JP2017183660A - Irradiation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress deterioration of light emission efficiency.SOLUTION: An irradiation device 1 comprises: a casing 11; a light emission part 13 arranged in the casing 11; a heat sink 17 that is arranged in the casing 11, and is thermally connected to the light emission part 13; and an introduction port 21 through which a gas cleaner than an external atmosphere is introduced into the casing 11. For example, a plurality of heat sinks 17 (17A, 17B, and 17C) is provided. The irradiation device 1 further comprises a current plate 19 that guides a gas flow including a gas 6 introduced from the introduction port 21 to the circumference of the plurality of heat sinks 17 (17A, 17B, and 17C) and of which a channel cross sectional area is larger as a channel 8 of the gas flow is longer.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an irradiation apparatus.

  An irradiation device that irradiates light such as ultraviolet rays is used for processing such as printing or curing of a resin or an adhesive. As a light source of an irradiation apparatus, a semiconductor light emitting element represented by an LED (Light Emitting Diode) is used. While LEDs generate heat by light emission, light emission efficiency decreases at high temperatures. In order to prevent a decrease in luminous efficiency at high temperatures, it is necessary to cool an irradiating device using an LED as a light source by dissipating heat generated by the LED by light emission.

  Patent Document 1 discloses a light irradiation device that cools a light source by radiating heat generated by the light source. This light irradiation device conducts heat in a planar shape by a flat heat pipe and radiates heat by a heat sink.

Japanese Patent Laying-Open No. 2015-141785

  However, the air in the housing of the light irradiating device of Patent Document 1 is introduced through a blower fan from the space in which the light irradiating device is disposed in order to prevent a decrease in the light emission efficiency of the light emitting element. This air may be mixed with foreign matters such as ink, oil, iron or paper dust generated during printing or curing. There is a problem that these foreign substances are taken into the housing and may cause a failure of the light irradiation apparatus.

  The present invention has been made to solve the above problems, and an object thereof is to provide an irradiation apparatus that suppresses a decrease in luminous efficiency.

  In order to achieve the above object, an irradiation apparatus according to one embodiment of the present invention includes a housing, a light-emitting portion that is disposed in the housing, the heat-emitting portion that is disposed in the housing, and is thermally connected to the light-emitting portion. A heat dissipation mechanism, and an inlet for introducing a gas cleaner than the external atmosphere into the housing.

  According to this, the heat generated by the light emitting part due to light emission is transmitted to the heat dissipation mechanism, and the heat dissipation mechanism is cooled by a gas that is introduced into the housing and is cleaner than the external atmosphere, in other words, a gas with less foreign matter. As a result, it is possible to suppress a decrease in light emission efficiency by suppressing the light emitting portion from being placed at a high temperature. In addition, it is possible to avoid failure of the irradiation device due to foreign matters such as ink adhering to each part in the irradiation device.

  Further, a plurality of the heat dissipation mechanisms are provided, and the irradiation device is a wind guide mechanism that guides a gas flow including the gas introduced from the introduction port to the periphery of the plurality of heat dissipation mechanisms, You may provide the wind guide mechanism with larger flow-path cross-sectional area, so that the flow path of the said gas flow is long.

  According to this, the irradiation apparatus can suppress a decrease in the light emission efficiency of the light emitting unit by guiding clean compressed gas (compressed air) uniformly around the plurality of heat dissipation mechanisms.

  The light emitting unit may include a semiconductor light emitting element that emits ultraviolet rays.

  According to this, the irradiation device can be used for printing using ultraviolet rays or curing of a resin or an adhesive. In the light emitting element included in the light emitting unit, the amount of heat generated when irradiating ultraviolet light having higher energy than visible light or the like is larger than the amount of heat generated when irradiating visible light or the like. For this reason, the light source element of the irradiation apparatus used for the above is likely to have a high temperature, and therefore, the light emission efficiency is likely to decrease at a high temperature. Therefore, it is possible to suppress a decrease in the light emission efficiency of the light emitting element, that is, the light emitting unit, while suppressing a failure of the irradiation apparatus that irradiates ultraviolet rays.

  The air guide mechanism may further guide the gas flow around the light emitting unit.

  According to this, the irradiation device can further directly cool the light emitting unit by the gas flow used for cooling the heat dissipation mechanism. As described above, since the amount of heat generated when the light emitting unit emits ultraviolet rays is relatively large, the cooling effect of the light emitting unit can be enhanced by directly cooling the light emitting unit as described above.

  Further, nitrogen is introduced into the introduction port as the gas, and the irradiation device further discharges the gas flow containing the nitrogen toward an object irradiated with ultraviolet rays from the light emitting unit. An outlet may be provided.

  According to this, while irradiating apparatus cools a thermal radiation mechanism using nitrogen as gas, this nitrogen is discharged | emitted to the space between target objects. It is known that oxygen inhibition occurs when oxygen is present in the space between the object to be printed by ultraviolet rays. Then, oxygen is excluded by substituting the space between an irradiation apparatus and a target object with nitrogen, As a result, oxygen inhibition can be prevented. In other words, there is an advantage that it is not necessary to replace the space with nitrogen by a separate means such as nitrogen purge. Thus, the irradiation device can improve the quality of processing such as printing or effects.

  The irradiation apparatus according to the present invention can suppress a decrease in light emission efficiency.

It is a perspective view which shows the external appearance of the irradiation apparatus which concerns on Embodiment 1 of this invention. It is a 1st schematic diagram which shows the internal structure of the irradiation apparatus which concerns on Embodiment 1 of this invention. It is a 2nd schematic diagram which shows the internal structure of the irradiation apparatus which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows the 1st example of the baffle plate which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows the 2nd example of the baffle plate which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows the board | substrate which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows the internal structure of the irradiation apparatus which concerns on the modification of Embodiment 1 of this invention. It is a schematic diagram which shows an example of the baffle plate which concerns on the modification of Embodiment 1 of this invention. It is a 1st schematic diagram which shows the internal structure of the irradiation apparatus which concerns on Embodiment 2 of this invention. It is a 2nd schematic diagram which shows the internal structure of the irradiation apparatus which concerns on Embodiment 2 of this invention. It is a schematic diagram which shows the cover and discharge port which concern on Embodiment 2 of this invention.

  Hereinafter, an irradiation apparatus according to an embodiment of the present invention will be described with reference to the drawings. Each of the embodiments described below shows a preferred specific example of the present invention. Numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of the constituent elements, manufacturing steps, order of manufacturing steps, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept are described as optional constituent elements. Also, the following figures are schematic diagrams and are not necessarily shown strictly. In the following description, description may be made using the XYZ axes shown in the referenced drawings. Also, the positive Z-axis direction may be expressed as “up” and the negative Z-axis direction may be expressed as “down”.

(Embodiment 1)
In the present embodiment, an irradiation apparatus 1 that suppresses a decrease in luminous efficiency will be described.

  FIG. 1 is a perspective view showing an appearance of an irradiation apparatus 1 according to the present embodiment.

  As shown in FIG. 1, the irradiation apparatus 1 is an irradiation apparatus that irradiates light 5 in the negative Z-axis direction. The irradiation device 1 is supplied with electric power, and uses the supplied electric power to irradiate light emitted from the light source as light 5. The light 5 is, for example, ultraviolet rays, and the irradiation device 1 is used as a device that performs processing such as printing or resin or adhesive curing on an object using ultraviolet rays. Although the following description will be made assuming that the light 5 is ultraviolet light, the light 5 may be light of other wavelengths, for example, visible light.

  In the housing 11 of the irradiation device 1, a gas 6 that is cleaner than the atmosphere of the irradiation device 1 (the gas in the space where the irradiation device 1 is installed) is introduced from the gas source 3 and discharged as a gas 7 from the discharge port 25. Is done. The gas 6 has a higher degree of cleanliness than the atmosphere of the irradiation apparatus 1, in other words, a gas that contains less foreign matter such as ink, and for example, a gas that is generated in advance so as not to contain foreign matter such as ink is used. it can. Moreover, the compressed air (for example, 0.1 MPa-0.8 MPa as a gauge pressure) supplied by piping installed in the factory etc. can also be used as the gas 6. The component of the gas 6 may be any material, for example, air containing about 80% nitrogen, about 20% oxygen, a small amount of argon and carbon dioxide. Alternatively, air enclosed in a cylinder or the like, or gas containing a predetermined gas component such as nitrogen can be used. Moreover, if the gas 6 is comparatively low temperature, the effect which reduces the temperature in the housing | casing 11 will improve. The relatively low temperature gas 6 may include, for example, cold air generated by a vortex tube.

  FIG. 2 is a first schematic diagram showing the internal configuration of the irradiation apparatus 1 according to the present embodiment. FIG. 3 is a second schematic diagram illustrating the internal configuration of the irradiation apparatus 1 according to the present embodiment. The internal configuration of the irradiation apparatus 1 will be described with reference to FIGS. 2 and 3.

  The irradiation device 1 includes a housing 11, a light emitting unit 13, a substrate 15, a heat sink 17, a current plate 19, an introduction port 21, a cover 23, and a discharge port 25.

  The housing 11 is a housing that houses the components of the irradiation apparatus 1 inside. The material of the housing 11 is a rigid member such as metal or synthetic resin. When a metal (aluminum, copper, etc.) having a relatively high thermal conductivity is used as the material of the housing 11, the effect of preventing the temperature inside the irradiation apparatus 1 from being increased by heat conduction and radiation by the housing 11 is enhanced. The housing 11 is provided with an introduction port 21 and a discharge port 25. The housing 11 is, for example, a column having the Z-axis direction as the axial direction, the introduction port 21 is disposed on the upper surface (the bottom surface on the Z-axis positive direction side), and the discharge port 25 is disposed on the side surface.

  The light emitting unit 13 is a light emitting unit including a light emitting element that emits light by supplied electric power. The light emitting unit 13 includes a semiconductor light emitting element, more specifically an LED, as the light emitting element. Moreover, the light which the light emission part 13 irradiates is an ultraviolet-ray, for example. The light emitting unit 13 emits heat by light emission. The heat generated by the light emitting unit 13 is transmitted to the heat sink 17 through the substrate 15 and radiated. Note that the number of the light emitting units 13 is one or more, and may be plural. FIG. 3 shows a case where there are three light emitting units 13.

  The substrate 15 is a substrate on which the light emitting unit 13 is disposed. The board | substrate 15 is a plate fixed to the inner wall of the housing | casing 11, and is comprised with a metal (for example, copper or aluminum) with comparatively high heat conductivity, or a ceramic. The substrate 15 receives heat generated by the light emitting unit 13 and transmits the heat to the heat sink 17.

  The substrate 15 is disposed at a position that divides the space in the housing 11 into a space including the introduction port 21 and the heat sink 17 and a space including the light emitting unit 13, and a through hole 42 communicating the two spaces with each other. Have Through the through hole 42, the gas introduced from the introduction port 21 is guided to the periphery 13 </ b> A of the light emitting unit 13. More specifically, the periphery 13 </ b> A of the light emitting unit 13 is a position around the light emitting element and covering an exposed portion of the light emitting element. In other words, it can be said that the periphery 13A of the light emitting unit 13 is a position within a predetermined distance from the light emitting element and is a position where heat generated by the light emitting element can be transferred to the gas at the position. The through hole 42 corresponds to a wind guide mechanism.

  The heat sink 17 is a heat radiating member for radiating the heat generated by the light emitting unit 13 to the air. The heat sink 17 has, for example, a plurality of fins, and improves heat dissipation efficiency by relatively increasing the surface area. Although the number of the heat sinks 17 may be any number, for example, the same number as the light emitting units 13 is provided. In that case, each of the plurality of heat sinks 17 is thermally connected to each of the plurality of light emitting units 13. FIG. 3 shows heat sinks 17A, 17B, and 17C connected to each of the three light emitting units 13. The heat sink 17 corresponds to a heat dissipation mechanism. The heat sink 17 is merely an example of a heat dissipation mechanism, and a device that moves heat to the outside by contacting gas may be employed instead of the heat sink 17. Moreover, the irradiation apparatus 1 may have a ventilation fan (not shown) which sends a wind further to the heat sink 17 as a thermal radiation mechanism.

  The rectifying plate 19 is a plate for guiding a gas flow including the gas 6 introduced from the introduction port 21 to the periphery of the heat sink 17. The rectifying plate 19 has a shape in which the cross-sectional area of the flow path increases as the flow path of the gas flow increases.

  Specifically, the rectifying plate 19 divides the space including the introduction port 21 and the space including the heat dissipation mechanism in the space in the housing 11, and at a position relatively close to the heat dissipation mechanism in the rectifying plate 19. The two spaces communicate with each other through a plurality of through holes provided. The gas flow including the gas 6 introduced from the introduction port 21 flows through the flow paths 8A, 8B, and 8C and reaches around the heat sinks 17A, 17B, and 17C, respectively.

  The diameter of the plurality of through holes of the rectifying plate 19 is larger as the flow path of the gas flow passing through the through holes is longer. In other words, the diameters of the plurality of through holes are larger as the distance from the inlet 21 of the through hole is larger. Since the gas introduced from the inlet 21 has a higher flow velocity or higher pressure as it is closer to the inlet 21, the amount of gas guided to the plurality of heat sinks 17 by setting the diameter of the through hole as described above. Can be made uniform. Here, “uniformization” means that the amount of gas guided to each of the plurality of heat sinks 17 is strictly uniform, and is nearly uniform as compared to the case where the rectifying plate 19 is not provided. Including. The material of the rectifying plate 19 may be any material as long as it does not substantially pass gas, and a metal or a synthetic resin can be adopted. Since the diameter of the through hole is determined based on the length of the flow path of the gas flow as described above, if the introduction port 21 is at a different position, the size varies depending on the position.

  The current plate 19 corresponds to an air guide mechanism. In addition, as another example of the air guide mechanism, a pipe connecting the introduction port 21 and each of the heat dissipation mechanisms can be adopted.

  The introduction port 21 is an introduction port through which the gas 6 is introduced into the housing 11. The inlet 21 is connected to the gas source 3 by a tube, and the clean gas 6 from the gas source 3 is introduced into the housing 11 through the tube. An example in which the introduction port 21 is arranged at the center of the upper surface of the housing 11 will be described below, but the position of the introduction port 21 is not limited to this.

  The cover 23 is a cover member that covers the irradiation device 1 from the irradiation direction side of the light 5. The cover 23 is disposed at a position corresponding to the lower surface of the housing 11. The material of the cover 23 is translucent synthetic resin or glass.

  The discharge port 25 is a discharge port through which a gas flow is discharged from the housing 11. The discharge port 25 may be provided on the side surface of the housing 11 or may be provided at a position corresponding to the lower surface of the housing 11 (the bottom surface on the Z-axis negative direction side).

  Hereinafter, the configuration of the current plate 19 will be described more specifically.

  FIG. 4 is a schematic diagram showing a rectifying plate 19A as a first example of the rectifying plate 19 according to the present embodiment. FIG. 4 is a view showing the rectifying plate 19A when viewed from the positive direction of the Z-axis in FIG. The rectifying plate 19A shows an example in which the difference in flow path cross-sectional area is realized by the difference in diameter of the through holes.

  The current plate 19 </ b> A has through holes 31, 32 and 33. The through holes 31, 32, and 33 are through holes provided in the vicinity of the heat sinks 17A, 17B, and 17C in the rectifying plate 19A, respectively.

  As shown in FIG. 4, the through hole 32 has the smallest diameter among the through holes 31, 32, and 33. This is because the flow path 8B from the gas flow inlet 21 passing through the through hole 32 to the heat sink 17B, the flow path 8A from the gas flow inlet 21 passing through the through hole 31 to the heat sink 17A, and the through hole This is because it is shorter than the flow path 8 </ b> C extending from the gas flow inlet 21 passing through 33 to the heat sink 17 </ b> C. The diameters of the through hole 31 and the through hole 33 are substantially the same. This is because the flow path 8A and the flow path 8B have substantially the same length.

  In addition, the shape of the through holes 31, 32, and 33 may be any shape, and may be a round hole or a long hole.

  FIG. 5 is a schematic diagram showing a rectifying plate 19B as a second example of the rectifying plate according to the present embodiment. FIG. 5 is a diagram showing the rectifying plate 19B when viewed from the positive direction of the Z-axis in FIG. 3, as in FIG. The rectifying plate 19B shows an example in which the difference in the channel cross-sectional area is realized by the difference in the number density of the through holes.

  The rectifying plate 19 </ b> B has through holes 35, 36 and 37. The through holes 35, 36, and 37 are through holes provided in the vicinity of the heat sinks 17A, 17B, and 17C, respectively, in the rectifying plate 19B.

  As shown in FIG. 5, among the through holes 35, 36 and 37, the number density of the through holes 36 is the smallest. This is because the channel 8B is shorter than the channel 8A and the channel 8C. The diameters of the through hole 35 and the through hole 36 are substantially the same. This is because the flow path 8A and the flow path 8B have substantially the same length.

  In addition, the shape of the through holes 35, 36, and 37 may be an arbitrary shape, a round hole, or a long hole.

  Moreover, in the above, the example which implement | achieves the difference of a flow-path cross-sectional area with the difference of the diameter of a through-hole by the rectification | straightening plate 19A, and the example which implement | achieves the difference of flow-path cross-sectional area by the difference in the number density of a through-hole by the rectification | straightening plate 19B However, it is also possible to realize a combination of these. That is, in the current plate 19A, the diameter of the through hole 31 may be larger than the diameter of the through hole 32, and the number density of the through holes 31 may be larger than the number density of the through holes 32.

  FIG. 6 is a schematic diagram showing the substrate 15 according to the present embodiment. FIG. 6 is a diagram showing the substrate 15 when viewed from the positive direction of the Z axis in FIG.

  As shown in FIG. 6, the substrate 15 is provided with a region 41 in which the heat sink 17 is disposed. Further, the substrate 15 has a through hole 42 at a position excluding the region 41 in the substrate 15.

  A gas flow including the gas 6 introduced from the introduction port 21 passes through the through hole 42, and the gas flow that has passed therethrough is then guided to the periphery 13 </ b> A of the light emitting unit 13. The shape of the through hole 42 may be any shape, and may be a circular round hole or a long hole, or a rectangular shape. When the shape of the through hole 42 is a long hole or a rectangular shape, it is easy to form the through hole 42 between the plurality of regions 41, and the advantage that the mechanical strength of the substrate 15 can be maintained without decreasing. There is.

  The position of the introduction port 21 is not limited to the center of the upper surface of the housing 11 and may be a side surface. In that case, the structure of the air guide mechanism is determined according to the position of the introduction port 21. An example in which the introduction port 21 is arranged on the side surface of the housing 11 will be described in the following modification.

(Modification of Embodiment 1)
In this modification, an introduction port and a wind guide mechanism in an irradiation apparatus having a configuration different from that of the first embodiment will be described. In addition, the same code | symbol is attached | subjected about the same component as the said embodiment, and detailed description is abbreviate | omitted.

  FIG. 7 is a schematic diagram showing an internal configuration of an irradiation apparatus 1A according to this modification.

  The irradiation apparatus 1A includes a housing 11, a light emitting unit 13, a substrate 15, a heat sink 17, a rectifying plate 19C, an introduction port 21A, a cover 23, and a discharge port 25. Here, the introduction port 21 </ b> A of the irradiation apparatus 1 </ b> A is different from the introduction port 21 in the irradiation apparatus 1 of Embodiment 1 in that it is provided on the side surface of the housing 11. The configuration of the rectifying plate 19C when the introduction port 21A is provided on the side surface of the housing 11 will be described below.

  FIG. 8 is a schematic diagram illustrating an example of a rectifying plate 19C according to this modification.

  FIG. 8 is a view showing a rectifying plate 19C when viewed from the positive direction of the Z-axis in FIG. The rectifying plate 19C shows an example in which the difference in flow path cross-sectional area is realized by the difference in diameter of the through holes.

  The rectifying plate 19C has through holes 51, 52 and 53. The through holes 51, 52, and 53 are through holes provided in the vicinity of the heat sinks 17A, 17B, and 17C in the rectifying plate 19C, respectively.

  As shown in FIG. 8, the diameters of the through holes 51, 52 and 53 are the smallest in the diameter of the through hole 51 and increase in the order of the through holes 52 and 53. The flow path 8D extends from the gas flow inlet 21A passing through the through hole 51 to the heat sink 17A, the flow path 8E extends from the gas flow inlet 21A passing through the through hole 52 to the heat sink 17B, and the through hole 53. This is because the flow path 8F from the gas flow inlet 21A passing through the heat sink 17C to the heat sink 17C increases in this order.

  In the above description, the example in which the difference in the channel cross-sectional area is realized by the difference in the diameters of the through holes is shown, but it can also be realized by the difference in the number density of the through holes.

(Embodiment 2)
In the present embodiment, a description will be given of an irradiation apparatus 2 that can suppress a decrease in light emission efficiency and improve a process applied to an irradiation target. In addition, the same code | symbol is attached | subjected about the same component as the said embodiment, and detailed description is abbreviate | omitted.

  The irradiation device 2 is used, for example, for a printing process for printing on an object. Specifically, the irradiation device 2 is used for ultraviolet irradiation for performing printing by curing ink with ultraviolet rays. Here, it is known that when oxygen is present in the space between the object to be printed, the oxygen inhibits ink curing (oxygen inhibition). Therefore, it is required to improve printing quality by preventing oxygen inhibition. It is known that when the oxygen concentration exceeds approximately 0.5%, the deterioration of quality due to oxygen inhibition starts to become remarkable. Therefore, in order to suppress the deterioration of quality due to oxygen inhibition, the oxygen concentration is approximately 0.5%. % Or less is required.

  The irradiation device 2 can improve the effect applied to the irradiation object while suppressing a decrease in light emission efficiency.

  FIG. 9 is a first schematic diagram showing the internal configuration of the irradiation apparatus 2 according to the present embodiment. FIG. 10 is a second schematic diagram showing the internal configuration of the irradiation apparatus 2 according to the present embodiment. FIG. 11 is a schematic diagram showing the cover 27 and the discharge port 29 according to the present embodiment.

  As shown in FIGS. 9 and 10, the irradiation device 2 includes a housing 11, a light emitting unit 13, a substrate 15, a heat sink 17, a current plate 19, an inlet 21, a cover 27, and an outlet. 29. The irradiation device 2 is different from the irradiation device 1 in that it has a position corresponding to the lower surface (bottom surface on the Z-axis negative direction side) of the housing 11, that is, a discharge port 29 in the cover 27.

  An object 61 to be printed by the irradiation device 2 is disposed below the irradiation device 2 with a space 63 therebetween. If oxygen is present in the space 63, oxygen inhibition may occur during printing as described above. The separation distance between the irradiation device 2 and the object 61, that is, the length of the space 63 in the Z direction is, for example, about 1 cm.

  Nitrogen 6A is introduced into the housing 11 of the irradiation apparatus 2 from the nitrogen source 3A. The nitrogen source 3A is, for example, a nitrogen cylinder.

  The cover 27 is the same as the cover 23 of the first embodiment, but differs in that it has a plurality of discharge ports 29 (see FIG. 11).

  The discharge port 29 is a discharge port through which a gas flow is discharged from the inside of the housing 11. The discharge port 29 is provided toward the object 61 at a position corresponding to the lower surface of the housing 11. Since nitrogen 6A is introduced into the casing 11 from the inlet 21, the nitrogen 7A in the casing 11 is discharged from the outlet 29 toward the object 61. The nitrogen discharged from the discharge port 29 fills the space 63 with nitrogen. The nitrogen discharged from the discharge port 29 causes the nitrogen concentration in the space 63 to be 99.5% or more, more specifically 99.99% or more.

  By setting the space 63 to the above-described nitrogen concentration, oxygen inhibition of ink curing in the space 63 is suppressed, and ink curing proceeds appropriately. Thereby, the printing process by the irradiation apparatus 2 can be improved.

  The present invention can be applied to an irradiation apparatus that suppresses a decrease in luminous efficiency. Specifically, the present invention can be applied to an irradiation apparatus or the like that irradiates light such as ultraviolet rays for printing or curing a resin or an adhesive.

DESCRIPTION OF SYMBOLS 1, 1A, 2 Irradiation device 3 Gas source 3A Nitrogen source 5 Light 6, 7 Gas 6A, 7A Nitrogen 8, 8A, 8B, 8C, 8D, 8E, 8F Flow path 11 Case 13 Light emitting part 13A Around light emitting part 15 Substrate 17, 17A, 17B, 17C Heat sink 19, 19A, 19B, 19C Rectifier plate 21, 21A Inlet 23, 27 Cover 25, 29 Discharge port 31, 32, 33, 35, 36, 37, 42, 51, 52, 53 Through-hole 41 Area 61 Object 63 Space

Claims (5)

A housing,
A light emitting unit disposed in the housing;
A heat dissipating mechanism disposed in the housing and thermally connected to the light emitting unit;
An irradiation apparatus comprising: an inlet for introducing a gas that is cleaner than an external atmosphere into the housing. A plurality of the heat dissipation mechanisms are provided,
The irradiation apparatus further includes:
An air guide mechanism that guides a gas flow including the gas introduced from the introduction port to the periphery of the plurality of heat dissipation mechanisms, and includes an air guide mechanism that has a larger cross-sectional area as the flow path of the gas flow is longer The irradiation apparatus according to claim 1. The irradiation device according to claim 2, wherein the light emitting unit includes a semiconductor light emitting element that irradiates ultraviolet rays. The irradiation device according to claim 3, wherein the air guide mechanism further guides the gas flow around the light emitting unit. Nitrogen is introduced into the inlet as the gas,
The irradiation apparatus further includes:
The irradiation apparatus according to claim 3, further comprising a discharge port through which the gas flow containing the nitrogen is discharged toward an object irradiated with ultraviolet rays from the light emitting unit.

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