JP2017157645A - Lead frame for multi-row type LED - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead frame for a multi-row type LED capable of facilitating integration of LED packages arranged individually, of preventing a gap, deformation, warpage, and the like of a pad part and a lead part to suitably keep flatness of an external connection terminal surface exposed to a lower surface side and to improve the productivity, and of eliminating a need for adhering an expensive resin tape to reduce cost, in manufacture.SOLUTION: A rectangular pad part 11 and a rectangular lead part 12 having the same length of a first side A and having mutually different lengths of a second side B are provided. In an individual lead frame region 10 (X, Y), a first through-hole 34a for separating the opposed pad part and lead part from each other over the length of the first side is formed. The lead frame regions adjacent to each other in a direction along the second side are arranged so that the arrangements of the pad part and the lead part are the same as each other. The lead frame regions adjacent to each other in a direction along the first side are arranged so that the arrangements of the pad part and the lead part are reverse to each other.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a multi-row type LED lead frame.

2. Description of the Related Art Optical semiconductor devices equipped with LED (Light Emitting Diode) elements have come to be used in various devices such as general lighting and displays such as televisions, mobile phones, and OA devices.
In these optical semiconductor devices, as LED packages that have been developed to meet demands for thinning and mass production, LED elements are conventionally mounted on lead frames having electrically insulated pad portions and lead portions, An LED in which a reflector resin portion is formed so as to surround a pad portion and a lead portion on the side on which the LED element is mounted, and the inner space on the side on which the LED element is mounted is sealed by the transparent resin portion. There is a package.

  In this type of LED package, for example, as shown in FIG. 8A, the lead frame 10 includes a pad portion 11 and a lead portion 12 that is spaced from the pad portion 11. In addition, on the upper surface and the lower surface of the lead part 12, a plating layer 13 for reflection and external connection is formed. In addition, an LED element 20 is mounted on the pad portion 11 on the upper surface side of the lead frame 10, and the LED element 20 and the lead portion 12 are connected via a bonding wire 14 or the like. In addition, a reflector resin portion 15 that reflects light is formed around the LED element 20 so as to surround the pad portion 11 and the lead portion 12. The internal space surrounded by the reflector resin portion 15 and mounted with the LED element 20 is sealed with a transparent resin portion 16 made of a transparent resin.

  In addition, as shown in FIGS. 9A to 9C, the lead frame used for manufacturing this type of LED package has a pad portion 11 and a lead portion so as to obtain a large number of LED packages at a time. 12 are formed as a multi-row lead frame arranged in a matrix form (indicated by a dashed-dotted rectangle in FIG. 9B). As shown in FIG. 9 (b), each of the pad portion 11 and the lead portion 12 is connected to a connecting portion 17 formed from a metal plate that forms the base material of the lead frame (hatched hatched lines in FIG. 9 (b)). And connected to the pad portion 11 or the lead portion 12 in the other lead frame region, or the outer frame portion 18 in the metal plate for manufacturing the multi-row type lead frame through the connecting portion 17. It is connected with.

  In the manufacture of this type of LED package, as shown in FIG. 8B, each reflector resin portion 15 corresponding to each lead frame region in the multi-row lead frame is covered with the connecting portion 17. Reflector resin formed in a lump after forming the transparent resin portion 16 in the inner space by mounting and fixing the LED element 20 to the pad portion 11 surrounded by each reflector resin portion 15 and performing wire bonding or the like. A part of the part 15 and a part of the connecting part 17 are simultaneously cut along the cut part between the lead frame regions.

By this cutting process, as shown in FIG. 8A, the lower surfaces of the pad portion 11 and the lead portion 12 are exposed on the lower surface side of the LED package, and individual LED packages that can be electrically connected to an external substrate are obtained. It is done. On the side surface of each LED package, the lead frame connecting portion 17 is exposed as a part of the cut surface together with the reflector resin portion 15.
Conventional LED packages having such a configuration are described in, for example, the following Patent Documents 1 and 2.

JP 2013-232506 A JP 2013-235872 A

  As described above, in the manufacture of the LED package, in order to obtain a large number of LED packages at a time, the pad portion 11 and the lead portion 12 in each lead frame region as shown in FIG. A multi-row lead frame connected through a pad portion 11 or a lead portion 12 in the lead frame region and a connecting portion 17 for connecting to an outer frame portion 18 in a metal plate for manufacturing a multi-row lead frame is used. .

  By the way, in the manufacturing process of the lead frame for a multi-row type LED, the lead frame base material is often caught and deformed, the alignment position shift due to the tensile load, the frame warp due to the half-etching process, and the like, and the yield is often lowered. Although measures such as line adjustment are taken each time, line adjustment is necessary every time a new product is produced that changes the lead frame shape by changing the size of the optical semiconductor element or the arrangement of the pads and leads.

However, the multi-row type LED lead frame in which individual lead frame regions are connected by the connecting portions 17 as described in Patent Documents 1 and 2 is a suspension-shaped or dam-bar-shaped connecting portion that connects the pad portion and the lead portion. As the width becomes narrower and longer, it becomes easier to deform due to insufficient strength.
Further, the lead is deformed vertically and horizontally by the pressure of the spray in the etching process, and the product comes into contact with the roller due to slack of the product caused by insufficient strength of the dam bar, which causes problems such as deformation and warping. In addition, it is necessary to examine the position of the suspended shape according to the size of the electrode connected to the external terminal.

  Specifically, an LED package manufactured using the above-described multi-row lead frame is generally a surface mount type package in which a terminal surface for external connection is exposed on the lower surface side of the lead frame. In the surface mount type LED package, the flatness of the terminal surface for external connection exposed on the lower surface side is required, and steps, deformation, warpage, and the like of the pad portion and the lead portion are severely restricted.

However, pad portions and lead portions in individual lead frame regions, pad portions or lead portions in other lead frame regions, and outer frame portions in metal plates for manufacturing multi-row lead frames are respectively connected via connecting portions. When connected to each other, depending on the strength of the connecting part, the shape of the pad part and the lead part connected to the connecting part, and the connection position, the connecting part may be deformed, and the pad part and the lead part may be stepped, deformed, warped. Etc. are likely to occur, and the flatness of the external connection terminal surface exposed on the lower surface side is impaired, which may adversely affect the connection with the external device.
In order to suppress warping and deformation of the entire lead frame, the connecting portion is required to have a certain degree of strength. For this purpose, it is necessary to increase the width and thickness of the connecting portion. In addition, it is necessary to devise the shape of the pad portion and the lead portion and the connection position with the connecting portion so that the connecting portion is not easily deformed, and the degree of freedom in designing the pad portion and the lead portion is also limited.

In addition, as described above, the metal constituting the connecting portion requires a thickness and a width to prevent warping and deformation, so that the pad portion and lead portion in each lead frame region and the pad in other lead frame regions It is impossible to reduce the length of the connecting portion that connects the portion or the lead portion and the outer frame portion of the metal plate for manufacturing the multi-row type lead frame.
As a result, the area occupied by the connecting portion in the multi-row lead frame becomes a size that cannot be ignored. In addition, as described above, it is necessary to devise the shape of the pad portion and the lead portion and the connection position with the connecting portion so that the connecting portion is not easily deformed.
For this reason, the number of individual lead frames that can be formed in the multi-row type lead frame forming area is limited, and the integration of the LED package area during the manufacture of the multi-row type LED package is hindered.

  On the other hand, by reducing the width and thickness of the connecting portion, the pad portion or lead portion in each lead frame region, the pad portion or lead portion in another lead frame region, or a metal plate for manufacturing a multi-row type lead frame Manufacturing the multi-row type LED package by shortening the length of the connecting part connecting the outer frame part in the case and reducing the connecting part area of the pad part, the lead part and the individual lead frame regions configured as an assembly part. If an attempt is made to integrate the LED package area at the time, as described above, the strength of the connecting portion connecting the individual lead frames is weakened, and the pad portion and the lead portion connected via the connecting portion are deformed or warped. Etc. occur frequently, resulting in a problem of lowering the assembly yield of the LED package. For this reason, in a conventional LED package using a multi-row lead frame having a connecting portion like the LED package described in Patent Documents 1 and 2, a cutting width by a blade is provided by about 0.3 to 0.5 mm. Inevitably, integration of the package area was limited.

  In general, in a multi-row lead frame having a connecting portion, in order to suppress a decrease in assembly yield of the LED package due to deformation or warpage of the connecting portion in the assembly process of the LED package, Resin tape is affixed as means for preventing deformation and warping of the pad portion and the lead portion that are connected to the entire surface exposed on the back side of the row type lead frame via the connecting portion. This resinous tape also serves to prevent the molding resin (reflector resin) from wrapping around the external connection terminal surface.

  However, this resin tape is die-bonding for fixing the mounted LED element to the pad part, wire bonding for electrically connecting the LED element and the lead part, and a mold resin for forming a reflector resin part and a transparent resin part. It is composed of an expensive heat-resistant polyimide film and heat-resistant silicon adhesive so that it can withstand use under various heating conditions such as filling. For this reason, in manufacturing the LED package, it is expensive to apply a resin tape to the lower surface of the multi-row lead frame.

  Furthermore, when the resin tape is peeled off after being filled with the final mold resin and discarded, the adhesive layer of the resin tape remains on the terminal surface for external connection and the mold resin side. In addition, even when a heat-resistant material is used for the resin tape, under various heating conditions, the heat resistance of the resin tape exceeds the limit of heat resistance. There is also a problem in that the position of the lead portion varies and the dimensional accuracy of each LED package varies.

  The present invention has been made in view of the above-described conventional problems, and promotes the integration of individually arranged LED packages during manufacturing, and prevents stepping, deformation, warpage, etc. of the pad part and the lead part, Multi-row LED leads that can improve the productivity by maintaining the flatness of the terminal surface for external connection exposed on the lower surface side, and can eliminate the need for expensive resin tape and reduce the cost. The purpose is to provide a frame.

  To achieve the above object, a multi-column LED lead frame according to the present invention is a multi-column LED lead frame in which lead frame regions having rectangular pad portions and lead portions are arranged in a matrix. The lower surface of the metal plate is formed with a recess for partitioning the pad portion, the lead portion, and the individual lead frame regions, and each of the lead frame regions includes an opposing pad portion and the lead portion. A first through-hole spaced apart over the length of the first side is formed, the lead frame regions adjacent to each other in a direction along the first side, and a second perpendicular to the first side The lead frame regions adjacent to each other in the direction along the side are arranged such that the first through holes do not communicate with each other in a straight line.

  In the multi-row LED lead frame of the present invention, the pad portion and the lead portion have the same length of the first side facing each other and the second side perpendicular to the first side. The lead frame regions having different lengths and adjacent in the direction along the second side are arranged with the same arrangement of the pad portion and the lead portion, and the direction along the first side It is preferable that the lead frame regions adjacent to each other are arranged so that the pad portion and the lead portion are disposed in opposite positions.

  In the multi-row LED lead frame of the present invention, the pad portion and the lead portion have a length of a first side facing each other and a length of a second side perpendicular to the first side. The lead frames adjacent to each other in the direction along the first side and the lead frame regions adjacent to each other in the direction along the second side are in the direction of the first through hole. Are preferably arranged so as to cross each other.

  Further, in the multi-row type LED lead frame of the present invention, the outer region in the vicinity of the four corners of each of the lead frame regions overlaps with the outer region in the vicinity of the four corners of the other lead frame regions adjacent to each other. A second through hole is preferably formed.

  In the multi-row LED lead frame of the present invention, the second through hole has an opening diameter on the side opposite to the semiconductor element mounting side larger than the opening diameter on the semiconductor element mounting side and on the side surface. It is preferably formed in a tapered shape.

  The multi-row LED lead frame of the present invention further includes at least two lead frame regions adjacent to each other in the direction along the first side, and is arranged along the first side. In each of the lead frame region groups that are formed, a third through hole that connects each of the first through holes is provided between the lead frame regions adjacent in the direction along the first side. It is preferable to form along 2 sides.

  In the lead frame for a multi-row LED according to the present invention, the lead frame region group includes an even number of the lead frame regions adjacent to each other in the direction along the first side. The lead frame region groups adjacent in the direction along the side are arranged so that the crank shapes of the through holes formed by the communication between the first through holes and the third through holes are in the same direction. The lead frame region groups adjacent to each other in the direction along the second side have the same orientation of the crank shape of the through hole formed by the communication between the first through hole and the third through hole. Are preferably arranged.

  In the multi-row LED lead frame of the present invention, the lead frame region group includes three or more odd number of the lead frame regions adjacent in the direction along the first side, In the lead frame region groups adjacent in the direction along the first side, the crank shape of the through hole formed by the communication between the first through hole and the third through hole is reversed. The lead frame region groups adjacent to each other in the direction along the second side are formed in a crank shape of a through hole formed by the communication between the first through hole and the third through hole. Are preferably arranged in the same orientation.

  In the multi-row LED lead frame of the present invention, the recess formed between the adjacent lead frame regions has a width wider than a cutting width for making individual LED packages. Is preferred.

  Moreover, in the lead frame for multi-row LED of the present invention, it is preferable that the surface of the recess is subjected to a roughening process.

  In the multi-row LED lead frame of the present invention, it is preferable that the side surface of the first through hole is subjected to a roughening treatment.

  In the multi-row LED lead frame of the present invention, the side surface of the second through hole is preferably subjected to a roughening treatment.

  In the multi-row LED lead frame of the present invention, it is preferable that the side surface of the third through hole is subjected to a roughening treatment.

  According to the present invention, during the manufacture, the integration of the individually arranged LED packages is promoted, the steps of the pad portion and the lead portion, the deformation, the warp, etc. are prevented, and the external connection terminal exposed on the lower surface side. It is possible to improve the productivity by maintaining the flatness of the surface well, and it is possible to obtain a multi-row type LED lead frame which can reduce the cost without attaching an expensive resin tape.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure and arrangement | sequence aspect of each lead frame area | region in the lead frame for multi-row type LED concerning 1st Embodiment of this invention, (a) is the top view seen from the upper surface side, (b) is from the lower surface side. (C) is an AA cross-sectional view of (a). It is explanatory drawing which shows an example of the manufacturing process of the lead frame for multi-row type LED shown in FIG. 1, and the manufacturing process of the LED package using the lead frame for multi-row type LED. It is a figure which shows the structure and arrangement | sequence aspect of each lead frame area | region in the lead frame for multi-row type LED concerning 2nd Embodiment of this invention, (a) is a top view seen from the upper surface side, (b) is from the lower surface side. It is the seen top view. It is a figure which shows the structure and arrangement | sequence aspect of each lead frame area | region in the lead frame for multi-row type LED concerning 3rd Embodiment of this invention, (a) is the top view seen from the upper surface side, (b) is from the lower surface side. (C) is a BB cross-sectional view of (b). It is a figure which shows the structure and arrangement | positioning aspect of each lead frame area | region group in the lead frame for multi-row type LED concerning 4th Embodiment of this invention, (a) is a top view seen from the upper surface side, (b) is the lower surface side It is the top view seen. It is a figure which shows the structure and arrangement | sequence aspect of each lead frame area | region group in the lead frame for multi-row type LED concerning 5th Embodiment of this invention, (a) is a top view seen from the upper surface side, (b) is the lower surface side It is the top view seen. It is a figure which shows the structure and arrangement | positioning aspect of each lead frame area | region group in the lead frame for multi-row type LED concerning 6th Embodiment of this invention, (a) is a top view seen from the upper surface side, (b) is the lower surface side It is the top view seen. It is a figure which shows schematic structure of the conventional LED package, (a) is sectional drawing of the LED package in the state cut | disconnected and turned into one product, (b) is the multi-row type LED manufactured collectively before cut | disconnecting It is a fragmentary sectional view which shows the cut part in a package. FIG. 7 is a diagram showing a schematic configuration of a multi-row LED lead frame used for manufacturing a conventional LED package, and (a) is a plan view conceptually showing an arrangement of individual lead frames in the multi-row LED lead frame; b) is a partially enlarged plan view of the arrangement of the pad portion and the lead portion in each lead frame region of the multi-row LED lead frame used for manufacturing the LED package of the type shown in FIG. It is AA sectional drawing of (b).

Prior to the description of the embodiment, the function and effect of the present invention will be described.
The lead frame for multi-row type LED of the present invention is a lead frame for multi-row type LED in which lead frame regions having rectangular pad portions and lead portions are arranged in a matrix, on the lower surface side of the metal plate. The pad portion, the lead portion, and the concave portion that divides each lead frame region are formed, and in each lead frame region, the first pad portion and the lead portion are spaced apart from each other over the length of the first side. The lead frame regions adjacent to each other in the direction along the first side, and the lead frame regions adjacent to each other in the direction along the second side perpendicular to the first side are formed with each other. The first through holes are arranged so as not to communicate in a straight line.
More specifically, the multi-row LED lead frame according to the first aspect has rectangular shapes in which the lengths of the first sides facing each other are the same, and the lengths of the second sides perpendicular to the first sides are different from each other. A lead frame region for a multi-row LED in which lead frame regions each having a pad portion and a lead portion are arranged in a matrix, and on the lower surface side of the metal plate, the pad portion, the lead portion, and each lead frame region The first lead-through hole is formed in each lead frame region so as to be spaced between the opposing pad portion and the lead portion over the length of the first side, and is formed on the second side. The lead frame regions adjacent to each other along the direction along the first side are arranged with the same arrangement of the pad portion and the lead portion, and the lead frame regions adjacent to each other along the direction along the first side are arranged between the pad portion and the lead portion. Is reversed Going on are arranged.
The multi-row LED lead frame according to the second aspect is a rectangular pad in which the length of the first side facing each other is equal to the length of the second side perpendicular to the first side. A lead frame region for a multi-row LED in which lead frame regions having a portion and a lead portion are arranged in a matrix, and a pad portion, a lead portion, and individual lead frame regions are partitioned on the lower surface side of the metal plate. A recess is formed, and in each lead frame region, a first through hole is formed that is spaced between the opposing pad portion and the lead portion over the length of the first side, and extends in a direction along the first side. Adjacent lead frames and lead frame regions adjacent in the direction along the second side are arranged so that the directions of the first through holes intersect each other.

If comprised in this way, only between the pad part and lead part which oppose in each lead frame area | region in the lead frame for multi-row type | mold LED will be spaced apart over the length of the 1st side by the 1st through-hole, The lead frame regions are integrally connected via a recess formed in the lead frame base material. At this time, the longitudinal direction of the first through hole that separates the pad portion and the lead portion in each lead frame region is such that the lead frame regions adjacent to each other in the direction of the first side are along the second side. Any of the adjacent lead frame regions does not communicate with each other in a straight line, and is not arranged on the same straight line, thus providing a balanced arrangement.
For this reason, it is possible to prevent a lack of strength caused by connecting the slit between the pad portion and the lead portion in a straight line. In addition, there is no connecting portion like the multi-row type lead frame used in the LED packages described in Patent Documents 1 and 2, and a pad portion and a lead portion in each lead frame region and a pad portion in another lead frame region Alternatively, the lead portion and the outer frame portion for manufacturing the multi-row type lead frame are integrally connected through the recess without being separated, so that the frame strength is improved and deformation or warpage is less likely to occur. In addition, there is no step, deformation or warping of the lead part, and the flatness of the terminal surface for external connection exposed on the lower surface side is maintained. For this reason, a heat-resistant polyimide film or a heat-resistant silicone adhesive is used to prevent deformation and warping of the pad portion and lead portion that are connected to the entire surface exposed on the lower surface side of the multi-row type lead frame via the connecting portion. An expensive resin-made back tape is also unnecessary, and the cost can be reduced. In addition, since the space for the hanging pin and the dam bar becomes unnecessary, the integration proceeds. Furthermore, since the exposed external area of the electrode when cut into individual packages is expanded, the heat dissipation characteristics are also improved.
In addition, if the concave portion is formed, the amount of metal that forms the base material of the lead frame when making individual LED packages can be reduced, and accordingly, the adverse effect on the blade during cutting is reduced, The life of the blade can be extended.

In the multi-row LED lead frame of the present invention, preferably, the outer region in the vicinity of the four corners of each lead frame region overlaps with the outer region in the vicinity of the four corners of the other lead frame region. A second through hole is formed.
If it does in this way, it will become easy to fill reflector resin in the crevice formed in the lower surface side via the 2nd penetration hole from the upper surface side of the substrate of a lead frame. In addition, the amount of metal that forms the base material of the lead frame in individual LED packages can be reduced without weakening the strength of the base material of the lead frame in the multi-frame type LED lead frame. The adverse effect on the blade during cutting can be reduced and the life of the blade can be extended. Furthermore, when forming the reflector resin part surrounding the LED element mounting area on the upper surface side of the base material of the lead frame, the reflector resin part formed on the upper surface side of the base material of the lead frame and the reflector resin part formed on the lower surface side Can be integrated via the reflector resin portion formed in the second through-hole, so that the adhesion of the reflector resin portion to the base material of the lead frame in each lead frame region is further improved.

In the multi-row LED lead frame of the present invention, it is preferable that the second through hole has a larger opening diameter on the side opposite to the semiconductor element mounting side than the opening diameter on the semiconductor element mounting side. It is formed in a tapered shape.
In this way, the anchor effect by the second through hole having a tapered shape on the side surface is increased, and the adhesion of the reflector resin portion to the lead frame substrate is further improved.
In addition, as a shape where the side surface has a taper, for example, a truncated cone shape in the case where the opening of the second through hole has a round shape may be mentioned.

The multi-row LED lead frame of the present invention preferably further includes at least two lead frame regions adjacent in the direction along the first side, and is arranged along the first side. In each of the lead frame region groups that are formed, a third through hole that communicates the first through holes with each other between the lead frame regions adjacent in the direction along the first side is formed on the second side. Are formed along.
This makes it easier to fill the concave portion formed on the lower surface side with the reflector resin from the upper surface side of the base material of the lead frame through the third through hole. In addition, it is possible to further reduce the amount of metal that forms the base material of the lead frame when making individual LED packages without weakening the strength of the base material of the lead frame in the multi-frame type LED lead frame. Therefore, the adverse effect on the blade during cutting can be reduced, and the life of the blade can be extended. Furthermore, when forming the reflector resin part surrounding the LED element mounting area on the upper surface side of the base material of the lead frame, the reflector resin part formed on the upper surface side of the base material of the lead frame and the reflector resin part formed on the lower surface side Can be integrated via the reflector resin portion formed in the third through hole, and therefore the adhesion of the reflector resin portion to the base material of the lead frame in each lead frame region is further improved.

  In the multi-row LED lead frame of the present invention, as a more specific aspect in which the above-described third through hole is provided, for example, the lead frame region group is an even number adjacent in the direction along the first side. The lead frame region groups that have the number of lead frame regions and are adjacent to each other in the direction along the first side are formed through communication between the first through hole and the third through hole. The lead frame region groups that are arranged with the crank shapes of the holes in the same direction and that are adjacent in the direction along the second side are formed by the communication between the first through hole and the third through hole. A configuration in which the crank shapes of the through holes are arranged in the same direction can be given.

  As another aspect, the lead frame region group has three or more odd number of lead frame regions adjacent in the direction along the first side, and leads adjacent in the direction along the first side. The frame region groups are arranged so that the crank shapes of the through holes formed by the communication between the first through holes and the third through holes are reversed, and are adjacent in the direction along the second side. The lead frame region groups may be configured such that the crank shapes of the through holes formed when the first through holes and the third through holes communicate with each other are arranged in the same direction.

In the multi-row LED lead frame of the present invention, preferably, the recess formed between the adjacent lead frame regions has a width wider than a cutting width for making individual LED packages. Yes.
If comprised in this way, the reflector resin part formed in the recessed part of the lower side of the base material of a lead frame will remain on the lower surface side of the base material of a lead frame, when it cut | disconnects to each LED package. And because the reflector resin part remaining on the lower surface side of the base material of the lead frame is integrated with the reflector resin part formed on the upper surface side of the lead frame base material via the reflector resin part formed in the through hole, The adhesion of the reflector resin part to the base material of the lead frame can be strengthened.

In the multi-row LED lead frame of the present invention, preferably, at least one of the surface of the recess, the side surface of the first through hole, the side surface of the second through hole, and the side surface of the third through hole is provided. The roughening process is performed.
If it does in this way, the adhesiveness of the resin part will improve.

  Therefore, according to the present invention, during the manufacture, the integration of individually arranged LED packages is promoted, and steps, deformation, warpage, etc. of the pad part and the lead part are prevented, and the external connection is exposed on the lower surface side. Thus, it is possible to improve the productivity by maintaining the flatness of the terminal surface, and it is possible to obtain a multi-row type LED lead frame that does not require an expensive resin tape and can reduce the cost.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First Embodiment FIG. 1 is a diagram showing the configuration and arrangement of individual lead frame regions in a multi-row LED lead frame according to a first embodiment of the present invention, wherein (a) is a plan view seen from the upper surface side. (b) is a plan view seen from the lower surface side, and (c) is a cross-sectional view taken along line AA of (a). FIG. 2 is an explanatory view showing an example of the manufacturing process of the multi-row LED lead frame shown in FIG. 1 and the manufacturing process of the LED package using the multi-row LED lead frame.

The multi-row LED lead frame of the first embodiment has a lead frame region 10 (X _n , Y _n ) (where X is the first side A where the pad portion and the lead portion face each other in each lead frame region). , Y is a direction along the second side B perpendicular to the first side A, and n is a positive integer) arranged in a matrix and used for cutting into individual LED packages. This is a multi-row type LED lead frame.
On the lower surface side of the metal plate, the pad portion 11 and the lead portion 12 and the individual lead frame region 10 (X n, _{Y n)} is recess 19 for partitioning, is formed by half-etching from the lower surface side.
Between adjacent lead frame regions 10 (X _n , Y _n ), 10 (X _n , Y _{n + 1} ), adjacent lead frame regions 10 (X _n , Y _n ), 10 (X _{n + 1} , Y _n ) The recesses 19 formed therebetween have a width wider than a cutting width for making individual LED packages. In the present embodiment, the recess 19 has a width that is +0.10 mm or more wider than the cutting width. Moreover, the recessed part 19 has a thickness of about 30 to 50% of the thickness of the metal plate.
Each lead frame region 10 (X _n , Y _n ) has a rectangular pad portion 11 and a lead portion 12.
The pad portion 11 and the lead portion 12 have the lengths of the first sides A ₁₁ and A ₁₂ facing each other and the lengths of the second sides B ₁₁ and B ₁₂ perpendicular to the first sides A ₁₁ and A _12. Are different from each other. More specifically, the length of the second side B ₁₁ in the pad portion 11 is longer than the length of the second side B ₁₂ in the lead portion 12.
Further, in each lead frame region, a first through hole 34a is formed that is spaced by a predetermined width between the opposing pad portion 11 and the lead portion 12 over the length of the first sides A ₁₁ and A _12. ing.
The first through hole 34a has a length of one side is a plate thickness more than the length of the base material of the lead frame, the longer side has a length longer than the first side A _11, A ₁₂ The opening is formed in a rectangular hole shape. Further, both end portions of the long side in the first through hole 34a are cut regions for separating into individual pieces in manufacturing the LED package (regions between individual lead frame regions surrounded by a two-dot chain line in FIG. ).
The lead frame regions 10 (X _n , Y _n ), 10 (X _n , Y _{n + 1} ) adjacent to each other in the direction along the second sides B ₁₁ , B ₁₂ (vertical direction in FIG. ₁ ) And the lead portion 12 are arranged in the same arrangement.
Further, the lead frame regions 10 (X _n , Y _n ) and 10 (X _{n + 1} , Y _n ) adjacent to each other in the direction along the first sides A ₁₁ and A ₁₂ (the left-right direction in FIG. And the arrangement of the lead portions 12 is reversed.
Further, the surface of the recess 19 and the side surface of the first through hole 34a are roughened.

  The multi-row LED lead frame of the first embodiment configured as described above is manufactured, for example, as follows. Note that description of pre-processing and post-processing including chemical solution cleaning and water cleaning performed in each manufacturing process is omitted for the sake of convenience.

First, a resist film R is provided on both surfaces of a metal plate (for example, Cu material) to be the base material m (see FIG. 2A), and a first penetration between the pad portion 11 and the lead portion 12 is provided on the upper side surface. Exposure and development are performed using a glass mask having a predetermined pattern corresponding to the hole 34a and a glass mask having a predetermined pattern corresponding to the pad portion 11 and the lead portion 12 on the lower surface (FIG. 2 ( b)), a resist mask 31 for etching is formed (see FIG. 2C).
In addition, the resist mask used in the manufacturing process of the LED package and the multi-row LED lead frame of the first embodiment and the examples to be described later is formed by laminating, for example, a dry film resist on both surfaces of the metal plate. The resist is exposed and developed on both sides using a glass mask on which a predetermined pattern is formed. Exposure and development are performed by a conventionally known method. For example, by irradiating ultraviolet rays in a state covered with a glass mask, reducing the solubility of the dry film resist portion irradiated with the ultraviolet rays that passed through the glass mask with respect to the developer, and removing other portions, A resist mask is formed. Although a negative dry film resist is used here as a resist, a negative liquid resist may be used for forming a resist mask. Furthermore, by using a positive dry film resist or a liquid resist, the solubility of the resist portion irradiated with ultraviolet rays that has passed through the glass mask is increased in the developing solution, and the resist mask is removed by removing the portion. You may make it form.
Next, half-etching is performed at a depth of 30 to 50% of the thickness of the metal plate from the upper surface side of the metal plate, and at a depth of 50 to 70% of the thickness of the metal plate from the lower surface side of the metal plate, A recess 19 is formed so that the pad portion 11, the lead portion 12, and the individual lead frame regions are partitioned at a depth where the half etching is performed on the lower surface side of the metal plate. A first through-hole 34a is formed between the portion 12 (see FIG. 2 (d)).
Next, the resist mask 31 for etching formed on both surfaces of the metal plate is removed (see FIG. 2 (e)).
Next, the plating layer 13 is formed on the entire surface of the metal plate (see FIG. 2 (f)). Thereby, the multi-row type LED lead frame in which the resin portion is not formed is completed.
In addition, the plating layer 13 may be formed by laminating plating in the order of Ni / Pd / Au / Ag, for example, or may be laminated in the order of Cu strike / Ag.
Further, the surface of the recess 19 and the side surface of the first through hole 34a are roughened.

Next, the recess 19 formed by half-etching on the lower surface side of the metal plate, the first through hole 34a is filled with the reflector resin, the space between the partitioned pad portion 11 and the lead portion 12, and the lead frame The LED element is mounted on the pad 11 on the outer periphery of the LED element mounting area and the wire bonding area in the pad portion on the upper surface side of the metal plate and the lead portion 12 and between the other lead frame region adjacent to the region. A reflector resin portion 15 that surrounds the LED element mounted on the surface so as to protrude upward is formed using a mold (see FIG. 2 (g)).
Thereby, the lead frame for multi-row type LEDs with the reflector resin is completed.
The reflector resin portion 15 interposed in the recess on the lower surface side of the metal plate and the reflector resin portion 15 formed on the upper surface side of the metal plate are integrated with each other via the reflector resin portion 15 interposed in the first through hole 34a. Turn into.

Next, the LED element 20 is mounted and fixed on the surface of the pad portion 11 on the upper surface side of the metal plate, and the lead portion 12 and the LED element 20 partitioned on the upper surface side of the metal plate are connected via the bonding wires 14. Further, the transparent resin portion 16 is filled with the transparent resin portion 15 surrounded by the reflector resin portion 15 in the pad portion 11 and the lead portion 12 partitioned on the upper surface side of the metal plate and the LED element 20 is mounted. Then, the internal space surrounded by the reflector resin portion 15 is sealed (see FIG. 2 (h)).
Next, the part surrounding the outer periphery of the pad part 11 and the lead part 12 in the reflector resin part 15 is cut together with the part where the concave part 19 is formed in the metal plate (see FIG. 2 (i)).
Thereby, the LED package is completed.

According to the multi-row type LED lead frame of the first embodiment, only the space between the pad portion 11 and the lead portion 12 facing each other in each lead frame region 10 (X _n , Y _n ) is defined by the first through hole 34a. The first sides A ₁₁ and A ₁₂ are spaced apart from each other, and the lead frame regions are integrally connected via a recess 19 formed in the base material of the lead frame. At this time, the longitudinal direction of the first through hole 34a that separates the pad portion 11 and the lead portion 12 in each lead frame region 10 (X _n , Y _n ) is the first side A ₁₁ , A ₁₂ . The lead frame regions 10 (X _n , Y _n ) and (X _{n + 1} , Y _n ) adjacent in the direction do not communicate with each other in a straight line, and are not arranged on the same straight line. It becomes.
For this reason, it is possible to prevent insufficient strength caused by the slits between the pad portion 11 and the lead portion 12 being connected in a straight line. In addition, there is no connection portion like the multi-row lead frame used in the LED packages described in Patent Documents 1 and 2, and the pad portion 11 and the lead portion 12 in each lead frame region and other lead frame regions. The pad portion 11 or the lead portion 12 and the outer frame portion for manufacturing the multi-row type lead frame are integrally connected without being separated through the recess portion 19, thereby improving the frame strength and causing deformation, warpage, or the like. It becomes difficult, and the flatness of the terminal surface for external connection exposed on the lower surface side is maintained without causing step, deformation, or warping of the pad portion or the lead portion. For this reason, a heat-resistant polyimide film or a heat-resistant silicone adhesive is used to prevent deformation and warping of the pad portion and lead portion that are connected to the entire surface exposed on the lower surface side of the multi-row type lead frame via the connecting portion. An expensive resin-made back tape is also unnecessary, and the cost can be reduced. In addition, since the space for the hanging pin and the dam bar becomes unnecessary, the integration proceeds. Furthermore, since the exposed external area of the electrode when cut into individual packages is expanded, the heat dissipation characteristics are also improved.

In addition, according to the multi-row type LED lead frame of the first embodiment, the recess 19 formed between adjacent lead frame regions has a width wider than a cutting width for making individual LED packages. Therefore, the resin portion formed in the concave portion 19 on the lower side of the base material of the lead frame remains on the lower surface side of the base material of the lead frame when cut into individual LED packages. The reflector resin portion 15 remaining on the lower surface side of the base material of the lead frame is formed on the upper surface side of the lead frame base material via the reflector resin portion 15 formed in the first through hole 34a. Therefore, the adhesion of the reflector resin portion 15 to the base material of the lead frame can be enhanced.
Further, according to the multi-row type LED lead frame of the first embodiment, since the surface of the recess 19 and the side surface of the first through hole 34a are roughened, the adhesion of the reflector resin portion 15 is improved. Is further improved.

Second Embodiment FIG. 3 is a view showing the configuration and arrangement of individual lead frame regions in a multi-row LED lead frame according to a second embodiment of the present invention, wherein (a) is a plan view seen from the upper surface side, (b) is a plan view seen from the lower surface side.

In addition to the configuration of the multi-column LED lead frame of the first embodiment shown in FIG. 1, the multi-column LED lead frame of the second embodiment further includes respective lead frame regions 10 (X _n , Y other lead frame area ₁₀ adjacent to the four corners of the outer region of the _{n) (X n + 1,} Y n), 10 (X n, Y n + 1), 10 (X n-1, Y n), 10 (X n, Y _n-1 ), 10 (X _{n + 1} , Y _n-1 ), 10 (X _{n + 1} , Y _{n + 1} ), 10 (X _n-1 , Y _{n + 1} ), 10 (X _n-1 , Y _n-1 ) A second through hole 34b is formed in a region where the outer region near the four corners overlaps.
The second through hole 34b has an opening whose diameter is 1.2 times or more the thickness of the base material of the lead frame, and each LED package has the same shape after being cut into individual LED packages. For example, it is formed into a shape such as a circle, a square, a rhombus, or a cross.
Further, the side surface of the second through hole 34b is subjected to a roughening process.
Other configurations are substantially the same as those of the multi-row type LED lead frame of the first embodiment shown in FIG.

According to the multi-row LED lead frame of the second embodiment, it is easy to fill the concave portion 19 formed on the lower surface side from the upper surface side of the base material of the lead frame to the lower surface side with the reflector resin. Become. In addition, the amount of metal that forms the base material of the lead frame in individual LED packages can be reduced without weakening the strength of the base material of the lead frame in the multi-frame type LED lead frame. The adverse effect on the blade during cutting can be reduced and the life of the blade can be extended. Further, when the reflector resin portion 15 surrounding the LED element mounting region on the upper surface side of the base material of the lead frame is formed, the reflector resin portion 15 formed on the upper surface side of the base material of the lead frame and the reflector formed on the lower surface side. Since the resin portion 15 can be integrated via the reflector resin portion 15 formed in the second through hole 34b, the adhesion of the reflector resin portion 15 to the base material of the lead frame in each lead frame region Is further improved.
Further, according to the multi-row LED lead frame of the second embodiment, since the roughening process is performed on the side surface of the second through hole 34b, the adhesion of the reflector resin portion 15 is further improved.
Other effects are substantially the same as those of the multi-row type LED lead frame of the first embodiment shown in FIG.

Third Embodiment FIG. 4 is a diagram showing the configuration and arrangement of individual lead frame regions in a multi-row LED lead frame according to a third embodiment of the present invention, wherein (a) is a plan view seen from the upper surface side. (b) is a top view seen from the lower surface side, (c) is BB sectional drawing of (b).

As shown in FIG. 4C, the second through hole 34b of the multi-row LED lead frame of the third embodiment is the same as that of the multi-row LED lead frame of the second embodiment shown in FIG. Compared to the configuration, the opening diameter r2 on the side opposite to the semiconductor element mounting side (lower surface side) is larger than the opening diameter r1 on the semiconductor element mounting side (upper surface side) and has a substantially truncated cone shape with a tapered side surface. Is formed.
Other configurations are substantially the same as those of the multi-row type LED lead frame of the second embodiment shown in FIG.

According to the multi-row type LED lead frame of the third embodiment, the anchor effect by the second through hole 34b is increased, and the adhesion of the reflector resin portion 15 to the lead frame base material is further improved.
Other effects are substantially the same as those of the multi-row type LED lead frame of the second embodiment shown in FIG.

Fourth Embodiment FIG. 5 is a diagram showing the configuration and arrangement of individual lead frame region groups in a multi-row LED lead frame according to a fourth embodiment of the present invention. FIG. 5 (a) is a plan view seen from the upper surface side. (B) is a plan view seen from the lower surface side.
In addition to the configuration of the multi-row LED lead frame of the second embodiment shown in FIG. 3, the multi-row LED lead frame of the fourth embodiment extends in the direction along the first sides A ₁₁ and A _12. Each lead frame having two adjacent lead frame regions 10 (X _n , Y _n ), 10 (X _{n + 1} , Y _n ) and arranged along the first sides A ₁₁ , A ₁₂ area group 10G _{(X n, Y} n) in the lead adjacent in the direction along the first side _{a 11, a 12} frame region _{10 (X n, Y n)} , between _{10 (X n + 1, Y} n) A third through hole 34c for communicating the first through holes 34a with each other is formed along the second sides B ₁₁ and B ₁₂ .
Further, the lead frame region groups 10G (X _n , Y _n ) and 10G (X _{n + 1} , Y _n ) adjacent in the direction along the first sides A ₁₁ and A ₁₂ are connected to the first through hole 34a and the third through hole 34a. The lead frame region group 10G (X _n) adjacent to each other in the direction along the second sides B ₁₁ and B ₁₂ are arranged with the crank shapes of the through holes formed by communicating with the through holes 34c in the same direction. , Y _n ), 10G (X _n , Y _{n + 1} ), the crank shapes of the through holes formed by the communication between the first through hole 34a and the third through hole 34c are in the same direction. Are arranged.
In addition, the side surface of the third through hole 34c is subjected to a roughening process.
Other configurations are substantially the same as those of the multi-row type LED lead frame of the second embodiment shown in FIG.

According to the multi-row type LED lead frame of the fourth embodiment, the concave portion 19 formed on the lower surface side is further filled with the reflector resin from the upper surface side of the base material of the lead frame through the third through hole 34c. It becomes easy. In addition, it is possible to further reduce the amount of metal that forms the base material of the lead frame when making individual LED packages without weakening the strength of the base material of the lead frame in the multi-frame type LED lead frame. Therefore, the adverse effect on the blade during cutting can be reduced, and the life of the blade can be extended. Further, when the reflector resin portion 15 surrounding the LED element mounting region on the upper surface side of the base material of the lead frame is formed, the reflector resin portion 15 formed on the upper surface side of the base material of the lead frame and the reflector formed on the lower surface side. Since the resin portion 15 can be integrated through the reflector resin portion 15 formed in the third through hole 34c, the adhesion of the reflector resin portion 15 to the base material of the lead frame in each lead frame region Is further improved.
Moreover, according to the multi-row type LED lead frame of the fourth embodiment, since the roughening process is performed on the side surface of the third through hole 34c, the adhesion of the reflector resin portion 15 is further improved.
Other effects are substantially the same as those of the multi-row type LED lead frame of the second embodiment shown in FIG.

Fifth Embodiment FIG. 6 is a diagram showing the configuration and arrangement of individual lead frame region groups in a multi-row LED lead frame according to a fifth embodiment of the present invention. FIG. 6 (a) is a plan view seen from the upper surface side. (B) is a plan view seen from the lower surface side.
In addition to the configuration of the multi-row LED lead frame of the second embodiment shown in FIG. 3, the multi-row LED lead frame of the fifth embodiment extends in the direction along the first sides A ₁₁ and A _12. Three lead frame regions 10 (X _n , Y _n ), 10 (X _{n + 1} , Y _n ), 10 (X _{n + 2} , Y _n ) adjacent to each other are formed on the first sides A ₁₁ and A ₁₂ . along husband are arranged s leadframe region group _{10G '(X n, Y n} ) in a first side _{a 11, a 12} to the lead frame area group adjacent in the direction along _{10G' (X n, Y n} ) , 10G ′ (X _{n + 1} , Y _n ) are arranged with the crank shapes of the through holes formed by the communication between the first through holes 34a and the third through holes 34c being reversed, 2 sides _{B 11, B 12} to follow the lead adjacent to the direction Frame area group _{10G '(X n, Y n} ), 10G' (X n, Y n + 1) each other, the through hole and the first through hole 34a and the third through hole 34c is formed by communicating The crank shape is arranged in the same direction.
Other configurations are substantially the same as those of the multi-row type LED lead frame of the fourth embodiment shown in FIG.

According to the multi-row LED lead frame of the fifth embodiment, when the third through-hole 34c is used to make individual LED packages without weakening the strength of the lead frame base material in the multi-row LED lead frame. The amount of metal that forms the base material of the lead frame can be further reduced as compared with the fourth embodiment, and accordingly, adverse effects on the blade during cutting are reduced, and the life of the blade is extended. Can do. Further, when forming the reflector resin portion 15 surrounding each lead frame region, the reflector resin portion 15 formed on the upper surface side of the base material of the lead frame and the reflector resin portion 15 formed on the lower surface side are integrated. Therefore, the amount of the reflector resin portion 15 formed in the third through hole 34c can be increased as compared with the fourth embodiment, and accordingly, the adhesion of the reflector resin portion 15 to the base material of the lead frame is further increased. Further improve.
Other effects are substantially the same as those of the multi-row type LED lead frame of the fourth embodiment shown in FIG.

Sixth Embodiment FIG. 7 is a view showing the configuration and arrangement of individual lead frame region groups in a multi-row LED lead frame according to a sixth embodiment of the present invention, and (a) is a plan view seen from the upper surface side. (B) is a plan view seen from the lower surface side.

In the multi-row type LED lead frame of the sixth embodiment, the pad portion 11 and the lead portion 12 have the length of the first sides A ₁₁ and A ₁₂ facing each other and the second side B perpendicular to the first side. _11, the length of _{B 12} have been both equally form.
Then, the lead frames 10 (X _n , Y _n ) and 10 (X _{n + 1} , Y _n ) adjacent to each other in the direction along the first sides A ₁₁ and A ₁₂ (left and right direction in FIG. 7), and the second side The lead frame regions 10 (X _n , Y _n ) and 10 (X _n , Y _{n + 1} ) adjacent to each other in the direction along B ₁₁ and B ₁₂ (the vertical direction in FIG. 7) are both of the first through hole 34a. The arrangement is such that the directions intersect with each other.
Other configurations are substantially the same as those of the multi-row type LED lead frame of the third embodiment shown in FIG.

According to the multi-row LED lead frame of the sixth embodiment, the pad portion 11 and the lead portion 12 have the lengths of the first sides A ₁₁ and A ₁₂ facing each other and the second side perpendicular to the first side. Even if the lengths of the sides B ₁₁ and B ₁₂ are the same, the lead frame has the same effect as the multi-row LED lead frame of the third embodiment.

EXAMPLES Next, examples of the present invention will be described.
In the following embodiments, the pre-processing and post-processing of each process such as the cleaning process and the drying process are general processes, and thus description thereof is omitted.

Example 1
First, a strip-like Cu material having a thickness of 0.2 mm was prepared as a base material for a lead frame, pilot holes were formed at the edge of the outer frame, and then a resist layer was formed on both sides (FIG. 2 (a )reference).
Next, a glass mask on which a pattern necessary for obtaining the first through-hole 34a is drawn is prepared on the upper surface side of the base material of the lead frame, and the pad portion 11 and the lead portion and the individual portions are provided on the lower surface side. Prepare a glass mask on which a pattern necessary for partitioning the lead frame region and obtaining the first through hole 34a is prepared, and determine the position of the glass mask based on the pilot hole formed earlier and expose The resist mask 31 for etching was formed on both surfaces of the base material of the lead frame by developing (see FIG. 2 (c)).
Next, an etching process is performed to perform a half etching process having a depth of about 0.06 to 0.1 mm from the upper surface side, and a half etching process to a depth of about 0.1 to 0.14 mm from the lower surface side. A recess 19 is formed so that the pad portion 11, the lead portion 12, and the individual lead frame regions are partitioned at a depth where the half etching is performed on the lower surface side, and a second portion is formed between the pad portion 11 and the lead portion 12. 1 through-hole 34a was formed (see FIG. 2 (d)).
The first through hole 34a was formed in a rectangular slit shape having a width of 0.3 mm, and the lead portion 11 and the pad portion 12 in each lead frame region were separated from each other. The distance between adjacent lead frame regions was designed to be 0.3 mm. Further, the lead frame regions 10 (X _n , Y _n ), 10 (X _n , Y _{n + 1} ) adjacent in the direction along the second sides B ₁₁ , B ₁₂ are arranged between the pad portion 11 and the lead portion 12. The lead frame regions 10 (X _n , Y _n ), 10 (X _{n + 1} , Y _n ) that are arranged in the same arrangement and are adjacent in the direction along the first sides A ₁₁ , A ₁₂ are connected to the pad portion 11. The lead portions 12 are arranged in the opposite arrangement. The pad portion 11 was formed to have a size of 0.8 mm × 1.8 mm, and the lead portion 12 had a size of 0.8 mm × 0.7 mm. The spacing between the pad portions 11 or the lead portions 12 in the adjacent lead frame region was designed to be 0.4 mm.
Next, the resist mask 31 for etching formed on both surfaces was removed (see FIG. 2 (e)).
Next, plating layers were formed on the entire surface in the order of Ni / Pd / Au / Ag to obtain a multi-row LED lead frame of Example 1 having the configuration of the first embodiment (FIG. 2 (f)). reference).

Example 2
Similar to Example 1, after preparing a base material for the lead frame and forming a resist layer on both sides (see FIG. 2 (a)), the first through hole 34a and A glass mask on which a pattern necessary for obtaining the second through hole 34b is drawn is prepared, and the lower surface side is used to partition the pad portion 11, the lead portion, and individual lead frame regions, and the first through hole 34a. A lead frame is prepared by preparing a glass mask on which a pattern necessary for obtaining the second through-hole 34b is drawn, determining the position of the glass mask with reference to the pilot hole previously formed, and performing exposure and development. An etching resist mask 31 was formed on both surfaces of the substrate (see FIG. 2C).
The second through hole 34b is lead frame area 10 _{(X n, Y} n) other leadframe region ₁₀ adjacent to the outer region of the four corners of the _{(X n + 1, Y n} ), 10 (X n, Y n + 1) _{, 10 (X n-1,} Y n), 10 (X n, Y n-1), 10 (X n + 1, Y n-1), 10 (X n + 1, Y n + 1), 10 (X n-1, Y _{n + 1} ), l0 (X _n-1 , Y _n-1 ) are formed in a region that overlaps with the outer region near the four corners, the size is φ0.832 mm, and the shape is the same after cutting each lead frame region A round shape was formed so that
The first through hole 34a, the distance between adjacent lead frame regions, the pad part 11 and the lead part 12, and the distance between the pad part 11 or the lead part 12 in the adjacent lead frame area were formed in the same manner as in Example 1. .
Next, as in Example 1, the resist mask 31 is removed (see FIG. 2 (e)), a plating layer is formed, and the multi-row LED of Example 2 having the same configuration as that of the second embodiment is used. A lead frame was obtained (see FIG. 2 (f)).

Example 3
In the second through hole 34b, the manufacturing method is the same as that of the third embodiment except that the opening diameter on the upper surface side and the opening diameter on the lower surface side of the base material of the lead frame are made different. A multi-row LED lead frame of Example 3 having the configuration was obtained.
The second through hole 34b was formed so that the opening diameter on the upper surface side of the base material of the lead frame was φ0.3 mm, the opening diameter on the lower surface side was φ0.832 mm, and the cross-sectional shape was a truncated cone shape.

Example 4
In the same manner as in Example 1, after preparing a lead frame base material and forming a resist layer on both sides (see FIG. 2 (a)), the first through hole 34a, A glass mask on which a pattern necessary for obtaining the second through hole 34b and the third through hole 34c is drawn is prepared, and the pad portion 11 and the lead portion and individual lead frame regions are defined on the lower surface side. And a glass mask on which a pattern necessary for obtaining the first through-hole 34a, the second through-hole 34b, and the third through-hole 34c is drawn, and the glass mask is formed based on the pilot holes previously formed. The resist mask 31 for etching was formed on both surfaces of the base material of the lead frame by deciding the position and performing exposure and development (see FIG. 2C).
The third through hole 34c has a width of 0.3 mm and is formed so as to communicate the first through hole 34a and the second through hole 34b.
Further, the third through hole 34c has two lead frame regions 10 (X _n ) adjacent to each other in the direction along the first sides A ₁₁ and A ₁₂ as in the multi-row LED lead frame of the fourth embodiment. , Y _n ), 10 (X _{n + 1} , Y _n ), and in each lead frame region group 10G (X _n , Y _n ) arranged along the first sides A ₁₁ , A ₁₂ , Along the second sides B ₁₁ , B ₁₂ between the lead frame regions 10 (X _n , Y _n ), 10 (X _{n + 1} , Y _n ) adjacent in the direction along the first sides A ₁₁ , A ₁₂ Formed.
The lead frame region groups 10G (X _n , Y _n ) and 10G (X _{n + 1} , Y _n ) adjacent in the direction along the first sides A ₁₁ and A ₁₂ are connected to the first through hole 34a and the third through hole 34a. The lead frame region group 10G (X _n) adjacent to each other in the direction along the second sides B ₁₁ and B ₁₂ are arranged with the crank shapes of the through holes formed by communicating with the through holes 34c in the same direction. , Y _n ), 10G (X _n , Y _{n + 1} ), the crank shapes of the through holes formed by the communication between the first through hole 34a and the third through hole 34c are in the same direction. To be arranged.
The first through hole 34a, the second through hole 34b, the interval between adjacent lead frame regions, the pad portion 11 and the lead portion 12, and the interval between the pad portion 11 or the lead portion 12 in the adjacent lead frame region are implemented. Formed as in Example 2.
Next, as in Example 2, the resist mask 31 is removed (see FIG. 2 (e)), a plating layer is formed, and the multi-row LED of Example 4 having the same configuration as that of the fourth embodiment is used. A lead frame was obtained (see FIG. 2 (f)).

Example 5
Except the arrangement pattern of the 3rd through-hole 34c, the lead frame for multi-row type LED of Example 5 provided with the structure similar to 5th Embodiment with the manufacturing method substantially the same as Example 4 was obtained.
The third through hole 34c has three lead frame regions 10 (X _n , Y adjacent to each other in the direction along the first sides A ₁₁ , A ₁₂ as in the multi-row LED lead frame of the fifth embodiment. _n ), 10 (X _{n + 1} , Y _n ), 10 (X _{n + 2} , Y _n ), and each lead frame region group 10G ′ (which is arranged along the first sides A ₁₁ , A ₁₂ ) X _n, in _{Y n),} the first side _{a 11, a 12} to the lead frame area group adjacent in the direction along _{10G '(X n, Y n} ), 10G' is _{(X n + 1, Y n} ) to each other, the The through holes formed by the communication between the first through hole 34a and the third through hole 34c are arranged in opposite directions, and are adjacent to each other in the direction along the second sides B ₁₁ and B _12. lead frame area group _{10G '(X n, Y n} ), 10 _{'(X n, Y n +} 1) to each other, and as the crank shape of the through hole formed by the first through hole 34a and the third through hole 34c communicates is arranged a same direction .

Example 6
A multi-frame LED lead frame of Example 6 having the same configuration as that of the sixth embodiment was obtained by a manufacturing method substantially similar to that of Example 3.
The size of each lead frame region was 3 mm × 3 mm, and the pad portion 11 and the lead portion 12 were each formed such that the opposite sides were 3 mm and the other side was 1.35 mm.
Further, in this example, two types of multi-row LED lead frames having different opening diameters of the second through holes 34b were manufactured. The lead frame for the first type of multi-row LED was formed such that the opening diameter on the upper surface side was φ0.350 mm and the opening diameter on the lower surface side was φ0.450 mm. The second type multi-row LED lead frame was formed such that the opening diameter on the upper surface side was φ0.600 mm and the opening diameter on the lower surface side was φ0.700 mm.
Further, the lead frames 10 (X _n , Y _n ), 10 (X _{n + 1} , Y _n ) adjacent to each other in the direction along the first sides A ₁₁ , A ₁₂ (left and right direction in FIG. 7), and the second side The lead frame regions 10 (X _n , Y _n ) and 10 (X _n , Y _{n + 1} ) adjacent to each other in the direction along B ₁₁ and B ₁₂ (the vertical direction in FIG. 7) are both of the first through hole 34a. It was formed so that the directions were arranged so as to cross each other.

  As mentioned above, although embodiment and the Example of this invention were described, the lead frame for multi-row type LED of this invention is not limited to each embodiment and each Example mentioned above. For example, in the multi-row LED lead frame of the sixth embodiment, the pad portion and the lead portion have the length of the first side facing each other and the length of the second side perpendicular to the first side. The lead frames that are equally formed and are adjacent to each other in the direction along the first side and the lead frame regions that are adjacent in the direction along the second side are both in directions in which the directions of the first through holes intersect each other. The arrangement arranged in such a manner may be combined with a configuration peculiar to each of the first embodiment and the second embodiment.

  The multi-row type LED lead frame of the present invention is in a field in which individual lead frame regions are arranged in a matrix, and in the process of forming a semiconductor device, it is required to form a lead frame that is individually cut. Useful.

DESCRIPTION OF SYMBOLS 10 Lead frame area | region 10G Lead frame area | region group 11 Pad part 12 Lead part 13 Plating layer 14 Bonding wire 15 Reflector resin part 16 Transparent resin part 17 Connection part 18 Outer frame part 20 LED element 34a 1st through-hole 34b 2nd penetration Hole 34c Third through hole m Lead frame substrate R Resist film

Claims (13)

A lead frame region for a multi-row LED in which lead frame regions having rectangular pad portions and lead portions are arranged in a matrix,
On the lower surface side of the metal plate, a recess is formed that partitions the pad portion, the lead portion, and the individual lead frame regions,
Each of the lead frame regions is formed with a first through hole that is spaced between the opposing pad part and the lead part over the length of the first side,
The lead frame regions adjacent to each other in the direction along the first side and the lead frame regions adjacent to each other in the direction along the second side perpendicular to the first side, respectively, A lead frame for a multi-row type LED, wherein the through holes are arranged so as not to communicate in a straight line. The pad portion and the lead portion have mutually equal first side lengths, and second side lengths perpendicular to the first side are different from each other,
The lead frame regions adjacent in the direction along the second side are arranged with the same arrangement of the pad portion and the lead portion,
2. The multiple lead frames according to claim 1, wherein the lead frame regions adjacent to each other in the direction along the first side are arranged so that the arrangement of the pad portion and the lead portion is reversed. Lead frame for row type LED. The pad portion and the lead portion have the same length of the first side facing each other and the length of the second side perpendicular to the first side,
The lead frames adjacent to each other in the direction along the first side and the lead frame regions adjacent to each other in the direction along the second side are directions in which the directions of the first through holes intersect each other. The lead frame for a multi-row type LED according to claim 1, wherein the lead frame is arranged as follows.   Furthermore, a second through hole is formed in a region where an outer region in the vicinity of the four corners of each of the lead frame regions overlaps with an outer region in the vicinity of the four corners of the other lead frame region. The multi-row type LED lead frame according to claim 1.   The second through-hole is formed in a shape in which the opening diameter on the side opposite to the semiconductor element mounting side is larger than the opening diameter on the semiconductor element mounting side and the side surface is tapered. The lead frame for multi-row LEDs according to claim 4.   Further, each of the lead frame region groups arranged along the first side includes at least two of the lead frame regions adjacent to each other in the direction along the first side. A third through hole that communicates each of the first through holes is formed between the lead frame regions adjacent to each other in a direction along the second side along the second side. The lead frame for a multi-row type LED according to claim 4, which is dependent on claim 2 or claim 2. The lead frame region group has an even number of lead frame regions adjacent in the direction along the first side,
The lead frame region groups adjacent to each other in the direction along the first side have the same orientation of the crank shape of the through hole formed by the communication between the first through hole and the third through hole. Is arranged,
The lead frame region groups adjacent to each other in the direction along the second side have the same orientation of the crank shape of the through hole formed by the communication between the first through hole and the third through hole. The lead frame for a multi-row LED according to claim 6, wherein The lead frame region group includes three or more odd number of the lead frame regions adjacent in the direction along the first side,
The lead frame region groups adjacent to each other in the direction along the first side have a crank shape of a through hole formed by communicating the first through hole and the third through hole in a reverse direction. Is arranged,
The lead frame region groups adjacent to each other in the direction along the second side have the same orientation of the crank shape of the through hole formed by the communication between the first through hole and the third through hole. The lead frame for a multi-row LED according to claim 6, wherein   The said recessed part formed between the said adjacent lead frame area | regions has a width | variety wider than the cutting width for making each LED package. Multi-row LED lead frame.   The lead frame for a multi-row LED according to any one of claims 1 to 9, wherein the surface of the recess is subjected to a roughening process.   The lead frame for a multi-row LED according to any one of claims 1 to 9, wherein a side surface of the first through hole is subjected to a roughening process.   6. The lead frame for a multi-row LED according to claim 4, wherein a side surface of the second through hole is subjected to a roughening process.   The lead frame for a multi-row LED according to any one of claims 6 to 8, wherein the side surface of the third through-hole is subjected to a roughening treatment.

Images