JP2017220482A - Component mounting machine, component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow for shortening of the time required for mounting a component on a board B, in a configuration for transporting the board B, respectively, by a first transportation lane 3a and a second transportation lane 3b.SOLUTION: Out of a first head unit 4a and a second head unit 4b, the first head unit 4a transfers a component E to a board B held on a second conveyer unit 32 close to a first component supply part 2a, out of the second conveyer unit 32 and a third conveyer unit 33 executing hold mode on an object transportation lane 3T, and the second head unit 4b transfers the component E to a board B held on a third conveyer unit 33 close to a second component supply part 2b. Travels of the first and second head units 4a, 4b from the first component supply part 2a and second component supply part 2b to a board B are thereby kept, and the time required for mounting a component on the board B can be shortened.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a component mounting technique for mounting a component on a substrate held by a transport mechanism that transports the substrate.

  Conventionally, a component supply unit provided on both sides in the width direction orthogonal to the substrate conveyance direction and two mounting heads provided corresponding to each component supply unit are provided, and the substrate conveyance is performed between these component supply units. 2. Description of the Related Art A component mounter that transfers components from a component supply unit corresponding to each mounting head to a substrate conveyed in a direction is known.

  Moreover, in the component mounting machine of patent document 1, the board | substrate conveyance apparatus arrange | positioned between the component supply parts of both sides is comprised by four conveyor units arranged in a line in a board | substrate conveyance direction, and in the case of component mounting The central two conveyor units hold the substrate. In particular, these two conveyor units are movable in the width direction, and are aligned in the board conveyance direction during board conveyance, but are shifted from each other in the width direction during component mounting. Then, each mounting head transfers the component onto the substrate held by the conveyor unit closer to the corresponding component supply unit. As a result, it is possible to suppress the movement distance of the mounting head from the component supply unit to the substrate and complete the component mounting on the substrate in a short time.

Japanese Patent Laying-Open No. 2015-225977 JP 2012-151331 A

  As described above, the component mounter disclosed in Patent Document 1 includes one transport mechanism (substrate transport device). However, as shown in Patent Document 2, there is a component mounting machine including two transport mechanisms (board transport lanes) arranged in parallel. In such a component mounting machine, there is room for improvement with respect to the influence of the movement distance of the mounting head from the component supply unit to the substrate on the time required for component mounting on the substrate.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique capable of shortening the time required for mounting a component on a board in a configuration in which the board is transported by each of two transport mechanisms. .

  The component mounter according to the present invention is arranged adjacent to the first transport mechanism from the first transport mechanism for transporting the substrate in the first direction and from the second direction orthogonal to the first direction, and in the first direction. A second transport mechanism that transports the first transport mechanism, a control unit that sets one of the first transport mechanism and the second transport mechanism as the target transport mechanism, and the second transport mechanism on the opposite side of the first transport mechanism in the second direction. A first component supply unit that is arranged and supplies components; a second component supply unit that is arranged on the opposite side of the first conveyance mechanism across the second conveyance mechanism in the second direction; and a target A first mounting unit that transfers components from the first component supply unit to the substrate held by the transfer mechanism; and a second mounting unit that transfers components from the second component supply unit to the substrate held by the target transfer mechanism; Each of the first transport mechanism and the second transport mechanism, the upstream transport section, and the upstream A transport unit including a downstream transport unit disposed on the downstream side in the first direction of the transport unit is provided, and the upstream transport unit and the downstream transport unit are arranged in the first direction and the substrate is placed in the first direction. It is possible to execute a transfer mode for transferring and a hold mode for holding different substrates that are shifted from each other in the second direction. Of the upstream transfer unit and the downstream transfer unit that execute the hold mode in the target transfer mechanism, The first mounting unit transfers the component to the substrate held by the conveyance unit closer to the one component supply unit, and the second mounting unit is the component on the substrate held by the conveyance unit closer to the second component supply unit. Is transferred.

  The component mounting method according to the present invention includes a first transport mechanism that transports a substrate in a first direction, and a substrate that is disposed adjacent to the first transport mechanism from a second direction orthogonal to the first direction, and is in the first direction. A second transport mechanism that transports and holds the substrate, and a substrate held in one of the first transport mechanism and the second transport mechanism in the second direction in the second direction. The component is transferred by the first mounting unit from the first component supply unit disposed on the opposite side of the second transport mechanism with the first transport mechanism interposed therebetween, and the first transport mechanism is sandwiched with the second transport mechanism in the second direction. And a step of transferring the component from the second component supply unit disposed on the opposite side of the second mounting unit to the first transport mechanism and the second transport mechanism, respectively. And a downstream conveyance unit disposed on the downstream side in the first direction of the unit A transport unit is provided, and a transport mode in which the upstream transport section and the downstream transport section transport the substrates in the first direction side by side in the first direction, and holding to hold different substrates in the second direction. The first mounting unit on the substrate held by the transfer unit closer to the first component supply unit among the upstream transfer unit and the downstream transfer unit that execute the holding mode in the target transfer mechanism. Transfer the component, and the second mounting unit transfers the component onto the substrate held by the transport unit closer to the second component supply unit.

  In the present invention (component mounting machine and component mounting method) configured as described above, the first transport mechanism and the second transport mechanism for transporting the substrate in the first direction respectively include an upstream transport section, a downstream transport section, and A transport unit. The upstream transport unit and the downstream transport unit are movable relative to each other in a second direction orthogonal to the first direction, and are connected to the transport mode for transporting the substrate in the first direction side by side in the first direction. It is possible to execute a holding mode in which different substrates are held by being shifted in the second direction. And a 1st mounting part and a 2nd mounting part mount components in the board | substrate hold | maintained by one target conveyance mechanism among a 1st conveyance mechanism and a 2nd conveyance mechanism. In particular, the first mounting unit transfers components to the substrate held by the conveyance unit closer to the first component supply unit among the upstream conveyance unit and the downstream conveyance unit that execute the holding mode in the target conveyance mechanism. The second mounting unit transfers the component onto the substrate held by the transport unit closer to the second component supply unit. In this way, it is possible to reduce the time required for component mounting on the board by suppressing the moving distance that the first mounting part and the second mounting part move from the first component supply part and the second component supply part to the board. ing.

  By the way, in the component mounting machine of the above-mentioned patent document 1, the two transfer units (conveyor units) are arranged in the board transfer direction when the board is transferred, but are shifted from each other in the width direction when the components are mounted. In such a component mounting machine, since the movement distance of the mounting head from the component supply unit to the substrate can be suppressed, there is an advantage that the time required for mounting the component on the substrate can be shortened. On the other hand, with the completion of component mounting on the substrate In some cases, the time required for replacing the substrate to be executed becomes a problem. In other words, when the component mounting on the board held by each transport unit is completed, the substrate is transported from the upstream transport unit to the downstream transport unit, and a new substrate is transported to the upstream transport unit. Thus, it is necessary to replace the substrate held in each transport unit. In this substrate replacement, the two transfer units are moved from the shifted state to the aligned state, and then the substrate is transferred by these transfer units, and further, the transfer units are moved from the aligned state to the shifted state. Is executed. For this reason, the time required for replacing the substrate is extended by the time required for moving each transport unit. On the other hand, component mounting on the board cannot be performed while the board is replaced. As a result, the efficiency of component mounting on the board may be reduced.

  Therefore, among the first transport mechanism and the second transport mechanism, in the release transport mechanism in which the setting to the target transport mechanism is released in accordance with the switching of the target transport mechanism, the upstream transport unit and the downstream transport unit are the second transport unit. A first transition operation that moves relative to the direction and shifts from the holding mode to the transport mode, transports the substrate held by the upstream transport unit to the downstream transport unit, and moves the substrate from the upstream side in the first direction. The transport operation of receiving and transporting the substrate held by the downstream transport unit to the downstream side in the first direction and receiving the substrate from the upstream transport unit, and the upstream transport unit and the downstream transport unit in the second direction The second transition operation that moves relatively and shifts from the transport mode to the holding mode is performed in this order, and in parallel with the execution of the first transition operation, the transport operation, and the second transition operation in the release transport mechanism, 1st mounting part and 2nd actual Part is to perform a mounting operation for transferring the parts to a substrate held to the subject transport mechanism may be configured component mounting machine.

  In other words, when the target transport mechanism is switched between the first transport mechanism and the second transport mechanism, the first transport mechanism and the second transport mechanism in the release transport mechanism in which the setting of the target transport mechanism is released is the first A transition operation, a transport operation, and a second transition operation are performed. In parallel with the first transition operation, the transport operation, and the second transition operation, the mounting operation is performed on the substrate supported by the newly set target transport mechanism. Therefore, it is possible to improve the efficiency of component mounting on the board.

  In addition, the component mounter may be configured so that the first transition operation, the transport operation, and the second transition operation in the release transport mechanism are completed before the mounting operation is completed. This makes it possible to more efficiently execute component mounting on the board.

  In addition, the moving range of the first mounting unit is limited to the first component supply unit side in the second direction from the second mounting unit that is mounting the component, and the moving range of the second mounting unit is mounted on the component The present invention is particularly suitable for a component mounter that is limited to the second component supply unit side in the second direction than the first mounting unit. That is, in such a component mounting machine, when the first mounting unit and the second mounting unit mount components in a range close to each other, one must mount the component on the board while the other needs to wait. is there. The waiting time of the mounting head can be a cause of reducing the efficiency of component mounting on the board. On the other hand, in the present invention, the first mounting unit is disposed on the substrate held by the transport unit closer to the first component supply unit among the upstream transport unit and the downstream transport unit that are shifted from each other in the second direction. The component is transferred, and the second mounting unit transfers the component to the substrate held by the transport unit closer to the second component supply unit. Accordingly, the standby of the first mounting unit or the second mounting unit can be suppressed, and the efficiency of component mounting on the board can be improved.

  Further, the upstream side where the transport unit close to the second component supply unit is located among the upstream side transport unit and the downstream side transport unit that executes the holding mode with the first transport mechanism, and the upstream side that executes the holding mode with the second transport mechanism You may comprise a component mounting machine so that the range in which the conveyance part close | similar to a 1st component supply part is located in a conveyance part and a downstream conveyance part may overlap in a 2nd direction. As a result, the component mounter can be downsized in the second direction.

  As described above, according to the present invention, it is possible to reduce the time required for component mounting on a board in a configuration in which the board is carried by each of the two carrying mechanisms.

It is a top view which shows typically the structure of the component mounting machine concerning this invention. It is a block diagram which shows the main electrical structures of the component mounting machine shown in FIG. It is a timing chart which shows the operation | movement performed with a component mounting machine. It is a figure which shows typically an example of the operation | movement performed according to the timing chart of FIG.

  FIG. 1 is a plan view schematically showing a configuration of a component mounter according to the present invention. FIG. 2 is a block diagram showing the main electrical configuration of the component mounter shown in FIG. In FIG. 1, XYZ orthogonal coordinate axes in which the Z direction is the vertical direction and the X direction and the Y direction are horizontal directions are shown.

  As shown in FIG. 1, the component mounting machine 1 includes a first component supply unit 2 a provided on one side in the Y direction and a second component supply unit 2 b provided on the other side in the Y direction. In each component supply unit 2a, 2b, a plurality of feeders 21 are attached side by side in the X direction, and each feeder 21 supplies a component E to the component extraction unit 22 at the tip. The component E includes small electronic components such as a semiconductor integrated circuit device, a transistor, a capacitor, and a resistor.

  The component mounter 1 includes a first transport lane 3a and a second transport lane 3b arranged in parallel between the first component supply unit 2a and the second component supply unit 2b. Thus, of the first transport lane 3a and the second transport lane 3b adjacent in the Y direction, the first transport lane 3a is arranged on the first component supply unit 2a side, and the second transport lane 3b is the second component supply unit 2b. Arranged on the side. In other words, the first component supply unit 2a is arranged on the opposite side of the second transfer lane 3b across the first transfer lane 3a in the Y direction, and the second component supply unit 2b is the second transfer lane in the Y direction. It is arranged on the opposite side of the first transport lane 3a with 3b in between. Each of these transport lanes 3a and 3b is composed of a first conveyor unit 31, a second conveyor unit 32, a third conveyor unit 33 and a fourth conveyor unit 34 arranged in this order in the X direction which is the substrate transport direction. . The second conveyor unit 32 and the third conveyor unit 33 constitute a transport unit 30. Each of the conveyor units 31, 32, 33, and 34 has a pair of conveyors 35 and 35 that are arranged at intervals in the Y direction, and the interval between the conveyors 35 and 35 in the Y direction is the width of the substrate B in the Y direction. It can be changed according to.

  Moreover, the conveyors 35 and 35 which comprise the 3rd conveyor unit 33 of the 1st conveyance lane 3a can move to a Y direction, maintaining those intervals. In other words, the third conveyor unit 33 is movable in the Y direction between a transport position Pc indicated by a solid line in FIG. 1 and a mounting position Pm indicated by a one-dot chain line in FIG. The mounting position Pm is set closer to the second component supply unit 2b in the Y direction than the transport position Pc. When the third conveyor unit 33 is located at the transport position Pc, the first to fourth conveyor units 31 to 34 are arranged in a line in the X direction, while when the third conveyor unit 33 is located at the mounting position Pm, the third conveyor The unit 33 is shifted in the Y direction with respect to the first, second, and fourth conveyor units 31, 32, and 34.

  The first transport lane 3a is driven by the first to fourth conveyor units 31 to 34 by driving the first to fourth conveyor units 31 to 34 while the third conveyor unit 33 is positioned at the transport position Pc. The substrate B is transferred to the substrate. In addition, the first transport lane 3a moves the third conveyor unit 33 to the mounting position Pm in the Y direction after carrying the substrate B into each of the second conveyor unit 32 and the third conveyor unit 33. The substrate B is held by each of the second conveyor unit 32 and the third conveyor unit 33 which are shifted from each other. As a result, the second conveyor unit 32 holds the substrate B closer to the first component supply unit 2 a than the third conveyor unit 33, and the third conveyor unit 33 has the second component supply unit 2 b more than the second conveyor unit 32. The substrate B is held near. Thus, in the 1st conveyance lane 3a, the 2nd conveyor unit 32 and the 3rd conveyor unit 33 mutually shift in the Y direction mutually, and differ from the conveyance mode which conveys the board | substrate B in a X direction along with an X direction. The holding mode for holding the substrate B can be executed.

  Moreover, the conveyors 35 and 35 which comprise the 2nd conveyor unit 32 of the 2nd conveyance lane 3b can move to the Y direction, maintaining those intervals. That is, the second conveyor unit 32 is movable in the Y direction between a transport position Pc indicated by a solid line in FIG. 1 and a mounting position Pm indicated by a one-dot chain line in FIG. The mounting position Pm is set closer to the first component supply unit 2a in the Y direction than the transport position Pc. When the second conveyor unit 32 is positioned at the transport position Pc, the first to fourth conveyor units 31 to 34 are arranged in a line in the X direction, while when the second conveyor unit 32 is positioned at the mounting position Pm, the second conveyor The unit 32 is shifted in the Y direction with respect to the first, third, and fourth conveyor units 31, 33, and 34.

  The second transport lane 3b is rotated by the first to fourth conveyor units 31 to 34 by rotating the first to fourth conveyor units 31 to 34 while the second conveyor unit 32 is positioned at the transport position Pc. The substrate B is transferred to the substrate. In addition, the second transport lane 3b moves in the Y direction by moving the second conveyor unit 32 to the mounting position Pm after carrying the substrate B into each of the second conveyor unit 32 and the third conveyor unit 33. The substrate B is held by each of the second conveyor unit 32 and the third conveyor unit 33 which are shifted from each other. As a result, the second conveyor unit 32 holds the substrate B closer to the first component supply unit 2 a than the third conveyor unit 33, and the third conveyor unit 33 has the second component supply unit 2 b more than the second conveyor unit 32. The substrate B is held near. As described above, in the second transport lane 3b, the second conveyor unit 32 and the third conveyor unit 33 are different from each other in the transport mode in which the substrate B is transported in the X direction side by side in the X direction. The holding mode for holding the substrate B can be executed.

  As shown in FIG. 1, the second conveyor units 32 of the first transport lane 3 a and the second transport lane 3 b are adjacent to each other in the Y direction, and the first transport lane 3 a and the second transport lane 3 b The three conveyor units 33 are adjacent to each other in the Y direction. And each mounting position Pm is provided overlapping with the area | region R which spreads in the Y direction between the 2nd conveyor unit 32 of the 1st conveyance lane 3a, and the 3rd conveyor unit 33 of the 2nd conveyance lane 3b, Further, the mounting position Pm of the third conveyor unit 33 in the first transport lane 3a and the mounting position Pm of the second conveyor unit 32 in the second transport lane 3b overlap in the Y direction in the overlapping range A.

  The component mounter 1 includes a first head unit 4a provided corresponding to the first component supply unit 2a and a second head unit 4b provided corresponding to the second component supply unit 2b. Furthermore, the component mounter 1 includes a first support portion 5a and a second support portion 5b that extend in the X direction in order to support the first head unit 4a and the second head unit 4b. Each of the first support portion 5a and the second support portion 5b includes a ball screw 51 extending in the X direction and an X-axis motor 52 that rotates the ball screw 51. The first support portion 5a rotates the ball screw 51 by the X-axis motor 52 to drive the first head unit 4a attached to the nut 511 of the ball screw 51 in the X direction, and the second support portion 5b By rotating the ball screw 51 by the shaft motor 52, the second head unit 4b attached to the nut 511 of the ball screw 51 is driven in the X direction.

  The first support portion 5a and the second support portion 5b are movable in the Y direction along the Y-axis rail 54 by a Y-axis motor 53 (linear motor). That is, field coils are attached to both end portions of the first support portion 5a and the second support portion 5b as movers of the linear motor. On the other hand, in the Y-axis rail 54, a plurality of permanent magnets are arranged along the Y direction and function as a stator of the linear motor. When a current is supplied to the mover of the first support portion 5a, the first support portion 5a moves in the Y direction with the first head unit 4a, and a current is supplied to the mover of the second support portion 5b. Then, the second support portion 5b moves in the Y direction with the second head unit 4b. Thus, each of the first head unit 4a and the second head unit 4b can move in the XY direction above the first transport lane 3a and the second transport lane 3b.

  Each of the first head unit 4a and the second head unit 4b has eight mounting heads 41 arranged in the X direction. Of the first head unit 4a and the second head unit 4b, the first head unit 4a on the first component supply unit 2a side picks up the component E supplied by the first component supply unit 2a and transfers it to the substrate B. On the other hand, the second head unit 4b on the second component supply unit 2b side picks up the component E supplied by the second component supply unit 2b and transfers it onto the substrate B.

  By the way, in the present embodiment, the first head unit 4a and the second head unit with respect to the substrate B held on one of the first transport lane 3a and the second transport lane 3b that is set in the target transport lane 3T. 4b mounts the component E. Specifically, when the first transport lane 3a is set as the target transport lane 3T, the first head unit 4a places the component E on the board B held by the second conveyor unit 32 of the first transport lane 3a. The second head unit 4b mounts the component E on the board B held by the third conveyor unit 33 located at the mounting position Pm of the first transport lane 3a. When the second transport lane 3b is set as the target transport lane 3T, the first head unit 4a is placed on the substrate B held by the second conveyor unit 32 located at the mounting position Pm of the second transport lane 3b. The component E is mounted, and the second head unit 4b mounts the component E on the board B held by the third conveyor unit 33 in the second transport lane 3b.

  And in order to control said mechanical structure, the component mounting machine 1 is provided with the control part 100 which controls each part of an apparatus (FIG. 2). The control unit 100 includes an arithmetic processing unit 110 that is a computer composed of a CPU (Central Processing Unit), a RAM (Random Access Memory), and the like, a memory 120 that stores programs, mounting data, and the like, and drives each motor. A motor control unit 130 for controlling. The motor control unit 130 controls driving of the conveyor units 31, 32, 33, and 34 in the first transfer lane 3a and the second transfer lane 3b, and motors 52 and 53 of the first support unit 5a and the second support unit 5b. To control the drive. Then, the arithmetic processing unit 110 controls the motor control unit 130 according to the program and the mounting data, thereby executing various operations required for mounting components on the board B. At this time, the control unit 100 restricts the movement range of the first head unit 4a to the first component supply unit 2a side in the Y direction with respect to the second head unit 4b mounting the component E on the board B. The movement range of the two-head unit 4b is limited to the second component supply unit 2b side in the Y direction with respect to the first head unit 4a that is mounting the component E on the board B. This prevents mutual interference between the first head unit 4a and the second head unit 4b.

  Subsequently, each operation executed by the component mounter 1 will be described in detail. FIG. 3 is a timing chart showing an operation executed by the component mounter. FIG. 4 is a diagram schematically showing an example of the operation executed according to the timing chart of FIG. In FIG. 4, different codes are used to distinguish each board B carried into the component mounter 1. Specifically, for the substrate B carried into the first transport lane 3a, a code with the letter “B” followed by the subscript “a” is used, and the substrate carried into the second transport lane 3b. For B, a symbol with a subscript “b” after a character “B” is used. Further, after the character “Ba” or the character “Bb”, numbers (1, 2, 3,...) Indicating the order of loading into the component mounter 1 are added. In addition, the hatched board B in FIG. 4 is the board B that is held in the target transport lane 3T and is a component mounting target.

  As described above, the component mounting machine 1 is provided with the first transport lane 3a and the second transport lane 3b. In response to this, the control unit 100 alternatively sets one of the first transport lane 3a and the second transport lane 3b as the target transport lane 3T, and sets the target transport lane 3T on the substrate B held by the target transport lane 3T. Then, component mounting is executed. In the timing chart of FIG. 3, the second transport lane 3b is set as the target transport lane 3T and the first transport lane 3a is released from the setting of the target transport lane 3T during the first half of the time t11 to t18. The transport lane 3C is set, and during the second half of the time t21 to t28, the first transport lane 3a is set as the target transport lane 3T, and the second transport lane 3b is the release transport lane 3C.

  At time t11, as shown in FIG. 4, the first transport lane 3a includes a substrate Ba1 held by the third conveyor unit 33 located at the mounting position Pm and a substrate Ba2 held by the second conveyor unit 32. It is in a state immediately after the component mounting on each is completed. In the second transfer lane 3b, the substrate Bb1 is held by the third conveyor unit 33, and the substrate Bb2 is held by the second conveyor unit 32 located at the mounting position Pm. At time t11, the first head unit 4a and the second head unit 4b start mounting components on the board B held in the second transfer lane 3b. Thereby, the first head unit 4a mounts the component E on the substrate Bb2, and the second head unit 4b mounts the component E on the substrate Bb1 (mounting operation).

  When component mounting in the second transfer lane 3b starts, the third conveyor unit 33 moves from the mounting position Pm to the transfer position Pc in the first transfer lane 3a (time t12 to t13). That is, from time t12 to t13, the second conveyor unit 32 and the third conveyor unit 33 in the first transport lane 3a move relatively in the Y direction, and shift from the holding mode to the transport mode (first transition operation). ). And the 1st conveyance lane 3a will start conveyance of the board | substrate Ba1 and Ba2 to the X direction, if the conveyor units 31-34 are located in a line in the X direction. As a result, in the first transfer lane 3a, the board Ba1 held on the third conveyor unit 33 is carried out of the component mounting machine 1, and the board Ba2 is delivered from the second conveyor unit 32 to the third conveyor unit 33. Then, a new substrate Ba3 is carried into the second conveyor unit 32 (time t14 to t15). That is, from time t14 to t15, in the first transport lane 3a, the substrate Ba2 held by the second conveyor unit 32 is transported to the third conveyor unit 33, and the substrate Ba3 is received from the upstream side in the X direction. The substrate Ba1 held by the conveyor unit 33 is transported downstream in the X direction and the substrate Ba2 is received from the second conveyor unit 32 (transport operation). Thus, in the first transport lane 3a, when the transport of the substrate Ba2 to the third conveyor unit 33 and the transport of the substrate Ba3 to the second conveyor unit 32 are completed, the third conveyor unit 33 is moved from the transport position Pc to the mounting position Pm. (Time t16 to t17). That is, from time t16 to t17, the second conveyor unit 32 and the third conveyor unit 33 of the first transfer lane 3a move relatively in the Y direction to shift from the transfer mode to the holding mode (second transfer operation). .

  At time t18, the mounting operation on the second transport lane 3b is completed. As described above, after the mounting operation is started in the second transfer lane 3b, the first transfer operation, the transfer operation, and the second transfer operation are executed in the first transfer lane 3a in parallel with the mounting operation. Then, before the mounting operation in the second transport lane 3b is completed, the first transition operation, the transport operation, and the second transition operation in the first transport lane 3a are completed.

  At time t21, as shown in FIG. 4, the second transport lane 3b includes a board Bb1 held by the third conveyor unit 33 and a board Bb2 held by the second conveyor unit 32 located at the mounting position Pm. It is in a state immediately after the component mounting on each is completed. The first transport lane 3a is in a state where the substrate Ba2 is held by the third conveyor unit 33 located at the mounting position Pm and the substrate Ba3 is held by the second conveyor unit 32. At time 21, the first head unit 4 a and the second head unit 4 b start component mounting on the board B held in the first transport lane 3 a. Thereby, the first head unit 4a mounts the component E on the substrate Ba3, and the second head unit 4b mounts the component E on the substrate Ba2 (mounting operation).

  When component mounting in the first transport lane 3a starts, the second conveyor unit 32 moves from the mounting position Pm to the transport position Pc in the second transport lane 3b (time t22 to t23). That is, from time t22 to t23, the second conveyor unit 32 and the third conveyor unit 33 in the second transport lane 3b move relatively in the Y direction, and shift from the holding mode to the transport mode (first transition operation). ). And the 2nd conveyance lane 3b will start conveyance of the board | substrate Bb1 and Bb2 to the X direction, if the conveyor units 31-34 are located in a line in the X direction. As a result, in the second transfer lane 3b, the board Bb1 held on the third conveyor unit 33 is carried out of the component mounting machine 1, and the board Bb2 is transferred from the second conveyor unit 32 to the third conveyor unit 33. Then, a new substrate Bb3 is carried into the second conveyor unit 32 (time t24 to t25). That is, from time t24 to t25, in the second transport lane 3b, the substrate Bb2 held by the second conveyor unit 32 is transported to the third conveyor unit 33, and the substrate Bb3 is received from the upstream side in the X direction. The substrate Bb1 held by the conveyor unit 33 is transported to the downstream side in the X direction and the substrate Bb2 is received from the second conveyor unit 32 (transport operation). Thus, in the second transport lane 3b, when the transport of the substrate Bb2 to the third conveyor unit 33 and the transport of the substrate Bb3 to the second conveyor unit 32 are completed, the second conveyor unit 32 moves from the transport position Pc to the mounting position Pm. (Time t26 to t27). That is, from time t26 to t27, the second conveyor unit 32 and the third conveyor unit 33 in the second transfer lane 3b move relatively in the Y direction and shift from the transfer mode to the holding mode (second transfer operation). .

  At time t28, the mounting operation on the first transport lane 3a is completed. As described above, after the mounting operation is started in the first transfer lane 3a, the first transfer operation, the transfer operation, and the second transfer operation are executed in the second transfer lane 3b in parallel with the mounting operation. Then, before the mounting operation in the first transport lane 3a is completed, the first transition operation, the transport operation, and the second transition operation in the second transport lane 3b are completed.

  In this way, the control unit 100 performs the component mounting operation in the target transport lane 3T while alternately switching the target transport lane 3T between the first transport lane 3a and the second transport lane 3b, and the release transport lane. In 3C, the first transition operation, the transport operation, and the second transition operation are executed.

  In the embodiment configured as described above, each of the first transport lane 3 a and the second transport lane 3 b that transports the substrate B in the X direction includes the second conveyor unit 32 and the third conveyor unit 33. The second conveyor unit 32 and the third conveyor unit 33 can move relative to each other in the Y direction orthogonal to the X direction. It is possible to execute a holding mode in which different substrates B are held in different directions. Then, the first head unit 4a and the second head unit 4b mount the component E on the board B held by one target transport lane 3T of the first transport lane 3a and the second transport lane 3b. In particular, among the second conveyor unit 32 and the third conveyor unit 33 that execute the holding mode in the target transport lane 3T, the first substrate B that is held by the second conveyor unit 32 that is closer to the first component supply unit 2a. The head unit 4a transfers the component E, and the second head unit 4b transfers the component E onto the substrate B held by the third conveyor unit 33 closer to the second component supply unit 2b. In this way, the movement distance of the first head unit 4a and the second head unit 4b from the first component supply unit 2a and the second component supply unit 2b to the substrate B is suppressed, and the time required for component mounting on the substrate B is shortened. It is possible to do.

  In addition, when the target transport lane 3T is switched between the first transport lane 3a and the second transport lane 3b, the setting for the target transport lane 3T of the first transport lane 3a and the second transport lane 3b is canceled. In the transport lane 3C, the first transition operation, the transport operation, and the second transition operation are performed. In parallel with the first transition operation, the transport operation, and the second transition operation, the mounting operation is performed on the board B supported by the newly set target transport lane 3T. Therefore, it is possible to improve the efficiency of component mounting on the board B.

  In particular, the first transition operation, the transport operation, and the second transition operation in the release transport lane 3C are completed before the mounting operation is completed. Therefore, when the mounting operation in the target transport lane 3T is completed and the target transport lane 3T is switched, the mounting operation is quickly performed in the target transport lane 3T after switching (that is, the original release transport lane 3C). You can start. Thus, it is possible to more efficiently execute component mounting on the board B.

  By the way, in the above-described mounting operation, the movement range of the first head unit 4a is limited to the first component supply unit 2a side than the second head unit 4b that is mounting the component, and the movement range of the second head unit 4b. Is controlled to limit the second head to the second component supply unit 2b rather than the first head unit 4a that is mounting the component. According to such control, when the component E is mounted in a range in which the first head unit 4a and the second head unit 4b are close to each other, the other is on standby while the component E is mounted on the board B. This waiting time can be a cause of reducing the efficiency of component mounting on the board B. On the other hand, in said embodiment, it hold | maintains at the 2nd conveyor unit 32 nearer to the 1st component supply part 2a among the 2nd conveyor units 32 and the 3rd conveyor unit 33 which mutually shifted | deviated to the Y direction. The first head unit 4a transfers the component E to the substrate B, and the second head unit 4b transfers the component E to the substrate B held by the third conveyor unit 33 closer to the second component supply unit 2b. . Thereby, the occurrence of standby of the first head unit 4a or the second head unit 4b can be suppressed, and the efficiency of component mounting on the board B can be improved.

  Further, the second conveyor unit 32 that executes the holding mode in the first transport lane 3a and the third conveyor unit 33 in the range where the third conveyor unit 33 close to the second component supply unit 2b is located, and the second transport lane 3b The range in which the second conveyor unit 32 close to the first component supply unit 2a is located in the second conveyor unit 32 and the third conveyor unit 33 that execute the holding mode overlaps in the Y direction. As a result, the component mounter 1 is reduced in size in the Y direction.

  Thus, in the above embodiment, the component mounter 1 corresponds to an example of the “component mounter” of the present invention, the first transport lane 3a corresponds to an example of the “first transport mechanism” of the present invention, and the first The second transport lane 3b corresponds to an example of the “second transport mechanism” in the present invention, the target transport lane 3T corresponds to an example of the “target transport mechanism” in the present invention, and the release transport lane 3C corresponds to the “release transport in the present invention”. The transport unit 30 corresponds to an example of the “transport unit” of the present invention, the second conveyor unit 32 corresponds to an example of the “upstream transport unit” of the present invention, and the third conveyor unit. 33 corresponds to an example of the “downstream conveyance unit” of the present invention, the first component supply unit 2a corresponds to an example of the “first component supply unit” of the present invention, and the second component supply unit 2b of the present invention. This corresponds to an example of a “second component supply unit”, and the first head unit 4a is the present invention. The second mounting unit 4b corresponds to an example of a “first mounting unit”, the second head unit 4b corresponds to an example of a “second mounting unit” of the present invention, the control unit 100 corresponds to an example of a “control unit” of the present invention, The board B corresponds to an example of the “board” of the present invention, the component E corresponds to an example of the “component” of the present invention, the X direction corresponds to an example of the “first direction” of the present invention, and the Y direction This corresponds to an example of the “second direction” of the present invention, and the overlapping range A is an example of the “overlapping portion” of the present invention.

  The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention. For example, in the above embodiment, the mode switching between the transfer mode and the holding mode is performed by moving the third conveyor unit 33 in the first transfer lane 3a, and the second conveyor unit 32 is moved in the second transfer lane 3b. Mode switching was executed. However, mode switching may be performed by moving the second conveyor unit 32 in the first transport lane 3a, and mode switching may be performed by moving the third conveyor unit 33 in the second transport lane 3b. In addition, mode switching in each of the first transport lane 3a and the second transport lane 3b may be performed by moving both the second conveyor unit 32 and the third conveyor unit 33 in the opposite directions.

  In the above embodiment, the mounting position Pm of the third conveyor unit 33 in the first transport lane 3a and the mounting position Pm of the second conveyor unit 32 in the second transport lane 3b overlap each other in the Y direction. However, it is not essential to overlap each mounting position Pm in this way.

1 ... component mounter,
2a ... 1st component supply part (1st component supply part),
2b ... 2nd component supply part (2nd component supply part),
3a ... 1st conveyance lane (1st conveyance mechanism),
3b ... 2nd conveyance lane (2nd conveyance mechanism),
3T: Target transport lane (target transport mechanism),
3C: Release transport lane (release transport mechanism),
30 ... transport unit,
31 ... 1st conveyor unit,
32 ... 2nd conveyor unit (upstream transport section),
33 ... third conveyor unit (downstream conveying section),
34 ... 4th conveyor unit 4a ... 1st head unit (1st mounting part),
4b ... 2nd head unit (2nd mounting part),
100 ... control unit,
A ... Overlapping range,
B ... Substrate,
E ... Parts,
X ... X direction (first direction),
Y ... Y direction (second direction)

Claims (6)

A first transport mechanism for transporting a substrate in a first direction;
A second transport mechanism that is disposed adjacent to the first transport mechanism from a second direction orthogonal to the first direction and transports the substrate in the first direction;
A control unit that sets one of the first transport mechanism and the second transport mechanism as a target transport mechanism;
A first component supply unit that is disposed on the opposite side of the second transfer mechanism with the first transfer mechanism interposed therebetween in the second direction, and supplies a component;
A second component supply unit that is disposed on the opposite side of the first transport mechanism across the second transport mechanism in the second direction, and that supplies a component;
A first mounting unit that transfers components from the first component supply unit to a substrate held by the target transport mechanism;
A second mounting unit that transfers components from the second component supply unit to the substrate held by the target transport mechanism;
Each of the first transport mechanism and the second transport mechanism is provided with a transport unit including an upstream transport section and a downstream transport section disposed downstream of the upstream transport section in the first direction. The transport mode in which the upstream transport unit and the downstream transport unit transport substrates in the first direction side by side in the first direction, and holding that holds different substrates in the second direction with respect to each other. Mode and can run
Of the upstream transport unit and the downstream transport unit that execute the holding mode in the target transport mechanism, the first mounting unit is mounted on a substrate that is held by a transport unit closer to the first component supply unit. , And the second mounting unit transfers the component onto the substrate held by the transport unit closer to the second component supply unit. Among the first transport mechanism and the second transport mechanism, in the release transport mechanism in which the setting to the target transport mechanism is canceled along with the switching of the target transport mechanism,
A first transition operation in which the upstream transport section and the downstream transport section move relatively in the second direction and shift from the holding mode to the transport mode;
The substrate held by the upstream transfer unit is transferred to the downstream transfer unit and the substrate is received from the upstream side in the first direction, and the substrate held by the downstream transfer unit is transferred in the first direction. A transport operation for transporting to the downstream side and receiving a substrate from the upstream transport unit;
A second transition operation in which the upstream transport unit and the downstream transport unit move relative to each other in the second direction and shift from the transport mode to the holding mode is performed in these order,
In parallel with the execution of the first transition operation, the transport operation, and the second transition operation in the release transport mechanism, the first mounting portion and the second mounting portion are components on the substrate held by the target transport mechanism. The component mounter according to claim 1, wherein a mounting operation for transferring the component is executed.   The component mounting machine according to claim 2, wherein the first transfer operation, the transfer operation, and the second transfer operation in the release transfer mechanism are completed before the mounting operation is completed.   The movement range of the first mounting unit is limited to the first component supply unit side in the second direction than the second mounting unit that is mounting components, and the movement range of the second mounting unit is 4. The component mounting machine according to claim 1, wherein the component mounting machine is limited to the second component supply unit side in the second direction with respect to the first mounting unit that is mounting a component. 5.   A range in which the conveyance unit close to the second component supply unit is located among the upstream conveyance unit and the downstream conveyance unit that execute the holding mode in the first conveyance mechanism, and the holding mode in the second conveyance mechanism. The range in which the conveyance part close | similar to a said 1st components supply part among the said upstream conveyance part and the said downstream conveyance part which performs 2 has a part which overlaps in a said 2nd direction. The component mounting machine according to claim 1. A first transport mechanism that transports the substrate in the first direction, and a second transport that is disposed adjacent to the first transport mechanism from the second direction orthogonal to the first direction and transports the substrate in the first direction. A process of transporting and holding a substrate using a mechanism;
Arranged on the opposite side of the second transport mechanism to the substrate held by one of the first transport mechanism and the second transport mechanism with the first transport mechanism sandwiched in the second direction. The second component supply unit disposed on the opposite side of the first transport mechanism in the second direction with the second transport mechanism sandwiched between the first component supply unit and the first mounting unit. And a step of transferring the component by the second mounting part.
Each of the first transport mechanism and the second transport mechanism is provided with a transport unit including an upstream transport section and a downstream transport section disposed downstream of the upstream transport section in the first direction. The transport mode in which the upstream transport unit and the downstream transport unit transport substrates in the first direction side by side in the first direction, and holding that holds different substrates in the second direction with respect to each other. Mode and can run
Of the upstream transport unit and the downstream transport unit that execute the holding mode in the target transport mechanism, the first mounting unit is mounted on a substrate that is held by a transport unit closer to the first component supply unit. A component mounting method in which the second mounting unit transfers a component to a substrate held by a transport unit closer to the second component supply unit.

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