JP2017217598A - Coating film formation method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coating film formation method for a lightweight inorganic base material capable of efficiently obtaining a coating film excellent in base material reinforcement property, adhesiveness, durability and the like.SOLUTION: A substance contains an epoxy resin, an amine curing agent and a nonaqueous solvent as first coating film formation materials with respect to a lightweight inorganic base material having a bulk density of 0.8 g/cmor less, where a ratio of the nonaqueous solvent is 40-400 pts.wt. with respect to 100 pts.wt. of the total solid content of the epoxy resin and the amine curing agent, and contains an aliphatic hydrocarbon solvent and a polar solvent having one or more polar groups selected from a hydroxyl group, an ether group and an ester group and having a boiling point of 100-260°C, as the nonaqueous solvents.SELECTED DRAWING: None

Description

  The present invention relates to a novel film forming method.

  2. Description of the Related Art Conventionally, inorganic coatings used for wall materials, ceiling materials, and the like have been subjected to various types of coatings for the purpose of enhancing their aesthetics and durability. In such coating, a primer material and a topcoat material are often used.

  Of these, lightweight inorganic base materials such as calcium silicate plates are porous because they are porous, and have the advantage of being excellent in heat insulation, workability, dimensional stability, and the like. On the other hand, the surface is brittle and tends to be pulverized. Therefore, when applying to such a lightweight inorganic base material, the device which improves a base material reinforcement property, adhesiveness, etc. is performed by performing the process using 2 or more types of undercoat materials (patent) Literature 1-3 etc.).

JP 2001-113224 A JP 2001-70875 A JP 2014-184414 A

  However, in the method of the above-mentioned patent document and the like, processing with two or more kinds of undercoat materials is required, so that the operation becomes complicated and the construction period may be prolonged.

  The present invention has been made in view of these points, and an object of the present invention is to efficiently obtain a coating excellent in substrate reinforcement, adhesion, durability, etc., in a coating forming method for a lightweight inorganic substrate. Is.

  In order to solve such a problem, the present inventors have conceived a film forming method using a film forming material containing an epoxy resin, an amine curing agent, and a specific nonaqueous solvent as a result of intensive studies. It came to complete.

  That is, the present invention has the following characteristics.

1. It is a film forming method for applying at least one film forming material to a lightweight inorganic base material having a bulk density of 0.8 g / cm ³ or less,
As the first film forming material,
Including epoxy resin, amine curing agent, and non-aqueous solvent,
The ratio of the non-aqueous solvent is 40 to 400 parts by weight with respect to 100 parts by weight of the total solid content of the epoxy resin and the amine curing agent,
As the non-aqueous solvent, an aliphatic hydrocarbon solvent and a solvent containing a polar solvent having a boiling point of 100 to 260 ° C. having one or more polar groups selected from a hydroxyl group, an ether group, and an ester group are used. A method for forming a film.

  ADVANTAGE OF THE INVENTION According to this invention, in the film formation method with respect to a lightweight inorganic base material, the film excellent in base-material reinforcement, adhesiveness, durability, etc. can be obtained efficiently.

  Hereinafter, modes for carrying out the present invention will be described.

The present invention is a film forming method in which at least one film forming material is applied to a lightweight inorganic base material having a bulk density of 0.8 g / cm ³ or less.

[Lightweight inorganic substrate]
As a painting target object of this invention, it can apply to the lightweight inorganic base material which comprises a wall material, ceiling material, etc., for example. The bulk density of such a lightweight inorganic base material is 0.8 g / cm ³ or less, preferably 0.1 g / cm ³ or more and 0.6 g / cm ³ or less, more preferably 0.15 g / cm ³ or more and 0. 0.5 g / cm ³ or less. In the present invention, an advantageous effect can be obtained in such a lightweight inorganic base material.

  Examples of the lightweight inorganic base material in the present invention include various inorganic base materials having a bulk density within the above range. Specific examples of the lightweight inorganic base material include, for example, fiber-mixed cement board, calcium silicate board, slag cement pearlite board, wood chip cement board, lightweight cellular concrete board, and gypsum board. In the present invention, particularly advantageous effects can be obtained when the object to be coated is a calcium silicate plate. These lightweight inorganic base materials may have various existing coatings.

[First film forming material]
In the present invention, a first film forming material is first applied to the lightweight inorganic base material. The 1st film formation material of this invention contains an epoxy resin, an amine hardening | curing agent, and a specific nonaqueous solvent.

  Of these, the epoxy resin acts as a binder. As the epoxy resin, one having two or more epoxy groups in one molecule can be used. For example, bisphenol type epoxy resin such as bisphenol A type epoxy resin and bisphenol F type epoxy resin, phenol novolac type bisphenol A epoxy resin, phenol Phenol novolac type epoxy resin such as novolac type bisphenol F epoxy resin, cresol novolac type epoxy resin, novolac type epoxy resin such as bisphenol A novolak type epoxy resin, copolymer type epoxy resin of bisphenol A type epoxy resin and phenol novolac resin, Diglycidyl ether of dihydroxynaphthalene, polyglycidyl ether of mono (di) hydroxynaphthalene novolak, phenol-divinylbenzene cross-linked phenolic tree Polyglycidyl ethers, bisphenol A- polyglycidyl ethers of divinylbenzene crosslinked phenolic resins, mono (di) hydroxy naphthalene - polyglycidyl ethers of divinylbenzene crosslinked phenol resin, or their modified products and the like. These can be used alone or in combination of two or more. Such an epoxy resin is desirably one that can be dissolved in a non-aqueous solvent described later (soluble type).

  The epoxy equivalent (per solid content) of the epoxy resin is preferably 300 to 2000 g / eq, more preferably 400 to 1800 g / eq. The epoxy equivalent is a value obtained by dividing the molecular weight of the epoxy resin by the number of epoxy groups.

  The amine curing agent is a component that forms a crosslinked film by reacting with the epoxy resin. Examples of the amine curing agent include aliphatic polyamines, alicyclic polyamines, aromatic polyamines, heterocyclic amines, aliphatic polyamides, alicyclic polyamides, aromatic polyamides, aliphatic polyamide amines, alicyclic polyamide amines, aromatic Group polyamidoamines, etc., or modified products thereof. These can be used alone or in combination of two or more. Such an amine curing agent is desirably one that can be dissolved in a non-aqueous solvent described later (soluble type).

  The active hydrogen equivalent (per solid content) of the amine curing agent is preferably 50 to 500 g / eq, more preferably 60 to 400 g / eq. The active hydrogen equivalent is a value obtained by dividing the molecular weight of the amine curing agent by the number of amino group hydrogen atoms.

  The mixing ratio of the epoxy resin and the amine curing agent is not particularly limited, but [(Amount of amine curing agent / active hydrogen equivalent of amine curing agent) / (Amount of epoxy resin / epoxy equivalent of epoxy resin)] is , Preferably 0.1 to 10, more preferably 0.3 to 2, and even more preferably 0.6 to 1.5.

The non-aqueous solvent in the first film-forming material is a component that acts as a medium for dissolving or dispersing (preferably dissolving) each of the above components. The non-aqueous solvent is a solvent other than water, and in the present invention, the following two solvents are included as essential components.
(P) an aliphatic hydrocarbon solvent (hereinafter also referred to as “component (p)”).
(Q) A polar solvent having a boiling point of 100 to 260 ° C. (hereinafter also referred to as “component (q)”) having one or more polar groups selected from a hydroxyl group, an ether group, and an ester group.

  The component (p) is a non-aqueous solvent that is less toxic than toluene, xylene, etc., has high work safety, and has little influence on air pollution. Examples of the component (p) include n-hexane, n-pentane, n-octane, n-nonane, n-decane, n-undecane, n-dodecane and the like, and these are one kind or two or more kinds. Can be used. Moreover, in this invention, (p) component can also be introduce | transduced by using aliphatic hydrocarbon containing mixed solvents, such as a mineral spirit. The component (p) is preferably contained in an amount of 5% by weight or more, more preferably 10 to 80% by weight, based on the total amount of the nonaqueous solvent.

  The component (q) is a polar solvent having one or more polar groups selected from a hydroxyl group, an ether group, and an ester group in one molecule and satisfying a boiling point of 100 to 260 ° C.

  Examples of the component (q) include alkylene glycol monoalkyl ether compounds, alkylene glycol dialkyl ether compounds, alkylene glycol monoalkyl ether acetate compounds, alcohol compounds, and the like. These can be used alone or in combination of two or more. The component (q) is preferably contained in an amount of 1 to 30% by weight, more preferably 2 to 20% by weight, based on the total amount of the nonaqueous solvent.

  Among these, as the alkylene glycol monoalkyl ether compound, for example, ethylene glycol monomethyl ether (boiling point 125 ° C.), ethylene glycol monoethyl ether (boiling point 136 ° C.), ethylene glycol mono n-butyl ether (boiling point 170 ° C.), ethylene glycol mono tert-butyl ether (boiling point 153 ° C.), diethylene glycol monomethyl ether (boiling point 194 ° C.), diethylene glycol monoethyl ether (boiling point 202 ° C.), diethylene glycol monobutyl ether (boiling point 230 ° C.), propylene glycol monomethyl ether (boiling point 120 ° C.), propylene glycol mono Ethyl ether (boiling point 132 ° C), propylene glycol monobutyl ether (boiling point 170 ° C), dipropylene glycol mono Cyl ether (boiling point 188 ° C.), propylene glycol monoethyl ether (boiling point 132 ° C.), propylene glycol monopropyl ether (boiling point 145 ° C.), propylene glycol mono n-butyl ether (boiling point 170 ° C.), dipropylene glycol monopropyl ether (boiling point 230) ° C), ethylene glycol mono-2-ethylhexyl ether (boiling point 229 ° C), and the like.

  Examples of the alkylene glycol dialkyl ether compound include ethylene glycol diethyl ether (boiling point 121 ° C.), ethylene glycol dibutyl ether (boiling point 203 ° C.), diethylene glycol ethyl methyl ether (boiling point 176 ° C.), diethylene glycol dimethyl ether (boiling point 162 ° C.), diethylene glycol ethyl methyl ether. (Boiling point 179 ° C.), diethylene glycol diethyl ether (boiling point 189 ° C.), diethylene glycol dibutyl ether (boiling point 256 ° C.), dipropylene glycol dimethyl ether (boiling point 171 ° C.), triethylene glycol dimethyl ether (boiling point 216 ° C.), and the like.

  Examples of the alkylene glycol monoalkyl ether acetate compound include ethylene glycol monomethyl ether acetate (boiling point 145 ° C.), diethylene glycol monoethyl ether acetate (boiling point 217 ° C.), ethylene glycol monoethyl ether acetate (boiling point 156 ° C.), ethylene glycol monobutyl ether. Examples include acetate (boiling point 217 ° C.), diethylene glycol monoethyl ether acetate (boiling point 217 ° C.), propylene glycol monomethyl ether acetate (boiling point 146 ° C.), and the like.

  Examples of the alcohol compound include 2-methyl-1-propanol (boiling point 108 ° C.), 1-butanol (boiling point 117 ° C.), 1-pentanol (boiling point 138 ° C.), 1-hexanol (boiling point 158 ° C.), 1- Heptanol (boiling point 176 ° C), cyclohexanol (boiling point 161 ° C), benzyl alcohol (boiling point 205 ° C), ethylene glycol (boiling point 197 ° C), 1,4-butanediol (boiling point 230 ° C), 1,5-pentanediol ( Boiling point 242 ° C.), diethylene glycol (boiling point 244 ° C.), and the like.

  The component (q) preferably includes a compound having two or more polar groups in one molecule, and more preferably includes a compound having a hydroxyl group and an ether group in one molecule. As the component (q) in the present invention, an embodiment containing an alkylene glycol monoalkyl ether compound is particularly suitable.

  The boiling point of the component (q) is 100 to 260 ° C, preferably 105 to 200 ° C. The boiling point is a value measured at 1 atmosphere. When the boiling point of the component (q) is too low, it tends to volatilize early in the film formation process, and it becomes difficult to obtain an effect of improving the base material reinforcement. When the boiling point of the component (q) is too high, the dry curability may be adversely affected.

  In the 1st film formation material, things other than the said (p) component and (q) component can also be used as a non-aqueous solvent. Examples of such non-aqueous solvents include petroleum solvents such as petroleum ether, petroleum naphtha, and solvent naphtha, as well as ethyl acetate, butyl acetate, methyl ethyl ketone, and methyl isobutyl ketone. As the nonaqueous solvent excluding the component (p) and the component (q), an embodiment containing a petroleum solvent (aromatic hydrocarbon-containing petroleum mixed solvent) having a mixed aniline point or an aniline point of 12 to 70 ° C is preferable. The mixed aniline point or aniline point is a value measured by the method of JIS K2256.

  The ratio of such a non-aqueous solvent is 40 to 400 parts by weight, preferably 60 to 300 parts by weight, more preferably 70 to 230 parts by weight, based on 100 parts by weight of the total solid content of the epoxy resin and the amine curing agent. More preferably, it is 80-180 weight part. In the present invention, by including the non-aqueous solvent in a specific ratio as described above, it is possible to obtain excellent performance in base material reinforcement, adhesion, durability, and the like. When the non-aqueous solvent is too much above the specified value, it is difficult to obtain sufficient performance in adhesion, durability, and the like. When the amount of the non-aqueous solvent is too much less than the above specified value, there is a risk of hindering the substrate reinforcement.

  Although the mechanism of action in which the effects of the present invention are achieved is not clear, the non-aqueous solvent satisfies the above-described conditions, so that the balance of drying property, permeability, etc. is good, and the phase between the epoxy resin and the amine curing agent is good. Since it is excellent in solubility, curability and the like, it is presumed that a sufficient cured film is formed from the outermost surface of the lightweight inorganic base material to the inside in the vicinity of the surface.

  In the first film forming material, a silane compound may be mixed in addition to the above components. The silane compound is suitable in terms of improving the substrate reinforcing property, adhesion, durability and the like. Such a silane compound is a compound having a reactive silyl group. Examples of reactive silyl groups include those in which an alkoxyl group, phenoxy group, mercapto group, amino group, halogen, hydrogen atom, or the like is bonded to a silicon atom. Among these, an alkoxysilyl group in which an alkoxyl group is bonded to a silicon atom is preferable. It is. Specifically, examples of the silane compound include tetraalkoxysilane, alkyltrialkoxysilane, dialkyldialkoxysilane, epoxy group-containing silane coupling agent, amino group-containing silane coupling agent, and the like. These can be used alone or in combination of two or more. Although the mixing ratio of a silane compound is not specifically limited, Preferably it is 0.1-30 weight part with respect to 100 weight part of solid content of an epoxy resin, More preferably, it is 0.3-20 weight part.

  In the first film forming material, in addition to the above-described components, various components can be mixed to such an extent that the effects of the present invention are not affected. Examples of such components include pigments, plasticizers, antiseptics, antifungal agents, anti-algae agents, antifoaming agents, leveling agents, pigment dispersants, anti-settling agents, anti-sagging agents, anti-skinning agents, and dehydration agents. Agents, matting agents, ultraviolet absorbers, light stabilizers, antioxidants, catalysts and the like. The first film-forming material can be produced by uniformly stirring and mixing the above components by a conventional method.

  The first film forming material is desirably used in a two-component form. In other words, it is desirable to use a two-component type consisting of a main agent containing an epoxy resin and a curing agent containing an amine curing agent at the time of distribution, and to mix and use these during coating. The non-aqueous solvent can be mixed with the main agent and / or the curing agent.

As a coating method of the first film forming material, various methods such as brush coating, roller coating, spray coating, roll coater, and flow coater can be used. The coating amount during coating is preferably 10 to 300 g / m ² , more preferably 20 to 200 g / m ² in terms of solid content. The number of coatings of the first film forming material may be appropriately set depending on the surface state of the lightweight inorganic base material, but is preferably 1 to 2 times.

  The drying time of the first film forming material is preferably 1 hour or longer, more preferably about 2 to 400 hours. The drying temperature is preferably −10 to 50 ° C., more preferably −5 to 40 ° C. In the present invention, excellent performance can be exhibited even when the drying temperature is relatively low.

[Second film forming material]
In the present invention, the second film forming material can be applied after the first film forming material is applied and dried. Examples of the second film forming material include those containing a resin component and a color pigment. Such a 2nd film formation material contributes to aesthetics provision, durability improvement, etc.

  Various resins can be used as the resin component in the second film forming material. Examples of the resin include vinyl acetate resin, polyester resin, alkyd resin, vinyl chloride resin, epoxy resin, acrylic resin, urethane resin, acrylic silicon resin, fluorine resin, and composite resins thereof. Among these, one or more selected from acrylic resins, urethane resins, acrylic silicon resins, fluororesins, and the like are preferable. Examples of such resin components include water-soluble resins, water-dispersible resins (resin emulsions), solvent-soluble resins, solvent-free resins, non-water-dispersed resins, and powder resins. Among these, one or more selected from water-soluble resins, water-dispersible resins, solvent-soluble resins, and non-water-dispersed resins are preferable. Among these, as the solvent-soluble resin and / or the non-water dispersible resin, a weak solvent resin containing an aliphatic hydrocarbon solvent is preferable. Moreover, these resin components may have a crosslinking reactivity. When a resin component having crosslinking reactivity is used, the durability, water resistance, weather resistance, chemical resistance, adhesion and the like of the coating can be improved.

  As a coloring pigment, a well-known coloring pigment can be used, for example, what was illustrated by the said 1st film forming material can be used. By appropriately using one or more of these color pigments, the second film forming material can be set to a desired hue. The mixing ratio of the color pigment in the second film forming material is preferably 1 to 500 parts by weight, more preferably 5 to 200 parts by weight, and still more preferably 10 to 100 parts by weight with respect to 100 parts by weight of the solid content of the resin component. It is.

  Such a second film-forming material may contain various components other than the above components as long as the effects of the present invention are not significantly impaired. Examples of such components include thickeners, film-forming aids, leveling agents, wetting agents, plasticizers, antifreezing agents, pH adjusters, extender pigments, aggregates, antiseptics, antifungal agents, and antialgae. Agents, antibacterial agents, dispersants, antifoaming agents, adsorbents, fibers, crosslinking agents, UV absorbers, antioxidants, low-contaminants, water repellents, catalysts, solvents, water, and the like. The 2nd film formation material of this invention can be manufactured by mixing the said resin component, a color pigment, and the above-mentioned various components as needed uniformly by a conventional method.

In the coating of the second film forming material, a known coating tool can be used. For example, a spray, a roller, a brush, or the like can be used as the coating instrument. Coating with the amount of the second film-forming material, preferably on a solid basis 30 g / ^{m 2} or more, more preferably 50 to 500 g / ^{m 2.} At the time of painting, it can be appropriately diluted as necessary. The number of coatings of the second film forming material is preferably 1 to 2 times.

  Examples and comparative examples are shown below to clarify the features of the present invention.

○ First film forming materials A to F
Epoxy resin A {phenol novolac bisphenol A epoxy resin solution, solid content 50% by weight, epoxy equivalent (solid content) 800 g / eq}, solvent A (mineral spirit), solvent B {ethylene glycol mono tert-butyl ether (boiling point 153 ° C. )}, Solvent C {petroleum solvent (mixed aniline point 14 ° C.)}, main agent containing additive (antifoaming agent), amine curing agent A {aliphatic polyamidoamine, solid content 70% by weight, active hydrogen equivalent ( Solid content) 120 g / eq} was mixed to prepare first film forming materials A to F. The ratio of each component in each first film forming material is as shown in Table 1. In addition, the solvent contained in the medium of each component is also added to the solvent ratio in Table 1.

Example 1
In Example 1, the following test was performed using the first film-forming material A.

○ Substrate reinforcement By spray coating the first film-forming material on the calcium silicate plate (bulk density 0.35 g / cm ³ ) at a coating amount of 100 g / m ² (solid content conversion) and drying for 24 hours. A test piece was prepared. The painting and drying were performed in a 5 ° C. environment. About the obtained test piece, the adhesiveness test by a cross-cut method is performed, the thing in which peeling was not recognized is "a", and the thing in which peeling of 5% or less was recognized is "b". The case where peeling was observed was evaluated as “c”, the case where peeling exceeding 10% and 15% or less was recognized was evaluated as “c”, and the case where peeling exceeding 15% was recognized was evaluated as “e”.

○ Adhesiveness Calcium silicate plate (bulk density: 0.35 g / cm ³ ) is spray-coated with a first film-forming material at a coating amount of 100 g / m ² (in terms of solid content), dried for 24 hours, and then the second film A test piece was prepared by spray-coating the forming material (polyurethane resin paint) at a coating amount of 130 g / m ² (in terms of solid content) and drying for 96 hours. The painting and drying were performed in a 5 ° C. environment. About the obtained test piece, the adhesiveness test by a cross-cut method is performed, the thing in which peeling was not recognized is "a", and the thing in which peeling of 5% or less was recognized is "b". The case where peeling was observed was evaluated as “c”, the case where peeling exceeding 10% and 15% or less was recognized was evaluated as “c”, and the case where peeling exceeding 15% was recognized was evaluated as “e”.

○ Durability A test piece obtained by the same method as above was immersed in water for 96 hours, and then an adhesion test by a cross-cut method was performed. "B" for the case where the peeling was observed, "c" for the case where peeling of more than 5% and 10% or less was observed, "c" for the case where peeling of more than 10% and 15% or less was recognized, exceeding 15% The case where peeling was recognized was evaluated as “e”.

(Example 2)
In Example 2, the above test was performed using the first film forming material B.

(Example 3)
In Example 3, the above test was performed using the first film-forming material C.

Example 4
In Example 3, the above test was performed using the first film-forming material D.

(Comparative Example 1)
In Comparative Example 1, the above test was performed using the first film forming material E.

(Comparative Example 2)
In Comparative Example 2, the above test was performed using the first film forming material F.

  The test results are shown in Table 2. Examples 1-4 were good results.

Claims (1)

It is a film forming method for applying at least one film forming material to a lightweight inorganic base material having a bulk density of 0.8 g / cm ³ or less,
As the first film forming material,
Including epoxy resin, amine curing agent, and non-aqueous solvent,
The ratio of the non-aqueous solvent is 40 to 400 parts by weight with respect to 100 parts by weight of the total solid content of the epoxy resin and the amine curing agent,
As the non-aqueous solvent, an aliphatic hydrocarbon solvent and a solvent containing a polar solvent having a boiling point of 100 to 260 ° C. having one or more polar groups selected from a hydroxyl group, an ether group, and an ester group are used. A method for forming a film.