JP2017120989A - Antenna device - Google Patents

Antenna device Download PDF

Info

Publication number
JP2017120989A
JP2017120989A JP2015256726A JP2015256726A JP2017120989A JP 2017120989 A JP2017120989 A JP 2017120989A JP 2015256726 A JP2015256726 A JP 2015256726A JP 2015256726 A JP2015256726 A JP 2015256726A JP 2017120989 A JP2017120989 A JP 2017120989A
Authority
JP
Japan
Prior art keywords
power supply
power
antenna
signal
control distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015256726A
Other languages
Japanese (ja)
Other versions
JP6521857B2 (en
Inventor
聡 岡崎
Satoshi Okazaki
聡 岡崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2015256726A priority Critical patent/JP6521857B2/en
Publication of JP2017120989A publication Critical patent/JP2017120989A/en
Application granted granted Critical
Publication of JP6521857B2 publication Critical patent/JP6521857B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain an antenna device comprising a power supply control distribution substrate that achieves reduction in cost and size.SOLUTION: An antenna device comprises: a transmitter/receiver 1 that transmits/receives an RF signal; an aerial wire 2 that transmits/receives an electromagnetic wave by being connected with the transmitter/receiver 1; a power supply unit 3 that supplies a power to the aerial wire 2; and a signal processing unit 4 that controls the aerial wire 2. The aerial wire 2 has: a power feeding substrate 5 that distributes the RF signal transmitted from the transmitter/receiver 1; a power supply control distribution substrate 6 that has a thick copper layer, and distributes the power supplied from the power supply unit 3 to transmission/reception modules 7-1 to 7-N; a plurality of transmission/reception modules 7-1 to 7-N that control a phase and an amplitude of the RF signal; and element antennas 8-1 to 8-N that emit the controlled RF signal into the air at transmission, and receive the electromagnetic wave at reception. The power supply control distribution substrate 6 applies a current from the power supply unit 3 to the thick copper layer.SELECTED DRAWING: Figure 1

Description

本発明は、フェーズドアレイアンテナ(PAA:Phased Array Antenna)を含むアンテナ装置に関する。   The present invention relates to an antenna device including a phased array antenna (PAA).

一般的なフェーズドアレイアンテナは、素子アンテナ、送受信モジュール、電源制御分配基板、給電基板及びアンテナ筐体を備える。送受信モジュールには電源制御分配基板を介して、各種制御信号と併せて電源供給を行い、電源系統によって大電流を流すことが可能である。従来、大電流が必要な電源系統には電源制御分配基板に対して工夫がなされている。   A typical phased array antenna includes an element antenna, a transmission / reception module, a power control distribution board, a power feeding board, and an antenna housing. A power supply is supplied to the transmission / reception module together with various control signals via a power supply control distribution board, and a large current can flow through the power supply system. Conventionally, power supply control distribution boards have been devised for power supply systems that require large currents.

一例として特許文献1には、「電源ブスを基板等に半田付けする際、帯状導電板と基板との間の熱膨脹率の差から生ずる基板の反り、半田やスルーホールの割れ等を防止すること」を目的として、「端子を帯状導電板の長手方向と直交する方向の端面に成形し、且つ折り曲げることで、最も問題となる帯状導電板長手方向の伸縮歪をこの曲げ部分が吸収し、端子自身が基板となす角度を初期角から変化させ平衡に達するようにする」構成が開示されている。特許文献1では、電源ブスの端子を帯状導電板の長手方向に成形し、且つ折り曲げることで、基板との間の熱膨脹率の違いによる伸縮歪を吸収し、装着時の半田付けにおける基板の反りを抑えている。   For example, Patent Document 1 states that “when power supply buses are soldered to a substrate or the like, the warpage of the substrate caused by the difference in the coefficient of thermal expansion between the belt-like conductive plate and the substrate, the cracking of the solder or the through hole, etc. are prevented. For the purpose of `` by forming the terminal on the end surface in the direction perpendicular to the longitudinal direction of the strip-shaped conductive plate and bending it, the bending portion absorbs the expansion / contraction strain in the longitudinal direction of the strip-shaped conductive plate, which is the most problematic, and the terminal A configuration is disclosed in which the angle formed by itself with respect to the substrate is changed from the initial angle so as to reach equilibrium. In Patent Document 1, the terminal of the power supply bus is formed in the longitudinal direction of the strip-shaped conductive plate and bent to absorb expansion / contraction strain due to the difference in thermal expansion coefficient with the substrate, and the warp of the substrate during soldering during mounting Is suppressed.

特開平7−78642号公報Japanese Unexamined Patent Publication No. 7-78642

しかしながら、上記従来の技術によれば、基板毎に複数の電源ブスの開発が必要であり、基板の高さ方向に装着スペースが必要である。そのため、電源制御分配基板の低コスト化と小型化が困難である、という問題があった。   However, according to the above conventional technique, it is necessary to develop a plurality of power supply buses for each substrate, and a mounting space is required in the height direction of the substrate. Therefore, there is a problem that it is difficult to reduce the cost and size of the power supply control distribution board.

本発明は、上記に鑑みてなされたものであって、低コスト化と小型化を実現した電源制御分配基板を備えるアンテナ装置を得ることを目的とする。   The present invention has been made in view of the above, and an object of the present invention is to obtain an antenna device including a power supply control distribution board that realizes cost reduction and size reduction.

上述した課題を解決し、目的を達成するために、本発明は、RF信号を送受信する送受信器と、送受信器に接続されて電磁波を送受信する空中線と、空中線に電力を供給する電源器と、空中線に制御信号を送受信する信号処理器とを備える。空中線は、送受信器から送信されたRF信号を分配する給電基板と、厚銅層を有し、電源器から供給された電力及び信号処理器から入力される制御信号を送受信モジュールに分配する電源制御分配基板と、RF信号の位相及び振幅を制御する複数個の送受信モジュールと、送信時には制御されたRF信号を空中に放射して受信時には空中から電磁波を受信する複数個の素子アンテナとを備え、電源制御分配基板は電源器からの電流を厚銅層に流すことを特徴とする。   In order to solve the above-described problems and achieve the object, the present invention includes a transmitter / receiver that transmits / receives an RF signal, an antenna that is connected to the transmitter / receiver and transmits / receives electromagnetic waves, a power supply that supplies power to the antenna, A signal processor for transmitting and receiving control signals to and from the antenna. The antenna has a power supply board that distributes the RF signal transmitted from the transmitter / receiver, and a thick copper layer, and distributes the power supplied from the power supply and the control signal input from the signal processor to the transmission / reception module. A distribution board, a plurality of transmission / reception modules for controlling the phase and amplitude of the RF signal, and a plurality of element antennas for radiating the controlled RF signal in the air at the time of transmission and receiving electromagnetic waves from the air at the time of reception, The power control distribution board is characterized in that the current from the power supply is passed through the thick copper layer.

本発明によれば、低コスト化と小型化を実現した電源制御分配基板を備えるアンテナ装置を得ることができるという効果を奏する。   According to the present invention, there is an effect that it is possible to obtain an antenna device including a power supply control distribution board that realizes cost reduction and size reduction.

実施の形態1に係るアンテナ装置の構成の一例を示す図The figure which shows an example of a structure of the antenna apparatus which concerns on Embodiment 1. FIG. 実施の形態1において、電源制御分配基板を示す図The figure which shows a power supply control distribution board in Embodiment 1. FIG. 実施の形態1において、電源ブスが装着された電源制御分配基板を示す図The figure which shows the power supply control distribution board with which the power supply buses were mounted in Embodiment 1. 実施の形態1において、電源制御分配基板の層構造を示す概略図Schematic showing the layer structure of the power supply control distribution board in the first embodiment 実施の形態2に係るアンテナ装置の構成の一例を示す図The figure which shows an example of a structure of the antenna apparatus which concerns on Embodiment 2. FIG. 実施の形態2において、電源制御分配基板を示す図The figure which shows a power supply control distribution board in Embodiment 2.

以下に、本発明の実施の形態にかかるアンテナ装置を図面に基づいて詳細に説明する。なお、この実施の形態によりこの発明が限定されるものではない。   Hereinafter, an antenna device according to an embodiment of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

実施の形態1.
図1は、本発明の実施の形態1に係るアンテナ装置の構成の一例を示す図である。図1に示すアンテナ装置は、RF信号を送受信する送受信器1と、送受信器1からのRF信号が入力されて電磁波を送信し、空中からの電磁波を受信して送受信器1に出力する空中線2と、空中線2に電力を供給する電源器3と、制御信号を送受信して空中線2を制御する信号処理器4とを備える。空中線2は、送受信器1から入力されたRF信号を分配する給電基板5と、電源器3から供給された電力及び信号処理器4から入力される制御信号を送受信モジュール7−1から7−Nに分配する電源制御分配基板6と、RF信号の位相及び振幅を制御するN個の送受信モジュール7−1から7−Nと、送信時には位相及び振幅が制御されたRF信号を電磁波として空中に放射して受信時には空中から電磁波を受信する素子アンテナ8−1から8−Nとを備える。なお、振幅の制御は、振幅の増幅を含む。
Embodiment 1 FIG.
FIG. 1 is a diagram illustrating an example of a configuration of an antenna device according to Embodiment 1 of the present invention. The antenna device shown in FIG. 1 includes a transmitter / receiver 1 that transmits and receives an RF signal, and an antenna 2 that receives the RF signal from the transmitter / receiver 1 and transmits an electromagnetic wave, receives the electromagnetic wave from the air, and outputs the electromagnetic wave to the transmitter / receiver 1. And a power supply 3 that supplies power to the antenna 2 and a signal processor 4 that transmits and receives control signals to control the antenna 2. The antenna 2 transmits power supply board 5 that distributes the RF signal input from the transmitter / receiver 1, power supplied from the power supply 3 and control signal input from the signal processor 4 to the transmission / reception modules 7-1 to 7-N. A power supply control distribution board 6 that distributes the signals, N transmission / reception modules 7-1 to 7-N that control the phase and amplitude of the RF signal, and an RF signal whose phase and amplitude are controlled during transmission as an electromagnetic wave. Thus, element antennas 8-1 to 8-N that receive electromagnetic waves from the air at the time of reception are provided. The amplitude control includes amplitude amplification.

送受信器1は給電基板5に接続され、電源器3及び信号処理器4は電源制御分配基板6に接続されている。給電基板5の分配端の各々は、N個の送受信モジュール7−1から7−Nの各々と接続され、送受信モジュール7−1から7−Nの各々は、素子アンテナ8−1から8−Nの各々に接続されている。電源制御分配基板6の分配端の各々は、N個の送受信モジュール7−1から7−Nの各々に接続されている。   The transceiver 1 is connected to a power supply board 5, and the power supply 3 and the signal processor 4 are connected to a power supply control distribution board 6. Each of the distribution ends of the power supply board 5 is connected to each of the N transmission / reception modules 7-1 to 7-N, and each of the transmission / reception modules 7-1 to 7-N includes the element antennas 8-1 to 8-N. Connected to each. Each distribution end of the power supply control distribution board 6 is connected to each of the N transmission / reception modules 7-1 to 7-N.

図2は、電源制御分配基板6を示す図である。図2(A)は、図1の電源制御分配基板6の概略構成を示す側面図であり、図2(B)は、図1の電源制御分配基板6を示す斜視図である。図2(A)に示す電源制御分配基板6は、厚銅層を有し、厚銅層を有するプリント配線基板(PWB:Printed Wiring Board)11と、信号処理器4と制御信号を送受信する信号配線12と、電源器3からの電力供給が行われる電源配線13A,13Bと、送受信モジュール7−1から7−Nへの接続部14−1から14−Nとを備える。   FIG. 2 is a diagram showing the power supply control distribution board 6. 2A is a side view showing a schematic configuration of the power supply control distribution board 6 in FIG. 1, and FIG. 2B is a perspective view showing the power supply control distribution board 6 in FIG. A power supply control distribution board 6 shown in FIG. 2A has a thick copper layer, a printed wiring board (PWB) 11 having a thick copper layer, and a signal that transmits and receives control signals to and from the signal processor 4. The wiring 12 is provided with power supply wirings 13A and 13B for supplying power from the power supply 3, and connection portions 14-1 to 14-N to the transmission / reception modules 7-1 to 7-N.

図3は、電源ブスが装着された電源制御分配基板20を示す図である。図3は、図2の比較例である。図3に示す電源ブスが装着された電源制御分配基板20は、厚銅層を有する電源ブス用のPWB21と、信号処理器4と制御信号を送受信する信号配線22と、電源器3からの電力供給が行われる電源配線23A,23Bと、送受信モジュール7−1から7−Nへの接続部24−1から24−Nと、電源ブス25−1から25−12とを備える。電源ブスが装着された電源制御分配基板20では、電源器3からの電源配線23A,23B及び電源ブス25−1から25−12を介してPWB21に流れた大電流が、接続部24−1から24−Nに供給される。   FIG. 3 is a diagram illustrating the power control distribution board 20 on which the power supply buses are mounted. FIG. 3 is a comparative example of FIG. The power supply control distribution board 20 to which the power supply buses shown in FIG. 3 are attached includes a PWB 21 for power supply buses having a thick copper layer, a signal wiring 22 for transmitting / receiving control signals to / from the signal processor 4, and power from the power supply 3 Power supply wirings 23A and 23B to be supplied, connection portions 24-1 to 24-N to transmission / reception modules 7-1 to 7-N, and power supply buses 25-1 to 25-12 are provided. In the power supply control distribution board 20 to which the power supply buses are attached, a large current that has flowed to the PWB 21 via the power supply wirings 23A and 23B and the power supply buses 25-1 to 25-12 from the power supply unit 3 is supplied from the connection unit 24-1. 24-N.

厚銅層を有する電源制御分配基板6では、大電流は厚銅層を有するPWB11に直接流れ、接続部14−1から14−Nに供給される。   In the power supply control distribution board 6 having the thick copper layer, a large current flows directly to the PWB 11 having the thick copper layer, and is supplied to the connecting portions 14-1 to 14-N.

図4は、電源制御分配基板6の層構造を示す概略図である。図4に示す電源制御分配基板6は、厚銅層である層L9から層L12で構成されて大電流を流すことが可能な大電流電源系統層30と、大電流を要さない他の電源系統層及び各種制御信号が流れるパターン層であり、大電流電源系統層30を挟持する小電流層31A,31Bとを備える。なお、小電流層31Aは、層L1からL8で構成され、小電流層31Bは、層L13からL20で構成されている。なお、層L1からL20では、隣接する層間は絶縁されている。   FIG. 4 is a schematic diagram showing the layer structure of the power supply control distribution board 6. The power supply control distribution board 6 shown in FIG. 4 is composed of layers L9 to L12, which are thick copper layers, and can supply a large current power system layer 30 capable of flowing a large current, and other power supplies that do not require a large current. It is a pattern layer through which a system layer and various control signals flow, and includes small current layers 31A and 31B that sandwich a large current power system layer 30. The small current layer 31A is composed of layers L1 to L8, and the small current layer 31B is composed of layers L13 to L20. In the layers L1 to L20, adjacent layers are insulated.

図4において、大電流を要する大電流電源系統層30は、薄い銅箔層である小電流層31A,31Bよりも厚く形成されており、大電流電源系統層30としては、240μm以上の厚い銅箔層を例示することができる。また、導体損失を低減するために大電流電源系統層30には往路及び復路が各々2層ずつ割り当てられている。これにより、図3の比較例における電源ブス25−1から25−12の使用時と同等の損失で大電流を流すことができる。   In FIG. 4, the large current power system layer 30 that requires a large current is formed thicker than the small current layers 31A and 31B, which are thin copper foil layers, and the large current power system layer 30 is a thick copper of 240 μm or more. A foil layer can be illustrated. In order to reduce conductor loss, two layers each of the forward path and the return path are assigned to the large current power supply system layer 30. Thereby, a large current can be caused to flow with a loss equivalent to that when the power supply buses 25-1 to 25-12 in the comparative example of FIG. 3 are used.

また、図4に示すように、往路である層L9,L11と復路である層L10,L12とが交互に配置されており、往路と復路とを隣接させることで電磁干渉を抑えることができ、電源ブスを使用したときよりもEMC(Electro Magnetic Compatibility)対処能力を向上させることができる。   Further, as shown in FIG. 4, the layers L9 and L11 that are the forward path and the layers L10 and L12 that are the return path are alternately arranged, and the electromagnetic interference can be suppressed by adjoining the forward path and the return path, EMC (Electro Magnetic Compatibility) coping ability can be improved more than when the power supply bus is used.

実施の形態2.
図5は、本発明の実施の形態2に係るアンテナ装置の構成の一例を示す図である。図5に示すアンテナ装置は、空中線2を空中線2aに置き換えた点が図1に示すアンテナ装置と異なる。空中線2aは、電源制御分配基板6aを備え、電源制御分配基板6aはエネルギーバンク60を有する。図5に示すアンテナ装置のその他の構成は、図1に示すアンテナ装置の構成と同じである。
Embodiment 2. FIG.
FIG. 5 is a diagram showing an example of the configuration of the antenna device according to Embodiment 2 of the present invention. The antenna device shown in FIG. 5 is different from the antenna device shown in FIG. 1 in that the antenna 2 is replaced with the antenna 2a. The antenna 2a includes a power control distribution board 6a, and the power control distribution board 6a includes an energy bank 60. The other configuration of the antenna device shown in FIG. 5 is the same as that of the antenna device shown in FIG.

図6は、電源制御分配基板6aを示す図である。図6(A)は、図5に示す電源制御分配基板6aの概略構成を示す側面図であり、図6(B)は、図5に示す電源制御分配基板6aを示す斜視図である。図6(A)に示す電源制御分配基板6aは、厚銅層を有するPWB11と、信号処理器4と制御信号を送受信する信号配線12と、電源器3からの電力供給が行われる電源配線13A,13Bと、送受信モジュール7−1から7−Nへの接続部14−1から14−Nと、コンデンサ群41とを備える。   FIG. 6 is a diagram showing the power supply control distribution board 6a. 6A is a side view showing a schematic configuration of the power supply control distribution board 6a shown in FIG. 5, and FIG. 6B is a perspective view showing the power supply control distribution board 6a shown in FIG. The power control distribution board 6a shown in FIG. 6A includes a PWB 11 having a thick copper layer, a signal wiring 12 that transmits and receives control signals to and from the signal processor 4, and a power wiring 13A that is supplied with power from the power supply 3. , 13B, connection portions 14-1 to 14-N to the transmission / reception modules 7-1 to 7-N, and a capacitor group 41.

コンデンサ群41は、図5に示すエネルギーバンク60に相当し、図3において電源ブス25−1から25−12が占有しているスペースに配されている。図5に示すアンテナ装置がレーダである場合には電源のパルス駆動を要する。しかしながら、エネルギーバンクを備えない構成では、電源の急峻な立ち上がりに対して、電源器3から送受信モジュール7−1から7−Nへの電流応答が間に合わず、電圧にサグが発生する。このようにコンデンサ群によるエネルギーバンクが設けられると、送受信モジュール7−1から7−Nに供給するための電荷を蓄積することができ、電源の急峻な立ち上がりに対しても対応することができる。   Capacitor group 41 corresponds to energy bank 60 shown in FIG. 5, and is arranged in the space occupied by power supply buses 25-1 to 25-12 in FIG. When the antenna device shown in FIG. 5 is a radar, pulse driving of the power supply is required. However, in the configuration without the energy bank, the current response from the power supply 3 to the transmission / reception modules 7-1 to 7-N is not in time for the sudden rise of the power supply, and the voltage sags. Thus, when the energy bank by the capacitor group is provided, the charge to be supplied to the transmission / reception modules 7-1 to 7-N can be accumulated, and it is possible to cope with the sudden rise of the power supply.

以上の実施の形態に示した構成は、本発明の内容の一例を示すものであり、別の公知の技術と組み合わせることも可能であるし、本発明の要旨を逸脱しない範囲で、構成の一部を省略、変更することも可能である。   The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

1 送受信器、2,2a 空中線、3 電源器、4 信号処理器、5 給電基板、6,6a,20 電源制御分配基板、7−1から7−N 送受信モジュール、8−1から8−N 素子アンテナ、11,21 PWB、12,22 信号配線、13A,13B,23A,23B 電源配線、14−1から14−N,24−1から24−N 接続部、25−1から25−12 電源ブス、30 大電流電源系統層、31A,31B 小電流層、41 コンデンサ群、60 エネルギーバンク。   DESCRIPTION OF SYMBOLS 1 Transmitter / receiver, 2, 2a Aerial line, 3 Power supply, 4 Signal processor, 5 Power supply board, 6, 6a, 20 Power supply control distribution board, 7-1 to 7-N Transmission / reception module, 8-1 to 8-N element Antenna, 11, 21 PWB, 12, 22 signal wiring, 13A, 13B, 23A, 23B power wiring, 14-1 to 14-N, 24-1 to 24-N connection, 25-1 to 25-12 power bus , 30 Large current power system layer, 31A, 31B Small current layer, 41 Capacitor group, 60 Energy bank.

Claims (3)

RF信号を送受信する送受信器と、
前記送受信器に接続されて電磁波を送受信する空中線と、
前記空中線に電力を供給する電源器と、
前記空中線に制御信号を送受信する信号処理器とを備え、
前記空中線は、
前記送受信器から送信された前記RF信号を分配する給電基板と、
厚銅層を有し、前記電源器から供給された電力及び前記信号処理器から入力される前記制御信号を送受信モジュールに分配する電源制御分配基板と、
前記RF信号の位相及び振幅を制御する複数個の送受信モジュールと、
送信時には制御された前記RF信号を空中に放射して受信時には空中から電磁波を受信する複数個の素子アンテナとを備え、
前記電源制御分配基板は前記電源器からの電流を前記厚銅層に流すことを特徴とするアンテナ装置。
A transceiver for transmitting and receiving RF signals;
An antenna that is connected to the transceiver to transmit and receive electromagnetic waves;
A power supply for supplying power to the antenna;
A signal processor for transmitting and receiving control signals to the antenna,
The antenna is
A power supply board for distributing the RF signal transmitted from the transceiver;
A power control distribution board that has a thick copper layer and distributes the power supplied from the power supply and the control signal input from the signal processor to a transmission / reception module;
A plurality of transceiver modules for controlling the phase and amplitude of the RF signal;
A plurality of element antennas that radiate the controlled RF signal into the air during transmission and receive electromagnetic waves from the air during reception;
The antenna apparatus according to claim 1, wherein the power supply control distribution board passes a current from the power supply to the thick copper layer.
前記電源制御分配基板がエネルギーバンクを有することを特徴とする請求項1に記載のアンテナ装置。   The antenna device according to claim 1, wherein the power control distribution board has an energy bank. 前記エネルギーバンクはコンデンサ群であることを特徴とする請求項2に記載のアンテナ装置。   The antenna device according to claim 2, wherein the energy bank is a capacitor group.
JP2015256726A 2015-12-28 2015-12-28 Antenna device Active JP6521857B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015256726A JP6521857B2 (en) 2015-12-28 2015-12-28 Antenna device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015256726A JP6521857B2 (en) 2015-12-28 2015-12-28 Antenna device

Publications (2)

Publication Number Publication Date
JP2017120989A true JP2017120989A (en) 2017-07-06
JP6521857B2 JP6521857B2 (en) 2019-05-29

Family

ID=59272488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015256726A Active JP6521857B2 (en) 2015-12-28 2015-12-28 Antenna device

Country Status (1)

Country Link
JP (1) JP6521857B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7515313B2 (en) 2020-06-24 2024-07-12 三菱電機株式会社 Antenna Device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59112163U (en) * 1982-08-17 1984-07-28 三菱電機株式会社 power bus board
JPH0254265U (en) * 1988-10-13 1990-04-19
JPH0794838A (en) * 1993-09-22 1995-04-07 Furukawa Electric Co Ltd:The Large current circuit board
JPH10321971A (en) * 1997-05-15 1998-12-04 Furukawa Electric Co Ltd:The Circuit board
JP2001085801A (en) * 1999-09-10 2001-03-30 Matsushita Electric Ind Co Ltd Circuit board for high current/high voltage and its manufacturing method
JP2011108704A (en) * 2009-11-13 2011-06-02 Nec Corp Printed wiring board and method of manufacturing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59112163U (en) * 1982-08-17 1984-07-28 三菱電機株式会社 power bus board
JPH0254265U (en) * 1988-10-13 1990-04-19
JPH0794838A (en) * 1993-09-22 1995-04-07 Furukawa Electric Co Ltd:The Large current circuit board
JPH10321971A (en) * 1997-05-15 1998-12-04 Furukawa Electric Co Ltd:The Circuit board
JP2001085801A (en) * 1999-09-10 2001-03-30 Matsushita Electric Ind Co Ltd Circuit board for high current/high voltage and its manufacturing method
JP2011108704A (en) * 2009-11-13 2011-06-02 Nec Corp Printed wiring board and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7515313B2 (en) 2020-06-24 2024-07-12 三菱電機株式会社 Antenna Device

Also Published As

Publication number Publication date
JP6521857B2 (en) 2019-05-29

Similar Documents

Publication Publication Date Title
JP2966949B2 (en) Module transmitter
EP2283542B1 (en) Dual beam dual selectable polarization antenna
US5459474A (en) Active array antenna radar structure
US20070152882A1 (en) Phased array antenna including transverse circuit boards and associated methods
JP4844554B2 (en) Antenna device
JP5377671B2 (en) Microstrip antenna and radar module
US10879598B2 (en) Antenna unit
JP2012151829A (en) Flexible printed wiring board and radio communication module
US20200153114A1 (en) Planar array antenna and wireless module
WO2019187758A1 (en) Array antenna
WO2018135003A1 (en) Phased array antenna
US20150200445A1 (en) Antenna Co-Located with PCB Electronics
JP6067445B2 (en) Radar equipment
JP2017120989A (en) Antenna device
CN109687100A (en) Wherein there is the antenna for base station component of the feeder panel of the passive intermodulation distortion with reduction
CN113287228B (en) Cooling in waveguide devices
KR102147954B1 (en) Phase shifting apparatus and antenna having the same
JP6967410B2 (en) Wireless module
RU2681370C2 (en) Anti-lightning-combined-stripline-circuit system
WO2021079361A1 (en) Antenna-on-package array
US12003042B2 (en) Structure for distributing radio frequency signals
JP6086383B2 (en) Thinned-out array antenna device
JP6707889B2 (en) Waveguide communication system
FI127074B (en) Coupling arrangement and coupling procedure
JP2014175773A (en) Array antenna device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20171227

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20181102

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20181120

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190117

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190326

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190423

R150 Certificate of patent or registration of utility model

Ref document number: 6521857

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250