JP2017130400A - Led lighting fixture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting fixture which efficiently radiates heat generated by an LED circuit board, on which LEDs are mounted, to the outside.SOLUTION: An LED lighting fixture includes: an LED circuit board on which LEDs are mounted; a first radiator to which the LED circuit board is attached; an upper cover having thermal conductivity; a lower cover having a light radiation window part and in which the first radiator is provided; and a second radiator in which one part is attached to an inner surface of the upper cover and the other part is attached to the first radiator.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heat dissipation technique for an LED lighting apparatus used as an outdoor lamp or an indoor lamp.

  LEDs (light-emitting diodes) have various advantages such as high luminous efficiency, directivity, small size / light weight, long life, no UV rays, etc., so traffic lights, portable electronic information devices, indoor and outdoor large-sized It is used for display devices and the like, and has recently been widely used as an outdoor or indoor lighting fixture. LED has high energy conversion efficiency to convert electrical energy into light compared to conventional fluorescent lamps, and the light emitted from LED contains almost no infrared rays, so the amount of heat generated in the light emitting part of LED is small, Increasing the current that flows to the LED to increase the illuminance increases the amount of heat generated inside the LED element, and inevitably the current that flows to the peripheral element that controls the lighting of the LED and the power supply unit that supplies power to the LED and the peripheral element. And the calorific value increases. Furthermore, in order to obtain a predetermined brightness as a lighting fixture, it is necessary to provide a plurality of LEDs, and the LED circuit board on which the plurality of LEDs, peripheral elements, power supply units and the like are mounted is heated to a high temperature. Become. Since the LED has a characteristic that the output decreases as the temperature rises, measures for heat dissipation of the LED circuit board are an important issue.

  Regarding heat radiation countermeasures for LED lighting fixtures, the following Patent Documents 1 and 2 describe the following. First, Patent Document 1 states that “as a collective lamp in which a large number of LEDs are conventionally arranged on a substrate, there are many cases in which only visibility of a traffic light or the like is required. In addition, the lighting of traffic lights is generally considered to be waterproof, but it is installed in a well-ventilated place and there are few problems with heat dissipation due to its structure, and a heat sink is generally used for heat dissipation of the board itself. It is known to be mounted on the entire back surface or partially on the front surface, but when a collective LED lamp is used as the original illumination, it is necessary to mount a considerable number of LEDs on a single substrate. In addition, it is necessary to reduce the thickness (or depth) as much as possible and to form the collective lamp itself in the form of a plate because of its versatility in relation to the mounting position, etc. Therefore, heat dissipation of the substrate is required. What is required the waterproof so there is a problem that heat dissipation is difficult. "(Paragraph" 0002 "," 0003 ", see." 0005 ") it has been described as.

  And in order to solve the said problem, the "collective type LED lamp" of patent document 1 is "projecting many LED (1) on the surface of a board | substrate (2), and the surface of this LED (1) In a collective lamp in which the side is covered with a translucent cover (3) and the heat sink (8) is mounted on the back side of the substrate (2), the heat dissipation between the substrate (2) and the heat sink (8) And the substrate (2) and the heat radiated through the heat radiation layer (7) having an adhesive function to adhere to the inner surface of the peripheral wall (3a) of the cover (3) and the substrate (2). The board (8) is fixed ". (Refer to “Claim 1”.)

  Patent Document 2 states that “LEDs have begun to be used as alternative light sources for lamp light sources in lighting fixtures that require high output as LED output increases. Particularly, in recent years, road lights and street lights have been used. As a lighting fixture used as a light source, an LED that uses an LED as a light source has been proposed (see, for example, Patent Document 1.) By the way, since an LED has a shorter lifetime as the temperature increases, the LED is used as a light source. "It is important to take measures for heat dissipation of the LED" (see paragraph "0002").

  And in order to solve the said subject, the "LED lighting fixture" of patent document 2 is "the light source unit which arrange | positions several LED in the position which faces the said irradiation opening in the fixture main body provided with the irradiation opening. The light source unit includes a part of the LEDs disposed on the inner surface side of the device body, and the LEDs disposed on the inner surface side are connected to the inner surface. It is characterized in that a conductive plate is connected to dissipate heat and other LEDs are connected to dissipate fins to dissipate heat.

JP 2010-021156 A JP 2010-262796 A

  In the “collective LED lamp” described in Patent Document 1, the “substrate 2” is waterproofed by the “cover 3” and the “heat radiation layer 7”, but is pressed against the back surface of the “heat radiation layer 7”. The "heat sink (heat radiating plate) 8 made of an aluminum extrusion molding material or the like" that is bonded and fixed in the state is exposed to the outside air (see paragraphs "0015" to "0019" and FIGS. 1 to 4). Therefore, when this “collective LED lamp” is used as a traffic signal, for example, the “heat sink (heat radiating plate) 8” is directly exposed to the outside air (wind, rain, snow, etc.). Is concerned. If the “heat sink (heat radiating plate) 8” is covered with a dense and waterproof cover, the heat dissipated by the “heat sink (heat radiating plate) 8” will be trapped in the cover, resulting in heat dissipation efficiency. May deteriorate.

  On the other hand, in the “LED lighting fixture 1” described in Patent Document 2, the “light source unit 13” is housed in the “tool body 5”, and therefore the “heat conduction” provided in the “light source unit 13”. With respect to the “plate 45”, “radiating fin 43” and other metal parts, it is assumed that the problem that the heat dissipating portion of the above-mentioned Patent Document 1 is exposed is solved.

  Here, when further examination is made, Patent Document 2 states that “LED lighting fixture 1 is ... a plurality of LED carrying plates 41 carrying one or more LEDs 30 in this way are frame-shaped frame plates”. The light source unit 13 is constructed by assembling to the light source unit 40. Now, when the LED support plate 41 is assembled to the light source unit 13, at least some of the light source units 13 are assembled to the inner surface 6 side of the instrument body 5. And among LED30 with which the light source unit 13 is provided, with respect to LED30 (it attaches | subjects and distinguishes with 30 A of codes | symbols) arrange | positioned along this inner surface 6 on the inner surface 6 side, as shown in FIG. A relatively thick (for example, 1 mm) heat conduction plate 45 made of, for example, a copper plate having high thermal conductivity is connected to the back surface of the LED carrying plate 41 carrying the LED 30A. Instrument body The heat of the LED 30A is conducted and dissipated to the inner surface 6 of the LED 30. The remaining LEDs 30 (indicated by reference numeral 30B) arranged on the inner side of these LEDs 30A are distinguished from each other on the LED carrying the LED 30B. A heat radiating fin 43 is connected to the back surface of the support plate 41 and heat is radiated to the inside of the instrument body 5 by the heat radiating fin 43 (see paragraphs “0010” to “0013” and FIGS. 1 to 3). Have been described.

  Patent Document 2 describes the reason for the above configuration and the effects thereof as follows. “As described above, the light source unit 13 is provided with the heat conduction plate 45 that conducts the heat of the LED 30A to the inner side surface 6 of the fixture body 5 in addition to the heat radiation fins 43, and both of them radiate heat from the LEDs 30A and 30B. Therefore, even when the existing fixture body 5 that has insufficient heat dissipation capability is dissipated by the heat radiation of the radiation fins 43 alone, among the LEDs 30 included in the light source unit 13, the heat generated by some LEDs 30 </ b> A is released to the inner side surface 6 of the fixture body 5. Therefore, each LED 30 can be radiated well, so that the number or number of LEDs 30 that could not be built in due to a thermal problem in the existing instrument body 5 can be built in. Especially, it is used outdoors. In a lamp such as a street light, the fixture body 5 has a sealed structure, so that heat is easily trapped, and the heat radiating fins 43 are sufficient to radiate heat. However, according to the present embodiment, sufficient heat dissipation can be realized because the heat is also radiated from the instrument body 5. Further, all the LEDs 30 are connected to the instrument body 5 via the heat conduction plate 45. However, in such a configuration, the instrument body 5 is likely to be thermally saturated, and the heat dissipation effect of the LED 30 is difficult to obtain. Such a problem does not occur because the LED 30A that dissipates heat by heat conduction is limited to a part of the instrument body 5 ”(see paragraphs“ 0014 ”and“ 0015 ”, FIGS. 1 to 3).

  However, in the “LED lighting fixture 1” described in Patent Document 2, some “LED carrying plates 41” out of the plurality of “LED carrying plates 41” are “heat conducting plates 45” via “thermal conducting plates 45”. Although it is configured to radiate heat to the “inner surface 6” of the “tool body 5”, the other “LED support plate 41” is connected to the “tool body 5” by the “radiation fins 43” connected to the back surface. It is configured to dissipate heat inside. In other words, in the “LED lighting fixture 1” described in Patent Document 2, the heat radiation means having different structures must be designed by using heat radiation by both the heat radiation by the “heat conduction plate” and the heat radiation by the “heat radiation fin”. In addition, the design takes time and the structure is complicated as shown in FIGS.

  In addition, the “LED carrying plate 41” on which the “LED 30B” is mounted is radiated only by the “radiating fins 43”, and this radiating is inside the “equipment main body 5” as described in Patent Document 2. Therefore, further improvement is required to release the heat trapped inside the “tool body 5”.

  Then, an object of this invention is to provide the LED lighting fixture which can thermally radiate the heat | fever of the LED circuit board in which several LED was mounted efficiently to the exterior.

  In order to achieve the above object, the invention of claim 1 is an LED lighting apparatus, wherein an LED circuit board on which a plurality of LEDs are mounted, a first radiator to which the LED circuit board is attached, An upper cover having thermal conductivity, a light irradiation window portion, a lower cover in which the first heat radiating body is provided, a part of which is attached to the inner surface of the upper cover, and the other portion And a second heat dissipating member attached to the first heat dissipating member.

  The invention of claim 2 is characterized in that, in the invention of claim 1, all of the plurality of LEDs used in the LED lighting apparatus are mounted on the LED circuit board.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the first heat radiator includes an upper surface and a lower surface, and the LED circuit board is attached to the lower surface, The heat dissipating body 2 includes an upper surface and a lower surface, the upper surface is attached to the inner surface of the upper cover, and the lower surface is attached to the upper surface of the LED circuit board.

  Further, in the invention of claim 4, in the invention of any one of claims 1 to 3, the first radiator and the second radiator are metal materials having thermal conductivity, etc. It is formed using.

  According to a fifth aspect of the present invention, there is provided the hinge according to any one of the first to fourth aspects, wherein the upper cover and the lower cover are rotatably supported. It is characterized by that.

  According to a sixth aspect of the present invention, in the invention according to any one of the first to fifth aspects, the heat generated in the LED circuit board is an internal structure constituted by the upper cover and the lower cover. The heat is radiated to the space, and is radiated to the external space through the first heat radiating body, the second heat radiating body, and the upper cover.

  The invention according to claim 7 is the invention according to any one of claims 1 to 5, wherein a heat radiation sheet having thermal conductivity and elasticity is attached to the lower surface of the second heat radiator. The lower surface of the second heat radiator is attached to the upper surface of the first heat radiator via the heat radiation sheet.

  According to an eighth aspect of the invention, in the invention of the seventh aspect, heat generated in the LED circuit board is radiated to an internal space formed by the upper cover and the lower cover, and the first The heat is radiated to the external space through one heat radiating body, the heat radiating sheet, the second heat radiating body, and the upper cover.

  The invention of claim 9 is an LED lighting apparatus, wherein an LED circuit board on which a plurality of LEDs are mounted, a first heat-dissipating body having thermal conductivity attached to the LED circuit board, and heat An upper cover having conductivity, and a lower cover having a light irradiation window portion and in which the first heat radiating body is provided, wherein a part of the first heat radiating body is a part of the upper cover. It is characterized by being attached to the inner surface.

  According to the LED lighting apparatus of the present invention, an LED circuit board on which a plurality of LEDs are mounted, a first heat radiator to which the LED circuit board is attached, an upper cover having thermal conductivity, and a light irradiation window A lower cover in which the first heat dissipating body is provided, a part of which is attached to the inner surface of the upper cover, and another part attached to the first heat dissipating body. The heat generated in the LED circuit board is dissipated into the internal space between the upper cover and the lower cover, and the first heat dissipator, Since heat is radiated to the external space (in the outside air) through the heat radiating body 2 and the upper cover, a significant heat radiating effect can be achieved as compared with the prior art.

  According to the LED lighting apparatus of the present invention, in the configuration in which the upper cover and the lower cover are closed, the heat radiator is housed in the LED lighting apparatus in a sealed and waterproof state together with the LED circuit board. Therefore, there is no risk of being directly exposed to the outside air.

  In addition, according to the LED lighting apparatus of the present invention, since the heat dissipation sheet having elasticity and high thermal conductivity is used on the lower surface of the second radiator, in the configuration in which the upper cover and the lower cover are closed. Since the first heat radiator and the second heat radiator are more closely attached, the heat radiation efficiency can be improved.

In the LED lighting fixture in embodiment of this invention, it is a perspective view explaining the mounting state of the 1st heat radiator and the 2nd heat radiator. In the LED lighting fixture in embodiment of this invention, it is a right view explaining the mounting state of a 1st heat radiator and a 2nd heat radiator. In the LED lighting fixture in the embodiment of the present invention, it is a front view explaining the wearing state of the 1st radiator and the 2nd radiator. In the LED lighting fixture in embodiment of this invention, it is a perspective view explaining the mounting state to the 2nd heat radiating body of the 1st heat radiating body. In the LED lighting fixture in embodiment of this invention, it is a right view explaining the mounting state to the 2nd heat radiating body of the 1st heat radiating body. In the LED lighting fixture in embodiment of this invention, it is a front view explaining the mounting state to the 2nd heat radiating body of the 1st heat radiating body. It is a bottom view explaining the mounting | wearing state to LED circuit board of LED in the LED lighting fixture in embodiment of this invention. In the LED lighting fixture in embodiment of this invention, it is a perspective view which shows the mounting state to the upper cover of a 1st heat radiator. In the LED lighting fixture in embodiment of this invention, it is a perspective view which shows the mounting state to the upper cover of a 1st heat radiator, and the mounting state to the lower cover of a 2nd heat radiator. It is a figure which shows the heat dissipation test result of the LED lighting fixture in embodiment of this invention.

  Hereinafter, the present invention will be described more specifically with reference to preferred embodiments. However, the following embodiment is merely an example embodying the present invention, and the present invention is not limited to this.

(Embodiment)
An LED lighting apparatus according to an embodiment of the present invention will be described with reference to FIGS.

  The LED lighting apparatus 1 is used as a road lamp that is fixed to the upper end of a support column standing on the side of the road and irradiates the road surface, similarly to the “LED lighting apparatus 1” described in Patent Document 2. It is also widely used as outdoor lighting such as street lamps, garden lights, and signboard lights, and indoor wall lighting of buildings.

  As shown in FIGS. 1 and 2, the LED lighting apparatus 1 mainly includes an upper cover 2, a lower cover 3, a hinge portion 4, an LED circuit board 5 on which a plurality of LEDs 30 are mounted, and a thermal conductive LED. The first heat dissipating body 6 is attached to the circuit board 5 and the second heat dissipating body 7 is attached to the upper cover 2 having thermal conductivity.

  The upper cover 2 is formed of a metal material having thermal conductivity (for example, aluminum), and a resin (for example, synthetic rubber) packing is provided inside the periphery for waterproofing. When the lower cover 3 is closed, hermeticity and waterproofness are enhanced. A hinge portion 4 that rotatably supports the upper cover 2 and the lower cover 3 is provided at the rear end portion of the LED lighting device 1. The upper and lower covers 2 and 3 can be opened and closed. It is done in favor of. The lower cover 3 is formed of the same material as that of the upper cover 2 and has a first heat radiator 6 provided therein.

  The first heat radiating body 6 is formed of a box made of a metal material having high heat conductivity (for example, aluminum) having upper and lower surfaces 6a and 6b and left and right side surfaces 6c and 6d, and the front and rear sides are opened. On the lower surface 6b of the first radiator 6, the LED circuit board 5 on which all the lighting LEDs 30 used in the lighting fixture 1 are mounted is attached to the lower surface 6b of the first radiator 6 by the fixing means 5a. (See FIG. 7 in particular.) In the present embodiment, a plurality of LED circuit boards 5 are provided, and a plurality of LEDs 30 are mounted on each LED circuit board 5, but all the LEDs 30 are mounted on a single LED circuit board 5. May be. The LED 30 is a so-called surface-mounted LED, the lens portion faces downward, which is an irradiation surface such as a road, and the anode / cathode portion is attached to the LED circuit board 5. Fixing members 6 e and 6 f for fixing the first heat radiating body 6 to the lower cover 3 are attached to the front portion and the rear portion of the first heat radiating body 6. A power cord 9 for supplying power to the LED 30 is connected to the LED circuit board 5 through an open column fixing portion 10.

  A position corresponding to the lower surface 6b of the first radiator 6 on the bottom surface of the lower cover 3 is opened, and an irradiation window portion 11 formed of a material having transparency or translucency such as tempered glass or reinforced plastic is provided. Is provided. The light irradiation window portion 11 is configured such that light emitted from the LED 30 irradiates, for example, a road surface.

  The second heat radiating body 7 has upper and lower surfaces 7a and 7b and front and rear surfaces 7c and 7d, and is formed of a box body made of a metal material (for example, aluminum) having high thermal conductivity and opened on the left and right surfaces. . The front surface 7c and the rear surface 7d are provided with fixing pieces 7e and 7f for fixing the second radiator 7 to the inner wall surface 2a of the upper cover 2, and the fixing pieces 7e and 7f are respectively made of screws, bolts or the like. The upper surface 7a of the second radiator is attached to the inner wall surface 2a of the upper cover 2 by being screwed to the inner wall surface 2a of the upper cover 2 by the screw means 7g, 7h (particularly FIG. 2). , See FIG.

  A heat radiating sheet 8 having elasticity and high thermal conductivity is attached to the lower surface 7 b of the second heat radiating body 7. The heat radiating sheet 8 is made of, for example, a silicon material or an acrylic (non-silicon) material. Thereby, when the upper cover 2 and the lower cover 3 are closed, the adhesion between the lower surface 7b of the second radiator 7 and the upper surface 6a of the first radiator 6 is improved. If the lower surface 7b of the second radiator 7 and the upper surface 6a of the first radiator 6 are in direct contact with each other and have sufficient heat radiation efficiency, the radiation sheet 8 may not be provided. Good.

  8 and 9 show a state in which the upper cover 2 and the lower cover 3 are opened. As shown in the figure, the first radiator 6 is installed in the lower cover 3, and the second radiator 7 is attached to the inner wall surface 2a of the upper cover 7 by screwing means 7g and 7h. . A heat radiating sheet 8 is attached to the lower surface 7 b of the second heat radiating body 7. When the LED lighting apparatus 1 is assembled, first, in a state where the upper cover 2 and the lower cover 3 are opened, the upper surface 7a of the second radiator 7 is attached to the inner wall surface 2a of the upper cover 2 and screwed. The first heat radiating body 6 is installed in the lower cover 3 and is detachably fixed with a fixing piece, and the power cord 9 inserted through the column fixing portion 10 is connected to the first cover 7g and 7h. Connect to a predetermined position of the radiator 6. At this time, the heat radiating sheet 8 may be attached in advance to the lower surface 7 b of the second heat radiating body 7.

  Next, the lower cover 3 to which the first radiator 6 is attached and the upper cover 2 to which the second radiator 7 is attached are closed. At this time, the upper cover 2 and the lower cover 3 were pressed by the locking means L1 and L2 (see FIG. 9) provided at the front end portion of the upper cover 2 and the front end portion of the lower cover 3. Locked in state. As described above, since the resin packing made of, for example, synthetic rubber is provided inside the periphery of the upper cover 2, the sealing property and the waterproof property are improved.

  Here, the second heat radiator 7 is formed to be smaller than the first heat radiator 6. The reason for this will be described below. In the present embodiment, the inner wall surface 2a of the upper cover 2 is not a flat surface, but is formed in a substantially U-shaped cross section (see FIG. 2). Therefore, when the left and right side surfaces 6c and 6d of the first heat dissipating body 6 are raised and the upper surface 6a is to be brought into contact with the inner wall surface 2a of the upper cover 2, there is a non-contact gap between the upper surface 6a and the inner wall surface 2a. May occur and the heat dissipation efficiency may decrease. Moreover, if the upper surface 6a of the 1st heat radiating body 6 is formed according to the magnitude | size of the flat part 2b of the inner wall surface 2a, the upper surface 6a of the 1st heat radiating body 6 and the flat part 2b of the inner wall surface 2a will closely_contact | adhere. However, the area of the upper surface 6a of the first heat radiating body 6 is significantly reduced compared with the area of the lower surface 6b, so that the heat dissipation efficiency is lowered. For this reason, the 2nd heat radiating body 7 is provided independently of the 1st heat radiating body 6, and the magnitude | size of the 1st heat radiating body 6 can be installed in the lower cover 3, and sufficient heat radiation efficiency is obtained. Furthermore, the size of the upper surface 7a of the second heat radiating body 7 is adapted to the size of the flat portion 2b of the inner wall surface 2a in consideration of mounting portions such as screwing means 7g, 7h. The heat dissipation efficiency of the second heat dissipator 7 is improved by improving the adhesion between the upper surface 7a of the second heat dissipator 7 and the inner wall surface 2a, and the first heat dissipator 6 and the second heat dissipator. Therefore, the heat radiation efficiency as a whole is improved.

  When the inner wall surface 2a of the upper cover 2 has a curved shape, for example, either the upper surface 7a of the second radiator 7 or the inner wall surface 2a of the upper cover 2 corresponding to the upper surface 7a. Or, by sticking a heat radiation sheet having elasticity and thermal conductivity, similar to the heat radiation sheet 8, to both, or forming the upper surface 7a of the second heat radiator 7 with flexibility, Adhesion between the inner wall surface 2a of the upper cover 2 and the upper surface 7a of the second heat radiating body 7, that is, heat dissipation efficiency can be effectively maintained.

  The second heat radiator 7 can be formed, for example, by cutting and bending a metal plate material that is easy to work such as aluminum into a predetermined shape. Therefore, it is easy to form according to various shapes of the upper cover 2. LED lighting fixtures are often formed by changing the shape of the upper cover without changing the shape of the lower cover, depending on the installation environment, decorative properties, etc. Since only the easy second heat radiating body 7 needs to be changed in design, the design man-hours of the entire lighting fixture can be simplified. Moreover, you may create the 2nd heat radiator 7 of various shapes previously according to a product lineup.

  When the inner wall 2a of the upper cover 2 is flat over a wide range, the upper surface 6a of the first heat radiating body 6 is directly attached to the inner wall surface 2a of the upper cover 2 without providing the second heat radiating body 7. It may be.

  In FIG. 10, the heat dissipation test result of LED lighting fixture 1 is shown. Since the LED lighting apparatus 1 according to the embodiment of the present invention is configured as described above, after the power is turned on (time axis “0 minutes” in FIG. 10) at an environmental temperature (Ta) of 30 ° C., the LED circuit board 5. The measured temperatures of the first radiator 6 and the upper cover 2 (LED lighting fixture 1) gradually increase, and after about 70 minutes, 76.5 ° C., 54.6 ° C., 35. Stable to 8 ° C. As a result, it can be said that the LED lighting apparatus 1 of the embodiment of the present invention has sufficient heat dissipation characteristics and can prevent the deterioration of the lifetime of the LED.

DESCRIPTION OF SYMBOLS 1 LED lighting fixture 2 Upper cover 2a Upper cover inner wall surface 2b Flat part of upper cover inner wall surface 3 Lower cover 4 Hinge part 5 LED circuit board 5a Fixing means 6 1st heat radiator 6a Upper surface 6b of 1st heat radiator Lower surface 6c of the first heat radiator 6d Front surface 6d of the first heat radiator Rear surfaces 6e, 6f of the first heat radiator 7 Fixed piece 7 of the first heat radiator Second heat radiator 7a Upper surface 7b of the second heat radiator The lower surface 7c of the second heat radiator 7d the front surface 7d of the second heat radiator 7e, 7f The fixing pieces 7g, 7h of the second heat radiator Screwing means 8 Heat radiation sheet 9 Power cord 10 Strut fixing portion 11 Light Irradiation window 50 LED
L1, L2 Locking means

Claims (9)

An LED circuit board on which a plurality of LEDs are mounted;
A first radiator to which the LED circuit board is attached;
An upper cover having thermal conductivity;
A lower cover having a light irradiating window, in which the first radiator is provided;
A second radiator that is partly attached to the inner surface of the upper cover and the other part is attached to the first radiator;
LED lighting fixture characterized by comprising.   2. The LED lighting apparatus according to claim 1, wherein all of the plurality of LEDs used in the LED lighting apparatus are mounted on the LED circuit board. The first radiator has an upper surface and a lower surface, and the LED circuit board is attached to the lower surface,
2. The second heat radiator includes an upper surface and a lower surface, the upper surface is attached to an inner surface of the upper cover, and the lower surface is attached to an upper surface of the LED circuit board. Or the LED lighting fixture of Claim 2.   4. The LED according to claim 1, wherein the first heat radiating body and the second heat radiating body are formed using a metal material having thermal conductivity. 5. lighting equipment.   5. The LED lighting apparatus according to claim 1, further comprising a hinge portion that rotatably supports the upper cover and the lower cover.   The heat generated in the LED circuit board is radiated to the internal space formed by the upper cover and the lower cover, and the first heat radiator, the second heat radiator, and the upper cover The LED lighting apparatus according to claim 1, wherein heat is radiated to an external space through the LED lighting apparatus.   A heat radiating sheet having thermal conductivity and elasticity is attached to the lower surface of the second heat radiating body, and the lower surface of the second heat radiating body is attached to the upper surface of the first heat radiating body via the heat radiating sheet. The LED lighting apparatus according to any one of claims 1 to 5, wherein the LED lighting apparatus is attached.   The heat generated in the LED circuit board is radiated to an internal space constituted by the upper cover and the lower cover, and the first heat radiating body, the heat radiating sheet, the second heat radiating body, and The LED lighting apparatus according to claim 7, wherein heat is radiated to an external space through the upper cover. An LED circuit board on which a plurality of LEDs are mounted;
A first heat-dissipating body having thermal conductivity to which the LED circuit board is attached;
An upper cover having thermal conductivity;
A lower cover having a light irradiation window and having the first heat dissipating body installed therein,
A part of said 1st heat radiator is contact | connected to the inner surface of the said upper cover, The LED lighting fixture characterized by the above-mentioned.

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