JP2017519869A5 - - Google Patents

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Publication number
JP2017519869A5
JP2017519869A5 JP2016573583A JP2016573583A JP2017519869A5 JP 2017519869 A5 JP2017519869 A5 JP 2017519869A5 JP 2016573583 A JP2016573583 A JP 2016573583A JP 2016573583 A JP2016573583 A JP 2016573583A JP 2017519869 A5 JP2017519869 A5 JP 2017519869A5
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JP
Japan
Prior art keywords
curable composition
filling
sandwich structure
voids
optionally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016573583A
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English (en)
Japanese (ja)
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JP2017519869A (ja
JP6626012B2 (ja
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Publication date
Priority claimed from EP14172755.2A external-priority patent/EP2957584B1/en
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Publication of JP2017519869A publication Critical patent/JP2017519869A/ja
Publication of JP2017519869A5 publication Critical patent/JP2017519869A5/ja
Application granted granted Critical
Publication of JP6626012B2 publication Critical patent/JP6626012B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016573583A 2014-06-17 2015-06-17 速硬化性エポキシ接着剤組成物 Active JP6626012B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14172755.2A EP2957584B1 (en) 2014-06-17 2014-06-17 Rapid curing epoxy adhesive compositions
EP14172755.2 2014-06-17
PCT/US2015/036189 WO2015195775A1 (en) 2014-06-17 2015-06-17 Rapid curing epoxy adhesive compositions

Publications (3)

Publication Number Publication Date
JP2017519869A JP2017519869A (ja) 2017-07-20
JP2017519869A5 true JP2017519869A5 (cg-RX-API-DMAC7.html) 2018-07-26
JP6626012B2 JP6626012B2 (ja) 2019-12-25

Family

ID=50942204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016573583A Active JP6626012B2 (ja) 2014-06-17 2015-06-17 速硬化性エポキシ接着剤組成物

Country Status (10)

Country Link
US (1) US10882947B2 (cg-RX-API-DMAC7.html)
EP (1) EP2957584B1 (cg-RX-API-DMAC7.html)
JP (1) JP6626012B2 (cg-RX-API-DMAC7.html)
KR (1) KR20170018912A (cg-RX-API-DMAC7.html)
CN (1) CN106414546A (cg-RX-API-DMAC7.html)
BR (1) BR112016029780A2 (cg-RX-API-DMAC7.html)
CA (1) CA2952248A1 (cg-RX-API-DMAC7.html)
ES (1) ES2625552T3 (cg-RX-API-DMAC7.html)
PL (1) PL2957584T3 (cg-RX-API-DMAC7.html)
WO (1) WO2015195775A1 (cg-RX-API-DMAC7.html)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3275915B1 (en) * 2016-07-29 2022-11-30 3M Innovative Properties Company Non-halogeneous fast curing two-component epoxy adhesive with flame retardant properties
EP3275914B1 (en) * 2016-07-29 2022-05-11 3M Innovative Properties Company Flame retardant adhesive composition
EP3385297A1 (en) * 2017-04-04 2018-10-10 3M Innovative Properties Company Epoxy-silicone hybrid sealant composition with low shrinkage and lower postcuring properties with chemical resistance for aerospace applications
CN108929518B (zh) * 2017-05-26 2022-11-25 洛阳尖端技术研究院 一种环氧树脂吸波复合材料及其制备方法
US10792884B2 (en) * 2017-06-15 2020-10-06 The Boeing Company Composite panel sandwich structures with integrated joints
EP3569629B1 (de) 2018-05-17 2022-07-06 Evonik Operations GmbH Schnell härtende epoxysysteme
US11359048B2 (en) * 2018-05-17 2022-06-14 Evonik Operations Gmbh Fast-curing epoxy systems
EP3569630B1 (de) 2018-05-17 2022-08-03 Evonik Operations GmbH Schnell härtende epoxysysteme
US11286335B2 (en) 2018-05-17 2022-03-29 Evonik Operations Gmbh Fast-curing epoxy systems
WO2020033036A1 (en) * 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
WO2020033037A1 (en) * 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
EP3626757A1 (de) * 2018-09-19 2020-03-25 Hilti Aktiengesellschaft Verwendung von salzen als beschleuniger in einer epoxidharzmasse zur chemischen befestigung
EP3660069B1 (de) 2018-11-29 2024-01-03 Evonik Operations GmbH Schnell härtende epoxysysteme
EP3733731A1 (de) * 2019-04-30 2020-11-04 Hilti Aktiengesellschaft Härterzusammensetzung für eine epoxidharzmasse, epoxidharzmasse und mehrkomponenten-epoxidharzsystem mit verbesserter tieftemperaturhärtung
WO2021019741A1 (ja) * 2019-07-31 2021-02-04 昭和電工マテリアルズ株式会社 接着剤セット
EP4011978B1 (en) 2019-08-06 2025-11-19 Kaneka Corporation Curable composition
CN110530924A (zh) * 2019-08-08 2019-12-03 西安交通大学 一种可施加电场的dsc电极系统
US11453744B2 (en) 2019-10-15 2022-09-27 Evonik Operations Gmbh Compositions consisting of BrØnsted acids and monoamines
WO2021206471A1 (ko) * 2020-04-09 2021-10-14 코오롱인더스트리 주식회사 접착제 조성물 및 고무 보강재
CN111748079A (zh) * 2020-07-14 2020-10-09 道生天合材料科技(上海)股份有限公司 一种可快速固化的固化剂及使用该固化剂的环氧树脂系统
US20220112321A1 (en) * 2020-10-09 2022-04-14 Rohm And Haas Electronic Materials Llc High refractive index materials
EP3981817B1 (de) 2020-10-12 2025-09-10 Evonik Operations GmbH Zusammensetzungen umfassend brönstedtsäuren und monoamine
EP4194516A1 (en) 2021-12-09 2023-06-14 Jotun A/S Coatings
WO2025116899A1 (en) * 2023-11-29 2025-06-05 Uniseal, Inc. Storage stable, one-component, solvent-free, non-halogenated, heat curable compositions for use in encapsulation of electrical components

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
US3282015A (en) 1962-04-20 1966-11-01 Frederick W Rohe Moldable insert fastener with dual potting ports in head
US3271498A (en) 1964-01-27 1966-09-06 Rohe Method of installation of moldable insert in sandwich panel
GB1500206A (en) * 1975-10-23 1978-02-08 Ciba Geigy Ag Compositions for curing epoxide resins
CA1249691A (en) * 1984-07-18 1989-01-31 Janis Robins Fast curing epoxy resin compositions
US4668736A (en) * 1984-07-18 1987-05-26 Minnesota Mining And Manufacturing Company Fast curing epoxy resin compositions
KR900007766B1 (ko) 1985-06-26 1990-10-19 더 다우 케미칼 캄파니 고무-개질 에폭시 화합물
US4941785A (en) 1989-09-13 1990-07-17 Witten Donald W Potted insert for honeycomb panels
CN101405342B (zh) 2006-04-24 2011-01-05 东丽株式会社 环氧树脂组合物、纤维增强复合材料及其制造方法
US20070293603A1 (en) * 2006-06-19 2007-12-20 Ashland Licensing And Intellectual Property Llc Epoxy adhesive composition and use thereof
EP2119745A4 (en) * 2007-02-13 2014-06-11 Kaneka Corp HARDENING COMPOSITION
EP2338938B1 (en) * 2008-09-29 2013-07-31 Kaneka Corporation Curable composition and cured product thereof
EP2393864A1 (en) * 2009-02-06 2011-12-14 3M Innovative Properties Company Room temperature curing epoxy adhesive
EP2223966B1 (en) * 2009-02-25 2017-08-16 3M Innovative Properties Company Epoxy adhesive compositions with high mechanical strength over a wide temperature range
GB0905362D0 (en) * 2009-03-30 2009-05-13 3M Innovative Properties Co Fire resistant epoxy resin based core filler material developing low exothermic heat
WO2012021258A1 (en) * 2010-08-10 2012-02-16 3M Innovative Properties Company Epoxy structural adhesive
US9139699B2 (en) * 2012-10-04 2015-09-22 Dow Corning Corporation Metal containing condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts
DE102012203794A1 (de) * 2012-03-12 2013-09-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrisch lösbarer Polyamid-Klebstoff
JP2014139293A (ja) * 2012-12-20 2014-07-31 Dow Global Technologies Llc エポキシ樹脂組成物、それを製造する方法、およびその物品

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