JP2017212662A - Power converter and antenna device with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a miniaturized power converter and an antenna having the power converter.SOLUTION: A power converter 100 comprises: a first substrate unit 101; a second substrate unit 102; and an adhesive member 103 provided between them. In the first substrate unit 101, a first transmission pattern 12 and a coupling element 11 are arranged to a first upper surface 10a of a first substrate 10, and a first lower surface ground 14 constructing a reflective wall of an electromagnetic wave with the first transmission pattern 12 and the coupling element 11 is arranged to a first lower surface 10b of the first substrate 10. In the second substrate unit 102, a matching element 21, a second transmission pattern 23, and a separation pattern 22 that suppresses the leakage of the electromagnetic wave from the matching element 21 are arranged on a second lower surface 20b of a second substrate 20. On a second upper surface 20a of the second substrate 20, the matching element 21, a second transmission ground 23, and a second transmission pattern 28 that constructs the reflective wall of the electromagnetic wave are arranged.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a power converter and an antenna device including the same.

  Patent Document 1 discloses a waveguide / microstrip line converter. In this waveguide / microstrip line converter, a waveguide having a hollow portion, a ground plate, a dielectric substrate, and a shield plate are laminated in order from the bottom. The ground plate has a closed region formed of an opening, and the ground plate is disposed so that the closed region corresponds to the hollow portion of the waveguide. Matching elements are arranged on the back surface of the dielectric substrate so as to correspond to the closed region of the ground plate. A cut is formed in the shield plate, and the transmission pattern is arranged corresponding to this cut. Thereby, a transmission pattern overlaps with a part of matching element.

  In the waveguide / microstrip line converter of Patent Document 1, a coplanar line and a microstrip line are formed. That is, within the cutout of the shield plate, the transmission pattern and the shield plate are arranged side by side on the dielectric substrate, thereby forming a coplanar line. Further, outside the closed region, the ground plate and the transmission pattern sandwich the dielectric substrate, thereby forming a microstrip line. Therefore, in patent document 1, the power transmitted through the hollow portion of the waveguide and the power transmitted through the planar line are converted by connecting the planar line such as the microstrip line and the coplanar line and the waveguide. doing.

JP 2011-223203 A

  However, since the waveguide / microstrip line converter of Patent Document 1 uses a waveguide, the size of the entire converter is large. This is because in the case of a waveguide, it is necessary to provide a hollow portion covered with a side wall inside the waveguide as a waveguide for propagation of electromagnetic waves. Therefore, it is difficult to achieve downsizing of the power converter.

  Accordingly, an object of the present invention is to provide a miniaturized power converter and an antenna having the power converter.

  A power converter according to an aspect of the present invention includes a first board, a first transmission pattern, a coupling element, a first transmission ground, a second board, a matching element, a separation pattern, and a second transmission ground. And a second transmission pattern and a fixing member.

  The first substrate has a first surface and a second surface disposed on the side opposite to the first surface. The first transmission pattern is disposed on the first surface. The coupling element is disposed on the first surface and connected to the end of the first transmission pattern. The first transmission ground is at least partially disposed on the second surface at a position corresponding to the first transmission pattern and the coupling element, and constitutes an electromagnetic wave reflection wall together with the first transmission pattern and the coupling element. The second substrate has a third surface facing the first surface of the first substrate, and a fourth surface disposed on the opposite side of the third surface. The matching element is disposed on the third surface at a position facing the coupling element, and is electromagnetically coupled to the coupling element. The separation pattern is disposed on the third surface, is separated from the matching element, and is disposed on at least a part of the periphery of the matching element to suppress leakage of electromagnetic waves from the matching element. The second transmission ground is disposed on the third surface. The second transmission pattern is disposed on the fourth surface at a position corresponding to the matching element and the second transmission ground, and constitutes an electromagnetic wave reflection wall together with the matching element and the second transmission ground. The fixing member fixes the first substrate and the second substrate. The fixing member includes an adhesive member that bonds both substrates with an adhesive, a fixing member that fixes both substrates in a predetermined position, and a fixing member that fixes both substrates in a predetermined position and is detachable from both substrates. And the like including a member for temporarily or permanently fixing both substrates.

  With the above configuration, the following effects can be obtained. First, in this power converter, the first transmission pattern, the coupling element, and the first transmission ground form a microstrip line that is an electromagnetic wave transmission line across the first substrate. On the other hand, the second transmission ground, the matching element, and the second transmission pattern constitute a microstrip line that is an electromagnetic wave transmission line across the second substrate. The electromagnetic wave is transmitted to the coupling element by the microstrip line on the first substrate, then radiated to the second substrate, and further transmitted along the second transmission pattern by the microstrip line on the second substrate. Then, transmission of electromagnetic waves from the second transmission pattern of the second substrate to the first transmission pattern of the first substrate is performed in the reverse order to that described above.

  That is, according to the power converter, power conversion is performed between the transmission line of the first substrate and the transmission line of the second substrate. Since these transmission lines can be formed by patterns on both sides of each substrate, the power converter can be reduced in thickness and size. Therefore, for example, it can be made thinner and smaller than a waveguide in which a hollow portion needs to be formed.

  In the power converter, a separation pattern is provided at a position separated from the matching element. The effective dielectric constant of the second substrate changes with the end face of the separation pattern as a reference, whereby the electromagnetic wave that leaks from the matching element and propagates through the second substrate is reflected. Therefore, it is possible to suppress the electromagnetic wave radiated from the matching element from spreading into the second substrate and the air, and unnecessary radiation. As a result, power loss can be suppressed and an efficient power converter can be obtained.

  In the power converter, at least a part of the first and second transmission patterns can be formed to extend in a first direction along a surface direction of the first and second substrates. In this case, the separation pattern is separated from the matching element in the plane direction of the first and second substrates, on the opposite side to the first transmission pattern, and extends in the second direction intersecting the first direction. Includes patterns.

  Thereby, the electromagnetic wave mainly in the first direction is radiated from the matching element through the first transmission pattern or the second transmission pattern extending in the first direction. The first pattern extends in a second direction intersecting the first direction, and the effective dielectric constant of the second substrate changes with the end face of the first pattern as a reference. Due to this change in effective dielectric constant, electromagnetic waves that leak from the matching element and propagate through the second substrate are reflected. That is, the first pattern extending in the second direction mainly reflects the electromagnetic wave in the first direction that is radiated from the matching element and propagates in the second substrate. Thereby, it is possible to suppress the electromagnetic wave from the matching element from spreading in the second substrate and in the air, thereby suppressing power loss.

In the power converter, when the guide wavelength of the electromagnetic wave in the first pattern is λf, the first width can be an odd multiple of ¼λf.
In this case, a standing wave is formed in the first pattern, and in the first pattern, a node of the standing wave is located on the end face close to the matching element, and an antinode of the standing wave is located on the end face far from the matching element. To position. At the end face where the node of the standing wave is located, the impedance from the matching element side toward the first pattern side is zero, that is, the potential is zero, resulting in a shorted state. On the other hand, on the end face where the antinode of the standing wave is located, the impedance from the matching element side toward the outside of the first pattern becomes infinite. Thereby, it is possible to suppress the electromagnetic wave in the first direction leaking from the matching element from spreading in the second substrate and in the air, thereby suppressing power loss.

In the above power converter, the separation pattern may include a second pattern that extends in the second direction and is separated from the matching element toward the first transmission pattern in the plane direction of the first and second substrates. it can.
The second pattern extending in the second direction causes a change in the effective dielectric constant of the second substrate, similar to the first pattern. Due to this change in effective dielectric constant, electromagnetic waves that leak from the matching element and propagate through the second substrate are reflected. That is, the second pattern extending in the second direction mainly reflects the electromagnetic wave in the first direction that is radiated from the matching element and propagates in the second substrate. Thereby, it is possible to suppress the electromagnetic wave from the matching element from spreading in the second substrate and in the air, thereby suppressing power loss.

  In the power converter, when the guide wavelength of the electromagnetic wave in the second pattern is λg, the second width can be an odd multiple of ¼λg. In this case, a standing wave is formed in the second pattern, and in the second pattern, a node of the standing wave is located on the end face close to the matching element, and an antinode of the standing wave is located on the end face far from the matching element. To position. Thereby, it is possible to suppress the electromagnetic wave in the first direction leaking from the matching element from spreading in the second substrate and in the air, thereby suppressing power loss.

  In the power converter, the second pattern may have a gap in a portion corresponding to the first transmission pattern. In this case, when the first substrate and the second substrate are bonded together, the first transmission pattern on the first surface of the first substrate corresponds to the gap between the second patterns on the third surface of the second substrate. To position. Therefore, it can be avoided that the first transmission pattern and the second pattern are short-circuited and electromagnetic waves leak out.

  In the above power converter, the separation pattern can include a third pattern and a fourth pattern. The third pattern connects the first end of the first pattern and the first end of the second pattern, is spaced apart from the matching element in the second direction, and extends in the first direction. The fourth pattern connects the second end of the first pattern and the second end of the second pattern, and is separated from the matching element at a position facing the third pattern with respect to the matching element in the second direction. Then, it extends in the first direction.

  The matching element emits electromagnetic waves not only in the first direction but also in the second direction. As described above, the third and fourth patterns extend in the first direction, and the effective dielectric constant of the second substrate changes with reference to the end surfaces of the third and fourth patterns. Therefore, the third and fourth patterns extending in the first direction mainly reflect electromagnetic waves in the second direction that are radiated from the matching elements and propagate in the second substrate. As a result, the electromagnetic wave from the matching element is suppressed from spreading in the second substrate and in the air, and power loss can be suppressed. In this way, by providing the third and fourth patterns in addition to the first and second patterns, the matching elements are surrounded by the first to fourth patterns, and power loss can be further suppressed.

  In the power converter, the separation pattern may be connected to the second transmission ground. In this case, the separation pattern is connected to the second transmission ground and is maintained at the ground potential. A node of a standing wave is located on the end face close to the matching element of the separation pattern, and the impedance becomes zero, that is, the potential becomes zero, resulting in a shorted state. By maintaining the separation pattern at the ground potential, the potential of the end face close to the matching element can be surely made zero and a short-circuited state can be achieved. Thereby, it is possible to suppress the electromagnetic wave leaking from the matching element from spreading in the second substrate other than the matching element and in the air, thereby suppressing power loss.

  In the power converter, the fixing member can fix the first substrate and the second substrate so that a space is formed between the coupling element and the matching element. According to this configuration, since a space is formed between the coupling element and the matching element, electromagnetic waves between them are radiated through air having a low dielectric constant. As a result, power loss is suppressed and an efficient power converter can be obtained.

  A power converter according to an aspect of the present invention includes a first board, a first transmission pattern, a coupling element, a first transmission ground, a second board, a matching element, a second transmission ground, and a second board. A transmission pattern and a fixing member are provided.

  The first substrate has a first surface and a second surface disposed on the side opposite to the first surface. The first transmission pattern is disposed on the first surface. The coupling element is disposed on the first surface and connected to the end of the first transmission pattern. The first transmission ground is at least partially disposed on the second surface at a position corresponding to the first transmission pattern and the coupling element, and constitutes an electromagnetic wave reflection wall together with the first transmission pattern and the coupling element. The second substrate has a third surface facing the first surface of the first substrate, and a fourth surface disposed on the opposite side of the third surface. The matching element is disposed on the third surface at a position facing the coupling element, and is electromagnetically coupled to the coupling element. The second transmission ground is disposed on the third surface. The second transmission pattern is disposed on the fourth surface at a position corresponding to the matching element and the second transmission ground, and constitutes an electromagnetic wave reflection wall together with the matching element and the second transmission ground. The fixing member fixes the first substrate and the second substrate so that a space is formed between the coupling element and the matching element.

  With the above configuration, the following effects can be obtained. First, in this power converter, the first transmission pattern, the coupling element, and the first transmission ground form a microstrip line that is an electromagnetic wave transmission line across the first substrate. On the other hand, the second transmission ground, the matching element, and the second transmission pattern constitute a microstrip line that is an electromagnetic wave transmission line across the second substrate. The electromagnetic wave is transmitted to the coupling element by the microstrip line on the first substrate, then radiated to the second substrate, and further transmitted along the second transmission pattern by the microstrip line on the second substrate. Then, transmission of electromagnetic waves from the second transmission pattern of the second substrate to the first transmission pattern of the first substrate is performed in the reverse order to that described above.

  That is, according to the power converter, power conversion is performed between the transmission line of the first substrate and the transmission line of the second substrate. Since these transmission lines can be formed by patterns on both sides of each substrate, the power converter can be reduced in thickness and size. Therefore, for example, it can be made thinner and smaller than a waveguide in which a hollow portion needs to be formed.

  Further, since a space is formed between the coupling element and the matching element, electromagnetic waves are radiated between them through air having a low dielectric constant. As a result, power loss is suppressed and an efficient power converter can be obtained.

  In the power converter, the first substrate and the second substrate can be formed of different materials. Thereby, a substrate material can be selected according to the element mounted on the substrate.

In the power converter, the first substrate can be formed of a glass epoxy resin, and the second substrate can be formed of a glass fluororesin.
Glass fluororesin is a material that can transmit and receive high frequencies with low loss. Thus, for example, when this power converter is used for an antenna device and a planar antenna pattern for transmitting and receiving high-frequency electromagnetic waves is connected to the end of the second transmission pattern of the second substrate, the second substrate is made of glass fluorine. It is preferable to form with resin.
On the other hand, since glass epoxy resin has a relatively small thermal expansion coefficient, it is difficult to cause breakage such as cracks even in the process of forming a through hole. Therefore, when forming a through hole around the coupling element of the first substrate, it is preferable to form the first substrate with a glass epoxy resin. This through hole suppresses the spread of electromagnetic waves in the first substrate other than the coupling element and in the air. The through hole can also be used as a coupling hole for mounting a high-frequency circuit on the first substrate.

  In the power converter, a plurality of through holes penetrating the first substrate are formed, and the plurality of through holes can be formed so as to surround the coupling element. These through-holes can suppress power loss because electromagnetic waves radiated from the coupling element are prevented from spreading outside the coupling element, for example, in the first substrate and in the air.

  In the power converter, at least a part of the first and second transmission patterns can be formed to extend in a first direction along a surface direction of the first and second substrates. In this case, the matching element is formed in a rectangular shape, and when the in-tube wavelength of the electromagnetic wave in the matching element is λe, the matching element can have a distance in the first direction of ½λe. As a result, a standing wave is generated in which the both end faces of the matching element in the first direction are antinodes and the center of both end faces is a node. At this time, the matching element resonates at a certain resonance frequency, and power loss in the matching element can be minimized.

  In the power converter, at least a part of the first and second transmission patterns can be formed to extend in a first direction along a surface direction of the first and second substrates. In this case, the coupling element is formed in a rectangular shape, and when the in-tube wavelength of the electromagnetic wave in the coupling element is λa, the coupling element can have a distance in the first direction of ½λa. As a result, a standing wave is generated in which both end faces of the coupling element in the first direction are antinodes and the center of both end faces is a node. At this time, the coupling element resonates at a certain resonance frequency, and power loss in the coupling element can be minimized.

  In the power converter, the fixing member can fix the first substrate and the second substrate at least at a part excluding the overlapping portion of the coupling element and the matching element.

  An antenna device according to an aspect of the present invention includes any one of the power converters described above and a planar antenna pattern that is disposed on the fourth surface of the second substrate and connected to an end of the second transmission pattern. Yes.

  According to the present invention, it is possible to provide a miniaturized power converter that performs power conversion between a transmission line and a transmission line, and an antenna having the power converter.

The perspective view of the power converter which concerns on this embodiment. The disassembled perspective view which looked at the power converter of FIG. 1 from the upper side. The exploded perspective view which looked at the power converter from the lower side. The perspective view which looked at the power converter from the upper side. FIG. 2 is a cross-sectional view taken along line A-A ′ of FIG. 1. The top view of the 1st lower surface of a 1st board | substrate. The top view of the 1st upper surface of a 1st board | substrate. It is a top view of the 2nd lower surface of the 2nd substrate. The enlarged plan view of the 1st separation ground. The top view of the 2nd upper surface of a 2nd board | substrate. The top view of the antenna by which the planar antenna pattern and the high frequency circuit were connected to the power converter. The top view of the antenna by which the planar antenna pattern and the high frequency circuit were connected to the power converter. The enlarged plan view in another example of the 1st separation ground. The enlarged plan view in another example of the 1st separation ground. The enlarged plan view in another example of the 1st separation ground. The enlarged plan view in another example of the 1st separation ground. The enlarged plan view in another example of the 1st separation ground. Explanatory drawing which shows the structure which formed the 2nd separation ground around the coupling element in the 1st upper surface of a 1st board | substrate. The top view which shows the planar shape of the connection part of an expansion ground and a 2nd transmission ground. The top view which shows the planar shape of the connection part of an expansion ground and a 2nd transmission ground. A-A 'line sectional view of Drawing 1 of a power converter provided with a fixing member.

  Hereinafter, a power converter and an antenna apparatus including the power converter according to an embodiment of the present invention will be described with reference to the drawings.

  The power converter according to the present embodiment is a device that performs power conversion between transmission lines, and is connected, for example, between a planar antenna pattern and a high-frequency circuit. When the planar antenna receives the electromagnetic wave, the power converter performs power conversion between the transmission lines and outputs the power to the high frequency circuit. When electromagnetic waves are output from the high frequency circuit, power conversion is performed between the transmission lines by the power converter, and the electromagnetic waves are radiated from the planar antenna. Below, the power converter of this embodiment is demonstrated first, and the antenna apparatus which has this power converter after that is demonstrated.

<1. Power converter>
(1) Overall Configuration of Power Converter FIG. 1 is a perspective view of a power converter according to this embodiment. FIG. 2 is an exploded perspective view of the power converter of FIG. 1 as viewed from above. FIG. 3 is an exploded perspective view of the power converter as viewed from below, contrary to FIG.

  The power converter 100 according to the present embodiment includes a plate-like first substrate unit 101, a plate-like second substrate unit 102 disposed opposite to the first substrate unit 101, and these substrate units 101, 102 bonded together. And an adhesive member (fixing member) 103.

  In the following, description will be given in the direction shown in FIG. 1, that is, up, down, front, back, right, left. Specifically, the direction between the first substrate unit 101 and the second substrate unit 102 is the up-down direction, and the front-rear direction and the left-right direction perpendicular to the surface direction of each substrate unit 101, 102 are It is defined and will be explained according to this direction. However, the present invention is not limited by this orientation, but the “front-rear direction” of the present embodiment corresponds to the first direction of the present invention, and the “left-right direction” corresponds to the second direction of the present invention. .

  Further, in the following description, the term “in-tube wavelength of a certain part” means the wavelength of an electromagnetic wave in a certain part that is affected by any configuration adjacent to the certain part. For example, as described later, the in-tube wavelength of the electromagnetic wave in the matching element is the second substrate unit provided with the matching element, the coupling element facing the matching element, the air between the matching element and the coupling element, etc. It shall mean the wavelength of the electromagnetic wave in the matching element, affected by any configuration around the element.

(2) Configuration of Each Unit of Power Converter 100 Next, the configuration of each unit of the power converter 100 will be described with reference to FIGS. FIG. 4 is a perspective view of the power converter as viewed from above. 5 is a cross-sectional view taken along line AA ′ of FIG. FIG. 6 is a plan view of the first lower surface of the first substrate. FIG. 7 is a plan view of the first upper surface of the first substrate. FIG. 8 is a plan view of the second lower surface of the second substrate. FIG. 9 is an enlarged plan view of the first separation ground. FIG. 10 is a plan view of the second upper surface of the second substrate.

(2-1) First substrate unit 101
As shown in FIGS. 2, 5, 7, etc., the first substrate unit 101 includes a rectangular first substrate 10, and a coupling element is formed on a first upper surface (first surface) 10 a of the first substrate 10. 11, a first transmission pattern 12 and a first upper surface ground 13 having a ground potential are arranged. The first transmission pattern 12 extends in the front-rear direction, and a high-frequency circuit (not shown) can be connected to the first end 12a on the rear side. The first transmission pattern 12 is connected to the coupling element 11 at the second end portion 12b on the front side. On the other hand, as shown in FIGS. 2, 5, 6, etc., a first lower surface ground 14 having a ground potential is disposed on the first lower surface (second surface) 10 b of the first substrate 10. ing. The first substrate 10 is formed with a plurality of through holes 16 penetrating therethrough.

  In addition, patterns such as grounds 13 and 14 formed on the first substrate 10, a connection ground 15 described later, the first transmission pattern 12, and the coupling element 11 are made of metal such as gold, silver, copper, copper alloy, and aluminum. An appropriate material is selected and formed into a thin film by plating, photoresist lithography, or the like. These thicknesses can be 9-36 micrometers, for example. In addition, each pattern may be formed of a metal of a different material. Hereinafter, each member will be described in detail.

(A) First substrate 10
As shown in FIG. 6 etc., the 1st board | substrate 10 is formed in the rectangular shape. Moreover, the 1st board | substrate 10 is formed, for example from the glass epoxy resin. Since the glass epoxy resin substrate has a relatively small coefficient of thermal expansion, breakage such as cracks hardly occurs even in the process of forming the through hole 16. Moreover, the thickness of this 1st board | substrate 10 can be 0.5-1.0 mm, for example.

(B) First transmission pattern 12 and coupling element 11
As shown in FIG. 7, the first transmission pattern 12 is formed in a long shape extending in the front-rear direction on the first upper surface 10 a of the first substrate 10. As described above, a high-frequency circuit can be connected to the first end 12a of the first transmission pattern 12, and the coupling element 11 is connected to the second end 12b. The coupling element 11 is formed in a rectangular shape, and is electromagnetically coupled to a matching element 21 of the second substrate 20 described later, thereby performing power conversion.

  The distance W12 in the left-right direction of the first transmission pattern 12 is a distance at which the impedance is about 50Ω, for example. The distance L12 in the front-rear direction of the first transmission pattern 12 is arbitrary, but is designed to be a distance necessary for connection with a high-frequency circuit, for example.

  The distance L11 in the front-rear direction of the coupling element 11 is ½λa, for example, where the wavelength of the electromagnetic wave in the coupling element 11 is λa. As a result, a standing wave is generated in which both end faces of the coupling element 11 in the front-rear direction are antinodes and the center of both end faces is a node. At this time, the coupling element 11 resonates at a certain resonance frequency, and the power conversion loss between the coupling element 11 and the matching element 21 can be minimized. Note that the distance W11 in the left-right direction of the coupling element 11 is arbitrary. However, the distance W11 is larger than the left and right distance W12 of the first transmission pattern 12 in order to resonate the electromagnetic wave in the coupling element 11, for example. The coupling element 11 may be a square in which the distance W11 and the distance L11 are substantially the same.

(C) First upper surface ground 13
The first upper surface ground 13 has an opening in which the coupling element 11 and the first transmission pattern 12 are arranged, and other portions are formed over the entire first upper surface 10 a of the first substrate 10. . Specifically, the opening of the first upper surface ground 13 includes a first opening end 13a, a second opening end 13b, and a third opening end 13c, which are arranged from the front side toward the rear side. Are integrally formed. The first opening end 13 a is formed in a rectangular shape at a position separated from the coupling element 11, and surrounds the coupling element 11. The second opening end 13 b and the third opening end 13 c are located away from the first transmission pattern 12.

  The first opening end 13a has a rectangular shape having a pair of short sides extending in the front-rear direction and a pair of long sides extending in the left-right direction. The distance W13a between the pair of long sides is larger than ½λb. Here, λb is the in-tube wavelength of the electromagnetic wave in the first opening end 13a. The cutoff wavelength of the electromagnetic wave in the first opening end 13a is 2 × W13a. That is, when the cutoff wavelength and the long-side distance W13a satisfy this relationship, the electromagnetic wave is attenuated. Therefore, the guide wavelength λb in the first opening end 13a needs to be smaller than 2 × W13a. According to said structure, since distance W13a is larger than 1/2 (lambda) b, attenuation | damping of electromagnetic waves can be suppressed.

  Further, the short side distance L13a of the first opening end 13a is smaller than the long side distance W13a or is a distance W13a × ½. By defining the distance L13a in this way, the front-rear direction in which the short side extends can be set as the resonance direction of the coupling element 11. Therefore, since the front-rear direction, which is the electromagnetic wave transmission direction, in the first transmission pattern 12 and the second transmission pattern 28 and the front-rear direction, which is the resonance direction of the coupling element 11, substantially coincide, power loss can be suppressed. On the other hand, when L13a is not defined as described above, the resonance direction changes from the front-rear direction in which the short side extends, and the resonance state of the coupling element 11 cannot be maintained, resulting in a large power loss.

  It is preferable that the coupling element 11 is disposed approximately at the center of the first opening end 13a. In this case, for example, the influence of the electromagnetic wave on the front side of the first opening end 13a on the coupling element 11 and the influence of the electromagnetic wave on the rear side on the coupling element 11 are substantially uniform. Similarly, for example, the influence of the electromagnetic waves on the right side of the first opening end 13a on the coupling element 11 and the influence of the left side electromagnetic waves on the coupling element 11 are substantially uniform. Therefore, the design of the coupling element 11 and the first opening end 13a can be facilitated.

  The second opening end 13b extends in the front-rear direction along the first transmission pattern 12, and the front end thereof is connected to the first opening end 13a, and the rear end is connected to the third opening end 13c. The distance W13b in the left-right direction of the second opening end 13b is set as narrow as possible in accordance with the processing accuracy within a range where the second opening end 13b and the first transmission pattern 12 do not contact each other. That is, it is narrower than the first opening end 13a and the third opening end 13c. On the other hand, the distance L13b in the front-rear direction of the second opening end 13b is an arbitrary length. The distance L13b is set to such a length that the configuration around the coupling element 11 does not affect the resonance state of the electromagnetic wave in the coupling element 11, for example.

  The third opening end 13 c extends in the front-rear direction along the first transmission pattern 12. A distance W13c in the left-right direction between the third opening end 13c and the first transmission pattern 12 is ¼λc. Here, λc is an in-tube wavelength in the space between the third opening end 13c and the first transmission pattern 12. Thereby, it is possible to prevent the electromagnetic wave in the first transmission pattern 12 and the electromagnetic wave in the first upper surface ground 13 from affecting each other. Therefore, electromagnetic waves can be efficiently transmitted along the first transmission pattern 12 to the coupling element 11. The distance L13c in the front-rear direction of the third opening end 13c is designed to be a distance necessary for connection with a high-frequency circuit, for example.

(D) First lower surface ground 14
As shown in FIG. 6, the first lower surface ground 14 is disposed over substantially the entire first lower surface 10 b of the first substrate 10 excluding the through hole 16. Thereby, since the 1st substrate 10 is supported by the 1st undersurface ground 14, the intensity of the 1st substrate 10 can be raised. Here, in the first lower surface ground 14, the portion corresponding to the first transmission pattern 12 on the first upper surface 10 a constitutes the first transmission ground 14 a, and the portion corresponding to the coupling element 11 on the first upper surface 10 a is the coupling ground. 14b is configured.

  And the 1st transmission ground 14a and the 1st transmission pattern 12 of the 1st upper surface 10a are united, and become an electromagnetic wave reflective wall. Similarly, the coupling element 11 on the first upper surface 10a and the coupling ground 14b on the first lower surface 10b are integrated to form an electromagnetic wave reflecting wall.

  When electromagnetic waves are transmitted from the high-frequency circuit, the electromagnetic waves are transmitted from the rear side to the front side while being reflected between the first transmission pattern 12 and the first transmission ground 14a, and transmitted to the coupling element 11 and the coupling ground 14b. Is done. Then, an electromagnetic wave is radiated from the coupling element 11 toward the matching element 21. On the other hand, when the coupling element 11 and the coupling ground 14b receive the electromagnetic wave radiated from the matching element 21, the electromagnetic wave passes between the first transmission pattern 12 and the first transmission ground 14a from the front side to the rear side to the high frequency circuit. Is transmitted.

(E) Through hole 16
As shown in FIGS. 6 and 7, a plurality of through holes 16 penetrating the first substrate 10 are formed around the coupling element 11 and the first transmission pattern 12. As shown in FIG. 5, a connection ground 15 having a ground potential is formed along the inner wall surface of the through hole 16, and the connection ground 15 is formed between the first upper surface ground 13 of the first upper surface 10a and the first lower surface 10b. The first lower surface ground 14 is connected.

  As shown in FIG. 7, the through holes 16 include a plurality of first through holes 16 a (through holes) arranged around the coupling element 11 and a plurality of pieces arranged along the circumference of the first transmission pattern 12. It is comprised with the 2nd through hole 16b. The first through hole 16a is disposed close to the outside of the first opening end 13a and the second opening end 13b of the first upper surface ground 13. The second through hole 16b is disposed close to the outside of the third opening end 13c of the first upper surface ground 13. The outer side is opposite to the side (inward) where the coupling element 11 and the first transmission pattern 12 are arranged with respect to the first opening end 13a, the second opening end 13b, and the third opening end 13c. Means side.

  The first through hole 16a surrounds the coupling element 11 to reflect the electromagnetic wave radiated from the coupling element 11, and this electromagnetic wave spreads in the first substrate 10 other than the matching element 21, for example, in the air. Suppress. The second through hole 16b suppresses the electromagnetic wave radiated from the first transmission pattern 12 from spreading in the first substrate 10 and in the air. Therefore, power loss can be suppressed by these through holes 16. The distance between the wall surfaces of the adjacent through holes 16 is, for example, 1 / 4λd. Here, λd is the in-tube wavelength of the electromagnetic wave in the through hole 16.

  As described above, since the first substrate 10 made of glass epoxy resin has a relatively small coefficient of thermal expansion, even if the through hole 16 is formed, breakage such as cracks is unlikely to occur. Further, a further through hole 16 may be formed as a coupling hole for mounting the high frequency circuit on the first substrate 10. For example, the high-frequency circuit is covered with a mold resin and has leads that protrude downward from the mold resin. The high frequency circuit can be fixed to the first substrate 10 by inserting the lead of the high frequency circuit into the through hole 16. The high-frequency circuit is, for example, an MMIC (monolithic microwave integrated circuit), and is a circuit that transmits and receives high-frequency waves such as millimeter waves and microwaves.

(2-2) Second substrate unit 102
Next, the second substrate unit 102 will be described. As shown in FIGS. 2, 5, 10, etc., the second substrate unit 102 includes a second substrate 20, and a shield plate 27 and a second upper surface (fourth surface) 20 a of the second substrate 20. The second transmission pattern 28 is arranged. On the other hand, as shown in FIGS. 3, 5, 8, and the like, the second lower surface (third surface) 20 b of the second substrate 20 includes a matching element 21 and a plurality of second lower surface grounds 25 having a ground potential. , Is arranged.

  Note that the pattern of the matching element 21, the second lower surface ground 25, the second transmission pattern 28, the shield plate 27, and the like formed on the second substrate 20 is appropriately selected from metals such as gold, silver, copper, copper alloy, and aluminum. A suitable material is selected and formed into a thin film by plating, photoresist lithography, or the like. These thicknesses can be 9-36 micrometers, for example. In addition, each pattern may be formed of a metal of a different material. Hereinafter, each member will be described.

(A) Second substrate 20
The second substrate 20 is formed in a rectangular shape shorter than the first substrate 10 in the front-rear direction, as shown in FIGS. 4 and 5, the first substrate 10 and the second substrate 20 are arranged so that the coupling element 11 of the first substrate 10 and the matching element 21 of the second substrate 20 face each other. . The rear end portion of the first substrate 10 is disposed so as to protrude from the rear end of the second substrate 20. Further, the width in the left-right direction of the second substrate 20 is not particularly limited, but can be made smaller than that of the first substrate 10 as shown in FIG.

  The second substrate 20 can be formed from, for example, a glass fluororesin. A glass fluororesin substrate is a substrate capable of transmitting and receiving high-frequency electromagnetic waves with low loss. Therefore, as will be described later, when a planar antenna pattern is formed on the power converter 100, for example, the planar antenna pattern is formed on the second substrate 20 made of a glass fluororesin substrate. On the other hand, since the glass fluororesin substrate has a large thermal expansion coefficient, the glass fluororesin substrate is damaged such as cracking in the process of forming the through holes. Further, the glass fluororesin substrate is more expensive than the glass epoxy resin. Therefore, a glass fluororesin is used for the second substrate 20 on which the planar antenna pattern is mounted, and an inexpensive glass epoxy resin capable of forming the through hole 16 is used for the first substrate 10 as described above. The thickness of the second substrate 20 can be set to 0.05 to 0.2 mm, for example.

(B) Matching element 21
As shown in FIG. 8, the matching element 21 is disposed on the second lower surface 20b of the second substrate 20, and is formed in a rectangular shape. The matching element 21 is disposed on the rear side of the second substrate 20 so as to face the coupling element 11 of the first substrate 10. The matching element 21 is electromagnetically coupled with the coupling element 11, thereby performing power conversion.

  The distance L21 in the front-rear direction of the matching element 21 is ½λe, for example, where the in-tube wavelength of the electromagnetic wave in the matching element 21 is λe. As a result, a standing wave is generated in which both end faces of the matching element 21 in the front-rear direction are antinodes and the center of both end faces is a node. At this time, the matching element 21 resonates at a certain resonance frequency, and the power loss in the matching element 21 can be minimized. Note that the distance W21 in the left-right direction of the matching element 21 is arbitrary. However, for example, the distance W21 may be substantially the same as the distance L21.

(C) Second lower surface ground 25
As shown in FIGS. 3 and 8, the second lower surface ground 25 having a ground potential is disposed on the second lower surface 20 b of the second substrate 20. The second lower surface ground 25 includes a first separation ground 22, a second transmission ground 23, and an expansion ground 24 that are integrally formed. These will be described below.

(C1) First separation ground 22 (separation pattern)
As shown in FIGS. 8 and 9, the first separation ground 22 has a shape surrounding the matching element 21, and is formed integrally with a first ground 22 a (first pattern) and a second ground 22 b (second Pattern), a third ground 22c (third pattern), and a fourth ground 22d (fourth pattern).

  The first ground 22a extends in the left-right direction, and is positioned at a front distance from the matching element 21 by a first distance ΔK1. Due to this positional relationship, the first transmission pattern 12 of the first substrate unit 101 is positioned behind the matching element 21 and the first ground 22a is positioned ahead of the matching element 21 in a top view. The first ground 22a has a first width A1 in the front-rear direction. Assuming that the guide wavelength of the first ground 22a is λf, the first width A1 is an odd multiple of ¼λf.

  The effective dielectric constant of the second substrate 20 changes with the end face of the first ground 22a as a reference, whereby the electromagnetic wave that leaks from the matching element 21 and propagates through the second substrate 20 is reflected. More specifically, since the first width A1 is an odd multiple of 1 / 4λf, the node of the standing wave is located on the end surface near the matching element 21 in the first ground 22a and is far from the matching element 21. An antinode of the standing wave is located on the end face. At the end face where the node of the standing wave is located, the impedance going outward from the matching element 21 side is zero, that is, the potential is zero, and a short circuit occurs. On the other hand, on the end face where the antinode of the standing wave is located, the impedance going outward from the matching element 21 side becomes infinite. Accordingly, the first ground 22 a extending in the left-right direction mainly reflects electromagnetic waves in the front-rear direction that are radiated from the matching element 21 and propagate through the second substrate 20. Therefore, it is possible to suppress the electromagnetic wave leaking from the matching element 21 from spreading in the second substrate 20 and in the air, thereby suppressing power loss.

  The second ground 22b extends in the left-right direction, and has a shape divided into left and right so as to have a gap 22b1 in a portion corresponding to the first transmission pattern 12 of the first substrate 10. The gap 22b1 has a distance C1 in the left-right direction. The distance C1 is, for example, larger than the left-right distance W12 (FIG. 7) of the first transmission pattern 12 and smaller than the left-right distance W21 of the matching element 21. In addition, the second ground 22b is located behind the matching element 21 by a second distance ΔL1. Accordingly, both the first transmission pattern 12 and the second ground 22b are located behind the matching element 21 in a top view. The second ground 22b has a second width D1 in the front-rear direction. Assuming that the guide wavelength of the second ground 22b is λg, the second width D1 is an odd multiple of ¼λg.

  The effective dielectric constant of the second substrate 20 changes with the end face of the second ground 22b as a reference, whereby the electromagnetic wave that leaks from the matching element 21 and propagates through the second substrate 20 is reflected. More specifically, since the second width D1 is an odd multiple of 1 / 4λg, a node of a standing wave is located on the end surface near the matching element 21 in the second ground 22b and is far from the matching element 21. An antinode of the standing wave is located on the end face. Thereby, the second ground 22b extending in the left-right direction mainly reflects the electromagnetic waves in the front-rear direction that are radiated from the matching element 21 and propagate through the second substrate 20. Therefore, it is possible to suppress the electromagnetic wave leaking from the matching element 21 from spreading in the second substrate 20 and in the air, thereby suppressing power loss.

  Furthermore, when the first substrate 10 and the second substrate 20 are bonded together by the gap 22b1, it is possible to avoid a short circuit between the first transmission pattern 12 and a second transmission pattern 28 described later. As a result, leakage of electromagnetic waves can be prevented.

  The third ground 22c extends in the front-rear direction, and corresponds to the right side of the matching element 21 (this right side corresponds to the right side when the power converter 100 is viewed from above as shown in FIG. 4). FIG. 9 is a plan view when the power converter 100 is viewed from below. The power converter 100 is located a third distance ΔM1 apart. The third ground 22c connects the right end of the first ground 22a and the right end of the second ground 22b. The third ground 22c has a third width I1 in the left-right direction. The third width I1 is preferably smaller than, for example, the first width A1 of the first ground 22a and the second width D1 of the second ground 22b. For example, the third width I1 is smaller than 1 / 4λh, where λh is the in-tube wavelength of the third ground 22c. In this case, it is possible to suppress electromagnetic waves from being supplemented by the third ground 22c, and to suppress power loss. Even if the third width I1 is small, the matching element 21 mainly emits electromagnetic waves in the front-rear direction along the first transmission pattern 12 and the second transmission pattern 28 described later. The amount of radiation is relatively small. Therefore, even if the third width I1 is small, the power loss can be suppressed small.

  The fourth ground 22d is configured to extend in the front-rear direction in substantially the same manner as the third ground 22c. The left side of the first and second grounds 22a and 22b (this left side is a power converter as shown in FIG. 100 corresponds to the left side when viewed from above.). Further, it is located on the left side with respect to the matching element 21 by a fourth distance ΔN1. The fourth ground 22d has a fourth width J1 in the left-right direction. For example, the fourth width J1 is preferably smaller than the first width A1 of the first ground 22a and the second width D1 of the second ground 22b. For example, the fourth width J1 is smaller than 1 / 4λi, where λi is the in-tube wavelength of the fourth ground 22d. In this case, similarly to the third ground 22c, the fourth ground 22d can suppress the supplement of electromagnetic waves, and the power loss can be reduced even if the fourth width J1 is small.

  Note that the first to fourth grounds 22a to 22d are connected to the second transmission ground 23, and are particularly maintained at the ground potential. As described above, standing wave nodes are located on the end faces of the first ground 22a and the second ground 22b close to the matching element 21. At this time, since the first ground 22a and the second ground 22b are maintained at the ground potential, the potential of the end face close to the matching element 21 can be surely set to zero and a short-circuited state can be achieved. Thereby, it is possible to further suppress the electromagnetic wave leaking from the matching element 21 from spreading in the second substrate 20 other than the matching element 21 and in the air, thereby suppressing power loss.

  An annular first separation ground 22 is formed by the first to fourth grounds 22a to 22d as described above. The inner periphery of the first separation ground 22 has a rectangular shape with a short side between the first ground 22a and the second ground 22b and a long side between the third ground 22c and the fourth ground 22d. The short side extends in the front-rear direction, and the long side extends in the left-right direction.

  The distance G1 between the long sides of the inner circumference is greater than ½λj. λj is the in-tube wavelength of the electromagnetic wave in the rectangular inner region formed by the first to fourth grounds 22a to 22d. The cutoff wavelength of the electromagnetic wave in this rectangular inner region is 2 × G1. That is, when the cutoff wavelength and the long-side distance G1 satisfy this relationship, the electromagnetic wave is attenuated. Therefore, the in-tube wavelength λj in the rectangular inner region needs to be smaller than 2 × G1. According to the above configuration, since the distance G1 is larger than ½λj, the attenuation of electromagnetic waves can be suppressed.

  On the other hand, the distance E1 of the short side of the inner periphery is smaller than the distance G1 of the long side of the inner periphery. More preferably, the short side distance E1 of the inner circumference is ½ of the distance G1 of the long side of the inner circumference. By defining in this way, the longitudinal direction in which the short side extends can be set as the resonance direction of the matching element 21. Therefore, since the front-rear direction, which is the transmission direction of the electromagnetic wave in the first transmission pattern 12 and the second transmission pattern 28, and the front-rear direction, which is the resonance direction of the matching element 21, substantially coincide, power loss can be suppressed.

  Moreover, it is preferable that the matching element 21 is disposed at a substantially equal position from the rectangular inner periphery of the first to fourth grounds 22a to 22d, that is, at the center. In this case, for example, the influence of the electromagnetic wave in the front-rear direction on the first ground 22a on the electromagnetic wave of the matching element 21 and the influence of the electromagnetic wave in the front-rear direction on the second ground 22b on the electromagnetic wave of the matching element 21 become substantially uniform. Similarly, for example, the influence of the left and right electromagnetic waves on the third ground 22c on the matching element 21 and the influence of the left and right electromagnetic waves on the fourth ground 22d on the matching element 21 are substantially uniform. Therefore, the design of the matching element 21 and the first to fourth grounds 22a to 22d can be facilitated.

  In addition, the outer periphery of the annular first separation ground 22 is also rectangular, the front-rear direction of the outer periphery is a short side, and the left-right direction of the outer periphery is a long side. The outer peripheral short side distance H1 is the sum of the distance E1, the first width A1, and the second width D1. The outer peripheral long side distance B1 is the sum of the distance G1, the third width I1, and the fourth width J1. The sum of ΔK1 and ΔL1 is a length obtained by subtracting the distance L21 from the distance E1. The sum of ΔM1 and ΔN1 is a length obtained by subtracting the distance W21 from the distance G1.

(C2) Second transmission ground 23
As shown in FIGS. 4 and 8, the second transmission ground 23 is a ground extending forward from the first ground 22 a of the first separation ground 22. The second transmission ground 23 is disposed corresponding to a second transmission pattern 28 on the second upper surface 20a of the second substrate 20, which will be described later. Further, the second transmission ground 23 is disposed at a position facing the first transmission pattern 12 on the first upper surface 10a of the first substrate 10 with respect to the matching element 21 when viewed from above. That is, in the top view, the first transmission pattern 12 is located on the rear side of the matching element 21, and the second transmission ground 23 is located on the front side of the matching element 21.

(C3) Expansion ground 24
The extended ground 24 is formed in a U shape as a whole so as to have a concave portion 24ab on the rear side, and the matching element 21, the first separation ground 22, and the second transmission ground 23 are arranged in the concave portion 24ab. Has been. And the front-end | tip part of the 2nd transmission ground 23 is connected to the front-end edge of this recessed part 24ab. Further, the front end edge of the concave portion 24ab is formed in an arc shape in which left and right portions 24a and 24b are convex from the connecting portion with the second transmission ground 23, respectively. Thereby, in the connection area | region of the 2nd transmission ground 23 and the expansion ground 24, the change of an impedance can be made loose. Therefore, reflection of electromagnetic waves can be suppressed and power loss can be suppressed.

  Further, when the in-tube wavelength of the electromagnetic wave between the third ground 22c and the extended ground 24 is λk, the distance O between the third ground 22c and the extended ground 24 is ¼λk or more. Similarly, when the in-tube wavelength of the electromagnetic wave between the fourth ground 22d and the extended ground 24 is λ1, the distance P between the fourth ground 22d and the extended ground 24 is ¼λ1 or more. Thereby, the electromagnetic waves in the third ground 22c and the fourth ground 22d and the electromagnetic waves in the extension ground 24 adjacent to them can be prevented from affecting each other. Therefore, the influence on the design of the first to fourth grounds 22a to 22d can be reduced.

(D) Shield plate 27
As shown in FIGS. 4 and 10, the shield plate 27 has a larger area in a top view than the matching element 21, and is disposed on the second upper surface 20 a of the second substrate 20 corresponding to at least the matching element 21. . More specifically, the shield plate 27 is disposed so as to correspond to the matching element 21 and the first separation ground 22. In addition, a rectangular recess 27 a that is recessed rearward is formed at the front end of the shield plate 27.

  Such a shield plate 27 suppresses the electromagnetic wave leaking from the matching element 21 and the coupling element 11 from spreading into the second substrate 20 and the air, for example. Therefore, power loss can be suppressed.

  The distance L27 in the front-rear direction of the shield plate 27 corresponds to the distance H1 in the front-rear direction of the outer periphery of the first separation ground 22. The distance W27 in the left-right direction of the shield plate 27 corresponds to the distance B1 in the left-right direction of the outer periphery of the first separation ground 22.

(E) Second transmission pattern 28
As shown in FIG. 10, the second transmission pattern 28 is formed in a strip shape extending in the front-rear direction on the second upper surface 20 a of the second substrate 20, and the first end 28 a and the second end are formed at both ends in the front-rear direction. It has an end 28b. In addition, the second transmission pattern 28 is disposed so as to correspond to the second transmission ground 23 on the second lower surface 20b, whereby the second transmission pattern 28 and the second transmission ground 23 are integrated, and the electromagnetic wave is transmitted. It becomes a reflection wall. Further, the first end portion 28a of the second transmission pattern 28 is inserted in a non-contact state into the concave portion 27a of the shield plate 27, and the first end portion 28a is the end portion of the matching element 21 as shown in FIG. Is superimposed. In other words, the first end portion 28 a of the second transmission pattern 28 and the matching element 21 overlap each other on the front side of the center portion in the front-rear direction of the matching element 21.

  As shown in FIG. 8, the distance W <b> 28 in the left-right direction of the second transmission pattern 28 is smaller than the distance W <b> 23 in the left-right direction of the second transmission ground 23. As a result, the second transmission pattern 28 and the second transmission ground 23 can be associated with each other even if the arrangement of the second transmission pattern 28 is shifted within the range of the distance W 28 of the second transmission ground 23. As a result, an electromagnetic wave transmission path can be configured by the second transmission pattern 28 and the second transmission ground 23.

  Further, since the first substrate 10 protrudes rearward from the second substrate 20, the second transmission pattern 28 is located on the front side and the first transmission on the rear side with the matching element 21 in between when viewed from above. Pattern 12 is located. That is, the first transmission pattern 12 and the second transmission pattern 28 are arranged so as to continuously extend in the front-rear direction when viewed from above. Thereby, the electromagnetic wave transmitted forward by the first transmission pattern 12 is continuously transmitted forward by the second transmission pattern 28 extending further forward through the coupling element 11 and the matching element 21. On the contrary, the electromagnetic wave transmitted backward by the second transmission pattern 28 is continuously transmitted backward by the first transmission pattern 12 extending further backward through the coupling element 11 and the matching element 21. Thereby, transmission of electromagnetic waves can be performed smoothly while reducing power loss.

  As described above, even when electromagnetic waves are transmitted from the first transmission pattern 12 toward the second transmission pattern 28, electromagnetic waves are transmitted from the second transmission pattern 28 toward the first transmission pattern 12. Even in such a case, the matching element 21 emits electromagnetic waves mainly in the front-rear direction. At this time, since the first ground 22a and the second ground 22b described above extend in the left-right direction, electromagnetic waves mainly emitted from the matching element 21 in the front-rear direction are spread in the second substrate 20 and in the air. Is suppressed. Thereby, power loss can be suppressed.

(2-3) Adhesive member 103
Next, the adhesive member 103 will be described. The adhesive member 103 is a member that bonds the first substrate 10 and the second substrate 20, and is formed smaller than the second substrate 20. Thereby, when bonding the 2nd board | substrate 20 to the 1st board | substrate 10, it can suppress that the adhesion member 103 protrudes from the 1st board | substrate 10. FIG. As shown in FIG. 4, the adhesive member 103 has a rectangular shape as a whole, but has a recess 103 a corresponding to the coupling element 11 and the matching element 21 on the rear side. Therefore, as shown in FIGS. 4 and 5, the bonding member 103 is not interposed in the portion where the coupling element 11 and the matching element 21 face each other, and the coupling element 11 and the matching element 21 face each other through air. doing. The adhesive member 103 is not particularly limited, but can be formed by, for example, a double-sided tape. However, the adhesive member 103 may be a liquid adhesive as long as it can bond the first and second substrates 10 and 20 in a portion excluding the coupling element 11 and the matching element 21. The adhesive member 103 is preferably non-conductive. In this case, the first substrate 10 and the second substrate 20 can be prevented from being electrically connected and short-circuited. In addition, the distance between the coupling element 11 and the matching element 21 formed by the adhesive member 103 can be set to 30 to 100 μm, for example.

(2-4) Manufacturing Method of Power Converter In the process of manufacturing the power converter 100 described above, patterning steps such as ground and transmission pattern are performed on the first substrate 10 and the second substrate 20, respectively. 1 and the second substrate units 101 and 102 are formed. Further, the adhesive member 103 is processed into a predetermined size, and the recess 103a is formed. Thereafter, the adhesive member 103 is interposed between the first substrate unit 101 and the second substrate unit 102 to perform alignment, and then both the substrate units 101 and 201 are bonded together.

<2. Operation of power converter>
Next, the operation of the power converter 100 will be described. First, in the power converter 100, a case where electromagnetic waves are transmitted from the first transmission pattern 12 of the first board unit 101 to the second transmission pattern 28 of the second board unit 102 will be described.

  When electromagnetic waves are input from the first end 12a of the first transmission pattern 12 of the first substrate unit 101, the electromagnetic waves are transmitted to the first transmission pattern 12 on the first upper surface 10a and the first transmission ground on the first lower surface 10b. The light is transmitted to the second end 12b along the first transmission pattern 12 while being reflected between the light and the light 14a. The electromagnetic wave is supplied from the second end 12b of the first transmission pattern 12 to the coupling element 11 continuous thereto. Here, the first transmission pattern 12, the coupling element 11, and the first transmission ground 14a constitute a microstrip line that is an electromagnetic wave transmission line with the first substrate 10 interposed therebetween.

  Next, an electromagnetic wave is radiated from the coupling element 11 on the first upper surface 10 a of the first substrate 10 to the matching element 21 on the second lower surface 20 b of the opposing second substrate 20. The coupling element 11 and the matching element 21 are electromagnetically coupled to each other via air, and power conversion is performed between the coupling element 11 and the matching element 21.

  Subsequently, the electromagnetic wave received by the matching element 21 of the second substrate unit 102 is reflected between the second transmission pattern 28 on the second upper surface 20a of the second substrate 20 and the second transmission ground 23 on the second lower surface 20b. However, it travels forward and is transmitted to the second end portion 28 b of the second transmission pattern 28. Here, the second transmission ground 23, the matching element 21, and the second transmission pattern 28 constitute a microstrip line that is an electromagnetic wave transmission line with the second substrate 20 interposed therebetween. Further, in the concave portion 27a of the shield plate 27, the second transmission pattern 28 and the shield plate 27 are arranged side by side on the second substrate 20, and these constitute a coplanar line.

  As described above, the electromagnetic wave is transmitted to the coupling element 11 by the microstrip line of the first substrate 10 and radiated to the second substrate 20, and further, the second transmission pattern 28 is transmitted by the microstrip line and the coplanar line of the second substrate 20. Is transmitted to the second end 28b. That is, according to the power converter 100, power conversion is performed between the transmission line of the first substrate 10 and the transmission line of the second substrate 20.

  Note that the transmission of electromagnetic waves from the second transmission pattern 28 of the second substrate 20 to the first transmission pattern 12 of the first substrate 10 is in the reverse order.

<3. Antenna device>
Next, the antenna device 200 using the power converter 100 will be described. 11 and 12 are plan views of an antenna in which a planar antenna pattern and a high-frequency circuit are connected to a power converter.

  As shown in FIG. 11, the antenna device 200 according to the present embodiment connects the planar antenna pattern 50 to the second end portion 28 b of the second transmission pattern 28 on the second upper surface 20 a of the second substrate 20. At this time, the second transmission pattern 28 includes a first part 28-1 extending forward from the shield plate 27 and a pair of second parts 28-2 separated from the front end of the first part 28-1 to the left and right. Is done. The second part 28-2 on the left side extends from the front end of the first part 28-1 to the left side, then extends rearward, and further extends to the left side. As a result, the tip of the left second portion 28-2 is positioned near the corner of the left rear end of the second substrate 20. Further, the right second portion 28-2 has a symmetrical shape with the left second portion 28-2.

  And the planar antenna pattern 50 formed in the back U-shaped convex shape is connected to the front-end | tip of each 2nd site | part 28-2, respectively. The second transmission pattern 28 and the planar antenna pattern 50 are arranged at positions corresponding to the expansion ground 24 shown in FIG. Thus, since the pair of planar antenna patterns 50 are disposed at both ends in the left-right direction of the second substrate 20, the first and second substrate units 101, 201 do not become too long in the front-rear direction, and the power converter The antenna device including 100 can be made compact. On the other hand, the high frequency circuit 60 is disposed on the first upper surface 10 a of the first substrate 10 of the power converter 100. The high frequency circuit 60 is connected to the first end 12 a of the first transmission pattern 12.

  In the antenna device 200, the electromagnetic wave emitted from the high frequency circuit 60 is input to the first transmission pattern 12 of the power converter 100. The input electromagnetic wave reaches the second end portion 28 b of the second transmission pattern 28 through the power converter 100 and is emitted from the planar antenna pattern 50. Conversely, the electromagnetic wave received by the planar antenna pattern 50 is input to the power converter 100 via the second transmission pattern 28 and input to the high-frequency circuit 60 via the first transmission pattern 12. Thus, the antenna device 200 that transmits and receives electromagnetic waves can achieve functions such as obstacle detection and wireless communication.

  Moreover, the planar antenna pattern 50 can also be arrange | positioned as follows. In the example shown in FIG. 12, the second transmission pattern 28 is formed in a straight line extending in the front-rear direction, and a planar antenna pattern 50 formed in a U-shape protruding backward is connected to the second end portion 28b. ing.

  The antenna device 200 as described above can be used as a collision-preventing radar or the like, and is used, for example, to monitor the surrounding environment of an automobile using electromagnetic waves in a short wavelength region such as a millimeter wave region. Short wavelength electromagnetic waves in the millimeter wave region or the like have high resolution and are suitable for accurately detecting the surrounding environment. The antenna device 200 according to the present embodiment is not limited to collision prevention, and can also be used for obstacle detection, wireless LAN, and the like, and the usable wavelength band is not limited to the millimeter wave region, but can be used in the microwave region or the like. Is also applicable.

<4. Features>
<4-1>
In the power converter 100 described above, power conversion is performed between the microstrip line of the first substrate 10 and the microstrip line and coplanar line of the second substrate 20 as described above. Since the transmission line can be formed by the patterns on both sides of the substrate, the power converter 100 can be reduced in thickness and size. When the pattern is formed of a thin layer of metal or the like, the power converter 100 can be further reduced in thickness and size. Such a power converter 100 is thinner and smaller than, for example, a waveguide in which a hollow portion needs to be formed.

<4-2>
Since a space is formed between the coupling element 11 and the matching element 21, electromagnetic waves are radiated between the coupling element 11 and the matching element 21 through air. The dielectric constant of air is about 1.0, which is smaller than the dielectric constant of resin, for example. Therefore, attenuation of electromagnetic waves radiated between the coupling element 11 and the matching element 21 can be suppressed. As a result, power loss can be suppressed, and an efficient power converter 100 can be obtained.

<4-3>
The first separation ground 22 formed on the second substrate 20 causes a change in the effective dielectric constant of the second substrate 20 with reference to the end face thereof, and therefore leaks from the matching element 21 and propagates through the second substrate 20. Reflects electromagnetic waves. Therefore, the electromagnetic wave from the matching element 21 is suppressed from spreading into the second substrate 20 and air. As a result, power loss can be further suppressed by the first separation ground 22.

<4-4>
By forming the first substrate 10 with glass epoxy resin, the through holes 16 can be formed without causing cracks in the first substrate 10. In addition, by forming the second substrate 20 with glass fluororesin, it is possible to transmit and receive high-frequency electromagnetic waves with low loss even when the planar antenna pattern 50 is mounted on the second substrate 20.

  Further, the glass fluororesin is more expensive than the glass epoxy resin. Therefore, cheaper power converter 100 can be obtained by using glass fluororesin only for second substrate 20 than using glass fluororesin for both first and second substrates 10 and 20. Further, by reducing the area of the second substrate 20 using the expensive glass fluororesin and reducing the amount of the glass fluororesin used, a further inexpensive power converter can be obtained. Even when the area of the first substrate 10 is increased in order to mount the high-frequency circuit 60 and the like, the cost increase of the power converter 100 is suppressed by using an inexpensive glass epoxy resin for the first substrate 10. it can.

<4-5>
As described above, the power converter 100 of the present embodiment does not include a waveguide, and includes a plate-like first substrate unit 101, a plate-like second substrate unit 102, and between these substrate units 101 and 102. The adhesive member 103 is included. Further, the first substrate 10 of the first substrate unit 101 and the second substrate 20 of the second substrate unit 102 have different thermal expansion coefficients. In this power converter 100, heat may be generated inside, or heat may be applied from the outside of the power converter 100. In this case, the adhesive member 103 sandwiched between the boards 10 and 20 may be distorted due to the difference in thermal expansion coefficient between the boards 10 and 20, but this greatly affects the power conversion structure of the boards 10 and 20. The power conversion efficiency of the power converter 100 is not greatly affected.
On the other hand, in a power converter that uses a waveguide to convert power between the power transmitted by the waveguide and a plurality of substrates constituting the transmission line, the difference in thermal expansion coefficient between the plurality of substrates As a result, the shape of the waveguide is distorted. Thereby, the conversion efficiency of electric power falls.
Therefore, even if the power converter 100 of this embodiment which does not use a waveguide includes the substrates 10 and 20 having different thermal expansion coefficients, the power conversion efficiency is excellent.

<5. Modification>
As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible unless it deviates from the meaning. For example, the following changes can be made. Moreover, the gist of the following modifications can be combined as appropriate.

<5-1>
In the above embodiment, in addition to the configuration in which the coupling element 11 and the matching element 21 face each other via air (configuration 1), the configuration in which the first separation ground 22 is further arranged around the matching element 21 (configuration) 2) is adopted. However, for example, instead of the above-described configuration 1, a configuration 1a in which the coupling element 11 and the matching element 21 are opposed to each other through a dielectric may be employed. That is, in the power converter 100, in addition to the configuration in which the coupling element 11 and the matching element 21 face each other via the dielectric (configuration 1a), the power converter 100 may be configured by adopting the configuration 2. Good. Since a dielectric is interposed between the coupling element 11 and the matching element 21, the effect of suppressing the attenuation of electromagnetic waves is smaller than that of air. However, the first separation ground 22 of the configuration 2 can suppress the electromagnetic wave from the matching element 21 from spreading in the second substrate 20 and the air, thereby suppressing power loss.

  Further, in the above embodiment, the power converter 100 may be configured by adopting the configuration 1 in addition to the configuration (configuration 2a) in which the power converter 100 does not include the first separation ground 22. In this case, since air having a low dielectric constant is interposed between the coupling element 11 and the matching element 21 by adopting the configuration 1, the attenuation of electromagnetic waves radiated between the coupling element 11 and the matching element 21 is suppressed, resulting in power loss. Can be suppressed.

<5-2>
In the above embodiment, the second ground 22b of the first separation ground 22 is divided with the gap 22b1. However, as shown in FIG. 13, the second ground 22b may be formed in a series of strips without the gap 22b1. FIG. 13 is an enlarged plan view of another example of the first separation ground. According to FIG. 13, the first separation ground 22 is configured by connecting the first to fourth grounds 22 a to 22 d, and is formed in a continuous annular shape so as to surround the entire periphery of the matching element 21.

  Note that the presence or absence of the gap 22b1 was examined under the same other conditions. In the case of the first remote ground 22 having the gap 22b1 in FIG. 9 of the present embodiment, the transmission amount at 78 GHz is about −0.9 dB. there were. On the other hand, in the case of the first separation ground 22 having a continuous belt shape in FIG. 13, the transmission amount at 78 GHz was about −0.9 dB. 9 and FIG. 13 show that the amount of transmission is large and the insertion loss of power is extremely small. However, the transmission amount was slightly higher in the case of the first separation ground 22 (FIG. 13) without the gap 22b1 than in the case of the first separation ground 22 (FIG. 9) having the gap 22b1. Therefore, it can be seen that by using the first separation ground 22 (FIG. 13) without the gap 22b1, the amount of transmission can be increased and the insertion loss of power can be extremely reduced.

<5-3>
In the said embodiment, the 1st separation ground 22 is comprised by the 1st-4th ground 22a-22d. However, the first separation ground 22 may be configured as shown in FIGS. 14 to 16 are enlarged plan views of another example of the first separation ground. As shown in FIG. 14, the first separation ground 22 may be configured only by the first ground 22 a connected to the second transmission ground.

  Moreover, as shown in FIG. 15, the 1st separation ground 22 may be comprised only by the 1st ground 22a and the 2nd ground 22b. In the case of the first separation ground 22 in FIGS. 14 and 15, the transmission amount at 78 GHz was about −1.0 dB, which was similar. However, the transmission amount was slightly higher when the first separation ground 22 was composed of the first ground 22a and the second ground 22b (FIG. 15) than when the first separation ground 22 was composed only of the first ground 22a (FIG. 14). In the measurement of the transmission amount, the conditions other than the configuration of the first separation ground 22 were the same in FIGS. 14 and 15. Therefore, it can be seen that by using the first separation ground 22 of FIGS. 14 and 15, the amount of transmission can be increased and the insertion loss of power can be extremely reduced.

  Moreover, as shown in FIG. 16, the 1st separation ground 22 may be comprised by the 1st ground 22a, the 3rd and 4th ground 22c, 22d. In this case, by providing not only the first ground 22a but also the third and fourth grounds 22c and 22d, not only unnecessary radiation of the electromagnetic waves from the matching element 21 in the front-rear direction but also unnecessary radiation of the electromagnetic waves in the left-right direction. Can be suppressed.

  Moreover, in the said embodiment, the 1st separation ground 22 is a rectangular cyclic | annular form. However, the shape of the 1st separation ground 22 is not limited to this, For example, circular shape, elliptical shape, etc. may be sufficient.

<5-4>
In the above embodiment, the first separation ground 22 is connected to the second transmission ground 23. However, the first separation ground 22 is not necessarily connected to the second transmission ground 23. FIG. 17 is an enlarged plan view of another example of the first separation ground.

  As shown in FIG. 17, the first separation ground 22 may be a first separation pattern 221 (separation pattern) that is separated from the second transmission ground 23 and is not maintained at the ground potential. Therefore, the first to fourth patterns 221a to 221d constituting the first separation pattern 221 are not maintained at the ground potential. However, since the first to fourth patterns 221a to 221d surround the matching element 21, the effective dielectric constant of the second substrate 20 changes at the end faces of the first to fourth patterns 221a to 221d. Therefore, since the electromagnetic wave radiated from the matching element 21 is reflected, it can be prevented from spreading in the second substrate 20 and in the air. Thereby, power loss can be suppressed. The first separation pattern 221 is not limited to a rectangular shape as in the modified example, and may be, for example, a circular shape or an elliptical shape.

<5-5>
In the said embodiment, although the glass fluororesin was used for the 2nd board | substrate 20, what is necessary is just to be able to transmit / receive a high frequency electromagnetic wave with a low loss, and is not limited to a glass fluororesin. For example, polyphenylene ether (PPE), liquid crystal polymer (LCP), polyethylene and the like may be used. Similarly, in the above description, the glass epoxy resin is used for the first substrate 10, but it is not limited to the glass epoxy resin as long as the coefficient of thermal expansion is small and a through hole can be formed. For example, a glass composite, a bismaleimide triazine resin, or the like may be used.

  Furthermore, the materials of the first substrate 10 and the second substrate 20 are variously selected according to specifications required by the first substrate 10 and the second substrate 20, for example, specifications required by elements mounted on the respective substrates. it can. For example, the substrate material can be appropriately selected from polyimide, polyethylene, Teflon (registered trademark), plastic, various vinyls, natural rubber, mica, glass, ceramic, and the like in addition to the glass fluororesin and the glass epoxy resin.

Moreover, in the said embodiment, the 2nd board | substrate 20 which consists of glass fluororesins has an area of a top view smaller than the 1st board | substrate 10 which consists of glass epoxy resins. However, the size of the area is not limited to this. For example, the area of the second substrate 20 may be larger than the area of the first substrate 10.
For example, the material of the 1st board | substrate 10 and the material of the 2nd board | substrate 20 may be the same, and may differ.

<5-6>
In the above embodiment, the through hole 16 is formed in the first substrate 10, but the through hole 16 is not essential. Further, instead of the through hole 16, an annular second separation ground 40 may be formed around the coupling element 11. FIG. 18 is an explanatory diagram illustrating a configuration in which a second separation ground is formed around the coupling element on the first upper surface of the first substrate. In the power converter 100 according to this modification, an annular second separation ground 40 is formed on the first upper surface 10 a of the first substrate 10 so as to surround the coupling element 11. The second separation ground 40 includes a fifth ground 40a, a sixth ground 40b, a seventh ground 40c, and an eighth ground 40d.

  As shown in FIG. 18, the second separation ground 40 has a shape surrounding the coupling element 11, and includes a fifth ground 40 a, a sixth ground 40 b, a seventh ground 40 c, and an eighth ground 40 d.

  The fifth ground 40a extends in the left-right direction, and is located at a first distance ΔK2 away from the coupling element 11 on the front side. The fifth ground 40a has a fifth width A2 in the front-rear direction. When the guide wavelength of the fifth ground 40a is λm, the fifth width A2 is an odd multiple of ¼λm.

  The fifth ground 40a has the same effect as the first ground 22a of the above embodiment. That is, the fifth ground 40a extending in the left-right direction prevents the electromagnetic waves in the front-rear direction radiated from the coupling element 11 from spreading in the first substrate 10 and in the air. In addition, since the first ground 22a has the fifth width A2, the node of the standing wave is located at the end face close to the coupling element 11 in the fifth ground 40a, and the end face far from the coupling element 11 is located at the end face far from the coupling element 11. Standing wave belly is located. Thereby, it is possible to suppress the electromagnetic wave leaking from the coupling element 11 from spreading in the first substrate 10 and in the air, thereby suppressing power loss.

  The sixth ground 40b extends in the left-right direction, and is located on the rear side of the coupling element 11 and separated by a second distance ΔL2. The sixth ground 40b has a sixth width D2 in the front-rear direction. If the guide wavelength of the sixth ground 40b is λn, the sixth width D2 is an odd multiple of ¼λn. The sixth ground 40 b has a gap 40 b 1 in a portion corresponding to the first transmission pattern 12 of the first substrate 10. The gap 40b1 has a distance C2 in the left-right direction, and the distance C2 is larger than the distance W12 of the first transmission pattern 12.

  Since the sixth ground 40b extends in the left-right direction like the fifth ground 40a, the electromagnetic waves in the front-rear direction radiated from the coupling element 11 are prevented from spreading in the second substrate 20 and in the air. Moreover, since the standing wave similar to the 5th ground 40a is formed in the 6th ground 40b, it is suppressed that the electromagnetic wave leaked from the coupling element 11 spreads in the 1st board | substrate 10, air, etc., and an electric power loss is carried out. Can be suppressed.

  The seventh ground 40c extends in the front-rear direction, and is located on the right side of the coupling element 11 by a third distance ΔM2. The seventh ground 40c connects the first end on the right side of the fifth ground 40a and the first end on the right side of the sixth ground 40b. The seventh ground 40c has a seventh width I2 in the left-right direction. For example, the seventh width I2 is preferably smaller than the fifth width A2 of the fifth ground 40a and the sixth width D2 of the sixth ground 40b. For example, the seventh width I2 is smaller than ¼λo when the in-tube wavelength of the seventh ground 40c is λo. In this case, it is possible to suppress electromagnetic waves from being supplemented by the seventh ground 40c, and to suppress power loss. Even if the seventh width I2 is small, the coupling element 11 emits electromagnetic waves in the front-rear direction mainly along the first transmission pattern 12 and the second transmission pattern 28, and the radiation amount of the electromagnetic waves in the left-right direction. Is relatively small. Therefore, even if the seventh width I2 of the third pattern is small, the power loss can be suppressed small.

  The eighth ground 40d extends in the front-rear direction, and is located on the left side of the coupling element 11 by a fourth distance ΔN2. The eighth ground 40d connects the second end on the left side of the fifth ground 40a and the second end on the left side of the sixth ground 40b. The eighth ground 40d has an eighth width J2 in the left-right direction. For example, the eighth width J2 is preferably smaller than the fifth width A2 of the fifth ground 40a and the sixth width D2 of the sixth ground 40b. For example, the eighth width J2 is smaller than 1 / 4λp when the guide wavelength of the eighth ground 40d is λp. In this case, similarly to the seventh ground 40c, the eighth ground 40d can suppress the supplement of electromagnetic waves, and the power loss can be suppressed even if the eighth width J2 is small.

  The fifth to eighth grounds 40a to 40d are particularly maintained at the ground potential. As described above, standing wave nodes are located on the end surfaces of the fifth ground 40a and the sixth ground 40b close to the coupling element 11. At this time, the fifth ground 40a and the sixth ground 40b are maintained at the ground potential, so that the potential of the end face close to the coupling element 11 can be reliably set to zero and short-circuited. Thereby, it is possible to further suppress the electromagnetic wave leaking from the coupling element 11 from spreading in the second substrate 20 other than the coupling element 11 and in the air, thereby suppressing power loss.

  An annular second separation ground 40 is formed by the fifth to eighth grounds 40a to 40d. The inner periphery of the second separation ground 40 has a rectangular shape having a short side between the fifth ground 40a and the sixth ground 40b and a long side between the seventh ground 40c and the eighth ground 40d. The short side extends in the front-rear direction, and the long side extends in the left-right direction.

  The distance G2 between the long sides of the inner circumference is greater than 1 / 2λq. λq is the in-tube wavelength of the electromagnetic wave in the rectangular inner region formed by the fifth to eighth grounds 40a to 40d. The cutoff wavelength of the electromagnetic wave in the rectangular inner region is 2 × G2. That is, when the cutoff wavelength and the long side distance G2 satisfy this relationship, the electromagnetic wave is attenuated. Therefore, attenuation of electromagnetic waves can be suppressed by making the distance G2 larger than 1 / 2λq.

  On the other hand, the distance E2 of the inner peripheral short side is smaller than the distance G2 of the inner peripheral long side. More preferably, the distance E2 of the short side of the inner periphery is ½ of the distance G2 of the long side of the inner periphery. The front-rear direction in which the short side extends is the resonance direction, and coincides with the front-rear direction, which is the transmission direction of the electromagnetic wave in the first transmission pattern 12 and the second transmission pattern 28, so that power loss can be suppressed.

  Moreover, it is preferable that the coupling elements 11 are arranged at substantially equal positions from the rectangular inner periphery of the fifth to eighth grounds 40a to 40d. In this case, for example, the influence of the electromagnetic wave in the front-rear direction on the fifth ground 40 a on the electromagnetic wave of the coupling element 11 and the influence of the electromagnetic wave in the front-rear direction on the sixth ground 40 b on the electromagnetic wave of the coupling element 11 become substantially uniform. Similarly, for example, the influence of the left and right electromagnetic waves on the seventh ground 40c on the electromagnetic waves of the coupling element 11 and the influence of the left and right electromagnetic waves on the eighth ground 40d on the electromagnetic waves of the coupling element 11 are substantially uniform. Therefore, the design of the coupling element 11 and the fifth to eighth grounds 40a to 40d can be facilitated.

  In addition, the outer periphery of the annular second separation ground 40 is also rectangular, the front-rear direction of the outer periphery is a short side, and the left-right direction of the outer periphery is a long side. Note that the shape of the second separation ground 40 is not limited to a rectangular shape, and may be a circular shape or an elliptical shape.

<5-7>
In the above embodiment, the connection ground 15 of the through hole 16 connects the first upper surface ground 13 of the first upper surface 10a and the first lower surface ground 14 of the first lower surface 10b. However, in the first substrate 10 in which the first upper surface ground 13 of the first upper surface 10a and the first lower surface ground 14 of the first lower surface 10b are not formed, the through hole 16 having the connection ground 15 formed on the wall surface is formed. May be. Further, the second through hole 16b may be omitted, and only the first through hole 16a around the coupling element 11 may be formed.

<5-8>
In the above embodiment, the planar shape of the connection portion between the expansion ground 24 and the second transmission ground 23 changes gently. However, the shape of the connecting portion is not limited to this. 19 and 20 are plan views showing a planar shape of a connection portion between the expansion ground and the second transmission ground. As shown in FIG. 19, the second transmission ground 23 extends in the front-rear direction, the expansion ground 24 extends in the left-right direction with respect to the second transmission ground 23, and the expansion ground 24 and the second transmission ground 23 are connected to each other. You may connect so that it may orthogonally cross.

  Further, as shown in FIG. 20, the extension ground 24 may be formed so as to be inclined rearward from the second transmission ground 23 in the left-right direction.

<5-9>
In the above embodiment, the coupling element 11 and the matching element 21 are rectangular. However, the shapes of the coupling element 11 and the matching element 21 are not limited to this, and may be other shapes such as a circular shape and an elliptical shape.

<5-10>
In the said embodiment, although the 1st lower surface ground 14 is arrange | positioned over the whole in the 1st lower surface 10b of the 1st board | substrate 10, it is not limited to this. For example, the first lower surface ground 14 may be configured to include at least a first transmission ground 14 a corresponding to the first transmission pattern 12 and a coupling ground 14 b corresponding to the coupling element 11.

<5-11>
In the above embodiment, the first transmission pattern 12 and the second transmission pattern 28 are disposed so as to face each other in the same straight line with the matching element 21 in between when viewed from above. However, the arrangement of the first transmission pattern 12 and the second transmission pattern 28 is not limited to this. For example, the second transmission pattern 28 is arranged on the same side as the first transmission pattern 12 with respect to the matching element 21 in a top view. May be.
Further, the second transmission pattern 28 may be arranged at a position different from the same linear shape as the first transmission pattern 12 with the matching element 21 in between when viewed from above. For example, the direction in which the first transmission pattern 12 extends and the direction in which the second transmission pattern 28 extends may intersect at an angle.
Further, at least one of the first transmission pattern 12 and the second transmission pattern 28 may not be linear, for example, may be curved or bent.

<5-12>
In the above embodiment, the first and second substrate units 101 and 102 have a rectangular shape that is long in the left-right direction, but may be a rectangular shape that is long in the front-rear direction. Moreover, the shape of each board | substrate unit 101,102 is not limited to a rectangular shape, For example, square shape, circular shape, elliptical shape, and polygonal shape may be sufficient.

<5-13>
In the above embodiment, one power converter 100 is formed on the first substrate 10 and the second substrate 20. However, a plurality of power converters 100 may be formed on the first substrate 10 and the second substrate 20.

<5-14>
In the said embodiment, although the planar antenna is mentioned as an example as an antenna, an antenna is not limited to this. For example, various antennas that can be connected to the power converter 100, such as a slot antenna, are applicable.

<5-15>
In the said embodiment, the power converter 100 showed the example used for the antenna apparatus 200. FIG. However, the use of the power converter 100 is not limited to this, and can be used for high-speed video wired transmission, high-speed wireless LAN, and the like.

<5-16>
In the above embodiment, the thermal expansion coefficient of the first substrate 10 below the power converter 100 is smaller than the thermal expansion coefficient of the upper second substrate 20. However, for example, the first substrate 10 and the second substrate 20 may be interchanged. For example, the first substrate 10 is disposed above the power converter 100 and the second substrate 20 is disposed below the power converter 100 so that the coupling element 11 of the first substrate 10 and the matching element 21 of the second substrate 20 face each other. May be. That is, a configuration provided on the substrate may be appropriately selected depending on the size of the thermal expansion coefficient of the substrate. In other words, regardless of the top and bottom of the board, a board with a low thermal expansion coefficient is easily affected by thermal expansion. Instead, a board with a high thermal expansion coefficient is not easily affected by thermal expansion. What is necessary is just to form.

<5-17>
In the above embodiment, the first substrate unit 101 and the second substrate unit 102 are bonded by the adhesive member 103 which is a fixing member of the present invention. However, the fixing member of the present invention is not limited to this, and is not particularly limited as long as the first substrate unit 101 and the second substrate unit 102 are fixed. Therefore, it may be fixed so as not to be removed like an adhesive, or may be fixed detachably. Hereinafter, another example of the fixing member according to the present invention will be described with reference to FIG. 21 is a cross-sectional view taken along the line AA ′ of FIG. 1 of the power converter including the fixing member.

  The fixing member 205 shown in FIG. 21 is formed in a U-shaped cross section having a pair of opposing plate-like support portions 205a and 205b and a connecting portion 205c that connects these support portions 205a and 205b. The first substrate unit 101 and the second substrate unit 102 are sandwiched and fixed between the pair of support portions 205a and 205b. Further, a spacer 210 is provided between the first substrate unit 101 and the second substrate unit 102 instead of the adhesive member 103 of the above embodiment. By this spacer 210, the coupling element 11 of the first substrate unit 101 and the matching element 21 of the second substrate unit 102 face each other through air.

  Even when such a fixing member 205 is used, the first substrate unit 101 and the second substrate unit 102 can be fixed. The substrate units 101 and 102 may be fixed to the fixing member 205 with an adhesive or the like, or both the substrate units 101 and 102 may be press-fitted between the support portions 205a and 205b. The method is not particularly limited and may be removable. In addition, both board units 101 and 102 can be detachably fixed with screws, bolts, or the like. Furthermore, you may fix together using an adhesive agent.

DESCRIPTION OF SYMBOLS 10 1st board | substrate 11 coupling | bonding element 12 1st transmission pattern 20 2nd board | substrate 21 matching element 22 1st isolation ground 23 2nd transmission ground 24 expansion ground 27 shield board 28 2nd transmission pattern 50 planar antenna pattern 60 high frequency circuit 100 power conversion Container 101 First substrate unit 102 Second substrate unit 103 Adhesive member (fixing member)
200 Antenna device

Claims (5)

A first substrate having a first surface and a second surface disposed opposite to the first surface;
A first transmission pattern disposed on the first surface;
A coupling element disposed on the first surface and connected to an end of the first transmission pattern;
A first transmission ground, wherein at least a part of the second surface is disposed at a position corresponding to the first transmission pattern and the coupling element, and constitutes an electromagnetic wave reflection wall together with the first transmission pattern and the coupling element; ,
A second substrate having a third surface facing the first surface of the first substrate and a fourth surface disposed on the opposite side of the third surface;
A matching element disposed on the third surface at a position facing the coupling element and electromagnetically coupled to the coupling element;
A separation pattern disposed on the third surface, spaced apart from the matching element, disposed in at least part of the periphery of the matching element, and suppressing leakage of electromagnetic waves from the matching element;
A second transmission ground disposed on the third surface;
A second transmission pattern disposed on the fourth surface at a position corresponding to the matching element and the second transmission ground, and constituting a reflection wall of an electromagnetic wave together with the matching element and the second transmission ground;
A fixing member that fixes the first substrate and the second substrate;
A power converter. The first and second transmission patterns are formed so that at least a part thereof extends in a first direction along a surface direction of the first and second substrates,
The separation pattern is
A first pattern extending in a second direction intersecting the first direction and spaced apart from the first transmission pattern with respect to the matching element in a plane direction of the first and second substrates; The power converter according to claim 1. A first substrate having a first surface and a second surface disposed opposite to the first surface;
A first transmission pattern disposed on the first surface;
A coupling element disposed on the first surface and connected to an end of the first transmission pattern;
A first transmission ground, wherein at least a part of the second surface is disposed at a position corresponding to the first transmission pattern and the coupling element, and constitutes an electromagnetic wave reflection wall together with the first transmission pattern and the coupling element; ,
A second substrate having a third surface facing the first surface of the first substrate and a fourth surface disposed on the opposite side of the third surface;
A matching element disposed on the third surface at a position facing the coupling element and electromagnetically coupled to the coupling element;
A second transmission ground disposed on the third surface;
A second transmission pattern disposed on the fourth surface at a position corresponding to the matching element and the second transmission ground, and constituting a reflection wall of an electromagnetic wave together with the matching element and the second transmission ground;
A fixing member that fixes the first substrate and the second substrate so that a space is formed between the coupling element and the matching element;
A power converter.   The power converter according to claim 1, wherein the first substrate and the second substrate are formed of materials having different thermal expansion coefficients. A power converter according to any one of claims 1 to 4,
An antenna pattern disposed on a fourth surface of the second substrate and connected to an end of the second transmission pattern;
An antenna device comprising:

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