JP2017183808A - Crystal element and crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal element capable of reducing an electrical characteristic change caused by reflecting vibrations that are propagated from a part of a crystal piece held between excitation electrode parts on a side face of a projection, and a crystal device.SOLUTION: The present invention relates to a crystal element 120 comprising: a mesa-shaped crystal piece 121 comprising a vibration part 122 which includes a first projection 122a and a second projection 122b and is formed substantially rectangular in a plan view; excitation electrode parts 126 provided on both principal surfaces of the vibration part 122; drawing parts 128 that are provided side by side along one predetermined side of the crystal piece 121; and a wiring part 127 connecting the excitation electrode parts with the drawing parts 128. The first projection 122a and the second projection 122b include inclined side faces, a side face of the first projection 122a position at a +X side is overlapped with a side face of the second projection 122b positioned at the +X side, and a side face of the first projection 122a positioned at a -X side is overlapped with a side face of the second projection 122b positioned at the -X side.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a crystal element and a crystal device having the crystal element. The crystal device is, for example, a crystal resonator or a crystal oscillator.

  The quartz crystal element is composed of, for example, a mesa-shaped quartz plate having a substantially rectangular shape in plan view, and a metal pattern provided on the quartz piece. The metal pattern includes a pair of excitation electrode portions, a pair of lead portions, and a pair of wiring portions. The pair of excitation electrode portions is provided on both main surfaces of the crystal piece. The pair of lead portions are for mounting the crystal element on the element mounting member, and are arranged to face the mounting pads of the element mounting member. One end of the pair of wiring portions is connected to the excitation electrode portion, and the other end is connected to the extraction portion. The crystal element is supported like a cantilever beam by mounting the lead portion and the mounting pad of the element mounting member electrically with a conductive adhesive, and is mounted on the element mounting member.

The crystal piece used in such a crystal element includes, for example, a vibration part including a pair of protrusions protruding in directions facing each other, and a periphery which is thinner than the vibration part and is provided along the outer edge of the vibration part Part. At this time, the long side of the crystal piece is parallel to the X axis, which is one of the crystal axes of the crystal piece, and the short side of the crystal piece rotates about the Z axis, which is one of the crystal axes of the crystal piece. It is parallel to the Z ′ axis. When one convex portion is in a direction parallel to the Z′-axis and in a cross-sectional view in the thickness direction of the crystal piece, a side surface that is inclined with respect to the main surface of the one convex portion and a main surface of the one convex portion And a side surface that is perpendicular to the surface. When the other convex portion is viewed in cross-section in the direction parallel to the Z ′ axis and in the thickness direction of the crystal piece,
It has a side surface inclined with respect to the main surface of the other convex portion and a side surface inclined with respect to the main surface of the other convex portion.
In a plan view in the thickness direction, the side surface inclined with respect to the main surface of the convex portion of one main surface and the side surface perpendicular to the main surface of the convex portion of the other main surface overlap. The side surface perpendicular to the main surface of the convex portion of one main surface and the side surface perpendicular to the main surface of the convex portion of the other main surface overlap. (For example, refer to Patent Document 1).

JP 2013-197621 A

Such a crystal element is configured such that when an alternating voltage is applied to the metal pattern, a part of the crystal piece sandwiched between the pair of excitation electrode portions vibrates. At this time, the pair of excitation electrode portions The vibrations sandwiched between the electrodes propagate in a direction from the outer edge of the excitation electrode portion toward the outer edge of the crystal piece, specifically, the side surface of the convex portion in plan view. When vibration is propagated to the outer edge of the crystal piece, specifically, to the side surface of the convex portion, the vibration is reflected on the side surface of the convex portion.
The conventional quartz element has one convex portion having a side surface perpendicular to the main surface of one convex portion and the other side having a side surface perpendicular to the main surface of the other convex portion. A crystal piece having a convex part of
Excitation electrode portions are provided on both main surfaces of the crystal piece, that is, the main surface of one convex portion and the main surface of the other convex portion. For this reason, the vibration propagated from a part of the crystal piece sandwiched between the pair of excitation electrode portions is a side surface that is perpendicular to the main surface of the convex portion and is inclined with respect to the main surface of the convex portion. In comparison, the amount of reflection increases, and the vibration of a part of the crystal piece sandwiched between the excitation electrode portions and the reflected vibration are combined. As a result, the equivalent series resistance value may increase and the electrical characteristics may deteriorate.

  In the present invention, a quartz crystal element capable of reducing a change in electrical characteristics caused by a vibration propagated from a part of a quartz piece sandwiched between excitation electrodes being reflected on a side surface of a convex portion, and An object is to provide a crystal device.

In order to solve the above-described problems, a quartz crystal element according to the present invention includes a vibrating portion having a first convex portion and a second convex portion protruding in directions facing each other, and a vibrating portion disposed along an outer edge of the vibrating portion. A crystal piece having a thinner peripheral portion and having a substantially rectangular shape in plan view, a pair of excitation electrode portions provided on the upper surface of the first convex portion and the lower surface of the second convex portion,
A crystal element comprising a pair of lead portions provided side by side along a predetermined side of a crystal piece, and a wiring portion having one end connected to the excitation electrode portion and the other end connected to the lead portion The first convex portion is opposed to the first side surface inclined with respect to the upper surface of the first convex portion provided with the excitation electrode portion, the first side surface in a predetermined direction,
A second side surface that faces the upper surface of the first convex portion on which the excitation electrode portion is provided, and the second convex portion is relative to the lower surface of the second convex portion on which the excitation electrode portion is provided. A third side surface that is inclined, and a fourth side surface that faces the third side surface in a predetermined direction and faces the lower surface of the second convex portion provided with the excitation electrode portion. Is arranged so as to overlap with the third side surface in a plan view in the thickness direction of the crystal piece, and the second side surface is arranged so as to overlap with the fourth side surface in a plan view in the thickness direction of the crystal piece. .

The quartz crystal device according to the present invention includes a vibrating part having a first convex part and a second convex part protruding in directions facing each other, and a peripheral part arranged along the outer edge of the vibrating part and having a thickness smaller than the vibrating part, A crystal piece having a substantially rectangular shape in plan view, a pair of excitation electrode portions provided on the upper surface of the first convex portion and the lower surface of the second convex portion, and aligned along a predetermined side of the crystal piece A quartz element comprising: a pair of lead portions provided at one end; a wiring portion having one end connected to the excitation electrode portion and the other end connected to the lead portion;
The first convex part is opposed to the first side face inclined with respect to the upper surface of the first convex part provided with the excitation electrode part, the first side face in a predetermined direction, and the excitation electrode part is provided. A second side surface with respect to the upper surface of the first convex portion,
The second convex portion is opposed to the third side surface inclined with respect to the lower surface of the second convex portion provided with the excitation electrode portion, the third side surface in a predetermined direction, and the excitation electrode portion is A fourth side surface facing the lower surface of the second convex portion provided, and the first side surface is arranged to overlap the third side surface in a plan view in the thickness direction of the crystal piece, The second side surface is disposed so as to overlap the fourth side surface in plan view in the thickness direction of the crystal piece. Therefore, while the first side surface and the second side surface are inclined with respect to the upper surface of the first convex portion,
The third side surface and the fourth side surface are inclined with respect to the lower surface of the second convex portion. For this reason, in the crystal element according to the present invention, the first side surface or the second side surface is perpendicular to the upper surface of the first convex portion, and the third side surface or the fourth side surface is the lower surface of the second convex portion. Compared to the vertical case,
The amount of vibration propagated from the portion sandwiched between the excitation electrode portions can be reduced by the first side surface, the second side surface, the third side surface, and the fourth side surface. It is possible to suppress the amount of deterioration of the electrical characteristics due to the vibration reflected on the third side surface and the fourth side surface.

It is a perspective view of the quartz crystal device concerning this embodiment. It is sectional drawing in the AA cross section of FIG. (A) is a top view of the upper surface of the crystal element which concerns on this embodiment, (b) is the plane perspective view which saw through the lower surface of the crystal element which concerns on this embodiment from the upper surface. (A) is a top view of the upper surface of a crystal piece, (b) is the plane perspective view which saw through the lower surface of the crystal piece from the upper surface. It is sectional drawing in the BB cross section of Fig.4 (a) for demonstrating the angle of the main surface and side surface of a convex part. It is sectional drawing in the BB cross section of Fig.4 (a) for demonstrating the distance from the predetermined other one side of a crystal piece to a side surface.

  FIG. 1 is a perspective view of a quartz crystal device according to the present embodiment, and FIG. 2 is a cross-sectional view taken along a line AA in FIG. FIG. 3 is a plan view of the crystal element 120 according to the present embodiment, and FIG. 4 is a plan view of the crystal piece 121. 5 and 6 are cross-sectional views of the crystal piece 121 in the BB cross section.

(Schematic configuration of crystal device)
A crystal device is an electronic component having a substantially rectangular parallelepiped shape as a whole, for example. For example, the quartz device has a long side or short side length of 0.6 mm to 2.0 mm, and a vertical thickness of 0.2 mm to 1.5 mm.

  The quartz crystal device includes, for example, an element mounting member 110 in which a recess is formed, a crystal element 120 accommodated in the recess, a lid 130 that closes the recess, and a crystal element 120 for adhesively mounting the element mounting member 110 on the element mounting member 110. And a conductive adhesive 140.

  The concave portion of the element mounting member 110 is sealed with a lid 130, and the inside thereof is, for example, evacuated or filled with an appropriate gas (for example, nitrogen).

  The element mounting member 110 includes, for example, a base 110a that is the main body of the element mounting member 110, a frame 110b that is provided along the edge of the upper surface of the base 110a, and a mounting pad 111 for mounting the crystal element 120. And an external terminal 112 for mounting the crystal device on a circuit board (not shown) or the like. In the element mounting member 110, the base body 110a is provided with a frame-like frame body 110b along the edge of the upper surface of the base body 110a to form a recess.

  The base 110a and the frame 110b are made of an insulating material such as a ceramic material. The mounting pad 111 and the external terminal 112 are made of, for example, a conductive layer made of metal or the like, and are electrically connected to each other by a conductor (not shown) disposed in the base 110a. The lid 130 is made of, for example, metal, and is joined to the element mounting member 110, specifically, the upper surface of the frame 110b by seam welding or the like.

  The crystal element 120 has, for example, a pair of excitation electrode portions 123 for applying a voltage to the crystal piece 121 and a pair of wiring portions 127 for mounting the crystal element 120 on the mounting pad 111. .

  The crystal piece 121 is a so-called AT-cut crystal piece. That is, in quartz, an orthogonal coordinate system XYZ composed of an X axis (electrical axis), a Y axis (mechanical axis), and a Z axis (optical axis) is 30 ° to 50 ° around the X axis (as an example, 35 ° 15 ′) When a rectangular coordinate system XY′Z ′ is defined by being rotated, it is a plate shape cut out parallel to the XZ ′ plane.

  The pair of excitation electrodes 126 and the pair of wiring portions 127 are configured by conductivity made of metal or the like. The pair of excitation electrode portions 126 is provided, for example, on the center side of both main surfaces of the crystal piece 121. The pair of wiring parts 127, for example, extends from the excitation electrode part 126 to one side in the X-axis direction (for example, the −X direction side), and a pair of lead-outs along the end of a predetermined side of the crystal piece 121. Part 128.

  The crystal element 120 is accommodated in the recess of the element mounting member 110 with the main surface facing the upper surface of the base 110 a of the element mounting member 110. The lead portion 128 is bonded to the mounting pad 111 provided on the base 110 a of the element mounting member 110 by the conductive adhesive 140. Thereby, the crystal element 120 is supported by the element mounting member 110 like a cantilever. Further, the pair of excitation electrode portions 126 is electrically connected to the pair of mounting pads 111 of the element mounting member 110, and as a result, is electrically connected to any two of the plurality of external terminals 112 of the element mounting member 110. .

  The crystal device configured in this way is disposed, for example, with the mounting surface of the circuit board (not shown) facing the lower surface of the element mounting member, and the external terminals 112 are joined to the pads of the circuit board by soldering or the like. Is mounted on the circuit board. For example, an oscillation circuit is configured on the circuit board. The oscillation circuit applies an alternating voltage to the pair of excitation electrode portions 126 via the external terminal 112 and the mounting pad 111 to generate an oscillation signal. At this time, for example, the oscillation circuit uses fundamental wave vibration among thickness shear vibrations of the crystal piece 121.

(Shape of crystal element)
3A is a plan view of the crystal element 120 viewed from above, and FIG. 3B is a plan perspective view of the crystal element 120 viewed from above. FIG. 4A is a plan view of the top surface of the crystal piece viewed in plan, and FIG. 4B is a plan perspective view of the bottom surface of the crystal piece 121 seen through from the top. 5 and 6 are cross-sectional views taken along the line BB.

  In the present embodiment, when the crystal element 120 is mounted on the element mounting member 110, the surface substantially parallel to the upper surface of the base 110 a of the element mounting member 110 is a main surface, and the crystal mounting element 110 to the element mounting member 110 are arranged. The direction toward the base 110a will be described as a downward direction, and the direction from the base 110a of the element mounting member 110 toward the crystal element 120 will be described as an upward direction.

The surface of the crystal element 120 facing the base 110a of the element mounting member 110 is the lower surface of the crystal element 120, the surface of the crystal element 120 facing the opposite side of the lower surface of the crystal element 120 is the upper surface of the crystal element 120, and the upper surface of the crystal element 120 The lower surface of the crystal element 120 is the main surface of the crystal element 120. Similarly, the surface of the crystal piece 121 facing the base 110a of the element mounting member 110a is the lower surface of the crystal piece 121, the surface of the crystal piece 121 facing the lower surface of the crystal piece 121 is the upper surface of the crystal piece 121, and the crystal piece The upper surface of 121 and the lower surface of the crystal piece 121 are defined as the main surface of the crystal piece 121.
Similarly, the surface of the vibration part 122 facing the base 110a of the element mounting member 110a is the lower surface of the vibration part 122, the surface of the vibration part 122 facing the lower surface of the vibration part 122 is the upper surface of the vibration part 122,
The upper surface of the vibration part 122 and the lower surface of the vibration part 122 are defined as the main surface of the vibration part 122.

  Moreover, the convex part provided in the vibration part 122, and the convex part protruding to the opposite side of the base 110a of the element mounting member 110a is defined as the first convex part 122a, and the convex part protruding to the base 110a side of the element mounting member 110a. The projecting portion is the second projecting portion 122b. At this time, the surface of the first convex portion 122a that is substantially parallel to the upper surface of the base 110a of the element mounting member 110a is the main surface of the first convex portion 122a, and is substantially parallel to the upper surface of the base 110a of the element mounting member 110a. Let the surface of the 2nd convex part 122b which is formed be the main surface of the 2nd convex part 122b.

  In addition, the upper surface of the vibration part 122a and the main surface of the first convex part 122a are used in the same meaning, and the upper surface of the crystal element 120 and the upper surface of the crystal piece 121 are used in the same meaning. Moreover, the upper surface of the crystal element 120, the upper surface of the crystal piece 121, the upper surface of the vibration part 122, and the main surface of the 1st convex part 122a are located on the same plane. Moreover, the lower surface of the vibration part 122a and the main surface of the second convex part 122b are used in the same meaning, and the lower surface of the crystal element 120 and the lower surface of the crystal piece 121 are used in the same meaning. Moreover, the lower surface of the crystal element 120, the lower surface of the crystal piece 121, the lower surface of the vibration part 122, and the main surface of the second convex part 122b are located on the same plane.

  The crystal element 120 includes a crystal piece 121 having a first convex portion 122a and a second convex portion 122b, and a metal pattern 125 including an excitation electrode portion 126, a wiring portion 127, and a lead portion 128.

  The crystal piece 121 is of a so-called mesa type, and is composed of a vibrating portion having a first convex portion 122a and a second convex portion 122b that protrude in opposite directions, an inclined portion 123, and a peripheral portion 124. By adopting such a shape, the energy confinement effect can be improved as compared with the case where a flat crystal piece is used, and as a result, the equivalent series resistance value can be reduced. The shape of the crystal piece 121 is substantially rectangular when viewed in plan, and its main surface is a rectangle having a long side parallel to the X axis and a short side parallel to the Z ′ axis. Such a crystal piece 121 has a longitudinal direction in the X-axis direction.

  The vibration unit 122 is, for example, a thin rectangular parallelepiped having a pair of main surfaces parallel to the XZ ′ plane, and the main surface is a rectangle having a long side parallel to the X axis and a short side parallel to the Z ′ axis. . A pair of excitation electrode portions 126 is provided on both main surfaces of the vibrating portion 122 (the main surface of the first convex portion 122a and the main surface of the second convex portion 122b). When an alternating voltage is applied to the pair of excitation electrode portions 126, a part of the vibration portion 122 sandwiched between the excitation electrode portions 126 is thickened by a reverse piezoelectric effect and a piezoelectric effect. Can slide and vibrate. At this time, the thickness shear vibration propagates from the portion sandwiched between the excitation electrode portions 126 to the outer edge side of the vibration portion 122 not sandwiched between the excitation electrode portions 126.

  As described above, in the present embodiment, the convex portion provided in the vibration portion 122 and protruding to the opposite side of the base 110a of the element mounting member 110a is the first convex portion 122a, and the element mounting is performed. The convex part which protrudes to the base | substrate 110a side of the base | substrate 110a of the member 110a is made into the 2nd convex part 122b.

  The first convex part 122a is a convex part protruding upward. As shown in FIG. 3A, the first convex portion 122a is a rectangle having a long side parallel to the X axis and a short side parallel to the Z ′ axis when the top surface of the crystal piece 121 is viewed in plan. ing. In addition, an inclined portion 123 (first inclined portion 123a) is provided along the outer edge of the first convex portion 122a.

  The second convex part 122b is a convex part protruding downward. As shown in FIG. 3B, the second convex portion 122 b has a long side parallel to the X axis and a short side parallel to the Z ′ axis when the lower surface of the crystal piece 121 is seen through the upper surface of the crystal piece 121. It is a rectangle with sides. Moreover, the main surface of the 2nd convex part 122b is parallel to the main surface of the 1st convex part 122a, as shown in FIG. In addition, an inclined portion 123 (second inclined portion 123b) is provided along the outer edge of the second convex portion 122b.

  The inclined part 123 has a first inclined part 123a and a second inclined part 123b. As shown in FIGS. 5 and 6, the thickness of the inclined portion 123 in the vertical direction is gradually reduced in the direction from the vibrating portion 122 toward the peripheral portion 124 when the crystal piece 121 is viewed in cross section. The first inclined portion 123a is a part of the inclined portion 123 provided along the outer edge of the first convex portion 122a. The second inclined portion 123b is a part of the inclined portion 123 provided along the outer edge of the second convex portion 122b.

  Here, as shown in FIG. 5, when the crystal piece 121 is viewed in cross-section on the XY ′ plane (a plane parallel to the X axis and the Y ′ axis), the first inclined portion 123a (along the first convex portion 122a). The side surface of the inclined portion 123) provided in the + X axis direction is defined as a first side surface S11, and the side surface of the first inclined portion 123a and positioned in the −X axis direction is defined as a second side surface S12. Further, as shown in FIGS. 4 and 5, when the crystal piece 121 is viewed in cross section on the XY ′ plane, it is the second inclined portion 123b (the inclined portion 123 provided along the second convex portion 122b). The side surface positioned in the + X-axis direction is referred to as a third side surface S13, and the side surface of the second inclined portion 123b that is positioned in the −X-axis direction is referred to as a fourth side surface S14.

  As shown in FIG. 5, the first side surface S <b> 11 is located on the + X axis side of the surface parallel to the Z ′ axis of the first inclined portion 123 a when the upper surface of the crystal piece 121 is viewed in plan. It is a surface. That is, the first side surface S11 is positioned on the positive direction side of the X axis with respect to a virtual line CLU perpendicular to the X axis that passes through the center CU of the main surface of the first convex portion 122a (the upper surface of the vibrating portion 122). doing. The angle formed by the first side surface S11 and the main surface of the first convex portion 122a is an obtuse angle (an angle larger than 90 ° and smaller than 180 °), specifically, 135 ° to 155 °. .

  As shown in FIG. 5, the second side surface S12 is located on the −X axis side of the surface parallel to the Z ′ axis of the first inclined portion 123a when the upper surface of the crystal piece 121 is viewed in plan. It is a surface. That is, the second side surface S12 is positioned on the negative direction side of the X axis with respect to the virtual line CLU perpendicular to the X axis passing through the center CU of the main surface of the first convex portion 122a (the upper surface of the vibrating portion 122). doing. The angle formed between the second side surface S12 and the main surface of the first convex portion 122a is an obtuse angle (an angle larger than 90 ° and smaller than 180 °), specifically 150 ° to 170 °. .

  As shown in FIG. 5, the third side surface S13 is located on the + X-axis side of the surface parallel to the Z′-axis of the second inclined portion 123b when the lower surface is seen through from the upper surface of the crystal piece 121. It is the surface that is doing. In other words, the third side surface S13 is positioned on the positive direction side of the X axis with respect to a virtual line CLD perpendicular to the X axis passing through the center CD of the main surface of the second convex portion 122b (the lower surface of the vibrating portion 122). doing. The angle formed by the third side surface S13 and the main surface of the second convex portion 122b is an obtuse angle (an angle greater than 90 ° and smaller than 180 °), specifically, 150 ° to 170 °. . Further, as shown in FIGS. 5 and 6, when the crystal piece 121 is viewed in cross section on the XY ′ plane (a plane parallel to the X axis and the Y ′ axis), the third side surface S13 is vertically It is located at the position that overlaps.

  As shown in 5, the fourth side surface S14 is located on the −X axis side of the plane parallel to the Z ′ axis of the second inclined portion 123b when the lower surface is seen through from the upper surface of the crystal piece 121. It is the surface that is. That is, the third side surface S14 is positioned on the negative direction side of the X axis with respect to a virtual line CLD perpendicular to the X axis that passes through the center CD of the main surface of the second convex portion 122b (the lower surface of the vibrating portion 122). doing. The angle formed by the fourth side surface S14 and the main surface of the second convex portion 122b is an obtuse angle (an angle larger than 90 ° and smaller than 180 °), specifically, 135 ° to 155 °. . Further, as shown in FIGS. 5 and 6, when the crystal piece 121 is viewed in a cross section on the XY ′ plane (a plane parallel to the X axis and the Y ′ axis), the fourth side surface S14 is vertically aligned with the second side surface S12. It is located at a position that overlaps the direction.

Therefore, as shown in FIGS. 5 and 6, when the crystal piece 121 is viewed in cross section, the first side surface S11 and the third side surface S13 are positioned in the vertical direction, while the second side surface S12 and the fourth side surface S14. Is positioned vertically. From another viewpoint, when the crystal piece 121 is seen through on a plane, the second side surface S12 and the fourth side surface S14 overlap while the first side surface S11 and the third side surface S13 overlap. By doing in this way, when the vibration propagated in the direction from the outer edge of the excitation electrode part 126 toward the outer edge of the vibration part 122 in a plan view from the portion sandwiched between the excitation electrode parts 126, An angle formed by the propagation direction and the side surface (first side surface S11, second side surface S12, third side surface S13, or fourth side surface S14),
Since the side surfaces (the first side surface, the second side surface, the third side surface, or the fourth side surface) can be reduced as compared with the case where the side surfaces are vertical, the first side surface S11, the second side surface S12, and the third side surface S13. In addition, the amount reflected by the fourth side surface S14 can be reduced, and the amount by which the electrical characteristics deteriorate due to the vibration reflected by the first side surface S11, the second side surface S12, the third side surface S13, and the fourth side surface S14 is suppressed. It becomes possible.

Further, in the crystal piece 121 of the present embodiment, the first side surface S11 and the third side surface S13 are positioned in the up-down direction when viewed in cross section on the XY ′ plane (surface parallel to the X axis and the Y ′ axis). The second side surface S12 and the fourth side surface S14 are positioned in the vertical direction. In other words, the crystal piece 121 is positive in the X axis with respect to a virtual line CLU in which the first side surface S11 passes through the center CU of the main surface of the first convex portion 122a and is perpendicular to the X axis. Located on the direction side, the second side surface S12 passes through the center CU of the main surface of the first convex portion 122a and is located on the negative direction side of the X axis with respect to the virtual line CLU perpendicular to the X axis, The third side surface S13 passes through the center CD of the main surface of the second convex portion 122b,
Positioned on the positive direction side of the X axis with respect to a virtual line CLD perpendicular to the X axis, the fourth side surface S14 passes through the center CD of the main surface of the second convex portion 122b,
It is located on the negative direction side of the X axis with respect to a virtual line CLD perpendicular to the X axis. By doing in this way, the part which is pinched | interposed into the excitation electrode part 126 by reducing the vibration reflected by the side surface (1st side surface S11, 2nd side surface S12, 3rd side surface S13, or 4th side surface S14). The effect on the thickness-shear vibration can be reduced, and the amount of deterioration of the electrical characteristics can be suppressed. In general, when a voltage is applied to the excitation electrode portion 126 to cause part of the vibration portion 122 sandwiched between the excitation electrode portions 126 to undergo thickness-shear vibration, the vibration displacement is the center in the direction parallel to the X axis. The department is the largest. For this reason, the vibration reflected and propagated from the side surface in the direction parallel to the X axis easily affects the thickness shear vibration of the portion sandwiched between the excitation electrode portions 126. That means
In the present embodiment, the first side surface S11 and the third side surface S13 are positioned in the vertical direction when viewed in cross section on the XY ′ plane (surface parallel to the X axis and the Y ′ axis), and the second side surface S12 When the fourth side surface S14 is positioned in the vertical direction, the side surfaces (first side surface S11, second side surface S12, By reducing the vibration reflected by the third side surface S13 or the fourth side surface S14), the influence on the thickness shear vibration of the portion sandwiched between the excitation electrode portions 126 can be reduced, and the electrical characteristics can be reduced. The amount of deterioration can be suppressed.

Further, in the crystal piece 121 of the present embodiment, the angle formed between the main surface of the first convex portion 122a and the first side surface S11 when viewed in cross section on the XY ′ plane (a surface parallel to the X axis and the Y ′ axis). Is an obtuse angle (an angle greater than 90 ° and less than 180 °), the angle formed by the main surface of the first convex portion 122a and the second side surface S12 is an obtuse angle, and the main surface of the second convex portion 122b And the third side surface S13 is an obtuse angle, and the angle formed by the main surface of the second convex portion 122b and the fourth side surface S14 is an obtuse angle. By doing in this way, from the portion sandwiched between the excitation electrode portion 126, when the crystal element 120 is viewed in plan and propagates in the direction from the outer edge of the excitation electrode portion 126 toward the outer edge of the vibration portion 122,
The side surface (first side surface, second side surface, third side surface or fourth side surface) has an angle formed by the propagation direction and the side surface (first side surface S11, second side surface S12, third side surface S13 or fourth side surface S14). Since it can be further reduced compared to the case where it is vertical, the amount of reflection on the first side surface S11, the second side surface S12, the third side surface S13, and the fourth side surface S14 can be reduced. It is possible to further suppress the amount of deterioration of the electrical characteristics due to the vibrations reflected by the first side surface S11, the second side surface S12, the third side surface S13, and the fourth side surface S14.

Specifically, in the crystal piece 121 according to the present embodiment, the angle between the main surface of the first convex portion 122a and the first side surface S11 is 135 ° to 155 °, and the main surface of the first convex portion 122a. And the second side S12 is 150 ° to 170 °, the angle between the main surface of the second convex portion 122b and the third side S13 is 150 ° to 170 °, and the second convex portion The angle formed between the main surface of 122b and the fourth side surface S14 is 135 ° to 155 °. In this way, when a voltage is applied to the excitation electrode portion 126 and a part of the vibration portion 122 sandwiched between the excitation electrode portions 126 is subjected to thickness-shear vibration, the side surface (first side surface S11, The amount of vibration reflected by the second side surface S12, the third side surface S13 or the fourth side surface S14) can be reduced in the direction parallel to the X axis,
The amount of deterioration of electrical characteristics can be further suppressed. In particular, since the angle with the side surface and the way of propagation of the thickness shear vibration are determined by the cut angle of the quartz wafer, in this embodiment, the electrical characteristics are deteriorated by determining the side surface angle in this way. The amount is suppressed. The tolerance of the angle formed is within ± 3 °.

  The peripheral portion 124 is provided along the outer edge of the inclined portion 123 in plan view of the crystal piece 121. The vertical thickness of the peripheral portion 124 is thinner than the vertical thickness of the vibrating portion 122 (the distance from the main surface of the first convex portion 122a to the main surface of the second convex portion 122b).

  As shown in FIG. 4A, when the upper surface of the crystal piece 121 is viewed in plan, it is opposed to a predetermined other side of the crystal piece 121 (a predetermined one side of the crystal piece 121 in which the lead-out portion 128 is arranged side by side). The distance D11 (+) from the other side of the crystal piece 121 to the negative direction side of the X-axis. The distance to the first side surface S11 is shorter than the distance to the distance D11 (−). Further, the distance D12 (+) from the other predetermined side of the crystal piece 121 to the second side face D12 located on the positive direction side of the X-axis is from the predetermined other side of the crystal piece 121 to the X side. It is shorter than the distance to the distance D12 (−) to the second side surface S12 located on the negative direction side of the shaft.

  As shown in FIG. 4B, when the lower surface of the crystal piece 121 is seen through from the upper surface side, the third side surface located on the positive direction side of the X axis from the other predetermined side of the crystal piece 121 The distance D13 (+) to S13 is shorter than the distance from the predetermined other side of the crystal piece 121 to the distance D13 (−) from the third side surface S13 located on the negative direction side of the X axis. ing. Further, the distance D14 (+) from the other predetermined side of the crystal piece 121 to the fourth side surface S14 located on the positive direction side of the X axis is from the predetermined other side of the crystal piece 121 to the X side. The distance is shorter than the distance to the distance D14 (−) to the fourth side surface S14 located on the negative direction side of the shaft.

4 and 6, the crystal piece 121 is a distance D13 (+) from the other predetermined side of the crystal piece 121 to the third side surface S13 located on the positive direction side of the X axis. However, the distance is shorter than the distance D11 (−) from the other predetermined side of the crystal piece 121 to the first side surface S11 located on the negative direction side of the X axis. Also, as shown in FIGS. 4 and 6, the distance D14 (+) from the other predetermined side of the crystal piece 121 to the fourth side surface S14 located on the positive direction side of the X axis is the crystal The distance is shorter than the distance D12 (−) from the other predetermined side of the piece 121 to the second side surface S12 located on the negative direction side of the X axis. That is, the crystal piece 121 is a virtual line CLU,
When the side perpendicular to the X axis located on the positive direction side of the X axis from the CLD is the other predetermined side of the crystal piece 121, the predetermined other side and the third side surface S13 close to the predetermined other side. The distance (D13 (+)) with the other side is shorter than the distance (D11 (−)) between the predetermined other side and the side of the first side surface S11 that is separated from the predetermined other side, The second side surface S12 in which the distance (D14 (+)) between the predetermined other side and the side of the fourth side S14 close to the predetermined other side is separated from the predetermined other side. It is shorter than the distance (D12 (−)) to the side.

Thus, when the crystal piece 121 is viewed in cross section, the second side surface S12 and the fourth side surface S14 are positioned in the vertical direction while the first side surface S11 and the third side surface S13 are positioned in the vertical direction. be able to. From another viewpoint, when the crystal piece 121 is seen through on a plane, the second side surface S12 and the fourth side surface S14 can overlap while the first side surface S11 and the third side surface S12 overlap. That is, in this way, when the crystal element 120 is viewed in plan from the portion sandwiched between the excitation electrode portions 126 and propagates in the direction from the outer edge of the excitation electrode portion 126 toward the outer edge of the vibration portion 122, An angle formed by the propagation direction and the side surface (first side surface S11, second side surface S12, third side surface S13, or fourth side surface S14),
Since the side surfaces (the first side surface, the second side surface, the third side surface, or the fourth side surface) can be reduced as compared with the case where the side surfaces are vertical, the first side surface S11, the second side surface S12, and the third side surface S13. In addition, the amount reflected by the fourth side surface S14 can be reduced, and the amount by which the electrical characteristics deteriorate due to the vibration reflected by the first side surface S11, the second side surface S12, the third side surface S13, and the fourth side surface S14 is suppressed. It becomes possible.

The crystal piece 121 has a distance D11 (−) from the other predetermined side of the crystal piece 121 to the first side surface S11 located on the negative direction side of the X axis, and the other predetermined side of the crystal piece 121. To the third side surface S13 located on the negative direction side of the X axis is equal to the distance D13 (−). That is, in the crystal piece 121, the distance (D11 (−)) between the predetermined other side and the side of the first side surface S11 far from the predetermined other side is the predetermined other side and the predetermined other side. Is equal to the distance (D13 (−)) from the side of the third side S13 far from the distance, and the distance (D14 (+) between the other predetermined side and the side of the second side S12 close to the predetermined other side. )) Is equal to the distance (D12 (+)) between the other predetermined side and the side of the fourth side S14 close to the predetermined other side.
Further, the crystal piece 121 includes a distance D12 (+) from the other predetermined side of the crystal piece 121 to the second side surface S12 positioned on the positive direction side of the X axis, and a predetermined other of the crystal piece 121. A distance D14 (+) from one side to the fourth side surface S14 located on the positive direction side of the X axis is equal. By doing in this way, when the crystal element 120 is seen through, the first side surface S11 located on the negative direction side of the X axis and the third side surface S13 located on the negative direction side of the X axis, The second side surface S12 positioned on the positive direction side of the X axis and the fourth side surface S24 positioned on the positive direction side of the X axis can be overlapped with each other. S11,
It is possible to reduce the amount of reflection on the second side surface S12, the third side surface S13, and the fourth side surface S14. As a result, it is possible to suppress the amount of deterioration of the electrical characteristics due to the vibration reflected by the first side surface S11, the second side surface S12, the third side surface S13, and the fourth side surface S14.

Here, a method of forming such a crystal piece 121 will be described. Such a method of forming the crystal piece 121 includes, for example, a crystal wafer preparation process, a first etching process, and a second etching process. In the crystal wafer preparation step, first, a crystal wafer having crystal axes composed of an X axis, a Y axis, and a Z axis orthogonal to each other is prepared. At this time, the thickness of the quartz wafer in the vertical direction is the same as the thickness of the vibrating portion 122 in the vertical direction. In addition, the main surface of the quartz wafer has the same cut angle as the main surface of the vibrating part 122. Therefore, the main surface of the quartz wafer is a surface obtained by rotating a plane parallel to the X-axis and the Z-axis by a predetermined angle counterclockwise around the X-axis and viewing the negative direction of the X-axis. It is parallel to. In the first etching process,
Photolithographic techniques and etching techniques are used. First, protective metal films are provided on both main surfaces of a quartz wafer, and a photosensitive resist is applied onto the protective metal film, and is exposed and developed in a predetermined pattern. At this time, when the crystal wafer is viewed in plan, the photosensitive resist remains in the portion that becomes the vibrating portion 122, and no photosensitive resist remains in the portions that become the inclined portion 123 and the peripheral portion 124. Thereafter, the crystal wafer is immersed in a predetermined etching solution, and the crystal wafer is etched until the vertical thickness of the etched crystal wafer becomes the vertical thickness of the peripheral portion 124. Finally, the photosensitive resist and the protective metal film remaining on the quartz wafer are peeled off. In the second etching step, a protective metal film is provided on both main surfaces of the crystal wafer after the first etching step,
A photosensitive resist is applied on the protective metal film, and is exposed and developed in a predetermined pattern. At this time, when the quartz wafer is viewed in plan, the photosensitive resist remains in the portion that becomes the quartz piece 121. Thereafter, the quartz wafer is etched by dipping in a predetermined etching solution. As described above, a plurality of crystal pieces 121 can be formed in a crystal wafer in a state where some of the crystal pieces 121 are connected.

Next, examples of each dimension of the crystal piece 121 will be described. The crystal piece 121 has a substantially rectangular shape in plan view, the long side dimension is 0.4 mm to 1.0 mm, and the short side dimension is 0.3 mm to 0.7 mm. It has become. The main surface of the first convex part 122a has a substantially rectangular shape, the dimension parallel to the long side of the crystal piece 121 is 0.2 mm to 0.8 mm, and is parallel to the short side of the crystal piece 121. Dimensions are 0.2 mm to 0.6 mm. The main surface of the second convex part 122b has a substantially rectangular shape, the dimension parallel to the long side of the crystal piece 121 is 0.2 mm to 0.8 mm, and is parallel to the short side of the crystal piece 121. Dimensions are 0.2 mm to 0.6 mm. The distance from the main surface of the first convex portion 122a to the second convex portion 122b (the thickness in the vertical direction of the vibrating portion 122) is
It is 30 μm to 70 μm. Further, the thickness of the peripheral portion 124 in the vertical direction is 10 μm to 65 μm.

The distance D11 (+) from the other predetermined side of the crystal piece 121 to the first side surface S11 located on the positive direction side of the X axis is 2 μm to 199 μm. A distance D11 (−) from the other side to the first side surface S11 located on the negative direction side of the X axis is 30 μm to 200 μm. The distance D12 (+) from the other predetermined side of the crystal piece 121 to the second side surface S12 located on the positive direction side of the X axis is 230 μm to 900 μm. A distance D12 (−) from the other side to the second side surface S12 located on the negative direction side of the X axis is 231 μm to 952 μm. The distance D13 (+) from the other predetermined side of the crystal piece 121 to the third side surface S13 located on the positive direction side of the X-axis is 2 μm to 199 μm. From the other side,
The distance D13 (−) to the third side surface S13 located on the negative direction side of the X axis is 30 μm to 200 μm. The distance D14 (+) from the other predetermined side of the crystal piece 121 to the fourth side surface S14 located on the positive direction side of the X axis is 230 μm to 900 μm. The distance D14 (−) from the other side to the fourth side surface S14 located on the negative direction side of the X axis is 231 μm to 965 μm.

The metal pattern 125 provided on the crystal piece 121 is for applying a voltage from the outside of the crystal element 120. The metal pattern 125 may be a single layer, or a plurality of metal layers may be laminated. Although not particularly illustrated, the metal pattern 125 includes, for example, a first metal layer and a second metal layer laminated on the first metal layer. For the first metal layer, a metal having good adhesion to the crystal is used, and for example, any one of nickel, chromium, or titanium is used. By using a metal having good adhesion to the crystal, a metal material that is difficult to adhere to the crystal can be used for the second metal layer. For the second metal layer, for example, any one of gold, an alloy containing gold, silver, or an alloy containing silver is used. Thus, the second metal layer is made of a stable material having a relatively low electrical resistivity among the metal materials. By using a material with a relatively low electrical resistivity,
The resistivity of the metal pattern 125 itself can be lowered, and as a result, the increase in the equivalent series resistance value of the crystal element 120 can be reduced. Further, by using a stable metal material for the second metal layer, the frequency of the crystal element 120 can be reduced as a result of the weight of the metal pattern 125 changing by reacting with the air around the crystal element 120. Can do.

  The excitation electrode unit 126 is for applying a voltage to the vibration unit 122. The excitation electrode portion 126 is a pair, and one excitation electrode portion 126 is provided on the upper surface of the vibrating portion 122 (the main surface of the first convex portion 122a), and the lower surface of the vibrating portion 122 (the second convex portion 122b). The other excitation electrode portion 126 is provided on the main surface. The excitation electrode portion 126 has a substantially rectangular shape when the crystal element 120 is viewed in plan. In addition, one excitation electrode portion 126 is provided such that the outer edge of one excitation electrode portion 126 is positioned inside the outer edge of the first convex portion 122, and the other excitation electrode portion 126 is provided with the other excitation electrode. The outer edge of the portion 126 is provided so as to be located inside the outer edge of the second convex portion 122b.

  The wiring part 127 is a pair and is used to apply a voltage to the excitation electrode part 126, and is provided on the surface of the crystal piece 121. One end of the wiring portion 127 is connected to the excitation electrode portion 126, and the other end is connected to a lead portion 128 provided along a predetermined side of the crystal piece 121.

  The lead portion 128 is connected to the wiring portion 127. When the crystal element 120 is used as a crystal device, the lead portion 128 is electrically bonded to the mounting pad 111 provided on the upper surface of the base 110a by the conductive adhesive 140. The drawer portions 128 are paired and are provided side by side along a predetermined side of the crystal piece 121.

Here, a method of forming the metal pattern 125 including the excitation electrode portion 126, the wiring portion 127, and the lead portion 128 on the crystal piece 121 will be described. Here, a case where the metal pattern 125 is integrally formed using a photolithography technique and an etching technique will be described as an example. First, a crystal wafer is prepared in a state where portions to be the crystal pieces 121 are connected, and a metal film to be a metal pattern 125 is formed on both main surfaces of the crystal wafer. Next, a photosensitive resist is applied on the metal film, and exposed to a predetermined pattern and developed. At this time, after development, the photosensitive resist remains in the portion that becomes the metal pattern 124. Thereafter, the film is immersed in a predetermined etching solution to remove a portion of the metal film where no photosensitive resist remains, and finally, the remaining photosensitive resist is removed. By doing this,
A metal pattern 125 is formed on a predetermined portion of the crystal piece 121. In addition, although the case where the excitation electrode part 126, the wiring part 127, and the extraction part 128 are formed at the same time is described, they may be formed separately, or sputtering may be performed without using the photolithography technique and the etching technique. A technique or a vapor deposition technique may be used, or a photolithography technique and an etching technique may be combined with a sputtering technique or a vapor deposition technique.

The quartz crystal element 120 according to the present embodiment is disposed along the outer edge of the vibrating part 122 and the vibrating part 122 having the first convex part 122a and the second convex part 122b protruding in a direction facing each other, and is thicker than the vibrating part 122. A crystal piece 121 having a thin peripheral portion 124 and having a substantially rectangular shape in plan view, and a pair of excitation electrode portions 126 provided on the upper surface of the first convex portion 122a and the lower surface of the second convex portion 122b. And a pair of lead portions 128 provided side by side along a predetermined side of the crystal piece 121, and a wiring portion having one end connected to the excitation electrode portion 126 and the other end connected to the lead portion 128. 127. The first convex portion 122a is opposed to the first side surface S11 inclined with respect to the upper surface of the first convex portion 122a provided with the excitation electrode portion 126, and the first side surface S11 in a predetermined direction.
A second side surface S12 facing the upper surface of the first convex portion 122a on which the excitation electrode portion 126 is provided, and the second convex portion 122b is a second convex portion on which the excitation electrode portion 126 is provided. A third side surface S13 that is inclined with respect to the lower surface of 122b, and a fourth surface that faces the third side surface S13 in a predetermined direction and faces the lower surface of the second convex portion 122b on which the excitation electrode portion 126 is provided. The first side surface S11 is disposed so as to overlap the third side surface S13 in plan view in the thickness direction of the crystal piece 121, and the second side surface S12 is disposed in the thickness direction of the crystal piece 121. It arrange | positions so that it may overlap with 4th side surface S14 by planar view.

  In this way, when the crystal element 120 is viewed in plan from the portion sandwiched between the excitation electrode portions 126 and propagates in the direction from the outer edge of the excitation electrode portion 126 toward the outer edge of the vibration portion 122, the propagation direction And the side surface (first side surface S11, second side surface S12, third side surface S13 or fourth side surface S14), and the side surface (first side surface, second side surface, third side surface or fourth side surface) is vertical. The amount of light reflected by the first side surface S11, the second side surface S12, the third side surface S13, and the fourth side surface S14 can be reduced, so that the first side surface S11, It is possible to suppress the amount of deterioration of electrical characteristics due to the vibrations reflected by the second side surface S12, the third side surface S13, and the fourth side surface S14.

Further, in the crystal element 120 according to the present embodiment, the first side surface S11 is positioned on the positive direction side of the X axis of the crystal axis of the crystal piece 121, and is parallel to a plane perpendicular to the X axis. The two side surfaces S12 are positioned on the negative direction side of the X axis of the crystal axis of the crystal piece 121 and are parallel to a plane perpendicular to the X axis, and the third side surface S13 is X of the crystal axis of the crystal piece 121. Located on the positive direction side of the axis and parallel to a plane perpendicular to the X axis, the fourth side surface S14 is located on the negative direction side of the X axis of the crystal axis of the crystal piece 121, and is on the X axis. It is parallel to a vertical plane. In other words, the crystal piece 121 has a first side surface S11 passing through the center CU of the main surface of the first convex portion 122a and a positive direction of the X axis with respect to a virtual line CLU perpendicular to the X axis in plan view. The second side surface S12 passes through the center CU of the main surface of the first convex portion 122a and is perpendicular to the X axis,
Positioned on the negative direction side of the X axis, the third side surface S13 passes through the center CD of the main surface of the second convex portion 122b, and is in the positive direction of the X axis with respect to a virtual line CLD perpendicular to the X axis. The fourth side surface S14 is located on the negative side of the X axis with respect to the imaginary line CLD passing through the center CD of the main surface of the two convex portions 122b and perpendicular to the X axis.

By doing in this way, the vibration reflected by the side surface (the first side surface S11, the second side surface S12, the third side surface S13, or the fourth side surface S14) is reduced, so that it is sandwiched between the excitation electrode portions 126. The influence on the thickness shear vibration of the portion can be reduced, and the amount of deterioration of the electrical characteristics can be suppressed. In general, when a voltage is applied to the excitation electrode portion 126 to cause part of the vibration portion 122 sandwiched between the excitation electrode portions 126 to undergo thickness-shear vibration, the vibration displacement is the center in the direction parallel to the X axis. The department is the largest. For this reason, the vibration reflected and propagated from the side surface in the direction parallel to the X axis easily affects the thickness shear vibration of the portion sandwiched between the excitation electrode portions 126. That is, in this embodiment, the XY ′ plane (a plane parallel to the X axis and the Y ′ axis).
When the cross-sectional view is taken, the first side surface S11 and the third side surface S13 are positioned in the vertical direction, and the second side surface S12 and the fourth side surface S14 are positioned in the vertical direction. Compared with the case where the vertical direction is positioned when viewed in cross section, the vibration reflected by the side surface (the first side surface S11, the second side surface S12, the third side surface S13, or the fourth side surface S14) is more excited. The influence on the thickness-shear vibration of the portion sandwiched between the two can be reduced, and the amount of deterioration of the electrical characteristics can be suppressed.

  Further, in the crystal element 120 according to the present embodiment, the angle between the upper surface of the first convex portion 122a provided with the excitation electrode portion 126 and the first side surface S11 is greater than 90 ° and smaller than 180 °. Specifically, the angle is 135 ° to 155 °. In addition, the angle between the top of the first convex portion 122a provided with the excitation electrode portion 126 and the second side surface S12 is greater than 90 ° and smaller than 180 °, specifically 150 ° to 170 °. It has become. Further, the angle between the lower surface of the second convex portion 122b on which the excitation electrode portion 126 is provided and the third side surface S13 is greater than 90 ° and smaller than 180 °, specifically 150 ° to 170 °. It has become. Further, the angle between the lower surface of the second convex portion 122b on which the excitation electrode portion 126 is provided and the fourth side surface S14 is greater than 90 ° and smaller than 180 °, specifically, 135 ° to 155 °. It has become.

  In this way, when the crystal element 120 is viewed in plan from the portion sandwiched between the excitation electrode portions 126 and propagates in the direction from the outer edge of the excitation electrode portion 126 toward the outer edge of the vibration portion 122, the propagation direction And the side surface (first side surface S11, second side surface S12, third side surface S13 or fourth side surface S14), and the side surface (first side surface, second side surface, third side surface or fourth side surface) is vertical. Compared with the case where it has become, since it can further reduce, the amount reflected on the first side surface S11, the second side surface S12, the third side surface S13 and the fourth side surface S14 can be reduced. It is possible to further suppress the amount of deterioration of the electrical characteristics due to the vibration reflected by the side surface S11, the second side surface S12, the third side surface S13, and the fourth side surface S14.

In addition, the crystal element 120 according to the present embodiment includes a crystal element 121 that is located on the positive side of the X axis that is the side of the crystal element 121 that is perpendicular to the X axis when the crystal element 120 is viewed in plan view. The distance D11 (+) from the predetermined other side to the side of the first side surface S11 located on the positive direction side of the X axis is positioned on the negative direction side of the X axis from the predetermined other side. The distance D13 (+) to the side of the third side surface S13 that is shorter than the distance D11 (−) to the first side surface S11 and is located on the positive direction side of the X axis is X from the other predetermined side. The distance is shorter than the distance D11 (−) to the first side surface S11 located on the negative direction side of the shaft. Further, the distance D14 (+) from the predetermined other side to the side of the fourth side surface S14 located on the positive direction side of the X axis is positioned on the negative direction side of the X axis from the predetermined other side. Shorter than the distance D14 (−) to the side of the fourth side S14
The distance D14 (+) from the predetermined other side to the side of the fourth side surface S14 located on the positive direction side of the X axis is the second side surface located on the negative direction side of the X axis. The distance is shorter than the distance D12 (−) to the side of S12. That is, the crystal piece 121 has a predetermined other one side when the side perpendicular to the X axis located on the positive direction side of the X axis from the virtual lines CLU and CLD is the predetermined other side of the crystal piece 121; The distance (D13 (+)) from the side of the third side S13 that is close to the other predetermined side is the distance (D11) between the predetermined other side and the side of the first side S11 that is away from the predetermined other side. (−)) Is shorter, and the distance (D14 (+)) between the predetermined other side and the side of the fourth side S14 close to the predetermined other side is equal to the predetermined other side and the predetermined side. It is shorter than the distance (D12 (−)) from the side of the second side surface S12 that is separated from the other side.

  In this way, when the crystal element 120 is viewed in plan from the portion sandwiched between the excitation electrode portions 126 and propagates in the direction from the outer edge of the excitation electrode portion 126 toward the outer edge of the vibration portion 122, the propagation direction And the side surface (first side surface S11, second side surface S12, third side surface S13 or fourth side surface S14), and the side surface (first side surface, second side surface, third side surface or fourth side surface) is vertical. The amount of light reflected by the first side surface S11, the second side surface S12, the third side surface S13, and the fourth side surface S14 can be reduced, so that the first side surface S11, It is possible to suppress the amount of deterioration of electrical characteristics due to the vibrations reflected by the second side surface S12, the third side surface S13, and the fourth side surface S14.

Further, in the crystal element 120 according to the present embodiment, when the crystal piece 121 is viewed in a cross-section along the XY ′ plane (a plane parallel to the X axis and the Y ′ axis), the X axis extends from a predetermined other side of the crystal piece 121. The third side surface S13 located on the negative direction side of the X-axis from the distance D11 (−) to the first side surface S11 located on the negative direction side and the predetermined other side of the crystal piece 121. Is equal to the distance D13 (−). Further, the crystal piece 121 includes a distance D12 (+) from the other predetermined side of the crystal piece 121 to the second side surface S12 positioned on the positive direction side of the X axis, and a predetermined other of the crystal piece 121. A distance D14 (+) from one side to the fourth side surface S14 located on the positive direction side of the X axis is equal. That is, the crystal piece 121 has a predetermined distance between a predetermined other side and a distance (D11 (−)) between the first side S11 far from the predetermined other side and the predetermined other side.
It is equal to the distance (D13 (−)) with the side of the third side S13 far from the other predetermined side, and the predetermined other one side and the side of the second side S12 close to the predetermined other side The distance (D14 (+)) is equal to the distance (D12 (+)) between the predetermined other side and the side of the fourth side surface S14 close to the predetermined other side.

  By doing in this way, when the crystal element 120 is seen through, the first side surface S11 located on the negative direction side of the X axis and the third side surface S13 located on the negative direction side of the X axis, The second side surface S12 positioned on the positive direction side of the X axis and the fourth side surface S14 positioned on the positive direction side of the X axis can be overlapped with each other. It is possible to reduce the amount of reflection at S11, second side surface S12, third side surface S13, and fourth side surface S14. As a result, it is possible to suppress the amount of deterioration of the electrical characteristics due to the vibration reflected by the first side surface S11, the second side surface S12, the third side surface S13, and the fourth side surface S14.

  The crystal device according to this embodiment includes such a crystal element 120, an element mounting member 110 on which the crystal element 120 is mounted, a lid 130 that is bonded to the element mounting member 110 and hermetically seals the crystal element 120, and , Is composed of. By doing so, the vibration propagated from a part of the crystal piece 121 sandwiched between the excitation electrode portions 126 is caused by reflection on the side surfaces of the first convex portion 122a and the second convex portion 122b. Changes in electrical characteristics can be reduced, and as a result, the equivalent series resistance value can be reduced.

  The present invention is not limited to the above embodiment, and may be implemented in various forms.

  A crystal device having a crystal element is not limited to a crystal resonator. For example, an oscillator having an integrated circuit element (IC) that generates an oscillation signal by applying a voltage to the crystal element in addition to the crystal element may be used. For example, the quartz crystal device may be equipped with a thermostatic bath. In the crystal device, the structure of the element mounting member for packaging the crystal element may be appropriately configured. For example, the element mounting member may be an H-shaped cross section having recesses on the upper surface and the lower surface.

  The shape and dimensions of the crystal element are not limited to those exemplified in the embodiment, and may be set as appropriate. The shape of the excitation electrode part is not limited to a substantially rectangular shape in plan view, and may be, for example, an elliptical shape.

  The first convex portion and the second convex portion may have the center thereof coincided with the center of the crystal piece in plan view of the crystal element or may be eccentric.

  When the upper surface of the crystal element is viewed in plan, the imaginary line passing through the center of the upper surface of the vibrating part (the main surface of the first convex part) and the lower surface of the vibrating part when the lower surface of the crystal element is viewed in plan from the upper surface The imaginary line passing through the center of (the main surface of the second convex portion) may or may not overlap.

110 ... Element mounting member 110a ... Base body 110b ... Frame body 111 ... Mounting pad 112 ... External terminals 120, 220 ... Crystal elements 121, 221 ... Crystal pieces 122, 222 ... ..Vibrating portions 122a, 222a ... first convex portions 122b, 222b ... second convex portions 123, 223 ... inclined portions 123a, 223a ... first inclined portions 123b, 223b ... second Inclined part 124, 224 ... Peripheral part 125, 225 ... Metal pattern 126, 226 ... Excitation electrode part 127, 227 ... Wiring part 128, 228 ... Lead-out part 130 ... Lid 140 ... conductive adhesives S11, S21 ... first side face S12, S22 ... second side face S13, S23 ... third side face S14, S24 ... fourth side face D11 (+), D21 ( +) ... water The distance between the predetermined other side of the piece and the side of the first side surface close to the predetermined other side of the crystal piece (the distance from the predetermined other side of the crystal piece to the first side located on the + X side) )
D11 (−), D21 (−)... Distance between a predetermined other side of the crystal piece and a side of the first side surface far from the predetermined other side of the crystal piece (from a predetermined other side of the crystal piece. -Distance to the first side located on the X side)
D12 (+), D22 (+) ... distance between the other predetermined side of the crystal piece and the side of the second side surface close to the other predetermined side of the crystal piece (from the predetermined other side of the crystal piece Distance to the second side located on the + X side)
D12 (−), D22 (−)... Distance between the other predetermined side of the crystal piece and the side of the second side surface that is separated from the other predetermined side of the crystal piece (predetermined other side of the crystal piece Distance from one side to the second side located on the -X side)
D13 (+), D23 (+) ... Distance between the other predetermined side of the crystal piece and the side of the third side surface close to the other predetermined side of the crystal piece (from the predetermined other side of the crystal piece Distance to the third side located on the + X side)
D13 (−), D23 (−)... Distance between a predetermined other side of the crystal piece and a side of the third side surface separated from the predetermined other side of the crystal piece (predetermined other side of the crystal piece Distance from one side to the third side located on the -X side)
D14 (+), D24 (+) ... distance between the other predetermined side of the crystal piece and the side of the fourth side surface close to the other predetermined side of the crystal piece (from the predetermined other side of the crystal piece + Distance to the fourth side located on the X side)
D14 (−), D24 (−)... Distance between the other predetermined side of the crystal piece and the side of the fourth side surface separated from the predetermined other side of the crystal piece (the predetermined other side of the crystal piece Distance from one side to the fourth side located on the -X side)

Claims (7)

A vibration part having a first convex part and a second convex part projecting in directions facing each other and a peripheral part arranged along the outer edge of the vibration part and having a thickness smaller than the vibration part, and substantially rectangular in plan view A crystal piece in shape,
A pair of excitation electrode portions provided on the upper surface of the first convex portion and the lower surface of the second convex portion;
A pair of drawers provided side by side along a predetermined side of the crystal piece;
One end is connected to the excitation electrode part, and the other end is connected to the lead part, and a wiring part,
A crystal element comprising:
The first convex portion is opposed to the first side surface inclined with respect to the upper surface of the first convex portion provided with the excitation electrode portion, the first side surface in a predetermined direction, and the excitation electrode. A second side surface with respect to the upper surface of the first convex portion provided with a portion,
The second convex portion is opposed to the third side surface inclined with respect to the lower surface of the second convex portion provided with the excitation electrode portion, the third side surface in a predetermined direction, and the excitation electrode portion A fourth side surface facing the lower surface of the second convex portion provided with,
The first side surface is arranged to overlap the third side surface in a plan view in the thickness direction of the crystal piece,
The crystal element according to claim 1, wherein the second side surface is disposed so as to overlap the fourth side surface in a plan view in the thickness direction of the crystal piece. The crystal element according to claim 1,
In plan view
The first side surface is located on the positive direction side of the X axis with respect to a virtual line passing through the center of the main surface of the first convex portion and perpendicular to the X axis of the crystal axis of the crystal piece,
The second side surface is located on the negative direction side of the X axis with respect to a virtual line passing through the center of the main surface of the first convex portion and perpendicular to the X axis,
The third side surface passes through the center of the main surface of the second convex portion and is located on the positive direction side of the X axis with respect to a virtual line perpendicular to the X axis,
The fourth side surface is located on the negative direction side of the X axis with respect to an imaginary line passing through the center of the main surface of the second convex portion and perpendicular to the X axis. Crystal element. The crystal element according to claim 2,
The angle between the upper surface of the first convex portion provided with the excitation electrode portion and the first side surface is larger than 90 ° and smaller than 180 °,
The angle between the first convex portion provided with the excitation electrode portion and the second side surface is larger than 90 ° and smaller than 180 °,
The angle between the lower surface of the second convex portion provided with the excitation electrode portion and the third side surface is larger than 90 ° and smaller than 180 °,
The quartz crystal element, wherein an angle between a lower surface of the second convex portion provided with the excitation electrode portion and the fourth side surface is larger than 90 ° and smaller than 180 °. The crystal element according to claim 3,
The angle between the upper surface of the first convex portion provided with the excitation electrode portion and the first side surface is 135 ° to 155 °,
The angle between the upper surface of the first convex portion provided with the excitation electrode portion and the second side surface is 150 ° to 170 °,
The angle between the lower surface of the second convex portion provided with the excitation electrode portion and the third side surface is 150 ° to 170 °,
An angle between the lower surface of the second convex portion provided with the excitation electrode portion and the fourth side surface is 135 ° to 155 °. The crystal element according to claim 4,
In plan view of the crystal element,
When a side perpendicular to the X axis located on the positive direction side of the X axis from the imaginary line is a predetermined other side of the crystal piece,
The side of the first side surface in which the distance between the other predetermined side and the side of the third side surface close to the predetermined other side is away from the predetermined other side and the predetermined other side It is shorter than the distance to
The side of the second side surface where the distance between the other side of the predetermined side and the side of the fourth side surface close to the other side of the predetermined side is separated from the other side of the predetermined side and the other side of the predetermined side Quartz element characterized in that it is shorter than the distance between. The crystal element according to claim 5,
The distance between the predetermined other side and the side of the first side far from the predetermined other side is the predetermined other side and the side of the third side far from the predetermined other side. Is equal to the distance of
The distance between the other predetermined side and the side of the second side surface close to the predetermined other side is the predetermined other side and the side of the fourth side surface close to the predetermined other side. A crystal element characterized by being equal to the distance of. The crystal element according to claim 1 to 6,
An element mounting member on which the crystal element is mounted;
A lid that is bonded to the element mounting member and hermetically seals the crystal element;
A crystal device that consists of

Images