JP2017168459A - LED lighting device - Google Patents

LED lighting device Download PDF

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Publication number
JP2017168459A
JP2017168459A JP2017125878A JP2017125878A JP2017168459A JP 2017168459 A JP2017168459 A JP 2017168459A JP 2017125878 A JP2017125878 A JP 2017125878A JP 2017125878 A JP2017125878 A JP 2017125878A JP 2017168459 A JP2017168459 A JP 2017168459A
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led
led lamp
mounting
mounting plate
power supply
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JP6262392B2 (en
Inventor
賢一 茂木
Kenichi Mogi
賢一 茂木
大輔 尾形
Daisuke Ogata
大輔 尾形
亮 岸本
Akira Kishimoto
亮 岸本
奥村 明彦
Akihiko Okumura
明彦 奥村
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Iris Ohyama Inc
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Iris Ohyama Inc
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Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting device which can be mounted with simple work without adding construction such as boring and the like at a mounted part such as a ceiling surface and the like, in which the number of components has been reduced, which has a simple structure, which can be manufactured at low cost, and which has excellent appearance.SOLUTION: The LED lighting device includes: an LED lamp body 200 having a power source part shield member 120 having a mortar-shaped light reflection surface, an LED element 130f provided at the center of the power source part shield member, and a translucent cover 100 mounted on the power source part shield member for covering the LED element; and a mounting plate 2 for mounting the LED lamp body on a mounted part. At the mounting plate, a plurality of mounting surface parts 2b of the LED lamp body standing from the surface on the LED lamp body side are formed. A screw hole 2f is formed on the mounting surface part. An opening for inserting a screw is formed at one part on the mounting plate side of the LED lamp body, and the screw is fastened in the screw hole on the mounting surface part through this opening, and the LED lamp body is mounted on the mounting plate.SELECTED DRAWING: Figure 13

Description

本発明は、LED素子を光源に使用したLED照明装置に関し、天井や壁面等の被取付部に直接取り付ける天井直付け型のLED照明装置に関するものである。   The present invention relates to an LED lighting device using an LED element as a light source, and relates to a ceiling-mounted LED lighting device that is directly attached to a mounted portion such as a ceiling or a wall surface.

近年、環境意識の高まりから、省電力化に優れたLED素子を光源に使用した、電源内蔵型の電球型LEDランプが普及してきた。更に最近は、天井埋め込み型のダウンライトや、天井直付け型のシーリングライトにおいても、LED素子を使用した照明装置が開発され、市場に導入されてきている。 2. Description of the Related Art In recent years, due to an increase in environmental awareness, a self-powered light bulb type LED lamp using an LED element excellent in power saving as a light source has been widespread. More recently, lighting devices using LED elements have also been developed and introduced into the market for ceiling-mounted downlights and ceiling-mounted ceiling lights.

たとえば特許文献1にはLEDモジュールの収納ケースを直接天井にネジ止めで装着するLED照明装置が開示されている。また、特許文献2には天井材に埋め込まれた器具本体にLEDユニットのベースをネジで装着する照明器具や、天井材に吊り具を装着して照明器具を吊るす形態が開示されている。   For example, Patent Literature 1 discloses an LED lighting device in which a storage case for an LED module is directly attached to a ceiling with screws. Patent Document 2 discloses a lighting fixture in which the base of the LED unit is attached to the fixture main body embedded in the ceiling material with a screw, and a form in which the lighting fixture is hung by attaching a hanging tool to the ceiling material.

特開2011−119206号公報JP 2011-119206 A 特開2012−182191号公報JP 2012-182191 A

しかしながら、特許文献1では、LEDモジュールの収納ケースの上面部が天井面と接しているため、LEDモジュールの発熱を効率的に放熱することができないという問題があり、また、LED基板とLED電力供給基板が独立して配置されているため部品点数が多くなり組立作業も複雑になる等の問題がある。また特許文献2は、発光装置となる長方形基板の中央部にLEDチップを配置し、基板端部に電源線を接合する構成となっているが、このような構成では、LEDチップを点灯させるための点灯回路を構成する電子部品がLEDチップの周囲に雑然と配置されることになり、また、その配置スペースを確保するために基板を長さ方向又は幅方向に広げる必要があって、基板全体がサイズアップするという問題がある。しかも、特許文献2ではベース、ホルダー、内カバー等の部品点数が多くなるため組立作業も面倒でありコストも高くなること、天井面に器具本体を埋め込むために大きな穴を開けなければならず、その施工作業や器具本体への照明器具の取り付け作業が面倒であること、天井材に照明器具を吊り具で吊るす形式では、照明器具が不安定であるばかりでなく、吊り具の取り付け作業や、天井材から引き出された外部電源電線と照明器具との結線作業が面倒であること、等の問題がある。   However, in patent document 1, since the upper surface portion of the storage case of the LED module is in contact with the ceiling surface, there is a problem in that the heat generated by the LED module cannot be efficiently radiated. Since the boards are arranged independently, there are problems such as an increase in the number of parts and a complicated assembly operation. Further, Patent Document 2 has a configuration in which an LED chip is arranged at the center of a rectangular substrate serving as a light emitting device and a power supply line is joined to the end of the substrate. In such a configuration, the LED chip is turned on. The electronic components constituting the lighting circuit of the LED are cluttered around the LED chip, and it is necessary to widen the board in the length direction or the width direction in order to secure the placement space, and the whole board There is a problem that size increases. Moreover, in Patent Document 2, the number of parts such as a base, a holder, and an inner cover is increased, so that the assembly work is troublesome and expensive, and a large hole has to be opened in order to embed the instrument body on the ceiling surface. The construction work and the mounting work of the lighting fixture on the fixture body, and the type of hanging the lighting fixture on the ceiling material with the hanging tool, the lighting fixture is not only unstable, There are problems such as troublesome connection work between the external power supply wires drawn from the ceiling material and the lighting fixtures.

本発明は、以上のような課題を解決するため提案されたものであり、天井面等の被取付部にあらたに穴あけ等の施工を加えることなく簡単な作業でLED照明装置を取り付けることができ、また部品点数を削減し、構成が簡単で安価に製造することができ、さらには外観性にも優れたLED照明装置を提供するものである。   The present invention has been proposed in order to solve the above-described problems, and the LED lighting device can be attached by a simple operation without adding a hole or the like to the attached portion such as the ceiling surface. In addition, the present invention provides an LED lighting device that has a reduced number of parts, can be manufactured at low cost, and is excellent in appearance.

上記課題を解決するため、本発明の一態様に係るLED照明装置にあっては、すり鉢形状の光反射面を有する電源部遮蔽部材と、
前記電源部遮蔽部材の中央に設けられたLED素子と、
前記電源部遮蔽部材に装着され、前記LED素子を覆う透光性カバーと、を有するLEDランプ本体と、
前記LEDランプ本体を被取付部に取り付ける取付板と、
を備え、
前記取付板には前記取付板の前記LEDランプ本体側の面から起立した前記LEDランプ本体の装着面部が複数形成されており、
前記装着面部にはネジ穴が形成されており、
前記LEDランプ本体の前記取付板側の一部にはネジを挿通する開口が形成されており、
前記開口を挿通して前記装着面部のネジ穴にネジを止着することにより、前記LEDランプ本体が前記取付板に取り付けられることを特徴とする。
In order to solve the above problems, in the LED lighting device according to an aspect of the present invention, a power supply shielding member having a mortar-shaped light reflecting surface;
An LED element provided in the center of the power source shielding member;
An LED lamp main body having a translucent cover attached to the power supply unit shielding member and covering the LED element;
A mounting plate for mounting the LED lamp body on the mounted portion;
With
The mounting plate is formed with a plurality of mounting surface portions of the LED lamp body that stand up from the surface of the mounting plate on the LED lamp body side,
The mounting surface portion is formed with a screw hole,
An opening through which a screw is inserted is formed in a part of the mounting side of the LED lamp body,
The LED lamp body is attached to the mounting plate by inserting the opening and fastening a screw in the screw hole of the mounting surface portion.

また本発明の一態様に係るLED照明装置にあっては、前記取付板には、外部電源電線が挿通する外部電源挿通孔が設けられ、かつ、被取付部に装着するための複数の長尺状ネジ穴が互いに長手方向の向きを変えて設けられていることを特徴とする。   Moreover, in the LED lighting device according to an aspect of the present invention, the mounting plate is provided with an external power supply insertion hole through which an external power supply wire is inserted, and a plurality of long holes for mounting on the mounted portion. The screw holes are provided with their longitudinal directions changed from each other.

上述した本発明によれば、天井面等の被取付部にあらたに穴あけ等の施工を加えることなく簡単な作業でLED照明装置を取り付けることができ、また部品点数を削減し、構成が簡単で安価に製造することができ、さらには外観性にも優れたLED照明装置を提供することができる。   According to the present invention described above, it is possible to attach the LED lighting device by a simple operation without adding a hole or the like to the attached portion such as the ceiling surface, reduce the number of parts, and the configuration is simple. It is possible to provide an LED lighting device that can be manufactured at low cost and that is also excellent in appearance.

第1の本実施形態に係わるLED照明装置の分解斜視図。The disassembled perspective view of the LED lighting apparatus concerning 1st this embodiment. 第1の本実施形態に係わるLEDランプ本体の筐体の斜視図。The perspective view of the housing | casing of the LED lamp main body concerning 1st this embodiment. 第1の本実施形態に係わるLEDランプ本体の透光性カバーの斜視図。The perspective view of the translucent cover of the LED lamp main body concerning 1st this embodiment. 第1の本実施形態に係わるLEDランプ本体のLEDユニット基板の斜視図。The perspective view of the LED unit board | substrate of the LED lamp main body concerning 1st this embodiment. 第1の本実施形態に係わるLEDランプ本体の絶縁カバーの斜視図。The perspective view of the insulation cover of the LED lamp main body concerning 1st this embodiment. 第1の本実施形態に係わるLEDランプ本体の基板支持部材の斜視図。The perspective view of the board | substrate support member of the LED lamp main body concerning 1st this embodiment. 第1の本実施形態に係わるLED照明装置の取付板の斜視図。The perspective view of the mounting plate of the LED lighting apparatus concerning 1st this embodiment. 第1の本実施形態に係わるLEDランプ本体の筐体と透光性カバーを取り外した状態の斜視図。The perspective view of the state which removed the housing | casing and translucent cover of the LED lamp main body concerning 1st this embodiment. 第1の本実施形態に係わるLEDランプ本体の筐体を取り外した状態の斜視図。The perspective view of the state which removed the housing | casing of the LED lamp main body concerning 1st this embodiment. 第1の本実施形態に係わるLEDランプ本体と取付板の取り付け状態を示す概略側面図。The schematic side view which shows the attachment state of the LED lamp main body concerning 1st this embodiment, and an attachment board. 第1の本実施形態に係わるLEDランプ本体の筐体の概略側面図。The schematic side view of the housing | casing of the LED lamp main body concerning 1st this embodiment. 第1の本実施形態に係わるLEDランプ装置の筐体を取り外した状態の全体斜視図。The whole perspective view of the state which removed the housing | casing of the LED lamp apparatus concerning 1st this embodiment. 第2の実施形態に係わるLED照明装置の分解斜視図。The disassembled perspective view of the LED lighting apparatus concerning 2nd Embodiment. (a)は第2の本実施形態に係わる筐体(LEDランプ本体)の表面側の斜視図、(b)は筐体の裏面側の斜視図。(A) is a perspective view of the surface side of the housing | casing (LED lamp main body) concerning 2nd this embodiment, (b) is a perspective view of the back surface side of a housing | casing. 第2の実施形態に係わる電源部遮蔽部材の表面側の斜視図。The perspective view of the surface side of the power-source-part shielding member concerning 2nd Embodiment. 第2の実施形態に係わる電源部遮蔽部材の裏面側の斜視図。The perspective view of the back surface side of the power-source-part shielding member concerning 2nd Embodiment. 第2の実施形態に係わる透光性カバーの下側から見た斜視図。The perspective view seen from the lower side of the translucent cover concerning 2nd Embodiment. 第2の実施形態に係わるLEDランプ本体の筐体を取り外した状態の斜視図。The perspective view of the state which removed the housing | casing of the LED lamp main body concerning 2nd Embodiment. 第2の実施形態に係わるLEDランプ本体の透光性カバーを取り外した状態の斜視図。The perspective view of the state which removed the translucent cover of the LED lamp main body concerning 2nd Embodiment. 第2の実施形態に係わるLEDランプ本体の電源部遮蔽部材を取り外した状態の斜視図。The perspective view of the state which removed the power-source-part shielding member of the LED lamp main body concerning 2nd Embodiment. 第2の実施形態に係わるLEDランプ本体のLEDユニット基板を取り外した状態の斜視図。The perspective view of the state which removed the LED unit board | substrate of the LED lamp main body concerning 2nd Embodiment. 第2の実施形態に係わるLEDランプ本体の端子台の斜視図。The perspective view of the terminal block of the LED lamp main body concerning 2nd Embodiment. 第2の実施形態に係わる筐体を取り外した状態のLED照明装置の底面方向から見た斜視図。The perspective view seen from the bottom face direction of the LED lighting apparatus of the state which removed the housing | casing concerning 2nd Embodiment. 第2の実施形態に係わるLEDランプ本体のLEDユニット基板を取り外した状態の側面図。The side view of the state which removed the LED unit board | substrate of the LED lamp main body concerning 2nd Embodiment.

以下に本発明の好適な実施の形態について、図面を参照しながら説明する。なお本実施形態は一例であり、これに限定されるものではない。   Preferred embodiments of the present invention will be described below with reference to the drawings. This embodiment is an example, and the present invention is not limited to this.

(第1の実施形態)
本発明のLED照明装置は、図1に示すように、LEDランプ本体1と取付板2からなっている。LEDランプ本体1は、LED照射方向から見て、筐体10と、この中に収納される透光性カバー20と、LEDユニット基板30と、絶縁カバー40と、基板支持部材50と、端子台(電源端子台)60とから概略構成されている。
(First embodiment)
As shown in FIG. 1, the LED lighting device of the present invention includes an LED lamp body 1 and a mounting plate 2. The LED lamp body 1 includes a housing 10, a translucent cover 20 accommodated in the housing 10, an LED unit substrate 30, an insulating cover 40, a substrate support member 50, and a terminal block as viewed from the LED irradiation direction. (Power supply terminal block) 60 and a schematic configuration.

前記筐体10は、図2に示すように下面部が開口し、上面部(照射方向)に透光性カバー20の露出孔10aが開口した偏平の略筒形状であり、ポリカーボネート樹脂等の合成樹脂で造られている。筒体10は、ここでは円筒体になっているが、楕円筒体、角筒体等、その形状は任意である。   As shown in FIG. 2, the casing 10 has a flat and substantially cylindrical shape with an open bottom surface and an exposed hole 10a of the translucent cover 20 on the top surface (irradiation direction). Made of resin. The cylindrical body 10 is a cylindrical body here, but the shape thereof is arbitrary, such as an elliptical cylindrical body or a rectangular cylindrical body.

前記透光性カバー20は、図3に示すように、全体が略蝶形の上面有底筒体であり、中央円盤部20aと、その両側部に張り出した円弧枠部(張り出し部)20b、20cが一体成形されており、円弧枠部20b,20cが形成されていない部分に装着逃げ部20d,20eが形成されている。中央円盤部20aと円弧枠部20b,20cは同心円の湾曲体である。ここでは、一方の円弧枠部20cが他方の円弧枠部20bよりも長い円弧長となっている。透光性カバー20はポリカーボネート樹脂に光拡散剤等を添加して透明又は乳白色となっている。   As shown in FIG. 3, the translucent cover 20 is a generally bottomed cylindrical body having a generally butterfly shape, and includes a central disk portion 20 a and arc frame portions (projecting portions) 20 b projecting on both sides thereof. 20c is integrally formed, and mounting relief portions 20d and 20e are formed in portions where the arc frame portions 20b and 20c are not formed. The central disk portion 20a and the arc frame portions 20b and 20c are concentric curved bodies. Here, one arc frame portion 20c has a longer arc length than the other arc frame portion 20b. The translucent cover 20 is transparent or milky white by adding a light diffusing agent or the like to polycarbonate resin.

中央円盤部20aの装着逃げ部20d側における円弧枠部20bの端面部近くには、電源電線を係止する係止舌片20gが外側に突設されている。この係止舌片20gには係止孔20fが開口され、その一部に切欠部20hが形成されている。この係止舌片20gが設けられた近くの円弧枠部20bの端面部には、電源電線の挿通孔20jが開口されている。また、円弧枠部20b,20cの周方向端部には、後述する基板支持部材50に設けられた止めネジ50g(図8)が螺入されるネジ止着部20iが形成されている。ネジ止着部20iの裏面側には、図示しないが、ネジ穴が形成されている。ネジ止着部20iは、ここでは複数箇所に設けられている   A locking tongue piece 20g for locking the power supply electric wire is provided on the outer side near the end face of the arc frame portion 20b on the mounting escape portion 20d side of the central disk portion 20a. A locking hole 20f is opened in the locking tongue piece 20g, and a notch 20h is formed in a part thereof. An insertion hole 20j for a power supply electric wire is opened in the end surface portion of the arcuate frame portion 20b near where the locking tongue piece 20g is provided. Further, screw fastening portions 20i into which set screws 50g (FIG. 8) provided on a substrate support member 50 described later are screwed are formed at the circumferential ends of the arc frame portions 20b and 20c. Although not shown, a screw hole is formed on the back surface side of the screw fixing portion 20i. Here, the screw fastening portions 20i are provided at a plurality of locations.

前記LEDユニット基板30は、図4に示すように、略蝶形の基板であり、中央円板部30aと、その両側部に張り出した円弧面部(張り出し面部)30b,30cが一体成形されている。中央円板部30aと円弧面部30b,30cは同心円の湾曲体である。ここでは、一方の円弧面部30cが他方の円弧面部30bよりも長い円弧長となっている。また、中央円板部30aと円弧面部30b,30cの間であって、円弧面部30b,30cが形成されていない切り欠き部分は、装着逃げ部30d,30eが形成されている。このLEDユニット基板30の中央円板部30aの下面部(照射面側)には、図8に示すように複数のLED素子30fがサークル状に実装され、円弧面部30b,30cにはLED素子30fを点灯駆動する点灯回路の電子部品(図示せず)が実装されている。この電子面部品は、円弧面部30b,30cにおけるLED素子30fと同一平面部に配置してもよく、その裏面部に配置してもよい。   As shown in FIG. 4, the LED unit substrate 30 is a substantially butterfly-shaped substrate, and a central disk portion 30a and arc surface portions (projecting surface portions) 30b and 30c projecting on both sides thereof are integrally formed. . The central disk portion 30a and the arcuate surface portions 30b and 30c are concentric curved bodies. Here, one arcuate surface portion 30c has a longer arc length than the other arcuate surface portion 30b. Further, notch portions between the central disc portion 30a and the arc surface portions 30b and 30c where the arc surface portions 30b and 30c are not formed are provided with mounting escape portions 30d and 30e. As shown in FIG. 8, a plurality of LED elements 30f are mounted in a circle on the lower surface (irradiation surface side) of the central disk portion 30a of the LED unit substrate 30, and the LED elements 30f are mounted on the arcuate surfaces 30b and 30c. An electronic component (not shown) of a lighting circuit for driving and lighting is mounted. This electronic surface component may be disposed on the same plane portion as the LED element 30f in the circular arc surface portions 30b and 30c, or may be disposed on the back surface portion thereof.

ここでは、LEDユニット基板30の中央円板部30aにLED素子30fを配置し、円弧面部30b,30cに電子部品を配置しているが、必要であれば、中央円板部30aに電子部品を配置し、円弧面部30b,30cにLED素子を配置してもよい。この場合は、これに対応して筐体10、透光性カバー20、LEDユニット基板30、絶縁カバー40、基板支持部材50の形状が変更される。   Here, the LED element 30f is disposed on the central disk portion 30a of the LED unit substrate 30 and the electronic components are disposed on the arcuate surface portions 30b and 30c. However, if necessary, the electronic component is disposed on the central disk portion 30a. The LED elements may be arranged on the arcuate surface portions 30b and 30c. In this case, the shapes of the housing 10, the translucent cover 20, the LED unit substrate 30, the insulating cover 40, and the substrate support member 50 are changed correspondingly.

前記電子部品は、過電流保護、ノイズカット、整流、平滑、調光制御などを行うための各種ダイオード、コンデンサー、IC、抵抗などの公知の電子部品である。   The electronic components are known electronic components such as various diodes, capacitors, ICs, resistors, and the like for performing overcurrent protection, noise cut, rectification, smoothing, dimming control, and the like.

上述のように、LEDユニット基板30は、一枚の基板にLED素子30fと、LED素子30fを点灯駆動する点灯回路の電子部品を実装したことにより、部品点数が削減される。また、LED素子30fと電子部品が一枚の基板に整然と区分されて配置されることになり、LEDランプ本体1の小型化を図ることができる。   As described above, the LED unit substrate 30 has the number of components reduced by mounting the LED elements 30f and the electronic components of the lighting circuit that drives the LED elements 30f on the single substrate. In addition, the LED element 30f and the electronic component are arranged in an orderly manner on a single substrate, so that the LED lamp body 1 can be reduced in size.

前記絶縁カバー40は、図5に示すように、前記LEDユニット基板30の形状に対応した略蝶形に形成されており、絶縁性樹脂により造られている。絶縁性カバー40は、中央円板部40aと、その両側に張り出した凹状の円弧枠部(張り出し部)40b,40cが一体成形され、これら円弧枠部40b,40cが形成されていない部分が装着逃げ部40d,40eとなっている。中央円板部40aと円弧枠部40b,40cは同心円の湾曲体である。ここでは、一方の円弧枠部40cが他方の円弧枠部40dよりも長い円弧長となっている。   As shown in FIG. 5, the insulating cover 40 is formed in a substantially butterfly shape corresponding to the shape of the LED unit substrate 30, and is made of an insulating resin. The insulating cover 40 is formed by integrally forming a central disc portion 40a and concave arcuate frame portions (projecting portions) 40b and 40c projecting on both sides thereof, and portions where these arc frame portions 40b and 40c are not formed are mounted. The escape portions 40d and 40e are formed. The central disc portion 40a and the arc frame portions 40b and 40c are concentric curved bodies. Here, one arc frame portion 40c has a longer arc length than the other arc frame portion 40d.

前記LEDユニット基板30を支持する基板支持部材50は、図6に示すように、略円板形状であり、金属板で成形加工されている。基板支持部材50は、中央円板面部50aの周方向両側部に下面部方向(照射方向と反対方向)に凹設された円弧枠部50b,50cが形成されており、これら円弧枠部50b,50cが形成されていない凸部分が前記取付板2との装着面部50d,50eとなっている。この装着面部50d,50eには略ダルマ状のネジ穴50fがそれぞれ開口されている。ここでは、一方の円弧枠部50cが他方の円弧枠部50bよりも長い円弧長となっている。また、基板支持部材50の装着面部50eには電源電線を挿通する切欠穴50h(図8)が形成されている。   As shown in FIG. 6, the substrate support member 50 that supports the LED unit substrate 30 has a substantially disk shape and is formed by a metal plate. The substrate support member 50 is formed with arc frame portions 50b and 50c that are recessed in the lower surface direction (direction opposite to the irradiation direction) on both sides in the circumferential direction of the central disk surface portion 50a. The convex portions where 50c is not formed are mounting surface portions 50d, 50e with the mounting plate 2. The mounting surface portions 50d and 50e are respectively provided with substantially dharma-shaped screw holes 50f. Here, one arc frame portion 50c has a longer arc length than the other arc frame portion 50b. Further, a notch hole 50h (FIG. 8) through which the power supply wire is inserted is formed in the mounting surface portion 50e of the substrate support member 50.

前記端子台60は、前記基板支持部材50の下面部にネジ等で装着されており、天井等の被取付部から引き出された外部電源電線(Fケーブル)の接続口が、後述する取付板2の外部電源電線挿通孔2cを向けて設けられている。図10及び図12にはこの端子台60が示されているが、ここでは外部電源電線との接続口は裏面側に設けられているため図示されていない。端子台60の表面側には、外部電源電線とLEDユニット基板30の電源部とを導通する電源電線の接続口60aが設けられている。   The terminal block 60 is attached to the lower surface portion of the substrate support member 50 with screws or the like, and a connection port of an external power supply wire (F cable) drawn out from a mounted portion such as a ceiling is a mounting plate 2 described later. The external power supply electric wire insertion hole 2c is provided. FIGS. 10 and 12 show the terminal block 60, but the connection port with the external power supply wire is not shown here because it is provided on the back side. On the surface side of the terminal block 60, a connection port 60a for a power supply wire that conducts the external power supply wire and the power supply unit of the LED unit substrate 30 is provided.

接続口60aに接続された電源電線は、基板支持部材50の切欠穴50hを通し、図12に示すように、透光性カバー20の係止舌片20gの係止孔20fを通して挿通孔20jから透光性カバー20の内部に挿通することにより、LEDユニット基板30の電源部と結線される。係止孔20fには切欠部20hが形成されているので、組立順序に左右されずに電源電線を係止孔20fに通すことができる。これらの結線作業は、LEDランプ本体1の組立工程で行われる。なお、端子台60は公知のものが使用できる。   The power supply wire connected to the connection port 60a passes through the notch hole 50h of the substrate support member 50, and passes through the insertion hole 20j through the locking hole 20f of the locking tongue piece 20g of the translucent cover 20, as shown in FIG. By being inserted into the interior of the translucent cover 20, the power unit of the LED unit substrate 30 is connected. Since the notch 20h is formed in the locking hole 20f, the power supply wire can be passed through the locking hole 20f regardless of the assembly order. These connection operations are performed in the assembly process of the LED lamp main body 1. A known terminal block 60 can be used.

前記取付板2は、図7に示すように、全体が横長の金属板であり、長さ方向両端縁部が筐体10の外径面に合わせた円弧状に形成されている。この取付板2の本体面部2aの長辺側の両端部には、L字状に起立したLEDランプ本体1の装着面部2bが一対形成されており、この装着面部2bにはネジ穴2fが開口されている。本体面部2aの中央部には、外部電源電線の挿通孔2cが開口されており、装着部2b近くには取付板2を天井等の被取付部に装着するための複数のネジ穴2dが互いに向きを変えて形成されている。また本体面部2aには、複数のビード2eが形成されている。なお、取付板2と被取付部との間にスポンジ等の弾性部材を介装させて密封することにより、LEDランプ本体1に粉塵、虫等が入り込まないようにし、被取付部の振動がLEDランプ本体1に伝わるのを防止することができる。   As shown in FIG. 7, the mounting plate 2 is a horizontally long metal plate, and both end edges in the length direction are formed in an arc shape matching the outer diameter surface of the housing 10. A pair of mounting surface portions 2b of the LED lamp body 1 erected in an L-shape is formed at both ends on the long side of the main body surface portion 2a of the mounting plate 2, and screw holes 2f are opened in the mounting surface portion 2b. Has been. An insertion hole 2c for an external power source electric wire is opened at the center of the main body surface portion 2a, and a plurality of screw holes 2d for mounting the mounting plate 2 on a mounted portion such as a ceiling are mutually connected near the mounting portion 2b. It is formed in a different direction. A plurality of beads 2e are formed on the main body surface portion 2a. It should be noted that an elastic member such as a sponge is interposed between the mounting plate 2 and the mounted portion and sealed to prevent dust, insects, etc. from entering the LED lamp main body 1 and the vibration of the mounted portion is reduced to the LED. Propagation to the lamp body 1 can be prevented.

上述したLEDランプ本体1は、図8に示すように、基板支持部材50の上面部に絶縁カバー40を介してLEDユニット基板30がネジ止め等により装着され一体化される。この状態で、基板支持部材50の凹状円弧枠部50b,50cに絶縁カバー40の凹状円弧枠部40b,40cが嵌挿され、LEDユニット基板30の中央円板部30aは、絶縁カバー40の中央円板部40aを介して基板支持部材50の中央円板面部50aに接することになる。また、LEDユニット基板30の円弧面部30b,30cは、基板支持部材50の凹状円弧枠部50b,50c及び絶縁カバー40の凹状円弧枠部40b,40cから離間した状態となる。   As shown in FIG. 8, the LED lamp main body 1 is integrated by attaching the LED unit substrate 30 to the upper surface portion of the substrate support member 50 via an insulating cover 40 by screws or the like. In this state, the concave arc frame portions 40b and 40c of the insulating cover 40 are fitted into the concave arc frame portions 50b and 50c of the substrate support member 50, and the central disk portion 30a of the LED unit substrate 30 is located at the center of the insulating cover 40. The central disc surface portion 50a of the substrate support member 50 is in contact with the disc portion 40a. Further, the arc surface portions 30 b and 30 c of the LED unit substrate 30 are separated from the concave arc frame portions 50 b and 50 c of the substrate support member 50 and the concave arc frame portions 40 b and 40 c of the insulating cover 40.

そして、LEDユニット基板30の裏面部(照射面の反対面)に前記電子部品を実装した場合は、この離間した空間部にその電子部品が収容されることになり、LEDランプユニット基板30の表面部(照射面側)に電子部品を配置した場合は、その空間部が電子部品の放熱部となる。   And when the said electronic component is mounted in the back surface part (opposite surface of an irradiation surface) of the LED unit board | substrate 30, the electronic component will be accommodated in this spaced apart space part, The surface of the LED lamp unit board | substrate 30 When the electronic component is arranged on the portion (irradiation surface side), the space portion becomes the heat radiating portion of the electronic component.

前記LEDユニット基板30の上方(照射斜面側)には、図9、図12に示すように、前記透光性カバー20が被せられ、基板支持部材50の止めネジ50gを透光性カバー20のネジ止着部20iに螺入することにより、基板支持部材50と透光性カバー20を固定する。そして、この透光性カバー20に筐体10(図9、図12では図示せず)が被せられる。この状態で、透光性カバー20の円弧枠部20b,20cが、対応するLEDユニット基板30の円弧面部30d,30eを覆い、図11に示すように、透光性カバー20の中央円盤部20aが筐体10の露出孔10aから膨出することになる。また、LEDユニット基板30の円弧面部30d,30eに実装された電子部品等が筐体10の上面部の縁面部(上面周面部10b、上端縁部10c)及び透光性カバー20の円弧枠部20b,20cで隠されることになる。なお、基板支持部材50と透光性カバー20の固定方法は、前述した構成に限定されるものではない。   As shown in FIGS. 9 and 12, the translucent cover 20 is put on the LED unit substrate 30 (on the irradiation slope side), and the set screw 50 g of the substrate support member 50 is attached to the translucent cover 20. The board support member 50 and the translucent cover 20 are fixed by screwing into the screw fastening part 20i. The translucent cover 20 is covered with a casing 10 (not shown in FIGS. 9 and 12). In this state, the arc frame portions 20b and 20c of the translucent cover 20 cover the arc surface portions 30d and 30e of the corresponding LED unit substrate 30, and the central disk portion 20a of the translucent cover 20 as shown in FIG. Swells from the exposure hole 10 a of the housing 10. Further, the electronic components and the like mounted on the arc surface portions 30 d and 30 e of the LED unit substrate 30 are the edge surface portions (upper surface peripheral surface portion 10 b and upper end edge portion 10 c) of the housing 10 and the arc frame portion of the translucent cover 20. It will be hidden by 20b, 20c. In addition, the fixing method of the board | substrate support member 50 and the translucent cover 20 is not limited to the structure mentioned above.

上述したLEDユニット基板30の形状は、電子部品の配置位置によっては、円弧面部30b,30cの大きさや形状を変えることができ、それに対応して、透光性カバー20の円弧枠部20c、絶縁カバー40の円弧枠部40b,40c、基板支持部材50の円弧枠部50b,50cの大きさや形状を変更することもできる。   The shape of the LED unit substrate 30 described above can change the size and shape of the arcuate surface portions 30b, 30c depending on the arrangement position of the electronic components. Correspondingly, the arc frame portion 20c of the translucent cover 20 is insulated. The size and shape of the arc frame portions 40b and 40c of the cover 40 and the arc frame portions 50b and 50c of the substrate support member 50 can be changed.

LEDランプ本体1を天井等の被取付部に取り付ける場合は、まず外部電源電線(Fケーブル)を、取付板2の装着部2bが下向き(照射方向)となるように取付板2の外部電源線挿通孔2cに挿通し(外部電源電線は天井に開口されている通孔から引き出す)、天井に開口されている外部電源電線の通孔と、取付板2の外部電源線挿通孔2cを合わせながら、ネジ穴2dを使用して被取付部に取付板2をネジ止めする。   When the LED lamp main body 1 is attached to a mounted portion such as a ceiling, first, connect the external power supply wire (F cable) to the external power line of the mounting plate 2 so that the mounting portion 2b of the mounting plate 2 faces downward (irradiation direction). Inserting into the insertion hole 2c (extracting the external power supply wire from the through hole opened in the ceiling), aligning the through hole of the external power supply wire opened in the ceiling and the external power supply line insertion hole 2c of the mounting plate 2 The mounting plate 2 is screwed to the mounted portion using the screw hole 2d.

次に、端子台60に外部電源電線を接続した後、LEDランプ本体1の基板支持部材50の装着面部50d,50eと取付板の装着面部2bを合わせ、ネジ穴50f、2fを通してネジ3(図8、図9)で止着する。この際、筐体10を取り外しておけば、透光性カバー20の装着逃げ部20d、20e、LEDユニット基板30の装着逃げ部30d,30e、絶縁カバー40の装着逃げ部40d,40eが対応して形成されているため、ネジ止め作業を簡単に行うことができる。   Next, after connecting the external power supply wire to the terminal block 60, the mounting surface portions 50d, 50e of the substrate support member 50 of the LED lamp body 1 and the mounting surface portion 2b of the mounting plate are aligned, and the screw 3 (FIG. 8 and Fig. 9). At this time, if the housing 10 is removed, the mounting escape portions 20d and 20e of the translucent cover 20, the mounting escape portions 30d and 30e of the LED unit substrate 30, and the mounting escape portions 40d and 40e of the insulating cover 40 correspond. Therefore, the screwing operation can be easily performed.

このようにLEDランプ本体1を取付板2に装着することにより、図10に模式的に示すように、LED基板支持部材50と取付板2の間に空間部70が生じることになり、この空間部70に端子台60が配置されることになる。またLEDユニット基板30で発生した熱は、LED基板支持部材50に伝わって空間部70に放熱されることになる。   By mounting the LED lamp body 1 on the mounting plate 2 in this manner, a space portion 70 is generated between the LED board support member 50 and the mounting plate 2 as schematically shown in FIG. The terminal block 60 is disposed on the portion 70. Further, the heat generated in the LED unit substrate 30 is transmitted to the LED substrate support member 50 and radiated to the space portion 70.

(第2の実施形態)
図13〜図24は、本発明の第2の実施形態を示したものである。第2の実施形態のLED照明装置は、図13に示すように、LEDランプ本体200と取付板2からなっている。取付板2の構成は第1の実施形態と同じであるから、ここでは説明を省略する。LEDランプ本体200は、LED照射方向から見て、筐体100と、この中に収納される透光性カバー110と、電源部遮蔽部材120と、LEDユニット基板130と、絶縁カバー140と、基板支持部材150と、この基板支持部材150に装着される端子台(電源端子台)160とから概略構成されている。
(Second Embodiment)
13 to 24 show a second embodiment of the present invention. As shown in FIG. 13, the LED lighting device of the second embodiment includes an LED lamp body 200 and a mounting plate 2. Since the configuration of the mounting plate 2 is the same as that of the first embodiment, the description thereof is omitted here. The LED lamp body 200 includes a housing 100, a translucent cover 110 housed therein, a power source shielding member 120, an LED unit substrate 130, an insulating cover 140, a substrate, as viewed from the LED irradiation direction. The support member 150 and a terminal block (power supply terminal block) 160 mounted on the substrate support member 150 are schematically configured.

図14(a)(b)は筐体100を示しており、図14(a)は本実施形態のLEDランプ本体200の組立後の全体形状にもなっている。筐体100の構成は、概略第1の実施形態と同じであるから、ここでは詳細な説明を省略するが、図14(b)に示すように、筐体100の裏面側面部には、後述するように電源部遮蔽部材120の引掛け部120iに係合する係止爪部100aが周方向に複数個所(ここでは3箇所)に突設されている。   14 (a) and 14 (b) show the housing 100, and FIG. 14 (a) also shows the overall shape after the assembly of the LED lamp main body 200 of the present embodiment. Since the configuration of the housing 100 is substantially the same as that of the first embodiment, a detailed description thereof will be omitted here, but as shown in FIG. As described above, the locking claw portions 100a that engage with the hooking portions 120i of the power supply portion shielding member 120 are provided to protrude in a plurality of locations (here, three locations) in the circumferential direction.

電源部遮蔽部材120は、光を透過しないポリカーボネート樹脂等により造られており、LEDユニット基板130に実装されている点灯回路の電子部品を覆い隠すためのものである。   The power source shielding member 120 is made of polycarbonate resin or the like that does not transmit light, and covers the electronic components of the lighting circuit mounted on the LED unit substrate 130.

電源部遮蔽部材120は、図15及び図16に示すように、全体が略蝶形筒体であり、中央円盤部120aと、この中央円盤部120aの対向する両側部に張り出した円弧枠部(張り出し部)120b、120cが一体成形されており、円弧枠部120b,120cが形成されていない部分が装着逃げ部120d,120eとなっている。   As shown in FIGS. 15 and 16, the power source shielding member 120 is generally a butterfly cylindrical body, and has a central disc portion 120 a and arcuate frame portions (see FIG. 15) projecting on opposite sides of the central disc portion 120 a. Overhang portions) 120b and 120c are integrally formed, and portions where the arc frame portions 120b and 120c are not formed are mounting escape portions 120d and 120e.

中央円盤部120aの中央部には開口部120fが形成されており、その開口部120fから後述するLEDユニット基板130のLED素子130fが露出するようになっている。また図19に示すように中央円盤部120aはすり鉢形状となっており、開口部120fから円弧状枠部120b,120cの内縁部に向かって拡口するような傾斜面が形成されている。その傾斜面は、高反射シートの貼付や、高反射用樹脂の塗布等の方法により光反射面となっている。さらに中央円盤部120aの上端周縁部には、等間隔に複数の細長の係合穴120p(本実施形態では3箇所)が形成されている。なお、中央円盤部120aと円弧枠部120b,120cは同心円の湾曲体であり、ここでは、一方の円弧枠部120cが他方の円弧枠部120bよりも長い円弧長となっている。   An opening 120f is formed at the center of the central disk portion 120a, and an LED element 130f of the LED unit substrate 130 described later is exposed from the opening 120f. Further, as shown in FIG. 19, the central disk portion 120a has a mortar shape, and an inclined surface is formed so as to expand from the opening portion 120f toward the inner edge portions of the arcuate frame portions 120b and 120c. The inclined surface is a light reflecting surface by a method such as application of a highly reflecting sheet or application of a highly reflecting resin. Further, a plurality of elongated engagement holes 120p (three in this embodiment) are formed at equal intervals on the upper peripheral edge of the central disk portion 120a. The central disk portion 120a and the arc frame portions 120b and 120c are concentric curved bodies. Here, one arc frame portion 120c has a longer arc length than the other arc frame portion 120b.

電源部遮蔽部材120の円弧枠部120b,120cの外周部には段状の側帯部120hが形成されており、該側帯部120hの周方向の複数個所には引掛け部120iが形成されている(本実施例では3箇所)。引掛け部120iは略凹形状であり、側帯部120hの上端縁部から斜め下方に切り込まれたスライド部120qと爪部120kが形成されており、上述した筒体100の係止爪部100aがスライド部120aにガイドされて引掛け部120iに係入し、爪部120kで係止されるようになっている。   Stepped side band portions 120h are formed on the outer peripheral portions of the arc frame portions 120b and 120c of the power source shielding member 120, and hooking portions 120i are formed at a plurality of locations in the circumferential direction of the side band portions 120h. (Three locations in this example). The hook portion 120i has a substantially concave shape, and is formed with a slide portion 120q and a claw portion 120k that are cut obliquely downward from the upper edge of the side band portion 120h, and the locking claw portion 100a of the cylinder 100 described above. Is guided by the slide part 120a, engages with the hook part 120i, and is locked by the claw part 120k.

また、装着逃げ部120dの一部には開口部120gが形成されており、その開口部120gと通じる中央円盤部120aの裏面部には図16に示すように略台形枠形状の端子台収納部120mが形成されている。また装着逃げ部120bの開口部120gの近くの端面部には、電源電線の挿通孔120jが形成されている。さらに、円弧枠部120b,120cの一端面側にそれぞれ対向して形成されたネジ装着部の裏面部には、ネジ穴120nが形成されている。   Further, an opening 120g is formed in a part of the mounting escape portion 120d, and a terminal block storage portion having a substantially trapezoidal frame shape as shown in FIG. 16 is formed on the back surface portion of the central disk portion 120a communicating with the opening 120g. 120m is formed. Further, an insertion hole 120j for a power supply electric wire is formed in an end surface near the opening 120g of the mounting escape portion 120b. Furthermore, a screw hole 120n is formed in the back surface portion of the screw mounting portion formed to face the one end surface side of each of the arc frame portions 120b and 120c.

透光性カバー110は、図17に示すように前記電源部遮蔽部材120の中央円盤部120aの外周縁部に対応した外径を有する円板形状であり、前記係合穴120pと対応した位置に複数の係合爪部110aが形成されている。この透光性カバー110は、係合爪110aを電源部遮蔽部材120の中央円盤部係合穴120pに係入することにより、電源部遮蔽部材120の中央円盤部120aを覆うように装着される。なお、透光性カバー110は、ポリカーボネート樹脂等に光拡散剤等を添加して透明又は乳白色となっている。   As shown in FIG. 17, the translucent cover 110 has a disk shape having an outer diameter corresponding to the outer peripheral edge of the central disk portion 120a of the power source shielding member 120, and a position corresponding to the engagement hole 120p. A plurality of engaging claws 110a are formed. The translucent cover 110 is mounted so as to cover the central disk part 120a of the power supply unit shielding member 120 by engaging the engaging claws 110a into the central disk part engagement hole 120p of the power supply unit shielding member 120. . The translucent cover 110 is transparent or milky white by adding a light diffusing agent or the like to polycarbonate resin or the like.

LEDユニット基板130は、第1実施態様のLEDユニット基板30と略同形であり、図20に示すように、中央円板部130aと、その両側部に張り出した円弧面部(張り出し面部)130b,130cが一体成形されている。中央円板部130aと円弧面部130b,130cは同心円の湾曲体である。ここでは、後述する電子部品の配置形態に対応するために一方の円弧面部130cが他方の円弧面部130bよりも長い円弧長となっている。また、中央円板部130aと円弧面部130b,130cの間であって、円弧面部130b,130cが形成されていない部分は、切り欠かれた装着逃げ部130d,130eとなっている。   The LED unit substrate 130 is substantially the same shape as the LED unit substrate 30 of the first embodiment, and as shown in FIG. 20, a central disc portion 130a and arcuate surface portions (projecting surface portions) 130b, 130c projecting on both sides thereof. Is integrally molded. The central disk portion 130a and the arcuate surface portions 130b and 130c are concentric curved bodies. Here, one arcuate surface part 130c has a longer arc length than the other arcuate surface part 130b in order to correspond to the arrangement form of electronic components described later. Further, portions between the central disc portion 130a and the arc surface portions 130b and 130c where the arc surface portions 130b and 130c are not formed are notched mounting escape portions 130d and 130e.

第2の実施形態では、装着逃げ部130e側が中央円板部130aの中心部方向に切り込まれており、後述する端子台160の配置スペースを確保している。LEDユニット基板130の中央円板部130aの下面部(照射面側)には、複数のLED素子130fがサークル状に実装されるが、中央円板部130aは第1の実施態様の中央円板部30aに比べて実装面積が狭くなっているため、その分、LED素子130fの実装密度を高くしている。また、円弧面部130b,130cにはLED素子130fを点灯駆動する点灯回路の電子部品(図示せず)が実装されている。   In the second embodiment, the mounting escape portion 130e side is cut in the direction of the central portion of the central disc portion 130a, and a space for arranging the terminal block 160 described later is secured. A plurality of LED elements 130f are mounted in a circle on the lower surface portion (irradiation surface side) of the central disk portion 130a of the LED unit substrate 130. The central disk portion 130a is the central disk of the first embodiment. Since the mounting area is smaller than that of the portion 30a, the mounting density of the LED elements 130f is increased accordingly. Further, an electronic component (not shown) of a lighting circuit that drives the LED element 130f to be lit is mounted on the circular arc surface portions 130b and 130c.

前記絶縁カバー140は、後述する端子台160の配置スペースを確保するために装着逃げ部140d(図13参照)が形成されている。その他の構成は第1の実施形態と同じであるから、ここでは説明を省略する。   The insulating cover 140 is provided with a mounting relief portion 140d (see FIG. 13) in order to secure an arrangement space for a terminal block 160 described later. Since other configurations are the same as those of the first embodiment, description thereof is omitted here.

前記基板支持部材150は、金属板で成形加工されており、図21、図24に示すように、中央円板面部150aの周方向両側部に下面部方向(照射方向と反対方向)に凹設された円弧枠部150b,150cが形成されている。これら円弧枠部150b,150cが形成されていない凸部分が前記取付板2との装着面部150d,150eとなっている。この装着面部150d,150eには略ダルマ状のネジ穴150fがそれぞれ開口されている。ここでは、一方の円弧枠部150cが他方の円弧枠部150bよりも長い円弧長となっている。   The substrate support member 150 is formed by a metal plate, and as shown in FIGS. 21 and 24, is recessed in the lower surface direction (opposite to the irradiation direction) on both sides in the circumferential direction of the central disk surface portion 150a. Arc frame portions 150b and 150c are formed. The convex portions where the arc frame portions 150b and 150c are not formed are mounting surface portions 150d and 150e with the mounting plate 2. The mounting surface portions 150d and 150e are respectively provided with substantially dharma-shaped screw holes 150f. Here, one arc frame portion 150c has a longer arc length than the other arc frame portion 150b.

基板支持部材150の端部、ここでは装着面部150eの端部には、後述の端子台160が収まる開口面積を有する切込口部150gが形成されている。この切込口部150gは、所定幅の切片を中央円板面部150aの中心部方向に切り欠いて形成され、略へ字状に屈曲した起立片150hが形成されている。この起立片150hには、端子台160を止着するための係入孔(図示せず)が形成されている。   At the end of the substrate support member 150, here, the end of the mounting surface 150e, a notch 150g having an opening area in which a terminal block 160 described later is accommodated is formed. The notch 150g is formed by cutting out a section having a predetermined width in the direction of the center of the central disk surface 150a, and an upright piece 150h that is bent substantially in a letter shape is formed. An engaging hole (not shown) for fixing the terminal block 160 is formed in the standing piece 150h.

前記端子台160は、図22に示すように、上面部に複数の係止突起160aが突設されている。この係止突起160aは特に限定されるものではないが、起立片150hの前記係入孔にワンタッチで係着できる構成にすれば、ネジ止め作業等の手間を省くことができる。この端子台160は、基板支持部材150の切込口部150gに挿入し、端子台150gの係止突起160aを起立片150hの係入孔に係入することにより基板支持部材150に装着する。端子台160に、外部電源電線が接続されること、外部電源電線との接続口が取付板2の外部電源電線挿入孔2cに向いていること、端子台160とLEDユニット基板130の電源部とを導通する電源電線の接続口が設けられていることは第1の実施形態と同じである。   As shown in FIG. 22, the terminal block 160 has a plurality of locking projections 160a on the upper surface. The locking protrusion 160a is not particularly limited, but if it is configured to be able to be engaged with the engaging hole of the upright piece 150h with one touch, it is possible to save time and labor such as screwing. The terminal block 160 is inserted into the notch 150g of the substrate support member 150, and is attached to the substrate support member 150 by engaging the locking projection 160a of the terminal block 150g into the engagement hole of the upright piece 150h. An external power supply wire is connected to the terminal block 160, a connection port with the external power supply wire is directed to the external power supply wire insertion hole 2c of the mounting plate 2, and the power supply section of the terminal block 160 and the LED unit board 130 It is the same as that of the first embodiment that the connection port of the power supply wire that conducts is provided.

次に、上述したLED照明装置を天井等の被取付部へ取り付ける手順の一例について説明する。まず第1の実施形態と同じように、外部電源電線(Fケーブル)を取付板2の外部電源線挿通孔2cに挿通し(外部電源電線は天井に開口されている通孔から引き出す)、天井に開口されている外部電源電線の通孔と、取付板2の外部電源線挿通孔2cを合わせ、取付板2の装着部2bを下向き(照射方向)となるようにネジ穴2dを通して被取付部に取付板2をネジ止めする。   Next, an example of a procedure for attaching the LED lighting device described above to an attached part such as a ceiling will be described. First, as in the first embodiment, the external power supply wire (F cable) is inserted into the external power supply wire insertion hole 2c of the mounting plate 2 (the external power supply wire is pulled out from the through hole opened in the ceiling), the ceiling The through-hole of the external power supply wire opened in the hole and the external power line insertion hole 2c of the mounting plate 2 are matched, and the mounted portion is passed through the screw hole 2d so that the mounting portion 2b of the mounting plate 2 faces downward (irradiation direction) The mounting plate 2 is screwed to.

一方、LEDランプ本体200の基板支持部材150と絶縁カバー140とLED基板130は、あらかじめ複数のネジ170(図13、図20)により止着され、一体化されている。そして、端子台160に外部電源電線を接続した後、この端子台160を基板支持部材150の起立片150hに上述のように取り付ける(図20の状態)。端子台160と外部電源電線の接続手順等は、第1の実施形態と同じであるから、ここでは説明を省略する。   On the other hand, the substrate support member 150, the insulating cover 140, and the LED substrate 130 of the LED lamp main body 200 are fastened and integrated by a plurality of screws 170 (FIGS. 13 and 20) in advance. And after connecting an external power supply electric wire to the terminal block 160, this terminal block 160 is attached to the standing piece 150h of the board | substrate support member 150 as mentioned above (state of FIG. 20). Since the connection procedure of the terminal block 160 and the external power supply wire is the same as in the first embodiment, the description thereof is omitted here.

その後、電源部遮蔽部材120を基板支持部材150にネジ止めにより取り付ける(図19の状態)。すなわち図13に示すように、基板支持部材150の通孔150kから挿通したネジ180を電源部遮蔽部材120のネジ穴120n(図16)に螺入することにより、電源部遮蔽部材120を基板支持部材150に止着する。このとき、基板支持部材150に取り付けられた端子台16は、電源部遮蔽部材120の端子台収納部120mに収納された状態となる。   Thereafter, the power source shielding member 120 is attached to the substrate support member 150 by screws (state of FIG. 19). That is, as shown in FIG. 13, the screw 180 inserted through the through hole 150 k of the substrate support member 150 is screwed into the screw hole 120 n (FIG. 16) of the power supply shield member 120, thereby supporting the power supply shield member 120. Fastened to the member 150. At this time, the terminal block 16 attached to the board support member 150 is stored in the terminal block storage section 120m of the power supply section shielding member 120.

次に、取付板2に、基板支持部材150と絶縁カバー140とLED基板130と電源部遮蔽部材120及び透光性カバー110を一体化したユニットを取り付ける。すなわち、ネジ190(図13、図20、図21)を基板支持部材150のネジ穴150fを通して取付板2のネジ穴2fに螺入することにより基板支持部材150を取付板2に固定する。その後、電源部遮蔽部材120の中央円盤部120aに上述の方法で透光性カバー110を装着し、最後に筐体100の係合爪部110aを電源部遮蔽部材120の引掛け部120iに係入して筐体100を電源部遮蔽部材120に係脱可能に取り付ける。   Next, a unit in which the substrate support member 150, the insulating cover 140, the LED substrate 130, the power source shielding member 120, and the translucent cover 110 are integrated is attached to the attachment plate 2. That is, the board support member 150 is fixed to the mounting plate 2 by screwing screws 190 (FIGS. 13, 20, and 21) into the screw holes 2f of the mounting plate 2 through the screw holes 150f of the board supporting member 150. Thereafter, the translucent cover 110 is attached to the central disk portion 120a of the power supply unit shielding member 120 by the above-described method, and finally the engaging claw portion 110a of the housing 100 is engaged with the hooking portion 120i of the power supply unit shielding member 120. The housing 100 is removably attached to the power source shielding member 120.

第2の実施形態によれば、端子台160が基板支持部材150の切込口部150gに装着されるため、図18乃至図21に示すように、端子台160が基板支持部材150の上方(電源部遮蔽部材120の配置方向)に突き出た状態になり、その分、LEDユニット基板130と、電源部遮蔽部材120に装着された透光性カバー110の間隔が大きくなる。このため、LEDユニット基板130に実装されているLED素子130fが透光性カバー110に粒々状に投影される状態を防止又は小さくすることができ、美麗な発光面とすることができる。また、被取付部への取り付けも簡単に行うことができる。   According to the second embodiment, since the terminal block 160 is attached to the notch 150g of the substrate support member 150, the terminal block 160 is located above the substrate support member 150 (see FIG. 18 to FIG. 21). In this state, the distance between the LED unit substrate 130 and the translucent cover 110 attached to the power supply shielding member 120 is increased. For this reason, it is possible to prevent or reduce the state in which the LED elements 130f mounted on the LED unit substrate 130 are projected in a granular shape on the translucent cover 110, and a beautiful light emitting surface can be obtained. Moreover, the attachment to a to-be-attached part can also be performed easily.

また、電源部遮蔽部材120をポリカーボネート樹脂製とすることにより、絶縁性が向上し、材料費を削減することができる。また、電源部遮蔽部材120にすり鉢形状の光反射面を形成したことにより、LED照射光を広範囲に均一に反射させることができる。さらに、電源部遮蔽部材120をすり鉢形状とすることによりLED照射効率をアップさせることができる。   Further, by making the power source shielding member 120 made of polycarbonate resin, the insulation can be improved and the material cost can be reduced. Moreover, by forming the mortar-shaped light reflecting surface on the power supply unit shielding member 120, the LED irradiation light can be uniformly reflected over a wide range. Furthermore, LED irradiation efficiency can be improved by making the power supply part shielding member 120 into a mortar shape.

なお、本実施形態ではLEDランプ本体2の形状を円筒形にしたが、これに限定されず断面が4角形等からなる扁平な多角柱であってもよい。   In the present embodiment, the shape of the LED lamp main body 2 is a cylindrical shape, but is not limited thereto, and may be a flat polygonal column having a quadrangular cross section.

以上、この発明の実施の形態を説明したが、この発明は、これらの実施の形態に限られるものではなく、この発明の要旨を逸脱しない範囲の設計変更があっても本発明に含まれる。すなわち、当業者であれば、当然なし得る各種変形、修正もまた本発明に含まれる。   As mentioned above, although embodiment of this invention was described, this invention is not restricted to these embodiment, Even if there is a design change of the range which does not deviate from the summary of this invention, it is included in this invention. That is, various changes and modifications that can be made by those skilled in the art are also included in the present invention.

1 LEDランプ本体
2 取付板
2b 装着面部
10 筐体
20 透光性カバー
30 LEDユニット基板
40 絶縁カバー
50 基板支持部材
50a 装着面部
60 端子台
100 LEDランプ本体
110 透光性カバー
120 電源部遮蔽部材
130 LEDユニット基板
140 絶縁カバー
150 基板支持部材
150g 切込口部
150h 起立片
160 端子台
DESCRIPTION OF SYMBOLS 1 LED lamp main body 2 Mounting plate 2b Mounting surface part 10 Case 20 Translucent cover 30 LED unit board 40 Insulating cover 50 Substrate support member 50a Mounting surface part 60 Terminal block 100 LED lamp main body 110 Translucent cover 120 Power supply part shielding member 130 LED unit substrate 140 Insulation cover 150 Substrate support member 150g Cut opening 150h Standing piece 160 Terminal block

Claims (2)

すり鉢形状の光反射面を有する電源部遮蔽部材と、
前記電源部遮蔽部材の中央に設けられたLED素子と、
前記電源部遮蔽部材に装着され、前記LED素子を覆う透光性カバーと、を有するLEDランプ本体と、
前記LEDランプ本体を被取付部に取り付ける取付板と、
を備え、
前記取付板には前記取付板の前記LEDランプ本体側の面から起立した前記LEDランプ本体の装着面部が複数形成されており、
前記装着面部にはネジ穴が形成されており、
前記LEDランプ本体の前記取付板側の一部にはネジを挿通する開口が形成されており、
前記開口を挿通して前記装着面部のネジ穴にネジを止着することにより、前記LEDランプ本体が前記取付板に取り付けられるLED照明装置。
A power source shielding member having a mortar-shaped light reflecting surface;
An LED element provided in the center of the power source shielding member;
An LED lamp main body having a translucent cover attached to the power supply unit shielding member and covering the LED element;
A mounting plate for mounting the LED lamp body on the mounted portion;
With
The mounting plate is formed with a plurality of mounting surface portions of the LED lamp body that stand up from the surface of the mounting plate on the LED lamp body side,
The mounting surface portion is formed with a screw hole,
An opening through which a screw is inserted is formed in a part of the mounting side of the LED lamp body,
An LED lighting device in which the LED lamp body is attached to the mounting plate by inserting the opening and fastening a screw in a screw hole of the mounting surface portion.
前記取付板には、外部電源電線が挿通する外部電源挿通孔が設けられ、かつ、被取付部に装着するための複数の長尺状ネジ穴が互いに長手方向の向きを変えて設けられている請求項1に記載のLED照明装置。   The mounting plate is provided with an external power supply insertion hole through which an external power supply wire is inserted, and a plurality of long screw holes for mounting on the mounted portion are provided with their longitudinal directions changed from each other. The LED lighting device according to claim 1.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03283305A (en) * 1990-03-30 1991-12-13 Toshiba Lighting & Technol Corp Illumination apparatus
JP2012243392A (en) * 2011-05-13 2012-12-10 Toshiba Lighting & Technology Corp Lighting fixture
WO2013161185A1 (en) * 2012-04-26 2013-10-31 Panasonic Corporation Lamp and lighting apparatus
JP2014149945A (en) * 2013-01-31 2014-08-21 Panasonic Corp Lighting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03283305A (en) * 1990-03-30 1991-12-13 Toshiba Lighting & Technol Corp Illumination apparatus
JP2012243392A (en) * 2011-05-13 2012-12-10 Toshiba Lighting & Technology Corp Lighting fixture
WO2013161185A1 (en) * 2012-04-26 2013-10-31 Panasonic Corporation Lamp and lighting apparatus
JP2014149945A (en) * 2013-01-31 2014-08-21 Panasonic Corp Lighting device

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