JP2017165045A - Molded product and in-mold molding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve reliability when a circuit layer of a molded product body and outside are electrically connected to each other.SOLUTION: There is provided a molded product which includes a molded product body (17) formed from an electric insulative resin layer, a wiring base (21) that is molded integrally with the outer periphery of the molded product body (17), extends to the outside of the molded product body (17) and is formed from the electric insulative resin, and a circuit layer (13) that is formed from an upper face of the molded product body (17) to an upper face of the wiring base (21) and has conductivity, where a thickness of the wiring base (21) is thinner than the molded product body (17).SELECTED DRAWING: Figure 1

Description

  The present invention relates to a molded product applied to products requiring an electric circuit such as an electrostatic switch and a touch panel as well as home appliances and automobile parts, and an in-mold molding apparatus for manufacturing the molded product.

FIG. 14 shows a conventional in-mold forming apparatus.
An in-mold molding apparatus composed of a first mold 1 and a second mold 2 includes an in-mold film 5 stretched between a supply reel 3 and a take-up reel 4, and a film clamp mechanism 6 and a second mold. 2, the molding resin is injected into the cavity space formed by closing the mold and closing the mold, and the transfer layer of the in-mold film 5 is transferred to the molded product, whereby the resin injection molding and the surface decoration are performed simultaneously.

A basic configuration of the in-mold film 5 is shown in FIG.
The in-mold film 5 is manufactured by sequentially applying a release layer 8, a hard coat layer 9, a pattern layer 10, and an adhesive layer 11 to a base material sheet 7.

  A transfer layer 12 composed of the hard coat layer 9, the picture layer 10 and the adhesive layer 11 is transferred to the molded product. The base sheet 7 plays a role for supplying the transfer layer 12 between the first mold 1 and the second mold 2, and the in-mold film 5 is directed from the supply reel 3 toward the take-up reel 4. , And is intermittently transferred in synchronization with the molding cycle.

  Materials such as polyethylene terephthalate, polycarbonate, and PMMA (polymethyl methacrylate resin) are used for the base sheet 7. The release layer 8 functions to enhance the releasability between the base sheet 7 and the molded product. An acrylic resin, a polyester resin, a polyurethane resin or a melamine resin, which is a thermosetting resin, is used as the release layer 8. Use it. The hard coat layer 9 acts as an antifouling property in order to prevent the occurrence of scratches and damage to the in-mold molded product, and to increase the depth of the pattern of the pattern layer 10, so as to prevent deterioration. A resin, a radiation curable resin, or a thermosetting resin may be used. The pattern layer 10 is a layer that functions to impart design properties to the resin surface, and an organic pigment and a polyvinyl resin, a polyamide resin, a polyester resin, an acrylic resin, or a polyurethane resin may be used as materials. A mirror-like design can be given to the resin surface by forming a metal foil film such as aluminum, tin, or indium on the pattern layer 10 by a method such as sputtering or vacuum deposition. The adhesive layer 11 is a layer that serves to adhere the molding resin and the pattern layer 10, and uses a polyacrylic resin, a polystyrene resin, a polycarbonate resin, or a polyamide resin that has an affinity for the molding resin and the pattern layer 10. Good. As the coating method for the release layer 8, the hard coat layer 9, the pattern layer 10, and the adhesive layer 11, a printing method such as a gravure printing method, a screen printing method, or an offset printing method may be used. When ink jet printing is used for the pattern layer 10, a beautiful pattern can be drawn.

  By patterning a conductive material between the hard coat layer 9 and the picture layer 10, the in-mold film 5 can have an electrical function. For example, by drawing a capacitor circuit, a capacitive touch sensor function used for a touch panel or a touch switch can be provided.

FIG. 16 shows an in-mold film having a circuit layer 13 made of a conductive material.
In this in-mold film 5, a transfer layer 12 b is formed on a base sheet 7 with a release layer 8 interposed therebetween. The transfer layer 12 b includes a hard coat layer 9, a circuit layer 13, a picture layer 10, and an adhesive layer 11.

  As the conductive material of the circuit layer 13, it is preferable to use a metal, for example, a polyvinyl resin, a polyamide resin, a polyester resin, an acrylic resin, or a polyurethane resin mixed with a filler of silver or copper. As a coating method of the circuit layer 13, a printing method such as a method using a dispenser, a gravure printing method, a screen printing method, or an offset printing method may be used. In particular, when ink jet printing is used, a dense line thickness circuit can be drawn.

The process of the manufacturing method of the in-mold molded product using the in-mold film 5 with this circuit layer 13 is demonstrated using Fig.17 (a)-(d).
First, in FIG. 17A, an in-mold film 5 composed of a base sheet 7 and a transfer layer 12 is supplied between the first mold 1 and the second mold 2.

In FIG. 17B, the cavity space 14 is created by closing the mold while adsorbing the in-mold film 5 to the second mold 2 by the second mold 2 and the film clamp mechanism 6.
In FIG. 17C, a high-temperature and high-pressure molding resin 15 is poured into the cavity space, and at this time, the transfer layer 12b is brought into close contact with the molding resin and then cooled.

  In FIG. 17D, the base sheet 7 of the in-mold film 5 remains in the second mold 2 by the opening of the mold, and the transfer layer 12b of the in-mold film 5 is transferred to the surface of the molded product. Thereafter, the molded product 16 is obtained by releasing the molded product from the first mold 1. FIG. 18A shows the molded product 16. The molded product 16 is configured by transferring the transfer layer 12b to a molded product body 17 in which the molding resin 15 is cooled and solidified.

  At this time, as shown in FIG. 18B, a part of the circuit layer 13 exposed by removing a part of the hard coat layer 9 is replaced with an ACF (anisotropic conductive film) 18 and an FPC (flexible circuit board). The electrical function of the circuit layer 13 can be utilized by connecting to the drive circuit or the like via the circuit 19. Instead of ACF 18, ACP (anisotropic conductive paste) or conductive adhesive may be used.

JP 2014-99199 A

FIG. 19 shows a connection state in which the FPC 19 connects the circuit layer 13 having a touch panel function and the device connector unit 20.
At this time, since the FPC 19 has flexibility and the thickness itself of the FPC 19 is uniform, an arc shape is drawn by bending, but a repulsive force against bending is exerted. Therefore, physical stress is applied to the locations at both ends of the FCP 19, that is, the locations where the ACF 18 is joined to the device connector portion 20. As a result, separation at the interface between the ACF 18 and the FPC 19, separation at the interface between the circuit layer 13 and the ACF 18, and connection between the FPC 19 and the device connector unit 20 may be disconnected.

  As a measure for preventing accidents such as peeling or disconnection in this way, conventionally, measures have been taken to seal and fix the vicinity of the ACF 18 and the FPC 19 and the FPC 19 and the device connector portion 20 with a UV curable resin or the like. This leads to high manufacturing costs.

  In addition, as for the FPC 19 to bend while drawing an arc shape, it is necessary to secure a space on the product configuration for drawing a large arc shape by handling the FPC 19, and the FPC 19 has a repulsive force against deformation. At this time, since it is not easy to connect to the device connector 20 with the FPC 19 bent, it is necessary to design a product configuration that takes that into consideration.

  In the present invention, physical stress acting on the corresponding portion is applied to the joint portion between the insert molded product and the FPC 19 or the connection portion between the FPC 19 and the device connector portion 20 without taking measures such as resin sealing. It is an object of the present invention to provide a flexible substrate integrated molded product for external connection and an in-mold molding apparatus that can be reduced as compared with the prior art.

  The molded product of the present invention includes a molded product body made of an electrically insulating resin layer, and a wiring base made of an electrically insulating resin integrally formed on the outer periphery of the molded product body and extended to the outside of the molded product body. And a conductive circuit layer formed from the upper surface of the molded product body to the upper surface of the wiring base, and the wiring base is thinner than the molded product body.

  Further, the molded product of the present invention is integrally molded by connecting an end portion inside the molded product main body by a molded product main body made of an electrically insulating resin layer and a notch formed in the molded product main body. A wiring base made of an electrically insulating resin and a conductive circuit layer formed from the upper surface of the molded product body to the upper surface of the wiring base are provided, and the thickness of the wiring base is thinner than that of the molded product body It is characterized by that.

  In the in-mold molding apparatus of the present invention, a first mold and a second mold are formed by closing a mold with an in-mold film formed with a transfer layer formed on a base sheet via a release layer. A molding resin is injected into the cavity space from the side of the first mold on the side of the transfer layer, and a molded product in which the transfer layer is transferred to the surface of the molded product body formed of the cured molding resin is created. In the in-mold molding apparatus, a convex portion that forms a wiring base having a shape that is thinner than the inner periphery and extended outward from the molded product body on the outer periphery of the molded product body forms the cavity space. It is formed on the mold surface of the first mold.

  In the in-mold molding apparatus of the present invention, the first mold and the second mold are closed by sandwiching an in-mold film in which a transfer layer is formed on a base sheet via a release layer. A molded product in which the transfer layer is transferred onto the surface of the molded product body formed by injecting a molding resin from the first mold side on the transfer layer side into the cavity space thus formed. The first mold for forming the cavity space and the first mold corresponding to a notch for forming a wiring base having an end connected to the inside of the molded product body A convex part is formed on the surface of at least one of the two molds, and a convex part that makes the wiring base thinner than the molded product body is formed on the mold surface of the first mold. It is characterized by that.

  According to this configuration, a wiring base that is thinner than the molded product body is integrally formed on the molded product body made of an electrically insulating resin layer, and the conductive circuit is formed from the upper surface of the molded product body to the upper surface of the wiring base. Since the layer is formed, the electric circuit function of the circuit layer of the molded article body can be connected to an external circuit through the circuit layer on the wiring base, so that conventional FPC bonding is not required. In addition, by designing the thickness of the wiring base so that it can be more easily deformed than when using an FPC, it becomes easier to connect to the device connector part during assembly, which increases the efficiency of assembly and Loss is reduced.

  Further, since the wiring base is more easily deformed than in the case of FPC, it is difficult for peeling and connection disconnection to occur at the joining portion, which has conventionally occurred. For this reason, it is possible to reduce the number of processes and material costs by eliminating the need to seal the UV curable resin to the joint portion, which was necessary in the past.

Enlarged sectional view of the molded product of the present invention Side view of the molded product shown in FIG. The expanded sectional view of the molding process which shows the in-mold molding device of the present invention (A) (b) The expanded sectional view of the formation process of another Example, respectively (A) (b) The expanded sectional view of the formation process of another Example, respectively (A) Top view of an in-mold molded product having a wiring base at the outer periphery, (b) a cross-sectional view thereof, and (c) a cross-sectional view of another embodiment (A) A top view of a molded product having a wiring base inside the molded product, (b) a sectional view thereof, and (c) a sectional view of another embodiment. (A) Top view of a molded product having a wiring base on the outer periphery and inside of the molded product, (b) a sectional view thereof, and (c) a sectional view of another embodiment. Sectional view of the insert molding device when the wiring base is formed inside the molded product body (A) Top view and (b) Cross-sectional view of a molded product made of a molded resin with a different molded body and wiring base The expansion perspective view which shows the use condition of the in-mold molded article shown in FIG. (A) 1st process drawing of the in-mold molding apparatus which manufactures the molded article of FIG. 10, (b) 2nd process drawing (A) enlarged sectional view showing another embodiment of in-mold molded product, (b) top view thereof and (c) side view Configuration diagram of conventional in-mold molding equipment Expanded sectional view of in-mold film Enlarged sectional view of an in-mold film with a circuit layer (A) (b) (c) (d) is an explanatory view of the in-mold molding process (A) An enlarged cross-sectional view of an in-mold molded product having a circuit layer, and (b) an enlarged cross-sectional view of an in-mold molded product in a state where the FPC is joined to the circuit layer. Enlarged sectional view of the FPC bent and joined to the device connector

Hereinafter, an in-mold molded product in which a flexible substrate for external connection of the present invention is formed integrally with a molded body will be described based on specific embodiments.
In addition, the same code | symbol is attached | subjected and demonstrated to what has the effect | action similar to FIGS.

(Embodiment 1)
FIG. 1 shows an in-mold product of the present invention.
The wiring base 21 made of an electrically insulating resin is integrally molded on the outer periphery of a molded product body 17 formed by injecting and cooling an electrically insulating molding resin 15. The wiring base 21 is narrower than the molded product body 17 and extends to the outside of the molded product body 17. The thickness d1 of the wiring base 21 is thinner than the thickness d0 of the molded product body 17. Further, a transfer layer 12 b including a conductive circuit layer 13 is formed over the upper surface of the molded product body 17 and the upper surface of the wiring base 21.

  This molded product 16 can be manufactured by in-mold molding using the in-mold film 5 shown in FIG. The transfer layer 12 b includes an adhesive layer 11, a picture layer 10, a circuit layer 13, and a hard coat layer 9.

  The circuit layer 13 is obtained by patterning a conductive material so that the in-mold film 5 has an electrical function. For example, by drawing a capacitor circuit, a capacitance used for a touch panel or a touch switch. It is possible to provide a touch sensor function of the system.

  On the surface of the wiring base 21 opposite to the surface on which the transfer layer 12b is formed, that is, on the lower surface of the wiring base 21, there is a recess 22 in a direction intersecting the length direction of the wiring base 21 (arrow J1 direction). The wiring base 21 is formed at predetermined intervals in the length direction.

The hard coat layer 9 at the tip 23 of the wiring base 21 is removed, and the lower circuit layer 13 is exposed.
With this configuration, when the device connector portion 20 located in the vicinity of the molded product body 17 and the circuit layer 13 of the molded product body 17 are electrically connected as shown in FIG. Connect to the connector 20. The wiring base 21 curved by this connection can bend smoothly at a portion where the concave portion 22 is formed and is thinner than other portions of the wiring base 21, and the hard coat layer 9, circuit layer of the wiring base 21 can be bent. 13. Unnecessary force does not act on the pattern layer 10 and the adhesive layer 11.

  More specifically, since the wiring base 21 is bent at the thin portion 24 by the concave portion 22 of the wiring base 21, a repulsive force is applied to the bending of the thin portion, but the force takes precedence over the interface with the adjacent thick portion. Therefore, the magnitude of physical stress at the joint portion between the molded product body 17 and the wiring base 21 and the connection portion between the wiring base 21 and the device connector portion 20 can be made smaller than in the conventional configuration.

  Further, by making the thickness of the thin portion 24 thinner than the thickness of the FPC (flexible circuit board) 19 or selecting the molding resin 15 having a smaller repulsive force against deformation than the FPC 19, the repulsive force against deformation of the entire wiring base 21 is obtained. Can be made smaller than when the FPC 19 is used.

  As described above, in the molded product 16, since the connection line that connects the circuit layer 13 of the molded product body 17 to the outside can be formed on the wiring base 21 integrally formed with the molded product body 17, Such FPC bonding is not necessary. Thereby, the FPC member cost, the manufacturing process, and the manufacturing lead time can be reduced.

  In addition, by designing the thickness of the wiring base 21 so as to be more easily deformed than when an FPC is used, it becomes easier to connect to the device connector portion 20 during assembly, thereby increasing the efficiency of assembly. , Process loss is reduced.

  Furthermore, since the wiring base 21 is more easily deformed than in the case of an FPC, it is difficult for peeling and connection disconnection that have occurred in the past to occur. For this reason, it is possible to reduce the number of processes and material costs by eliminating the need to seal the UV curable resin to the joint portion, which was necessary in the past.

(Embodiment 2)
FIG. 3 shows a main part of the insert molding apparatus.
The first mold 1 of the first mold 1 and the second mold 2 is formed with a convex portion 25 that forms a wiring base 21 having a base end connected to one side of the outer periphery of the molded product body 17. Yes. The convex portion 25 is formed from the mold surface of the first mold 1 to the mold surface of the second mold 2 in the cavity space 14 formed by closing the first mold 1 and the second mold 2. Protrusively.

  Further, the convex part 25 of the first mold 1 has auxiliary convex parts 26, 27, 28 that form the concave part 22 in the width direction intersecting with the length direction (arrow J 1 direction) of the wiring base 21. It is formed at predetermined intervals in the vertical direction. The tip shapes of the auxiliary convex portions 26, 27, 28 are flat. The convex portion 28 is lower in height than the auxiliary convex portions 26 and 27 close to the molded product body 17.

  In this insert molding apparatus, the first mold 1 and the second mold 2 are closed with the in-mold film 5 interposed therebetween, and the formed cavity space is formed from the first mold 1 side on the transfer layer 12b side. The molded resin is injected to create a molded product in which the transfer layer 12b is transferred onto the surface of the molded product main body 17 formed of the cured molded resin. FIG. The state of the cooling process is shown.

The in-mold molded product described in FIG. 1 can be manufactured by taking out the molded product 16 through the mold release step (FIG. 17D) of the insert molding apparatus.
(Embodiment 3)
4A, the tips of the auxiliary convex portions 26, 27, and 28 of the first mold 1 are acute angles. In this way, by making the tips of the auxiliary convex portions 26 to 28 have an acute angle, the angle at which the wiring base 21 bends is gradual compared to the case where the tips of the auxiliary convex portions 26 to 28 are made flat as shown in FIG. Can be regulated.

  4B, the tips of the auxiliary convex portions 26 and 27 on the base end side of the wiring base 21 are flat, and the tips of the auxiliary convex portions 28 on the tip side of the wiring base 21 are more acute than the auxiliary convex portions 26 and 27. I have to. By doing so, the bending angle of the wiring base 21 can be made larger on the proximal end side of the wiring base 21 than on the distal end side of the wiring base 21.

(Embodiment 4)
In the insert molding apparatus according to the third embodiment, the auxiliary convex portions 26, 27, and 28 are formed integrally with the first mold 1, and the first mold 1 and the auxiliary convex portions 26 to 28 are in the mold closed state and the mold. Although moved simultaneously when opened, in this fourth embodiment, the nests 26b, 27b, 28b projecting from the fourth mold 1 into the cavity space 14 after the mold is closed are formed on the convex portion 25.

FIG. 5A is formed by inserting and retracting the inserts 26b to 28b having a flat tip into and out of the cavity space 14 by hydraulic, pneumatic or electric cylinders.
FIG. 5 (b) is configured by driving the inserts 26c to 28c with acute angles at the tip in a direction different from the mold closing in the direction of the arrow by hydraulic, pneumatic or electric cylinders.

  In the case of FIG. 5A or 5B, it is easier to fill the molding resin 15 to the tip of the wiring base 21 than in the configuration of FIG. Further, by forming the mold in a divided structure, it is possible to suppress a defect caused by burning of the molded product, which is generated when the gas generated from the molding resin is released from the gap between the molds.

(Embodiment 5)
The in-mold molded product of Embodiment 1 will be described more specifically.
FIG. 6A is a plan view in the case where there is one wiring base 21 integrally formed on the outer periphery of the molded product body 17 in the molded product body 17. 6B is a cross-sectional view taken along the alternate long and short dash line in FIG. 6A, and the bottom surface of the recess 22 is a plane. The wiring base 21 is thinner than the molded product body 17.

FIG. 6C is a cross-sectional view of the alternate long and short dash line of another embodiment of FIG. 6A, and the bottom surface of the recess 22 has an acute angle. The wiring base 21 is thinner than the molded product body 17.
FIG. 7A is a plan view in the case where there is one wiring base 21 made of an electrically insulating resin formed by connecting an end inside the molded product main body 17 in the molded product main body 17. A U-shaped notch 29 is formed in the molded product body 17 during insert molding. FIG. 7B is a cross-sectional view taken along the alternate long and short dash line in FIG. 7A, and the bottom surface of the recess 22 is a plane. The wiring base 21 is thinner than the molded product body 17.

FIG. 7C is a cross-sectional view of the alternate long and short dash line of another embodiment of FIG. 7A, and the bottom surface of the recess 22 has an acute angle. The wiring base 21 is thinner than the molded product body 17.
FIG. 8A shows an electrical insulation formed by connecting the wiring base 21 integrally formed on the outer periphery of the molded product body 17 to the molded product body 17 at two locations and the inner side of the molded product body 17. 6 is a plan view in the case where there is one wiring base 21 made of the resin in the molded product body 17. FIG. 8B is a cross-sectional view taken along the alternate long and short dash line in FIG. 8A, and the bottom surface of the recess 22 is a plane. The wiring base 21 is thinner than the molded product body 17.

FIG. 8C is a cross-sectional view of the alternate long and short dash line in another embodiment of FIG. 8A, and the bottom surface of the recess 22 has an acute angle. The wiring base 21 is thinner than the molded product body 17.
FIG. 9 shows an insert molding apparatus when the notch 29 is formed inside the molded product body 17. In this case, the first mold 1 is different from the case shown in FIG. 3 only in that a convex portion 30 whose tip is in contact with the second mold 2 is formed in the mold closed state.

  In FIG. 9, the protrusion 30 for forming the notch 29 is provided in the first mold 1, but the protrusion 30 for forming the notch 29 is provided in the second mold 2, The notch 29 can also be formed by bringing the two convex portions provided on the first mold 2 and the first mold 2 into contact with each other.

(Embodiment 6)
In the in-mold molded product of each of the embodiments described above, the molded product main body 17 and the wiring base 21 are molded resins of the same material. In the sixth embodiment, the formation of the molded product body 17 and the wiring base 21 using different molding resins is described.

  Since the wiring base 21 needs to withstand deformation against bending, a resin that is resistant to bending fatigue such as PP (polypropylene) resin is suitable. It is necessary to reduce the thickness of a resin that is weak against bending fatigue, such as PMMA (acrylic) resin, but in injection molding, it is not preferable to form a too thin shape from the viewpoint of production stability. In addition, in the case of in-mold molded products that require light-transmitting properties, such as display covers, transparent resins such as PMMA (acrylic) are required, but transparent resins are resistant to bending fatigue. Low. As described above, it may be more reasonable as a product characteristic to form the wiring base 21 and the molded product body 17 with different molding resins.

  In the in-mold molded product shown in FIGS. 10A and 10B, the molded product main body 17 and the wiring base 21 are integrally molded with different molding resins. In order to prevent the resin constituting the molded product body 17 and the resin constituting the wiring base 21 from being separated, the bonding distance between the molded product body 17 and the wiring base 21 is increased as shown in FIG. As described above, a part 31 of the molding resin following the wiring base 21 enters the inside of the molded product body 17 and is molded by injection. Further, a small convex portion 32 is formed on a part of the molding resin 15 a entering the molded product body 17, and the molding resin 15 b forming the remaining part of the molded product body 17 is interposed between the convex portions 32. It has entered and hardened. FIG. 11 shows a perspective view.

  In addition, a small concave portion is formed instead of the small convex portion 32 in a part of the molding resin 15a entering the molded product main body 17, and the remaining portion of the molded product main body 17 is formed in this small concave portion. It is the same even if it enters and solidifies.

(Embodiment 7)
In order to realize the in-mold molded product shown in FIGS. 10A and 10B, a so-called two-color molding machine capable of injecting two types of molding resins into a mold is required as an in-mold molding apparatus. It is.

  In the in-mold molding apparatus according to the seventh embodiment, as shown in FIGS. 12A and 12B, the first mold 1 includes a first split mold 1a, second split molds 34 and 35, and a third split mold. A split mold 36 is provided.

  In the step shown in FIG. 12A, the first cavity space 14a of the wiring base 21 is formed by the second mold 2 and the first divided mold 1a. Further, the first split mold 1a, the second mold 2 and the second split molds 34, 35 form a second cavity space 14b communicating with the first cavity space 14a in a part of the molded product body 17. ing.

In the step shown in FIG. 12A, the molding resin 15 a forming the wiring base 21 is filled into the mold from the gate 33 of the first mold 1.
After filling the molding resin 15a, the second divided dies 34 and 35 are driven in the directions of arrows J2 and J3 by hydraulic, pneumatic or electric cylinders.

  In the step shown in FIG. 12 (b), the third split mold 36 is driven in the direction of arrow J4 by hydraulic, pneumatic or electric cylinders, and the second mold 2, the first split mold 1a, A third cavity space 14 c that forms the remaining part of the molded product body 17 is formed by the three-part mold 36. In this state, the in-mold molded product shown in FIGS. 10A and 10B can be molded by filling the third cavity space 14c with the molding resin 15b and cooling it.

(Embodiment 8)
13A, 13B, and 13C show specific examples of the molded product 16 of the first embodiment.
In this in-mold molded product, an anchor-shaped claw 37 is integrally formed on the wiring base 21 at the tip of the wiring base 21.

  In this way, the claws 37 are formed on both side surfaces of the front end of the wiring base 21 and engaged with the device connector portion 20, thereby making it difficult to remove the wiring base 21 on which the circuit layer 13 is formed from the device connector portion 20. it can.

  The present invention contributes to improving the reliability of molded products applied to products that require electrical circuits such as electrostatic switches and touch panels, as well as home appliances and automobile parts.

DESCRIPTION OF SYMBOLS 1 1st metal mold | die 2 2nd metal mold | die 3 Supply reel 4 Take-up reel 5 In-mold film 6 Film clamp mechanism 7 Base material sheet 8 Peeling layer 9 Hard coat layer 10 Picture layer 11 Adhesive layer 12b Transfer layer 13 Circuit layer 14 Cavity Space 14a First cavity space 14b Second cavity space 14c Third cavity space 15 Molded resin 16 Molded product 17 Molded product body 20 Device connector portion 21 Wiring base 22 Recess 23 in a direction intersecting the length direction of the wiring base 21 Wiring base The tip 24 of 21 The thin part 25 by the recessed part 22 of the wiring base 21 The convex part 26,27,28 which forms the wiring base 21, Auxiliary convex part 29 Notch part 30 The convex part 31 which shape | molds the notch part 29 The wiring base 21 is comprised. Part of resin 32 to be formed Partly small protrusion 33 of molded resin 15a Gate 1a First division Type 34 and 35 the length direction of the second split mold 36 third split mold 37 nails J1 wiring base 21

Claims (12)

A molded product body made of an electrically insulating resin layer;
A wiring base made of an electrically insulating resin integrally formed on the outer periphery of the molded product body and extended to the outside of the molded product body;
A conductive circuit layer formed from the upper surface of the molded product body to the upper surface of the wiring base, and the wiring base is thinner than the molded product body,
Molding. A molded product body made of an electrically insulating resin layer;
A wiring base made of an electrically insulating resin integrally formed by connecting an end to the inside of the molded product body by a notch formed in the molded product body;
A conductive circuit layer formed from the upper surface of the molded product body to the upper surface of the wiring base, and the wiring base is thinner than the molded product body,
Molding. The surface of the wiring base opposite to the circuit layer has a recess in a direction intersecting the length direction of the wiring base.
The molded article according to claim 1 or 2. The molded product body and the wiring base are the same material,
The molded article according to claim 1 or 2. The material of the molded product body and the wiring base are different.
The molded article according to claim 1 or 2. The circuit layer has an electric circuit function;
The molded article according to claim 1 or 2. The concave portion has an acute angle shape,
The in-mold molded product according to claim 3. The first mold and the second mold are closed with an in-mold film on which a transfer layer is formed on a base sheet with a release layer interposed therebetween, and the transfer layer side of the transfer layer is formed in the formed cavity space. In an in-mold molding apparatus for injecting a molding resin from the first mold side and creating a molded product in which the transfer layer is transferred to the surface of a molded product main body formed of the cured molding resin.
A convex portion forming a wiring base having a shape thinner on the outer periphery of the molded product body than the inner periphery and extending outward from the molded product body is the first mold that forms the cavity space. Formed on the surface of the mold,
In-mold molding device. The convex portion has a shape further having an auxiliary convex portion for forming a thin wall in a direction intersecting the length direction of the wiring base.
The in-mold molding apparatus according to claim 8. The auxiliary convex part is formed by advancing a part of the first mold toward the second mold,
The in-mold molding apparatus according to claim 8. The first mold is
A first split mold that forms a first cavity space of the wiring base with the second mold;
A second split mold that forms a second cavity space that communicates with the first cavity space in a part of the molded product body by the first split mold and the second mold;
A third split mold that forms a third cavity space that forms the remaining part of the molded product body with the second mold and the first split mold;
The in-mold molding apparatus according to claim 8. The first mold and the second mold are closed with an in-mold film on which a transfer layer is formed on a base sheet with a release layer interposed therebetween, and the transfer layer side of the transfer layer is formed in the formed cavity space. In an in-mold molding apparatus for injecting a molding resin from the first mold side and creating a molded product in which the transfer layer is transferred to the surface of a molded product main body formed of the cured molding resin.
At least one mold of the first mold and the second mold that forms the cavity space corresponding to a notch that forms a wiring base having an end connected to the inside of the molded product body A convex part is formed on the surface of
A convex portion that makes the wiring base thinner than the molded product body is formed on the surface of the mold of the first mold.
In-mold molding device.

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