JP2018003095A - Mask adsorption equipment - Google Patents

Mask adsorption equipment Download PDF

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JP2018003095A
JP2018003095A JP2016131735A JP2016131735A JP2018003095A JP 2018003095 A JP2018003095 A JP 2018003095A JP 2016131735 A JP2016131735 A JP 2016131735A JP 2016131735 A JP2016131735 A JP 2016131735A JP 2018003095 A JP2018003095 A JP 2018003095A
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mask
pole
substrate
magnet
surface side
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JP6309048B2 (en
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崇 竹見
Takashi Takemi
崇 竹見
大介 青沼
Daisuke Aonuma
大介 青沼
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Canon Tokki Corp
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Canon Tokki Corp
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Priority to JP2016131735A priority Critical patent/JP6309048B2/en
Priority to KR1020170081318A priority patent/KR102027645B1/en
Priority to CN201710518667.4A priority patent/CN107557730B/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
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Abstract

PROBLEM TO BE SOLVED: To provide a mask adsorption equipment of a high universal quality capable of adsorbing various masks excellently by a substrate, without arraying magnets for various masks of different mask patterns.SOLUTION: A mask adsorption equipment is mounted on the surface side of a substrate 1 and is caused to adsorb a mask 2 disposed on the surface side of a substrate 1, and is adsorbed by a magnetic force to the mask 2 disposed on the surface side of the substrate 1. Magnet arrays 5, which are constituted by arranging an N-pole portion 3 of an N pole on a face confronting said mask 2 and an S-pole 4 portion of an S pole on a face confronting said mask, are juxtaposed at an interval having a longitudinal direction arranged and capable of opposing said mask 2. The magnetic arrays 5 are juxtaposed over a region entirety at an interval in the longitudinal direction, so that the array phases of said N-pole portion 3 and said S-pole portion 4 are offset between said magnet arrays 5 adjoining.SELECTED DRAWING: Figure 2

Description

本発明は、マスク吸着装置に関するものである。   The present invention relates to a mask suction device.

メタルマスクを介して基板上に所望のパターンの成膜を行う成膜装置において、マスクを磁力により基板の成膜面に良好に吸着させる技術として、例えば特許文献１には、基板保持体にマスクの非開口部に対応して配列された磁石を設ける技術が開示されている。   In a film forming apparatus that forms a desired pattern on a substrate through a metal mask, as a technique for attracting the mask to the film forming surface of the substrate by magnetic force, for example, Patent Document 1 discloses a mask on a substrate holder. A technique for providing magnets arranged in correspondence with the non-opening portions of the present invention is disclosed.

しかしながら、特許文献１に開示される技術では、マスクパターンが異なるマスクに対しては、その都度、磁石の配列を変える必要があり、種々のマスクを用いる際には、各マスクと対応する磁石配列を有する基板保持体を種々用意しておく必要がある。   However, in the technique disclosed in Patent Document 1, it is necessary to change the arrangement of the magnets for each mask having a different mask pattern. When using various masks, the magnet arrangement corresponding to each mask is used. It is necessary to prepare various substrate holders having the above.

この場合、種々の基板保持体を収納しておく基板保持体ストック室を成膜装置に追加配設したり、マスクに応じてその都度対応する基板保持体を交換したりする必要がある等、成膜装置の大型化・高コスト化は避けられない。   In this case, it is necessary to additionally arrange a substrate holder stock chamber for storing various substrate holders in the film forming apparatus, or to change the corresponding substrate holder each time according to the mask, etc. It is inevitable to increase the size and cost of the film forming apparatus.

なお、特許文献２には、マスクが対向する基板の被処理面とは反対側に、Ｎ極とＳ極との境界部を有する磁石を、この境界部にマスクのフレーム領域を相対させるように配置する技術が開示されている。また、特許文献３には、マスクの開口部を仕切るリブ（フレーム）の幅の中心を通る中心線を挟んで、互いに極性が異なる向きで離間して配置される複数のマグネットを用いて、マスクを基板に固定する技術が開示されている。しかし、いずれもマスクパターンに応じて磁石及びマグネットの配置を変更する必要があり、上記特許文献１と同様の問題点を有する。   In Patent Document 2, a magnet having a boundary portion between the N pole and the S pole on the side opposite to the surface to be processed of the substrate facing the mask is set so that the frame region of the mask is opposed to the boundary portion. Disposition techniques are disclosed. Patent Document 3 discloses a mask using a plurality of magnets that are spaced apart from each other in different polarities across a center line passing through the center of the width of a rib (frame) that partitions the opening of the mask. A technique for fixing the substrate to the substrate is disclosed. However, in any case, it is necessary to change the arrangement of the magnet and the magnet according to the mask pattern.

特開平１１−１３１２１２号公報JP-A-11-131212 国際公開第２００９／０６９７４３号International Publication No. 2009/069743 特開２０１５−１２４３９４号公報JP-A-2015-124394

本発明は、上述のような現状に鑑みなされたもので、マスクパターンが異なる種々のマスク毎に磁石配列を変更する必要なく、種々のマスクを良好に基板に吸着させることが可能なユニバーサル性の高いマスク吸着装置を提供するものである。   The present invention has been made in view of the above-described situation, and it is not necessary to change the magnet arrangement for each of various masks having different mask patterns. A high mask suction device is provided.

基板の表面側に設けられたマスクをこの基板に磁力によって吸着させる、基板の裏面側に設けられるマスク吸着装置であって、前記マスクと対向する面がＮ極となるＮ極部と、前記マスクと対向する面がＳ極となるＳ極部とが周期的に配設されて構成された磁石列が、その長手方向を揃えて間隔をおいて前記マスクが対向し得る領域全体にわたって並設され、この磁石列の前記Ｎ極部及び前記Ｓ極部の配列位相が隣接する前記磁石列同士でずれた状態となっていることを特徴とするマスク吸着装置に係るものである。   A mask suction device provided on the back surface side of a substrate for attracting a mask provided on the front surface side of the substrate to the substrate by magnetic force, an N pole portion whose surface facing the mask is an N pole, and the mask Are arranged in parallel over the entire region where the mask can be opposed to each other at intervals with the longitudinal direction aligned. The mask attracting apparatus is characterized in that the arrangement phase of the N pole portion and the S pole portion of the magnet row is shifted between adjacent magnet rows.

本発明は上述のように構成したから、マスクパターンが異なる種々のマスク毎に磁石配列を変更する必要なく、種々のマスクを良好に基板に吸着させることが可能なユニバーサル性の高いマスク吸着装置となる。   Since the present invention is configured as described above, there is no need to change the magnet arrangement for each of various masks having different mask patterns, and a highly universal mask suction apparatus capable of satisfactorily attracting various masks to the substrate. Become.

本実施例の概略説明側面図である。It is a schematic explanatory side view of a present Example. 本実施例の要部の概略説明斜視図である。It is a schematic explanatory perspective view of the principal part of a present Example. 本実施例の要部の概略説明平面図である。It is a schematic explanatory top view of the principal part of a present Example. 別例１の概略説明平面図である。10 is a schematic plan view of another example 1. FIG. 別例２の概略説明平面図である。12 is a schematic explanatory plan view of another example 2. FIG. 別例２の概略説明平面図である。12 is a schematic explanatory plan view of another example 2. FIG.

好適と考える本発明の実施形態を、図面に基づいて本発明の作用を示して簡単に説明する。   An embodiment of the present invention which is considered to be suitable will be briefly described with reference to the drawings showing the operation of the present invention.

基板１の成膜面（表面）に配置されるマスク２を、基板１裏面側に設けられる磁石列５により基板１に吸着させる。   The mask 2 disposed on the film formation surface (front surface) of the substrate 1 is attracted to the substrate 1 by a magnet row 5 provided on the back surface side of the substrate 1.

この際、磁石列５は、マスク２と対向し得る領域（マスク配設領域）全体にわたって並設されており、隣接する磁石列５同士でＮ極部３及びＳ極部４の配列位相が異なることから、Ｎ極部３及びＳ極部４が散在してマスク２全体に平均的に吸着力を作用させることができ、マスクパターンが異なっても良好に基板１に吸着させることが可能となる。   At this time, the magnet rows 5 are arranged in parallel over the entire region (mask arrangement region) that can face the mask 2, and the arrangement phases of the N pole portion 3 and the S pole portion 4 are different between adjacent magnet rows 5. As a result, the N pole part 3 and the S pole part 4 are scattered to allow the suction force to act on the entire mask 2 on average, and can be satisfactorily attracted to the substrate 1 even if the mask patterns are different. .

即ち、磁石列５を隣接する磁石列５同士でＮ極部３及びＳ極部４の配列位相をずらし、マスク２の吸着力が高いＮ極部３とＳ極部４との境界部が、マスク配設領域に満遍なく配置される構成とすることで、例えば各磁石列５の磁力を基板１表面側での成膜を阻害しない程度の磁力に設定しても、吸着力のムラが可及的に少なく、マスクパターンに関わらずマスク２を良好に吸着保持することが可能となる。   In other words, the magnet array 5 is shifted between adjacent magnet arrays 5 by shifting the arrangement phase of the N-pole part 3 and the S-pole part 4, and the boundary between the N-pole part 3 and the S-pole part 4 where the attractive force of the mask 2 is high, By adopting a configuration in which the masks are uniformly arranged in the mask arrangement region, for example, even if the magnetic force of each magnet array 5 is set to a magnetic force that does not hinder the film formation on the surface side of the substrate 1, unevenness in adsorption force is possible. Therefore, the mask 2 can be attracted and held satisfactorily regardless of the mask pattern.

更に、隣接する磁石列５同士でＮ極部３及びＳ極部４の配列位相がずれることで、隣接する磁石列５同士のＮ極部３及びＳ極部４間にも良好に磁力が作用し、マスク２の格子状の非開口部の磁石列５の長手方向に沿う部分は勿論、磁石列５の並設方向に沿う部分も良好に吸着保持することが可能となる。   Further, the magnetic phase acts well between the N pole portion 3 and the S pole portion 4 of the adjacent magnet rows 5 by shifting the arrangement phase of the N pole portion 3 and the S pole portion 4 between the adjacent magnet rows 5. In addition, not only the portion along the longitudinal direction of the magnet row 5 of the lattice-shaped non-opening portion of the mask 2 but also the portion along the parallel direction of the magnet row 5 can be satisfactorily attracted and held.

本発明の具体的な実施例について図面に基づいて説明する。   Specific embodiments of the present invention will be described with reference to the drawings.

本実施例は、基板１の表面にメタルマスク２を介して成膜を行う成膜装置に、基板１の表面側に設けられたマスク２をこの基板１に磁力によって吸着させる、基板１の裏面側に設けられるマスク吸着装置を設けたものである。   In the present embodiment, the back surface of the substrate 1 is made to adsorb the mask 2 provided on the surface side of the substrate 1 to the substrate 1 by magnetic force in a film forming apparatus that forms a film on the surface of the substrate 1 through the metal mask 2. A mask suction device provided on the side is provided.

このマスク吸着装置は、マスク２と対向する面がＮ極となるＮ極部３と、マスク２と対向する面がＳ極となるＳ極部４とが周期的に直線状に配設されて構成された磁石列５が、その長手方向を揃えて間隔をおいてマスク２が対向し得る領域全体にわたって並設され、この磁石列５のＮ極部３及びＳ極部４の配列位相が隣接する磁石列５同士でずれた状態となるように構成されている。   In this mask suction device, an N pole part 3 whose surface facing the mask 2 is an N pole and an S pole part 4 whose surface facing the mask 2 is an S pole are periodically arranged in a straight line. The configured magnet row 5 is arranged in parallel over the entire region where the mask 2 can be opposed to each other with the longitudinal direction aligned, and the arrangement phase of the N pole portion 3 and the S pole portion 4 of this magnet row 5 are adjacent to each other. It is comprised so that it may be in the state which shifted | deviated between the magnet rows 5 to perform.

図１〜３に図示したように、磁石列５は磁石配列板７（ヨーク）上に複数並設され、この磁石配列板７は磁石列５側が基板１の裏面に対向した状態で基板１の裏面側に配置される。図１中、符号６は基板１を保持する基板トレイである。   As shown in FIGS. 1 to 3, a plurality of magnet arrays 5 are arranged in parallel on a magnet array plate 7 (yoke), and the magnet array plate 7 is arranged on the substrate 1 with the magnet array 5 side facing the back surface of the substrate 1. Arranged on the back side. In FIG. 1, reference numeral 6 denotes a substrate tray that holds the substrate 1.

本実施例のＮ極部３及びＳ極部４は、マスク２の被吸着面に対して垂直方向に磁化された直方体状の永久磁石であり、Ｎ極部３はＳ極側の面が、Ｓ極部４はＮ極側の面が、夫々磁石配列板７に当接した状態でネジ等の適宜な固定部材により固定されている。   The N pole part 3 and the S pole part 4 of the present embodiment are cuboid permanent magnets magnetized in a direction perpendicular to the attracted surface of the mask 2, and the N pole part 3 has a surface on the S pole side. The S pole portion 4 is fixed by an appropriate fixing member such as a screw in a state where the surface on the N pole side is in contact with the magnet array plate 7.

本実施例においては、隣接する前記磁石列５同士で前記Ｎ極部３及び前記Ｓ極部４の配列位相が９０°ずれた状態となるように構成している。   In this embodiment, the arrangement phase of the N pole portion 3 and the S pole portion 4 is shifted by 90 ° between the adjacent magnet rows 5.

具体的には、右側の磁石列５の前記配列位相が左側の磁石列５の前記配列位相より９０°進んだ状態となるように構成している。本実施例では磁石列５を５つ並設しているため、両端の磁石列５は前記配列位相が同一となる。   Specifically, the arrangement phase of the right magnet array 5 is configured to be 90 ° ahead of the arrangement phase of the left magnet array 5. In this embodiment, since five magnet rows 5 are arranged in parallel, the magnet rows 5 at both ends have the same arrangement phase.

なお、隣接する磁石列５同士の前記配列位相が９０°ずれた状態とすることで、特に良好なマスク吸着性を得られることが確認されているが、９０°に限らず、他の角度ずれた状態でも、位相が一致している場合に比し、マスク吸着性の向上効果を得ることができる。   It has been confirmed that a particularly good mask attracting property can be obtained by setting the arrangement phase between adjacent magnet arrays 5 to be shifted by 90 °. Even in this state, it is possible to obtain an effect of improving the mask adsorbability as compared with the case where the phases are matched.

また、前記磁石列５は一定の間隔をおいて並設されている。磁石列５同士が当接したり間隔が近すぎると、隣接する磁石列５同士が干渉し、磁石列５の長手方向に対する磁束密度が減少し、吸着力の低下を招く。また、隣接する磁石列５の各Ｎ極部３及びＳ極部４の磁力の相互作用により、磁石を磁石配列板に固定することが困難となり、接着材が必要となる場合があるが、この接着材は成膜室内で真空を汚染する原因となる。   The magnet rows 5 are arranged side by side with a constant interval. If the magnet rows 5 come into contact with each other or are too close to each other, adjacent magnet rows 5 interfere with each other, the magnetic flux density in the longitudinal direction of the magnet rows 5 decreases, and the attracting force decreases. In addition, due to the interaction of the magnetic force of each N pole part 3 and S pole part 4 of the adjacent magnet row 5, it is difficult to fix the magnet to the magnet array plate, and an adhesive may be required. The adhesive causes contamination of the vacuum in the film formation chamber.

よって、本実施例では、磁石列５同士のピッチは、磁石列５の長手方向と直交する方向における磁石列５の幅のおよそ３倍乃至１０倍程度となるように設定している。   Therefore, in this embodiment, the pitch between the magnet rows 5 is set to be about 3 to 10 times the width of the magnet row 5 in the direction orthogonal to the longitudinal direction of the magnet rows 5.

また、Ｎ極部３及びＳ極部４のサイズは種々設定できるが、例えば、長さは５〜２０ｍｍ程度、幅は２〜１４ｍｍ程度、高さは２〜１０ｍｍ程度とすると良い。本実施例においては、長さ１０ｍｍ、幅３ｍｍ、高さ５ｍｍとしている。   The sizes of the N pole part 3 and the S pole part 4 can be variously set. For example, the length is about 5 to 20 mm, the width is about 2 to 14 mm, and the height is about 2 to 10 mm. In this embodiment, the length is 10 mm, the width is 3 mm, and the height is 5 mm.

また、例えば、図４に図示した別例１のように、各磁石列５のＮ極部３とＳ極部４とがその配列方向に間隔をおいて配設されている構成としても良い。この場合、隣接する磁石列５同士を所定の間隔で配設するのと同様、Ｎ極部３及びＳ極部４同士の間隔を適宜設定することで、一層マスク吸着性を高めることが可能となり、単位体積あたりの吸着力を向上させることができる。   Further, for example, as in another example 1 illustrated in FIG. 4, the N-pole part 3 and the S-pole part 4 of each magnet row 5 may be arranged at intervals in the arrangement direction. In this case, the mask attractiveness can be further improved by appropriately setting the distance between the N pole part 3 and the S pole part 4 as in the case where the adjacent magnet arrays 5 are arranged at a predetermined interval. The adsorption power per unit volume can be improved.

また、例えば、図５，６に図示した別例２のように、複数の磁石列５が配設された磁石配列板７を水平移動若しくは水平回転させる磁石列駆動部を設ける構成としても良い。この場合、複数の磁石列５を水平移動及び水平回転させて、マスク２に応じてマスク２の非開口部に磁石列５が可及的に重なるように磁石配列板の位置を調整することが可能となり、一層良好にマスク２を基板１の表面に吸着可能な構成となる。   Further, for example, as in another example 2 illustrated in FIGS. 5 and 6, a magnet array driving unit that horizontally moves or rotates the magnet array plate 7 on which the plurality of magnet arrays 5 are arranged may be provided. In this case, by moving the plurality of magnet rows 5 horizontally and horizontally, the position of the magnet arrangement plate can be adjusted according to the mask 2 so that the magnet row 5 overlaps the non-opening portion of the mask 2 as much as possible. Therefore, the mask 2 can be adsorbed to the surface of the substrate 1 more favorably.

また、図５に図示したように、磁石列５の並設ピッチａは、マスク箔周期間隔ｂ（マスク２の格子状の非開口部の磁石列５の長手方向に沿う部分の周期間隔ｂ）の１／ｎ倍（ｎ：１，２，・・・）に設定するのが好ましい。この場合、マスク２の非開口部の磁石列５の長手方向に沿う部分が複数箇所で磁石列５に重なる構成となり、マスク２のマスク箔を、より吸着力が強い部分にできるだけ重ねることが可能となる。   Further, as shown in FIG. 5, the parallel pitch a of the magnet rows 5 is the mask foil cycle interval b (the cycle interval b of the portion of the mask 2 along the longitudinal direction of the magnet row 5 of the lattice-like non-opening portion). Is preferably set to 1 / n times (n: 1, 2,...). In this case, the portion along the longitudinal direction of the magnet row 5 of the non-opening portion of the mask 2 is configured to overlap the magnet row 5 at a plurality of locations, and the mask foil of the mask 2 can be overlapped as much as possible on the portion having a higher attractive force. It becomes.

１ 基板
２ マスク
３ Ｎ極部
４ Ｓ極部
５ 磁石列 1 Substrate 2 Mask 3 N pole 4 S pole 5 Magnet array

Claims (5)

基板の表面側に設けられたマスクをこの基板に磁力によって吸着させる、基板の裏面側に設けられるマスク吸着装置であって、前記マスクと対向する面がＮ極となるＮ極部と、前記マスクと対向する面がＳ極となるＳ極部とが周期的に配設されて構成された磁石列が、その長手方向を揃えて間隔をおいて前記マスクが対向し得る領域全体にわたって並設され、この磁石列の前記Ｎ極部及び前記Ｓ極部の配列位相が隣接する前記磁石列同士でずれた状態となっていることを特徴とするマスク吸着装置。   A mask suction device provided on the back surface side of a substrate for attracting a mask provided on the front surface side of the substrate to the substrate by magnetic force, an N pole portion whose surface facing the mask is an N pole, and the mask Are arranged in parallel over the entire region where the mask can be opposed to each other at intervals with the longitudinal direction aligned. The mask attracting apparatus is characterized in that the arrangement phase of the N pole part and the S pole part of the magnet row is shifted between the adjacent magnet rows. 隣接する前記磁石列同士で前記Ｎ極部及び前記Ｓ極部の配列位相が９０°ずれた状態となっていることを特徴とする請求項１に記載のマスク吸着装置。   The mask attracting apparatus according to claim 1, wherein an arrangement phase of the N pole part and the S pole part is shifted by 90 ° between the adjacent magnet arrays. 前記磁石列は一定の間隔で並設されていることを特徴とする請求項１，２のいずれか１項に記載のマスク吸着装置。   The mask attracting apparatus according to claim 1, wherein the magnet rows are arranged in parallel at regular intervals. 前記各磁石列の前記Ｎ極部と前記Ｓ極部とがその配列方向に間隔をおいて配設されていることを特徴とする請求項１〜３のいずれか１項に記載のマスク吸着装置。   The mask attracting apparatus according to any one of claims 1 to 3, wherein the N-pole portion and the S-pole portion of each of the magnet arrays are disposed with an interval in the arrangement direction. . 複数の前記磁石列を水平移動若しくは水平回転させる磁石列駆動部が設けられていることを特徴とする請求項１〜４のいずれか１項に記載のマスク吸着装置。   The mask suction device according to claim 1, further comprising a magnet row driving unit that horizontally moves or horizontally rotates the plurality of magnet rows.
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CN201710518667.4A CN107557730B (en) 2016-07-01 2017-06-30 Mask adsorption device
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