JP2017147280A - Electronic circuit component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic circuit component which can improve pressure resistance without increasing the board thickness of a lid.SOLUTION: An electronic circuit component 1 according to the present invention comprises: an electronic component 2 having at least one selected from electrical elements 21 and 22, and a portion 23 of a conducting path to the electrical elements 21 and 22; a resin member 4 which is provided with housing recesses 41, 42, and 43 recessed in a concave manner from a surface 4a, and which has the electronic component 2, electrical elements 21 and 22, as well as the portion 23 arranged inside the housing recesses 41 to 43; and a lid member 5 covering the surface 4a of the resin member 4. The lid member 5 has a protrusion 54 which comes into contact with inner peripheral surfaces 41c, 42c, and 43c of openings of the housing recesses 41 to 43.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electronic circuit component.

2. Description of the Related Art Conventionally, there is a sensor using a semiconductor element that includes a container that houses a semiconductor chip and a lid that seals the opening of the container. This sensor is disclosed in Patent Document 1, for example. This sensor includes a semiconductor chip, a bottomed cylindrical container, and a curved plate-like lid that seals the opening of the container.
Such a conventional sensor (or a semiconductor element) may be integrally molded with resin together with other electronic components constituting the circuit.

JP 2008-227087 A

  However, the lid that seals the opening of the container is a plate that is arranged so as to cover the opening of the container, and is deformed so that the lid is bent toward the container due to heat and molding pressure during resin molding. There was a fear.

  When the lid is deformed, the deformed lid may come into contact with the semiconductor chip or the bonding wire, and unnecessary pressure may be applied to the semiconductor chip. In particular, the deformation of the lid increases as the opening of the container (the size of the semiconductor chip) increases and the molding pressure of the resin mold increases.

For such a problem, a method of increasing the plate thickness of the lid or a method of changing to a material having higher rigidity can be considered. In these methods, the overall physique is coarsened and the cost is increased. Furthermore, when the plate | board thickness of the cover body which consists of resin is thickened, there existed a problem of causing the fall of heat dissipation.
This invention is made | formed in view of the said situation, and makes it a subject to provide the electronic circuit component which can improve pressure | voltage resistance, without thickening the plate | board thickness of a cover body.

  In order to solve the above-mentioned problems, the inventor of the present invention has completed the present invention as a result of repeated studies on suppressing deformation of the lid of the electronic circuit component.

  That is, the electronic circuit component of the present invention is formed with an electrical component, a part of a conductive path to the electrical component, an electronic component having at least one selected from the electrical component, and an accommodation recess recessed in a concave shape from the surface. An electronic circuit component having a resin member in which the electronic component is disposed and a lid member that covers the surface of the resin member, the lid member being a protrusion that abuts on the inner peripheral surface of the opening of the housing recess Part.

  In the electronic circuit component of the present invention, the lid member has a protrusion. The protrusion is in contact with the inner peripheral surface of the opening of the housing recess, and the lid member is deformed (specifically, the lid member is curved toward the housing recess and expands radially outward of the opening). ). As a result, deformation of the lid member is suppressed, and the electronic circuit component has improved pressure resistance.

It is a top view of electronic circuit component 1 of a 1st embodiment. It is sectional drawing in the II-II line of the electronic circuit component 1 of 1st Embodiment. It is the top view which showed the structure of the electronic circuit component 1 of 1st Embodiment. It is sectional drawing in the IV-IV line of the electronic circuit component 1 of 1st Embodiment. It is sectional drawing in the VV line of the electronic circuit component 1 of 1st Embodiment. It is sectional drawing in the VI-VI line of the electronic circuit component 1 of 1st Embodiment. It is a figure which shows typically the effect of the electronic circuit component 1 of 1st Embodiment. It is a figure which shows typically the effect of the electronic circuit component 1 of 1st Embodiment. It is sectional drawing which shows the main structures of the electronic circuit component 1 of 2nd Embodiment. It is sectional drawing which shows the main structures of the electronic circuit component 1 of 3rd Embodiment. It is sectional drawing which shows the main structures of the electronic circuit component 1 of 4th Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, each figure used for description is a figure which shows schematic structure. Further, the present invention is not limited to each embodiment, and can be implemented with various modifications.

[First Embodiment]
As shown in FIGS. 1 to 6, the electronic circuit component 1 of the present embodiment includes an electronic component 2, a lead frame 3, a resin member 4, a lid member 5, and a coating resin 6. FIG. 1 is a top view of the electronic circuit component 1 of the present embodiment. 2 is a cross-sectional view taken along line II-II in FIG. FIG. 3 is a top view showing the configuration of the electronic circuit component 1 of the present embodiment, excluding the lid member 5 and the coating resin 6. 4 is a cross-sectional view taken along line IV-IV in FIG. FIG. 5 is a cross-sectional view taken along line VV in FIG. 6 is a cross-sectional view taken along line VI-VI in FIG.

In the description of this embodiment, the side of the resin member 4 on which the electronic component 2 (21 to 23) is disposed is referred to as the upper side, and the opposite side is referred to as the lower side. Moreover, as shown in the figure, one direction in the plane direction orthogonal to the up-down direction is referred to as the front-rear direction, and the direction orthogonal to the up-down direction and the front-rear direction is referred to as the left-right direction. The radial direction corresponds to the radial direction of the annular protrusion 54 formed over the entire circumference, and corresponds to the front-rear direction and the left-right direction in the drawing.
The electronic circuit component 1 of this embodiment can be used for an acceleration sensor and ECU (electronic control unit), for example.

(Electronic parts)
The electronic component 2 has at least one selected from the electric elements 21 and 22 and a part of the conductive path to the electric elements 21 and 22.
The electric elements 21 and 22 are elements constituting an electronic circuit, and examples thereof include a capacitor, a resistor, or an integrated circuit (IC) sealed in a package. In this embodiment, the electric element 21 is an element having a small size such as a capacitor or a resistance element, and the electric element 22 is an IC having a large size.

  The part of the conductive path to the electric elements 21 and 22 of the electronic component 2 indicates an exposed part of the conductive path through which the electric elements 21 and 22 are energized. Examples of the conductive path include an exposed portion of the lead frame 3 and a connecting portion 23 between the lead frame 3 and the external terminal 31. In the figure, the connecting portion 23 is a connecting portion (specifically, a welded portion) to two external terminals 31, but the number of connecting portions 23 increases as the number of external terminals 31 increases. .

(Lead frame)
The lead frame 3 is a conductive flat wiring, and forms a circuit pattern corresponding to the electronic component 2. The lead frame 3 is a circuit forming member formed by punching and molding a conductive alloy plate, for example. The lead frame 3 is configured using a plurality of lead wire portions 30. The lead wire portion 30 constitutes a wiring that connects the electronic component 2 and the outside. The lead frame 3 includes an external terminal 31 described later.

  The lead frame 3 can be formed of, for example, a copper material, an alloy material, or a kovar material used for IC components. The lead frame 3 may be subjected to surface treatment (for example, tin plating) in order to improve solderability.

(Resin member)
The resin member 4 is a substantially rectangular parallelepiped substrate forming member made of resin, in which a part of the lead frame 3 is disposed inside. The resin member 4 includes a flat substrate forming portion 40 and a plurality of housing recesses 41, 42, 43.

  The housing recesses 41 to 43 of the resin member 4 are formed to be recessed from the surface 4a (upper surface). The housing recesses 41 to 43 are partitioned into the substrate forming portion 40. In the housing recesses 41 to 43, the electronic component 2 (21, 22, 23) is housed. The housing recesses 41 to 43 are formed at the arrangement positions of the electronic components 2 (21 to 23) according to the sizes of the electric elements 21 and 22 and the connection portion 23.

  As shown in FIG. 4, the housing recesses 41 to 43 are formed so as to be recessed from the surface 4 a (upper surface), and the inner surface is formed in a substantially trapezoidal shape. The substantially trapezoidal shape of the housing recesses 41 to 43 is such that the side surfaces 41c to 43c are inclined so that the diameter gradually increases from the most concave surface 41b to 43b (also corresponding to the concave bottom surface) toward the opening. Is formed. The inclination angles of the side surfaces 41c to 43c of the housing recesses 41 to 43 are not limited.

  In the housing recess 41, the electric element 21 is disposed on the most concave surface 41b. In the housing recess 42, the electric element 22 is arranged on the most concave surface (also corresponding to a concave bottom surface) 42b. In the housing recess 43, the connection portion 23 (a plurality of welds) is disposed on the most concave surface (also corresponding to a concave bottom surface) 43 b. As shown in FIG. 4, each of the housing recesses 41 to 43 has side surfaces 41 c, 42 c, 43 c formed in parallel to the depth direction (vertical direction in the drawing) of the housing recesses 41 to 43.

(Cover member)
As shown in FIG. 4, the lid member 5 is a member for covering the surface 4a of the resin member 4, and is disposed on the surface 4a. The lid member 5 is formed separately from the resin member 4. The lid member 5 has lid recesses 51 to 53 that are recessed from the lower surface 5b at sites corresponding to the housing recesses 41 to 43 (or opposed sites). The lid recesses 51 to 53 are formed to be slightly smaller than the shape of the openings of the housing recesses 41 to 43 because the projections 54 are formed.

  The lid member 5 is formed with a protrusion 54 that is inserted into the housing recesses 42 to 43 so as to protrude from the lower surface 5b. When the lid member 5 covers the surface 4 a of the resin member 4, the protruding portion 54 is inserted into the housing recesses 42 to 43, and the side surface 54 c on the radially outer side becomes the side surfaces 42 c to 43 c of the housing recesses 42 to 43. Abut (or adhere). The protrusion 54 is formed to protrude from the lower surface 5b so as to form a triangular cross section. In the protrusion 54 having a triangular cross section, the inclination angle of the side surface 54c on the radially outer side coincides with the inclination angle of the side surfaces 42c to 43c of the housing recesses 42 to 43.

  As shown in FIGS. 4 to 6, the protrusion 54 is formed so as to be able to contact over the entire circumference of the opening of the housing recesses 42 to 43. That is, it is formed so as to protrude from the openings of the lid recesses 52 to 53 over the entire circumference. Further, no protrusion 54 is formed in the opening of the lid recess 51 corresponding to the housing recess 41.

  The protrusion height from the lower surface 5b of the protrusion 54 (downward protrusion height in the figure) is appropriately determined according to the material of the resin member 4 and the lid member 5 and the force applied to the lid member 5. It is not limited to.

(Coating resin)
The coating resin 6 is a resin member that covers a part of the lead frame 3, the resin member 4, and the lid member 5. The coating resin 6 is formed by molding the resin member 4 and the lid member 5 with a resin (for example, PBT).

  The coating resin 6 is formed on the main body portion 60 that covers the resin member 4 and the lid member 5, the connector case portion 61 that protrudes from one end portion from the main body portion 60, and the end portion (here, the other end portion) of the main body portion 60. And a fixed portion 62. The connector case portion 61 is formed in a cylindrical shape, and an end portion of the external terminal 31 that is a part of the lead frame 3 is exposed inside. The fixing portion 62 is integrally formed (insert molding) with a fixing metal member 63 for fixing to the vehicle.

[Effect of the first embodiment]
(First effect)
The electronic circuit component 1 according to the present embodiment includes an electronic component 2, a resin member 4 in which housing recesses 41 to 43 are housed in the electronic component 2, and a lid member 5 that covers the surface 4 a of the resin member 4. In the circuit component 1, the lid member 5 has a protrusion 54 that abuts against the inner peripheral surfaces 42 c to 43 c of the openings of the housing recesses 42 to 43.

  According to this configuration, even if the lid member 5 tries to deform in the direction in which the protrusions 54 are separated from each other radially outward (specifically, the direction in which the openings of the housing recesses 42 to 43 are opened), the protrusion 54 The side surface contacts the inner peripheral surfaces 42c to 43c, and further deformation is restricted. As a result, the deformation of the lid member 5 itself is restricted. As a result, the electronic circuit component 1 of the present embodiment has improved pressure resistance.

  More specifically, the electronic circuit component 1 of the present embodiment is formed by insert molding in a state where the surface 4a of the resin member 4 is disposed so as to cover the lid member 5 (the state shown in FIG. 7). It is formed. 7 to 8 are diagrams schematically showing a configuration in the vicinity of the accommodating recess 42 in a state in which the lid member 5 is arranged on the resin member 4. At the time of insert molding, heat and pressure are applied to the resin member 4 and the lid member 5. The lid member 5 has a substantially plate shape and is likely to be deformed and bent. In particular, the portion where the lid concave portions 51 to 53 are formed has a thin plate thickness of the lid member 5 and is likely to be deformed or bent. As shown in FIG. 7, stress is applied in the plate thickness direction of the lid member 5.

  In the electronic circuit component 1 of the present embodiment, even when stress is applied to the lid member 5 during insert molding and deformation or deflection occurs, the protrusion 54 contacts the inner peripheral surfaces 42c to 43c as described above, and more The deformation of is regulated. As shown in FIG. 8, even if the lid member 5 starts to be deformed and the protrusion 54 presses the inner peripheral surface 42c, the protrusion 54 causes the inner peripheral surface 42c to react with the reaction force from the inner peripheral surface 42c. Expansion is restricted. That is, the progress of further deformation in the lid member 5 is restricted. As a result, the deformation of the lid member 5 itself is restricted.

This indicates that it is not necessary to increase the thickness of the lid member 5 in order to increase the strength of the lid member 5. That is, the deformation is regulated without making the physique of the electronic circuit component 1 coarse.
As described in detail above, the electronic circuit component 1 of the present embodiment has improved pressure resistance.

(Second to third effects)
In the electronic circuit component 1 of this embodiment, an integrated circuit (IC) is used as the electric element 22 of the electronic component 2, and the protrusion 54 is formed over the entire circumference of the opening of the housing recess 42.

  In the electronic circuit component 1 of this embodiment, an IC is used as the electric element 22. The IC is larger in size than the capacitor and the resistance element of the electric element 21, and the area of the opening of the housing recess 42 in which the IC is housed is larger than that of the housing recess 41. This indicates that the portion where the lid recess 52 is formed has a lower strength than the portion where the lid recess 51 is formed, and is easily deformed.

As in the present embodiment, in the housing recesses 42 and 43 in which the electronic component 2 with a large size of the electronic component 2 is accommodated, the projection 54 abuts over the entire circumference of the opening, so that the deformation of the lid member 5 is more reliably performed. Be regulated.
That is, even if the size of the electronic component 2 is increased as in the present embodiment, the above-described effects can be exhibited by forming the protrusions 54 over the entire circumference.

(Fourth effect)
In the electronic circuit component 1 of the present embodiment, the inner peripheral surfaces (side surfaces) 41c to 43c of the openings of the housing recesses 41 to 43 are inclined surfaces whose diameters are increased on the opening side.

  According to this configuration, even if the lid member 5 is deformed or bent and the protrusion 54 presses the inner peripheral surfaces 42c to 43c, the inclined inner peripheral surfaces 42c to 43c disperse the applied pressure. Specifically, the pressing force of the protrusion 54 is dispersed in the vertical direction and the front-rear direction in the figure due to the inclination of the inner peripheral surfaces 42c to 43c. This indicates that the pressure resistance of the electronic circuit component 1 of this embodiment is further improved.

  Moreover, the moldability of the shaping | molding die of the resin member 4 improves because the internal peripheral surfaces 41c-43c were formed inclined. That is, the moldability of the resin member 4 is improved, and the electronic circuit component 1 can be obtained at low cost.

(Fifth effect)
In the electronic circuit component 1 according to the present embodiment, the lid member 5 is a facing recess 5 that is recessed from the facing surface 5 b in a portion corresponding to the housing recesses 41 to 43 on the facing surface 5 b facing the surface 4 a of the resin member 4. 51-53 are formed.

  By forming the lid recesses 51 to 53, a gap (clearance) can be secured above the electronic component 2. This gap prevents contact or pressing with the upper surface of the electronic component 2 even if the lid member 5 is deformed. In particular, the lid member 5 can be prevented from being deformed and damaging the electronic component 2 during the above-described insert molding.

  Furthermore, it is possible to prevent the total thickness of the lid member 5 and the resin member 4 from increasing. This can not only prevent the overall size of the body from becoming coarse, but also improve heat dissipation.

  In addition, as shown in the figure, the surface of the resin member 4 can be made lower than the upper surface of the IC of the electric element 21. That is, the resin member 4 can be made thin, and from this point as well, coarsening of the entire physique can be suppressed.

(Sixth effect)
In the electronic circuit component 1 of the present embodiment, the lid recesses 51 to 53 are formed so that the cross-sectional shape is concave.
According to this configuration, the above effects can be reliably exhibited.

(Seventh effect)
The electronic circuit component 1 of this embodiment is assembled to a lead frame 3 having a circuit pattern corresponding to the electronic component 2, and the resin member 4 fixes the lead frame 3 therein.

  According to this configuration, the electronic component 2 can be assembled with the lead frame 3 fixed to the resin member 4. That is, the resin member 4 can be formed in a state where the electronic component 2 is not assembled. That is, it is possible to prevent the electronic component 2 from being damaged when the resin member 4 is formed.

(Eighth effect)
The electronic circuit component 1 of this embodiment has a coating resin 6 that surrounds the resin member 4 and the lid member 5.
According to this configuration, the electronic circuit component 1 of the present embodiment can form a desired outer peripheral shape.

[Second Embodiment]
This embodiment is the electronic circuit component 1 having the same configuration as that of the first embodiment except that the inner peripheral shapes of the lid recesses 51 to 53 are different. The structure of this embodiment is shown in a sectional view in FIG. 9 is a cross-sectional view similar to FIG.

  The lid recesses 51 to 53 are formed so that the inner peripheral surface forms an arc shape. In this embodiment, the radius of curvature of the arc on the inner peripheral surface of the lid recess 51 to 53 is not limited.

[Effects of Second Embodiment]
Also in this embodiment, the same effect as the first embodiment is exhibited.
In this embodiment, the inner peripheral surfaces of the lid recesses 51 to 53 are further formed in an arc shape. In this configuration, the lid recesses 51 to 53 do not have corners. That is, even if a large force is applied to the lid member 5, partial stress concentration does not occur. That is, the pressure resistance of the lid member 5 itself is improved. As a result, the pressure resistance of the electronic circuit component 1 of this embodiment is further improved.

[Third Embodiment]
The present embodiment is the electronic circuit component 1 having the same configuration as that of the first embodiment except that the protrusion 54 is formed also in the opening of the lid recess 51 corresponding to the housing recess 41. The structure of this embodiment is shown in a sectional view in FIG. FIG. 10 is also a cross-sectional view similar to FIG.

[Effect of the third embodiment]
Also in this embodiment, the same effect as the first embodiment is exhibited.
In this embodiment, since the projection 54 is also formed in the opening of the lid recess 51, deformation of the lid member 5 at the portion corresponding to the housing recess 41 can be suppressed. For this reason, said effect can be exhibited more reliably.

[Fourth Embodiment]
The present embodiment is an electronic circuit component 1 having the same configuration as that of the first embodiment except that the cross-sectional shape of the inner surface of the housing recesses 41 to 43 and the outer peripheral shape of the protrusion 54 are different. The structure of this embodiment is shown in a sectional view in FIG. FIG. 11 is also a cross-sectional view similar to FIG.
The inner surfaces of the housing recesses 41 to 43 of the present embodiment are formed so as to have a concave cross section as illustrated.

Further, the protrusion 54 is formed to have a convex cross-sectional shape. As for the projection part 54, the side surface 54c of the radial direction outer side becomes a contact surface with the side surfaces 42c-43c of the accommodation recessed parts 42-43.
The thickness in the radial direction of the protruding portion 54 may be any thickness as long as the strength of the protruding portion 54 can be secured, and is not generally limited.

[Effect of Fourth Embodiment]
Also in this embodiment, the same effect as the first embodiment is exhibited.
Furthermore, in this embodiment, the strength of the protrusion 54 itself can be increased. As a result, even if the force applied to the lid member 5 becomes larger, the deformation of the lid member 5 can be suppressed. That is, according to the present embodiment, the above effects can be more reliably exhibited.

[Modified form of each embodiment]
In said each form, although the cover recessed parts 51-53 are formed in the cover member 5, it is good also as a plate shape in which the cover recessed parts 51-53 are not formed. Also in this embodiment, the above-mentioned effect can be exhibited by forming the projections 54.

  Moreover, although the projection part 54 is formed over the perimeter of the opening part of the cover recessed parts 51-53 corresponding to the accommodation recessed parts 41-43, it is not limited to this structure. For example, it may be formed in a line shape or a point shape in a partially cut annular shape or in a part in the circumferential direction of the opening. Preferably, it is a portion where the amount of deformation increases when a force is applied to the lid member in the vertical direction, and when the opening of the lid recesses 51 to 53 is substantially rectangular, it is preferably formed along the short side. .

DESCRIPTION OF SYMBOLS 1: Electronic circuit component 2: Electronic component 21, 22: Electrical element 23: Connection part 3: Lead frame 30: Lead wire 4: Resin member 40: Board | substrate formation site 41,42,43: Housing recessed part 5: Lid member 51, 52, 53: lid recess 54: projection 6: coating resin 60: main body 61: connector case 62: fixing part 63: fixing metal member

Claims (8)

An electronic component (2) having at least one selected from the electric element (21, 22), a part of the conductive path (23) to the electric element, and
A resin member (4) in which a housing recess (41, 42, 43) recessed from the surface (4a) is formed, and the electronic component (2) is disposed inside the housing recess;
A lid member (5) covering the surface of the resin member (4);
An electronic circuit component (1) having:
The said cover member (5) is an electronic circuit component which has the projection part (54) contact | abutted to the internal peripheral surface (41c, 42c, 43c) of the opening part of the said accommodation recessed part (41-43).   The electronic circuit component according to claim 1, wherein the protrusion is formed over the entire circumference of the opening of the receiving recess.   The electronic circuit component according to claim 1, wherein the electronic component is an integrated circuit.   The electronic circuit component according to any one of claims 1 to 3, wherein an inner peripheral surface of the opening of the housing recess is an inclined surface having an enlarged diameter on the opening side.   The lid member (5) is formed with a lid recess (51, 52, 53) recessed in a concave shape from the facing surface on a portion of the resin member facing the surface and corresponding to the receiving recess. The electronic circuit component according to any one of claims 1 to 4.   6. The electronic circuit component according to claim 5, wherein the lid recess (51-53) is formed so that the cross-sectional shape forms at least one of a concave shape and an arc shape. The electronic component (2) is assembled to a lead frame (3) having a corresponding circuit pattern,
The electronic circuit component according to any one of claims 1 to 6, wherein the resin member (4) fixes the lead frame therein.   The electronic circuit component according to any one of claims 1 to 7, further comprising a coating resin (6) surrounding the electronic circuit component.

Images