JP2017107694A - Lighting fixture - Google Patents

Lighting fixture Download PDF

Info

Publication number
JP2017107694A
JP2017107694A JP2015239460A JP2015239460A JP2017107694A JP 2017107694 A JP2017107694 A JP 2017107694A JP 2015239460 A JP2015239460 A JP 2015239460A JP 2015239460 A JP2015239460 A JP 2015239460A JP 2017107694 A JP2017107694 A JP 2017107694A
Authority
JP
Japan
Prior art keywords
substrate
wiring
lighting circuit
inner peripheral
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015239460A
Other languages
Japanese (ja)
Inventor
河野 誠
Makoto Kono
誠 河野
森 和也
Kazuya Mori
森  和也
飛呂也 菅
Hiroya Kan
飛呂也 菅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Priority to JP2015239460A priority Critical patent/JP2017107694A/en
Publication of JP2017107694A publication Critical patent/JP2017107694A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a lighting fixture which achieves cost reduction and in which a light emitting element and a lighting circuit are effectively and efficiently mounted on a substrate, and wiring of the lighting circuit, the light emitting element and the side of a wiring device is facilitated.SOLUTION: A fixture body 21 has an attachment part 39 attached to a wiring device 12 installed on a fixture attaching surface 11. A substrate device 22 is provided with a substrate 42, a light emitting element 43 and a lighting circuit 44. The substrate 42 is arranged around the attachment part 39 and is structured such that: an opening part 48 is formed facing the attachment part 39; a wiring surface 47 is set only on one surface thereof; and another surface side thereof is attached to the fixture body 21. The light emitting element 43 is mounted on the wiring surface 47 in an outer peripheral side region 49 of the substrate 42. The lighting circuit 44 is set around the opening part 48 in an inner peripheral side region 50 of the substrate 42. The lighting circuit 44 includes: a surface mounting component 53 mounted on the wiring surface 47 of the substrate 42 in the inner peripheral side region 50; and a lead component 54 in which a lead line arranged on the other surface side of the substrate 42 in the inner peripheral side region 50 and inserted into the substrate 42, is electrically connected to the wiring surface 47.SELECTED DRAWING: Figure 1

Description

本発明の実施形態は、発光素子を用いた照明器具に関する。   Embodiments described herein relate generally to a lighting fixture using a light emitting element.

従来、例えばシーリングライトなどの照明器具では、器具本体の表面側に発光素子を実装した基板が配設され、器具本体の背面側に点灯回路が配設されていることが多い。   2. Description of the Related Art Conventionally, lighting fixtures such as ceiling lights, for example, are often provided with a substrate on which a light emitting element is mounted on the surface side of the fixture body and a lighting circuit on the back side of the fixture body.

また、照明器具では、発光素子を実装する基板に点灯回路を一緒に設けたものもある。このように発光素子を実装する基板に点灯回路を設けたものは、基板に対して発光素子や点灯回路の部品をいかに有効かつ効率よく設けるかが十分に考慮されていなかった。そのため、基板の内周側領域には何も配設されない部分が発生したり、両面に実装部品が配置されて基板の両面に配線が必要となるなど、基板がコストアップや大形化してしまう。   In some lighting fixtures, a lighting circuit is provided on a substrate on which a light emitting element is mounted. Thus, what provided the lighting circuit in the board | substrate which mounts a light emitting element did not fully consider how to provide efficiently and efficiently the components of a light emitting element and a lighting circuit with respect to a board | substrate. As a result, there is a part where nothing is provided in the inner peripheral area of the board, or mounting parts are arranged on both sides and wiring is required on both sides of the board, which increases the cost and size of the board. .

さらに、器具取付面に設置された配線器具に器具本体を取り付け、配線器具側と点灯回路とを電気接続するが、配線器具側と点灯回路とが離れていたり、配線器具側と点灯回路との間に発光素子が配設されていると、配線器具側と点灯回路および発光素子との配線を容易にできない。   Furthermore, the fixture body is attached to the wiring fixture installed on the fixture mounting surface, and the wiring fixture side and the lighting circuit are electrically connected, but the wiring fixture side and the lighting circuit are separated, or the wiring fixture side and the lighting circuit are not connected. If a light emitting element is disposed between them, wiring between the wiring device side, the lighting circuit, and the light emitting element cannot be easily performed.

特開2015−185382号公報JP-A-2015-185382

本発明が解決しようとする課題は、低コスト化を実現できるとともに、基板に対して発光素子や点灯回路を有効かつ効率よく設けることができ、配線器具側と点灯回路および発光素子との配線も容易にできる照明器具を提供することである。   The problem to be solved by the present invention is that the cost can be reduced and the light emitting element and the lighting circuit can be effectively and efficiently provided on the substrate, and the wiring device side and the lighting circuit and the light emitting element are also wired. It is to provide a lighting device that can be easily made.

実施形態の照明器具は、器具本体および基板装置を備える。器具本体は、器具取付面に設置された配線器具に取り付けられる取付部を有する。基板装置は、基板、発光素子および点灯回路を備える。基板は、取付部の周囲に配設され、取付部に対向して開口部が設けられるとともに、一面のみに配線面が設けられ、他面側が器具本体に取り付けられる。発光素子は、基板の外周側領域で配線面に実装される。点灯回路は、基板の内周側領域で開口部の周囲に設けられる。点灯回路は、基板の内周側領域で配線面に実装される表面実装部品、および基板の内周側領域で他面側に配設されて基板に挿入されるリード線が配線面に電気接続されるリード部品を有する。   The lighting fixture of the embodiment includes a fixture main body and a substrate device. The appliance main body has an attachment portion that is attached to a wiring appliance installed on the appliance attachment surface. The substrate device includes a substrate, a light emitting element, and a lighting circuit. The substrate is disposed around the mounting portion, and an opening is provided to face the mounting portion, a wiring surface is provided on only one surface, and the other surface side is attached to the instrument body. The light emitting element is mounted on the wiring surface in the outer peripheral side region of the substrate. The lighting circuit is provided around the opening in the inner peripheral region of the substrate. The lighting circuit is a surface-mounted component that is mounted on the wiring surface in the inner peripheral region of the board, and a lead wire that is disposed on the other surface side in the inner peripheral region of the board and is inserted into the board is electrically connected to the wiring surface. Lead parts to be provided.

本発明によれば、低コスト化を実現できるとともに、基板に対して発光素子や点灯回路を有効かつ効率よく設けることができ、配線器具側と点灯回路および発光素子との配線も容易にすることが期待できる。   According to the present invention, it is possible to realize a reduction in cost, and it is possible to effectively and efficiently provide a light emitting element and a lighting circuit on a substrate, and to facilitate wiring between the wiring device side and the lighting circuit and the light emitting element. Can be expected.

一実施形態を示す照明器具の一部の断面図である。It is sectional drawing of a part of lighting fixture which shows one Embodiment. 同上照明器具の断面図である。It is sectional drawing of a lighting fixture same as the above.

以下、一実施形態を、図1および図2を参照して説明する。   Hereinafter, an embodiment will be described with reference to FIGS. 1 and 2.

図1および図2に示すように、照明器具10は、器具取付面11に設置された引掛シーリングである配線器具12にアダプタ13を介して取り付けられるシーリングライトである。   As shown in FIGS. 1 and 2, the luminaire 10 is a ceiling light that is attached to a wiring fixture 12 that is a hook ceiling installed on the fixture mounting surface 11 via an adapter 13.

そして、配線器具12には器具取付面11から突出する高さや形状が異なる各種のタイプがあるが、図1および図2には高さの高い丸形タイプの配線器具12を示している。   The wiring device 12 includes various types protruding from the device mounting surface 11 and having different heights and shapes. FIGS. 1 and 2 show a round type wiring device 12 having a high height.

また、アダプタ13は、円筒状のアダプタ本体16を有し、このアダプタ本体16の上面から配線器具12に対して電気的および機械的に接続される一対の断面L字形の端子が突設されている。アダプタ本体16の側面には一対の爪部17が突出されている。爪部17は付勢部材によってアダプタ本体16から突出するように付勢されており、アダプタ本体16の下面に配設された解除ボタン18を押すことにより、爪部17をアダプタ本体16内に移動させることができる。アダプタ13からは一対の端子に電気的に接続されたアダプタケーブルが引き出され、このアダプタケーブルの先端に設けられたアダプタコネクタが照明器具10側に電気的に接続される。   The adapter 13 has a cylindrical adapter main body 16, and a pair of L-shaped cross-section terminals that are electrically and mechanically connected to the wiring device 12 from the upper surface of the adapter main body 16 project. Yes. A pair of claw portions 17 protrude from the side surface of the adapter body 16. The claw portion 17 is urged so as to protrude from the adapter body 16 by the urging member, and the claw portion 17 is moved into the adapter body 16 by pressing a release button 18 disposed on the lower surface of the adapter body 16. Can be made. An adapter cable electrically connected to a pair of terminals is drawn out from the adapter 13, and an adapter connector provided at the tip of the adapter cable is electrically connected to the lighting fixture 10 side.

また、照明器具10は、器具本体21を備えている。この器具本体21の表面側である下面側に、基板装置22、この基板装置22を覆う光源カバー23および回路カバー24、器具本体21の下面側全体を覆うセード25などが配設されている。   The lighting fixture 10 includes a fixture body 21. A substrate device 22, a light source cover 23 and a circuit cover 24 that cover the substrate device 22, a shade 25 that covers the entire lower surface side of the device body 21, and the like are disposed on the lower surface side that is the surface side of the device body 21.

そして、器具本体21は、金属製で、円盤状に形成されている。器具本体21には、基板装置22を取り付ける環状の基板取付部28が形成され、この基板取付部28の内周側および外周側に器具本体21の背面側である上面側にそれぞれ屈曲して突出する内周側屈曲部29および外周側屈曲部30が形成されている。   The instrument body 21 is made of metal and has a disk shape. An annular substrate mounting portion 28 for mounting the substrate device 22 is formed on the instrument main body 21, and the inner and outer peripheral sides of the substrate mounting portion 28 are bent and protruded to the upper surface side that is the back side of the instrument main body 21, respectively. An inner peripheral bent portion 29 and an outer peripheral bent portion 30 are formed.

基板取付部28は、平面状で環状に形成され、器具本体21の下方に最も突出されている。   The board mounting portion 28 is formed in a flat and annular shape, and protrudes most downward from the instrument body 21.

内周側屈曲部29の中央、すなわち器具本体21の中央には、配線器具12およびアダプタ13が挿通可能な挿通口31が形成されている。挿通口31の周縁部はアダプタ13の爪部17に係止可能な上部側の係止部32として構成されている。内周側屈曲部29の下面側には点灯回路収容部33が環状に形成されている。   An insertion port 31 through which the wiring device 12 and the adapter 13 can be inserted is formed at the center of the inner peripheral bending portion 29, that is, the center of the device body 21. The peripheral edge portion of the insertion port 31 is configured as an upper locking portion 32 that can be locked to the claw portion 17 of the adapter 13. A lighting circuit accommodating portion 33 is formed in an annular shape on the lower surface side of the inner peripheral side bent portion 29.

外周側屈曲部30は、内周側屈曲部29よりも上方に突出されている。外周側屈曲部30の外周縁にはセード25を嵌合するセード嵌合部30aが形成されている。外周側屈曲部30の下面に側には、セード25を回動させて着脱可能に取り付けるための複数のセード取付金具が取り付けられている。   The outer peripheral side bent portion 30 protrudes above the inner peripheral side bent portion 29. A shade fitting portion 30a for fitting the shade 25 is formed on the outer peripheral edge of the outer peripheral side bent portion 30. On the side of the lower surface of the outer peripheral bending portion 30, there are attached a plurality of shade mounting brackets for removably mounting the shade 25.

器具本体21の中央、すなわち内周側屈曲部29に、アダプタ13に取り付けるアダプタガイドとしての取付部材34が取り付けられている。この取付部材34は、絶縁性を有している。取付部材34は、円筒状に形成された筒部35を備え、この筒部35の内周に下部側の係止部36が環状に突設されている。筒部35の上部には、内周側屈曲部29の下面側を覆う環状の絶縁部37が形成されている。筒部35の下端には、基板取付部28よりも下方に突出される突出部38が形成されている。取付部材34は、基板装置22の内周側を支持するリブやボスなどの支持部を備えている。そして、取付部材34および器具本体21の係止部32が、配線器具12の高さに応じて、配線器具12にアダプタ13を介して取り付けるための取付部39として構成されている。   An attachment member 34 as an adapter guide to be attached to the adapter 13 is attached to the center of the instrument main body 21, that is, the inner peripheral bending portion 29. The attachment member 34 has an insulating property. The mounting member 34 includes a cylindrical portion 35 formed in a cylindrical shape, and a lower locking portion 36 is provided in an annular shape on the inner periphery of the cylindrical portion 35. An annular insulating portion 37 that covers the lower surface side of the inner circumferential bent portion 29 is formed on the upper portion of the cylindrical portion 35. At the lower end of the cylindrical portion 35, a protruding portion 38 that protrudes downward from the substrate mounting portion 28 is formed. The attachment member 34 includes support portions such as ribs and bosses that support the inner peripheral side of the substrate device 22. The attachment member 34 and the locking portion 32 of the appliance main body 21 are configured as an attachment portion 39 for attaching to the wiring appliance 12 via the adapter 13 according to the height of the wiring appliance 12.

器具本体21の背面には、照明器具10の設置時に器具取付面11に接するクッション材が取り付けられている。   A cushioning material that is in contact with the fixture mounting surface 11 when the lighting fixture 10 is installed is attached to the back surface of the fixture body 21.

また、基板装置22は、基板42、この基板42に設けられた複数の発光素子43および点灯回路44を備えている。   The substrate device 22 includes a substrate 42, a plurality of light emitting elements 43 provided on the substrate 42, and a lighting circuit 44.

基板42は、例えば絶縁材料をベースとし、その一面のみに配線パターンが形成された片面配線基板である。すなわち、基板42の一面である表面42aは配線パターンが形成された配線面47であり、基板42の他面であるとともに配線面47に対して反対側である背面42bは配線パターンが形成されていない面である。   The substrate 42 is a single-sided wiring substrate in which, for example, an insulating material is used as a base and a wiring pattern is formed only on one surface thereof. That is, the surface 42a that is one surface of the substrate 42 is a wiring surface 47 on which a wiring pattern is formed, and the back surface 42b that is the other surface of the substrate 42 and opposite to the wiring surface 47 is formed with a wiring pattern. There is no aspect.

基板42は、中央に開口部48を有する環状に形成されている。基板42は、例えば、環状に一体に設けられていてもよいし、周方向に複数に分割されていてこれらが環状に組み合わされるようにしてもよい。基板42が周方向に複数に分割されている場合には、分割基板を環状に組み合わせた際に、分割基板同士をコネクタ接続などによって電気的に接続されるように構成すればよい。   The substrate 42 is formed in an annular shape having an opening 48 in the center. For example, the substrate 42 may be integrally provided in an annular shape, or may be divided into a plurality of portions in the circumferential direction so that these are combined in an annular shape. When the substrate 42 is divided into a plurality in the circumferential direction, the divided substrates may be configured to be electrically connected to each other by connector connection or the like when the divided substrates are combined in an annular shape.

基板42は、外周側領域49および内周側領域50を備えている。基板42の外周側領域49で配線面47に複数の発光素子43が実装され、基板42の内周側領域50で開口部48の周囲に点灯回路44が設けられている。基板42の配線面47の外周側領域49には複数の発光素子43を実装するための配線パターンが形成され、基板42の配線面47の内周側領域50には点灯回路44を構成するための配線パターンが形成されている。   The substrate 42 includes an outer peripheral side region 49 and an inner peripheral side region 50. A plurality of light emitting elements 43 are mounted on the wiring surface 47 in the outer peripheral side region 49 of the substrate 42, and a lighting circuit 44 is provided around the opening 48 in the inner peripheral side region 50 of the substrate 42. A wiring pattern for mounting a plurality of light emitting elements 43 is formed in the outer peripheral region 49 of the wiring surface 47 of the substrate 42, and the lighting circuit 44 is configured in the inner peripheral region 50 of the wiring surface 47 of the substrate 42. The wiring pattern is formed.

基板42は、開口部48が取付部材34の外周に嵌合されるとともに、外周側領域49の背面42bが器具本体21の基板取付部28に接するように取り付けられている。   The substrate 42 is mounted such that the opening 48 is fitted to the outer periphery of the mounting member 34 and the back surface 42b of the outer peripheral side region 49 is in contact with the substrate mounting portion 28 of the instrument main body 21.

発光素子43は、例えば、表面実装形のLEDが用いられている。複数の発光素子43は、基板42の配線面47の外周側領域49に、同心円状に複数列配設されるとともに、それぞれの列で周方向に沿って所定の間隔をあけて実装されている。本実施形態では、2列に配設されているが、3列以上でもよく、あるいは1列でもよい。発光素子43は、LEDに限らず、有機ELなどの他の発光素子でもよい。   As the light emitting element 43, for example, a surface mount type LED is used. The plurality of light emitting elements 43 are arranged in a plurality of concentric rows on the outer peripheral side region 49 of the wiring surface 47 of the substrate 42, and are mounted at predetermined intervals along the circumferential direction in each row. . In this embodiment, it is arranged in two rows, but it may be three or more rows or one row. The light emitting element 43 is not limited to an LED, and may be another light emitting element such as an organic EL.

点灯回路44は、基板42の内周側領域50に設けられている。点灯回路44は、配線器具12およびアダプタ13を通じて入力される交流電源を整流および平滑する整流回路、この整流回路からの出力をスイッチング素子のスイッチング動作によって所定の直流電源に変換して発光素子43に供給するコンバータ、および調光信号を入力してスイッチング素子のスイッチング動作を制御する制御部を備えている。   The lighting circuit 44 is provided in the inner peripheral side region 50 of the substrate 42. The lighting circuit 44 rectifies and smoothes the AC power input through the wiring device 12 and the adapter 13, and converts the output from the rectifier circuit into a predetermined DC power source by the switching operation of the switching element to the light emitting element 43. A converter to be supplied and a control unit that inputs a dimming signal and controls the switching operation of the switching element are provided.

点灯回路44は、この点灯回路44を構成するための複数の表面実装部品53および複数のリード部品54を備えている。   The lighting circuit 44 includes a plurality of surface mount components 53 and a plurality of lead components 54 for constituting the lighting circuit 44.

表面実装部品53は、例えば、トランジスタ、抵抗、コンデンサなどの高さが低く、リード線を備えないチップ部品である。そして、表面実装部品53は、基板42の内周側領域50で、配線面47の配線パターン上に搭載されてはんだ付け接続されている。   The surface-mounted component 53 is a chip component having a low height such as a transistor, a resistor, and a capacitor and not including a lead wire. The surface-mounted component 53 is mounted on the wiring pattern on the wiring surface 47 and soldered and connected in the inner peripheral side region 50 of the substrate.

リード部品54は、例えば、電解コンデンサやインダクタなどの高さが高い部品であり、リード部品本体から突出された複数のリード線を備えている。そして、リード部品54は、基板42の内周側領域50で、リード部品本体が基板42の背面42b側に配設され、リード線が基板42の背面42b側から表面42a側である配線面47に挿入されてその配線面47の配線パターンにはんだ付け接続されている。リード部品54のリード部品本体は、器具本体21の点灯回路収容部33に収容されている。   The lead component 54 is a component having a high height, such as an electrolytic capacitor or an inductor, and includes a plurality of lead wires protruding from the lead component body. The lead component 54 is an inner peripheral side region 50 of the substrate 42, the lead component main body is disposed on the back surface 42b side of the substrate 42, and the lead wire is a wiring surface 47 that is on the surface 42a side from the back surface 42b side of the substrate 42. And connected to the wiring pattern of the wiring surface 47 by soldering. The lead component main body of the lead component 54 is accommodated in the lighting circuit accommodating portion 33 of the instrument main body 21.

点灯回路44は、アダプタ13から引き出されているアダプタケーブルのアダプタコネクタが接続される入力コネクタを有している。   The lighting circuit 44 has an input connector to which an adapter connector of an adapter cable drawn from the adapter 13 is connected.

なお、基板装置22は、リモコンからのリモコン信号(調光信号)を受光するリモコン受光部や、常夜灯を備えていてもよい。リモコン受光部は、表面実装形の部品であり、点灯回路44の一部として、基板42の内周側領域50で、配線面47の配線パターン上に搭載されてはんだ付け接続される。常夜灯は、例えば、表面実装形のLEDであり、配線面47のどこに実装してもよい。   The substrate device 22 may include a remote control light receiving unit that receives a remote control signal (dimming signal) from a remote control, or a nightlight. The remote control light-receiving part is a surface-mounted component, and is mounted on the wiring pattern of the wiring surface 47 and soldered as a part of the lighting circuit 44 in the inner peripheral side region 50 of the substrate 42. The night light is, for example, a surface-mounted LED, and may be mounted anywhere on the wiring surface 47.

また、光源カバー23は、絶縁性および透光性を有する樹脂材料によって、環状に形成されている。樹脂材料としては、例えば、透明なポリカーボネートが用いられている。   The light source cover 23 is formed in an annular shape from a resin material having insulating properties and translucency. As the resin material, for example, transparent polycarbonate is used.

光源カバー23は、器具本体21の基板取付部28との間に基板42を挟み込んで保持するカバー部57、および発光素子43に対向するレンズ部58を備えている。   The light source cover 23 includes a cover portion 57 that holds the substrate 42 between the substrate mounting portion 28 of the instrument main body 21 and a lens portion 58 that faces the light emitting element 43.

カバー部57は、環状に形成されており、基板42の配線面47に接する。   The cover part 57 is formed in an annular shape and contacts the wiring surface 47 of the substrate 42.

レンズ部58は、発光素子43に対向する背面側に断面凹状の入射面59が形成されているとともに、入射面59と反対の表面側に断面凸状の出射面60が形成されている。レンズ部58は、発光素子43からの光を器具中心側から器具外径側に亘って拡散させる配光特性を有している。   The lens portion 58 has an incident surface 59 having a concave cross section on the back side facing the light emitting element 43, and an exit surface 60 having a convex cross section on the surface side opposite to the incident surface 59. The lens unit 58 has a light distribution characteristic that diffuses light from the light emitting element 43 from the instrument center side to the instrument outer diameter side.

また、回路カバー24は、絶縁性および遮光性を有する樹脂材料によって、環状に形成されている。   The circuit cover 24 is formed in an annular shape from a resin material having insulating properties and light shielding properties.

回路カバー24は、内周側が取付部材34の突出部38に嵌合されて取り付けられ、外周側が光源カバー23のカバー部57を介して器具本体21に取り付けられている。回路カバー24は、基板42の配線面47の内周側領域50およびこの内周側領域50に実装された点灯回路44の表面実装部品53を覆う。回路カバー24の基板42からの突出寸法は、光源カバー23のレンズ部58と同じか略同じ程度に設けられている。   The circuit cover 24 is attached by fitting the inner peripheral side to the protruding portion 38 of the mounting member 34, and the outer peripheral side is attached to the instrument main body 21 via the cover part 57 of the light source cover 23. The circuit cover 24 covers the inner peripheral side region 50 of the wiring surface 47 of the substrate 42 and the surface mounting component 53 of the lighting circuit 44 mounted in the inner peripheral side region 50. The projecting dimension of the circuit cover 24 from the substrate 42 is the same as or substantially the same as the lens portion 58 of the light source cover 23.

そして、光源カバー23および回路カバー24は、例えば、それらカバー23,24の背面から突設された複数の略L字形の爪を器具本体21に設けられた取付孔にそれぞれ挿入してそれらカバー23,24を回動させることで器具本体21に係止し、カバー23,24を挿通するねじを器具本体21に螺着して固定するようにしてもよい。   For example, the light source cover 23 and the circuit cover 24 are formed by inserting a plurality of substantially L-shaped claws projecting from the back surfaces of the covers 23 and 24 into attachment holes provided in the instrument body 21, respectively. , 24 may be locked to the instrument main body 21 and screws for inserting the covers 23, 24 may be screwed to the instrument main body 21 and fixed.

さらに、リモコン受光部や常夜灯が基板42の配線面47の内周側領域50に実装されている場合には、その実装位置に対応して回路カバー24に切欠きを設けるとともに、この回路カバー24に切欠き部分を覆うように光源カバー23から延長部を設けるようにすればよい。   Further, when the remote control light receiving unit and the nightlight are mounted on the inner peripheral side region 50 of the wiring surface 47 of the substrate 42, the circuit cover 24 is provided with a notch corresponding to the mounting position, and the circuit cover 24 An extension may be provided from the light source cover 23 so as to cover the notch.

なお、光源カバー23と回路カバー24とは一体に形成されていてもよい。この場合、回路カバー24の部分のみを遮光材を塗布するなどして遮光性を有するように構成すればよい。   The light source cover 23 and the circuit cover 24 may be integrally formed. In this case, only the portion of the circuit cover 24 may be configured to have a light shielding property by applying a light shielding material or the like.

また、セード25は、透光性および拡散性を有する乳白色の樹脂材料によって一体に形成されている。セード25は、上面側が開口され、下面側がドーム状に膨らんだ形状に形成されている。セード25の上面側の開口の内周縁部には、器具本体21のセード取付金具に対してセード25の回動によって着脱可能に取り付けられる取付段部が形成されている。そして、器具本体21に取り付けられるセード25により、器具本体21の下面全体が覆われる。   The shade 25 is integrally formed of a milky white resin material having translucency and diffusibility. The shade 25 is formed in a shape in which the upper surface side is opened and the lower surface side swells in a dome shape. On the inner peripheral edge of the opening on the upper surface side of the shade 25, an attachment step portion is formed that is detachably attached to the shade attachment fitting of the instrument body 21 by the rotation of the shade 25. The entire lower surface of the instrument main body 21 is covered by the shade 25 attached to the instrument main body 21.

そして、照明器具10を器具取付面11に設置するには、まず、配線器具12にアダプタ13を装着する。配線器具12に装着されたアダプタ13は、配線器具12に対して電気的に接続されるとともに機械的に保持され、配線器具12に対する回動も規制される。   In order to install the lighting fixture 10 on the fixture mounting surface 11, first, the adapter 13 is attached to the wiring fixture 12. The adapter 13 attached to the wiring device 12 is electrically connected to the wiring device 12 and mechanically held, and the rotation with respect to the wiring device 12 is also restricted.

器具本体21を持ち上げ、挿通口31および取付部材34をアダプタ13の周囲に合わせ、器具本体21を押し上げる。   The instrument body 21 is lifted, the insertion port 31 and the attachment member 34 are aligned with the periphery of the adapter 13, and the instrument body 21 is pushed up.

器具本体21を押し上げることにより、器具本体21の取付部39がアダプタ13の爪部17上に引っ掛かって取り付けられる。本実施形態では、配線器具12が高さの高い丸形タイプであるため、取付部材34の係止部36がアダプタ13の爪部17上に引っ掛かって取り付けられる。この取付状態では、クッション材が器具本体21と器具取付面11との間で圧縮され、このクッション材によって器具取付面11に対する照明器具10のがたつきが防止される。   By pushing up the instrument body 21, the attachment part 39 of the instrument body 21 is hooked onto the claw part 17 of the adapter 13 and attached. In the present embodiment, since the wiring device 12 is a round type with a high height, the locking portion 36 of the attachment member 34 is hooked onto the claw portion 17 of the adapter 13 and attached. In this attachment state, the cushion material is compressed between the instrument body 21 and the instrument attachment surface 11, and the cushioning material prevents the lighting instrument 10 from rattling against the instrument attachment surface 11.

続いて、アダプタ13のアダプタケーブルを点灯回路44の入力コネクタに電気的に接続し、セード25を器具本体21の下面に被せ、セード25を回動させることにより、セード25を器具本体21のセード取付金具に取り付ける。これにより、照明器具10の設置が完了となる。   Subsequently, the adapter cable of the adapter 13 is electrically connected to the input connector of the lighting circuit 44, the shade 25 is put on the lower surface of the instrument body 21, and the shade 25 is rotated, so that the shade 25 is attached to the shade of the instrument body 21. Attach to the mounting bracket. Thereby, installation of the lighting fixture 10 is completed.

一方、照明器具10を外す場合には、セード25を外し、アダプタ13のアダプタケーブルを点灯回路44の入力コネクタから外し、アダプタ13の解除ボタン18を操作することにより、爪部17をアダプタ本体16内に移動させる。これにより、取付部39がアダプタ13の爪部17から外れ、器具本体21を下方へ移動させることが可能となり、器具本体21をアダプタ13から外すことができる。   On the other hand, when removing the luminaire 10, remove the shade 25, remove the adapter cable of the adapter 13 from the input connector of the lighting circuit 44, and operate the release button 18 of the adapter 13 to attach the claw portion 17 to the adapter body 16 Move in. As a result, the attachment portion 39 is detached from the claw portion 17 of the adapter 13, and the instrument body 21 can be moved downward, and the instrument body 21 can be detached from the adapter 13.

また、照明器具10の設置状態においては、壁スイッチのオン操作やリモコンのオン操作により、点灯回路44が交流電源を所定の直流電源に変換して発光素子43に供給し、発光素子43が点灯する。発光素子43からの光は光源カバー23のレンズ部58に入射し、レンズ部58で配光が制御された光がセード25を透過して照明空間に照射される。   When the lighting fixture 10 is installed, the lighting circuit 44 converts the AC power into a predetermined DC power and supplies the light to the light emitting element 43 by turning on the wall switch or the remote control. To do. The light from the light emitting element 43 enters the lens portion 58 of the light source cover 23, and the light whose light distribution is controlled by the lens portion 58 passes through the shade 25 and is irradiated to the illumination space.

そして、基板装置22では、同じ基板42に発光素子43および点灯回路44を一緒に設けているため、部品点数を削減することができる。   In the board device 22, since the light emitting element 43 and the lighting circuit 44 are provided together on the same board 42, the number of parts can be reduced.

しかも、基板42には、一面のみに配線面47を設けた片面配線基板を使用することにより、基板コストを低減することができる。   In addition, the substrate cost can be reduced by using a single-sided wiring board in which the wiring surface 47 is provided only on one surface as the substrate 42.

さらに、基板42に複数の発光素子43を配列すること、および発光素子43からの光の広がりを考慮して、基板42の外周側領域49に発光素子43が実装されることが多く、基板42の内周側領域50で開口部48の周囲には何も配設されない部分が発生するのが一般的であるが、本実施形態では、その基板42の内周側領域50で開口部48の周囲に点灯回路44を設けているため、基板42に発光素子43および点灯回路44を有効かつ効率よく設けることができる。   Furthermore, in consideration of arranging a plurality of light emitting elements 43 on the substrate 42 and the spread of light from the light emitting elements 43, the light emitting elements 43 are often mounted on the outer peripheral region 49 of the substrate 42. In general, a portion where nothing is provided around the opening 48 is generated in the inner peripheral side region 50 of the inner peripheral side region 50, but in this embodiment, the opening 48 is formed in the inner peripheral side region 50 of the substrate 42. Since the lighting circuit 44 is provided around, the light-emitting element 43 and the lighting circuit 44 can be effectively and efficiently provided on the substrate 42.

さらに、点灯回路44の小形の表面実装部品53を基板42の内周側領域50で配線面47に実装するとともに、点灯回路44の大形のリード部品54を基板42の内周側領域50で配線面47とは反対側の面に配設するため、発光素子43から器具中心方向に向かう光を遮らないようにでき、セード25の明るさを均一にできる。   Further, the small surface mounting component 53 of the lighting circuit 44 is mounted on the wiring surface 47 in the inner peripheral region 50 of the substrate 42, and the large lead component 54 of the lighting circuit 44 is mounted in the inner peripheral region 50 of the substrate 42. Since it is disposed on the surface opposite to the wiring surface 47, it is possible not to block the light from the light emitting element 43 toward the center of the instrument, and the brightness of the shade 25 can be made uniform.

また、基板42の内周側領域50で開口部48の周囲に点灯回路44が設けられるため、配線器具12側と点灯回路44とが近くに位置し、配線器具12側と点灯回路44との配線を容易にできる。   Further, since the lighting circuit 44 is provided around the opening 48 in the inner peripheral side region 50 of the substrate 42, the wiring device 12 side and the lighting circuit 44 are located close to each other, and the wiring device 12 side and the lighting circuit 44 are connected. Wiring can be done easily.

このように、本実施形態の照明器具10によれば、基板42に片面実装基板を用いて低コスト化を実現できるとともに、基板42に対して発光素子43や点灯回路44を有効かつ効率よく設けることができ、配線器具12側と点灯回路44および発光素子43との配線も容易にできる。   As described above, according to the lighting apparatus 10 of the present embodiment, it is possible to reduce the cost by using a single-sided mounting substrate for the substrate 42, and to effectively and efficiently provide the light emitting element 43 and the lighting circuit 44 on the substrate 42. In addition, wiring between the wiring device 12 side and the lighting circuit 44 and the light emitting element 43 can be easily performed.

また、基板42の同じ配線線47に発光素子43と点灯回路44の表面実装部品53を実装した場合、発光素子43からの光によって表面実装部品53の光劣化が生じるおそれがあるが、その点灯回路44の表面実装部品53を遮光性を有する回路カバー24で覆うことにより、表面実装部品53の光劣化が生じるのを防止することができる。   Further, when the light emitting element 43 and the surface mounting component 53 of the lighting circuit 44 are mounted on the same wiring line 47 of the substrate 42, the light from the light emitting element 43 may cause light deterioration of the surface mounting component 53. By covering the surface mount component 53 of the circuit 44 with the circuit cover 24 having a light shielding property, it is possible to prevent the surface mount component 53 from being deteriorated by light.

本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

10 照明器具
11 器具取付面
12 配線器具
21 器具本体
22 基板装置
23 光源カバー
24 回路カバー
39 取付部
42 基板
43 発光素子
44 点灯回路
47 配線面
48 開口部
49 外周側領域
50 内周側領域
53 表面実装部品
54 リード部品
10 Lighting equipment
11 Instrument mounting surface
12 Wiring equipment
21 Instrument body
22 Board equipment
23 Light source cover
24 Circuit cover
39 Mounting part
42 PCB
43 Light emitting element
44 Lighting circuit
47 Wiring surface
48 opening
49 Outer peripheral area
50 Inner circumference area
53 Surface mount components
54 Lead parts

Claims (2)

器具取付面に設置された配線器具に取り付けられる取付部を有する器具本体と;
前記取付部の周囲に配設され、前記取付部に対向して開口部が設けられるとともに、一面のみに配線面が設けられ、他面側が前記器具本体に取り付けられる基板と、この基板の外周側領域で前記配線面に実装される発光素子と、前記基板の内周側領域で前記開口部の周囲に設けられる点灯回路とを備え、この点灯回路は、前記基板の内周側領域で前記配線面に実装される表面実装部品、および前記基板の内周側領域で他面側に配設されて前記基板に挿入されるリード線が前記配線面に電気接続されるリード部品を有する基板装置と;
を具備することを特徴とする照明器具。
An instrument body having an attachment portion attached to a wiring instrument installed on the instrument attachment surface;
A substrate that is disposed around the mounting portion, has an opening facing the mounting portion, has a wiring surface only on one surface, and the other surface is attached to the instrument body, and an outer peripheral side of the substrate A light emitting element mounted on the wiring surface in a region, and a lighting circuit provided around the opening in an inner peripheral region of the substrate, and the lighting circuit is connected to the wiring in the inner peripheral region of the substrate. A surface mount component mounted on a surface, and a substrate device having a lead component disposed on the other surface side in the inner peripheral region of the substrate and electrically connected to the wiring surface by a lead wire inserted into the substrate ;
The lighting fixture characterized by comprising.
前記基板の外周側領域で前記配線面を覆う透光性を有する光源カバーと;
前記基板の内周側領域で前記配線面を覆う遮光性を有する回路カバーと;
を具備することを特徴とする請求項1記載の照明器具。
A translucent light source cover that covers the wiring surface in an outer peripheral side region of the substrate;
A light-shielding circuit cover that covers the wiring surface in an inner peripheral region of the substrate;
The lighting fixture according to claim 1, comprising:
JP2015239460A 2015-12-08 2015-12-08 Lighting fixture Pending JP2017107694A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015239460A JP2017107694A (en) 2015-12-08 2015-12-08 Lighting fixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015239460A JP2017107694A (en) 2015-12-08 2015-12-08 Lighting fixture

Publications (1)

Publication Number Publication Date
JP2017107694A true JP2017107694A (en) 2017-06-15

Family

ID=59059962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015239460A Pending JP2017107694A (en) 2015-12-08 2015-12-08 Lighting fixture

Country Status (1)

Country Link
JP (1) JP2017107694A (en)

Similar Documents

Publication Publication Date Title
US20130201697A1 (en) Cap, socket device, and luminaire
JP6455666B2 (en) Lighting device
JP2014082066A (en) Lighting apparatus
JP2014082067A (en) Lighting device
JP2019515426A (en) Lighting device
JP6443697B2 (en) lighting equipment
JP6508473B2 (en) lighting equipment
JP2014082068A (en) Lighting device
JP2018073743A (en) Lighting fixture
TWI548837B (en) Lighting apparatus
JP2012146668A (en) Lighting fixture
JP6044758B2 (en) Light source unit and lighting fixture
JP6112185B2 (en) lighting equipment
JP2017107694A (en) Lighting fixture
JP2019009056A (en) Illuminating device
JP2013251142A (en) Light source unit and lighting fixture
JP2016021310A (en) Lighting fixture
JP2012146441A (en) Lighting fixture
JP2016171033A (en) Lens and lighting device
JP2016171034A (en) Lighting device
JP5870253B2 (en) lighting equipment
JP7274691B2 (en) lamp
JP6990149B2 (en) lighting equipment
JP6390931B2 (en) lighting equipment
JP6726872B2 (en) Lighting device and lighting device