JP2017526120A - 強制対流冷却器のためのヒートシンク - Google Patents
強制対流冷却器のためのヒートシンク Download PDFInfo
- Publication number
- JP2017526120A JP2017526120A JP2017504342A JP2017504342A JP2017526120A JP 2017526120 A JP2017526120 A JP 2017526120A JP 2017504342 A JP2017504342 A JP 2017504342A JP 2017504342 A JP2017504342 A JP 2017504342A JP 2017526120 A JP2017526120 A JP 2017526120A
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- Prior art keywords
- heat sink
- fin
- heat
- plate
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000010146 3D printing Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005276 aerator Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
- F21V29/673—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for intake
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (16)
- 熱源を冷却するためのヒートシンクであって、前記ヒートシンクが、
主軸のまわりに配設される側壁を備える3次元ボディを有するヒートディストリビュータと、
前記側壁に結合されると共に前記側壁から延在する複数のプレートであって、前記複数のプレートの各々が、前記主軸に対して垂直な断面において湾曲している複数のプレートとを有し、前記プレートが、前記ヒートディストリビュータの前記主軸に沿ってねじれており、隣接する2つのプレートの間の距離であるフィン間隔が、半径方向位置の増大と共に増大するヒートシンク。 - 前記側壁が、円柱形状又円錐形状をしている請求項1に記載のヒートシンク。
- 前記主軸に対して垂直な断面において、各プレートが、2次元螺旋を形成する請求項1乃至2のいずれか一項に記載のヒートシンク。
- 前記主軸に対して垂直な断面において、各プレートが、前記主軸に対して半径方向に前記ヒートディストリビュータの前記側壁を出る請求項1乃至3のいずれか一項に記載のヒートシンク。
- 各プレートが、少なくとも3つの縁端部を持ち、前記側壁に接続される第1縁端部が、前記ヒートディストリビュータの外径と等しい第1半径を持つ第1螺旋を形成する請求項1乃至4のいずれか一項に記載のヒートシンク。
- 各プレートが、4つの縁端部を持ち、前記第1縁端部の反対側にある第2縁端部が、前記ヒートディストリビュータの前記外径より大きい第2半径を持つ第2螺旋を形成する請求項5に記載のヒートシンク。
- 各プレートが、4つの縁端部を持ち、前記第1縁端部の反対側にある第2縁端部が、円錐形螺旋を形成する請求項5に記載のヒートシンク。
- 前記フィン間隔が、前記プレートの内側半径から始まる半径方向位置の増大と共に線形に増大する請求項1乃至7のいずれか一項に記載のヒートシンク。
- 前記プレートの外側半径における前記フィン間隔が、前記プレートの前記内側半径における前記フィン間隔より約10%乃至20%大きい請求項1乃至8のいずれか一項に記載のヒートシンク。
- 前記フィン間隔の最大値が、前記フィン間隔の最小値の2倍未満である請求項1乃至9のいずれか一項に記載のヒートシンク。
- 1メートル当たりのフル旋回数として規定されるような前記ヒートシンクの前記プレートのねじれが、0.28/r_外側までであり、ここで、r_外側は、前記ヒートシンクの前記外側半径である請求項1乃至10のいずれか一項に記載のヒートシンク。
- 前記ヒートシンクが、前記ヒートシンクフィンのまわり配設されるエンクロージャを更に有し、前記エンクロージャが、前記半径方向において前記フィンを完全又は部分的に覆う請求項1乃至11のいずれか一項に記載のヒートシンク。
- 請求項1乃至12のいずれか一項に記載のヒートシンク、及び前記ヒートシンクと軸方向に位置合わせされると共に、前記プレートを通るよう空気を吹き込むよう構成される軸方向通風機を有する強制対流冷却器。
- 少なくとも1つの発光装置と、請求項13に記載の強制対流冷却器とを有するランプ。
- 前記発光装置が発光ダイオードである請求項14に記載のランプ。
- 請求項14又は15に記載のランプを少なくとも1つ有する照明器具。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14179321 | 2014-07-31 | ||
EP14179321.6 | 2014-07-31 | ||
PCT/EP2015/066504 WO2016016024A1 (en) | 2014-07-31 | 2015-07-20 | Heat sink for forced convection cooler |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017526120A true JP2017526120A (ja) | 2017-09-07 |
JP2017526120A5 JP2017526120A5 (ja) | 2018-08-23 |
Family
ID=51260683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017504342A Pending JP2017526120A (ja) | 2014-07-31 | 2015-07-20 | 強制対流冷却器のためのヒートシンク |
Country Status (5)
Country | Link |
---|---|
US (1) | US10222047B2 (ja) |
EP (1) | EP3175173B1 (ja) |
JP (1) | JP2017526120A (ja) |
CN (1) | CN106574768A (ja) |
WO (1) | WO2016016024A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102020207382A1 (de) | 2020-06-15 | 2021-12-16 | Volkswagen Aktiengesellschaft | Fahrzeugleuchte mit einer Lichtquelle und einem Kühlsystem zum Kühlen der Lichtquelle |
US11448389B1 (en) * | 2022-02-17 | 2022-09-20 | Dialight Corporation | Luminaires with modular heat spreader panels |
CN115062562B (zh) * | 2022-08-11 | 2022-11-04 | 锦浪科技股份有限公司 | 一种电源设备的风冷系统设计方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2462337Y (zh) * | 2001-01-17 | 2001-11-28 | 高原 | 散热器型材 |
US6886627B2 (en) * | 2003-06-27 | 2005-05-03 | Intel Corporation | Radial heat sink with helical shaped fins |
TWM264823U (en) * | 2004-05-03 | 2005-05-11 | Chu-Tsai Huang | Ring-shape heat sink structure of streamlined curving surface heat dissipation plate |
US7063130B2 (en) | 2003-08-08 | 2006-06-20 | Chu-Tsai Huang | Circular heat sink assembly |
US7055577B2 (en) * | 2004-02-12 | 2006-06-06 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation device for electronic device |
CN101016983A (zh) * | 2007-02-26 | 2007-08-15 | 吕大明 | 一种螺旋散热鳍led灯 |
TWM334274U (en) * | 2007-12-04 | 2008-06-11 | Cooler Master Co Ltd | A lighting device and cover with heat conduction structure |
CN101629710A (zh) * | 2008-07-18 | 2010-01-20 | 富士迈半导体精密工业(上海)有限公司 | 照明装置 |
US7922356B2 (en) * | 2008-07-31 | 2011-04-12 | Lighting Science Group Corporation | Illumination apparatus for conducting and dissipating heat from a light source |
CN101660703B (zh) * | 2008-08-26 | 2012-10-10 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
US8152336B2 (en) * | 2008-11-21 | 2012-04-10 | Journée Lighting, Inc. | Removable LED light module for use in a light fixture assembly |
EP2457018A4 (en) * | 2009-07-21 | 2014-10-15 | Cooper Technologies Co | CONNECTING A LIGHT EMITTING DIODE MODULE (LED) TO A THERMAL DISSIPATING ASSEMBLY, LIGHT REFLECTOR, AND ELECTRIC CIRCUITS |
US8262255B1 (en) * | 2009-11-20 | 2012-09-11 | Hamid Rashidi | Small sized LED lighting luminaire having replaceable operating components and arcuate fins to provide improved heat dissipation |
CN102105034A (zh) * | 2009-12-18 | 2011-06-22 | 富准精密工业(深圳)有限公司 | 固定架以及使用该固定架的散热装置 |
US20110164420A1 (en) * | 2010-01-07 | 2011-07-07 | Hung-Wen Lee | Diffusion structure for illumination light source |
US8888318B2 (en) * | 2010-06-11 | 2014-11-18 | Intematix Corporation | LED spotlight |
WO2012118985A2 (en) * | 2011-03-02 | 2012-09-07 | Sandia Corporation | Solid state lighting devices and methods with rotary cooling structures |
TWI451041B (zh) * | 2011-09-30 | 2014-09-01 | Lextar Electronics Corp | 光源的散熱裝置與其散熱方法 |
-
2015
- 2015-07-20 CN CN201580041496.XA patent/CN106574768A/zh active Pending
- 2015-07-20 JP JP2017504342A patent/JP2017526120A/ja active Pending
- 2015-07-20 WO PCT/EP2015/066504 patent/WO2016016024A1/en active Application Filing
- 2015-07-20 EP EP15738926.3A patent/EP3175173B1/en not_active Not-in-force
- 2015-07-20 US US15/500,538 patent/US10222047B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP3175173B1 (en) | 2017-12-20 |
EP3175173A1 (en) | 2017-06-07 |
US20170219198A1 (en) | 2017-08-03 |
US10222047B2 (en) | 2019-03-05 |
CN106574768A (zh) | 2017-04-19 |
WO2016016024A1 (en) | 2016-02-04 |
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