JP2017527107A5 - - Google Patents
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- Publication number
- JP2017527107A5 JP2017527107A5 JP2017502835A JP2017502835A JP2017527107A5 JP 2017527107 A5 JP2017527107 A5 JP 2017527107A5 JP 2017502835 A JP2017502835 A JP 2017502835A JP 2017502835 A JP2017502835 A JP 2017502835A JP 2017527107 A5 JP2017527107 A5 JP 2017527107A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- pressure control
- pad
- substrate
- control pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 230000000875 corresponding Effects 0.000 description 1
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462026269P | 2014-07-18 | 2014-07-18 | |
US14/334,948 US9662762B2 (en) | 2014-07-18 | 2014-07-18 | Modifying substrate thickness profiles |
US14/334,948 | 2014-07-18 | ||
US62/026,269 | 2014-07-18 | ||
PCT/US2015/040064 WO2016010865A1 (en) | 2014-07-18 | 2015-07-10 | Modifying substrate thickness profiles |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017527107A JP2017527107A (ja) | 2017-09-14 |
JP2017527107A5 true JP2017527107A5 (pt) | 2018-08-23 |
JP6778176B2 JP6778176B2 (ja) | 2020-10-28 |
Family
ID=55078939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017502835A Active JP6778176B2 (ja) | 2014-07-18 | 2015-07-10 | 基板の厚さプロファイルの調節 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6778176B2 (pt) |
KR (1) | KR102376928B1 (pt) |
CN (1) | CN106463384B (pt) |
TW (1) | TWI691379B (pt) |
WO (1) | WO2016010865A1 (pt) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109155249B (zh) * | 2016-03-25 | 2023-06-23 | 应用材料公司 | 局部区域研磨系统以及用于研磨系统的研磨垫组件 |
WO2018071302A1 (en) * | 2016-10-10 | 2018-04-19 | Applied Materials, Inc. | Real time profile control for chemical mechanical polishing |
SG10202111787PA (en) * | 2016-10-18 | 2021-11-29 | Ebara Corp | Local polisher, method of a local polisher and program |
KR102629679B1 (ko) * | 2018-11-09 | 2024-01-29 | 주식회사 케이씨텍 | 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인 |
TWI834195B (zh) | 2019-04-18 | 2024-03-01 | 美商應用材料股份有限公司 | Cmp期間基於溫度的原位邊緣不對稱校正的電腦可讀取儲存媒體 |
US11282755B2 (en) * | 2019-08-27 | 2022-03-22 | Applied Materials, Inc. | Asymmetry correction via oriented wafer loading |
TWI797501B (zh) | 2019-11-22 | 2023-04-01 | 美商應用材料股份有限公司 | 在拋光墊中使用溝槽的晶圓邊緣不對稱校正 |
CN111975469A (zh) * | 2020-08-28 | 2020-11-24 | 上海华力微电子有限公司 | 化学机械研磨的方法及研磨系统 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06333891A (ja) * | 1993-05-24 | 1994-12-02 | Sony Corp | 基板研磨装置および基板保持台 |
US5938504A (en) * | 1993-11-16 | 1999-08-17 | Applied Materials, Inc. | Substrate polishing apparatus |
US5558563A (en) * | 1995-02-23 | 1996-09-24 | International Business Machines Corporation | Method and apparatus for uniform polishing of a substrate |
US6267659B1 (en) * | 2000-05-04 | 2001-07-31 | International Business Machines Corporation | Stacked polish pad |
JP2002246346A (ja) * | 2001-02-14 | 2002-08-30 | Hiroshima Nippon Denki Kk | 化学機械研磨装置 |
US20020164926A1 (en) * | 2001-05-07 | 2002-11-07 | Simon Mark G. | Retainer ring and method for polishing a workpiece |
US6863771B2 (en) * | 2001-07-25 | 2005-03-08 | Micron Technology, Inc. | Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods |
US6764387B1 (en) * | 2003-03-07 | 2004-07-20 | Applied Materials Inc. | Control of a multi-chamber carrier head |
US6913518B2 (en) * | 2003-05-06 | 2005-07-05 | Applied Materials, Inc. | Profile control platen |
TWI275451B (en) * | 2005-01-11 | 2007-03-11 | Asia Ic Mic Process Inc | Measurement of thickness profile and elastic modulus profile of polishing pad |
US7198548B1 (en) * | 2005-09-30 | 2007-04-03 | Applied Materials, Inc. | Polishing apparatus and method with direct load platen |
US8858300B2 (en) * | 2010-02-09 | 2014-10-14 | International Business Machines Corporation | Applying different pressures through sub-pad to fixed abrasive CMP pad |
CN102884612B (zh) * | 2011-01-03 | 2017-02-15 | 应用材料公司 | 压力控制的抛光压板 |
JP6282437B2 (ja) * | 2012-10-18 | 2018-02-21 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 研磨パッドコンディショナ用ダンパ |
US20140141694A1 (en) * | 2012-11-21 | 2014-05-22 | Applied Materials, Inc. | In-Sequence Spectrographic Sensor |
-
2015
- 2015-07-10 WO PCT/US2015/040064 patent/WO2016010865A1/en active Application Filing
- 2015-07-10 CN CN201580032583.9A patent/CN106463384B/zh active Active
- 2015-07-10 KR KR1020177004530A patent/KR102376928B1/ko active IP Right Grant
- 2015-07-10 JP JP2017502835A patent/JP6778176B2/ja active Active
- 2015-07-15 TW TW104122940A patent/TWI691379B/zh active
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