciter 203a and the second surface wave exciter 203b are not particularly distinguished and may be referred to as the surface wave exciter 203 in some cases.

  The configurations of the surface wave excitation body 203, the high frequency power supply section 210, and the high frequency power generation section 220 are the same as those of the surface wave excitation body 103, the high frequency power supply section 110, and the high frequency power described in the first embodiment. Since it is the same as the structure of the electric power generation part 120, description is abbreviate | omitted.

  With the above configuration, the high-frequency heating device 200 according to the present embodiment is arranged so that the high-frequency power generated by the high-frequency power generation unit 220 is sandwiched between the object to be heated 102 via the high-frequency power supply unit 210. The first surface wave exciter 203a, which is one of the first surface wave exciter 203a and the second surface wave exciter 203b, is supplied only to the first surface wave exciter 203a. The high-frequency power propagating through the surface wave exciter 203a and the second surface wave exciter 203b with surface waves has a simple configuration and does not use another heat source such as a heater, and is installed on the installation table 101. Heat treatment can be performed on both surfaces of the heated object 102, and further, both surfaces of the object to be heated 102 can be burnt.

  Next, the operation | movement which heat-processes the to-be-heated material 102 of the above-mentioned high frequency heating apparatus 200 is demonstrated.

  5 shows the first surface wave when the high frequency power generated by the high frequency power generator 220 is supplied to the first surface wave exciter 203a shown in FIG. High-frequency power propagating through the surface wave through the excitation body 203a and the second surface wave excitation body 203b, respectively, and the intensity distribution of the electric field in the vicinity of the surfaces of the first surface wave excitation body 203a and the second surface wave excitation body 203b Is schematically shown.

  As shown in FIG. 5, when the high frequency power generated by the high frequency power generator 220a is supplied to the first surface wave exciter 203a via the high frequency power supply unit 210, the first surface wave exciter 203a is supplied to the surface wave. The electric field distribution 240a in which the electric field concentrates in the vicinity of the surface of the first surface wave exciter 203a is formed by the high-frequency power 250a propagating through the first wave, and the object to be heated 102 is sandwiched by the spatial coupling of radio waves. A part of the high-frequency electric power 250a propagating through the first surface wave excitation body 203a by the surface wave is supplied to the second surface wave excitation body 203b disposed at a position facing the surface wave excitation body 203a of the second surface wave excitation body 203a. An electric field distribution 240b in which an electric field concentrates in the vicinity of the surface of the second surface wave exciter 203b is formed by the high frequency power 250b propagating through the surface wave exciter 203b by the surface wave.

  Thus, by supplying high-frequency power only to one of the surface wave excitation bodies 203 of the surface wave excitation bodies 203 arranged at opposite positions so as to sandwich the object to be heated 102, both first surface wave excitation bodies are provided. High-frequency power is propagated by surface waves through 203a and the second surface wave exciter 203b, and heat treatment is performed on both surfaces of the object to be heated 102 installed on the installation table 101 without using another heat source such as a heater. In addition, both sides of the object to be heated 102 can be scorched.

In particular, when using the heater of the conventional example, if the object to be heated is burnt, power consumption is about 800 W to 1000 W. However, when using the high frequency power generator in the present invention, the power consumption is low. Since it only takes about 100W to 200W, it has excellent energy saving performance. Also, in the heater, the surface and the inside of the object to be heated become a hard texture, but when the surface wave exciter is used in the overall configuration of the present invention, the surface of the object to be heated is hardened even if the surface is hardened, It is possible to produce a texture that is different from when a heater is used.

  Here, in the high-frequency heating device 200 of FIG. 4, the high-frequency power from the high-frequency power generation unit 220 is applied to the first surface wave exciter 203 a located in the lower surface direction of the object to be heated 102 via the high-frequency power supply unit 210. Although described so as to be supplied, the second surface wave exciter 203b positioned in the upper surface direction of the object to be heated 102 may be supplied.

(Embodiment 3)
Hereinafter, Embodiment 3 of the present invention will be described with reference to the drawings.

  In the description of the third embodiment, the same reference numerals are given to components having the same functions as those in the first embodiment or the second embodiment, and the description thereof is omitted. Also, the description of the content having the same action as in the first embodiment or the second embodiment is omitted.

  FIG. 6 is a block diagram showing a configuration of a high-frequency heating device 300 according to Embodiment 3 of the present invention.

  The high-frequency heating device 300 shown in the figure is different from the high-frequency heating device 100 according to the first embodiment shown in FIG. 1 in place of the first surface wave excitation body 103a and the second surface wave excitation body 103b. 1 surface wave exciter 303a and second surface wave exciter 303b, and instead of the first high frequency power supply unit 110a and the second high frequency power supply unit 110b, the first high frequency power supply unit 310a and the second high frequency power supply unit 110b A high frequency power supply unit 310b is provided, and a first high frequency power generation unit 320a and a second high frequency power generation unit 320b are provided instead of the high frequency power generation unit 120. In FIG. 6, the high-frequency heating apparatus 300 includes two surface wave exciters, two high-frequency power supply units, and two high-frequency power generation units. And the number of high frequency electric power generation parts is not limited to this.

  The high frequency power generated by the first high frequency power generation unit 320a is supplied to the first surface wave exciter 303a via the first high frequency power supply unit 310a. The high-frequency power supplied to the first surface wave excitation body 303a propagates through the first surface wave excitation body 303a by surface waves to heat the object to be heated 102, and the first surface wave excitation body 303a. A part of the high frequency power propagating through the surface wave is also supplied to the second surface wave exciter 303b disposed at a position facing the first surface wave exciter 303a by spatial coupling. Then, the object to be heated 102 is heated by propagating through the second surface wave exciter 303b by the surface wave.

  On the other hand, the high frequency power generated by the second high frequency power generation unit 320b is supplied to the second surface wave exciter 303b via the second high frequency power supply unit 310b. The high-frequency power supplied to the second surface wave excitation body 303b propagates through the second surface wave excitation body 303b with the surface wave to heat the object to be heated 102, and at the same time, the second surface wave excitation body 303b. Part of the high frequency power propagating through the surface wave is also supplied to the first surface wave excitation body 303a disposed at a position facing the second surface wave excitation body 303b by spatial coupling. Then, the object to be heated 102 is heated by propagating through the first surface wave exciter 303a by the surface wave.

In the following, the first surface wave excitation body 303a and the second surface wave excitation body 303b, the first high frequency power supply unit 310a and the second high frequency power supply unit 310b, and the first high frequency power generation unit 320a and the second high frequency power generation unit 320b are not particularly distinguished from each other, and may be referred to as a surface wave exciter 303, a high frequency power supply unit 310, and a high frequency power generation unit 320.

  The configurations of the surface wave excitation body 303, the high frequency power supply section 310, and the high frequency power generation section 320 are the same as those of the surface wave excitation body 103, the high frequency power supply section 110, and the high frequency power described in the first embodiment. Since it is the same as the structure of the electric power generation part 120, description is abbreviate | omitted.

  With the configuration as described above, the high-frequency heating device 300 according to the present embodiment is arranged such that the first surface wave excitation body 303a and the second surface wave excitation body 303b face each other with the object to be heated 102 interposed therebetween. Then, the high frequency power generated by the first high frequency power generation unit 320a is supplied to the first surface wave exciter 303a via the first high frequency power supply unit 310a, and the second high frequency power generation unit By supplying the high-frequency power generated in 320b to the second surface wave exciter 303b via the second high-frequency power supply unit 310b, the first surface wave exciter 303a and the second surface wave exciter 303b are supplied. The high-frequency power propagating through the body 303b by surface waves can heat both surfaces of the object to be heated 102 installed on the installation table 101 without using another heat source such as a heater. It is also possible to apply browning on both sides of the heated object 102.

  Next, the operation | movement which heat-processes the to-be-heated material 102 of the above-mentioned high frequency heating apparatus 300 is demonstrated.

  FIG. 7 shows that the first high frequency power generator 320a and the second high frequency power generator 320b generate the first surface wave exciter 303a and the second surface wave exciter 303b shown in FIG. When the high frequency power supplied through the first high frequency power supply unit 310a and the second high frequency power supply unit 310b is applied to the first surface wave excitation body 303a and the second surface wave excitation body 303b, respectively The high-frequency power propagating by the waves and the state of the electric field intensity distribution in the vicinity of the surfaces of the first surface wave exciter 303a and the second surface wave exciter 303b are schematically shown.

  As shown in FIG. 7, when the high-frequency power generated by the first high-frequency power generation unit 320a is supplied to the first surface wave exciter 303a via the first high-frequency power supply unit 310a, the above-described implementation is performed. Similarly to the second embodiment, the high-frequency power 350a propagating through the first surface wave excitation body 303a by the surface wave forms an electric field distribution in which the electric field concentrates in the vicinity of the surface of the first surface wave excitation body 303a. As a result of the spatial coupling, a part of the high-frequency power 350a propagating through the first surface wave exciter 303a by the surface wave is also supplied to the second surface wave exciter 303b. Due to the high-frequency power 350b propagating by the waves, an electric field distribution is formed in which the electric field is concentrated near the surface of the second surface wave exciter 303b.

  Similarly, when the high frequency power generated by the second high frequency power generator 320b is supplied to the second surface wave exciter 303b via the second high frequency power supply unit 310b, the second surface wave exciter 303b is supplied. The high-frequency power 350c propagating through the surface wave forms an electric field distribution in which the electric field concentrates near the surface of the second surface wave exciter 303b, and the first surface wave exciter 303a is coupled to the first surface wave exciter 303a by spatial coupling of radio waves. Also, a part of the high-frequency power 350c propagating through the second surface wave excitation body 303b by the surface wave is supplied, and the first surface wave is generated by the high-frequency power 350d propagating through the first surface wave excitation body 303a by the surface wave. An electric field distribution in which the electric field concentrates is also formed near the surface of the exciter 303a.

Accordingly, the high-frequency power 351a propagating through the surface acoustic wave through the first surface wave exciter 303a is generated by spatial coupling from the high-frequency power 350a supplied from the first high-frequency power generator 320a and the second surface wave exciter 303b. The electric field distribution 343a near the surface of the first surface wave exciter 303a is the sum of the supplied high frequency power 350d and the electric field intensity distribution formed by the high frequency power 350a supplied from the first high frequency power generator 320a. And the second surface wave exciter 3
It is formed as the sum of the electric field intensity distribution formed by the high-frequency power 350d supplied by space coupling from 03b.

  Similarly, the high frequency power 351b propagating by the surface wave through the second surface wave exciter 303b is coupled to the high frequency power 350c supplied from the second high frequency power generator 320b and the first surface wave exciter 303a. The electric field distribution 343b near the surface of the second surface wave exciter 303b is also the electric field strength formed by the high frequency power 350c supplied from the second high frequency power generator 320b. It is formed as the sum of the distribution and the electric field strength distribution formed by the high frequency power 350b supplied from the first surface wave exciter 303a by spatial coupling.

  Thus, the first surface wave excitation is performed by supplying high-frequency power to each of the first surface wave excitation body 303a and the second surface wave excitation body 303b that are arranged to face each other so as to sandwich the object to be heated 102. Since the balance state of the high-frequency powers 351a and 351b propagating by surface waves through both the body 303a and the second surface wave excitation body 303b can be changed, heating unevenness and heating adjustment can be changed. A variety of well-balanced heat treatments can be performed on both surfaces of the object to be heated 102 installed in the apparatus. Further, both surfaces of the object to be heated 102 can be burnt.

  Here, in the high-frequency heating device 300 of FIG. 6, the first high-frequency power supply unit 310a and the second high-frequency power supply unit 310b with respect to the first surface wave excitation body 303a and the second surface wave excitation body 303b. Are provided in the same direction, and the high-frequency power from the first high-frequency power generation unit 320a and the second high-frequency power generation unit 320b is supplied from the same direction, but the respective surface wave exciters 303a and 303b are provided. The direction in which the high frequency power is supplied may be the reverse direction or other directions.

  Further, in the high-frequency heating device 100 of the first embodiment shown in FIG. 1, the high-frequency heating device 200 of the second embodiment shown in FIG. 4, and the high-frequency heating device 300 of the third embodiment shown in FIG. However, the high-frequency power generators 120, 220, 320a, and 320b may be variable-frequency high-frequency oscillators that generate high-frequency power having a set frequency.

  A frequency variable high frequency oscillator can be realized by using a voltage variable element (for example, a varactor diode) as an element for determining the resonance frequency of the resonance circuit constituting the semiconductor oscillation circuit described above, and is generally a VCO (Voltage Controlled). Oscillator). Since the technique of VCO is well known, detailed description is omitted. In this case, the frequency can be changed by supplying voltage information corresponding to the frequency to the VCO by providing a control unit or the like.

  Furthermore, a PLL (Phase Locked Loop) oscillator including a reference signal generator and a phase comparator may be configured. Since the technology of the PLL oscillator is known, a detailed description is omitted. In this case, the frequency can be changed by supplying an information signal corresponding to the frequency to the phase comparator by providing a control unit or the like.

  By changing the frequency of the high frequency power supplied to the surface wave exciter, the intensity distribution of the electric field formed in the vicinity of the surface of the surface wave exciter can be changed.

FIG. 8 is a diagram showing how the surface concentration of the electric field formed near the surface of the surface wave exciter changes when the frequency of the high-frequency power supplied to the surface wave exciter is changed. The graph shows the magnitude of the electric field strength with respect to the distance from the surface of the surface wave exciter in relation to the frequency of the high frequency power supplied to the surface wave exciter and the excitation frequency of the surface wave exciter. The horizontal axis indicates the distance from the surface of the surface wave exciter, and the vertical axis indicates the magnitude of the electric field strength. The larger the slope of the graph, the more the electric field is concentrated on the surface of the surface wave exciter. Means.

  FIG. 8A shows the electric field strength with respect to the distance from the surface of the surface wave exciter when the frequency (fp) of the high frequency power supplied to the surface wave exciter is lower than the excitation frequency (fc) of the surface wave exciter. FIG. 8B shows a surface wave exciter when the frequency (fp) of the high frequency power supplied to the surface wave exciter is approximately equal to the excitation frequency (fc) of the surface wave exciter. FIG. 8C shows a graph 402 of the magnitude of the electric field strength with respect to the distance from the surface of FIG. 8C. The frequency (fp) of the high frequency power supplied to the surface wave exciter is higher than the excitation frequency (fc) of the surface wave exciter. A graph 403 of the magnitude of the electric field strength with respect to the distance from the surface of the surface wave exciter at a high time is shown.

  As shown in FIG. 8B, when the frequency (fp) of the high-frequency power supplied to the surface wave exciter is set to be substantially equal to the excitation frequency (fc) of the surface wave exciter, The gradient of the electric field strength magnitude graph 402 with respect to the distance is the largest, and the electric field is most concentrated on the surface of the surface wave exciter, that is, the electric field strength in the vicinity of the surface of the surface wave exciter is very large. Since the electric field strength rapidly decreases as the distance from the surface increases, the surface of the object to be heated is intensively heated and is suitable for scorching.

  Further, as shown in FIG. 8A, when the frequency (fp) of the high-frequency power supplied to the surface wave exciter is set to a frequency lower than the excitation frequency (fc) of the surface wave exciter, the surface of the surface wave exciter is The gradient of the electric field strength graph 401 with respect to the distance of the surface wave becomes gentle, and the concentration of the electric field on the surface of the surface wave exciter becomes small. That is, the electric field strength near the surface of the surface wave exciter is large, Even if you move away from the surface of the surface wave exciter, there is no sudden drop in electric field strength, and high-frequency power reaches a distance from the surface of the surface wave exciter. ing.

  Further, as shown in FIG. 8C, when the frequency (fp) of the high frequency power supplied to the surface wave exciter is set higher than the excitation frequency (fc) of the surface wave exciter, the surface wave exciter is separated from the surface. The gradient of the electric field strength graph 403 with respect to the distance of the surface wave becomes almost zero, and the electric field is not concentrated at all on the surface of the surface wave exciter, that is, the high frequency power supplied to the surface wave exciter is It means a state where the body is radiated to the space without propagating with surface waves, so it is suitable for heating the entire object to be heated relatively uniformly.

  As described above, the high-frequency power generation unit 120 in the high-frequency heating device 100 of the first embodiment shown in FIG. 1, the high-frequency power generation unit 220 in the high-frequency heating device 200 of the second embodiment shown in FIG. The heating pattern can be freely changed by using a variable frequency high frequency oscillator for the first high frequency power generation unit 320a and the second high frequency power generation unit 320b in the high frequency heating apparatus 300 of the third embodiment shown in FIG. In other words, both surfaces of the object to be heated 102 installed on the installation table 101 can be subjected to heat treatment with various finishes, and further can be appropriately burnt.

  In addition, the high frequency heating apparatus in Embodiments 1-3 may have a basic configuration similar to a general cooking microwave oven. That is, a heating chamber that heats an object to be heated is provided inside a substantially rectangular parallelepiped casing, and a high-frequency power generation unit including a magnetron that supplies high-frequency power to the heating chamber is provided in the lower part of the casing and the side of the casing. A waveguide for supplying microwaves from the high-frequency power generation unit to the heating chamber is further provided, a surface wave exciter is provided as a heating unit at the lower portion, back portion, or upper portion of the heating chamber, and for opening and closing the heating chamber. The entire structure may be such that a door is installed on the front surface of the housing and a door choke groove for preventing electromagnetic wave leakage is provided around the door.

  As described above, the high-frequency heating device according to the present invention has been described based on each embodiment, but the present invention is not limited to this embodiment. Unless it deviates from the meaning of this invention, the form which carried out the various deformation | transformation which those skilled in the art can think to the said embodiment, and the form constructed | assembled combining the component in a different embodiment is also contained in the scope of the present invention. .

  The present invention relates to a high-frequency heating apparatus that heats an object to be heated by supplying high-frequency power to a surface wave exciter, and has a simple structure that allows both surfaces of the object to be heated to be used without using other heat sources such as a heater. Since it can be heat-treated and further burnt, it is useful as a cooking appliance such as a microwave heater.

100, 200, 300 High-frequency heating device 101 Installation table 102 Object to be heated 103a, 203a, 303a First surface wave exciter 103b, 203b, 303b Second surface wave exciter 110 High frequency power supply unit 110a, 310a First High-frequency power supply unit 110b, 310b Second high-frequency power supply unit 120, 220 High-frequency power generation unit 130 Rectangular waveguide 131 Tapered rectangular waveguide 140a, 140b, 140c, 240a, 240b, 343a, 343b Electric field intensity distribution 210 High frequency power supply unit 250a, 250b High frequency power 320 High frequency power generation unit 320a First high frequency power generation unit 320b Second high frequency power generation unit 350a, 350b, 350c, 350d, 351a, 351b High frequency power

Claims (4)

A high-frequency power generator for generating high-frequency power;
A plurality of surface wave exciters for heating the object to be heated by propagating the high frequency power by surface waves;
A high frequency power supply unit for supplying the high frequency power to the surface wave exciter;
An installation base for installing the object to be heated;
The high-frequency heating device, wherein the plurality of surface wave exciters are installed at opposing positions so as to sandwich the object to be heated. The high-frequency heating device according to claim 1, wherein the high-frequency power is supplied from the high-frequency power generation unit to only one of the plurality of surface wave excitation bodies. The high frequency heating device according to claim 1, wherein the high frequency power is supplied from the high frequency power generation unit to each of the plurality of surface wave exciters. The high-frequency heating device according to claim 1, wherein the high-frequency power generation unit is a variable-frequency high-frequency oscillator that generates high-frequency power having a set frequency.

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