JP2017109295A - Polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing device capable of maintaining high polishing accuracy, and reducing abrasion of the device itself.SOLUTION: A polishing wire 10 stretched between a plurality of wheels 20 is supported by an auxiliary wire 13 abutting on and running parallel to the polishing wire 10, and movement and deflection to a longitudinal direction crossing a traveling direction are suppressed by the auxiliary wire 13. Hereby, high polishing accuracy can be maintained, and abrasion of a device itself can be reduced.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a polishing apparatus that performs profile polishing.

  2. Description of the Related Art Conventionally, a polishing apparatus that performs profile polishing uses a polishing method in which a disk-shaped rotating grindstone is gradually moved while being in contact with a workpiece. As a polishing tool used in this type of polishing apparatus, for example, a rotary dressing tool including a brazing diamond layer (see Patent Document 1) is used.

  As a polishing tool using a polishing wire instead of a disk-shaped rotary dressing tool, a wire polishing apparatus and a wire polishing method (see Patent Document 2) have been proposed. Moreover, as a thing using a diamond wire as a grinding | polishing wire, the grinding | polishing method and apparatus of a cutting blade (refer patent document 3) are proposed.

  The polishing tool described in Patent Document 1 is configured as a rotary dressing tool having a polishing rim on the outer peripheral edge. As a processing example using this rotary dressing tool, a processing example for reshaping the profile surface of the polishing wheel It is shown.

  The wire polishing apparatus described in Patent Document 2 takes into account that the workpiece supported in a cantilever manner bends downward as it goes from the base end portion supported in a cantilever manner to the distal end portion. In addition, as the polishing wire moves from the base end portion to the tip end portion while polishing, the processing load of the polishing wire pressing the workpiece is reduced.

  That is, the size of the processing load applied to the workpiece from the polishing wire is adjusted so as to correspond to the bending curve in the length direction from the base end portion to the tip end portion of the workpiece supported by the cantilever. Decreasing as you go. As a result, the machining load and the reaction force from the workpiece when the machining load is applied can be balanced over the length of the workpiece, and the workpiece can be uniformly polished. It is configured to be able to.

  In the polishing apparatus described in Patent Document 3, a diamond wire to which diamond abrasive grains are fixed is used, and the diamond wire is caused to travel between two guide rollers. And it is the structure grind | polished with the diamond wire which drive | works the workpiece distribute | arranged between the two guide rollers.

JP 2005-131784 A JP 2014-8590 A Japanese Patent Laid-Open No. 2003-117781

  In the configuration using the polishing tool described in Patent Document 1, the rotating rotary dressing tool is in contact with the workpiece for a long time, and high heat is generated in the rotary dressing tool. This causes a problem that the workpiece is deformed. Further, since the rotary dressing tool itself is configured to come into contact with the workpiece only on the outer peripheral surface, the rotary dressing tool itself is worn during polishing and the outer peripheral diameter thereof changes. As a result, the problem that processing accuracy falls also arises.

  In the wire polishing apparatus described in Patent Document 2, since the workpiece is polished while the polishing wire is traveling, the portion of the polishing wire that is in contact with the workpiece is the traveling of the polishing wire. Along with this, it will move sequentially. Therefore, the above-mentioned problem in the rotary polishing tool can be solved.

However, because of the configuration using a flexible polishing wire, when a processing load is applied to the workpiece, the polishing wire itself is deformed by a reaction force from the workpiece. When the polishing wire is deformed by the reaction force from the workpiece, the magnitude of the processing load also changes, and the workpiece cannot be uniformly polished by the polishing wire. Further, the polishing wire does not contact the workpiece in the tangential direction, and the workpiece is polished by the deformed curved portion, so that accurate profile polishing cannot be performed.
With respect to the deformation of the polishing wire due to the reaction force from the workpiece, Patent Document 2 does not disclose or suggest a problem recognition or a solution to the deformation of the polishing wire.

  Patent Document 3 discloses a configuration in which polishing is performed using a diamond wire, but the diamond wire is also deformed by a reaction force from the workpiece as in the case of the polishing wire in Patent Document 2 described above. become. However, even in Patent Document 3, there is neither disclosure nor suggestion of recognition regarding a problem that a diamond wire is deformed by a reaction force and a solution to the problem.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a polishing apparatus that can maintain high polishing accuracy and can reduce wear of the polishing tool itself.

In order to solve the above problems, a polishing apparatus according to the present invention includes a polishing wire in which abrasive grains are dispersed and fixed on a surface, a wire traveling mechanism that stretches between a plurality of wheels and causes the polishing wire to travel, and A long auxiliary wire that contacts the polishing wire and runs parallel to the polishing wire at a constant speed;
The main feature is that the auxiliary wire has a shape that restricts the movement of the polishing wire in the left-right direction intersecting the traveling direction of the polishing wire and suppresses the bending of the polishing wire.

  In the polishing apparatus according to the present invention, profile polishing can be performed using a polishing wire, high polishing accuracy can be maintained, and wear of the polishing tool itself can be reduced.

It is a schematic diagram which shows the principal part front of a grinding | polishing processing apparatus. (Example 1) It is sectional drawing which shows the relationship between the polishing wire in the AA cross section of FIG. 1, an auxiliary wire, and a wheel, Comprising: The structure (a) which has arrange | positioned the abrasive grain to the perimeter surface of the polishing wire, and auxiliary wire as a core wire of a polishing wire The configuration (b) using the, and the configuration (c) in which the abrasive grains are arranged only on the polishing surface of the polishing wire are shown. (Example 1) It is the schematic which shows the principal part front of the grinding | polishing processing apparatus which comprised the polishing wire and the auxiliary wire separately. (Example 1) It is a schematic diagram which shows the principal part front in the modification of a grinding | polishing processing apparatus. (Example 1) It is a schematic diagram which shows the principal part front of a grinding | polishing processing apparatus. (Example 2) FIG. 6 is a cross-sectional view showing the relationship between the polishing wire, the auxiliary wire, and the wheel in the BB cross section of FIG. 5, a configuration (a) in which abrasive grains are arranged on the entire peripheral surface of the polishing wire, and an auxiliary wire as a core wire of the polishing wire The configuration (b) using the, and the configuration (c) in which the abrasive grains are arranged only on the polishing surface of the polishing wire are shown. (Example 2) It is the schematic which shows the principal part front of the grinding | polishing processing apparatus which comprised the polishing wire and the auxiliary wire separately. (Example 2) It is a schematic diagram which shows the principal part front of a grinding | polishing processing apparatus. Example 3 It is explanatory drawing which shows the relationship between the grinding | polishing wire and wheel in the AA cross section of FIG. It is explanatory drawing which shows the relationship between the grinding | polishing wire and wheel in the AA cross section of FIG. (Reference example)

Embodiment 1 of a polishing apparatus according to the present invention will be specifically described below with reference to the accompanying drawings. As the polishing apparatus according to the present invention, any shape and configuration that can solve the problems of the present invention can be adopted. Therefore, the present invention is not limited to the configuration of the embodiment described below, and various modifications are possible.
Further, in the description of each embodiment, the same member is denoted by the same reference numeral for the same member, and redundant description is omitted.

  The configuration of the first embodiment of the polishing apparatus according to the present invention will be described with reference to FIGS. In FIG. 1, the workpiece 1 is gripped by a chuck provided in the moving mechanism 3, and is profiled between the three wheels 20 in order to perform profile processing on the tip of the workpiece 1. Further, the polishing wire 10 is stretched. An appropriate wheel of the three wheels 20 can be configured as a drive wheel, and the polishing wire 10 stretched between the wheels 20 can run in a clockwise direction or a counterclockwise direction.

  The moving mechanism 3 can rotate the workpiece 1 around its rotation axis by rotating the chuck, and can move the workpiece 1 along the rotation axis or be orthogonal to the rotation axis. Or move in the direction.

  In the illustrated example, the polishing wire 10 is configured to be able to polish the outer peripheral edge of the workpiece 1 by traveling along the longitudinal direction of the outer periphery of the workpiece 1, as shown in FIG. 4. As described above, the polishing wire 10 can be configured to run in a direction orthogonal to the longitudinal direction of the workpiece 1, that is, in a direction perpendicular to the paper surface. Further, the wheel 20 can be configured to move in a direction orthogonal to the rotation axis.

  In addition, although the illustration example of the structure is abbreviate | omitted as the wire traveling mechanism 18 which moves the wheel 20 with the grinding | polishing wire 10 and the auxiliary wire 13 in the direction orthogonal to the said rotating shaft, it is well-known conventionally. The polishing tool moving mechanism can be used, and its illustration is omitted.

  By causing the polishing wire 10 to travel along the longitudinal direction of the outer periphery of the workpiece 1, the polishing portion of the workpiece 1 can be polished linearly. If the workpiece 1 has a cylindrical shape, the workpiece 1 is polished linearly with the polishing wire 10, and the workpiece 1 is driven to rotate by sequentially driving the moving mechanism 3 to rotate the workpiece 1. The polishing location of the object 1 can be polished over the entire circumference.

  In the following description of the embodiment, a configuration using a diamond wire as the polishing wire 10 will be described. However, the polishing wire 10 according to the present invention is not limited to the diamond wire, and the material of the workpiece 1 is not limited to this. It is possible to use a polishing wire 10 in which abrasive grains capable of performing appropriate polishing are dispersed and fixed. As the abrasive grains for that purpose, for example, diamond grains, CBN grains (cubic boron nitride grains), Si grains (silicon carbide grains), or the like can be used.

  As a cross-sectional shape of the polishing wire 10, cross-sectional shapes as shown in FIGS. 2A to 2C, which are AA cross-sectional views of FIG. 1, can be provided. FIG. 2A shows a shape in which an abrasive grain fixing portion 12 to which diamond grains are fixed is formed on the outer peripheral surface of the core wire 11a of the polishing wire 10, and FIG. 2B shows an auxiliary wire 13 to be described later. 3 shows a shape in which the core wire 11b of the polishing wire 10 is formed and the abrasive grain fixing portion 12 is formed only on the polishing surface and part of the polishing wire 10 in the core wire 11b. FIG. 2C shows a shape in which the abrasive grain fixing portion 12 is formed only on the polishing surface and the portion of the polishing wire 10 in the core wire 11b. The configuration in which the core wire 11b of the polishing wire 10 is formed by the auxiliary wire 13 is not limited to the configuration shown in FIG. 2B, but may be configured as shown in FIG.

  As shown in FIG. 1 and FIGS. 2A to 2C, the polishing wire 10 has a surface opposite to the polishing surface of the polishing wire 10 in order to suppress bending of the polishing wire 10. Auxiliary wire 13 is provided that contacts and prevents bending of polishing wire 10 at least in the polishing region.

  By running the auxiliary wire 13 integrally with the polishing wire 10, it is possible to prevent the polishing wire 10 from coming into direct contact with the wheel 20, and the guide groove of the wheel 20 is polished and worn by the polishing wire 10. Can be prevented.

  That is, as shown in FIG. 10 as a reference diagram, when the polishing wire 10 is directly supported by the wheel 20, the guide groove 21 of the wheel 20 is polished by the traveling polishing wire 10.

  In the case of FIG. 1, the wheel 20 disposed in the polishing region and the auxiliary wire 13 supported by the wheel 20 are configured to suppress the bending of the polishing wire 10 and perform precise polishing. Yes. The wheel 20 disposed in the polishing region also functions as a support member that suppresses deformation of the polishing wire 10 and the auxiliary wire 13.

  The auxiliary wire 13 has a desired thickness in the vertical direction in order to suppress the bending of the polishing wire 10. One end surface of the auxiliary wire 13 that is in contact with the polishing wire 10 is formed in a concave shape so as to support the core wire 11a of the polishing wire 10, and the concave shape is the entire surface of a substantially semicircular surface on the outer peripheral surface of the polishing wire 10. Can abut.

  The concave inner surface shape formed on the end surface of the auxiliary wire 13 is formed in a shape that follows the outer peripheral surface shape of the polishing wire 10, and the pair of end edges 15 in the inner surface shape causes the polishing wire 10 to be During traveling, it is prevented from moving while shaking in the left-right direction intersecting the traveling direction.

  Further, the other end surface side of the auxiliary wire 13 is formed in a quadrangular shape in order to increase the contact area with the wheel 20. By causing the auxiliary wire 13 to travel integrally with the polishing wire 10, the polishing wire 10 can be prevented from coming into direct contact with the wheel 20, and wear of the wheel 20 can be prevented. For this reason, the auxiliary wire 13 can be made of a material that is less worn against the wheel 20 and that can receive the driving force from the driving wheel 20. For example, a resin material or the like can be used as the auxiliary wire 13.

  Among the three wheels 20 in FIG. 1, a friction preventing member 14 is provided in the guide groove 21 of the driven wheel excluding the drive wheel in order to reduce the sliding resistance generated between the auxiliary wire 13. As the drive wheel, the wheel 20 disposed at a position close to the workpiece 1 is configured as a drive wheel, or the wheel disposed at a position separated from the workpiece 1 is configured as a drive wheel. You can also. Or the some wheel 20 can also be comprised as a drive wheel.

Each wheel 20 is configured to include a rotation shaft 22 and a stopper 26 fixed to the rotation shaft 22, and FIG. 2 illustrates a configuration as a drive wheel. That is, the drive wheel is fixed to the rotating shaft 22 and can drive the auxiliary wire 13 and the polishing wire 10 in the longitudinal direction by the driving force from the rotating shaft 22.
Although not shown, the driven wheel of the wheel 20 is rotatably supported by the rotating shaft 22 in a form sandwiched between a pair of stoppers 26 fixed to the rotating shaft 22.

  FIG. 1 shows a configuration example in which the polishing wire 10 and the auxiliary wire 13 are integrally configured. However, as shown in FIG. 3, the polishing wire 10 and the auxiliary wire 13 are configured separately. You can also. For example, the polishing wire 10 is integrally wound with the auxiliary wire 13 in the polishing region while being rewound from one winding / rewinding reel 23 wound and wound on the other winding / rewinding reel 24. It can be run. The winding / rewinding reels 23 and 24 are driven forward and backward by the drive shaft 25.

  When the rewinding from one winding / rewinding reel 23 is completed, the rewinding is performed from the other winding / rewinding reel 24 and the one winding / rewinding reel 23 performs the rewinding. By doing so, the polishing wire 10 can be run in both directions. As a result, the polishing wire 10 can be repeatedly traveled in both directions to polish the workpiece 1. In the configuration according to the first embodiment, the workpiece 1 can be polished in a dot shape, so that an effect as a polishing process for a fine portion can be achieved.

  The configuration of the second embodiment according to the present invention will be described with reference to FIGS. In the first embodiment, the configuration of a polishing apparatus that polishes the workpiece 1 with the polishing wire 10 while supporting the polishing wire 10 and the auxiliary wire 13 with the wheel 20 disposed at the polishing location with respect to the workpiece 1 will be described. It was. In Example 2 according to the present invention, the polishing wire 10 and the auxiliary wire 13 are stretched between a pair of wheels 20a, 20b disposed on the workpiece 1 side, and the workpiece 1 is stretched by the stretched polishing wire 10. The configuration of a polishing apparatus that performs polishing in the longitudinal direction will be described.

  In addition, although the illustration example of the structure is abbreviate | omitted as the wire traveling mechanism 18 which moves the wheel 20 to the direction which adjoins with respect to the to-be-processed object 1 with the polishing wire 10 and the auxiliary wire 13, from the former A known polishing tool moving mechanism can be used, and its illustration is omitted.

  And in order to suppress the deformation | transformation of the grinding | polishing wire 10 and the auxiliary wire 13 between a pair of wheels 20a and 20b, the guide board 30 as a supporting member is arrange | positioned along the running direction of the grinding | polishing wire 10 and the auxiliary wire 13. As shown in FIG. Yes. The surface of the guide plate 30 is provided with a friction preventing member 14 for reducing the frictional force with the auxiliary wire 13. Moreover, a friction preventing member can be configured in each guide groove 31 of the pair of wheels 20a and 20b as necessary.

Other configurations in the second embodiment are the same as the configurations in the first embodiment, and the same components as those in the first embodiment are denoted by the same reference numerals, and redundant description is omitted.
FIG. 5 shows a configuration in which the polishing wire 10 and the auxiliary wire 13 are endlessly stretched around four wheels 20, and an appropriate wheel 20 of the four wheels 20 is configured as a driving wheel and a driven wheel. I can leave.

  By rotating the drive wheel forward and backward, the polishing wire 10 stretched between the wheels 20 can run in the clockwise direction or the counterclockwise direction. Each wheel 20 has the same configuration as that described in the first embodiment, and driving the driving wheel among the wheels 20 allows the polishing wire 10 and the auxiliary wire 13 to travel integrally. it can.

As a structure of the polishing wire 10 and the auxiliary wire 13, it can be set as the structure in any of Fig.6 (a)-FIG.6 (c). The configuration of the polishing wire 10 and the auxiliary wire 13 shown in FIGS. 6A to 6C is the same as the configuration shown in FIG.
The polishing position can be moved by moving either the workpiece 1 or the wire traveling mechanism 18 of the polishing wire 10.

  The relationship between the guide plate 30, the polishing wire 10 and the auxiliary wire 13 is configured as shown in FIGS. 6 (a) to 6 (c). In the illustrated example, the thickness of the guide plate 30 is a configuration example having a thickness substantially equal to the diameter of the wheel 20, but depending on the rigidity of the guide plate 30, the support structure that supports the guide plate 30, and the like. The plate thickness of the guide plate 30 can be set to an appropriate plate thickness that can suppress deformation of the polishing wire 10 and the auxiliary wire 13.

  In order to suppress the movement of the auxiliary wire 13 in the left-right direction with respect to the traveling direction of the auxiliary wire 13, a guide groove 31 extending along the traveling direction of the auxiliary wire 13 can be formed.

  FIG. 5 shows a configuration example in which the polishing wire 10 and the auxiliary wire 13 are integrally configured. However, as shown in FIG. 7, the polishing wire 10 and the auxiliary wire 13 are configured separately. You can also. For example, the polishing wire 10 is unwound from one winding / rewinding reel 23 that is wound, and is wound on the other winding / rewinding reel 24 while being polished between the pair of wheels 20a, 20b. Then, it can be made to travel integrally with the auxiliary wire 13. The winding / rewinding reels 23 and 24 are driven forward and backward by the drive shaft 25.

  When the rewinding from one winding / rewinding reel 23 is completed, the rewinding is performed from the other winding / rewinding reel 24 and the one winding / rewinding reel 23 performs the rewinding. By doing so, the polishing wire 10 can travel in both directions. Thereby, the polishing wire 10 can be repeatedly traveled in both directions, and the workpiece 1 can be efficiently polished.

  By configuring as in the second embodiment, the workpiece 1 can be polished linearly at a time, and a wide range of polished surfaces can be efficiently polished.

  The configuration of the second embodiment according to the present invention will be described with reference to FIG. In the first and second embodiments, the configuration of the polishing apparatus that polishes the outer peripheral surface of the workpiece 1 has been described. In Example 3 according to the present invention, the configuration of a polishing apparatus that polishes the inner surface of the through hole 2 formed in the workpiece 1 will be described.

  Other configurations in the third embodiment are the same as the configurations in the second embodiment, and the same components as those in the second embodiment are denoted by the same reference numerals, and redundant description is omitted. 8 shows a configuration in which the polishing wire 10 and the auxiliary wire 13 are arranged endlessly, but the polishing wire 10 is configured separately from the auxiliary wire 13 as shown in FIG. It can also be left.

  In this case, a winding wire / rewinding reel similar to the winding / rewinding reels 23 and 24 shown in FIG. It is desirable to arrange it.

  In addition, although the illustration example of the structure is abbreviate | omitted as the wire traveling mechanism 18 which moves the wheel 20 to the direction which adjoins with respect to the to-be-processed object 1 with the polishing wire 10 and the auxiliary wire 13, from the former A known polishing tool moving mechanism can be used, and its illustration is omitted.

  As shown in FIG. 8, even when the inner surface polishing in the through hole 2 of the workpiece 1 is performed, it can be configured at least similar to the configuration of Example 2 shown in FIGS. The polishing wire 10 is stretched in a closed loop via four wheels 20. Of the four wheels 20, the polishing wheel 10 and the auxiliary wire 13 can be caused to travel integrally by rotating the drive wheel.

In order to suppress deformation of the polishing wire 10 and the auxiliary wire 13 in the polishing region, a part of the guide plate 32 is also inserted into the through hole 2. When the guide plate 32 cannot be inserted into the through hole 2, the guide plate 32 is arranged in the vicinity of the entrance and the exit of the through hole 2, and the polishing wire 10 and the auxiliary wire are provided at the polishing location. It can comprise so that 13 may not deform | transform. The friction preventing member 14 can be formed on the surface of the guide plate 32 that is brought into sliding contact with the auxiliary wire 13 in contact therewith.
The polishing position can be moved by operating either the moving mechanism 3 or the wire traveling mechanism.

  In each of the above-described embodiments, the polishing wire 10 is stretched in an endless closed loop and polished, or the polishing wire 10 is rewound and wound from a winding / rewinding reel wound up in a coil shape. Although the configuration has been described by way of example, the configuration of the embodiment according to the present invention is not limited to these configurations, and a configuration in which the polishing wire 10 is reciprocated with both ends of the polishing wire 10 fixed is also possible. Can be adopted.

  As described above, in the polishing apparatus according to the present invention, wear of the wheel and guide plate that supports the traveling polishing wire is prevented, and the traveling path is also prevented from being shaken in the left-right direction while the polishing wire is traveling. Therefore, the maintenance and inspection of the polishing apparatus can be facilitated, and the accuracy of the polishing process can be improved.

  The technology according to the present invention can be used as a polishing apparatus that performs polishing using a traveling polishing wire.

  DESCRIPTION OF SYMBOLS 1 ... Workpiece, 2 ... Through-hole, 3 ... Movement mechanism, 10 ... Polishing wire, 11, 11a, 11c ... Core wire, 11b ... Core wire which served as auxiliary wire, DESCRIPTION OF SYMBOLS 12 ... Abrasive fixed part, 13 ... Auxiliary wire, 14 ... Friction prevention member, 15 ... End edge part, 18 ... Wire travel mechanism, 20, 20a, 20b ... Wheel, 21... Guide groove, 22... Rotating shaft, 23 and 24... Winding / rewinding reel, 25... Rotating shaft, 26. -Guide groove, 32 ... guide plate.

Claims (8)

A polishing wire having abrasive grains dispersed and fixed on the surface;
A wire traveling mechanism that stretches between a plurality of wheels and travels the polishing wire;
A long auxiliary wire that abuts the polishing wire and runs parallel to the polishing wire at a constant speed;
With
The polishing apparatus characterized in that the auxiliary wire has a shape that restricts movement of the polishing wire in the left-right direction intersecting the traveling direction of the polishing wire, and suppresses bending of the polishing wire.   The polishing apparatus according to claim 1, wherein the auxiliary wire is in contact with a surface other than the polishing surface of the polishing wire. A support member that suppresses deformation of the auxiliary wire is disposed in a polishing region for polishing the workpiece with the polishing wire,
A friction preventing member is provided on a contact surface of the support member with the auxiliary wire,
The polishing apparatus according to claim 1, wherein the support member is a guide plate disposed between a pair of the wheels and / or a driven wheel of the wheels.   The polishing apparatus according to claim 1, wherein the auxiliary wire is configured integrally with the polishing wire.   The polishing apparatus according to claim 4, wherein a core wire of the polishing wire is configured by the auxiliary wire.   The polishing apparatus according to claim 1, wherein the polishing wire is a diamond wire.   The polishing apparatus according to claim 1, further comprising a moving mechanism that moves the workpiece.   8. The polishing apparatus according to claim 1, wherein the wire travel mechanism includes a feeding mechanism for bringing the polishing wire into and out of contact with the workpiece.

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