JP2017157794A - Stacked cooler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stacked cooler capable of improving distribution of refrigerant flow in a plurality of passage pipes, while ensuring the strength at a part thereof subjected to compressive load.SOLUTION: A plurality of passage pipes 30 constituting a stack S include a cylindrical projecting tube part 32 opening in the stacking direction of the stack S and projecting in the stacking direction, and a flat passage pipe formation part 31 extending in the longitudinal direction of the passage pipes 30, respectively. In each passage pipe 30, the load receiving width L of the passage pipe formation part 31 is set equal to or longer than the passage pipe height H, and the pipe diameter φ of the projecting tube part 32 is set equal to or longer than the length of the load receiving width L.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a stacked cooler that cools a plurality of heating elements.

  2. Description of the Related Art Conventionally, a multilayer cooler is known that alternately stacks flow path tubes through which a refrigerant circulates and electronic components constituting a heating element, and cools the electronic components by heat exchange between the refrigerant and the electronic components (for example, Patent Document 1).

  In the stacked cooler described in Patent Document 1, each adjacent channel tube is provided with a protruding tube portion protruding in the stacking direction, and the protruding tube portions of each channel tube are joined to each other so that each channel The tubes communicate with each other.

  In addition, in the stacked cooler described in Patent Document 1, in order to make the heat generating body and the flow path pipe closely contact each other, the heat generating body is disposed in a gap formed between adjacent flow path pipes. The structure is such that a compressive load is applied in the stacking direction of the channel pipes, and the heating element is sandwiched between both sides of the channel pipes.

JP 2007-53307 A

  This type of stacked cooler can cope with a change in the number of heat generating elements to be cooled by increasing or decreasing the number of flow channel tubes to be stacked according to the number of heat generating elements. There are features. For example, when the number of heating elements to be cooled increases, it can be dealt with by increasing the number of channel tubes to be stacked.

  Incidentally, as in Patent Document 1, in a structure in which a compressive load is applied in the stacking direction of the flow path pipes and the heating element is sandwiched between both surfaces of the flow path pipes, the load acting on the root portion of the protruding pipe portion in the flow path pipes is reduced. Become the largest.

  Therefore, the present inventors considered reducing the diameter of the protruding tube portion and increasing the width of the root portion of the protruding tube portion that receives a load in the stacking direction in the flow channel tube.

  However, in the above-described structure considered by the present inventors, the diameter of the protruding tube portion of the flow channel tube is reduced, so that the pressure loss of the protruding tube portion is increased. As described above, in the structure in which the pressure loss in the protruding pipe portion increases, when the number of the channel pipes to be stacked increases, the refrigerant flow downstream side due to the influence of the pressure loss in the protruding pipe portion of the flow path pipe on the upstream side of the refrigerant flow. This makes it difficult for the refrigerant to flow through the flow pipe. That is, in the above-described structure considered by the present inventors, the flow rate distribution of the refrigerant in the plurality of flow path pipes deteriorates.

  In view of the above points, the present invention provides a stacked type cooler capable of improving the flow rate distribution of refrigerant in a plurality of flow channel pipes while ensuring the strength of a portion receiving a compressive load in the flow path tubes. For the purpose.

  The invention according to claim 1 is directed to a stacked type cooler that cools a plurality of heating elements (2). In order to achieve the above object, the invention according to claim 1 is a laminate in which a plurality of flow channel tubes (30) are stacked in a state where a gap for arranging a heating element is provided between adjacent flow channel tubes. (S) is provided.

  Each of the plurality of flow path tubes has a pair of cylindrical projecting pipe portions (32, 33) that open in the stacking direction of the laminate and project in the stacking direction, and a refrigerant flow that extends along the longitudinal direction of the flow path tube. The passage is formed inside and includes a flat channel forming portion (31) that receives a compressive load acting in the stacking direction on the base side of the pair of protruding tube portions. Also, adjacent channel pipes are connected to each other so that the refrigerant flow passages formed inside the channel forming parts communicate with each other via the pair of protruding pipe parts. Yes. Then, the lateral width in the short direction of the flow path tube in the flat portion of the flow path forming portion is the cooling region width (A), the vertical width in the stacking direction of the flow path forming portion is the flow path height (H), The lateral width of the channel pipe in the short direction of the projecting pipe part is the pipe diameter (φ), and the pipe diameter is subtracted from the cooling region width in the base part (317) of the pair of projecting pipe parts in the channel forming part. When the width is the load receiving width (L), the load receiving width is set to a length equal to or greater than the flow path height, and the pipe diameter is set to a length equal to or greater than the load receiving width.

  In this way, by setting the load bearing width of the base side portion of the pair of projecting tube portions in the flow path forming portion to a length that is greater than or equal to the flow channel height, when a compressive load is applied to the flow path forming portion Strength can be increased. Also, by setting the pipe diameter of the pair of projecting tube portions to be longer than the load receiving width, the pressure loss in the projecting tube portion can be suppressed, so that the flow path formation of the channel tube on the downstream side of the refrigerant flow in the laminate It becomes easy for the refrigerant to flow through the part. Furthermore, when the pipe diameter of the pair of protruding tube portions is increased, the circumferential length on the root side of the protruding tube portion in the flow path forming portion is increased. For this reason, the area of the site | part which receives the compressive load in the base side of the protrusion pipe | tube part in a flow-path formation part is securable.

  Therefore, according to the first aspect of the present invention, there is provided a stacked type cooler capable of improving the flow rate distribution of the refrigerant in the plurality of flow channel pipes while ensuring the strength of the portion receiving the compressive load in the flow path tubes. Can be realized.

  In addition, the code | symbol in the parenthesis of each means described in this column and the claim shows an example of a correspondence relationship with the specific means described in the embodiment described later.

It is a schematic block diagram of a power converter provided with the lamination type cooler of a 1st embodiment. It is a typical sectional view of the lamination type cooler of a 1st embodiment. FIG. 3 is a sectional view taken along line III-III in FIG. 2. FIG. 4 is an arrow view of a flow path tube in the direction of arrow IV in FIG. 3. It is VV sectional drawing of FIG. It is VI-VI sectional drawing of FIG. It is typical sectional drawing for demonstrating the flow of the refrigerant | coolant in the laminated cooler of a comparative example. It is typical sectional drawing for demonstrating the flow of the refrigerant | coolant in the lamination type cooler of 1st Embodiment. It is principal part sectional drawing of the laminated cooler which shows the modification 1 of 1st Embodiment. It is principal part sectional drawing of the laminated cooler which shows the modification 2 of 1st Embodiment. It is sectional drawing which shows the upper surface side of the flow-path pipe | tube of 2nd Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts as those described in the preceding embodiments are denoted by the same reference numerals, and the description thereof may be omitted. Further, in the embodiment, when only a part of the constituent elements are described, the constituent elements described in the preceding embodiment can be applied to the other parts of the constituent elements. The following embodiments can be partially combined with each other even if they are not particularly specified as long as they do not cause any trouble in the combination.

(First embodiment)
The present embodiment will be described with reference to FIGS. In the present embodiment, an example in which the stacked cooler 3 is applied to the power conversion device 1 will be described. The power conversion device 1 is employed in a DC-DC converter or the like mounted on a vehicle.

  As shown in FIG. 1, the power conversion device 1 includes a semiconductor unit 10 and a housing 11 that houses the semiconductor unit 10. The semiconductor unit 10 includes a plurality of semiconductor modules 2 incorporating semiconductor elements such as switching elements, and a stacked cooler 3 that cools the semiconductor modules 2. In the present embodiment, the semiconductor module 2 constitutes a heating element to be cooled by the stacked cooler 3. In addition to the semiconductor module 2, for example, a power transistor, a power FET, or the like may be employed as the heating element.

  The housing 11 includes a housing portion 111 that forms an outer shell. A pair of through holes 111a and 111b through which a supply pipe portion 34 and a discharge pipe portion 35 of the laminated cooler 3 described later are inserted to the outside are formed in the wall portion on one end side in the stacking direction of the stacked body S in the housing portion 111. Has been.

  Inside the housing 11, a cooler support portion 112 that supports a portion of the stacked cooler 3 between the supply pipe portion 34 and the discharge pipe portion 35 is formed integrally with the housing portion 111. Yes.

  In addition, a pressure member 113 that applies a compressive load to the semiconductor unit 10 in the stacking direction is disposed inside the housing 11. The pressurizing member 113 is disposed in a state of being in contact with the wall portion on the other end side facing the cooler support portion 112 in the housing portion 111.

  The semiconductor unit 10 is held in a state compressed in the stacking direction by the compression load of the pressure member 113. The pressurizing member 113 is provided in order to improve the adhesion between the flow path pipe 30 of the stacked cooler 3 and the semiconductor module 2 that is a heating element.

  The semiconductor module 2 is a module incorporating a switching element such as an IGBT (Insulated Gate Bipolar Transistor) or a MOSFET (MOS field effect transistor). The semiconductor module 2 has an outer shell formed in a rectangular parallelepiped shape by molding a switching element with resin.

  As shown in FIG. 2, in the stacked cooler 3, a plurality of flow channel tubes 30 are stacked in a state where there is a gap between the adjacent flow channel tubes 30 in which the semiconductor module 2 that is a heating element is disposed. A laminate S is provided. The stacked body S constitutes a heat exchange unit that exchanges heat between the refrigerant flowing inside the flow channel tube 30 and the semiconductor module 2 disposed outside the flow channel tube 30.

  Here, as the refrigerant, for example, water mixed with ethylene glycol antifreeze, natural refrigerant such as water or ammonia, chlorofluorocarbon refrigerant such as HFC134a, alcohol refrigerant such as methanol, or ketone refrigerant such as acetone is adopted. be able to.

  As shown in FIG. 3 and FIG. 4, the plurality of flow path tubes 30 constituting the stacked body S include a flow path forming portion 31 in which a refrigerant flow path extending in the longitudinal direction is formed, and the stacking direction of the stacked body S. A pair of cylindrical projecting pipe portions 32 and 33 that open and project in the stacking direction are included.

  The flow path forming portion 31 is a flat portion extending in the longitudinal direction of the flow path tube 30. The flow path forming portion 31 of the present embodiment is configured by joining in a state where metal plates having excellent thermal conductivity such as aluminum and copper are stacked.

  Specifically, the flow path forming unit 31 includes a pair of outer shell plates 311 and 312 and an intermediate plate 313 disposed between the pair of outer shell plates 311 and 312 as shown in FIG. A refrigerant flow path extending in the longitudinal direction of the flow path pipe 30 is formed between the pair of outer shell plates 311 and 312 and the intermediate plate 313, and heat exchange between the semiconductor module 2 and the refrigerant is performed in the flow path. A wave-shaped inner fin 314 that promotes the movement is disposed.

  As shown in FIGS. 3 and 4, the flow path forming portion 31 of the present embodiment is provided with ribs 315 that are recessed inward at a part of the outer peripheral edge portion that extends in the longitudinal direction of the flow channel tube 30. The rib 315 is provided for positioning the inner fin 314.

  As shown in FIGS. 2 and 4, the pair of protruding pipe portions 32 and 33 are portions protruding in the stacking direction in the flow path pipe 30. The pair of projecting tube portions 32 and 33 are provided on both sides of the flow channel forming portion 31 in the longitudinal direction of the flow channel tube 30.

  The pair of projecting tube portions 32 and 33 constitute a distribution portion in which one projecting tube portion 32 distributes the refrigerant to the flow passage formed inside the channel forming portion 31, and the other projecting tube portion 33 serves as the channel. A collecting part that collects the refrigerant that has passed through the inside of the forming part 31 is configured.

  Of the plurality of flow channel tubes 30, the flow channel tubes 30 excluding the flow channel tubes 30 located on the outermost sides in the stacking direction are protruded tube portions 32 on both sides of the facing surface facing the adjacent flow channel tubes 30. , 33 are provided.

  The pair of projecting tube portions 32 and 33 includes first projecting portions 321 and 331 formed on one surface of the flow channel tube 30 and second projecting portions 322 and 332 formed on the other surface of the flow channel tube 30. It is comprised in the shape which can be fitted in.

  Adjacent channel pipes 30 of the present embodiment are connected to each other so that the refrigerant flow passages formed in the flow path forming parts 31 communicate with each other via the pair of projecting pipe parts 32 and 33. The protruding pipe portions 32 and 33 are connected in a fitted state.

  In addition, as shown in FIG. 2, the stacked cooler 3 of the present embodiment is configured such that, from among the plurality of flow channel tubes 30, the refrigerant from the outside is supplied to the flow channel tube 30 on one end side in the stacking direction. A supply pipe portion 34 that supplies the refrigerant and a discharge pipe portion 35 that discharges the refrigerant from the inside of the stacked body S are connected.

  The supply pipe portion 34 and the discharge pipe portion 35 of the present embodiment are connected to portions facing the pair of through holes 111a and 111b of the housing 11 in the flow channel pipe 30 on one end side in the stacking direction. Note that the supply pipe portion 34 and the discharge pipe portion 35 of the present embodiment have their center axis CL1 shifted inward in the longitudinal direction of the flow channel tube 30 with respect to the center axis CL2 of the pair of projecting tube portions 32 and 33. Yes.

  Here, as shown in FIGS. 3 and 4, the flow path forming portion 31 of the present embodiment includes a contact portion 316 that contacts the semiconductor module 2 that is a heating element, and a base side of the pair of protruding tube portions 32 and 33. It can be roughly divided into the root part 317 of the nose.

  In the stacked cooler 3 of this embodiment, the semiconductor module 2 is disposed in the gap between the adjacent flow channel tubes 30, and a compressive load is applied by the external force of the pressure member 113 so that the semiconductor module 2 flows through the flow path. The structure is sandwiched between both surfaces of the tube 30.

  In such a structure, when a compressive load acts on the flow path pipe 30 in the stacking direction, the load acting on the root portion 317 of the flow path forming portion 31 becomes the largest, and the root portion 317 is caused by the compressive load. It deforms toward the inside of the flow channel tube 30.

  From the viewpoint of improving the strength of the root portion 317 of the flow path forming portion 31, it is conceivable to reduce the diameter of the protruding tube portions 32 and 33 and increase the width of the root portion 317. In this case, the protruding tube portion The pressure loss of 32 and 33 will become large.

  When the pressure loss of the pair of projecting pipe portions 32 and 33 increases, the refrigerant hardly flows into the flow path pipe 30 on the downstream side of the refrigerant flow among the plurality of flow path pipes 30, and the flow rate of the refrigerant in the plurality of flow path pipes 30 It is not preferable because distribution deteriorates.

  Next, a characteristic structure of the flow path pipe 30 of the present embodiment will be described with reference to FIG. Here, FIG. 6 is a VI-VI sectional view of FIG.

  Here, in the present embodiment, the cooling region width which is the lateral width in the short direction of the flow path tube 30 in the flat portion of the flow path forming portion 31 is “A”, and the vertical width of the flow path forming portion 31 in the stacking direction. The flow path height is “H”. Furthermore, in this embodiment, the pipe diameter, which is the lateral width in the short direction of the flow path pipe 30 in the protruding pipe section 32, is “φ”, and the pipe diameter is determined from the cooling region width A in the root portion 317 of the flow path forming section 31. The load receiving width that is the width obtained by subtracting φ is “L”. In the present embodiment, the cooling region width A at the root portion 317 of the flow path forming portion 31 and the cooling region width at the contact portion 316 are the same size. In the present embodiment, the lateral widths of the root portions 317 formed on both sides of the protruding tube portion 32 in the flow path forming portion 31 are equal. That is, the lateral width of the root portion 317 formed on both sides of the protruding tube portion 32 in the flow path forming portion 31 of the present embodiment is half the load receiving width L (= L / 2).

  Here, when a compressive load is applied to the flow path tube 30 in the stacking direction, a portion that becomes a joint with the protruding pipe portion 32 in the root portion 317 of the flow path forming portion 31 is greatly deformed. As a result of this deformation, when the bending angle θ formed by the flat portion of the root portion 317 and the straight line extending in the short direction exceeds 45 °, the repulsive force against the compressive load at the root portion 317 is dispersed from the stacking direction to the short direction. It will be. In this case, the strength of the flow path forming portion 31 of the flow path pipe 30 becomes insufficient because the repulsive force against the compressive load at the root portion 317 is insufficient.

  In addition, when the bending angle θ at the root portion 317 exceeds 45 °, for example, the inner side of the root portion 317 and the intermediate plate 313 come into contact with each other, and a part of the refrigerant flow path inside the flow path pipe 30 is blocked. There is a possibility of being. This is not preferable because it causes an increase in the pressure loss of the refrigerant flow passage in the flow path forming unit 31 and there is a concern about performance deterioration due to deterioration of the refrigerant flow distribution.

  Therefore, in this embodiment, when a compressive load is applied to the flow path tube 30 in the stacking direction, the load receiving width L is set to the flow path height so that the bending angle θ at the root portion 317 does not exceed 45 °. The length is set to H or more (that is, L ≧ H).

  In the present embodiment, the pipe diameter φ is set to a length greater than the load receiving width L so that the refrigerant can easily flow into the flow path pipe 30 on the downstream side of the refrigerant flow among the plurality of flow path pipes 30. (That is, φ ≧ L).

  Thus, the flow path pipe 30 of the present embodiment has a length that allows the load receiving width L to be equal to or higher than the flow path height H and equal to or less than the pipe diameter φ, that is, the load receiving width L satisfies the following formula F1. It is set to length.

H ≦ L ≦ φ (F1)
For example, in the flow path tube 30 in which the cooling area width A is 24 mm and the flow path height H is 2 mm, the load receiving width L is about 5 mm which is equal to or higher than the flow path height H, and the pipe diameter φ is equal to or greater than the load receiving width L. What is necessary is just to be 19 mm used as the length of this.

  In addition, each of the plurality of flow path tubes 30 of the present embodiment is configured such that the pressure loss of the refrigerant flow path in the flow path forming portion 31 is larger than the pressure loss in the pair of protruding tube portions 32 and 33. ing.

Specifically, in the flow path forming portion 31 of the present embodiment, the cross-sectional area (≈ [H × (φ + L)]) in the refrigerant flow path is equal to the cross-sectional area inside the pair of protruding pipe portions 32 and 33 (≈ [Π × (φ / 2) ² ]). In addition, by disposing a member (for example, the inner fin 314) that serves as a flow resistance of the refrigerant inside the flow path forming unit 31, the pressure loss of the refrigerant flow path in the flow path forming unit 31 is reduced to a pair of protruding pipe portions 32. , 33 may be configured to be larger than the pressure loss inside. In FIG. 6, the cross section on the one projecting pipe portion 32 side in the flow path pipe 30 is illustrated, but the cross section on the other projecting pipe portion 33 side is configured similarly.

  In the stacked cooler 3 according to the present embodiment having the above-described configuration, a plurality of refrigerants supplied from the outside via the supply pipe portion 34 are supplied via one protruding tube portion 32 of the pair of protruding tube portions 32 and 33. It flows in from one end side in the longitudinal direction of the flow path forming portion 31 of the flow path pipe 30. Then, the refrigerant flowing through the flow path forming portions 31 of the plurality of flow path tubes 30 flows out from the other end side in the longitudinal direction of the flow path tubes 30, and passes through the other protruding tube portion 33 of the pair of protruding tube portions 32 and 33. Through the discharge pipe portion 35.

  Here, FIG. 7 is a schematic cross-sectional view showing the flow of the refrigerant in the multilayer cooler REF of the comparative example. The laminated cooler REF of the comparative example is different from the laminated cooler 3 of the present embodiment in that the pipe diameter φref of the pair of protruding tube portions T1 and T2 is shorter than the load receiving portion. For convenience of explanation, in FIG. 7, the same reference numerals are assigned to the configurations that are the same between the stacked cooler REF of the comparative example and the present embodiment.

  In the laminated cooler REF of the comparative example, the refrigerant supplied from the outside via the supply pipe portion 34 is supplied with a plurality of flow channel tubes 30 via one protruding tube portion T1 of the pair of protruding tube portions T1 and T2. It flows in from the one end side of the longitudinal direction of this flow path formation part 31. At this time, in the multilayer cooler REF of the comparative example, since the pipe diameter φref of the protruding tube portion T1 is small, due to the pressure loss in the protruding tube portion T1, as shown in FIG. It becomes difficult for the refrigerant to flow into the flow path pipe 30 on the downstream side of the refrigerant flow.

  On the other hand, in the multilayer cooler 3 of the present embodiment, the pipe diameter φ of the protruding pipe portion 32 is sufficiently ensured. For this reason, in the multilayer cooler 3 of the present embodiment, the pressure loss in the protruding pipe portion 32 is reduced, and the flow path pipe 30 on the downstream side of the refrigerant flow among the plurality of flow path pipes 30 as shown in FIG. In addition, the refrigerant easily flows.

  In the stacked cooler 3 of the present embodiment described above, the load receiving width L of the root portion 317 of the flow path forming unit 31 is set to a length equal to or greater than the flow path height H of the flow path forming unit 31. According to this, the strength when a compressive load acts on the flow path forming portion 31 can be increased.

  In addition, in the stacked cooler 3 of the present embodiment, the pipe diameter φ of the pair of projecting pipe portions 32 and 33 is set to a length greater than the load receiving width L. According to this, since the pressure loss in the pair of protruding pipe portions 32 and 33 can be suppressed, the refrigerant easily flows into the flow path forming portion 31 of the flow path pipe 30 on the downstream side of the refrigerant flow in the stacked body S. Furthermore, when the pipe diameters of the pair of protruding pipe portions 32 and 33 are increased, the circumferential length at the root portion 317 in the flow path forming portion 31 is increased. For this reason, the area of the site | part which receives a compressive load in the base side of a pair of projecting pipe parts 32 and 33 in the flow-path formation part 31 is securable.

  Therefore, according to the present embodiment, the stacked cooler 3 capable of improving the flow rate distribution of the refrigerant in the plurality of flow channel tubes 30 while ensuring the strength of the portion receiving the compressive load in the flow channel tube 30. Can be realized.

  In addition, each of the plurality of flow path tubes 30 of the present embodiment is configured such that the pressure loss of the refrigerant flow path in the flow path forming portion 31 is larger than the pressure loss in the pair of protruding tube portions 32 and 33. ing. As described above, in the configuration in which the pressure loss in the flow path of the refrigerant in the flow path forming portion 31 is larger than the pressure loss in the pair of projecting pipe portions 32 and 33, the flow path pipe on the downstream side of the refrigerant flow in the stacked body S. It becomes easy for the refrigerant to also flow through the flow path forming portion 31 of 30. For this reason, it is possible to improve the flow rate distribution of the refrigerant in the plurality of flow path tubes 30.

(Modification 1 of the first embodiment)
In the first embodiment described above, the central axis CL1 of the supply pipe portion 34 and the discharge pipe portion 35 is shifted inward in the longitudinal direction of the flow channel tube 30 with respect to the central axis CL2 of the pair of protruding pipe portions 32 and 33. However, the present invention is not limited to this. For example, as shown in FIG. 9, the central axis CL1 of the supply pipe part 34 and the discharge pipe part 35 and the central axis CL2 of the pair of protruding pipe parts 32 and 33 may be coaxial.

(Modification 2 of the first embodiment)
Further, for example, as shown in FIG. 10, the diameters of the portions of the supply pipe portion 34 and the discharge pipe portion 35 on the flow channel pipe 30 side are increased so that the central axis CL1 of the supply pipe portion 34 and the discharge pipe portion 35 and the pair of It is good also as a structure with which the central axis CL2 of the protrusion pipe parts 32 and 33 becomes coaxial.

(Second Embodiment)
Next, a second embodiment will be described with reference to FIG. In this embodiment, the point which has changed the shape of the flow-path formation part 31 is different from 1st Embodiment.

  As shown in FIG. 11, in the flow path forming portion 31 of the present embodiment, the cooling region width A1 at the root portion 317 is larger than the cooling region width A2 at the contact portion 316 that contacts the semiconductor module 2.

  Other configurations are the same as those of the first embodiment. The stacked cooler 3 of the present embodiment can obtain the effects obtained by the configuration common to the first embodiment in the same manner as the first embodiment.

  In particular, in the present embodiment, the cooling area width A1 of the root part 317 in the flow path forming part 31 is larger than the cooling area width A2 of the contact part 316 in the flow path forming part 31. According to this, even if the pipe diameter φ in the pair of projecting pipe portions 32 and 33 is increased, it is easy to ensure the load receiving width L of the flow path forming portion 31. For this reason, the configuration of the present embodiment is suitable for improving the flow rate distribution of the refrigerant in the plurality of flow channel tubes 30 while ensuring the strength of the portion receiving the compressive load in the flow channel tube 30.

(Other embodiments)
As mentioned above, although the typical form which implements invention was demonstrated, it is not limited to the above-mentioned embodiment, For example, various deformation | transformation are possible as follows.

  As in the above-described embodiments, each of the plurality of flow path tubes 30 is configured such that the pressure loss in the refrigerant flow path in the flow path forming portion 31 is larger than the pressure loss in the pair of protruding tube portions 32 and 33. Although it is desirable to be comprised, it is not limited to this. For example, only a part of the plurality of flow path pipes 30 is configured such that the pressure loss of the refrigerant flow passage in the flow path forming part 31 is larger than the pressure loss in the pair of protruding pipe parts 32 and 33. May be.

  In each of the embodiments described above, an example in which the intermediate plate 313 is disposed inside the flow path forming portion 31 of the flow path pipe 30 to form two rows of refrigerant flow paths inside the flow path forming portion 31. Although described, it is not limited to this. For example, the intermediate plate 313 may be omitted, and one row of refrigerant flow paths may be formed inside the flow path forming portion 31 of the flow path pipe 30.

  In each of the above-described embodiments, the example in which the inner fin 314 is disposed inside the flow path forming portion 31 of the flow path pipe 30 has been described. However, the present invention is not limited thereto, and the inner fin 314 may be omitted.

  In the above-described embodiment, it is needless to say that elements constituting the embodiment are not necessarily indispensable except for the case where it is clearly indicated that the element is essential and the case where it is considered that it is clearly essential in principle.

  In the above-described embodiment, when numerical values such as the number, numerical value, quantity, range, etc. of the constituent elements of the embodiment are mentioned, it is particularly limited to a specific number when clearly indicated as essential and in principle. Except in some cases, the number is not limited.

  In the above embodiment, when referring to the shape, positional relationship, etc. of the component, etc., the shape, positional relationship, etc. unless otherwise specified and in principle limited to a specific shape, positional relationship, etc. It is not limited to etc.

(Summary)
According to the first aspect shown in a part or all of the above-described embodiments, the stacked cooler is configured such that the load-receiving width of the flow path forming portion is set to a flow higher than the flow path height, The pipe diameter of the pair of protruding tube portions is set to a length that is equal to or greater than the load receiving width.

  Further, according to the second aspect, in each of the plurality of flow path tubes of the stacked cooler, the pressure loss of the refrigerant flow passage in the flow path forming portion is larger than the pressure loss in the pair of protruding tube portions. It is configured as follows.

  Thus, in the configuration in which the pressure loss of the refrigerant flow path in the flow path forming portion is larger than the pressure loss in the protruding pipe portion, the flow path forming portion of the flow path pipe on the downstream side of the refrigerant flow in the laminated body is also used. It becomes easier for the refrigerant to flow. For this reason, it is possible to improve the flow rate distribution of the refrigerant in the plurality of flow channel tubes.

  Further, according to the third aspect, the stacked cooler is configured such that the cooling region width at the base side portion of the pair of projecting tube portions in the flow path forming portion is the cooling at the portion where the heating element in the flow path forming portion is in contact. It is larger than the region width.

  In this way, if the cooling region width on the base side of the protruding tube portion in the flow path forming portion is larger than the cooling region width of the portion in contact with the heating element in the flow path forming portion, the pipe in the protruding tube portion Even if the diameter is increased, it is easy to ensure the load receiving width of the flow path forming portion. Such a configuration is suitable for improving the flow rate distribution of the refrigerant in the plurality of flow channel pipes while ensuring the strength of the portion receiving the compressive load in the flow channel pipes.

2 Semiconductor module (heating element)
DESCRIPTION OF SYMBOLS 3 Laminated type cooler 30 Channel pipe 31 Channel formation part 32, 33 A pair of protrusion pipe part S Laminated body A Cooling area width H Channel height L Load receiving width

Claims (3)

A stacked type cooler for cooling a plurality of heating elements (2),
A plurality of flow path pipes (30) are provided with a laminate (S) that is stacked in a state where a gap for arranging the heating element is provided between the adjacent flow path pipes,
Each of the plurality of flow path pipes is
A pair of cylindrical projecting pipe portions (32, 33) that open in the stacking direction of the stack and project in the stacking direction;
A flow path forming portion having a flat shape, in which a refrigerant flow passage extending along the longitudinal direction of the flow path tube is formed, and receives a compressive load acting in the stacking direction on the base side of the pair of protruding pipe portions. (31), and
The adjacent channel pipes are connected to each other so that the refrigerant flow passages formed inside the channel forming parts communicate with each other via the pair of protruding pipe parts. Has been
The horizontal width in the short direction of the flow path tube in the flat portion of the flow path forming portion is the cooling region width (A), the vertical width in the stacking direction of the flow path forming portion is the flow height (H), The transverse width of the channel pipe in the short direction of the pair of projecting tube portions is the pipe diameter (φ), and the cooling region in the base side portion (317) of the pair of projecting tube portions of the channel forming portion. When the width obtained by subtracting the pipe diameter from the width is the load receiving width (L),
The load bearing width is set to a length equal to or greater than the flow path height,
The pipe-type diameter is a stacked cooler in which the length is set to be longer than the load receiving width.   2. The plurality of flow channel pipes according to claim 1, wherein each of the plurality of flow channel tubes is configured such that a pressure loss of a refrigerant flow path in the flow channel forming unit is larger than a pressure loss in the pair of protruding tube units. Stacked cooler.   In the flow path forming portion, the cooling region width (A1) in the base portion (317) of the pair of protruding tube portions is larger than the cooling region width (A2) in the portion (316) in contact with the heating element. The stacked cooler according to claim 1 or 2, wherein the size is also larger.

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