JP2017188528A5 - - Google Patents

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Publication number
JP2017188528A5
JP2017188528A5 JP2016075046A JP2016075046A JP2017188528A5 JP 2017188528 A5 JP2017188528 A5 JP 2017188528A5 JP 2016075046 A JP2016075046 A JP 2016075046A JP 2016075046 A JP2016075046 A JP 2016075046A JP 2017188528 A5 JP2017188528 A5 JP 2017188528A5
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JP
Japan
Prior art keywords
plate
electrode member
substrate
conductor pattern
bonding region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016075046A
Other languages
English (en)
Japanese (ja)
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JP2017188528A (ja
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Publication date
Application filed filed Critical
Priority to JP2016075046A priority Critical patent/JP2017188528A/ja
Priority claimed from JP2016075046A external-priority patent/JP2017188528A/ja
Publication of JP2017188528A publication Critical patent/JP2017188528A/ja
Publication of JP2017188528A5 publication Critical patent/JP2017188528A5/ja
Pending legal-status Critical Current

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JP2016075046A 2016-04-04 2016-04-04 半導体装置 Pending JP2017188528A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016075046A JP2017188528A (ja) 2016-04-04 2016-04-04 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016075046A JP2017188528A (ja) 2016-04-04 2016-04-04 半導体装置

Publications (2)

Publication Number Publication Date
JP2017188528A JP2017188528A (ja) 2017-10-12
JP2017188528A5 true JP2017188528A5 (cg-RX-API-DMAC10.html) 2019-05-09

Family

ID=60045716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016075046A Pending JP2017188528A (ja) 2016-04-04 2016-04-04 半導体装置

Country Status (1)

Country Link
JP (1) JP2017188528A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021100199A1 (ja) * 2019-11-22 2021-05-27 三菱電機株式会社 半導体装置およびその製造方法ならびに電力変換装置
JP7438071B2 (ja) * 2020-09-15 2024-02-26 株式会社東芝 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156560U (cg-RX-API-DMAC10.html) * 1988-04-21 1989-10-27
JPH05315490A (ja) * 1992-05-07 1993-11-26 Fuji Electric Co Ltd 半導体素子
JP2007096004A (ja) * 2005-09-29 2007-04-12 Toshiba Corp 半導体装置
JPWO2015107871A1 (ja) * 2014-01-15 2017-03-23 パナソニックＩｐマネジメント株式会社 半導体装置

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