JP2017194679A - Camera module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a camera module.SOLUTION: A camera module is provided, including a lens drive mechanism, a lens unit, a circuit board, and an image sensor. The lens unit is disposed on the lens drive mechanism. The image sensor is disposed on the circuit board. The circuit board includes a metal member, an insulation layer, and a metal wire. The insulation layer is disposed between the metal member and the metal wire, and the metal wire is electrically connected to the image sensor. The lens drive module can drive the lens unit to move relative to the image sensor. The image sensor can capture light through the lens unit.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a camera module, and more particularly to an image sensor and a camera module having a circuit board. The image sensor is installed on the circuit board, and the circuit board has a metal member.

  With the development of technology, many electronic devices (for example, cameras and smartphones) have a function of taking a picture or recording a video. The use of these electronic devices has become more and more universal, has become more convenient and thinner, providing more choices to users.

  In general, an electronic device having a function of taking a picture or recording a video has a drive module, drives one or more optical lens units, moves along an optical axis, and automatically aims. Has achieved automatic zooming control. The light beam passes through the optical lens unit and generates an image on the image sensor.

  Therefore, the flatness of the drive module and the image sensor is important. However, the conventional image sensor is usually supported by a printed circuit board, and when the electronic device is assembled or moved, the printed circuit board is bent and the flatness is lowered.

JP 2008-19731 A

  In order to solve the defects of conventional products, an embodiment of the present invention provides a camera module having a lens driving mechanism, a lens unit, a circuit board, and an image sensor. A lens unit is installed on the lens driving mechanism. An image sensor is installed on the circuit board. The circuit board has a metal member, an insulating layer, and a metal wire. The insulating layer is disposed between the metal member and the metal wire, and the metal wire is electrically connected to the image sensor. The lens driving module drives the lens unit and moves it relative to the image sensor. The image sensor can capture the light beam by the lens unit.

  In some embodiments, the thickness of the metal member exceeds the total thickness of the insulating layer and the metal line.

  In some embodiments, the metal member has a thickness of 0.10 mm to 0.35 mm.

  In some embodiments, the metal line is formed on the insulating layer using a molded interconnect device.

  In some embodiments, the metal line is formed on the insulating layer by coating.

  In some embodiments, the metal member and the metal wire have the same coefficient of thermal expansion.

  In some embodiments, the image sensor is attached to an insulating layer.

  In some embodiments, the camera module further includes a plurality of lens driving mechanisms, a plurality of lens units, and a plurality of image sensors. Each lens unit is installed on a lens driving mechanism, and each image sensor is installed on a circuit board. Each lens unit position corresponds to each image sensor position.

  In some embodiments, the camera module further includes a base installed between the image sensor and the lens unit.

  In some embodiments, the base has a metal substrate, a first conductive layer electrically connected to the lens drive mechanism, and a first insulating layer disposed between the metal substrate and the first conductive layer.

  In some embodiments, the thickness of the metal substrate exceeds the total thickness of the first conductive layer and the first insulating layer.

  In some embodiments, the metal substrate has a thickness of 0.10 mm to 0.35 mm.

  In some embodiments, the base further includes a second insulating layer and a second conductive layer, wherein the second insulating layer is formed on the metal substrate, and the first insulating layer and the second insulating layer are formed. The layer is formed on the opposite surface of the metal substrate, and the second conductive layer is formed on the second insulating layer.

  In some embodiments, the thickness of the metal substrate exceeds the total thickness of the second insulating layer and the second conductive layer.

  In some embodiments, the second conductive layer is electrically connected to the image sensor.

  In some embodiments, the first conductive layer and the second conductive layer are formed on the first insulating layer and the second insulating layer, respectively, depending on the type of the molded circuit component.

  In some embodiments, the metal substrate, the first conductive layer, and the second conductive layer have the same coefficient of thermal expansion.

  In some embodiments, the camera module further includes a housing that surrounds the lens drive mechanism and includes metal.

  In some embodiments, the housing and base are connected to each other by welding.

  In the camera module of the present invention, the image sensor becomes flat. Further, a metal member is used to assist heat dissipation of the image sensor. Furthermore, electromagnetic interference is reduced.

The invention can be best understood from the following description when read in conjunction with the accompanying drawings.
1 is a schematic diagram of an electronic device according to an embodiment of the present invention. It is an exploded view of the camera module by one Embodiment of this invention. It is the schematic of the image sensor by one Embodiment of this invention, and a circuit board. FIG. 4 is a cross-sectional view taken along line AA in FIG. 3. 1 is a schematic view of a base according to an embodiment of the present invention. FIG. 6 is a schematic view of a base according to another embodiment of the present invention. FIG. 6 is a schematic view of a camera module according to another embodiment of the present invention.

  The manufacture and use of camera modules according to embodiments of the present invention will be discussed in detail below. It should be noted that the embodiments provide many applicable inventive concepts that can be implemented in a wide range of specific contexts. The specific embodiments discussed are intended to illustrate the use of the present invention in a specific manner and are not intended to limit the scope of the invention.

  Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this technique belongs. It should be understood that these terms, such as those defined in commonly used dictionaries, should be construed as having a meaning consistent with the correlation techniques and background of the present disclosure or the text. Yes, and unless otherwise defined, should not be idealized or interpreted in an overly formal manner.

  Referring to FIG. 1, in one embodiment of the present invention, the camera module 10 is installed in the electronic device 20 and can take a picture or record a video. The electronic device 20 is, for example, a smartphone or a digital camera. When taking a picture or recording a video, the camera module 10 can receive light and form an image, which is sent to a processor (not shown) in the electronic device 20 for post-image. Execute the process.

  As shown in FIG. 2, the camera module 10 mainly includes a housing 100, a lens driving mechanism 200, a lens unit 300, a base 400, an image sensor 500, and a circuit board 600. The housing 100 and the base 400 have a hollow box shape, and the housing 100 surrounds the lens driving mechanism 200. Therefore, the lens driving mechanism 200, the lens unit 300, and the base 400 are accommodated in the above-described box. The image sensor 500 and the circuit board 600 are installed on one side of the box, and the housing 100 and the base 400 each have an opening O1 and an opening O2. The light rays sequentially reach the image sensor 500 through the opening O1, the lens unit 300, and the opening O2, and form an image on the image sensor 500.

  The lens driving mechanism 200 includes a lens holder 210, a frame 220, at least one first electromagnetic drive assembly 230, at least one second electromagnetic drive assembly 240, a first elastic member 250, a second elastic member 260, a coil board 270, and a plurality of coil boards 270. Suspension wire 280 and a plurality of position detectors 290.

  The lens holder 210 has an accommodation space 211 and a concave surface structure 212, the accommodation space 211 is formed at the center of the lens holder 210, and the concave surface structure 212 is formed by the outer wall of the lens holder 210 and the accommodation space 211. Besiege. The lens unit 300 is attached to the lens holder 210 and is accommodated in the accommodation space 211. The first electromagnetic drive assembly 230 is installed in the concave structure 212.

  The frame 220 has a receiving portion 221 and a plurality of recesses 222. The lens holder 210 is received in the receiving portion 221 and the second electromagnetic drive assembly 240 is mounted in the recess 222 and is adjacent to the first electromagnetic drive assembly 230.

  The first elastic member 250 and the second elastic member 260 are installed on the opposite sides of the lens holder 210 and the frame 220, respectively, and the lens holder 210 and the frame 220 are installed therebetween. An inner portion 251 of the first elastic member 250 is connected to the lens holder 210, and an outer portion 252 of the first elastic member 250 is connected to the frame 220. Similarly, the inner part 261 of the second elastic member 260 is connected to the lens holder 210, and the outer part 262 of the second elastic member 260 is connected to the frame 220. Therefore, the lens holder 210 is suspended in the receiving portion 221 of the frame 220 by the first elastic member 250 and the second elastic member 260, and the range of movement of the lens holder 210 in the Z-axis direction is further Limited by the first and second elastic members 250, 260.

  The lens holder 210 and the lens unit 300 installed on the lens holder 210 are driven by electromagnetic induction between the first electromagnetic drive assembly 230 and the second electromagnetic drive assembly 240, and in the Z-axis direction with respect to the frame 220, Moving. For example, in this embodiment, the first electromagnetic drive assembly 230 is a drive coil that surrounds the accommodation space 211 of the lens holder 210, and the second electromagnetic drive assembly 240 has at least one magnet. When current flows through the drive coil (first electromagnetic drive assembly 230), electromagnetic induction is generated between the drive coil and the magnet. Accordingly, the lens holder 210 and the lens unit 300 installed thereon are driven and moved along the Z-axis direction with respect to the frame 220 to achieve focus adjustment.

  In some embodiments, the first electromagnetic drive assembly 230 is a magnet and the second electromagnetic drive assembly 240 is a drive coil.

  Referring to FIG. 2, the coil board 270 is installed on the base 400. Similarly, when current flows through the coil board 270, electromagnetic induction is generated between the coil board 270 and the second electromagnetic drive assembly 240 (or the first electromagnetic drive assembly 230). Accordingly, the lens holder 210 and the frame 220 are driven to move along the X-axis direction and / or the Y-axis direction with respect to the coil board 270, and the lens unit 300 is driven to drive the image sensor 500. On the other hand, it moves along the X-axis direction and / or the Y-axis direction. Image stabilization is achieved.

  In this embodiment, the camera module 10 has four suspension wires 280. The four suspension wires 280 are installed at the four corners of the coil board 270, respectively, and connect the coil board 270, the base 400, and the first elastic member 250. When the lens holder 210 and the lens unit 300 move along the X-axis direction and / or the Y-axis direction, the suspension wire 280 can limit the range of their movement. Furthermore, since the suspension wire 280 includes a metal (for example, copper or an alloy thereof), the suspension wire 280 may be used as a conductor (conductive path). For example, current flows into the first electromagnetic drive assembly 230 via the base 400 and the suspension wire 280.

  A position detector 290 is installed on the base 400 and detects the movement of the second electromagnetic drive assembly 240 to confirm the positions of the lens holder 210 and the lens unit 300 in the X-axis direction and the Y-axis direction.

  For example, the position detector 290 may be a Hall sensor, a magnetoresistive sensor (MR sensor), a giant magnetoresistive sensor (GMR sensor), a tunnel type magnetoresistive sensor (TMR sensor), or a fluxgate sensor. (fluxgate sensor).

  As shown in FIGS. 3 and 4, the circuit board 600 has a three-layer structure of a metal member 610, an insulating layer 620, and a metal wire 630, and the insulating layer 620 is between the metal member 610 and the metal wire 630. Installed. The image sensor 500 is attached to the insulating layer 620 and electrically connected to the metal wire 630. Further, the metal member 610 and the insulating layer 620 each have a hole 611 and a hole 621 aligned with each other, and the appearance of the hole 611 is almost the same as the hole 621. The image sensor 500 can capture the light beam passing through the lens unit 300 through the holes 611 and 621. Conventional circuit boards that support image sensors typically have plastic plates and coils or wires that are either installed on top or incorporated therein. Therefore, as compared with the conventional circuit board, the structure of the circuit board 600 described above reduces the height of the camera module 10 and reduces the volume of the camera module 10.

  It should be noted that the thickness of the metal member 610 in the Z-axis direction exceeds the total thickness of the insulating layer 620 and the metal wire 630 in the Z-axis direction. Therefore, the circuit board 600 has sufficient hardness and sufficient flatness, and prevents the inclination of the lens unit 300 and the inclination of the image sensor 500 during the assembly period of the camera module 10. For example, the thickness of the metal member 610 is 0.10 mm to 0.35 mm. Further, the bottom surface of the metal member 610 is exposed and not covered. Therefore, the thermal radiation efficiency of the circuit board 600 and the image sensor 500 is improved. Since the metal member 610 and the metal wire 630 have the same thermal expansion coefficient, no relative shift is generated between the metal member 610 and the metal wire 630 when the circuit board 600 is heated.

  In this embodiment, molded circuit components (MID), for example, laser direct structuring (LDS), micro composite processing technology (MIPTEC), laser induced metallization (LIM), laser reconstruction printing (LRP), aerosol jet processor The metal wire 630 is formed on the insulating layer 620 by using a two-piece forming method. In some embodiments, the metal line 630 is formed on the insulating layer 620 by coating.

  In some embodiments, the metal wire 630 and the metal member 610 have different materials, the metal member 610 has a high hardness material, and the metal wire 630 has a high electrical and thermal conductivity. Of materials. Therefore, the hardness of the metal wire 630 is smaller than that of the metal member 610, and the electrical conductivity and thermal conductivity of the metal wire 630 exceed the metal member 610.

  Referring to FIG. 5, in this embodiment, the base 400 includes a metal substrate 410, a first insulating layer 420, a first conductive layer 430, a second insulating layer 440, and a second conductive layer 450. The first insulating layer 420 and the second insulating layer 440 are formed on opposite surfaces of the metal substrate 410, respectively. The first conductive layer 430 is formed on the first insulating layer 420, and the second conductive layer 450 is formed on the second insulating layer 440. The first conductive layer 430 is electrically connected to the suspension wire 280, and the second conductive layer 450 is electrically connected to the image sensor 500.

  Similarly, the thickness of the metal substrate 410 in the Z-axis direction exceeds the total thickness of the first insulating layer 420 and the first conductive layer 430 in the Z-axis direction, and the second insulating layer 440 and the second conductive layer 450 Exceeds the total thickness in the Z-axis direction. For example, the thickness of the metal substrate 410 is 0.10 mm to 0.35 mm. Since the metal substrate 410, the first conductive layer 430, and the second conductive layer 450 have the same thermal expansion coefficient, no relative shift is generated even when the metal substrate 410 is heated.

  It should be noted that the housing 100 includes metal to reduce electromagnetic interference to other electronic components in the electronic device 20 of the camera module 10. Since the base 400 includes the metal substrate 410, the base 400 is connected to the housing 100 by welding. The connection strength between the base 400 and the housing 100 increases. Separation between the base 400 and the housing 100 due to the collision of the camera module 10 is prevented, and melting of the plastic due to welding and tilting of the pins are prevented.

  As shown in FIG. 6, in another embodiment, the base 400 has only a metal substrate 410, a first insulating layer 420, and a first conductive layer 430. The second insulating layer 440 and the second conductive layer 450 are omitted, and thus the height of the camera module 10 in the Z-axis direction is reduced. Since the base 400 includes the metal substrate 410, the flatness is good. Furthermore, since the metal substrate is adjacent to or in contact with the image sensor 500, the heat dissipation efficiency of the image sensor 500 is improved.

  In some embodiments, the base 400 further includes an outer insulating layer, and the first conductive layer 430 is disposed between the outer insulating layer and the first insulating layer 420. A short circuit between the first conductive layer 430 and other electronic components is prevented. It should be noted that the outer insulating layer has one or more openings that are electrically connected.

  Referring to FIG. 7, in another embodiment, the camera module 10 includes a plurality of housings 100, a plurality of lens driving mechanisms 200, a plurality of lens units 300, a plurality of bases 400, a plurality of image sensors 500, and a circuit board. 600. Since the image sensor 500 installed on the circuit board 600 corresponds to the lens unit 300 on the lens driving mechanism 200, the light beam passes through the lens unit 300 and forms an image on the image sensor 500. Since all the image sensors are installed on the same circuit board 600 having the metal member 610, the image sensor 500 is substantially coplanar, which is advantageous for the camera module to acquire a plurality of images simultaneously.

  In summary, a camera module is provided, and a circuit board in the camera module has a metal member, an insulating layer, and a metal wire, and the thickness of the metal member is the total thickness of the insulating layer and the metal wire. To exceed. Since the metal member has sufficient hardness, the image sensor becomes flat. Further, a metal member is used to assist heat dissipation of the image sensor.

  Furthermore, since electromagnetic waves entering and leaving the camera module are reduced by the circuit board having the metal member and the base having the metal substrate, the electromagnetic interference is reduced. Further, conductive layers (metal member 610, metal wire 630, metal substrate 410, first conductive layer 430, second conductive layer 450) in the circuit board and base, and non-conductive layers (insulating layer 620, first insulating layer) 420, the second insulating layer 440) is arranged in a staggered manner, increasing the number of metal boundaries. Therefore, the boundary effect is improved and electromagnetic interference is further reduced. For example, the structure of the circuit board includes a metal member 610, an insulating layer 620, and a metal wire 630 from the bottom to the top, and an electronic component (for example, the image sensor 500) that is electrically connected to the metal wire 630 includes: It is installed on the metal wire 630. The bottom to top structure includes a metal substrate 410, a first insulating layer 420, and a first conductive layer 430, and an electronic component (eg, position detector 290) that is electrically connected to the first conductive layer 430. Is disposed on the first conductive layer 430.

  Although embodiments of the present invention and advantages thereof have been described in detail, it will be understood by those skilled in the art that changes, substitutions, and modifications can be made without departing from the spirit of the present invention. For example, those skilled in the art can change many features, functions, processes, and materials disclosed herein without departing from the spirit of the invention. Further, the scope of protection of the present invention is not limited to the processes, equipment, manufacture, material compositions, apparatus, methods, and steps in the specific embodiments described within the specification, and those skilled in the art will From the disclosure, current or future developing processes, equipment, manufacturing, material compositions, apparatus, methods, and steps can be understood and perform the same functions in the embodiments described herein. Alternatively, achieving the same result as the corresponding embodiment is utilized in accordance with the present disclosure. Accordingly, the protection scope of the present invention includes such processes, equipment, manufacturing, material compositions, apparatus, methods, and steps. Furthermore, each claim constitutes an individual embodiment, and the protection scope of the present invention includes each claim scope and a combination of the embodiments.

  In the present invention, preferred embodiments have been disclosed as described above. However, the present invention is not limited to the present invention, and any person who is familiar with the technology can use various methods within the spirit and scope of the present invention. Variations and moist colors can be added, so the protection scope of the present invention is based on what is specified in the claims.

DESCRIPTION OF SYMBOLS 10 ... Camera module 20 ... Electronic device 100 ... Housing 200 ... Lens drive mechanism 210 ... Lens holder 211 ... Accommodating space 212 ... Concave surface structure 220 ... Frame 221 ... Receiving part 222 ... Recess 230 ... First electromagnetic drive assembly 240 ... Second electromagnetic Drive assembly 250 ... first elastic member 251 ... inner part 252 ... outer part 260 ... second elastic member 261 ... inner part 262 ... outer part 270 ... coil board 280 ... suspension wire 290 ... position detector 300 ... lens unit 400 ... base 410 ... metal substrate 420 ... first insulating layer 430 ... first conductive layer 440 ... second insulating layer 450 ... second conductive layer 500 ... image sensor 600 ... circuit board 610 ... metal member 611 ... hole 620 ... insulating layer 621 ... hole 630 ... Metal wires O1, O2 ... Openings

Claims (23)

A camera module,
A lens drive mechanism,
A lens unit installed on the lens driving mechanism;
A circuit board having a metal member, a metal wire, and an insulating layer disposed between the metal member and the metal wire; and
An image sensor installed on the circuit board and electrically connected to the metal wire;
The camera module, wherein the lens driving mechanism drives the lens unit to move it relative to the image sensor, and the image sensor can capture a light beam by the lens unit.   The camera module according to claim 1, wherein a thickness of the metal member exceeds a total thickness of the insulating layer and the metal wire.   The camera module according to claim 1, wherein the thickness of the metal member is 0.10 mm to 0.35 mm.   The camera module according to claim 1, wherein the metal wire is formed on the insulating layer by using a molded circuit component.   The camera module according to claim 1, wherein the metal wire is formed on the insulating layer by using a coating.   The camera module according to claim 1, wherein the metal member and the metal wire have the same thermal expansion coefficient.   The camera module according to claim 1, wherein the image sensor is attached to the insulating layer.   A plurality of the lens driving mechanisms, a plurality of the lens units, and a plurality of the image sensors, wherein each of the lens units is installed on the lens driving mechanism, and the image sensors are arranged on the circuit board. The camera module according to claim 1, wherein the camera module is installed and the position of the lens unit corresponds to the position of the image sensor.   The camera module according to claim 1, further comprising a base installed between the image sensor and the lens unit. The base is
A metal substrate;
A first conductive layer electrically connected to the lens driving mechanism; and
A first insulating layer disposed between the metal substrate and the first conductive layer;
The camera module according to claim 9, further comprising:   The camera module according to claim 10, wherein a thickness of the metal substrate exceeds a total thickness of the first conductive layer and the first insulating layer.   The camera module according to claim 10, wherein the metal substrate has a thickness of 0.10 mm to 0.35 mm. The base further includes:
A second insulating layer formed on the metal substrate, together with the first insulating layer, formed on the opposite surface of the metal substrate; and
A second conductive layer formed on the second insulating layer;
The camera module according to claim 10, further comprising:   The camera module according to claim 13, wherein a thickness of the metal substrate exceeds a total thickness of the second insulating layer and the second conductive layer.   The camera module according to claim 13, wherein the second conductive layer is electrically connected to the image sensor.   The first conductive layer and the second conductive layer are formed on the first insulating layer and the second insulating layer, respectively, according to a method of a molded circuit component. Camera module.   The camera module according to claim 13, wherein the metal substrate, the first conductive layer, and the second conductive layer have the same thermal expansion coefficient.   The camera module according to claim 10, further comprising a housing surrounding the lens driving mechanism and containing metal.   The camera module according to claim 18, wherein the housing and the base are connected to each other by welding.   The camera module according to claim 1, wherein the metal wire and the metal member have different materials.   The camera module according to claim 20, wherein the electrical conductivity of the metal wire exceeds the electrical conductivity of the metal member.   The camera module according to claim 20, wherein the hardness of the metal wire is lower than the hardness of the metal member.   The camera module according to claim 20, wherein the thermal conductivity of the metal wire exceeds the thermal conductivity of the metal member.

Images