JP2017093083A - Power conversion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power conversion device capable of adequately cooling a capacitor module having a capacitor.SOLUTION: A power conversion device 1 comprises: an inverter 10 having a plurality of semiconductor modules 11; a cooling part 20 having a plurality of cooling fins 21 provided to abut against the plurality of semiconductor modules 11, and a cooling plate 22 through which the same fluid as that flowing in the plurality of cooling fins 21 flows; a capacitor module 30 having capacitors 31, 32, 33 and bus-bars 34, 35; and a containing member 40 having a capacitor space 401 capable of containing the capacitor module 30, and an element space 402 capable of containing a laminate having the plurality of semiconductor modules 11 and the plurality of cooling fins 21 which are laminated alternately. The capacitor module 30 contained in the capacitor space 401 has outer wall faces 301, 302, 303, 304, 305, 306 which are covered by the containing member 40 or cooling plate 22.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a power conversion device that converts DC power into AC power.

  Conventionally, a power conversion apparatus has a plurality of semiconductor modules, an inverter that converts DC power into AC power, a capacitor module that has a capacitor and smoothes the voltage of DC power applied to the semiconductor module, and cools the semiconductor module and the capacitor module. A cooling unit, a housing member for housing the semiconductor module and the capacitor module, and the like. The capacitor module is formed of a capacitor having a relatively large calorific value and a sealing material for sealing the capacitor. Since the sealing material is formed from resin, when the power converter is used stably, the temperature of the capacitor module needs to be lower than the heat resistance temperature of the sealing material. For example, in Patent Document 1, a laminate in which a plurality of fins and a plurality of semiconductor modules included in a cooling unit are alternately stacked, a capacitor module, and a cooling pipe included in the cooling unit are inserted into the laminate and the capacitor module. The power converter device provided with the accommodating member which accommodates is described.

JP 2014-187827 A

  However, in the power conversion device described in Patent Literature 1, the capacitor module is inserted into the accommodation hole of the accommodation member, and both ends of the capacitor module protrude from the accommodation member. For this reason, heat tends to accumulate at both ends of the capacitor module, and the temperature of the capacitor module may be higher than the heat resistance temperature of the capacitor and the sealing material.

  The present invention has been made in view of the above problems, and an object thereof is to provide a power conversion device capable of sufficiently cooling a capacitor module having a capacitor.

The present invention is a power converter, and includes an inverter (10), a cooling unit (20), a capacitor module (30), a housing member (40), and an urging member (50).
The inverter has a plurality of semiconductor modules (11) formed of a switching element (12) and an element sealing material (14) for sealing the switching element and arranged in one direction, and converts DC power into AC. Convert to electricity.
The cooling unit includes a plurality of cooling fins (21) alternately stacked with the semiconductor module while being in contact with the semiconductor module on one side or the other side in one direction of the semiconductor module, and a plurality of semiconductors stacked alternately A cooling plate (22) provided on the other side in one direction of the laminate of the module and the plurality of cooling fins, and a fluid having a temperature lower than that of the semiconductor module in the plurality of cooling fins and the cooling plate. A cooling pipe (23) for
The capacitor module is made of a capacitor (31, 32, 33) capable of charging DC power supplied from the power source (3) and discharging the charged power, and a metal that electrically connects the power source and the plurality of switching elements and the capacitor. And a capacitor sealing material (36) for sealing the capacitor and a part of the bus bar to smooth the voltage of the DC power applied to the switching element.
The housing member is formed on the other side in one direction and is formed with a first insertion port (431) through which the capacitor module can be inserted in one direction, and a first housing space (401) that communicates with the first insertion port and can store the capacitor module. ), A second insertion port (432) formed on the other side in one direction and capable of inserting the laminate in one direction, a second accommodation space (402) capable of communicating with the second insertion port and accommodating the laminate. And it has a through-hole (450) which connects a 1st accommodation space and a 2nd accommodation space, and a part of bus bar is located.
The urging member is provided between the laminate and the inner wall surface (424) of the wall (422) on one side in one direction of the accommodation member in the second accommodation space, and urges the laminate.
In the power conversion device of the present invention, the capacitor module housed in the first housing space has an outer side radially outward of the capacitor module, where the direction in which the capacitor module is inserted into the first insertion slot is the axial direction of the capacitor module. The wall surface (301, 302, 305, 306) and the outer wall surface (303) on the insertion side in the axial direction are covered with the housing member. Further, the capacitor module housed in the first housing space is covered by a cooling plate that abuts the housing member so that the outer wall surface (304) opposite to the axial insertion side of the capacitor module closes the second insertion port. It has been broken.

In the power conversion device of the present invention, in the capacitor module housed in the first housing space, the outer wall surface on the radially outer side of the capacitor module and the outer wall surface on the insertion side in the axial direction are covered with the housing member. In addition, the capacitor module is covered with a cooling plate that abuts the housing member such that an outer wall surface opposite to the insertion side in the axial direction of the capacitor module closes the first insertion port. That is, in the capacitor module accommodated in the first accommodation space, the outer wall surface excluding a part exposed outside the surface on the through hole side is covered with the accommodation member. Thereby, the heat | fever discharge | released from the capacitor module used as a comparatively high temperature is transmitted to a storage member or a cooling plate. Since the housing member is efficiently cooled by the cooling plate that comes into contact with the housing member, the heat transmitted to the housing member is released to the outside of the power conversion device via the cooling unit. Thus, in the power conversion device of the present invention, the capacitor module that is relatively high in temperature is covered with the housing member and the cooling plate that are efficiently cooled by the cooling plate, so that the capacitor module can be sufficiently cooled. it can.
In addition, the housing member and the cooling plate may be provided with a gap of about dimensional accuracy depending on the processing accuracy of the parts, but in the power conversion device of the present invention, the cooling plate is provided so as to close the first insertion port. Therefore, the outer wall surface on the opposite side to the insertion side in the axial direction of the capacitor module can be efficiently cooled by the cooling plate.

It is a schematic diagram of the power converter device by one Embodiment of this invention. It is a circuit diagram of the power converter by one embodiment of the present invention. It is the III-III sectional view taken on the line of FIG. It is IV arrow line view of FIG. It is the VV sectional view taken on the line of FIG. It is a perspective view of the capacitor module with which the power converter by one embodiment of the present invention is provided. It is a perspective view of the P side connection member with which the power converter by one embodiment of the present invention is provided. It is a perspective view of the N side connection member with which the power converter by one embodiment of the present invention is provided.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(One embodiment)
A power converter according to an embodiment of the present invention will be described with reference to FIGS.
The schematic diagram of the power converter device 1 by one Embodiment is shown in FIG. The power conversion device 1 is mounted on, for example, an electric vehicle or a hybrid vehicle. As shown in FIG. 2, the power converter 1 is provided at a position where the DC power source 3 and the three-phase AC motor 5 can be electrically connected. The power converter 1 converts the DC power supplied from the DC power source 3 into AC power and outputs the AC power to the three-phase AC motor 5. The three-phase AC motor 5 to which AC power is supplied generates a driving force for driving the driving wheels of the automobile.

  The power conversion device 1 includes an inverter 10, a cooling unit 20, a capacitor module 30, a housing member 40, an urging member 50, and the like. In the power conversion device 1, the housing member 40 is formed so that the inverter 10 and the capacitor module 30 can be inserted into the housing member 40 in the same direction. 1 and 3 to 8, the direction passing through the cooling unit 20 and the capacitor module 30 inserted in the housing member 40 is the x direction, and the direction in which the cooling unit 20 and the capacitor module 30 are inserted into the housing member 40. Are shown in the y direction as the “insertion direction” and “one direction”, and the x direction and the direction perpendicular to the y direction as the z direction. In FIG. 1, the lid member 51 provided on one side in the z direction of the housing member 40 is indicated by a two-dot chain line for easy understanding of the inside of the housing member 40.

  The inverter 10 includes a plurality of semiconductor modules 11, a control circuit board 15, and the like. The inverter 10 converts the DC power supplied from the DC power source 3 into AC power according to the traveling state of the automobile on which the power conversion device 1 is mounted.

Each of the semiconductor modules 11 includes two switching elements 12 and two free wheel diodes 13 as shown in FIG. In the semiconductor module 11, the two switching elements 12 and the two free wheel diodes 13 are sealed with an element sealing material 14 formed in a substantially flat plate shape. In one embodiment, the inverter 10 includes three semiconductor modules 11. The three semiconductor modules 11 are provided so as to be arranged while maintaining a constant interval in the y direction.
A plurality of terminals are provided at the end of the semiconductor module 11 in the z direction. At one end in the z direction of the semiconductor module 11, the N terminal 112 and the P terminal 111 that are electrically connected to the capacitor module 30 and the three-phase AC motor 5 are electrically connected in order from the capacitor module 30 side. An output terminal 113 to be connected is provided. A connection terminal 114 that is electrically connected to the control circuit board 15 is provided at the other end of the semiconductor module 11 in the z direction (see FIGS. 3 and 5).

  The control circuit board 15 is electrically connected to a control unit (not shown). The control circuit board 15 controls the operation of the switching element 12 according to a command from the control unit based on the running state of the automobile on which the power conversion device 1 is mounted.

  The cooling unit 20 includes a plurality of cooling fins 21, a cooling plate 22, a cooling pipe 23, and the like. The cooling unit 20 can cool the inverter 10, the capacitor module 30, the housing member 40, and the like.

  The cooling fin 21 is provided on one side or the other side of the semiconductor module 11 in the y direction so as to contact the semiconductor module 11. Specifically, as shown in FIG. 1, one semiconductor module 11 is provided on the cooling plate 22 side in the y direction or on the opposite side to the cooling plate 22. At this time, the cooling fin 21 is in contact with the one semiconductor module 11. That is, one semiconductor module 11 is sandwiched between two cooling fins 21. Thereby, the semiconductor modules 11 and the cooling fins 21 are provided to be alternately stacked. The cooling fin 21 has a hollow shape and can circulate a fluid.

  The cooling plate 22 is provided at a position opposite to the direction in which the cooling unit 20 is inserted into the housing member 40 in the stacked body of the semiconductor modules 11 and the cooling fins 21 that are alternately stacked. The cooling plate 22 is formed so that the length in the x direction is substantially the same as the length of the housing member 40 in the x direction. As shown in FIGS. 1 and 4, the cooling plate 22 is fixed while being in contact with the housing member 40 by bolts 221. The cooling plate 22 has a hollow shape and can circulate fluid.

  The cooling pipe 23 is formed to extend in the y direction. In one embodiment, the cooling unit 20 includes two cooling pipes 23. The two cooling pipes 23 are joined to the plurality of cooling fins 21 and the cooling plate 22. The cooling pipe 23 is formed to be able to circulate a refrigerant as “a fluid having a temperature lower than the temperature of the semiconductor module” supplied by an external refrigerant supply unit (not shown). The refrigerant flowing through one cooling pipe 23 flows into the cooling fins 21 and the cooling plate 22. The refrigerant flowing into the cooling fins 21 and the cooling plate 22 is discharged to the outside of the power conversion device 1 through the other cooling pipe 23. The refrigerant is, for example, a fluid having a temperature lower than that at the time of actual use of the semiconductor module 11. Therefore, the refrigerant cools the semiconductor module 11 in contact with the cooling fins 21 and accommodates the cooling plate 22 fixed thereto. The member 40 is cooled.

  The capacitor module 30 includes three capacitors 31, 32, 33, a P-side bus bar 34, an N-side bus bar 35, a capacitor sealing material 36, a capacitor module case 361, and the like. The capacitor module 30 is provided on one side in the x direction with respect to the alternately stacked semiconductor modules 11 and cooling fins 21. The capacitor module 30 is electrically connected to the switching element 12 and the DC power supply 3 to smooth the DC power applied to the switching element 12. As shown in FIG. 2, the capacitor module 30 is electrically connected to the DC power supply 3 and each of the three semiconductor modules 11.

  The capacitor module 30 has three capacitors 31, 32 and 33. Capacitors 31, 32, and 33 can charge DC power supplied from DC power supply 3 in accordance with the operation of inverter 10, or discharge the charged power toward inverter 10. Capacitors 31, 32, 33 formed in a substantially columnar shape are arranged in the y direction in a capacitor module case 361 formed in a bottomed cylindrical shape having a substantially rectangular cross section as shown in FIG. 1, for example. It is provided to line up.

  The P side bus bar 34 and the N side bus bar 35 are made of metal. The P-side bus bar 34 and the N-side bus bar 35 electrically connect the DC power supply 3 and the switching element 12 to the capacitors 31, 32, and 33.

  The P-side bus bar 34 is mostly sealed with a capacitor sealing material 36, and a sealed portion 340 that electrically connects the three capacitors 31, 32, and 33, and a P-side included in the sealed portion 340 A P-side connection member 342 that connects the connection terminal 341 and the P terminal 111 is formed. As shown in FIG. 1, the P-side connection terminal 341 is arranged in the y direction on the outer wall surface 301 as “an outer wall surface radially outside the capacitor module” and “one outer wall surface” on one side in the z direction of the capacitor module 30. And is formed so as to protrude from the outer wall surface 301.

A perspective view of the P-side connecting member 342 is shown in FIG. The P-side connection member 342 is formed from a capacitor-side connection portion 343, a flat plate portion 344, three connection portions 345, and the like.
The capacitor side connection portion 343 is formed to be connectable to the P side connection terminal 341.
The flat plate portion 344 is a flat portion formed in one flat shape with the capacitor side connection portion 343. In one embodiment, the flat plate portion 344 is formed to extend from the capacitor side connection portion 343 to the other side in the y direction.
The connecting portion 345 is provided on the other side of the flat plate portion 344 in the x direction. The connection part 345 is formed so as to be connected to each of the three P terminals 111 included in the three semiconductor modules 11.

  The N-side bus bar 35 is mostly sealed with a capacitor sealing material 36, and a sealed portion 350 that electrically connects the three capacitors 31, 32, and 33, and an N side included in the sealed portion 350 An N-side connection member 352 connecting the connection terminal 351 and the N terminal 112 is formed. The N-side connection terminal 351 is provided on the other side in the y direction on the outer wall surface 301 of the capacitor module 30 and is formed to protrude from the outer wall surface 301.

A perspective view of the N-side connecting member 352 is shown in FIG. The N-side connection member 352 is formed of a capacitor-side connection portion 353, a flat plate portion 354, a plurality of connection portions 355, and the like.
The capacitor side connection portion 353 is formed to be connectable to the N side connection terminal 351.
The flat plate portion 354 is a flat plate-like portion formed in one plane with the capacitor side connection portion 353. In one embodiment, the flat plate portion 354 is formed to extend from the capacitor side connection portion 353 in one direction in the y direction.
The connecting portion 355 is provided on the other side of the flat plate portion 354 in the x direction. The connection portion 355 is formed so as to be connected to each of the three N terminals 112 included in the three semiconductor modules 11.

  Between the flat plate portion 344 of the P-side connection member 342 and the flat plate portion 354 of the N-side connection member 352, an insulating member 37 formed of an insulating material is provided as shown in FIGS. The insulating member 37 maintains the insulation between the P-side connecting member 342 and the N-side connecting member 352.

  The capacitor sealing material 36 seals a part of the capacitors 31, 32, 33 and the P-side bus bar 34 and the N-side bus bar 35. In the capacitor module 30 according to an embodiment, a capacitor sealing material 36 is potted in a capacitor module case 361 in which capacitors 31, 32, 33, a P-side bus bar 34, and an N-side bus bar 35 are arranged. 33, etc. are sealed.

  The capacitor module 30 has assembly parts 38 on both sides in the x direction. The assembly part 38 has a screw hole. The capacitor module 30 is screwed to the housing member 40 by a bolt 381 inserted through the screw hole.

  The housing member 40 is a member formed of metal, for example, aluminum having excellent thermal conductivity. The housing member 40 includes an intermediate wall 41, a side wall 421 as “one side wall”, a “side wall body in one direction”, a side wall 422 as “other side wall”, a first joint wall 44, a first lid. Part 45, second lid part 46, second joining wall 47, and the like. The intermediate wall 41, the side walls 421 and 422, the first joint wall 44, the first lid portion 45, the second lid portion 46, and the second joint wall 47 are integrally formed.

  The intermediate wall 41 is provided between the stacked body of the plurality of semiconductor modules 11 and the plurality of cooling fins 21 stacked alternately and the capacitor module 30. The intermediate wall 41 includes a capacitor space 401 as a “first storage space” in which the capacitor module 30 can be stored in the internal space of the storage member 40 and an element space 402 as a “second storage space” in which the laminate can be stored. Divide into and. A depression 411 is formed on one side of the intermediate wall 41 in the z direction. The P-side connection member 342 and the N-side connection member 352 are located in the recess 411. The intermediate wall 41 has a groove 412 through which the assembly portion 38 passes when the capacitor module 30 is inserted into the capacitor space 401. The inner wall surface 413 of the intermediate wall 41 on the capacitor space 401 side is formed to face the outer wall surface 302 as the “outer wall surface on the radially outer side” of the capacitor module 30. As shown in FIGS. 3 and 5, the inner wall surface 414 on the element space 402 side of the intermediate wall 41 has a curved surface shape in accordance with the shape of the end portion of the cooling fin 21.

The side wall 421 is provided at one end in the y direction of the intermediate wall 41 and is formed to extend to one side in the x direction as “a direction different from one direction”. The side wall 421 is formed in a substantially flat plate shape. In one embodiment, the side wall 421 is provided to join the intermediate wall 41 at a right angle. The inner wall surface 423 of the side wall 421 on the capacitor space 401 side is formed to face the outer wall surface 303 as the “outer wall surface on the insertion side in the axial direction” of the capacitor module 30. That is, the side wall 421 becomes the bottom wall of the capacitor space 401.
The side wall 422 is provided at one end in the y direction of the intermediate wall 41 and is formed to extend to the other side in the x direction. The side wall 422 is formed in a substantially flat plate shape. In one embodiment, the side wall 422 is provided to join the intermediate wall 41 at a right angle. The “right angle” in describing the positional relationship between the walls of the housing member 40 includes not only a right angle in a strict sense but also an angle relationship that can be made a right angle by visual observation.

  The first joining wall 44 is provided at one end of the side wall 421 in the x direction. The first joining wall 44 is provided so as to be joined to the side wall 421 at a right angle, and is formed to extend to the other side in the y direction. The first bonding wall 44 forms a capacitor space 401 together with the intermediate wall 41 and the side wall 421. The inner wall surface 441 on the capacitor space 401 side of the first bonding wall 44 is formed to face the outer wall surface 305 as the “outer wall surface on the radially outer side” of the capacitor module 30. The first joining wall 44 has a groove 442 through which the assembly portion 38 passes when the capacitor module 30 is inserted into the capacitor space 401.

  The first lid 45 is provided at one end of the side wall 421 in the z direction and one end of the first bonding wall 44 in the z direction. The first lid 45 is provided so as to be joined to the side wall 421 and the first joining wall 44 at a right angle. The first lid 45 covers a part of the outer wall surface 301 of the capacitor module 30 accommodated in the capacitor space 401. The first lid 45 has an opening 450 as a “through hole” on the other side in the x direction. The opening 450 communicates the capacitor space 401 with the outside. Further, the opening 450 communicates with the element space 402 through the recess 411. The size of the opening 450 is such that the P-side connection terminal 341 and the N-side connection terminal 351 can be exposed to the outside. From the opening 450, the P-side connection terminal 341 and the N-side connection terminal 351 of the capacitor module 30 are exposed to the outside.

  The second lid 46 is provided at the other end in the z direction of the intermediate wall 41, the other end in the z direction of the side wall 421, and the other end in the z direction of the first joining wall 44. It has been. The second lid portion 46 is provided so as to be joined to the intermediate wall 41, the side wall 421, and the first joint wall 44 at a right angle and in parallel with the first lid portion 45. The second lid portion 46 includes an outer wall surface 306 as an “outer wall surface on the radially outer side of the capacitor module” and an “other outer wall surface” on the other side in the z direction of the capacitor module 30 accommodated in the capacitor space 401. cover. “Parallel” when describing the positional relationship of the walls of the housing member 40 includes not only parallel in a strict sense but also an angular relationship that can be made parallel by visual observation.

  As described above, the capacitor space 401 is formed by the intermediate wall 41, the side wall 421, the first bonding wall 44, the first lid portion 45, and the second lid portion 46. The capacitor space 401 includes an end on the other side in the y direction of the intermediate wall 41, an end on the other side in the y direction of the first joint wall 44, and an end on the other side in the y direction of the first lid 45. , And communicated with an opening 431 as a “first insertion port” formed from the other end portion of the second lid portion 46 in the y direction. The opening 431 is formed so that the capacitor module 30 can be inserted.

  The second bonding wall 47 is provided at the other end of the side wall 422 in the x direction. The second joining wall 47 is provided so as to be joined to the side wall 422 at a right angle, and is formed to extend to the other side in the y direction. The second bonding wall 47 forms an element space 402 together with the intermediate wall 41 and the side wall 422. The element space 402 communicates with an opening 432 as a “second insertion port” formed from the other end in the y direction of the intermediate wall 41 and the other end in the y direction of the second bonding wall 47. ing. The opening 432 is formed so that a laminated body can be inserted.

The laminated body housed in the element space 402 is surrounded by the housing member 40 on both sides in the x direction and both sides in the y direction, while both sides in the z direction are exposed to the outside. On one side in the z direction of the element space 402, a terminal space 403 in which the P terminal 111, the N terminal 112, and the output terminal 113 of the semiconductor module 11 are located is formed. The terminal space 403 communicates with the element space 402. Further, a substrate space 404 as a “third accommodation space” capable of accommodating the control circuit board 15 is formed on the other side in the z direction of the element space 402. The substrate space 404 communicates with the element space 402.
As shown in FIG. 3, the inner wall surface 471 of the second joining wall 47 has a curved surface shape in accordance with the shape of the end portion of the cooling fin 21.

  The biasing member 50 is provided between the cooling fin 21 and the side wall 422 that are located closest to the side wall 422 among the plurality of cooling fins. One end of the biasing member 50 is in contact with the inner wall surface 424 of the side wall 422 on the element space 402 side. The other end is in contact with the cooling fin 21 located closest to the side wall 422. The biasing member 50 biases the stacked body to the other side in the y direction.

  A lid member 51 as a “through-hole lid member” is provided on one side in the z direction of the housing member 40. The lid member 51 is formed in a flat plate shape and is fixed to the housing member 40 with bolts 511. As shown in FIGS. 3 and 5, the lid member 51 is formed so as to close the opening 450, the recess 411, and the terminal space 403.

  A lid member 52 as a “substrate lid member” is provided on the other side in the z direction of the housing member 40. The lid member 52 is formed in a flat plate shape and is fixed to the housing member 40 by bolts 521. As shown in FIGS. 3 and 5, the lid member 52 is formed so as to close the substrate space 404.

Next, a method for assembling the power conversion device 1 will be described.
First, the semiconductor module 11 is inserted between the plurality of cooling fins 21 included in the cooling unit 20 to form a stacked body.

Next, the capacitor module 30 in which the P-side connection member 342 and the N-side connection member 352 are not assembled is inserted into the capacitor space 401 through the opening 431. The capacitor module 30 inserted into the capacitor space 401 is fixed to the housing member 40 by two assembly portions 38 and bolts 381.
Next, the stacked body is inserted into the element space 402 through the opening 432. The laminated body inserted into the element space 402 abuts on the urging member 50 provided on the side wall 422 and is urged to the other side in the y direction.

  When the stacked body is accommodated in the element space 402, the cooling plate 22 includes the end surface 415 on the other side in the y direction of the intermediate wall 41, the end surface 443 on the other side in the y direction of the first bonding wall 44, and the first lid 45. The openings 431 and 432 are closed while abutting against the other end surface in the y direction, the other end surface in the y direction of the second lid 46, and the other end surface 472 in the y direction of the second bonding wall 47. It is fixed to the housing member 40. Thus, a part of the inner wall surface of the cooling plate 22 on the capacitor space 401 side faces the outer wall surface 304 as the “outer wall surface opposite to the axial insertion side” of the capacitor module 30.

Next, the capacitor module 30 and the semiconductor module 11 are electrically connected.
Specifically, the P side connection terminal 341 of the capacitor module 30 and the P terminal 111 of the semiconductor module 11 are connected by the P side connection member 342. Further, the N side connection terminal 351 of the capacitor module 30 and the N terminal 112 of the semiconductor module 11 are connected by the N side connection member 352. The P-side connection member 342 and the N-side connection member 352 are inserted into the opening 450 and the recess 411 from one side in the Z direction of the housing member 40 and assembled to the capacitor module 30 and the semiconductor module 11. When the P-side connection member 342 and the N-side connection member 352 are assembled to the capacitor module 30 and the semiconductor module 11, the P-side connection member 342 and the N-side connection member 352 are positioned in the opening 450, the recess 411, and the element space 402. To do.
Further, the control circuit board 15 is assembled to the connection terminal 114, and the control circuit board 15 and the connection terminal 114 are electrically connected in the board space 404.
Finally, the lid members 51 and 52 are assembled to the housing member 40.

  In the power conversion device 1, the capacitor module 30 is accommodated in the capacitor space 401 included in the accommodation member 40. The capacitor module 30 has an intermediate wall 41, a first lid 45, and a first joint on the outer side in the radial direction of the capacitor module 30, where the y direction that is the direction in which the capacitor module 30 is inserted into the opening 431 is the axial direction of the capacitor module 30 The wall 44 and the second lid 46 are covered. Further, the capacitor module 30 is covered with a side wall 421 on one side in the y direction, which is the “axial insertion side”. Further, the capacitor module 30 is covered with the cooling plate 22 on the other side in the y direction, which is “the side opposite to the insertion side in the axial direction”. That is, in the capacitor module 30 accommodated in the capacitor space 401, the outer wall surfaces 301, 302, 303, 304, 305, 306 are covered with the accommodating member 40 or the cooling plate 22. As a result, heat released from the capacitor module 30 having a relatively high temperature is transmitted to the housing member 40 or the cooling plate 22. Since the housing member 40 is efficiently cooled by the cooling plate 22 that contacts the housing member 40 so as to close the opening 431, the heat transferred to the housing member 40 is external to the power conversion device 1 via the cooling unit 20. Can be released. Therefore, the capacitor module 30 covered with the housing member 40 and the cooling plate 22 can be sufficiently cooled.

  The opening 450 of the first lid 45 has a size that allows the P-side connection terminal 341 and the N-side connection terminal 351 to be exposed to the outside. As a result, most of the outer wall surfaces 301, 302, 303, 304, 305, 306 of the capacitor module 30 are covered with the housing member 40 or the cooling plate 22, so that most of the heat released from the capacitor module 30 is contained in the housing member. 40 or cooling plate 22. Therefore, the capacitor module 30 can be sufficiently cooled.

  In the power converter 1, the capacitor module 30 is formed in a rectangular parallelepiped shape. On the other hand, the intermediate wall 41 and the side wall 421 forming the capacitor space 401 are provided to be joined at a right angle. The first joining wall 44 is provided so as to be joined to the side wall 421 at a right angle. The first lid 45 is provided so as to be joined to the side wall 421 and the first joining wall 44 at a right angle. The second lid 46 is provided so as to be joined to the intermediate wall 41, the side wall 421, and the first joint wall 44 at a right angle and in parallel with the first lid 45. Thereby, since the capacitor space 401 is formed so as to follow the shape of the capacitor module 30, the heat released from the capacitor module 30 can be efficiently transmitted to the housing member 40. Therefore, the capacitor module 30 can be efficiently cooled via the housing member 40.

  The intermediate wall 41 has a recess 411 in which a P-side connection member 342 having a flat plate portion 344 and an N-side connection member 352 having a flat plate portion 354 are located. Accordingly, since the P-side connection terminal 341 and the P terminal 111 and the N-side connection terminal 351 and the N terminal 112 can be linearly connected, the lid member 51 can be formed in a flat plate shape. Therefore, the physique of the power converter device 1 can be made smaller than when connecting the P-side connection terminal and the P terminal and the N-side connection terminal and the N terminal so as to bypass the intermediate wall.

In the power conversion device 1, the lid member 51 is provided so as to close the opening 450, the depression 411, and the terminal space 403. In the opening 450, the depression 411, and the terminal space 403, the P-side connection member 342 of the P-side bus bar 34 and the N-side connection member 352 of the N-side bus bar 35 that easily transmit heat generated by the capacitors 31, 32, and 33 are located. ing. Thereby, the P-side connection member 342 and the N-side connection member 352 can be cooled by the lid member 51. Therefore, the capacitors 31, 32, and 33 can be sufficiently cooled.
Further, since the capacitor module 30 is covered with the housing member 40 and the lid member 51, it is possible to prevent heat radiation to the outside. It is possible to prevent a problem from occurring in another device outside the power conversion device 1 due to heat radiation from the capacitor module 30.

  The lid member 52 is formed to close the substrate space 404. As a result, it is possible to prevent external foreign matter from entering the substrate space 404.

(Other embodiments)
In the above-described embodiment, the capacitor space is formed by the intermediate wall, the side wall on the capacitor module side, the first joint wall, the first lid portion, and the second lid portion. However, the wall forming the capacitor space is not limited to this. When the direction in which the capacitor module is inserted into the opening is the axial direction of the capacitor module, the outer wall surface on the radially outer side of the capacitor module and the outer wall surface on the insertion side in the axial direction may be covered with the housing member. .

  In the above-described embodiment, the capacitor module is formed in a rectangular parallelepiped shape. However, the shape of the capacitor module is not limited to this.

  In the above-described embodiment, the intermediate wall and the side wall on the capacitor module side are provided so as to be joined at a right angle. Further, the first joining wall is provided so as to be joined at right angles to the side wall on the capacitor module side. Further, the first lid portion is provided so as to be joined at right angles to the intermediate wall, the side wall on the capacitor module side, and the first joining wall. Further, the second lid portion is provided so as to be joined at right angles to the intermediate wall, the side wall on the capacitor module side, and the first joint wall and to be parallel to the first lid portion. However, the positional relationship between the wall and the lid forming the capacitor housing space is not limited to this.

  In the above-described embodiment, the intermediate wall has a recess in which the P-side connecting member and the N-side connecting member are located. However, the depression may not be present.

  In the above-described embodiment, the lid member formed so as to close the terminal space and the lid member formed so as to close the substrate housing space are provided. However, these lid members may not be provided.

  In the above-described embodiment, the “direction in which the multilayer body and the capacitor module are inserted” and “one direction” in which the plurality of semiconductor modules and the plurality of cooling fins are alternately stacked are the same direction y. The direction. However, the “insertion direction” and the “one direction” may be different.

  In the above-described embodiment, the capacitor module has two bus bars. However, the number of bus bars is not limited to this.

  In the above-described embodiment, the capacitor module has three cylindrical capacitors. However, the shape and number of capacitors are not limited to this. In the above-described embodiment, the capacitors are provided so as to be arranged in the x direction. However, the direction in which the capacitors are arranged is not limited to this.

  As mentioned above, this invention is not limited to such embodiment, It can implement with a various form in the range which does not deviate from the summary.

DESCRIPTION OF SYMBOLS 1 ... Power converter 10 ... Inverter 11 ... Semiconductor module 20 ... Cooling part 22 ... Cooling plate 30 ... Capacitor module 301, 302, 303, 304, 305, 306 ... Outer wall surface 40 ... Housing member 450 ... Opening (through hole)
401 ... Capacitor space (first housing space)
402: Element space (second housing space)
50 ・ ・ ・ Biasing member

Claims (8)

It has a plurality of semiconductor modules (11) formed from a switching element (12) and an element sealing material (14) for sealing the switching element and arranged in one direction. An inverter (10) to convert;
A plurality of cooling fins (21) alternately stacked with the semiconductor module while being in contact with the semiconductor module on one side or the other side in one direction of the semiconductor module, and the plurality of semiconductor modules stacked alternately And a cooling plate (22) provided on the other side in the one direction of the laminate of the plurality of cooling fins, and a temperature lower than the temperature of the semiconductor module in the plurality of cooling fins and in the cooling plate A cooling section (20) having a cooling pipe (23) for circulating a fluid of
Capacitors (31, 32, 33) capable of charging DC power supplied from the power source (3) and discharging the charged power, and electrically connecting the power source (3) and a plurality of the switching elements and the capacitor. A capacitor module having a bus bar (34, 35) made of metal and a capacitor sealing material (36) for sealing the capacitor and a part of the bus bar, and smoothing a voltage of DC power applied to the switching element (30),
A first insertion port (431) formed on the other side of the one direction and capable of inserting the capacitor module in the one direction, and a first accommodation space that communicates with the first insertion port and can accommodate the capacitor module ( 401), a second insertion port (432) formed on the other side of the one direction and capable of inserting the laminate in the one direction, and a second insertion port communicating with the second insertion port and accommodating the laminate. A housing member (40) having a through-hole (450) through which the housing space (402) and the first housing space and the second housing space communicate with each other and a portion of the bus bar is located;
A biasing member provided between the laminate and the inner wall surface (424) of the wall (422) on one side of the accommodation member in the second housing space and biasing the laminate. 50),
With
The capacitor module housed in the first housing space has an outer wall surface (outside in the radial direction of the capacitor module), where the capacitor module is inserted into the first insertion slot in the axial direction. 301, 302, 305, 306) and the outer wall surface (303) on the insertion side in the axial direction are covered by the housing member, and the outer wall surface (304) on the opposite side of the insertion side in the axial direction of the capacitor module. The power converter covered with the said cooling plate contact | abutted to the said accommodating member so that said 2nd insertion port may be plugged up. The bus bar has connection terminals (341, 351) formed so as to protrude from the capacitor sealing material,
The power conversion device according to claim 1, wherein the size of the through hole is such that the connection terminal can be exposed to the outside.   The housing member is provided between the laminated body and the capacitor module, and is provided at an end portion on one side in one direction of the intermediate wall that is formed to extend in the one direction. One side wall (421) formed to extend to one side in a direction different from the one direction and a direction different from the one direction provided at one end of the intermediate wall in one direction The other side wall as one side wall body in the one direction formed so as to extend to the other side of the one side, and joined to the end portion on the one side of the one side wall, together with the intermediate wall and the one side wall, the first The capacitor that is accommodated in the first accommodation space while being joined to the first joining wall (44) forming the one accommodation space, the intermediate wall, the one side wall, and the first joining wall to form the through hole. One as the outer wall surface on the radial outside of the module The first outer wall surface of the capacitor module that is joined to the first housing space and joined to the first lid portion (45) covering the wall surface (301), the intermediate wall, the one side wall, and the first joint wall. A second lid portion (46) that covers another outer wall surface (306) as an outer wall surface in the radial direction of the capacitor module on the opposite side of the capacitor module, and an end on the other side of the other side wall. The power converter according to claim 1 or 2 which has the 2nd joined wall (47) which forms said 2nd accommodation space with an intermediate wall and said other side wall. The capacitor module is formed in a rectangular parallelepiped shape,
The one side wall is joined to the intermediate wall at a right angle;
The first joining wall is provided to be parallel to the intermediate wall while joining at right angles to the one side wall,
The first lid part is joined at right angles to the intermediate wall, the one side wall and the first joining wall,
The power conversion device according to claim 3, wherein the second lid portion is provided so as to be parallel to the first lid portion while being joined at right angles to the intermediate wall, the one side wall, and the first joint wall.   5. The power conversion device according to claim 3, wherein the intermediate wall has a recess (411) communicating the through hole and the second accommodation space.   The power converter according to any one of claims 1 to 5, further comprising a through hole lid member (51) for closing the through hole. The inverter has a control circuit board (15) on which a control circuit for controlling the operation of the switching element is mounted.
The power conversion device according to any one of claims 1 to 6, wherein the housing member has a third housing space (404) that communicates with the second housing space and the outside and can house the control circuit board.   The power converter according to claim 7, further comprising a substrate lid member (52) that closes the third accommodation space.

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