JP2017530205A5 - - Google Patents
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- Publication number
- JP2017530205A5 JP2017530205A5 JP2017501397A JP2017501397A JP2017530205A5 JP 2017530205 A5 JP2017530205 A5 JP 2017530205A5 JP 2017501397 A JP2017501397 A JP 2017501397A JP 2017501397 A JP2017501397 A JP 2017501397A JP 2017530205 A5 JP2017530205 A5 JP 2017530205A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- flakes
- flowable composition
- flowable
- conductive particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462023215P | 2014-07-11 | 2014-07-11 | |
| US62/023,215 | 2014-07-11 | ||
| PCT/US2015/038810 WO2016007351A1 (en) | 2014-07-11 | 2015-07-01 | Flowable compositions with low temperature curing to form thermally conductive pathways in electronics type applications and methods relating thereto |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017530205A JP2017530205A (ja) | 2017-10-12 |
| JP2017530205A5 true JP2017530205A5 (enExample) | 2018-07-05 |
| JP6595575B2 JP6595575B2 (ja) | 2019-10-23 |
Family
ID=53762323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017501397A Expired - Fee Related JP6595575B2 (ja) | 2014-07-11 | 2015-07-01 | 低温硬化してエレクトロニクス用途の熱伝導経路を形成する流動性組成物およびそれに関連する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9840651B2 (enExample) |
| EP (1) | EP3167458B1 (enExample) |
| JP (1) | JP6595575B2 (enExample) |
| CN (1) | CN107075327B (enExample) |
| WO (1) | WO2016007351A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107112249B (zh) * | 2015-02-04 | 2020-04-14 | 纳美仕有限公司 | 导热膏及其制备方法 |
| JP6786819B2 (ja) * | 2016-03-07 | 2020-11-18 | 東洋インキＳｃホールディングス株式会社 | 光輝性呈色樹脂組成物、光輝性呈色物品およびその製造方法 |
| DE102016125465B4 (de) * | 2016-12-22 | 2022-08-11 | Pas Deutschland Gmbh | Siebdruckpaste, Verfahren zur Herstellung der Siebdruckpaste, Verwendung der Siebdruckpaste und elektrisch leitfähige Struktur |
| WO2018180746A1 (ja) * | 2017-03-30 | 2018-10-04 | 富士フイルム株式会社 | 光学フィルムならびにこれを有する画像表示装置の前面板、画像表示装置、画像表示機能付きミラ－、抵抗膜式タッチパネルおよび静電容量式タッチパネル |
| WO2018191492A1 (en) * | 2017-04-13 | 2018-10-18 | The Diller Corporation | Electrically-conductive ink formulations containing microcrystalline cellulose, methods of printing electrically-conductive traces, and laminates containing the same |
| US11441010B2 (en) * | 2017-10-04 | 2022-09-13 | Dowa Electronics Materials Co., Ltd. | Fine silver particle dispersion |
| EP3806111B1 (en) * | 2018-07-06 | 2024-03-13 | Senju Metal Industry Co., Ltd. | Electrically conductive paste and sintered body |
| US11227702B2 (en) * | 2019-04-04 | 2022-01-18 | Dowa Electronics Materials Co., Ltd. | Fine silver particle dispersion |
| WO2021236849A1 (en) * | 2020-05-17 | 2021-11-25 | Ferro Coporation | Inkjet ink system for handling high solid particles loaded inks |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07302510A (ja) * | 1994-05-10 | 1995-11-14 | Sumitomo Metal Mining Co Ltd | 導電ペースト組成物 |
| JPH1166956A (ja) * | 1997-08-12 | 1999-03-09 | Tanaka Kikinzoku Kogyo Kk | 導電性ペースト |
| US6317023B1 (en) * | 1999-10-15 | 2001-11-13 | E. I. Du Pont De Nemours And Company | Method to embed passive components |
| US8044330B2 (en) * | 2008-01-17 | 2011-10-25 | E.I. Du Pont De Nemours And Company | Electrically conductive adhesive |
| KR20100000685A (ko) * | 2008-06-25 | 2010-01-06 | 에스에스씨피 주식회사 | 전도성 페이스트 조성물 및 이를 이용한 전극 제조방법 |
| JP5656380B2 (ja) * | 2008-09-30 | 2015-01-21 | 三菱マテリアル株式会社 | 導電性インク組成物及び該組成物を用いた太陽電池セル及び太陽電池モジュールの製造方法 |
| CN102667959B (zh) * | 2009-09-24 | 2016-02-03 | E.I.内穆尔杜邦公司 | 用作电镀连接件的聚合物厚膜银电极组合物 |
| US8900487B2 (en) * | 2011-03-24 | 2014-12-02 | E I Du Pont De Nemours And Company | Conductive paste composition and semiconductor devices made therefrom |
| KR20130031414A (ko) * | 2011-09-21 | 2013-03-29 | 삼성전기주식회사 | 저온소성용 도전성 페이스트 조성물 |
| US8767378B2 (en) * | 2012-11-02 | 2014-07-01 | E I Du Pont De Nemours And Company | Electrically conductive paste composition |
| CN103413591B (zh) * | 2013-08-09 | 2016-01-20 | 南京萨特科技发展有限公司 | 一种贴片保险丝熔断体用电子浆料及其制作方法 |
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2015
- 2015-07-01 JP JP2017501397A patent/JP6595575B2/ja not_active Expired - Fee Related
- 2015-07-01 EP EP15744765.7A patent/EP3167458B1/en active Active
- 2015-07-01 WO PCT/US2015/038810 patent/WO2016007351A1/en not_active Ceased
- 2015-07-01 CN CN201580048196.4A patent/CN107075327B/zh not_active Expired - Fee Related
- 2015-07-06 US US14/791,575 patent/US9840651B2/en active Active