JP2017513147A5 - - Google Patents
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- JP2017513147A5 JP2017513147A5 JP2016560985A JP2016560985A JP2017513147A5 JP 2017513147 A5 JP2017513147 A5 JP 2017513147A5 JP 2016560985 A JP2016560985 A JP 2016560985A JP 2016560985 A JP2016560985 A JP 2016560985A JP 2017513147 A5 JP2017513147 A5 JP 2017513147A5
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- Prior art keywords
- processing component
- workload
- temperature
- energy efficiency
- alarm
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- 238000012545 processing Methods 0.000 claims 46
- 238000009529 body temperature measurement Methods 0.000 claims 10
- 238000000034 method Methods 0.000 claims 9
- 238000012544 monitoring process Methods 0.000 claims 4
- 238000013461 design Methods 0.000 claims 3
- 238000005070 sampling Methods 0.000 claims 3
- 238000004590 computer program Methods 0.000 claims 2
- 238000012952 Resampling Methods 0.000 claims 1
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461977013P | 2014-04-08 | 2014-04-08 | |
| US61/977,013 | 2014-04-08 | ||
| US201461981714P | 2014-04-18 | 2014-04-18 | |
| US61/981,714 | 2014-04-18 | ||
| US14/280,630 US9977439B2 (en) | 2014-04-08 | 2014-05-18 | Energy efficiency aware thermal management in a multi-processor system on a chip |
| US14/280,630 | 2014-05-18 | ||
| PCT/US2015/024845 WO2015157371A1 (en) | 2014-04-08 | 2015-04-08 | Energy efficiency aware thermal management in a multi-processor system on a chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017513147A JP2017513147A (ja) | 2017-05-25 |
| JP2017513147A5 true JP2017513147A5 (enExample) | 2018-05-10 |
Family
ID=54209704
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016560981A Expired - Fee Related JP6218967B2 (ja) | 2014-04-08 | 2015-04-08 | マルチプロセッサシステムオンチップにおけるエネルギー効率認識型熱管理 |
| JP2016560971A Ceased JP2017517057A (ja) | 2014-04-08 | 2015-04-08 | マルチプロセッサシステムオンチップにおけるエネルギー効率認識型熱管理 |
| JP2016560985A Ceased JP2017513147A (ja) | 2014-04-08 | 2015-04-08 | マルチプロセッサシステムオンチップにおけるエネルギー効率認識型熱管理 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016560981A Expired - Fee Related JP6218967B2 (ja) | 2014-04-08 | 2015-04-08 | マルチプロセッサシステムオンチップにおけるエネルギー効率認識型熱管理 |
| JP2016560971A Ceased JP2017517057A (ja) | 2014-04-08 | 2015-04-08 | マルチプロセッサシステムオンチップにおけるエネルギー効率認識型熱管理 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US9823673B2 (enExample) |
| EP (3) | EP3129854B1 (enExample) |
| JP (3) | JP6218967B2 (enExample) |
| KR (3) | KR101813435B1 (enExample) |
| CN (3) | CN106233224B (enExample) |
| BR (3) | BR112016023524A2 (enExample) |
| WO (3) | WO2015157370A1 (enExample) |
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| US9292293B2 (en) | 2013-08-08 | 2016-03-22 | Qualcomm Incorporated | Intelligent multicore control for optimal performance per watt |
| JP2015130035A (ja) * | 2014-01-07 | 2015-07-16 | 富士通株式会社 | 半導体装置および制御方法 |
| US9823673B2 (en) | 2014-04-08 | 2017-11-21 | Qualcomm Incorporated | Energy efficiency aware thermal management in a multi-processor system on a chip based on monitored processing component current draw |
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2014
- 2014-05-18 US US14/280,631 patent/US9823673B2/en not_active Expired - Fee Related
- 2014-05-18 US US14/280,629 patent/US9582012B2/en not_active Expired - Fee Related
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2015
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