JP2017150929A - Physical quantity detector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent corrosion of a circuit board wiring caused by breakage of an insulating film when a physical quantity detector is assembled.SOLUTION: A physical quantity detector includes: a circuit board on which an insulating film 800 is formed; and a housing in which the circuit board is formed by insertion. The insulating film 800 includes: a first region 801 in a fixing part of the circuit board; a second region 802 in a pressing part of the circuit board to which a metal mold for forming the housing is pressed; a third region 803 in a conductor arrangement part of the circuit board in which a circuit conductor is arranged; and a fourth region 804 in the boundary of the circuit board between at least one of the fixing part and the pressing part and the conductor arrangement part, the first, second, and fourth regions having different film thicknesses from one another.SELECTED DRAWING: Figure 9

Description

  The present invention relates to a physical quantity detection device for intake air of an internal combustion engine.

  A conventional thermal flow meter has a structure in which a circuit board having a measurement unit is bonded to a housing with an adhesive. Further, Patent Document 1 discloses that a circuit package including a flow rate measurement circuit is formed in the first resin molding process, and the circuit package is included when forming the housing in the second resin molding process. The structure of a thermal flow meter holding and fixing is shown.

JP2015-42991A

  For example, when a circuit board is used instead of a circuit package in the second resin molding step, the housing is molded in a state where the circuit board is sandwiched and held in a molding die. Therefore, there is a possibility that the amount of pressing of the mold may be increased due to variation in the dimensions of the circuit board or setting in the mold, and there is a possibility that a large stress is applied to the circuit board. Therefore, the insulating protective film provided on the circuit board for protecting the circuit conductor of the circuit board may be damaged, and water or oil may enter from the damaged portion to corrode the circuit conductor.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a physical quantity detection device in which corrosion of a circuit conductor of a circuit board due to damage to an insulating film is reduced.

  In order to solve the above problems, a physical quantity detection device of the present invention is a physical quantity detection device having a circuit board having an insulating film formed on the outer surface of a board body and a housing in which the circuit board is insert-molded. The circuit board includes a fixed portion fixed to the housing, a pressing portion to which a mold for molding the housing is pressed, a conductor arrangement portion where a circuit conductor is disposed, the fixed portion, and the A boundary portion formed between at least one of the pressing portions and the conductor placement portion, and the insulating film is disposed in the pressing portion and a first region disposed in the fixing portion. The second region, the third region disposed in the conductor placement portion, and the fourth region disposed in the boundary portion, and the first region and the second region. And the fourth region are different in film thickness .

  ADVANTAGE OF THE INVENTION According to this invention, corrosion of the circuit conductor of a circuit board resulting from the damage of an insulating film can be reduced. Further features related to the present invention will become apparent from the description of the present specification and the accompanying drawings. Further, problems, configurations, and effects other than those described above will be clarified by the following description of embodiments.

The system figure which shows one Example which used the physical quantity detection apparatus which concerns on this invention for the internal combustion engine control system. The front view of a physical quantity detection apparatus. The rear view of a physical quantity detection apparatus. The left view of a physical quantity detection apparatus. The right view of a physical quantity detection apparatus. The top view of a physical quantity detection apparatus. The bottom view of a physical quantity detection apparatus. The front view which shows the state which removed the front cover from the physical quantity detection apparatus. The rear view which shows the state which removed the back cover from the physical quantity detection apparatus. The left view which shows the state which removed the front cover and the back cover from the physical quantity detection apparatus. The right view which shows the state which removed the front cover and the back cover from the physical quantity detection apparatus. FIG. 3 is a cross-sectional view taken along line AA in FIG. The rear view explaining other examples of a housing. The right view of the housing shown to FIGS. 4-1. The figure explaining the structure of a table | surface cover. The figure explaining the structure of a back cover. The front view of a circuit board. The right view of a circuit board. The rear view of a circuit board. The figure explaining an example of the circuit structure of a physical quantity detection apparatus. The figure explaining the other Example of the circuit structure of a physical quantity detection apparatus. FIG. 3 is a diagram illustrating a configuration of a housing in the first embodiment. FIG. 3 is a cross-sectional view of the housing in the first embodiment. Sectional drawing of the housing in Example 2. FIG. Sectional drawing of the housing in Example 3. FIG. Sectional drawing of the housing in Example 4. FIG. FIG. 6 is a diagram illustrating a configuration of a housing in a fifth embodiment.

  The modes for carrying out the invention (hereinafter referred to as examples) described below solve various problems demanded as actual products, and particularly as a detection device for detecting the physical quantity of intake air of a vehicle. Various problems desirable for use are solved, and various effects are achieved. One of the various problems solved by the following embodiment is the contents described in the section of the problem to be solved by the invention described above, and one of the various effects exhibited by the following embodiment is as follows. It is the effect described in the column of the effect of the invention. Various problems solved by the following embodiments will be described in the description of the following embodiments with respect to various effects exhibited by the following embodiments. Therefore, the problems and effects solved by the embodiments described in the following embodiments are also described in the contents other than the contents of the problem column to be solved by the invention and the effects of the invention column.

  In the following embodiments, the same reference numerals indicate the same configuration even when the figure numbers are different, and the same effects are achieved. For configurations that have already been described, only the reference numerals are attached to the drawings, and the description may be omitted.

1. An Example Using a Physical Quantity Detection Device According to the Present Invention for an Internal Combustion Engine Control System FIG. 1 shows an embodiment using a physical quantity detection device according to the present invention for an electronic fuel injection type internal combustion engine control system. It is a system diagram. Based on the operation of the internal combustion engine 110 including the engine cylinder 112 and the engine piston 114, the intake air is sucked from the air cleaner 122 as the measurement target gas 30 and passes through the main passage 124 such as the intake body, the throttle body 126, and the intake manifold 128. Guided to the combustion chamber of the engine cylinder 112. The physical quantity of the gas 30 to be measured, which is the intake air guided to the combustion chamber, is detected by the physical quantity detection device 300 according to the present invention, and fuel is supplied from the fuel injection valve 152 based on the detected physical quantity, and together with the intake air It is guided to the combustion chamber in the state of air-fuel mixture. In this embodiment, the fuel injection valve 152 is provided at the intake port of the internal combustion engine, and the fuel injected into the intake port forms an air-fuel mixture together with the measured gas 30 that is the intake air, and passes through the intake valve 116. It is guided to the combustion chamber and burns to generate mechanical energy.

  The fuel and air guided to the combustion chamber are in a mixed state of fuel and air, and are burned explosively by spark ignition of the spark plug 154 to generate mechanical energy. The combusted gas is guided from the exhaust valve 118 to the exhaust pipe, and is discharged from the exhaust pipe to the outside as the exhaust gas 24. The flow rate of the gas 30 to be measured, which is the intake air led to the combustion chamber, is controlled by the throttle valve 132 whose opening degree changes based on the operation of the accelerator pedal. The fuel supply amount is controlled based on the flow rate of the intake air guided to the combustion chamber, and the driver controls the flow rate of the intake air guided to the combustion chamber by controlling the opening degree of the throttle valve 132, thereby The mechanical energy generated by the engine can be controlled.

1.1 Outline of Control of Internal Combustion Engine Control System Physical quantities such as a flow rate, temperature, humidity, pressure, and the like of the measurement target gas 30 that is the intake air that is taken in from the air cleaner 122 and flows through the main passage 124 are detected by the physical quantity detection device 300. An electric signal representing the physical quantity of the intake air is input from the detection device 300 to the control device 200. Further, the output of the throttle angle sensor 144 that measures the opening degree of the throttle valve 132 is input to the control device 200, and the positions and states of the engine piston 114, the intake valve 116, and the exhaust valve 118 of the internal combustion engine, and the rotation of the internal combustion engine. In order to measure the speed, the output of the rotation angle sensor 146 is input to the control device 200. In order to measure the state of the mixture ratio of the fuel amount and the air amount from the state of the exhaust gas 24, the output of the oxygen sensor 148 is input to the control device 200.

  The control device 200 calculates the fuel injection amount and the ignition timing based on the physical quantity of intake air that is the output of the physical quantity detection device 300 and the rotational speed of the internal combustion engine that is measured based on the output of the rotation angle sensor 146. Based on these calculation results, the amount of fuel supplied from the fuel injection valve 152 and the ignition timing ignited by the spark plug 154 are controlled. The fuel supply amount and ignition timing are actually based on the temperature and throttle angle change state detected by the physical quantity detection device 300, the engine speed change state, and the air-fuel ratio state measured by the oxygen sensor 148. It is finely controlled. The control device 200 further controls the amount of air that bypasses the throttle valve 132 by the idle air control valve 156 in the idle operation state of the internal combustion engine, and controls the rotational speed of the internal combustion engine in the idle operation state.

1.2 Importance of Improving Detection Accuracy of Physical Quantity Detection Device and Mounting Environment of Physical Quantity Detection Device Both the fuel supply amount and ignition timing, which are main control amounts of the internal combustion engine, are calculated using the output of the physical quantity detection device 300 as a main parameter. The Therefore, improvement in detection accuracy of the physical quantity detection device 300, suppression of changes over time, and improvement in reliability are important in terms of improvement in vehicle control accuracy and ensuring reliability.

  In particular, in recent years, there has been a very high demand for fuel efficiency of vehicles and a very high demand for exhaust gas purification. In order to meet these demands, it is extremely important to improve the detection accuracy of the physical quantity of the intake air 20 detected by the physical quantity detection device 300. It is also important that the physical quantity detection device 300 maintains high reliability.

  A vehicle on which the physical quantity detection device 300 is mounted is used in an environment in which changes in temperature and humidity are large. It is desirable for the physical quantity detection device 300 to take into account the response to changes in temperature and humidity in the environment of use and the response to dust and contaminants.

  The physical quantity detection device 300 is attached to an intake pipe that is affected by heat generated from the internal combustion engine. Therefore, the heat generated by the internal combustion engine is transmitted to the physical quantity detection device 300 via the intake pipe which is the main passage 124. Since the physical quantity detection device 300 detects the flow rate of the measurement target gas 30 by performing heat transfer with the measurement target gas 30, it is important to suppress the influence of heat from the outside as much as possible.

  As described below, the physical quantity detection device 300 mounted on the vehicle simply solves the problem described in the column of the problem to be solved by the invention, and only exhibits the effect described in the column of the effect of the invention. Instead, as will be described below, the various problems described above are fully considered, and various problems required as products are solved and various effects are produced. Specific problems to be solved by the physical quantity detection device 300 and specific effects to be achieved will be described in the description of the following embodiments.

2. Configuration of Physical Quantity Detection Device 300 2.1 External Structure of Physical Quantity Detection Device 300 FIGS. 2-1 to 2-6 are diagrams showing the appearance of the physical quantity detection device 300, and FIG. Fig. 2-2 is a rear view, Fig. 2-3 is a left side view, Fig. 2-4 is a right side view, Fig. 2-5 is a plan view, and Fig. 2-6 is a bottom view.

  The physical quantity detection device 300 includes a housing 302, a front cover 303, and a back cover 304. The housing 302 is formed by molding in which a resin material is molded using a mold. The housing 302 includes a flange 311 for fixing the physical quantity detection device 300 to the intake body, which is the main passage 124, and an external connection portion 321 having a connector that protrudes from the flange 311 and is electrically connected to an external device. The measuring unit 331 extends from the flange 311 toward the center of the main passage 124 and extends in a direction orthogonal to the main flow direction of the measurement target gas 30 flowing through the main passage 124.

  A circuit board 400 is integrally molded in the measurement unit 331 of the housing 302 by insert molding (see FIGS. 3A and 3B). The circuit board 400 is molded integrally with the housing 302 by insert molding in which the circuit board 400 is previously placed in a mold for molding the housing 302 and the housing 302 is molded. The circuit board 400 is provided with at least one detection unit for detecting a physical quantity of the measurement target gas 30 flowing through the main passage 124 and a circuit unit for processing a signal detected by the detection unit. The detection unit is arranged at a position exposed to the measurement target gas 30, and the circuit unit is arranged in a circuit chamber sealed by a front cover 303.

  A sub-passage groove is provided on the front surface and the back surface of the measuring unit 331, and the first sub-passage 305 is formed in cooperation with the front cover 303 and the back cover 304. At the tip of the measuring unit 331, a first sub-passage inlet 305 a for taking a part of the measurement target gas 30 such as intake air into the first sub-passage 305 and the measurement target gas 30 from the first sub-passage 305 are mainly used. A first sub-passage outlet 305b for returning to the passage 124 is provided. A part of the circuit board 400 protrudes in the middle of the first sub-passage 305, and a flow rate detection unit 602 (see FIG. 3-1), which is a detection unit, is arranged on the protruding portion, and the measurement target is The flow rate of the gas 30 is detected.

  A second sub-passage 306 is provided in the middle of the measurement unit 331 closer to the flange 311 than the first sub-passage 305 for taking a part of the measurement target gas 30 such as intake air into the sensor chamber Rs. The second sub passage 306 is formed by the cooperation of the measurement unit 331 and the back cover 304. The second sub-passage 306 includes a second sub-passage inlet 306 a that opens to the upstream outer wall 336 to take in the gas to be measured 30, and a downstream side to return the gas to be measured 30 from the second sub-passage 306 to the main passage 124. A second sub-passage outlet 306b that opens to the outer wall 338 is provided. The second sub-passage 306 communicates with the sensor chamber Rs formed on the back side of the measurement unit 331. In the sensor chamber Rs, pressure sensors 421A and 421B and a humidity sensor 422 which are detection units provided on the back surface of the circuit board 400 are arranged (see FIG. 7-3).

2.2 Effects Based on Appearance Structure of Physical Quantity Detection Device 300 The physical quantity detection device 300 is provided with a second sub-passage inlet 306a provided in the middle portion of the measurement unit 331 extending from the flange 311 toward the center of the main passage 124, and measuring. A first sub-passage inlet 305 a is provided at the tip of the part 331. Therefore, not the vicinity of the inner wall surface of the main passage 124 but the portion of the gas near the center away from the inner wall surface can be taken into the first sub-passage 305 and the second sub-passage 306, respectively. Therefore, the physical quantity detection device 300 can measure the physical quantity of the gas in the part away from the inner wall surface of the main passage 124, and can reduce the measurement error of the physical quantity related to the heat and the flow velocity decrease near the inner wall surface.

  The measuring part 331 has a shape that extends long along the axis from the outer wall of the main passage 124 toward the center, but the thickness width is narrow as shown in FIGS. 2-3 and 2-4. It is made. That is, the measurement unit 331 of the physical quantity detection device 300 has a side surface with a small width and a substantially rectangular front surface. Thereby, the physical quantity detection device 300 can include the first sub-passage 305 having a sufficient length, and the fluid resistance of the measurement target gas 30 can be suppressed to a small value. For this reason, the physical quantity detection device 300 can measure the flow rate of the measurement target gas 30 with high accuracy while suppressing the fluid resistance to a small value.

2.3 Structure and Effect of Flange 311 The flange 311 is provided with a plurality of recesses 313 on the lower surface 312 facing the main passage 124 to reduce the heat transfer surface between the main passage 124 and detect a physical quantity. The device 300 is less susceptible to heat. In the physical quantity detection device 300, the measurement unit 331 is inserted into the inside from an attachment hole provided in the main passage 124, and the lower surface 312 of the flange 311 faces the main passage 124. The main passage 124 is, for example, an intake body, and the main passage 124 is often maintained at a high temperature. Conversely, when starting in a cold region, the main passage 124 may be at a very low temperature. If such a high or low temperature state of the main passage 124 affects the measurement of various physical quantities, the measurement accuracy decreases. The flange 311 has a recess 313 on the lower surface 312, and a space is formed between the lower surface 312 facing the main passage 124 and the main passage 124. Therefore, heat transfer from the main passage 124 to the physical quantity detection device 300 can be reduced, and deterioration in measurement accuracy due to heat can be prevented.

  The screw holes 314 of the flange 311 are for fixing the physical quantity detection device 300 to the main passage 124, and the respective surfaces of the screw holes 314 facing the main passage 124 around the screw holes 314 are separated from the main passage 124. A space is formed between the main passage 124 and the surface of the screw hole 314 that faces the main passage 124. By doing in this way, it has the structure which can reduce the heat transfer from the main channel | path 124 with respect to the physical quantity detection apparatus 300, and can prevent the measurement accuracy fall by heat.

2.4 Structure of External Connection Portion 321 The external connection portion 321 includes a connector 322 that is provided on the upper surface of the flange 311 and protrudes from the flange 311 toward the downstream side in the main flow direction of the measurement target gas 30. The connector 322 is provided with an insertion hole 322a for inserting a communication cable for connecting to the control device 200. As shown in FIG. 2-4, four external terminals 323 are provided inside the insertion hole 322a. The external terminal 323 serves as a terminal for outputting physical quantity information that is a measurement result of the physical quantity detection device 300 and a power supply terminal for supplying DC power for operating the physical quantity detection device 300.

  The connector 322 has a shape protruding from the flange 311 toward the downstream side in the flow direction of the gas 30 to be measured and inserted from the downstream side in the flow direction toward the upstream side, but is not limited to this shape. For example, it may have a shape that protrudes vertically from the upper surface of the flange 311 and is inserted along the extending direction of the measuring unit 331, and various modifications are possible.

3. Overall Structure of Housing 302 and its Effects 3.1 Overall Structure Next, the overall structure of the housing 302 will be described with reference to FIGS. FIGS. 3A to 3E are views showing the state of the housing 302 with the front cover 303 and the back cover 304 removed from the physical quantity detection device 300. FIG. 3A is a front view of the housing 302, and FIG. 2 is a rear view of the housing 302, FIG. 3-3 is a left side view of the housing 302, FIG. 3-4 is a right side view of the housing 302, and FIG. 3-5 is a sectional view taken along line AA in FIG. .

  The housing 302 has a structure in which the measuring unit 331 extends from the flange 311 toward the center of the main passage 124. A circuit board 400 is insert-molded on the base end side of the measurement unit 331. The circuit board 400 is arranged in parallel along the surface of the measurement unit 331 at an intermediate position between the front surface and the back surface of the measurement unit 331, and is molded integrally with the housing 302, and measures the proximal end side of the measurement unit 331. The portion 331 is partitioned into one side and the other side in the thickness direction.

  A circuit chamber Rc that houses the circuit portion of the circuit board 400 is formed on the front surface side of the measurement unit 331, and a sensor chamber Rs that houses the pressure sensor 421 and the humidity sensor 422 is formed on the back surface side. The circuit chamber Rc is sealed by attaching the front cover 303 to the housing 302 and is completely isolated from the outside. At that time, by filling the circuit chamber Rc with silicone to fill the circuit portion of the circuit board 400, the possibility of corrosion due to gas intrusion can be reduced. On the other hand, by attaching the back cover 304 to the housing 302, the second sub-passage 306 and the sensor chamber Rs, which is an indoor space communicating with the outside of the measuring unit 331 via the second sub-passage 306, are formed. A part of the circuit board 400 protrudes into the first sub-passage 305 from the partition wall 335 that partitions the circuit chamber Rc of the measurement unit 331 and the first sub-passage 305, and the measurement flow path surface of the protruding portion A flow rate detection unit 602 is provided at 430.

3.2 Structure of the sub-passage groove A sub-passage groove for forming the first sub-passage 305 is provided on the front end side of the measuring unit 331 in the length direction. The sub passage groove for forming the first sub passage 305 includes a front side sub passage groove 332 shown in FIG. 3A and a back side sub passage groove 334 shown in FIG. 3-2. As shown in FIG. 3A, the front side sub-passage groove 332 gradually moves toward the base of the measurement unit 331 as it moves from the first sub-passage outlet 305b opening in the downstream side outer wall 338 of the measurement unit 331 toward the upstream side outer wall 336. It curves to the flange 311 side, which is the end side, and communicates with an opening 333 that penetrates the measurement unit 331 in the thickness direction at a position near the upstream outer wall 336. The opening 333 is formed along the flow direction of the measurement target gas 30 in the main passage 124 so as to extend between the upstream outer wall 336 and the downstream outer wall 338.

  As shown in FIG. 3-2, the back side auxiliary passage groove 334 moves from the upstream side outer wall 336 toward the downstream side outer wall 338, and is divided into two branches at an intermediate position between the upstream side outer wall 336 and the downstream side outer wall 338. One side extends straight as a discharge passage and opens to the discharge port 305c of the downstream outer wall 338, and the other side is the flange 311 side, which is gradually the base end side of the measuring unit 331 as it moves to the downstream outer wall 338. And communicates with the opening 333 in the vicinity of the downstream outer wall 338.

  The back side auxiliary passage groove 334 forms an inlet groove into which the measured gas 30 flows from the main passage 124, and the front side auxiliary passage groove 332 is an outlet for returning the measured gas 30 taken in from the back side auxiliary passage groove 334 to the main passage 124. Grooves are formed. Since the front side sub-passage groove 332 and the back side sub-passage groove 334 are provided at the front end of the housing 302, the portion of the gas away from the inner wall surface of the main passage 124, in other words, the portion close to the central portion of the main passage 124 is provided. The flowing gas can be taken in as the measurement target gas 30. The gas flowing in the vicinity of the inner wall surface of the main passage 124 is affected by the wall surface temperature of the main passage 124 and often has a temperature different from the average temperature of the gas flowing through the main passage 124 such as the intake air 20. Further, the gas flowing in the vicinity of the inner wall surface of the main passage 124 often exhibits a flow rate that is slower than the average flow velocity of the gas flowing through the main passage 124. Since the physical quantity detection device 300 according to the embodiment is not easily affected by such influence, it is possible to suppress a decrease in measurement accuracy.

  As shown in FIG. 3B, a part of the measurement target gas 30 flowing through the main passage 124 is taken into the back side sub passage groove 334 from the first sub passage inlet 305 a and flows through the back side sub passage groove 334. The large foreign matter contained in the gas to be measured 30 flows into the discharge passage extending straight from the branch together with a part of the gas to be measured, and enters the main passage 124 from the discharge port 305c of the downstream outer wall 338. Discharged.

  The back side sub-passage groove 334 has a shape that becomes deeper as it advances, and the measurement target gas 30 gradually moves to the front side of the measurement unit 331 as it flows along the back side sub-passage groove 334. In particular, the back side sub-passage groove 334 is provided with a steeply inclined portion 334a that becomes deeper in front of the opening 333, and a part of the air having a small mass moves along the steeply inclined portion 334a. It flows on the measurement channel surface 430 side of the circuit board 400. On the other hand, a foreign substance having a large mass is difficult to change rapidly, and therefore flows on the measurement channel surface rear surface 431 side.

  As shown in FIG. 3A, the measurement target gas 30 that has moved to the front side through the opening 333 flows along the measurement flow path surface 430 of the circuit board, and the flow rate detection unit 602 provided on the measurement flow path surface 430. Heat is transferred between the two, and the flow rate is measured. Both air flowing from the opening 333 to the front side sub-passage groove 332 flows along the front side sub-passage groove 332, and is discharged to the main passage 124 from the first sub-passage outlet 305 b that opens to the downstream side outer wall 338.

  A substance having a large mass, such as dust, mixed in the measurement target gas 30 has a large inertial force, so that it rapidly advances in the deep direction of the groove along the surface of the steeply inclined portion 334a where the depth of the groove suddenly increases. It is difficult to change. For this reason, the foreign matter having a large mass moves toward the measurement channel surface rear surface 431, and the foreign matter can be prevented from passing near the flow rate detection unit 602. In this embodiment, since many foreign substances having a large mass other than gas pass through the measurement channel surface rear surface 431 which is the back surface of the measurement channel surface 430, they are caused by foreign matters such as oil, carbon, and dust. The influence of dirt can be reduced, and the decrease in measurement accuracy can be suppressed. That is, since it has a shape in which the path of the gas to be measured 30 is suddenly changed along an axis that crosses the flow axis of the main passage 124, the influence of foreign matter mixed in the gas to be measured 30 can be reduced.

3.3 Structure and Effect of Second Sub-passage and Sensor Chamber The second sub-passage 306 is parallel to the flange 311 so as to be along the main flow direction of the gas 30 to be measured flowing through the main passage 124. And the second sub-passage outlet 306b. The second auxiliary passage inlet 306a is formed by cutting out a part of the upstream outer wall 336, and the second auxiliary passage outlet 306b is formed by cutting out a part of the downstream outer wall 338. Specifically, as shown in FIG. 3C, at a position continuously along the upper surface of the partition wall 335, a part of the upstream outer wall 336 and a part of the downstream outer wall 338 are arranged from the back surface side of the measuring unit 331. Notched and formed. The second sub-passage inlet 306a and the second sub-passage outlet 306b are notched to a depth position that is flush with the back surface of the circuit board 400. The second sub-passage 306 functions as a cooling channel for cooling the substrate main body 401 because the measurement target gas 30 passes along the back surface of the substrate main body 401 of the circuit board 400. The circuit board 400 often has heat such as an LSI or a microcomputer, and the heat can be transferred to the back surface of the board body 401 and dissipated by the measured gas 30 passing through the second sub-passage 306.

  A sensor chamber Rs is provided on the proximal end side of the measurement unit 331 with respect to the second sub-passage 306. Part of the gas 30 to be measured that has flowed into the second sub-passage 306 from the second sub-passage inlet 306a flows into the sensor chamber Rs, and the pressure and relative humidity are respectively measured by the pressure sensor 421 and the humidity sensor 422 in the sensor chamber Rs. Detected. Since the sensor chamber Rs is retracted and disposed at a position shifted to the proximal end side of the measurement unit 331 with respect to the second sub-passage 306 extending along the main flow direction of the measurement target gas 30, the second sub-passage 306 is disposed. The influence of the dynamic pressure of the measurement target gas 30 passing through the passage 306 can be reduced. Therefore, the detection accuracy of the pressure sensor 421 in the sensor chamber Rs can be improved.

  Since the sensor chamber Rs is disposed on the proximal end side of the measurement unit 331 with respect to the second sub-passage 306, for example, when the distal end side of the measurement unit 331 is attached to the intake passage in a posture state toward the lower side, It is possible to suppress fouling substances and water droplets flowing into the second sub-passage 306 together with the gas to be measured 30 from adhering to the pressure sensor 421 and the humidity sensor 422 disposed downstream thereof.

  In particular, in the present embodiment, in the sensor chamber Rs, the pressure sensor 421 having a relatively large outer shape is disposed on the upstream side, and the humidity sensor 422 having a relatively small outer shape is disposed on the downstream side of the pressure sensor 421. The contaminants and water droplets that flow along with the measurement target gas 30 adhere to the pressure sensor 421 and the adhesion to the humidity sensor 422 is suppressed. Therefore, it is possible to protect the humidity sensor 422 that has low resistance to dirt and water droplets.

  The pressure sensor 421 and the humidity sensor 422 are less affected by the flow of the gas to be measured 30 than the flow rate detection unit 602. In particular, the humidity sensor 422 only needs to ensure the diffusion level of moisture in the gas to be measured 30. It can be provided in the sensor chamber Rs adjacent to the straight second sub-passage 306. On the other hand, the flow rate detection unit 602 requires a flow rate of a certain level or more, needs to keep away dust and dirt, and needs to consider the influence on pulsation. Therefore, the flow rate detection unit 602 is provided in the first sub-passage 305 having a shape that circulates in a loop shape.

FIGS. 4-1 and FIGS. 4-2 are figures which show the other form of a 2nd subchannel | path.
In this embodiment, instead of cutting out the upstream side outer wall 336 and the downstream side outer wall 338, through holes 337 are provided in the upstream side outer wall 336 and the downstream side outer wall 338, so that the second sub passage inlet 306a and the second sub passage outlet 306b are provided. Is forming. As in the second sub-passage shown in FIGS. 3-2 to 3-5 described above, the upstream outer wall 336 and the downstream outer wall 338 are cut away to form the second sub-passage inlet 306a and the second sub-passage outlet 306b. Then, since the width of the upstream outer wall 336 and the width of the downstream outer wall 338 are locally narrow at this position, the measurement unit 331 is substantially omitted from the notch due to heat sinks at the time of molding. There is a risk of distortion. According to this embodiment, since the through-hole is provided instead of the notch, the measuring unit 331 can be prevented from being bent into a generally U shape. Therefore, it is possible to prevent the detection accuracy from being affected by the change in the position and orientation of the detection unit with respect to the measurement target gas 30 due to distortion in the housing 302, and it is possible to always ensure a constant detection accuracy without individual differences.

3.4 Shape and Effect of Table Cover 303 and Back Cover 304 FIG. 5 is a view showing the appearance of the table cover 303, FIG. 5 (a) is a front view, and FIG. 5 (b) is a diagram of FIG. It is AA sectional view. 6A and 6B are views showing the appearance of the back cover 304. FIG. 6A is a front view, and FIG. 6B is a cross-sectional view taken along the line BB in FIG.

  5 and 6, the front cover 303 and the back cover 304 make up the first sub-passage 305 by closing the front-side sub-passage groove 332 and the back-side sub-passage groove 334 of the housing 302. The front cover 303 forms a sealed circuit chamber Rc, and the back cover 304 closes the recess on the back side of the measuring unit 331 and communicates with the second sub-passage 306 and the second sub-passage 306. make.

  The front cover 303 includes a protrusion 356 at a position facing the flow rate detection unit 602, and is used to make a restriction between the measurement flow path surface 430 and the front cover 303. For this reason, it is desirable that the molding accuracy be high. Since the front cover 303 and the back cover 304 are made by a resin molding process in which a thermoplastic resin is injected into a mold, the front cover 303 and the back cover 304 can be made with high molding accuracy.

  The front cover 303 and the back cover 304 are provided with a plurality of fixing holes 351 into which a plurality of fixing pins 350 protruding from the measuring unit 331 are respectively inserted. The front cover 303 and the back cover 304 are respectively attached to the front surface and the back surface of the measuring unit 331. At that time, the fixing pins 350 are inserted into the fixing holes 351 and positioned. And it joins by the laser welding etc. along the edge of the front side subchannel groove 332 and the back side subchannel groove 334, and similarly, it joins by the laser welding etc. along the edge of the circuit chamber Rc and the sensor chamber Rs.

3.5 Fixing Structure and Effect of Circuit Board 400 by Housing 302 Next, fixing of the circuit board 400 to the housing 302 by a resin molding process will be described. The flow rate detection unit 602 of the circuit board 400 is provided at a predetermined position of the sub-passage groove for forming the sub-passage, for example, in the present embodiment, the opening 333 that is a connecting portion between the front-side sub-passage groove 332 and the back-side sub-passage groove 334. The circuit board 400 is molded integrally with the housing 302 so as to be disposed.

  The measurement part 331 of the housing 302 is provided with fixing parts 372 and 373 that are fixed by embedding the outer peripheral edge of the base part 402 of the circuit board 400 in the housing 302 with a resin mold. The fixing portions 372 and 373 include and fix the outer peripheral edge portion of the base portion 402 of the circuit board 400 so as to be sandwiched from the front side and the back side.

  The housing 302 is manufactured by a resin molding process. In this resin molding process, the circuit board 400 is built in the resin of the housing 302 and fixed in the housing 302 by the resin mold. In this way, the flow rate detection unit 602 performs heat transfer with the measurement target gas 30 to measure the flow rate, for example, the shape of the front side passage groove 332 and the back side passage groove 334. The positional relationship and the directional relationship, which are relationships, can be maintained with extremely high accuracy, and errors and variations occurring in each circuit board 400 can be suppressed to a very small value. As a result, the measurement accuracy of the circuit board 400 can be greatly improved. For example, the measurement accuracy can be dramatically improved as compared with a conventional method of fixing using an adhesive.

  The physical quantity detection device 300 is often produced by mass production, and the method of adhering with an adhesive while strictly measuring each is limited in terms of improving measurement accuracy. However, variation in measurement accuracy can be greatly reduced by fixing the circuit board 400 at the same time as the sub-passage is molded in the resin molding process for molding the sub-passage through which the gas 30 to be measured flows as in this embodiment. The measurement accuracy of each physical quantity detection device 300 can be greatly improved.

  For example, in the embodiment shown in FIGS. 3-1 to 3-5, the relationship between the front side sub-passage groove 332, the back side sub-passage groove 334, and the flow rate detection unit 602 is high so as to be a prescribed relationship. The circuit board 400 can be fixed to the housing 302 with accuracy. In this way, in the physical quantity detection device 300 that is mass-produced, the positional relationship and shape of the flow rate detection unit 602 of each circuit board 400 and the first sub-passage 305 can be constantly obtained with very high accuracy. Is possible.

  The first sub-passage 305 in which the flow rate detection unit 602 of the circuit board 400 is fixedly arranged can be formed with, for example, a front-side sub-passage groove 332 and a back-side sub-passage groove 334 with very high accuracy. The operation of forming the first sub-passage 305 from 334 is an operation of covering both surfaces of the housing 302 with the front cover 303 and the back cover 304. This work is very simple and is a work process with few factors that reduce the measurement accuracy. The front cover 303 and the back cover 304 are produced by a resin molding process with high molding accuracy. Therefore, it is possible to complete the sub-passage provided in a prescribed relationship with the flow rate detection unit 602 of the circuit board 400 with high accuracy. By such a method, in addition to improvement of measurement accuracy, high productivity can be obtained.

  On the other hand, in the past, a thermal flow meter was produced by manufacturing a sub-passage and then adhering a measuring unit to the sub-passage with an adhesive. As described above, the method of using the adhesive has a large variation in the thickness of the adhesive, and the bonding position and the bonding angle vary from product to product. For this reason, there was a limit to increasing the measurement accuracy. Furthermore, when performing these operations in a mass production process, it is very difficult to improve measurement accuracy.

  In the embodiment according to the present invention, the circuit board 400 is integrally fixed to the housing 302 by a resin mold, and at the same time, a sub-passage groove for forming the first sub-passage 305 is formed by the resin mold. By doing so, the flow rate detection unit 602 can be fixed to the shape of the auxiliary passage groove and the auxiliary passage groove with extremely high accuracy.

  A part related to the measurement of the flow rate, for example, the flow path surface 430 for measurement to which the flow rate detection unit 602 and the flow rate detection unit 602 are attached is provided on the surface of the circuit board 400. The flow rate detector 602 and the measurement flow path surface 430 are exposed from the resin for molding the housing 302. That is, the flow rate detector 602 and the measurement flow path surface 430 are not covered with the resin for molding the housing 302. The flow rate detection unit 602 and the measurement flow path surface 430 of the circuit board 400 are used as they are after resin molding of the housing 302 as they are, and are used for flow rate measurement of the physical quantity detection device 300. By doing so, the measurement accuracy is improved.

  In the embodiment according to the present invention, since the circuit board 400 is fixed to the housing 302 having the first sub-passage 305 by integrally forming the circuit board 400 in the housing 302, the circuit board 400 is securely attached to the housing 302. Can be fixed. In particular, since the projecting portion 403 of the circuit board 400 penetrates the partition wall 335 and projects into the first sub-passage 305, the sealing performance between the first sub-passage 305 and the circuit chamber Rc is high. Further, it is possible to prevent the measurement target gas 30 from leaking from the first sub-passage 305 into the circuit chamber Rc, and to prevent the circuit components, wirings, and the like of the circuit board 400 from being in contact with the measurement target gas 30 and being corroded.

4. Appearance of Circuit Board 400 4.1 Formation of Measurement Channel Surface 430 Comprising Flow Rate Detection Unit 602 FIGS. 7-1 to 7-3 show the appearance of the circuit board 400. FIG. The hatched portions described on the external appearance of the circuit board 400 indicate the fixing part 432 and the fixing part 434 to which the circuit board 400 is covered and fixed when the housing 302 is molded in the resin molding process.

  FIG. 7-1 is a front view of the circuit board, FIG. 7-2 is a right side view of the circuit board, and FIG. 7-3 is a rear view of the circuit board.

  The circuit board 400 has a board body 401. Circuit conductors (not shown) are provided on the front and back surfaces of the substrate body 401, and an insulating film (solder resist) 800 is formed thereon (see FIG. 9). The insulating film 800 is for circuit protection and prevention of adhesion of solder to unnecessary portions. For example, the insulating film 800 is provided by applying an insulating paint or ink to the outer surface of the substrate body and drying it.

  The circuit board 400 includes a circuit unit and a flow rate detection unit 602 that is a sensing element on the surface of the substrate body 401, and pressure sensors 421 </ b> A and 421 </ b> B and humidity sensors 422 that are sensing elements on the back surface of the substrate body 401. . The substrate body 401 is made of a material made of glass epoxy resin, and has a value approximate to the thermal expansion coefficient of the material made of thermoplastic resin forming the housing 302 compared to the substrate made of ceramic material. Yes. Therefore, when the circuit board 400 is insert-molded in the housing 302, the stress due to the difference in thermal expansion coefficient can be reduced, and the distortion of the circuit board 400 can be reduced.

  The substrate body 401 has a flat plate shape having a certain thickness, and has a substantially rectangular base portion 402 and a substantially rectangular protruding portion 403 that protrudes from one side of the base portion 402 and is slightly smaller than the base portion 402. And has a substantially T shape in plan view. A circuit portion is provided on the surface of the base portion 402. The circuit unit is configured by mounting electronic components such as an LSI 414, a microcomputer 415, a power supply regulator 416, and a chip component 417 such as a resistor and a capacitor on a circuit conductor (not shown). Since the power regulator 416 generates a larger amount of heat than other electronic components such as the microcomputer 415 and the LSI 414, the power regulator 416 is disposed relatively upstream in the circuit room Rc. The LSI 414 is entirely sealed with a synthetic resin material 419 so as to include a gold wire, thereby improving the handleability of the circuit board 400 during insert molding.

  A concave portion 402 a into which the LSI 414 is inserted is provided on the surface of the substrate body 401. The recess 402a can be formed by subjecting the substrate body 401 to laser processing. The substrate body 401 made of glass epoxy resin is easier to process than the substrate body made of ceramic, and the recess 402a can be easily provided. The recess 402 a has a depth such that the surface of the LSI 414 is flush with the surface of the substrate body 401. Thus, by making the surface of the LSI 414 and the surface of the substrate body 401 coincide with each other, wire bonding for connecting the LSI 414 and the substrate body 401 with a gold wire becomes easy, and the circuit board 400 can be easily manufactured. Become.

  The protrusion 403 is disposed in the first sub-passage 305 when the circuit board 400 is insert-molded into the housing 302, and the measurement flow path surface 430 that is the surface of the protrusion 403 is along the flow direction of the measurement target gas 30. Extend. A flow rate detector 602 is provided on the measurement channel surface 430 of the protrusion 403. The flow rate detector 602 performs heat transfer with the gas to be measured 30, measures the state of the gas to be measured 30, for example, the flow velocity of the gas to be measured 30, and outputs an electrical signal representing the flow rate through the main passage 124. In order for the flow rate detection unit 602 to measure the state of the measurement target gas 30 with high accuracy, it is desirable that the gas flowing in the vicinity of the measurement channel surface 430 is laminar and has little turbulence. For this reason, it is desirable that the surface of the flow rate detection unit 602 and the surface of the measurement channel surface 430 are flush with each other, or the difference is equal to or less than a predetermined value.

  A concave portion 403a is formed on the surface of the measurement flow path surface 430, and a flow rate detector 602 is fitted therein. This recess 403a can also be formed by laser processing. The recess 403a has a depth such that the surface of the flow rate detector 602 is flush with the surface of the measurement channel surface 430. The flow rate detection unit 602 and its wiring part are covered with a synthetic resin material 418 to prevent electrolytic corrosion due to adhesion of salt water.

  Two pressure sensors 421A and 421B and one humidity sensor 422 are provided on the back surface of the substrate body 401. The two pressure sensors 421A and 421B are divided into an upstream side and a downstream side and arranged in a line. A humidity sensor 422 is disposed downstream of the pressure sensor 421B. These two pressure sensors 421A and 421B and one humidity sensor 422 are arranged in the sensor chamber Rs.

  In the circuit board 400, the second sub-passage 306 is disposed on the back side of the board body 401. Therefore, the entire substrate body 401 can be cooled by the measurement target gas 30 passing through the second sub-passage 306.

4.2 Structure of Temperature Detection Unit 451 A temperature detection unit 451 is provided at the end on the upstream side of the base unit 402 and at the corner on the protrusion 403 side. The temperature detection unit 451 constitutes one of detection units for detecting a physical quantity of the measurement target gas 30 flowing through the main passage 124, and is provided on the circuit board 400. The circuit board 400 has a protrusion 450 that protrudes from the second sub-passage inlet 306a of the second sub-passage 306 toward the upstream side of the gas to be measured 30, and the temperature detection part 451 is the protrusion 450 and the circuit. A chip-type temperature sensor 453 provided on the back surface of the substrate 400 is provided. The temperature sensor 453 and the wiring portion thereof are covered with a synthetic resin material, which prevents electrolytic corrosion from occurring due to adhesion of salt water.

  For example, as shown in FIG. 3-2, in the central portion of the measurement unit 331 where the second sub-passage entrance 306 a is provided, the upstream outer wall 336 in the measurement unit 331 constituting the housing 302 is recessed toward the downstream side. The projecting portion 450 of the circuit board 400 projects from the recess-shaped upstream outer wall 336 toward the upstream side. The tip of the protrusion 450 is disposed at a position recessed from the most upstream surface of the upstream outer wall 336. The temperature detection part 451 is provided in the protrusion part 450 so that the back surface of the circuit board 400, ie, the 2nd sub channel | path 306 side, may be faced.

  Since the second sub-passage inlet 306a is formed on the downstream side of the temperature detection unit 451, the gas to be measured 30 flowing into the second sub-passage 306 from the second sub-passage entrance 306a contacts the temperature detection unit 451. Then, the temperature is detected when it flows into the second sub-passage inlet 306a and contacts the temperature detector 451. The gas 30 to be measured that has contacted the temperature detector 451 flows directly from the second sub-passage inlet 306a into the second sub-passage 306, passes through the second sub-passage 306, and is discharged from the second sub-passage outlet 306b to the main passage 124. Is done.

4.3 Fixing of Circuit Board 400 by Resin Molding Process and Its Effect The hatched portions in FIGS. 7-1 and 7-3 are the resin molding process in order to fix the circuit board 400 to the housing 302 in the resin molding process. The fixing part 432 and the fixing part 434 for covering the circuit board 400 with the thermoplastic resin used in FIG. It is important that the relationship between the measurement flow path surface 430 and the flow rate detection unit 602 provided on the measurement flow path surface 430 and the shape of the sub-passage is maintained with high accuracy so as to be a prescribed relationship.

  In the resin molding process, the circuit board 400 is fixed to the housing 302 that simultaneously molds the sub-passage, and at the same time, the relationship between the sub-passage, the measurement flow path surface 430, and the flow rate detection unit 602 is extremely accurate. Can be maintained. That is, since the circuit board 400 is fixed to the housing 302 in the resin molding process, the circuit board 400 can be positioned and fixed with high accuracy in a mold for forming the housing 302 having the sub-passage. Become. By injecting a high-temperature thermoplastic resin into the mold, the sub-passage is molded with high accuracy, and the circuit board 400 is fixed with high accuracy. Therefore, it is possible to suppress errors and variations occurring in each circuit board 400 to very small values. As a result, the measurement accuracy of the circuit board 400 can be greatly improved.

5. Circuit Configuration of Physical Quantity Detection Device 300 FIG. 8-1 is a circuit diagram of the physical quantity detection device 300. The physical quantity detection device 300 includes a flow rate detection circuit 601 and a temperature / humidity detection circuit 701.

  The flow rate detection circuit 601 includes a flow rate detection unit 602 having a heating element 608 and a processing unit 604. The processing unit 604 controls the amount of heat generated by the heating element 608 of the flow rate detection unit 602 and outputs a signal representing the flow rate to the microcomputer 415 via the terminal 662 based on the output of the flow rate detection unit 602. In order to perform the processing, the processing unit 604 includes a central processing unit (hereinafter referred to as a CPU) 612, an input circuit 614, an output circuit 616, a memory 618 that holds data representing a relationship between a correction value, a measured value, and a flow rate, A power supply circuit 622 is provided to supply a constant voltage to each necessary circuit. The power supply circuit 622 is supplied with DC power from an external power source such as an in-vehicle battery via a terminal 664 and a ground terminal (not shown).

  The flow rate detector 602 is provided with a heating element 608 for heating the measurement target gas 30. The voltage V1 is supplied from the power supply circuit 622 to the collector of the transistor 606 constituting the current supply circuit of the heating element 608, and a control signal is applied from the CPU 612 to the base of the transistor 606 via the output circuit 616. Accordingly, a current is supplied from the transistor 606 to the heating element 608 through the terminal 624. The amount of current supplied to the heating element 608 is controlled by a control signal applied from the CPU 612 to the transistor 606 constituting the current supply circuit of the heating element 608 via the output circuit 616. The processing unit 604 controls the amount of heat generated by the heating element 608 so that the temperature of the measurement target gas 30 is higher than the initial temperature by a predetermined temperature, for example, 100 ° C., when heated by the heating element 608.

  The flow rate detection unit 602 includes a heat generation control bridge 640 for controlling the amount of heat generated by the heating element 608 and a flow rate detection bridge 650 for measuring the flow rate. One end of the heat generation control bridge 640 is supplied with a constant voltage V3 from the power supply circuit 622 via a terminal 626, and the other end of the heat generation control bridge 640 is connected to the ground terminal 630. A constant voltage V2 is supplied from one end of the flow rate detection bridge 650 from the power supply circuit 622 via a terminal 625, and the other end of the flow rate detection bridge 650 is connected to the ground terminal 630.

  The heat generation control bridge 640 includes a resistor 642 that is a resistance temperature detector whose resistance value changes based on the temperature of the heated measurement target gas 30. The resistor 642, the resistor 644, the resistor 646, and the resistor 648 are bridges. The circuit is configured. The potential difference between the intersection A of the resistor 642 and the resistor 646 and the potential B at the intersection B of the resistor 644 and 648 is input to the input circuit 614 via the terminal 627 and the terminal 628, and the CPU 612 has a predetermined potential difference between the intersection A and the intersection B. In this embodiment, the amount of heat generated by the heating element 608 is controlled by controlling the current supplied from the transistor 606 so as to be zero volts. The flow rate detection circuit 601 illustrated in FIG. 8A heats the measurement target gas 30 with the heating element 608 so as to be higher than the original temperature of the measurement target gas 30 by a constant temperature, for example, 100 ° C. at all times. In order to perform this heating control with high accuracy, when the temperature of the gas 30 to be measured heated by the heating element 608 becomes a constant temperature, for example, 100 ° C., always higher than the initial temperature, the intersection A and the intersection A The resistance value of each resistor constituting the heat generation control bridge 640 is set so that the potential difference between B becomes zero volts. Therefore, in the flow rate detection circuit 601, the CPU 612 controls the supply current to the heating element 608 so that the potential difference between the intersection A and the intersection B becomes zero volts.

  The flow rate detection bridge 650 includes four resistance temperature detectors, a resistor 652, a resistor 654, a resistor 656, and a resistor 658. These four resistance temperature detectors are arranged along the flow of the gas to be measured 30, and the resistor 652 and the resistor 654 are arranged upstream of the heating element 608 in the flow path of the gas to be measured 30, and the resistor 656. And the resistor 658 are arranged on the downstream side in the flow path of the measurement target gas 30 with respect to the heating element 608. In order to increase the measurement accuracy, the resistor 652 and the resistor 654 are arranged so that the distance to the heating element 608 is substantially the same, and the resistor 656 and the resistor 658 are substantially the same distance to the heating element 608. Has been placed.

  A potential difference between an intersection C of the resistor 652 and the resistor 656 and an intersection D of the resistor 654 and the resistor 658 is input to the input circuit 614 through the terminal 631 and the terminal 632. In order to improve the measurement accuracy, for example, each resistance of the flow rate detection bridge 650 is set so that the potential difference between the intersection C and the intersection D becomes zero when the flow of the measurement target gas 30 is zero. Therefore, when the potential difference between the intersection point C and the intersection point D is, for example, zero volts, the CPU 612 generates an electric signal indicating that the flow rate of the main passage 124 is zero based on the measurement result that the flow rate of the measurement target gas 30 is zero. Output from the terminal 662.

  When the gas 30 to be measured flows in the direction of the arrow in FIG. 8A, the resistor 652 and the resistor 654 arranged on the upstream side are cooled by the gas 30 to be measured and arranged downstream of the gas 30 to be measured. The resistor 656 and the resistor 658 are heated by the measurement target gas 30 heated by the heating element 608, and the temperatures of the resistors 656 and 658 are increased. Therefore, a potential difference is generated between the intersection C and the intersection D of the flow rate detection bridge 650, and this potential difference is input to the input circuit 614 via the terminal 631 and the terminal 632. The CPU 612 retrieves data representing the relationship between the potential difference stored in the memory 618 and the flow rate of the main passage 124 based on the potential difference between the intersection C and the intersection D of the flow rate detection bridge 650, and Find the flow rate. An electrical signal representing the flow rate of the main passage 124 obtained in this way is output via the terminal 662. Note that the terminal 664 and the terminal 662 shown in FIG. 8A are newly described with reference numerals, but are included in the connection terminal 412 shown in FIG.

  The memory 618 stores data representing the relationship between the potential difference between the intersection C and the intersection D and the flow rate of the main passage 124, and is obtained based on the actual measured value of gas after the circuit board 400 is produced. In addition, correction data for reducing measurement errors such as variations is stored.

  The temperature / humidity detection circuit 701 holds an input circuit such as an amplifier / A / D for inputting detection signals from the temperature sensor 453 and the humidity sensor 422, an output circuit, and data representing a relationship between a correction value, temperature, and absolute humidity. And a power supply circuit 622 for supplying a certain voltage to necessary circuits. Signals output from the flow rate detection circuit 601 and the temperature / humidity detection circuit 701 are input to the microcomputer 415. The microcomputer 415 has a flow rate calculation unit, a temperature calculation unit, and an absolute humidity calculation unit, calculates a flow rate, a temperature, and an absolute humidity, which are physical quantities of the gas 30 to be measured, based on the signal. Output.

  The physical quantity detection device 300 and the control device 200 are connected by a communication cable, and communication using digital signals is performed according to a communication standard such as SENT, LIN, or CAN. In this embodiment, a signal is input from the microcomputer 415 to the LIN driver 420, and LIN communication is performed from the LIN driver 420. Information output from the LIN driver of the physical quantity detection device 300 to the control device 200 is superimposed and output by digital communication using a single or two-wire communication cable.

  The absolute humidity calculation unit of the microcomputer 415 calculates the absolute humidity based on the relative humidity information and temperature information output from the humidity sensor 422, and performs a process of correcting the absolute humidity based on the error. The corrected absolute humidity calculated by the absolute humidity calculation unit is used by the control unit of the control device 200 for various engine operation controls. Further, the control device 200 can directly use the information on the total error for various engine operation controls.

  In the above-described embodiment illustrated in FIG. 8A, the case where the physical quantity detection device 300 includes the LIN driver 420 and performs LIN communication has been described. However, the present invention is not limited to this, and FIG. As shown in FIG. 2, communication may be performed directly with the microcomputer 415 without using LIN communication.

6). Structure of Circuit Board 400 [Example 1]
FIG. 9 is a diagram illustrating the configuration of the housing and the circuit board in the first embodiment, and FIG. 10 is a cross-sectional view of the housing and the circuit board in the first embodiment. 9 illustrates the sensor chamber Rs of the housing 302, and FIG. 10 also illustrates a mold 901 when the circuit board is insert-molded into the housing 302.

  The circuit board 400 is built in the housing 302 by insert molding, and is resin-molded and fixed in the housing 302. The circuit board 400 includes a fixing portion 434 fixed to the housing 302, a pressing portion to which a mold 901 for forming the housing 302 is pressed, a conductor arrangement portion in which a circuit conductor is arranged, a fixing portion and a pressing portion. A boundary portion formed between at least one of the portions and the conductor placement portion.

  In the present embodiment, the fixing portion 434 is provided along the outer peripheral edge portion of the base portion 402 of the substrate body 401. The pressing portion is set along the fixed portion 373 and the partition wall 335 of the housing 302 at a position exposed in the sensor chamber Rs of the housing 302. The conductor arrangement portion has a rectangular shape that is slightly smaller than the base portion 402, and is disposed in the center of the base portion 402 and surrounded by the pressing portion. A circuit conductor wiring pattern is arranged in the conductor arrangement portion. The boundary portion is continuously arranged with a constant width along the outline of the base portion 402 so as to form a square frame surrounding the entire circuit conductor wiring pattern from the outside.

  The circuit board 400 is provided with an insulating film 800 on the front surface and the back surface, which are the outer surfaces of the substrate body 401. The insulating film 800 includes, on the back surface of the substrate body 401, a first region 801 disposed in the fixing portions 432 and 434, a second region 802 disposed in the pressing portion, and a first region disposed in the conductor placement portion. 3 region 803 and a fourth region 804 arranged at the boundary. The insulating film 800 has a different film thickness between the first region 801 and the second region 802 and the fourth region 804.

  In the present embodiment, the fourth region 804 is arranged so as to match the shape of the boundary portion of the circuit board 400. A concave groove 811 is formed in the insulating film 800 so as to coincide with the fourth region 804, and the film thickness of the fourth region 804 is the first region 801, the second region 802, and the third region. It is thinner than each film thickness of 803. For example, the thickness of the fourth region 804 is preferably less than or equal to two-thirds of the thickness of each of the first region 801, the second region 802, and the third region 803, and more preferably less than or equal to one-half. .

  The concave groove 811 can be formed using a known method such as masking or laser. For example, in the case of masking, an insulating paint is applied to the entire outer surface of the substrate body 401 to form a lower layer to form a lower layer, and after drying, the fourth region 804 is masked to form an upper layer. A concave groove 811 can be formed by applying an insulating coating material to form an upper layer and removing masking. In the case of a laser, an insulating paint is applied to the entire outer surface of the substrate body 401 so as to have a constant film thickness to form an insulating film 800, and a laser is applied to a portion where the fourth region 804 of the insulating film 800 is formed. The groove 811 can be formed by irradiating and cutting.

  In order to fix the circuit board 400 in the housing 302 with a resin mold, as shown in FIG. 10, a mold 901 for molding the housing 302 is brought into contact with the insulating film 800 of the circuit board 400, or no resin leaks. It is necessary to manage the gap. Depending on the thickness variation of the inserted circuit board 400 and the setting variation on the mold 901, the amount of pressing of the mold 901 may increase, and there is a possibility that a large stress is applied to the circuit board 400. In this case, a crack may be generated in the second region 802 that is the mold contact portion of the insulating film 800, and the crack may reach the third region 803 that is a portion that protects the circuit conductor.

  Moreover, since the housing 302 is a mold resin, warpage and sink marks are generated by cooling after molding. When stress is applied to the circuit board 400 from the fixing portions 372 and 373 due to warping or sinking of the mold resin, cracks generated in the first region 801 or the second region 802 of the insulating film 800 develop, and the third It is possible to reach the region 803 of When the crack of the insulating film 800 reaches the third region 803 that is the circuit conductor protection portion, the risk of corrosion of the circuit conductor increases.

  On the other hand, in this embodiment, the first region 801 and the fourth region 804 between the second region 802 and the third region 803 are compared to the first region 801 and the second region 802. In addition, a concave groove 811 is provided which is a portion having a thin film thickness. When a crack reaches a part where the film thickness changes from a part where the film thickness changes due to the progress of the crack, the progress of the crack stops at this position. Therefore, damage such as cracks generated in the first region 801 or the second region 802 is blocked by the concave groove 811 in the fourth region 804 to prevent the damage from propagating to the third region 803. be able to. Therefore, the corrosion risk of the circuit conductor of the circuit board 400 can be reduced, and the reliability as a product can be improved.

  In this embodiment, the case where the groove 811 of the fourth region 804 is arranged between the first region 801 and the second region 802 and the third region 803 has been described as an example. However, the present invention is not limited to both the first region 801 and the second region 802. For example, the first region 801 and the second region 802 may be arranged between at least one of the first region 801 and the second region 802, and the third region 803. Alternatively, damage such as cracks generated in the second region 802 can be blocked by the concave groove 811 in the fourth region 804, thereby preventing damage from propagating to the third region 803. Has a working effect.

[Example 2]
FIG. 11 is a cross-sectional view of the housing and the circuit board in the second embodiment.
A characteristic feature of this embodiment is that a slit 812 is provided in the fourth region 804 of the insulating film 800. The slit 812 is provided so as to coincide with the fourth region 804. In the slit 812, the thickness of the insulating film 800 is 0, and the outer surface of the substrate body 401 is exposed. A circuit conductor is not disposed at a position where the slit 812 is provided on the surface of the substrate body 401. The slit 812 can be formed, for example, by masking a portion to be the fourth region 804, applying an insulating paint to the entire outer surface of the substrate body 401, and removing the masking after the application. Further, after applying the insulating paint to the substrate body 401 to mask the fourth region 804 and exposing and curing it, the slit 812 may be formed by washing away the uncured portion with a developing solution or by screen printing. Good.

  In the present embodiment, since the slit 812 having a film thickness of 0 is provided in the fourth region 804 of the insulating film 800, the first region is caused by, for example, pressing of the mold 901 or distortion due to thermal contraction of the housing 302. When a crack occurs in the region 801 or the second region 802, the progress of the crack can be blocked by the slit 812 in the fourth region 804, and the crack can be prevented from progressing to the third region 803. Can do. Therefore, it is possible to effectively prevent the circuit conductor of the circuit board 400 from being corroded by water or oil entering from the cracked portion.

[Example 3]
FIG. 12 is a cross-sectional view of the housing and the circuit board in the third embodiment.
In this embodiment, the conductor 425 is provided so as to match the shape of the boundary portion on the back surface of the circuit board 400. The insulating film 800 is formed so that the entire back surface of the substrate body 401 including the conductor 425 is substantially flat. Therefore, the fourth region 804 of the insulating film 800 is provided over the conductor 425.

  The conductor 425 is provided so as to surround the entire wiring pattern of the circuit conductor from the outside, and is not electrically connected to the circuit conductor of the circuit board 400 and does not constitute a circuit. When the insulating film 800 is formed on the outer surface of the substrate body 401, the fourth region 804 of the insulating film 800 has the first region 801, the second region 802, and the third region corresponding to the thickness of the conductor 425. The thickness of the insulating film 800 is smaller than that of any of the regions 803. Therefore, the insulating film 800 is formed with a thin film portion having a small thickness in the fourth region 804.

  Therefore, when a crack occurs in the first region 801 or the second region 802 due to the pressing of the mold 901 or the distortion corresponding to the heat shrinkage of the housing 302, the crack is generated in the thin film portion of the fourth region 804. The dam can be stopped and cracks can be prevented from progressing to the third region 803. Therefore, it is possible to effectively prevent water, oil, and the like from entering from the cracked portion and corrode the circuit conductor of the circuit board 400, thereby improving the reliability of the product. Since the conductor 425 does not form a circuit, even if a crack occurs in the insulating film 800 near the conductor 425 and the conductor 425 is corroded, the reliability as a product is not affected. Further, according to the present embodiment, the conductor 425 can be formed simultaneously with the circuit conductor of the circuit board 40, and can be easily manufactured.

[Example 4]
FIG. 13 is a cross-sectional view of the housing and the circuit board in the fourth embodiment.
In this embodiment, the substrate body 401 has a configuration in which a concave groove 404 is provided along the boundary portion. The concave groove 404 can be formed, for example, by partially shaving the back surface of the circuit board 400 by known laser processing. When the insulating film 800 is formed on the outer surface of the substrate body 401, the thickness of the insulating film 800 is increased in the fourth region 804 by the depth of the concave groove 404 of the circuit board 400. Therefore, the insulating film 800 is formed with a thick film portion in the fourth region 804 that is thicker than any of the first region 801, the second region 802, and the third region 803.

  Therefore, when a crack occurs in the first region 801 or the second region 802 due to the pressing of the mold 901 or the distortion corresponding to the thermal contraction of the housing 302, the thick region of the fourth region 804 is aligned. Thus, the crack can be stretched to block the crack, and the crack can be prevented from progressing to the third region 803. Therefore, it is possible to effectively prevent water, oil, and the like from entering from the cracked portion and corrode the circuit conductor of the circuit board 400, thereby improving the reliability of the product.

[Example 5]
FIG. 14 is a diagram illustrating the configuration of the housing and the circuit board 400 according to the fifth embodiment.
In this embodiment, the fourth region 804 of the insulating film 800 is partially cut off. In the first embodiment, the fourth region 804 is arranged so as to continuously form a square frame with a constant width along the outline of the base portion 402 so as to match the shape of the boundary portion of the circuit board 400. A concave groove 811 is formed so as to match the shape of the fourth region 804.

  On the other hand, in this embodiment, the insulating film 800 has a fifth region 805 at a location where the fourth region 804 is partially interrupted. The fifth region 805 is not formed with the concave groove 811, and is continuous and flush with the first region 801, the second region 802, and the third region 803. The concave groove 811 does not need to be provided over the entire circumference along the outline of the base portion 402 as in the first embodiment, and may be provided only in a portion of the insulating film 800 where it is necessary to prevent the progress of cracks. . Therefore, for example, a portion where no circuit conductor is present in the vicinity may be configured as the fifth region 805 in which the concave groove 811 is not formed.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various designs can be made without departing from the spirit of the present invention described in the claims. It can be changed. For example, the above-described embodiment has been described in detail for easy understanding of the present invention, and is not necessarily limited to one having all the configurations described. Further, a part of the configuration of an embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of an embodiment. Furthermore, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

30 Measurement target gas 124 Main passage 300 Physical quantity detection device 302 Housing 400 Circuit board 401 Substrate body 404 Concave groove 425 Conductor 434 Fixing portion 800 Insulating film 801 First region 802 Second region 803 Third region 804 Fourth region 805 Fifth region 811 Concave groove 812 Slit 901 Mold

Claims (9)

A physical quantity detection device having a circuit board in which an insulating film is formed on the outer surface of a board body, and a housing in which the circuit board is insert-molded,
The circuit board includes a fixing part fixed to the housing, a pressing part against which a mold for molding the housing is pressed, a conductor arranging part in which a circuit conductor is arranged, the fixing part and the pressing part. A boundary portion formed between at least one of the portions and the conductor arrangement portion,
The insulating film includes a first region disposed in the fixing portion, a second region disposed in the pressing portion, a third region disposed in the conductor placement portion, and the boundary portion. A physical quantity detection device comprising: a fourth region, wherein the first region, the second region, and the fourth region have different film thicknesses.   2. The physical quantity detection device according to claim 1, wherein the insulating film has a thickness of the fourth region that is smaller than a thickness of each of the first region and the second region.   The physical quantity detection device according to claim 2, wherein the insulating film is provided with a concave groove in the fourth region.   The physical quantity detection device according to claim 2, wherein a conductor is provided at the boundary portion of the circuit board, and the fourth region is formed on the conductor.   The physical quantity detection device according to claim 4, wherein the conductor is disposed at a position surrounding the entire wiring pattern of the circuit conductor from the outside.   The physical quantity detection device according to claim 1, wherein the insulating film is provided with a slit that exposes an outer surface of the substrate body in the fourth region.   2. The physical quantity detection device according to claim 1, wherein the insulating film has a thickness of the fourth region that is greater than a thickness of each of the first region and the second region.   The physical quantity detection device according to claim 7, wherein the circuit board is provided with a concave groove in the boundary portion. The said housing is comprised by the material made from a thermoplastic resin, and the said board | substrate main body is comprised by the material made from a glass epoxy resin, The Claim 1 characterized by the above-mentioned. Physical quantity detection device.

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