JP2016024437A - Exposure apparatus and exposure method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure apparatus and an exposure method by which a greater number of surfaces can be simultaneously exposed and efficient exposure can be achieved.SOLUTION: The exposure apparatus includes: a holding unit that holds an exposure target substrate 200; a first exposure light projection unit that is located at the top surface side of the exposure target substrate 200 and projects laser light LL1 on the exposure target substrate 200; and a second exposure light projection unit that is located at the back surface side of the exposure target substrate 200 and projects laser light LL2 to the exposure target substrate 200. The laser light LL1 is incident to the exposure target substrate 200 at an incident angle tilted forward in a sub-scanning direction with respect to the normal direction of the top surface, while the laser light LL2 is incident to the exposure target substrate 200 at an incident angle tilted backward in the sub-scanning direction with respect to the normal direction of the back surface.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an exposure apparatus and an exposure method.

  As a sample processing method, a method using photolithography processing and etching processing is known. Patent Document 1 discloses an exposure apparatus for performing an exposure process included in photolithography. The exposure apparatus described in FIG. 5 of Patent Document 1 scans the second scanning light obliquely with respect to the surface from the back surface side while scanning the first scanning light obliquely with respect to the surface from the front surface side of the sample. By doing so, the exposure to the side surface as well as the exposure to the front surface and the back surface of the sample is made possible, and the exposure process is reduced. However, in the configuration of FIG. 5 of Patent Document 1, since both the first and second scanning lights are scanned on the same side surface of the sample, only one side surface can be exposed in one exposure process. Therefore, it cannot be said that the exposure process is sufficiently reduced.

JP 2013-186291 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide an exposure apparatus and an exposure method capable of exposing more surfaces at the same time and enabling efficient exposure.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.

[Application Example 1]
The exposure apparatus of this application example includes a holding unit that holds an object to be exposed,
A first exposure light incident portion that is located on the first main surface side of the object to be exposed and that makes first exposure light that scans in a first direction enter the object to be exposed;
A second exposure light incident portion that is located on the second principal surface side opposite to the first principal surface of the object to be exposed, and that enters second exposure light that scans in a second direction to the object to be exposed;
Moving means for relatively moving the holding unit, the first exposure light incident unit, and the second exposure light incident unit in a third direction intersecting the first direction and the second direction; ,
The first exposure light is incident on the object to be exposed from a direction inclined to one side of the third direction with respect to the normal direction of the first main surface,
The second exposure light is incident on the object to be exposed from a direction inclined to the other side of the third direction with respect to the normal direction of the second main surface.
Accordingly, it is possible to provide an exposure apparatus that can expose more surfaces at the same time (during the same process) and can perform efficient exposure.

[Application Example 2]
In the exposure apparatus of this application example, the object to be exposed has side surfaces connected to the first main surface and the second main surface,
The first main surface and the first portion of the side surface are exposed by the first exposure light,
It is preferable that the second main surface and the second portion of the side surface are exposed by the second exposure light.
Thereby, more surfaces can be exposed simultaneously.

[Application Example 3]
In the exposure apparatus according to this application example, it is preferable that at least one of the first portion and the second portion includes a plurality of surfaces having different normal directions.
Thereby, more surfaces can be exposed simultaneously.

[Application Example 4]
In the exposure apparatus of this application example, it is preferable that the second direction is along the first direction.
Thus, by combining the scanning direction of the first exposure light and the operation method of the second exposure light, for example, it becomes easy to create a program or the like for determining an exposure pattern.

[Application Example 5]
In the exposure apparatus of this application example, it is preferable that the scanning center axis of the first exposure light and the scanning center axis of the second exposure light are on the same straight line.
By setting in this way, it becomes easy to adjust the optical axes of the first exposure light and the second exposure light.

[Application Example 6]
The exposure apparatus according to this application example preferably includes an incident angle adjusting unit that can adjust the incident angle of at least one of the first exposure light and the second exposure light.
Thereby, a to-be-exposed board | substrate can be exposed more accurately.

[Application Example 7]
In the exposure method of this application example, the first exposure light scanned in the first direction is incident from the first main surface side of the object to be exposed, and the second exposure light scanned in the second direction is opposite to the first main surface. The incident position of the first exposure light and the second exposure light is moved in a third direction that intersects the first direction and the second direction. Including a step of exposing an exposed object,
In the step, the first exposure light is incident on the object to be exposed from a direction inclined to one side of the third direction with respect to a normal direction of the first main surface, and the second exposure light is The light is incident on the object to be exposed from a direction inclined to the other side of the third direction with respect to the normal direction of the second main surface.
Thereby, more surfaces can be exposed simultaneously (during the same process), and efficient exposure becomes possible.

[Application Example 8]
In the exposure method of this application example, the object to be exposed has side surfaces connected to the first main surface and the second main surface,
The first exposure light exposes the first main surface and the first portion of the side surface,
The second exposure light preferably exposes the second main surface and the second portion of the side surface.
Thereby, more surfaces can be exposed simultaneously.

It is a block diagram of the exposure apparatus which concerns on suitable embodiment of this invention. It is a side view which shows the holding | maintenance unit of the exposure apparatus shown in FIG. It is a figure which shows an example of the to-be-exposed board | substrate exposed by the exposure apparatus shown in FIG. 1, (a) is a top view, (b) is the sectional view on the AA line in the figure (a). It is sectional drawing explaining the exposure method of the to-be-exposed board | substrate shown in FIG. It is sectional drawing explaining the exposure method of the to-be-exposed board | substrate shown in FIG. It is the top view and side view explaining another exposure method of the to-be-exposed board | substrate shown in FIG. The vibration element as an example of a product is shown, (a) is a plan view, and (b) is a cross-sectional view taken along the line BB in FIG. It is sectional drawing explaining the patterning method of the excitation electrode which the vibration element shown in FIG. 7 has. It is sectional drawing which shows the wavelength tunable filter as an example of a product. It is sectional drawing which shows the light emitting element as an example of a manufactured product. It is CC sectional view taken on the line in FIG. It is sectional drawing which shows the inkjet head as an example of a product. It is sectional drawing which shows the base material which has a metal mask as an example of a manufactured product. It is sectional drawing which shows the manufacturing method of the metal mask shown in FIG.

  Hereinafter, an exposure method and an exposure apparatus of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<First Embodiment>
First, a first embodiment of the exposure method and exposure apparatus of the present invention will be described.

  FIG. 1 is a block diagram of an exposure apparatus according to a preferred embodiment of the present invention. FIG. 2 is a side view showing a holding unit of the exposure apparatus shown in FIG. 3A and 3B are diagrams showing an example of a substrate to be exposed exposed by the exposure apparatus shown in FIG. 1, wherein FIG. 3A is a plan view, and FIG. 3B is a cross-sectional view taken along line AA in FIG. is there. FIG. 4 is a cross-sectional view for explaining an exposure method for the substrate to be exposed shown in FIG. FIG. 5 is a sectional view for explaining an exposure method for the substrate to be exposed shown in FIG. 6A and 6B are a plan view and a side view for explaining another exposure method for the substrate to be exposed shown in FIG. In FIG. 1 and FIG. 2, for convenience of explanation, the x axis, the y axis, and the z axis are illustrated as three axes orthogonal to each other. Hereinafter, a direction parallel to the x-axis is also referred to as “x-axis direction”, a direction parallel to the y-axis is also referred to as “y-axis direction”, and a direction parallel to the z-axis is also referred to as “z-axis direction”.

1. Exposure Apparatus An exposure apparatus 100 shown in FIG. 1 is an exposure apparatus used to expose a substrate to be exposed (object to be exposed) 200. Such an exposure apparatus 100 includes a holding unit 110 that moves the held substrate to be exposed 200, and a laser beam (exposure light) LL1 that is incident on the substrate to be exposed 200 from the surface (first main surface) side. A first exposure light incident unit (first exposure light incident part) 120A and a second exposure light incident unit (first exposure light) LL2 that enters laser light (exposure light) LL2 from the back surface (second main surface) side with respect to the exposed substrate 200. 2 exposure light incident part) 120B, and is a double-sided exposure type exposure apparatus capable of simultaneously exposing the substrate to be exposed 200 from the front surface side and the back surface side.

≪First exposure light incident unit≫
The first exposure light incident unit 120A includes a laser light source 130A that emits the laser light LL1, a laser light source controller 140A that controls driving of the laser light source 130A, an optical lens system 150A that optically corrects the laser light LL1, and a laser light. A polygon mirror 160A for scanning LL and a mirror 170A are provided.

  The laser light source 130A is controlled by the laser light source controller 140A and emits the laser light LL1 at a predetermined timing so that the exposed substrate 200 can be exposed with a predetermined pattern. The laser beam LL1 emitted from the laser light source 130A is reflected by the mirror 170A and then enters the reflecting surface 161 of the polygon mirror 160A. The polygon mirror 160A is rotationally driven around an axis J by a driving source (not shown) such as a motor, and scans the incident laser beam LL1 in one dimension (main scanning).

  As shown in FIG. 1, the optical lens system 150A includes a collimator lens 151, a first zoom lens 152, a second zoom lens 153, and a first cylindrical lens 154 disposed between the laser light source 130A and the mirror 170A. And an fθ lens 155 and a second cylindrical lens 156 disposed between the polygon mirror 160A and the holding unit 110.

  Among these lenses, the collimator lens 151 is a lens for making the laser beam LL1 into parallel light. The first zoom lens 152 is a lens that expands the laser beam LL1 in the z-axis direction, and the second zoom lens 153 is a lens that expands the laser beam LL1 in the y-axis direction. Since the cross-sectional shape of the laser light LL1 emitted from the laser light source 130A is generally not a perfect circle (ellipse), the cross-sectional shape (aspect ratio) of the laser light LL1 is changed by the first and second zoom lenses 152 and 153. Correction is made so that the cross-sectional shape is almost a perfect circle. Further, the first cylindrical lens 154 and the second cylindrical lens 156 correct the deviation of the scanning position of the laser beam LL1 due to the so-called “surface tilt” of the reflection surface 161 of the polygon mirror 160A, and are the same regardless of the presence or absence of the surface tilt. This is a lens for imaging the laser beam LL1 at a position. The fθ lens 155 is a lens for scanning the exposed substrate 200 with the laser light LL1 at a constant speed. By providing the optical lens system 150A having such a configuration, the laser beam LL1 can be incident on the substrate to be exposed 200 with high accuracy.

≪Second exposure light incident unit≫
The second exposure light incident unit 120B includes a laser light source 130B that emits the laser light LL2, a laser light source controller 140B that controls driving of the laser light source 130B, an optical lens system 150B that optically corrects the laser light LL2, and a laser light. A polygon mirror 160B that scans LL2 and a mirror 170B are provided. Such a second exposure light incident unit 120B has the same configuration as the first exposure light incident unit 120A described above. Therefore, detailed description of the second exposure light incident unit 120B is omitted.

  Such a second exposure light incident unit 120B is arranged to face the first exposure light incident unit 120A via the holding unit 110 (the substrate to be exposed 200 held by the holding unit 110). More specifically, the first exposure light incident unit 120A is positioned on the front surface side of the substrate to be exposed 200 held by the holding unit 110, and the second exposure light incident unit 120B is positioned on the back surface side. By arranging the first and second exposure light incident units 120A and 120B in such an arrangement, the laser light LL1 from the first exposure light incident unit 120A is incident on the front surface side of the substrate 200 to be exposed, and the first exposure light incident unit 120A and 120B is incident on the rear surface side. The laser light LL2 from the two-exposure light incident unit 120B can be made incident, and the exposed substrate 200 can be simultaneously exposed from the front and back sides.

  In particular, in the present embodiment, the second exposure light incident unit 120B is arranged so that the scanning direction (second direction) of the laser light LL2 is along the scanning direction (first direction) of the laser light LL1. By aligning the scanning directions of the laser beams LL1 and LL2 in this way, for example, an ON (incident) / OFF (non-incident) pattern of the laser beam LL1 for exposing the surface side of the exposed substrate 200 with a predetermined pattern, Since the ON / OFF pattern of the laser beam LL2 for exposing the back surface side with a predetermined pattern can be programmed in the same manner, the control of the first and second exposure light incident units 120A and 120B is relatively easy. Thus, the substrate to be exposed 200 can be exposed more efficiently. Further, by aligning the scanning directions of the laser beams LL1 and LL2, the movement direction (sub-scanning direction) of the substrate to be exposed 200 can be made orthogonal to the scanning direction (main scanning direction) of the laser beams LL1 and LL2. Therefore, the exposed substrate 200 can be efficiently exposed.

  In the present embodiment, the first and second exposure light incident units 120A and 120B are configured to scan the laser light LL1 scanning surface (the surface defined by the trajectory of the scanned laser light LL1) and the laser light LL2 scanning surface ( And the surface defined by the trajectory of the scanned laser beam LL2) are located in the same plane. Thereby, the optical axes of the laser beams LL1 and LL2 can be easily adjusted, and the exposed substrate 200 can be exposed more accurately. The first and second exposure light incident units 120A and 120B further include a scanning center axis (bisector of scanning angle) of the laser beam LL1 and a scanning center axis (bisector of scanning angle) of the laser beam LL2. ) Are coincident with each other, that is, they are preferably located along the same straight line. Thereby, the effect mentioned above can be exhibited more effectively.

  Further, the laser beam LL1 from the first exposure light incident unit 120A is designed so that the beam waist portion and a region having a small beam diameter in the vicinity thereof are incident on the substrate to be exposed 200. Similarly, the second exposure light is irradiated with the second exposure light. The laser beam LL2 from the light incident unit 120B is designed so that the beam waist portion and a region having a small beam diameter in the vicinity thereof are incident on the substrate to be exposed 200. Thereby, the to-be-exposed substrate 200 can be finely and accurately exposed.

≪Holding unit≫
The holding unit 110 can move in a direction (third direction, sub-scanning direction) intersecting (orthogonal) with the scanning direction (main scanning direction) of the laser beams LL1 and LL2 while holding the exposed substrate 200. . Therefore, the laser beam LL1 is two-dimensionally moved with respect to the substrate to be exposed 200 held by the holding unit 110 by scanning the laser beams LL1 and LL2 in the main scanning direction while moving the holding unit 110 in the sub-scanning direction. , LL2 is incident, whereby the exposed substrate 200 can be exposed in a predetermined pattern.

  Further, as shown in FIG. 2, the holding unit 110 can also rotate around an axis J <b> 1 along the normal direction. Thereby, the to-be-exposed board | substrate 200 hold | maintained can be made into a desired direction. Further, the holding unit 110 can rotate around the axis J2 located in the scanning plane of the laser beams LL1 and LL2 along the x axis. Thereby, the inclination of the to-be-exposed board | substrate 200 with respect to the scanning surface of laser beam LL1, LL2 can be changed, and the incident angle of laser beam LL1, LL2 with respect to the to-be-exposed board | substrate 200 can be adjusted.

  That is, the holding unit 110 functions as a moving unit that moves the substrate to be exposed 200, and also functions as an incident angle adjusting unit that adjusts the incident angles of the laser beams LL1 and LL2.

  Here, the moving direction (sub-scanning direction) of the holding unit 110 changes according to the inclination of the holding unit 110, and the holding unit 110 moves along the inclination. By moving the holding unit 110 in this way, the laser beams LL1 and LL2 having a substantially constant diameter can be incident on the substrate to be exposed 200 while the holding unit 110 is moving. Therefore, unevenness (roughness) does not easily occur in exposure patterning, and the exposed substrate 200 can be uniformly exposed.

  The moving direction (sub-scanning direction) of the holding unit 110 is not particularly limited, but it is preferable that the holding unit 110 is closer to the vertical direction. Thereby, since the to-be-exposed board | substrate 200 hold | maintained at the holding | maintenance unit 110 will be in the state stood with respect to the horizontal surface, for example, compared with the state to which the to-be-exposed substrate 200 followed the horizontal surface, the bending of the to-be-exposed substrate 200 was carried out. Can be reduced. Therefore, the laser beams LL1 and LL2 can be accurately incident on the exposed substrate 200, and the exposed substrate 200 can be accurately exposed. As described above, since the moving direction of the holding unit 110 varies depending on the inclination of the holding unit 110, for example, the z axis may coincide with the vertical direction, or the frequently used inclination of the holding unit 110 is inclined. When there is a corner, the moving direction of the holding unit 110 at the tilt angle may be matched with the vertical direction.

  The shape of the holding unit 110 is not particularly limited, but in the present embodiment, the holding unit 110 is configured to hold the edge of the substrate 200 to be exposed. Thereby, both the front surface and the back surface of the substrate to be exposed 200 can be exposed.

  The configuration of the exposure apparatus 100 has been briefly described above. According to such an exposure apparatus 100, the substrate 200 to be exposed can be exposed in a predetermined pattern by synchronizing the movement of the holding unit 110 and the emission timing of the laser beams LL1 and LL2. For this reason, an exposure mask used in an exposure apparatus as conventionally known (for example, an apparatus described in JP-A-2006-210426) is not required, and the manufacturing time and manufacturing cost of the exposure mask can be saved. . Therefore, the exposure apparatus 100 can perform exposure inexpensively and quickly with respect to the conventional exposure apparatus. In particular, when an actual exposure pattern (actual pattern) is deviated from a predetermined exposure pattern (ideal pattern), it is necessary to recreate the exposure mask in the conventional exposure apparatus in order to correct the deviation. On the other hand, the exposure apparatus 100 may correct the emission timing of the laser beams LL1 and LL2 from the laser light sources 130A and 130B. Even in this respect, the exposure apparatus 100 can perform exposure at low cost and promptly with respect to the conventional exposure apparatus.

  The configuration of the exposure apparatus 100 is not limited to the above configuration as long as the substrate to be exposed 200 can be exposed by scanning light. For example, in each of the optical lens systems 150A and 150B, at least one of the various lenses described above may be omitted, or a lens having a function other than the various lenses described above may be included. As a means for scanning the laser beams LL1 and LL2, a Si MEMS device that performs optical scanning by rotating the mirror surface around the axis J may be used instead of the polygon mirrors 160A and 160B. In the above configuration, the holding unit 110 can be tilted and rotated with respect to the first and second exposure light incident units 120A and 120B. However, the holding unit 110 cannot be tilted and rotated, and its posture is constant. May be stipulated. On the contrary, the first and second exposure light incident units 120A and 120B may be inclined and rotated with respect to the holding unit 110. According to this, since the moving direction of the holding unit 110 can be fixed in the vertical direction, it is possible to more effectively reduce the bending of the exposed substrate 200 as described above. In the above configuration, the holding unit 110 moves in the sub-scanning direction with respect to the first and second exposure light incident units 120A and 120B. The second exposure light incident units 120A and 120B may be configured to move in the sub-scanning direction.

2. Next, an exposure method for the substrate to be exposed 200 using the exposure apparatus 100 will be described.

  First, an example of the substrate to be exposed 200 will be described with reference to FIG. The exposed substrate 200 has a rectangular shape in plan view, and is formed on a substrate 210 made of silicon, quartz, or the like, a metal film M formed on the substrate 210, and a metal film M. And a resist film R. The exposed substrate 200 has a front surface 201 and a back surface 202 that are in a front / back relationship, and four side surfaces 203, 204, 205, and 206 that connect the front surface 201 and the back surface 202. Of the four side surfaces 203 to 206, the side surfaces 203 and 205 are disposed to face each other, and the side surfaces 204 and 206 are disposed to face each other. Further, the side surfaces 203 to 206 are orthogonal to the front surface 201 and the back surface 202, respectively.

By exposing the resist film R included in the exposed substrate 200 with the exposure apparatus 100, a resist mask RM for patterning the metal film M from the resist film R is formed. The resist film R may be a positive type in which an exposed portion (a portion irradiated with the laser beam LL) is removed or a negative type in which an exposed portion remains.
Such an exposed substrate 200 is exposed by the exposure apparatus 100 as follows.

<< Exposure Method 1 >>
The exposure method of the to-be-exposed substrate 200 includes a first exposure step of exposing the resist film R on the front surface 201 and the side surface 203 with the laser beam LL1, and exposing the resist film R on the back surface 202 and the side surface 205 with the laser beam LL2. A second exposure step of exposing the resist film R on the side surface 204 with the laser beam LL1 and exposing the resist film R on the side surface 206 with the laser beam LL2.

[First exposure step]
First, the exposed substrate 200 is prepared, and the prepared exposed substrate 200 is held by the holding unit 110. Next, if necessary, the holding unit 110 is rotated about the axis J1, and the direction in which the side surfaces 203 and 205 face (separation direction) is made to coincide with the sub-scanning direction. Further, if necessary, the holding unit 110 is inclined about the axis J2, and the incident angle θin of the laser beam LL1 with respect to the surface 201 and the side surface 203 is about 45 ° (half the angle θ formed by the surface 201 and the side surface 203). That is, θ / 2), and the substrate to be exposed so that the incident angle θin of the laser beam LL2 with respect to the back surface 202 and the side surface 205 is about 45 ° (half the angle θ formed between the back surface 202 and the side surface 205, ie, θ / 2). Adjust the posture of 200. That is, the laser beam LL1 is incident on the substrate to be exposed 200 at an incident angle inclined by about 45 ° to the front side (one side) in the sub-scanning direction with respect to the normal direction L ₂₀₁ of the front surface 201 and the normal direction of the back surface 202 as the laser beam LL2 is incident on the exposed substrate 200 at an incident angle of approximately 45 ° tilt in the sub-scanning direction rear side (the other side) relative to the L _202, adjusts the attitude of the substrate to be exposed 200.

  Then, after adjusting the orientation and inclination of the substrate 200 to be exposed, the holding unit 110 is moved while scanning the laser beams LL1 and LL2 while synchronizing the movement of the holding unit 110 and the emission timing of the laser beams LL1 and LL2. Move in the sub-scanning direction. As a result, as shown in FIG. 4, the laser beam LL1 is incident on the resist film R on the surface 201 of the substrate 200 to be exposed and the side surface 203 (first portion) facing forward, and the portion is exposed with a predetermined pattern. At the same time, the laser beam LL2 is incident on the resist film R on the back surface 202 and the rear side surface 205 (second portion) of the exposed substrate 200, and the portion is exposed in a predetermined pattern.

  Thus, since the four surfaces of the substrate to be exposed 200 can be exposed in a single exposure step, the substrate to be exposed 200 can be efficiently exposed. In particular, in this embodiment, since the incident angles θin of the laser beams LL1 and LL2 with respect to each surface are aligned to 45 °, the spot shapes and areas of the laser beams LL1 and LL2 on each surface can be approximately uniform. . Therefore, more uniform exposure with less density can be performed on each surface. In addition, since the exposure amount (energy amount per unit area) on each surface can be made uniform, the occurrence of underexposed or overexposed portions is reduced, and more uniform exposure is performed on each surface. be able to. Note that the incident angle θin of the laser beam LL1 with respect to the surface 201 and the side surface 203 is not limited to about 45 ° as long as the laser beam LL1 can be incident on each of these surfaces. It is preferably in the range of θ / 2 ± 15 °, more preferably in the range of θ / 2 ± 5 °. The same applies to the incident angle θin of the laser beam LL2 with respect to the back surface 202 and the side surface 205.

[Second exposure step]
First, similarly to the first exposure step, for example, the holding unit 110 is rotated by 90 ° around the axis J1, and the facing direction (separation direction) of the side surfaces 204 and 206 of the substrate 200 to be exposed is made coincident with the sub-scanning direction. If necessary, the holding unit 110 is tilted about the axis J2, and the incident angle θin of the laser beam LL1 with respect to the side surface 204 becomes about 45 °, and the incident angle θin of the laser beam LL2 with respect to the side surface 206 becomes about 45 °. The posture of the substrate to be exposed 200 is adjusted so that

  When the orientation of the substrate to be exposed 200 is adjusted, the holding unit 110 is sub-scanned while scanning the laser beams LL1 and LL2 by synchronizing the movement of the holding unit 110 and the emission timing of the laser beams LL1 and LL2. Move in the direction. As a result, as shown in FIG. 5, the laser beam LL1 is incident on the resist film R on the side surface 204 facing the front side in the sub-scanning direction, the portion is exposed in a predetermined pattern, and the rear in the sub-scanning direction. The laser beam LL2 is incident on the resist film R on the side surface 206 facing the side, and the portion is exposed with a predetermined pattern. As described above, the side surfaces 204 and 206 are exposed in the first exposure step by making the laser beams LL1 and LL2 incident at the same incident angle θin as the incident angle θin with respect to each surface in the first exposure step. The exposure can be performed under substantially the same conditions as the surface (spot areas of the laser beams LL1, LL2, exposure amount, etc.). Therefore, the entire region of the resist film R can be more uniformly exposed.

  According to the exposure method as described above, all the six surfaces of the substrate to be exposed 200 can be exposed by the first and second exposure steps. That is, more surfaces can be exposed with fewer exposure processes, and the substrate to be exposed 200 can be exposed efficiently. In particular, since the variation in the exposure amount between different surfaces can be suppressed by aligning the incident angle θin as in the present embodiment, exposure unevenness can be reduced and the resist film R can be exposed uniformly. In the present embodiment, the resist film R on the front surface 201 and the back surface 202 is exposed in the first exposure process. However, the resist film R in the corresponding portion is exposed in the second exposure process together with the side surfaces 204 and 206. Also good.

<< Exposure Method 2 >>
Moreover, the to-be-exposed board | substrate 200 can be exposed also with the following exposure methods. The exposure method of the to-be-exposed substrate 200 is an exposure process in which the resist film R on the front surface 201 and the side surfaces 203 and 204 is exposed with the laser beam LL1, and the resist film R on the back surface 202 and the side surfaces 205 and 206 is exposed with the laser beam LL2. Is included.

[Exposure process]
First, the exposed substrate 200 is prepared, and the prepared exposed substrate 200 is held by the holding unit 110. Next, if necessary, the holding unit 110 is rotated around the axis J1, and for example, the extension direction of the diagonal line connecting the corner between the side surfaces 203 and 204 and the corner between the side surfaces 205 and 206 is the sub-scanning direction. To match. If necessary, the holding unit 110 is tilted about the shaft J2, the laser beam LL1 is the exposed substrate 200 at an incident angle inclined to the sub-scanning direction front side with respect to the normal direction L ₂₀₁ of the surface 201 incident, as the laser beam LL2 is incident on the exposed substrate 200 at an incident angle inclined to the sub-scanning direction rear side with respect to the normal direction L ₂₀₂ of the back 202, to adjust the attitude of the substrate to be exposed 200.

  Then, after adjusting the orientation and inclination of the substrate 200 to be exposed, the holding unit 110 is moved while scanning the laser beams LL1 and LL2 while synchronizing the movement of the holding unit 110 and the emission timing of the laser beams LL1 and LL2. Move in the sub-scanning direction. As a result, as shown in FIG. 6, the laser beam LL1 is incident on the surface 201 and the side surfaces 203 and 204 (first portion) of the substrate 200 to be exposed, and the resist film R in the portion is exposed with a predetermined pattern. The laser beam LL2 is incident on the back surface 202 and the side surfaces 205 and 206 (second portion) of the substrate to be exposed 200, and the resist film R in the portion is exposed with a predetermined pattern.

  According to such an exposure method, the resist film R on a total of three surfaces of the front surface 201 and the side surfaces 203 and 204 having different normal directions can be simultaneously exposed with the laser beam LL1, and the back surface 202 is irradiated with the laser beam LL2. In addition, the resist film R on a total of three side surfaces 205 and 206 having different normal directions can be exposed simultaneously. Therefore, the substrate to be exposed 200 can be efficiently exposed with fewer exposure steps. In particular, in the present embodiment, the entire surface of the substrate to be exposed 200 can be exposed in a single exposure process.

  The exposure method and the exposure apparatus of the present invention have been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each part is an arbitrary configuration having the same function. Can be replaced. In addition, any other component may be added to the present invention.

  Next, some specific examples of the products (including the substrate to be exposed) that can be manufactured by using the exposure apparatus and the exposure method of the present invention will be illustrated. However, the product is not limited to the examples given below.

≪Vibration element≫
7A and 7B show a vibration element as an example of a manufactured product, in which FIG. 7A is a plan view and FIG. 7B is a cross-sectional view taken along line BB in FIG. FIG. 8 is a cross-sectional view illustrating a method for patterning excitation electrodes included in the vibration element shown in FIG.

  A vibration element 500 shown in FIG. 7A is a tuning fork type crystal vibration element having a base 510 and a pair of vibration arms 520 and 530 extending from the base 510. A plurality of through holes 521 and 531 are formed in the vibrating arms 520 and 530 along the extending direction thereof. Further, as shown in FIG. 7B, the vibration element 500 includes excitation electrodes 541 and 542 disposed on the side surfaces (outer side surface and inner side surface) of the vibrating arms 520 and 530, and the excitation electrode 541, By applying an alternating voltage between 542, the vibrating arms 520 and 530 are flexibly vibrated in the in-plane reverse phase mode.

  In the vibration element 500 as described above, the excitation electrodes 541 and 542 can be formed using the exposure apparatus 100 and the exposure method described above. For example, first, a metal film M and a positive resist film R are sequentially formed on the entire surface of the vibrating arms 520 and 530. Next, as shown in FIG. 8A, laser beams LL1 and LL2 are incident at an incident angle θin of about 45 ° to expose the resist film R on the front and back surfaces and side surfaces. Further, the remaining surface is exposed and developed in the same manner, whereby a resist mask RM corresponding to the shape of the excitation electrodes 541 and 542 is formed as shown in FIG. 8B, and the resist mask RM passes through the resist mask RM. After the metal film M is etched, the resist electrodes 541 and 542 can be formed by removing the resist mask RM.

  In FIG. 7, the tuning fork type vibrator has been described. However, the structure of the vibrator is not limited to this, and for example, a double tuning fork type vibrator may be used. An H-type vibrating gyroscope having a base, a pair of drive arms extending from the base to one side, and a pair of detection arms extending from the base to the other side, which may be an AT-cut crystal resonator It may be a sensor element, a base, a pair of detection arms extending from the base to both sides, a pair of connection arms extending from the base to both sides in a direction orthogonal to the pair of detection arms, and one connection A WT vibration type gyro sensor element having a pair of driving arms extending from both ends of the arm to both sides and a pair of vibrating arms extending from the tip of the other connecting arm to both sides may be used. .

≪Wavelength tunable filter≫
FIG. 9 is a cross-sectional view showing a wavelength tunable filter as an example of a product.

  A wavelength tunable filter 600 shown in FIG. 9 includes a fixed substrate 610 and a movable substrate 620, both of which are formed from a glass plate, and these are bonded to face each other. Further, the fixed substrate 610 has a convex reflective film installation part 611 protruding from the periphery, and a fixed reflective film 630 is provided on the upper surface of the reflective film installation part 611. On the other hand, the movable substrate 620 includes an annular holding portion 621 that is thinner than the surroundings, and a movable portion 622 that is positioned inside the holding portion 621 and that can be displaced with respect to the fixed substrate 610 while elastically deforming the holding portion 621. A movable reflective film 640 is provided on the lower surface of the movable portion 622. The fixed reflection film 630 and the movable reflection film 640 are arranged to face each other via a gap G1, and the gap G1 can be adjusted by the electrostatic actuator 650.

  The electrostatic actuator 650 is disposed on the upper surface of the fixed substrate 610 so as to surround the reflection film installation portion 611 and is disposed on the lower surface of the movable substrate 620 so as to face the fixed electrode 651. The fixed electrode 651 is drawn out by the lead wiring 653, and the movable electrode 652 is drawn out by the lead wiring 654. In such an electrostatic actuator 650, the gap G1 can be adjusted using an electrostatic force generated by applying a voltage between the fixed electrode 651 and the movable electrode 652. In this way, by adjusting the gap G1, light having a predetermined target wavelength can be extracted from the inspection target light incident on the wavelength tunable filter 600.

  In the wavelength tunable filter 600 as described above, for example, the fixed electrode 651 and the lead-out wiring 653 can be formed using the exposure apparatus 100 and the exposure method described above. Similarly, the movable electrode 652 and the lead wiring 654 can be formed using the exposure apparatus 100 and the exposure method described above. Note that a specific exposure method is substantially the same procedure as that of the vibration element 500 described above, and a description thereof will be omitted.

≪Light emitting element≫
FIG. 10 is a cross-sectional view showing a light emitting device as an example of a product. 11 is a cross-sectional view taken along the line CC in FIG.

  A light emitting element 700 shown in FIGS. 10 and 11 is an SLD (super luminescent diode), and includes a substrate 702, a first cladding layer 704, an active layer 706, a second cladding layer 708, and a contact layer 709. In addition, the first electrode 712, the second electrode 714, and the insulating portion 720 are stacked.

  The substrate 702 is, for example, an n-type GaAs substrate. The first cladding layer 704 is, for example, an n-type InGaAlP layer. The second cladding layer 708 is, for example, a p-type InGaAlP layer. The active layer 706 has a multiple quantum well (MQW) structure in which, for example, three quantum well structures each composed of an InGaP well layer and an InGaAlP barrier layer are stacked.

  The active layer 706 includes a first side surface 731 on which the light emitting portion 730 is formed, a second side surface 732 and a third side surface 733 that are inclined with respect to the first side surface 731. The second and third side surfaces 732 and 733 are configured by inner peripheral surfaces of through holes 741 and 742 that penetrate the light emitting element 700, respectively. A part of the active layer 706 forms a gain region group 750 including a first gain region 751, a second gain region 752, and a third gain region 753, and a plurality of gain region groups are provided.

  In the light emitting device 700 having such a configuration, when a forward bias voltage of a pin diode including the first cladding layer 704, the active layer 706, and the second cladding layer 708 is applied between the first electrode 712 and the second electrode 714. Then, gain regions 751, 752, and 753 are generated in the active layer 706, and recombination of electrons and holes occurs in the gain regions 751, 752, and 753, and light emission occurs. With this generated light as the starting point, stimulated emission occurs in a chain, and the light intensity is amplified in the gain regions 751, 752, and 753. Then, the light whose intensity has been amplified is emitted as light L from the light emitting unit 730.

  The contact layer 709 and a part of the second cladding layer 708 form a columnar portion 722. The planar shape of the columnar portion 722 is the same as the planar shape of the gain region group 750. In other words, the current path between the first and second electrodes 712 and 714 is determined by the planar shape of the columnar portion 722, and as a result, the planar shape of the gain region group 750 is determined.

  The first electrode 712 is formed on the entire surface under the substrate 702, and the second electrode 714 is formed on the contact layer 709. The planar shape of the second electrode 714 is the same as the planar shape of the gain region group 750, for example. The first and second electrodes 712 and 714 are, for example, a metal laminate in which a Cr layer, an AuZn layer, and an Au layer are laminated in this order.

  In the light emitting element 700 as described above, for example, the second electrode 714 can be formed using the exposure method described above. Further, for example, the through holes 741 and 742 can be formed using the exposure method described above. The specific exposure method is substantially the same procedure as that of the vibration element 500 described above, and the description thereof is omitted.

≪Inkjet head≫
FIG. 12 is a cross-sectional view showing an inkjet head as an example of a product.

  An inkjet head 800 shown in FIG. 12 includes a laminated substrate 810 in which a nozzle substrate 811, a flow path forming substrate 812, a vibration plate 813, a reservoir forming substrate 814 and a compliance substrate 815 are sequentially stacked, and a plurality of substrates disposed on the vibration plate 813. Piezoelectric element 820, a wiring forming portion 830 provided on the vibration plate 813 so as to cover the piezoelectric element 820, and an IC package 840 disposed on the wiring forming portion 830. In such an inkjet head 800, the piezoelectric element 820 vibrates the vibration plate 813, thereby changing the pressure in the pressure generation chamber 890, and ejecting ink I as droplets from the ejection port 891 formed in the nozzle substrate 811. Is configured to do.

  For example, the wiring forming unit 830 is collectively formed with the reservoir forming substrate 814 by performing wet etching (anisotropic etching) on the silicon substrate. Such a wiring forming portion 830 has a pair of inclined surfaces 831 and 832 and an upper surface 833 that connects the upper ends of the inclined surfaces 831 and 832, and the inclined angle of the inclined surfaces 831 and 832 is about 54 °. ing. In addition, the wiring forming portion 830 has a recess opening on the lower surface, and the piezoelectric element 820 is disposed in a space defined by the recess and the diaphragm 813. Further, a wiring 839 is disposed on the upper surface 833 and the inclined surfaces 831 and 832 of the wiring forming portion 830, and the wiring 839 is electrically connected to the piezoelectric element 820.

  The IC package 840 includes a circuit that can control the driving of each piezoelectric element 820 independently, and is fixed to the upper surface of the wiring forming portion 830 via a conductive fixing member such as solder or gold bumps. 839 is electrically connected.

  In the inkjet head 800 as described above, for example, the wiring 839 can be formed by using the exposure apparatus 100 and the exposure method described above. The specific exposure method is substantially the same procedure as that of the vibration element 500 described above, and the description thereof is omitted.

≪Metal mask≫
FIG. 13 is a cross-sectional view showing a base material having a metal mask as an example of a product. 14 is a cross-sectional view showing a method for manufacturing the metal mask shown in FIG.

  A metal mask 910 shown in FIG. 13 is a mask used when patterning a base material 900 such as a crystal substrate or a silicon substrate by dry etching, for example. Such a metal mask 910 can also be formed using the exposure apparatus 100 and the exposure method described above. Briefly, first, a base material 900 is prepared, and as shown in FIG. 14A, a seed layer 920 for plating growth is formed on the front and back surfaces of the base material 900 by sputtering, vapor deposition, or the like. Next, a resist film R is formed on the seed layer 920, and this resist film R is exposed by the above-described exposure method, whereby openings corresponding to the shape of the metal mask 910 are formed as shown in FIG. A resist mask RM having is obtained. Next, a plating layer 930 is formed in the opening of the resist mask RM by electrolytic plating, electroless plating, or the like, and the seed layer 920 protruding from the resist mask RM and the plating layer 930 is removed, whereby FIG. As shown in c), a metal mask 910 is obtained.

DESCRIPTION OF SYMBOLS 100 ... Exposure apparatus 110 ... Holding unit 120A ... 1st exposure light incident unit 120B ... 2nd exposure light incident unit 130A, 130B ... Laser light source 140A, 140B ... Laser light source control part 150A, 150B ... Optical Lens system 151 ... Collimator lens 152 ... First zoom lens 153 ... Second zoom lens 154 ... First cylindrical lens 155 ... fθ lens 156 ... Second cylindrical lenses 160A, 160B ... Polygon mirror 161 ... ... reflective surfaces 170A, 170B ... mirror 200 ... substrate to be exposed 201 ... front surface 202 ... back surface 203, 204, 205, 206 ... side surface 210 ... substrate 500 ... vibration element 510 ... base 520, 530 ... ... Vibrating arm 521, 531 ... Through hole 541 542... Excitation electrode 600... Tunable filter 610... Fixed substrate 611. 650: Electrostatic actuator 651: Fixed electrode 652: Movable electrode 653 ... Lead wire 654 ... Lead wire 700 ... Light emitting element 702 ... Substrate 704 ... First clad layer 706 ... Active layer 708 ... Second clad layer 709 ... contact layer 712 ... first electrode 714 ... second electrode 720 ... insulating part 722 ... columnar part 730 ... light emitting part 731 ... first side 732 ... second side 733 …… Third side surface 741, 742 …… Through hole 750 …… Gain region group 751 …… First gain region 752 …… Second gain region 753 …… Third gain region Area 800... Inkjet head 810... Laminated substrate 811... Nozzle substrate 812. 831, 832 ... Inclined surface 833 ... Upper surface 839 ... Wiring 840 ... IC package 890 ... Pressure generating chamber 891 ... Discharge port 900 ... Base material 910 ... Metal mask 920 ... Seed layer 930 ... Plating layer G1 ...... gap I ...... ink J, J1, J2 ...... axis L _201, L 202 _...... normal direction LL1, LL2 ...... laser light L ...... light M ...... metal film R ...... resist film RM ... … Resist mask θin …… incident angle

Claims (8)

A holding unit for holding an object to be exposed;
A first exposure light incident portion that is located on the first main surface side of the object to be exposed and that makes first exposure light that scans in a first direction enter the object to be exposed;
A second exposure light incident portion that is located on the second principal surface side opposite to the first principal surface of the object to be exposed, and that enters second exposure light that scans in a second direction to the object to be exposed;
Moving means for relatively moving the holding unit, the first exposure light incident unit, and the second exposure light incident unit in a third direction intersecting the first direction and the second direction; ,
The first exposure light is incident on the object to be exposed from a direction inclined to one side of the third direction with respect to the normal direction of the first main surface,
The exposure apparatus, wherein the second exposure light is incident on the object to be exposed from a direction inclined to the other side of the third direction with respect to a normal line direction of the second main surface. The object to be exposed has side surfaces connected to the first main surface and the second main surface;
The first main surface and the first portion of the side surface are exposed by the first exposure light,
The exposure apparatus according to claim 1, wherein the second main surface and the second portion of the side surface are exposed by the second exposure light.   The exposure apparatus according to claim 2, wherein at least one of the first part and the second part includes a plurality of surfaces having different normal directions.   The exposure apparatus according to claim 1, wherein the second direction is along the first direction.   5. The exposure apparatus according to claim 1, wherein a scanning center axis of the first exposure light and a scanning center axis of the second exposure light are along the same straight line. 6.   The exposure apparatus according to any one of claims 1 to 5, further comprising an incident angle adjusting unit capable of adjusting the incident angle of at least one of the first exposure light and the second exposure light. The first exposure light that scans in the first direction is incident from the first main surface side of the object to be exposed, and the second exposure light that scans in the second direction is the second main surface side opposite to the first main surface. And exposing the object to be exposed by moving the incident positions of the first exposure light and the second exposure light in a third direction intersecting the first direction and the second direction. ,
In the step, the first exposure light is incident on the object to be exposed from a direction inclined to one side of the third direction with respect to a normal direction of the first main surface, and the second exposure light is An exposure method, wherein the exposure object is incident from a direction inclined to the other side of the third direction with respect to a normal direction of the second main surface. The object to be exposed has side surfaces connected to the first main surface and the second main surface;
The first exposure light exposes the first main surface and the first portion of the side surface,
The exposure method according to claim 7, wherein the second exposure light exposes the second main surface and a second portion of the side surface.

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