JP2017187601A - Manufacturing method of screen mask - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for effectively preventing dropout of a mask forming material from a screen mask to enhance durability.SOLUTION: There is provided a manufacturing method of a screen mask for screen printing including radiating an exposure light with a pattern shape to a photosensitive material layer hold by a screen mesh to practically cure the photosensitive material layer depending on irradiation pattern of the exposure light and then removing an uncured part of the photosensitive material, the exposure light is directly radiated to a both surfaces of the photosensitive material layer hold by the screen mesh.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a screen mask.

  Conventionally, when producing a screen mask for screen printing, a positive film or a glass mask having a predetermined pattern is used as an original, and this is brought into close contact with a photosensitive material layer held by a screen mesh and then subjected to batch exposure. Was common.

  However, in this method, problems such as poor adhesion between the photosensitive material layer and the original plate and pinching of foreign substances may occur, and deterioration of the original plate due to the close contact of the original plate is unavoidable, resulting in a replacement cost. There were problems such as occurrence.

  Therefore, a method called direct drawing exposure is attracting attention. This is a method of obtaining a screen mask by drawing directly on a photosensitive material layer using a MEMS called a polygon mirror or DMD based on the original data, and is partially applied to printed wiring boards. ing.

  In this direct drawing exposure method, since there is no physical contact between the photosensitive material layer and the original plate, problems such as poor adhesion between the photosensitive material layer and the original plate and pinching of foreign matter do not occur. In addition, since the mask pattern can be created and stored as electronic data, it can be said to be an attractive method in that the cost for creating and storing the original plate can be reduced.

  When the screen mask is exposed by these direct drawing exposure methods, it is possible to efficiently form a high-definition image as compared with the contact exposure method using a conventional original plate.

JP 2016-17875 A

  However, it has been found that the screen mask produced by employing the direct drawing exposure method has a problem that the mask forming material is easily dropped from the screen mask. This loss of mask forming material often occurs during the process of cleaning the screen during printing. For this reason, screen masks using the direct drawing exposure method have more mask material dropping than conventional screen masks that expose the photosensitive material layer and the original plate in close contact with each other. And print quality of screen printing were likely to deteriorate.

The present invention is intended to solve the above problems.
Therefore, the method for manufacturing a screen mask according to the present invention irradiates the photosensitive material layer according to the exposure light irradiation pattern by irradiating the photosensitive material layer held on the screen mesh with the exposure light beam in a pattern. A method of manufacturing a mask for screen printing comprising partially curing and then removing an uncured portion of the photosensitive material layer, wherein the photosensitive material held on the screen mesh The both sides of the material layer are directly irradiated with the exposure light beam.

  In such a method for producing a screen mask according to the present invention, as a preferred embodiment, the first surface of the photosensitive material layer held by the screen mesh is irradiated with a pattern of exposure light, and then the screen mesh is applied to the screen mesh. What irradiates the 2nd surface of the photosensitive material layer hold | maintained with the exposure light beam in pattern shape is included.

  Such a method for producing a screen mask according to the present invention is preferably held by the screen mesh before irradiating the second surface of the photosensitive material layer held by the screen mesh with exposure light. The amount of displacement of the photosensitive material layer is determined, and based on the determination result, the exposure light irradiation pattern to the second surface of the photosensitive material layer held by the screen mesh is controlled .

  In such a method for producing a screen mask according to the present invention, as a preferred embodiment, the displacement amount of the photosensitive material layer held on the screen mesh is determined by the first surface and the second surface of the screen mesh. And those that are performed using alignment marks that can be visually recognized.

In such a method for producing a screen mask according to the present invention, as a preferred embodiment, the exposure light irradiation amount on the first surface of the photosensitive material layer held on the screen mesh is 10 to 90 of the total irradiation amount. % (Where the total irradiation amount is the sum of the irradiation amount to the first surface and the irradiation amount to the second surface (unit: mJ / cm ² )).

  According to the present invention, the mask forming material can be effectively prevented from falling off the screen mask, and the durability of the screen mask can be improved.

  And according to this invention, the screen mask by which the displacement (for example, the dimensional change by a shrinkage | contraction, distortion, etc.) was suppressed with higher precision can be provided.

  Therefore, according to the present invention, it is possible to obtain a screen mask capable of stably performing high-accuracy screen printing over a long period of time.

The figure which shows the outline | summary of the preferable screen mask by this invention, and its manufacturing method. The figure which shows the outline | summary of a taper phenomenon. The figure which shows the outline | summary of the manufacturing method of the preferable screen mask by this invention. The figure which shows the outline | summary of the manufacturing method of the preferable screen mask by this invention. The figure which shows the outline | summary of the manufacturing method of the preferable screen mask by this invention. The figure which shows the outline | summary of the determination method of the displacement amount of the photosensitive material layer using an alignment mark. The figure which shows the outline | summary of the criterion of a matching precision. The figure which shows the outline | summary of the criterion of a matching precision.

<Screen mask manufacturing method>
The method of manufacturing a screen mask according to the present invention irradiates the photosensitive material layer held in a screen mesh with exposure light in a pattern, so that the photosensitive material layer is partially formed according to the exposure light irradiation pattern. A method of manufacturing a mask for screen printing comprising: curing the composition and then removing the uncured portion of the photosensitive material layer comprising:
The exposure light beam is directly irradiated on both surfaces of the photosensitive material layer held on the screen mesh.

The present invention will be described below with reference to the drawings as necessary.
1A to 1D show an outline of a preferred screen mask 1 according to the present invention and a method for manufacturing the same.

  As the screen mesh 2, those conventionally used for screen printing can also be used in the present invention. Preferred screen meshes 2 in the present invention include, for example, resin screen meshes such as nylon and polyester screen meshes, metal screen meshes such as stainless steel and tungsten screen meshes, and other screen meshes such as silk. A screen or the like can be used. Further, a combination screen mesh (FIG. 3) using different types of screen meshes at the outer peripheral portion and the inner peripheral portion of the screen mesh can also be used.

  The line mesh, opening, aperture ratio, thickness, etc. of the screen mesh 2 can be appropriately determined in consideration of, for example, the printing object, printing pattern, printing accuracy, durability, and the like.

  The photosensitive material layer 3 can be formed of a photosensitive material that has been conventionally used for forming a screen printing plate, particularly, a photosensitive material that can be applied to a direct drawing method.

  The photosensitive material layer can be held on the screen mesh 2 by, for example, applying or transferring the photosensitive material to the screen mesh 2. In the present invention, a photosensitive material layer can be formed on one side of the screen mesh 2 by applying or transferring the photosensitive material from one side of the screen mesh 2, and the photosensitive material is applied to both sides of the screen mesh 2. By coating or transferring, a photosensitive material layer can be formed on both surfaces of the screen mesh 2.

  The thickness of the photosensitive material layer 3 on the screen mesh 2 can be appropriately determined according to, for example, a printing target, a printing pattern, printing accuracy, durability, and the like.

  The thickness of the photosensitive material layer on the screen mesh 2 can be made different between the first surface 31 side and the second surface 32 side of the photosensitive material layer 3. In the present specification, the first surface 31 of the photosensitive material layer 3 refers to a surface that comes into contact with an object to be printed during screen printing, and the second surface 32 of the photosensitive material layer 3 refers to The surface on which the squeegee slides during screen printing. Usually, the thickness of the photosensitive material layer is preferably thicker on the first surface 31 side than on the second surface 32 side. Therefore, also in the present invention, the thickness of the photosensitive material layer is The one surface 31 side is thicker than the second surface 32 side.

  In the screen mask 1 of the present invention, the thickness of the photosensitive material layer on the first surface 31 side before exposure (that is, the thickness of the photosensitive material layer on the screen mesh 2) is 1 to 50 μm, and the second The thickness of the photosensitive material layer on the surface 32 side is preferably 1 to 10 μm. Among them, the thickness of the photosensitive material layer on the first surface 31 side is 5 to 20 μm, and the second surface It is particularly preferable that the photosensitive material layer on the 32 side has a thickness of 1 to 3 μm.

  In the method for producing a screen mask of the present invention, the photosensitive material layer 3 held on the screen mesh 2 is irradiated with the exposure light beam R in a pattern, whereby the photosensitive material layer 3 is irradiated according to the irradiation pattern of the exposure light beam R. This is the same as the conventional method of manufacturing a screen mask in that the photosensitive material is partially cured and the photosensitive material in the portion not exposed to the exposure light beam R is removed by subsequent development processing. However, the method of manufacturing the screen mask 1 according to the present invention is such that the both sides of the photosensitive material layer held on the screen mesh 2 (that is, the first side 31 and the second side of the photosensitive material layer 3 held on the screen mesh 2). This is distinguishable from the conventional method of manufacturing a screen mask in that it is one of the main features to directly irradiate the exposure light beam R onto both sides of the surface 32 of the screen.

  Here, “directly irradiating exposure light” means “irradiating exposure light without passing through an original (photomask)”. Accordingly, the direct drawing exposure method (for example, the exposure method using a direct drawing machine) that irradiates the exposure light beam in a pattern without using an original (photomask) that partially shields the exposure light beam is the “exposure light beam” of the present invention. Directly irradiated "method.

  In the method for producing a screen mask according to the present invention, both exposure light beams (ie, the first surface 31 and the second surface 32) of the photosensitive material layer 3 held on the screen mesh 2 are directly irradiated with exposure light. Although a predetermined effect can be obtained, preferably, the first surface 31 of the photosensitive material layer 3 is irradiated with the exposure light beam R in a pattern (FIG. 1B), and then the first layer 31 of the photosensitive material layer 3 is irradiated. It is preferable to irradiate the second surface 32 with the exposure light beam R in a pattern (FIG. 1C). A general direct drawing machine can be used, and this makes it possible to easily form a finer pattern and to more effectively prevent the mask forming material from falling off the screen mask 1. Because.

  In addition, when a general photosensitive material is cured by exposure to exposure light, it may be observed that the volume of the photosensitive material decreases and the photosensitive material layer contracts accordingly. Therefore, when exposure light is irradiated in a pattern on the photosensitive material layer, the shrinkage ratio and shrinkage direction of the photosensitive material layer vary depending on the placement pattern and placement ratio of the photosensitive material layer on the screen mesh. As a result, displacement (for example, dimensional change or distortion due to shrinkage) may occur in the screen mask.

  Although the tendency of volume reduction (shrinkage) due to curing of the photosensitive material is common in the present invention, in the method for producing a screen mask of the present invention in which exposure light is directly irradiated on both surfaces of the photosensitive material layer, the photosensitive material layer Compared with the conventional method of irradiating only one surface with exposure light, there is no shielding of the exposure light by the screen mesh 2, and both the first surface 31 and the second surface 32 of the photosensitive material layer 3 are covered. Since the direct exposure is performed, the mask material is prevented from falling off the screen mask 1 on both the first surface 31 and the second surface 32.

  In the method for manufacturing a screen mask according to the present invention, the exposure light beam is not shielded by the screen mesh 2 as compared with the conventional method in which the exposure light beam is irradiated only on one surface of the photosensitive material layer. The total amount can be reduced. Therefore, in the method for manufacturing a screen mask according to the present invention, the amount of exposure can be reduced as compared with the conventional method, so that the amount of displacement (for example, dimensional change or distortion due to shrinkage) of the screen mask 1 itself is reduced. Therefore, according to the invention of the present application, it is possible to provide a screen mask in which displacement (for example, dimensional change or distortion due to contraction) of the screen mask 1 is suppressed with higher accuracy.

  In particular, in the method for producing a screen mask according to the present invention, the irradiation amount on the first surface 31 can be reduced as compared with the conventional method in which the exposure light beam is irradiated only on one surface of the photosensitive material layer. Therefore, the displacement amount of the screen mask 1 itself is remarkably reduced, and in addition, since the exposure light beam is also irradiated onto the second surface 32, the displacement amount between the first surface 31 and the second surface 32 is balanced. Is planned.

  In general, when producing a screen mask by partially curing the photosensitive material layer according to the exposure light irradiation pattern and removing the photosensitive material in the non-irradiated portion by subsequent development processing. As shown in FIG. 2A, a so-called taper phenomenon occurs in which the opening width L2 on the non-irradiation surface side is smaller than the opening width L1 on the irradiation surface side of the exposure layer of the photosensitive material layer 3. There is a case. In the conventional method of irradiating only one side of the photosensitive material layer with exposure light, this taper phenomenon may be noticeably observed, but in the method for producing a screen mask of the present invention, as described above, Since the total exposure amount is low and the exposure light beam is irradiated on both surfaces, the difference between the opening width L1 and the opening width L2 is remarkably small (or substantially) as shown in FIG. To eliminate the difference).

The irradiation amount of the exposure light beam on the first surface 31 of the photosensitive material layer 3 held on the screen mesh 2 is preferably 10 to 90% of the total irradiation amount, particularly preferably 30 to 50% of the total irradiation amount, (Here, the total irradiation amount is the sum of the irradiation amount on the first surface and the irradiation amount on the second surface (unit: mJ / cm ² )). Thus, by setting the irradiation ratio to the first surface 31 and the second surface 32, the effect of the present invention by irradiating the both surfaces of the photosensitive material layer 3 with the exposure light beam can be achieved more effectively. be able to.

  Then, the screen mask 1 by this invention can be manufactured by removing the uncured part of the photosensitive material layer 3 (FIG. 1 (d)).

  As described above, according to the method for manufacturing a screen mask of the present invention, it is possible to form a finer pattern and to effectively prevent the mask forming material from falling off the screen mask.

  As shown in FIG. 1C, it is preferable that the irradiation of the exposure light beam on the second surface 32 has a smaller irradiation area than the irradiation of the exposure light beam on the first surface 31. Even when the photosensitive material layer 3 is displaced by the irradiation of the exposure light beam on the first surface 31 (or when a displacement more than expected is temporarily generated), the exposure accuracy on the second surface 32 is so strict. Even if it is not controlled, it is avoided that the opening width L2 is narrowed due to the positional deviation between the opening on the first surface 31 side and the opening on the first surface 32 side, and the printing accuracy at the time of screen printing is not affected. Because it is.

  In a more preferable method for manufacturing a screen mask according to the present invention, before the exposure light R is irradiated onto the second surface 32 of the photosensitive material layer 3 held by the screen mesh 2 (FIG. 1 (C)), the above screen is used. The amount of displacement of the photosensitive material layer 3 held on the mesh 2 is determined, and based on the determination result, the exposure light beam is irradiated onto the second surface 32 of the photosensitive material layer 3 held on the screen mesh 2. It is preferable to control (FIG. 1C).

  In this way, mainly, the displacement amount of the photosensitive material layer 3 caused by the exposure of the exposure light to the first surface 31 is determined, and the exposure of the exposure light to the second surface 32 is performed based on the determination result. By controlling, an exposure light beam can be irradiated to an accurate position of the second surface 32. Thus, a finer pattern can be easily formed, and the mask forming material can be more effectively prevented from dropping from the screen mask 1.

  The amount of displacement of the photosensitive material layer 3 caused by the exposure of the exposure light to the first surface 31 (for example, the degree of positional change due to dimensional change or distortion) is determined by the photosensitive material layer before the exposure light irradiation. This can be done by comparing the size, shape, and the like of (FIG. 1 (a)) with the photosensitive material layer (FIG. 1 (b)) after exposure light exposure.

  Then, as shown in FIGS. 3 and 4, the displacement amount is preferably determined using alignment marks 5 that are visible from the first and second surfaces of the screen mesh 2. it can.

  For example, the displacement of the photosensitive material layer 3 due to a change in the distance or positional relationship between two or more alignment marks selected from the group of alignment marks 5 (FIG. 6 (A) or (B)). By determining the amount and controlling the exposure light beam irradiation to the second surface 32 based on the determination result, the exposure light beam is irradiated to an appropriate position on the second surface 32 (FIG. 1C). be able to. Thus, a fine pattern can be easily formed at a target position, and the mask forming material can be more effectively prevented from dropping from the screen mask 1. For the sake of explanation, in FIG. 6, the displacement amount is shown enlarged from the actual level.

The location where the alignment mark 5 is formed, the number thereof, and the like can be appropriately determined.
The method for forming the alignment mark 5 is not particularly limited. In the present invention, it is preferable to form the alignment mark 5 by, for example, a printing method such as pad printing or screen printing, or laser marking.

  The test of an Example and a comparative example was done by the following specifications. The plate making method is manufactured by a known method, and is not limited to this.

  As shown in FIG. 3, a polyester mesh made of 200 mesh with a yarn diameter of 54 μm, which is the outer collar 22, is attached to the frame 6 with a tension of 0.8 mm. The tension was measured with STG75B manufactured by Protech. At the center, the inner collar 21 cut to a predetermined size was combined and bonded using an ultraviolet curable adhesive, and the inner side polyester mesh was cut and removed to form a combination mask. Thereafter, an alignment mark 5 having a diameter of 3 mm was formed by pad printing using an immortal ink at the position shown in FIG.

  Using the inner shell shown in Table 1 below, the direct method film (IC-10000 made by Murakami) is directly applied to the predetermined thickness shown in Table 1 (SP-9902 made by Murakami). The plate specifications 1 to 4 were prepared by pasting and drying.

<Example 1>
Using the plate specification 1, each of the 16 regions (ie, regions A1 to A4 and B1 to B4) divided as shown in FIG. 4 is directly exposed to an exposure tool (manufactured by Adtech Engineering Co., Ltd., IP-3650HH). Then, direct exposure was performed (exposure dose: 1300 mJ / cm ² ).
At this time, the exposure pattern for each region of the first surface 31 is as follows.
Area A1: 30 straight lines with a width of 20 μm and a pitch of 1 mm in the X-axis direction Area A2: 30 straight lines with a width of 30 μm and a pitch of 1 mm in the X-axis area A3: 30 straight lines with a width of 40 μm and a pitch of 1 mm in the X-axis direction Area A4: 30 straight lines with a width of 50 μm and a pitch of 1 mm in the X-axis direction Area B1: 30 straight lines with a width of 20 μm and a pitch of 1 mm in the Y-axis area B2: A straight line with a width of 30 μm and a pitch of 1 mm in the Y-axis direction 30 areas B3: 30 straight lines with a width of 40 μm and a pitch of 1 mm in the Y-axis direction Area B4: 30 straight lines with a width of 50 μm and a pitch of 1 mm in the Y-axis direction

  After the exposure of the surface of the photosensitive material layer (first surface 31), the screen is reversed, and the position of the alignment mark 5 is changed by the camera installed in the exposure machine (ie, mainly the amount of displacement of that position (ie, mainly). The displacement amount of the position due to the shrinkage of the photosensitive material layer due to exposure on the first surface was determined.

  The same direct drawing exposure machine (manufactured by Adtech Engineering Co., Ltd., IP-3650HH) is used for the back surface (second surface 32) of the photosensitive material layer, and the exposure light irradiation pattern is controlled based on the above determination result. Drawing exposure was carried out.

Specifically, as illustrated in FIG. 5, direct drawing exposure on the back surface (second surface 32) of the photosensitive material layer is performed by exposing the surface exposed on the surface (first surface 31) of the photosensitive material layer. Based on the above determination result, direct exposure was performed while controlling the position and pitch so that the line thicker by 40 μm than the straight line was overlapped with the previous straight line (exposure light dose: 400 mJ / cm ² ). The exposure dose of the exposure light to the first surface was 76.5% of the total dose.

<Example 2>
Using plate specification 2, the exposure amount was the same as in Example 1 except that the first surface was 1000 mJ / cm ² and the second surface was 300 mJ / cm ² .

<Example 3>
Using the plate specification 3, the exposure amount first surface is 1200 mJ / cm ^2, except that the second surface and 500 mJ / cm ² the same as in Example 1.

<Example 4>
Using the plate specification 4, the exposure amount first surface is 900 mJ / cm ^2, except that the second surface and 400 mJ / cm ² the same as in Example 1.

<Comparative Example 1>
The same as Example 1 except that the plate specification 1 was used and the exposure was set to 1300 mJ / cm ² only on the first surface.

<Comparative example 2>
Using the plate specification 1 and FIG. 4 output as a positive film in advance and the one with the line width corrected for the second surface exposure, exposure of the first and second surfaces with a commonly used exposure machine Went. The alignment at this time was performed by visual inspection of the operator.

<Comparative Example 3>
Using plate specifications 2 and FIG. 4 output as a positive film in advance, and the one with the line width corrected for the second surface exposure, exposure of the first and second surfaces with a commonly used exposure machine Went. The alignment at this time was performed by visual inspection of the operator.

<Comparative Example 4>
Using plate specification 1, only the first surface was set to 1500 mJ / cm ² with an exposure machine generally used with reference to FIG.

<Evaluation method>
The following evaluation was performed about Examples 1-4 and Comparative Examples 1-4. The results are as shown in Table 2.
(1) Line width measurement For the regions A3 and B3 having a design value of 40 μm, with the three-dimensional measuring machine ZIP300 (OGP), the first surface is the upper side, and the line width on the outermost surface side with incident light is “opening” The narrowest part of the transmitted light was measured as the “narrowest part”.
(2) Peel resistance In the regions A4 and B4 having a design value of 50 μm, a cellophane tape (manufactured by Nichiban Co., Ltd.) having a tape width of 19 mm was brought into close contact with the load by applying a load of 500 g / cm ² . Then, 90 degree peeling was performed and it evaluated from the peeling condition of the mask formation material.
(3) Alignment accuracy With respect to the plate subjected to the exposure from the second surface, the images obtained by the exposure from the first surface and the exposure from the second surface were observed visually.
The linear pattern formed on the back surface (second surface) with respect to the linear pattern formed on the front surface (first surface) is arranged almost at the center (see FIG. 7).
The linear pattern formed on the back surface (second surface) with respect to the linear pattern formed on the front surface (first surface) has a portion that is shifted by 10 μm or more and less than 20 μm.
The linear pattern formed on the back surface (second surface) with respect to the linear pattern formed on the front surface (first surface) is Δ,
In contrast to the linear pattern formed on the front surface (first surface), a portion (see FIG. 8) that is obstructed by the linear pattern formed on the back surface (second surface) is indicated as x. .

The exposure pattern for each region (first surface) shown in FIG. 4 is as follows.
Area A1: 30 straight lines with a width of 20 μm and a pitch of 1 mm in the X-axis direction Area A2: 30 straight lines with a width of 30 μm and a pitch of 1 mm in the X-axis area A3: 30 straight lines with a width of 40 μm and a pitch of 1 mm in the X-axis direction Area A4: 30 straight lines with a width of 50 μm and a pitch of 1 mm in the X-axis direction Area B1: 30 straight lines with a width of 20 μm and a pitch of 1 mm in the Y-axis area B2: A straight line with a width of 30 μm and a pitch of 1 mm in the Y-axis direction 30 areas B3: 30 straight lines with a width of 40 μm and a pitch of 1 mm in the Y-axis direction Area B4: 30 straight lines with a width of 50 μm and a pitch of 1 mm in the Y-axis direction

The exposure pattern for each region (second surface) shown in FIG. 5 is as follows.
Area A1 ′: 30 straight lines with a width of 60 μm and a pitch of 1 mm in the X-axis direction Area A2 ′: 30 straight lines with a width of 70 μm and a pitch of 1 mm in the X-axis area A3 ′: A width of 80 μm in the X-axis direction and a pitch of 1 mm 30 straight lines Area A4 ′: 30 straight lines with a width of 90 μm in the X axis direction and 1 mm pitch B1 ′: 30 straight lines with a width of 60 μm in the Y axis direction and 1 mm pitch Area B2 ′: 70 μm wide in the Y axis direction , 30 straight lines with a pitch of 1 mm Region B3 ′: 30 straight lines with a width of 80 μm in the Y-axis direction Region B4 ′: 30 straight lines with a width of 90 μm in the Y-axis direction and a pitch of 1 mm

1: screen mask, 2: screen mesh, 3: photosensitive material layer, 31: first surface of photosensitive material layer, 32: second surface of photosensitive material layer, 4: photosensitive material, 5: alignment mark

Claims (5)

By irradiating the photosensitive material layer held on the screen mesh with exposure light in a pattern, the photosensitive material layer is partially cured according to the exposure light irradiation pattern, and then the photosensitive material layer is exposed to light. A method for manufacturing a mask for screen printing comprising removing an uncured portion of a functional material layer, comprising:
A method for producing a screen mask, wherein the exposure light beam is directly irradiated on both surfaces of the photosensitive material layer held on the screen mesh.   The first surface of the photosensitive material layer held on the screen mesh is directly irradiated with an exposure light beam in a pattern, and then the exposure light beam is applied to the second surface of the photosensitive material layer held on the screen mesh. The method for producing a screen mask according to claim 1, wherein the pattern mask is directly irradiated.   Before irradiating the second surface of the photosensitive material layer held on the screen mesh with exposure light, the amount of displacement of the photosensitive material layer held on the screen mesh is determined, and based on the determination result The method for producing a screen mask according to claim 2, wherein an irradiation light irradiation pattern on the second surface of the photosensitive material layer held by the screen mesh is controlled.   The determination of the amount of displacement of the photosensitive material layer held on the screen mesh is performed using alignment marks visible from the first surface and the second surface of the screen mesh. Method of manufacturing a screen mask. The irradiation amount of the exposure light beam to the first surface of the photosensitive material layer held by the screen mesh is 10 to 90% of the total irradiation amount, according to any one of claims 1 to 4. Manufacturing method of screen mask (herein, the total irradiation amount is the sum of the irradiation amount to the first surface and the irradiation amount to the second surface (unit: mJ / cm ² )).

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