CN114553985B - Camera module and electronic device using same - Google Patents
Camera module and electronic device using same Download PDFInfo
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- CN114553985B CN114553985B CN202011340610.8A CN202011340610A CN114553985B CN 114553985 B CN114553985 B CN 114553985B CN 202011340610 A CN202011340610 A CN 202011340610A CN 114553985 B CN114553985 B CN 114553985B
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- driver
- image sensor
- carrier
- circuit board
- shake
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
- Adjustment Of Camera Lenses (AREA)
Abstract
The application provides an image pickup module which comprises a lens assembly, an image sensor and a driver which are sequentially stacked from top to bottom. The driver carries the image sensor and is movable relative to the lens assembly so as to drive the image sensor to move. A soft adhesive layer is arranged on the surface of the lens assembly, facing the image sensor; a soft rubber film is arranged in the driver; the soft adhesive layer and the soft adhesive film are used for buffering collision caused by movement of the driver and the image sensor. The application also provides an electronic device applying the camera module. When the driver collides with the lens assembly under external disturbance, the soft rubber layer can buffer/reduce collision impact force, so that structural or functional failure is avoided; when the driver collides with each other in the driver under external disturbance, the soft rubber film can buffer/reduce impact force, and structural or functional failure is avoided.
Description
Technical Field
The application relates to a camera module and an electronic device using the camera module.
Background
The automatic focusing or optical anti-shake function of a camera module of an electronic device (such as a mobile phone) is mainly realized by moving a lens; currently, some camera modules start to use a method of moving an image sensor to realize automatic focusing and optical anti-shake functions. The image sensor is arranged on the image sensor driver, and the image sensor is driven to move by the movement of the image sensor driver. The image sensor driver may be moved spatially by magnetic force or other means; compared with the traditional module driving lens movement, the weight of the image sensor is far lighter than that of the lens, and the driving of the image sensor does not need larger thrust, so that the pain point that most of current lens drivers cannot drive a large lens can be made up. At the same time, however, the image sensor is used as a precision device, the image sensor is extremely easy to damage under the influence of external force, the current trend of module size is miniaturization, and a buffer device is difficult to be arranged in a sufficient space nearby the image sensor.
Disclosure of Invention
The first aspect of the embodiment of the application provides an image pickup module, which comprises a lens assembly, an image sensor and a driver, wherein the lens assembly, the image sensor and the driver are sequentially stacked from top to bottom, and the driver carries the image sensor and is movable relative to the lens assembly so as to drive the image sensor to move; a soft adhesive layer is arranged on the surface of the lens assembly, facing the image sensor; a soft rubber film is arranged in the driver; the soft adhesive layer and the soft adhesive film are used for buffering collision caused by movement of the driver and the image sensor.
In the automatic focusing and optical anti-shake processes, the driver drives the image sensor to move, and if the driver and the image sensor collide with the lens component under external disturbance, the soft adhesive layer can buffer/reduce collision impact force, so that collision buffer is brought to the driver and the image sensor, and structural or functional failure is avoided; when the drivers collide with each other in the outside disturbance, the soft rubber film can buffer/reduce impact force, so that collision buffer is brought to the drivers, and structural or functional failure is avoided.
In an embodiment of the present application, the soft adhesive layer is at least located on two opposite sides of the image sensor.
The soft adhesive layer can be arranged on the surface of the carrier of the lens assembly, which faces the image sensor, and the soft adhesive layer does not cover the lens, so that the imaging effect is prevented from being influenced, and the soft adhesive layer can be formed on the surface of the carrier of the lens assembly through secondary injection molding; the soft adhesive layer may be made of silica gel, but is not limited to silica gel. When the driver collides to the lens assembly under external disturbance, the soft rubber layer can effectively buffer/reduce collision impact force, so that collision buffer is brought to the driver and the image sensor, and structural or functional failure is avoided.
In an embodiment of the application, the camera module further comprises a lower cover, wherein the lower cover comprises a bottom and a side part connected with the periphery of the bottom, the bottom and the side part are matched to form a containing cavity, the driver and the image sensor are positioned in the containing cavity, and the driver is positioned between the bottom and the image sensor; the lens assembly is arranged on the lower cover and is positioned on one side of the lower cover with the side part.
The lower cover is used for accommodating and protecting the driver and the image sensor; the driver can move at least in the X direction and the Y direction in the accommodating cavity of the lower cover.
In the embodiment of the application, an outer circuit board is also arranged between the lens assembly and the lower cover; the outer circuit board surrounds the image sensor so as not to affect the light signal entering the image sensor.
The outer circuit board is used for being connected with a control circuit and the like outside the camera module so as to receive the electric signals and transmit the electric signals to the image sensor and the driver.
In an embodiment of the present application, the image sensor is electrically connected to the outer circuit board through a wire.
External optical signals sequentially pass through the lens and the infrared filter and then are transmitted to the image sensor, the driver is in the process of realizing the optical anti-shake function, the image sensor can be always electrified to work, the lead can be a long gold wire, and the long gold wire can shake or deform due to the action of the driver, but good electrical connection can be always kept.
In the embodiment of the application, a metal sheet is further arranged in the lower cover, the driver is electrically connected with the outer circuit board through the metal sheet, one end of the metal sheet is electrically connected with the outer circuit board, and the other end of the metal sheet is electrically connected with the driver.
The outer circuit board receives an electric signal from the camera module, and the electric signal is transmitted to the driver through a metal sheet connected with the outer circuit board.
In an embodiment of the application, the side is provided with a further soft glue layer on the surface facing the driver.
The soft gel layer on the side portion may further effectively buffer the collision between the driver and the image sensor and the side portion of the lower cover.
In an embodiment of the application, the driver comprises an optical anti-shake coil, a focusing carrier and an inner circuit board which are sequentially stacked on the bottom; the inner side circuit board is electrically connected with the outer side circuit board through a wire; the image sensor is electrically connected with the inner circuit board through a wire; the driver also comprises a focusing coil, an optical anti-shake carrier and a magnet, wherein the focusing coil is wound outside the focusing carrier and is positioned between the inner circuit board and the optical anti-shake coil; the optical anti-shake carrier is arranged on the optical anti-shake coil and is positioned between the focusing carrier and the side part; the magnet is carried on the optical anti-shake carrier; the optical anti-shake carrier and the focusing carrier are both made of electrically insulating materials.
The driver can move in the accommodating cavity of the lower cover in the directions X, Y and Z, and the directions X, Y, Z are mutually perpendicular, so that the image sensor is driven to move in the accommodating cavity in the directions X, Y and Z, and the functions of automatic focusing and optical anti-shake are achieved.
In the embodiment of the application, the soft rubber film is arranged on the surfaces of the optical anti-shake carrier and the magnet facing the focusing carrier.
The soft rubber film can effectively buffer collision inside the driver.
In the embodiment of the application, the surface of the bottom facing the driver is provided with an additional soft adhesive layer, and the optical anti-shake coil is provided with a through hole for the additional soft adhesive layer on the bottom to pass through; the further soft gel layer is located between the bottom and the focusing carrier.
The soft rubber film can effectively buffer collision between the bottom of the lower cover and the focusing carrier.
In the embodiment of the application, a circuit is arranged on the surface of the bottom facing the driver, the optical anti-shake coil is electrically connected with the circuit, a metal sheet is also arranged in the lower cover, the circuit is electrically connected with the outer circuit board through the metal sheet, one end of the metal sheet is electrically connected with the outer circuit board, and the other end of the metal sheet is electrically connected with the circuit; the driver also comprises a plurality of suspension wires, each suspension wire is a metal thin rod, the metal thin rod is vertically arranged on the bottom, one end of each suspension wire is electrically connected with the circuit, and the other end of each suspension wire is electrically connected with one elastic sheet of the focusing coil.
When the camera module focuses, the outer circuit board receives an electric signal from the camera module, the electric signal is sequentially transmitted to the circuit of the lower cover through the outer circuit board and the metal sheet, then is transmitted to the suspension wire through the circuit of the lower cover, is transmitted to the elastic sheet through the suspension wire, and is transmitted to the focusing coil through the elastic sheet; after the focusing coil is electrified, Z-direction electromagnetic force is generated under the action of the magnetic field of the magnet, so that the focusing coil carries the focusing carrier, the inner circuit board and the image sensor to realize the focusing function of Z-direction action.
When the camera module is in optical anti-shake, the outer circuit board receives an electric signal from the camera module, the electric signal is transmitted to the circuit of the lower cover through the outer circuit board and the metal sheet, and then is transmitted to the optical anti-shake coil through the circuit of the lower cover; after the optical anti-shake coil is electrified, electromagnetic force in X and Y directions is generated under the action of the magnetic field of the magnet, so that the magnet carries the optical anti-shake carrier, the elastic sheet, the focusing carrier, the focusing coil, the inner circuit board and the image sensor to realize the optical anti-shake function of X and Y directions.
In an embodiment of the present application, the driver is a mems actuator, a gap is formed in the mems actuator, and the soft plastic film is formed in the gap.
The soft rubber film can effectively buffer collision inside the driver.
In an embodiment of the application, an infrared filter is further disposed on a side of the lens assembly facing the image sensor, and the image sensor is located between the infrared filter and the driver.
The external light signals sequentially pass through the lens and the infrared filter and then are transmitted to the image sensor, and the infrared filter can be used for filtering out unwanted infrared light.
The second aspect of the embodiment of the application provides an electronic device, which comprises the camera module.
The electronic device with the camera shooting module can effectively reduce the size of the camera shooting module because the driver arranged on the camera shooting module drives the image sensor to move, has good focusing and optical anti-shake functions, and can further effectively improve the service performance of the electronic device.
Drawings
Fig. 1 is a schematic perspective view of an image capturing module according to an embodiment of the present application.
Fig. 2 is an exploded view of the camera module of the first embodiment.
Fig. 3 is a schematic cross-sectional view of an image capturing module according to the first embodiment.
Fig. 4 is a schematic cross-sectional view of another position of the camera module of the first embodiment.
Fig. 5 is a schematic cross-sectional view of an image capturing module according to the second embodiment.
Fig. 6 is a schematic cross-sectional view of another position of the camera module of the second embodiment.
Fig. 7 is a partially exploded view of an image capturing module according to a second embodiment of the present application.
Fig. 8 is a schematic diagram of a partial explosion of an image capturing module according to a second embodiment of the present application.
Fig. 9A and 9B are schematic cross-sectional views for improving the adhesion strength of the soft adhesive.
Description of the main reference signs
Image pickup module 100, 200
Lens assembly 10
Image sensor 30
Driver 50
Infrared filter 20
Soft adhesive layers 40, 40a,40b,40c
Film 42 of soft rubber
Lower cover 60
Bottom 61
Side 63
Accommodation chamber 65
Outer circuit board 70
Long gold thread 81
Sheet metal 80
Void 501
Optical anti-shake coil 51
Focusing carrier 52
Inner circuit board 53
Focusing coil 54
Spring 55
Extension end 550
Optical anti-shake carrier 56
Groove 560
Magnet 57
Suspension wire 58
Short gold wire 82
Through hole 510
Shallow groove 11
Detailed Description
Embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.
Example 1
Referring to fig. 1 and 3 together, an image capturing module 100 according to a first embodiment of the present application includes a lens assembly 10, an image sensor 30 and a driver 50 stacked in order from top to bottom. Referring to fig. 3 in combination, an infrared filter 20 is further disposed on a side of the lens assembly 10 facing the image sensor 30, and the lens assembly 10 is connected to a periphery of the infrared filter 20. The image sensor 30 is located between the infrared filter 20 and the driver 50; the infrared filter 20 is spaced opposite the image sensor 30. The driver 50 carries the image sensor 30 and is movable, thereby driving the image sensor 30 to move. The camera module 100 implements an optical anti-shake function by moving the image sensor 30. However, in the implementation of the optical anti-shake function, the image sensor 30 or the driver 50 is liable to collide due to movement, and thus deformed to fail.
The image capturing module 100 of the present application can effectively prevent the image sensor 30 or the driver 50 from being deformed and disabled due to collision during the implementation of the optical anti-shake function, as shown in fig. 3, a soft adhesive layer 40 is disposed on a surface of the lens assembly 10 facing the image sensor 30; the driver 50 is internally provided with a flexible glue film 42.
In the present application, the lens assembly 10 is considered as a whole, and may actually include a lens (not shown), a carrier (not shown) for carrying and connecting the lens, a carrier (not shown) for connecting the infrared filter 20, and the like.
As shown in fig. 1, the camera module 100 further includes a lower cover 60, the lens assembly 10 is covered on the lower cover 60, and an outer circuit board 70 is further disposed between the lens assembly 10 and the lower cover 60. As shown in fig. 2 and 3, the lower cover 60 includes a bottom portion 61 and a side portion 63 connected to a peripheral edge of the bottom portion 61, and the bottom portion 61 and the side portion 63 cooperate to form a receiving chamber 65. The driver 50 and the image sensor 30 are located in the accommodating chamber 65 and are sequentially stacked on the bottom 61. The lower cover 60 is used to house and protect the driver 50 and the image sensor 30. In this embodiment, the side portion 63 is connected perpendicularly to the bottom portion 61; the bottom 61 is rectangular plate-shaped, the number of the side parts 63 is four, and the four side parts 63 are sequentially connected to form a rectangular frame. The actuator 50 is movable in at least an X direction and a Y direction within the accommodating chamber 65 of the lower cover 60, the X direction being perpendicular to the Y direction. The material of the lower cover 60 may be plastic. The outer circuit board 70 is located between the side 63 and the lens assembly 10. In this embodiment, the outer circuit board 70 is rectangular and surrounds the image sensor 30, so that the image sensor 30 is not blocked, and the light signal is not affected to the image sensor 30. The external circuit board 70 is used for connecting with a control circuit and the like outside the camera module 100 to receive the electric signals and transmit the electric signals to the image sensor 30 and the driver 50.
In this embodiment, the lens assembly 10 is connected to the periphery of the infrared filter 20, and the lens assembly 10 and the infrared filter 20 are adhered by an adhesive (not shown). The outer circuit board 70 is bonded to the lens assembly 10 by an adhesive (not shown) on one side and to the side 63 of the lower cover 60 on the other side. The image sensor 30 is adhered to the driver 50 by an adhesive (not shown). The surface of the actuator 50 adjacent to the lower cover 60 is bonded to the bottom 61 of the lower cover 60 by an adhesive ((not shown).
The image sensor 30 is electrically connected to the outer circuit board 70 through a wire (for example, a long gold wire 81 shown in fig. 2), that is, one end of the long gold wire 81 is connected to the outer circuit board 70, and the other end is connected to the image sensor 30; the long gold wires 81 may be soldered to the outer circuit board 70 and the image sensor 30.
As shown in fig. 2, a plurality of metal sheets 80 are further disposed in the accommodating cavity 65 of the lower cover 60. The driver 50 is electrically connected to the outer circuit board 70 through a metal plate 80. In this embodiment, the number of the metal sheets 80 is four, and each metal sheet 80 is L-shaped and connects the bottom 61 and one side 63 of the lower cover 60, and is disposed adjacent to four corners of the lower cover 60. One end of the metal sheet 80 is electrically connected to the outer circuit board 70, and the other end is electrically connected to the driver 50; the connection modes can be welding connection.
The driver 50 is a Micro-Electro-Mechanical System (MEMS) actuator. MEMS actuators are MEMS devices that convert an electrical signal into a micro-motion or micro-operation. Typical MEMS actuators include micro-motors (not shown), micro-switches (not shown), micro-clamps (not shown), and the like. The working principle of the driver 50 is as follows: the outer circuit board 70 receives an electrical signal from the camera module 100, and the electrical signal is transmitted to the metal sheet 80 through the outer circuit board 70 and then transmitted to the MEMS actuator from the metal sheet 80; the MEMS actuator controls the center of the MEMS actuator to displace in the X direction and/or the Y direction under the condition of electrification through an electrostatic driving principle, so that the image sensor 30 arranged on the MEMS actuator is driven to displace, and optical anti-shake is realized.
The working principle of the image sensor 30 is as follows: the outer circuit board 70 receives an electrical signal from the camera module 100, and the electrical signal is transmitted to the image sensor 30 through the long gold wires 81 connected to the outer circuit board 70; likewise, the electrical signals of the image sensor 30 are also transmitted to the outside circuit board 70 and the camera module 100.
In this embodiment, the external light signal sequentially passes through the lens and the infrared filter 20 and then is transmitted to the image sensor 30, and the driver 50 can always energize the image sensor 30 to work in the process of implementing the optical anti-shake function; the long gold wires 81 are shaken or deformed by the actuation of the driver 50, but a good electrical connection is maintained at all times.
As shown in fig. 2 and 3, the soft adhesive layer 40 is disposed on a surface of the carrier of the lens assembly 10 facing the image sensor 30 (the soft adhesive layer 40 does not cover the lens to avoid affecting the image capturing effect), and the soft adhesive layer 40 is at least located on two opposite sides of the image sensor 30. In this embodiment, the number of the soft adhesive layers 40 is two, and each soft adhesive layer 40 is in a long strip shape. The soft gel layer 40 may be formed on the carrier surface of the lens assembly 10 by two-shot molding. That is, the carrier is preformed or prepared, and then the carrier is placed in a mold, and the soft gel layer 40 is formed on the surface of the carrier by injection molding. The material of the carrier can be metal, plastic or metal-plastic integrated. The soft gel layer 40 and the soft gel film 42 may be made of silica gel, but are not limited to silica gel. When the driver 50 collides with the lens assembly 10 under external disturbance, the soft gel layer 40 can buffer/reduce the collision impact force, so as to provide collision buffer for the driver 50 and the image sensor 30, and avoid structural or functional failure.
As shown in fig. 3 and 4, a void 501 is formed in the actuator 50 (MEMS actuator), and the soft plastic film 42 is formed in the void 501. The soft plastic film 42 inside the MEMS actuator can be formed by means of drop molding or spray coating. The drop molding is to print the material in a liquid or molten state forming the soft plastic film 42 onto the target component (MEMS actuator) by ink jet printing and then solidify under certain conditions, thereby realizing the effect of covering the soft plastic film 42 on the surface of the target component. The spraying is to spray the liquid or molten material forming the soft plastic film 42 onto the target component (MEMS actuator) through a spray gun and then solidify under certain conditions, thereby realizing the effect of covering the soft plastic film 42 on the surface of the target component. When the MEMS actuators collide with each other internally under external disturbance, the flexible glue film 42 can buffer/reduce the impact force, thereby providing collision buffer for the driver 50 and avoiding structural or functional failure.
Example two
Referring to fig. 1 and 5 in combination, an image capturing module 200 according to a second embodiment of the present application is substantially the same as the image capturing module 100 according to the first embodiment, and includes a lens assembly 10, an image sensor 30, and a driver 50 stacked in order from top to bottom, wherein an infrared filter 20 is disposed on a side of the lens assembly 10 facing the image sensor 30, and the lens assembly 10 is connected to a periphery of the infrared filter 20; the image sensor 30 is located between the infrared filter 20 and the driver 50; the infrared filter 20 is spaced opposite the image sensor 30. For clarity of illustration, neither fig. 7 nor fig. 8 show the lens assembly 10 nor the infrared filter 20.
The image capturing module 200 of the second embodiment also includes a lower cover 60, the lens assembly 10 is disposed on the lower cover 60, and an external circuit board 70 is disposed between the lens assembly 10 and the lower cover 60, similar to the image capturing module 100 of the first embodiment. The outer circuit board 70 is frame-shaped to surround the image sensor 30 so as not to obscure the image sensor 30. The lower cover 60 includes a bottom portion 61 and a side portion 63 connected to a peripheral edge of the bottom portion 61, and the bottom portion 61 and the side portion 63 cooperate to form a receiving chamber 65. The driver 50 and the image sensor 30 are positioned in the accommodating chamber 65 and are sequentially stacked on the bottom 61; the lens assembly 10 is disposed at a side of the lower cover 60 having a side 63. In this embodiment, the side portion 63 is connected perpendicularly to the bottom portion 61; the bottom 61 is rectangular plate-shaped, the number of the side parts 63 is four, and the four side parts 63 are sequentially connected to form a rectangular frame. The outer circuit board 70 has a rectangular frame shape and is located between the side portion 63 and the lens assembly 10. The material of the lower cover 60 may be insulating plastic.
Substantially the same as the image capturing module 100 of the first embodiment, a soft adhesive layer 40a is disposed on a surface of the lens assembly 10 of the image capturing module 200 facing the image sensor 30; the soft adhesive layers 40a are at least located at two opposite sides of the image sensor 30, the number of soft adhesive layers 40a is two, and each soft adhesive layer 40a is in a long strip shape. The soft gel layer 40a may be formed by the above-described two-shot molding.
Unlike the camera module 100 of the first embodiment, as shown in fig. 5 and 6, in the camera module 200, a soft adhesive layer 40b is further disposed on a surface of each side 63 of the lower cover 60 facing the driver 50, and each soft adhesive layer 40b is substantially elongated. The soft gel layer 40b may further cushion the impact of the driver 50 and the image sensor 30 against the side 63 of the lower cover 60.
Unlike the camera module 100 of the first embodiment, the driver 50 of the camera module 200 is not a MEMS actuator, and the driver 50 can move in the accommodating cavity 65 of the lower cover 60 in the directions X, Y and Z, and the directions X, Y, Z are perpendicular to each other.
As shown in fig. 5 and 6, the driver 50 includes an optical anti-shake coil 51, a focusing carrier 52, an inner circuit board 53, a focusing coil 54, a plurality of spring pieces 55, an optical anti-shake carrier 56, a magnet 57, and a plurality of suspension wires 58. The surface of the bottom 61 of the lower cover 60 facing the driver 50 is provided with electrical circuitry (not shown). The optical anti-shake coil 51, the focus carrier 52, and the inner circuit board 53 are stacked in this order on the bottom 61. The optical anti-shake coil 51 is electrically connected (e.g., soldered) to the circuit on the bottom 61. A focusing coil 54 is wound outside the focusing carrier 52 and is located between the inner circuit board 53 and the optical anti-shake coil 51. An optical anti-shake carrier 56 is disposed on the optical anti-shake coil 51 and surrounds the focus carrier 52, the optical anti-shake carrier 56 being located between the focus carrier 52 and the side 63 and spaced from both the focus carrier 52 and the side 63. In this embodiment, the optical anti-shake carrier 56 carries a plurality of magnets 57 thereon. Wherein, the optical anti-shake carrier 56 and the focusing carrier 52 are both electrically insulating materials, such as plastics. In the image capturing module 200 of the present embodiment, as shown in fig. 7 and 8, the optical anti-shake carrier 56 is substantially rectangular, and four grooves 560 are formed on the optical anti-shake carrier, each groove 560 is configured with one magnet 57, and the four magnets 57 are respectively located on four sides of the focusing carrier 52, and each magnet 57 is in a rectangular column shape.
One end of each spring plate 55 is connected with the focusing carrier 52, and the other end is connected with the optical anti-shake carrier 56; the focusing carrier 52 and the optical anti-shake carrier 56 are integrally connected through the plurality of elastic pieces 55. Part of the spring 55 is also electrically connected (e.g. by welding) to the focusing coil 54. The connection mode between each spring 55 and the focusing carrier 52 may be riveting, and the connection mode between the spring 55 and the optical anti-shake carrier 56 may be riveting. In this embodiment, the image capturing module 200 has eight elastic pieces 55, which are respectively connected to four corners of the focusing carrier 52 on the upper side far from the bottom 61 and four corners of the focusing carrier 52 on the lower side near to the bottom 61; four spring plates 55 connected with four corners of the focusing carrier 52 far from the bottom 61 are all electrically connected with the focusing coil 54. In this embodiment, each spring 55 has a curved shape.
Each suspension wire 58 is a metal thin rod, which is vertically disposed on the bottom 61, and one end of each suspension wire 58 is electrically connected (e.g. welded) to the circuit of the bottom 61, and the other end is electrically connected to a spring 55 electrically connected to the focusing coil 54. As shown in fig. 7, specifically, the spring plate 55 located on the upper side of the focusing carrier 52 is provided with an extension end 550, and the extension end 550 is welded to the suspension wire 58. In this embodiment, the camera module 200 is provided with four suspension wires 58, which are respectively located at the four corners of the lower cover 60. Each suspension wire 58 is electrically connected to only the spring plate 55 located on the upper side of the focusing carrier 52 away from the bottom 61.
The surface of the bottom 61 facing the drive 50 is provided with a soft gel layer 40c. As shown in fig. 7 and 8, the optical anti-shake coil 51 is provided with a through hole 510 for the soft adhesive layer 40c on the bottom 61 to pass through. The soft gel layer 40c is located between the bottom portion 61 and the focus carrier 52. The soft gel layer 40c may buffer the collision between the bottom 61 of the lower cover 60 and the focus carrier 52. In this embodiment, the number of the soft adhesive layers 40c is four, and the soft adhesive layers 40c are arranged at intervals on the bottom 61, and each soft adhesive layer 40c is circular. As shown in fig. 5, the surfaces of the optical anti-shake carrier 56 and the magnet 57 facing the focusing carrier 52 are provided with a soft plastic film 42, and the soft plastic film 42 may be formed by the above-mentioned plastic dropping/spraying method. The flexible film 42 may cushion interfering impacts inside the driver 50.
In this embodiment, the lens assembly 10 is connected to the periphery of the infrared filter 20, and the lens assembly 10 and the infrared filter 20 are adhered by an adhesive (not shown). The outer circuit board 70 is bonded to the lens assembly 10 by an adhesive (not shown) on one side and to the side 63 of the lower cover 60 on the other side. The image sensor 30 is adhered to the inner circuit board 53 of the driver 50 by an adhesive (not shown). The inner circuit board 53 is bonded to the focus carrier 52 by an adhesive (not shown). The focusing coil 54 is wound around the focusing carrier 52 and then bonded by an adhesive (not shown). The optical anti-shake support 56 and the magnet 57 are bonded by an adhesive (not shown). The optical anti-shake coil 51 is adhered to the bottom 61 of the lower cover 60 by an adhesive (not shown).
The image sensor 30 is electrically connected to the inner circuit board 53 through a wire (for example, a short gold wire 82 shown in fig. 6 and 7), that is, one end of the short gold wire 82 is connected to the inner circuit board 53, and the other end is connected to the image sensor 30; the short gold wires 82 may be soldered to the outer circuit board 70 and the image sensor 30. The inner circuit board 53 is electrically connected to the outer circuit board 70 through a wire (for example, a long gold wire 81 shown in fig. 6 and 7), that is, one end of the long gold wire 81 is connected to the outer circuit board 70, and the other end is connected to the inner circuit board 53; the long gold wires 81 may be soldered to the outer circuit board 70 and the inner circuit board 53.
As shown in fig. 7 and 8, the lower cover 60 is further provided with a plurality of metal sheets 80. The circuit of the lower cover 60 is electrically connected to the outer circuit board 70 through a metal sheet 80. In this embodiment, the number of the metal sheets 80 is four, and each metal sheet 80 is L-shaped and connects the bottom 61 and one side 63 of the lower cover 60, and is disposed adjacent to four corners of the lower cover 60. One end of the metal sheet 80 is electrically connected with the outer circuit board 70, and the other end is electrically connected with the circuit of the lower cover 60; the connection modes can be welding connection.
The working principle of focusing of the driver 50 is as follows: the outer circuit board 70 receives an electric signal from the camera module 200, the electric signal is sequentially transmitted to the circuit of the lower cover 60 through the outer circuit board 70 and the metal sheet 80, then transmitted to the suspension wire 58 through the welding point of the circuit of the lower cover 60 and the suspension wire 58, then transmitted to the elastic sheet 55 through the welding point of the suspension wire 58 and the elastic sheet 55, and then transmitted to the focusing coil 54 through the welding point of the elastic sheet 55 and the focusing coil 54; after the focusing coil 54 is electrified, a Z-direction electromagnetic force is generated under the action of the magnetic field of the magnet 57, so that the focusing coil 54 carries the focusing carrier 52, the inner circuit board 53 and the image sensor 30 to realize a focusing function of Z-direction action.
The working principle of the optical anti-shake of the driver 50 is as follows: the outer circuit board 70 receives an electric signal from the camera module 200, the electric signal is transmitted to the circuit of the lower cover 60 through the outer circuit board 70 and the metal sheet 80, and then transmitted to the optical anti-shake coil 51 through the welding point between the circuit of the lower cover 60 and the optical anti-shake coil 51; after the optical anti-shake coil 51 is energized, electromagnetic forces in the X and Y directions are generated under the magnetic field of the magnet 57, so that the magnet 57 carries the optical anti-shake carrier 56, the spring plate 55, the focusing carrier 52, the focusing coil 54, the inner circuit board 53 and the image sensor 30 to realize the optical anti-shake function of the X and Y directions.
The image sensor 30 works according to the following principle: the outer circuit board 70 receives an electrical signal from the camera module 200, the electrical signal is transmitted to the inner circuit board 53 through the long gold wires 81 welded with the outer circuit board 70, and then is transmitted to the image sensor 30 through the short gold wires 82 welded with the inner circuit board 53; likewise, the electrical signals of the image sensor 30 are also transmitted to the outside circuit board 70 and the camera module.
The external light signal is transmitted to the image sensor 30 after passing through the lens and the infrared filter 20, and the image sensor 30 can be always electrified to work in the process of realizing focusing and optical anti-shake functions by the image sensor 30 driver 50; the long gold wires 81 are shaken or deformed by the operation of the driver 50, but a good electrical connection is always maintained.
In this embodiment, the surface of the lens assembly 10 facing the image sensor 30 is secondarily molded with an elongated soft adhesive layer 40a, the surface of each side 63 of the lower cover 60 is molded with an elongated soft adhesive layer 40b, the bottom 61 of the lower cover 60 is molded with a circular soft adhesive layer 40c, and when the driver 50 collides with the lower cover 60 or the lens assembly 10 under external disturbance, the soft adhesive layers 40a,40b,40c can buffer/reduce the collision impact force, thereby providing collision buffering for the driver 50 and the image sensor 30, and avoiding structural or functional failure. In addition, the surface of the optical anti-shake carrier 56 facing the focusing carrier 52 is formed with the soft plastic film 42 by means of plastic dropping/spraying or the like, and when the optical anti-shake carrier 56 of the driver 50 and the focusing carrier 52 collide with each other under external disturbance, the soft plastic film 42 can buffer/reduce the impact force, thereby bringing collision buffer to the driver 50 and the image sensor 30, and avoiding structural or functional failure.
As shown in fig. 5, the area of the soft adhesive layer 40a disposed on the surface of the lens assembly 10 is provided with a shallow groove 11, and the area of the soft adhesive layer 40b disposed on the surface of the side 63 is also provided with a shallow groove 11, so that when the soft adhesive layer is formed by injection molding, the soft adhesive layer forming material can enter the shallow groove 11, and the bonding strength between the soft adhesive layer 40 and the attaching surface can be effectively improved. It is to be understood that the manner of improving the adhesive strength is not limited thereto, and as shown in fig. 9A and 9B, the surface provided with the soft adhesive layer 40 and the soft adhesive film 42 may be provided with perforations or roughened.
The application also provides an electronic device (not shown) applying the camera module 100 or 200, and the electronic device can be a mobile phone, a notebook computer, a tablet personal computer and the like.
It should be noted that the above is only a specific embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes or substitutions are covered by the scope of the present application; the embodiments of the present application and features in the embodiments may be combined with each other without conflict. Therefore, the protection scope of the application is subject to the protection scope of the claims.
Claims (11)
1. The camera module is characterized by comprising a lens assembly, an image sensor and a driver which are sequentially stacked from top to bottom, wherein the driver carries the image sensor and is movable relative to the lens assembly so as to drive the image sensor to move,
the camera module further comprises a lower cover, wherein the lower cover comprises a bottom and a side part connected with the periphery of the bottom, the bottom and the side part are matched to form a containing cavity, the driver and the image sensor are positioned in the containing cavity, and the driver is positioned between the bottom and the image sensor; the lens component is arranged on the lower cover and is positioned on one side of the lower cover with the side part; an outer circuit board is arranged between the lens assembly and the side part, surrounds the image sensor so as not to influence the transmission of optical signals into the image sensor, and is electrically connected with the image sensor;
the lens assembly is provided with a soft adhesive layer towards the surface of the image sensor, the soft adhesive layer is positioned on one side of the outer circuit board, which is close to the image sensor, the soft adhesive layer is positioned on at least two opposite sides of the image sensor, the projection of the soft adhesive layer along the stacking direction is positioned on the side of the image sensor and on the upper surface of the driver, and the soft adhesive layer is used for buffering collision between the driver and the lens assembly and between the soft adhesive layer and the side part caused by movement of the driver and the image sensor;
a soft plastic film is arranged in the driver, and the soft plastic film is formed by plastic dropping or spraying; the soft plastic film is used for buffering collision between internal structures of the driver caused by movement of the driver.
2. The camera module of claim 1, wherein the image sensor is electrically connected to the external circuit board by wires.
3. The camera module of claim 1, wherein a metal sheet is further disposed in the lower cover, the driver is electrically connected to the outer circuit board through the metal sheet, one end of the metal sheet is electrically connected to the outer circuit board, and the other end of the metal sheet is electrically connected to the driver.
4. The camera module of claim 1, wherein the side facing the driver is provided with an additional soft gel layer on the surface.
5. The camera module according to claim 1, wherein the driver includes an optical anti-shake coil, a focus carrier, and an inner circuit board sequentially stacked on the bottom; the inner side circuit board is electrically connected with the outer side circuit board through a wire; the image sensor is electrically connected with the inner circuit board through a wire; the driver also comprises a focusing coil, an optical anti-shake carrier and a magnet, wherein the focusing coil is wound outside the focusing carrier and is positioned between the inner circuit board and the optical anti-shake coil; the optical anti-shake carrier is arranged on the optical anti-shake coil and is positioned between the focusing carrier and the side part; the magnet is carried on the optical anti-shake carrier; the optical anti-shake carrier and the focusing carrier are both made of electrically insulating materials.
6. The camera module of claim 5, wherein the soft plastic film is disposed on surfaces of the optical anti-shake carrier and the magnet facing the focusing carrier.
7. The camera module of claim 5, wherein the surface of the bottom facing the driver is provided with an additional soft adhesive layer, and the optical anti-shake coil is provided with a through hole for the additional soft adhesive layer on the bottom to pass through; the further soft gel layer is located between the bottom and the focusing carrier.
8. The camera module according to claim 5, 6 or 7, wherein the driver further comprises a plurality of elastic pieces, one end of each elastic piece is fixedly connected with the focusing carrier, and the other end is fixedly connected with the optical anti-shake carrier, so that the focusing carrier and the optical anti-shake carrier are integrally connected through the plurality of elastic pieces; and part of the elastic sheets are electrically connected with the focusing coil.
9. The camera module according to claim 8, wherein a circuit is disposed on a surface of the bottom facing the driver, the optical anti-shake coil is electrically connected to the circuit, a metal sheet is further disposed in the lower cover, the circuit is electrically connected to the outer circuit board through the metal sheet, one end of the metal sheet is electrically connected to the outer circuit board, and the other end of the metal sheet is electrically connected to the circuit; the driver also comprises a plurality of suspension wires, each suspension wire is a metal thin rod, the metal thin rod is vertically arranged on the bottom, one end of each suspension wire is electrically connected with the circuit, and the other end of each suspension wire is electrically connected with one elastic sheet of the focusing coil.
10. The camera module of claim 1, wherein a side of the lens assembly facing the image sensor is further provided with an infrared filter, the image sensor being located between the infrared filter and the driver.
11. An electronic device comprising the camera module of any one of claims 1 to 10.
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| CN202011340610.8A CN114553985B (en) | 2020-11-25 | 2020-11-25 | Camera module and electronic device using same |
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| CN202011340610.8A CN114553985B (en) | 2020-11-25 | 2020-11-25 | Camera module and electronic device using same |
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| CN114553985A (en) | 2022-05-27 |
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