JP2017092201A - Substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of avoiding collision between a transfer device and a lift pin without polluting a substrate.SOLUTION: A substrate processing apparatus 100 includes: a transfer robot 2 including two hands 211, a horizontally moving mechanism 225 for advancing/retreating the hands 211 in a predetermined direction at heights different from each other, and a lifting mechanism 224 for lifting the hands 211; two substrate mounting units 40a, 40b arranged in the predetermined direction; and lift pins 43 provided on the substrate mounting units 40a, 40b and capable of projecting/retreating from mounting surfaces 420. Each lift pin 43 is provided at a position not overlapping with a movement area Q in which the hands 211 are advanced/retreated when viewed from above. A height at which one of the hands 211 for transferring a substrate W to/from the first substrate mounting unit 40a advances/retreats is lower than a height at which the other of the hands for transferring the substrate to/from the second substrate mounting unit 40b that is arranged closer to the transfer robot 2 than to the first substrate mounting unit 40a advances/retreats.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a substrate processing apparatus that performs various types of processing on a substrate.

  In a substrate processing apparatus, a group of substrates accommodated in a magazine rack or the like is taken out one by one by a transfer device and loaded into a processing chamber, and the substrates are processed one by one in the processing chamber (so-called, Some have adopted a single wafer type). The single-wafer method has the advantage of being able to perform highly accurate processing compared to a method (so-called batch method) that processes several tens of substrates at a time, but has the disadvantage that the tact time is increased. .

  Therefore, in order to shorten the tact time, a type of substrate processing apparatus that simultaneously processes two substrates in one processing chamber has been proposed (see Patent Documents 1 to 3). In this type of substrate processing apparatus, the transfer device simultaneously carries two substrates (unprocessed substrates) into the processing chamber and simultaneously unloads two substrates (processed substrates) from the processing chamber.

JP 2012-164716 A JP 2011-023505 A JP 2013-149840 A

  In the substrate processing apparatus described in Patent Document 1, the operation when the transfer device carries two substrates into the processing unit at the same time will be described with reference to FIG. Here, the transfer apparatus includes two transfer arms 91a and 91b arranged at different height positions, and the hands 92 of the transfer arms 91a and 91b hold the substrates W one by one, thereby processing the processing unit. Enter 9 In the processing unit 9, two substrate placement units 93a and 93b are juxtaposed along the entry path of the transfer arms 91a and 91b, and the transfer arms 91a and 91b are arranged with respect to the substrate placement units 93a and 93b. Performs transfer of the substrate W at the same time.

  Each of the substrate mounting portions 93a and 93b is provided with a plurality of lift pins 95a and 95b provided so as to be able to appear and retract with respect to the mounting surface on which the substrate W is mounted. When the substrate W is transferred from the hand 92 of each transfer arm 91a, 91b to each substrate mounting portion 93a, 93b, each lift pin 95a, 95b is projected from the placement surface (projected state), and each transfer arm 91a is moved. , 91b are disposed above the substrate placement portions 93a, 93b, respectively (step S91). From this state, when each hand 92 is lowered, the substrate W held by each hand 92 is transferred onto the lift pins 95a and 95b of the respective substrate platforms 93a and 93b. Then, the transfer arms 91a and 91b and the hands 92 are retracted from the processing unit 9 (step S92), the lift pins 95a and 95b are lowered, and the tip is below the placement surface (immersion state). (Step S93). Thereby, each substrate W is placed on each substrate placement portion 93a, 93b.

  In the substrate processing apparatus described in Patent Document 1, a part of lift pins 95b included in the substrate mounting portion 93b on the near side (that is, the side close to the insertion port 94 of the transfer arms 91a and 91b formed in the processing portion 9). However, it is provided at a position overlapping the moving area Q when the hand 92 moves forward and backward as viewed from above. For this reason, when the transfer arm 91a that delivers the substrate W to the rear substrate placement portion 93a descends, a device is provided to prevent this from colliding with the lift pins 95b of the front substrate placement portion 93b. Necessary.

  Therefore, in the substrate processing apparatus described in Patent Document 1, when the lift pins 95a and 95b are in the protruding state, the tip position of the lift pin 95a of the back substrate mounting portion 93a is the front substrate mounting. The transfer arm 91a which is higher than the tip position of the lift pin 95b of the portion 93b and which is disposed on the upper side with respect to the rear substrate mounting portion 93a is opposed to the front substrate mounting portion 93b. The transfer arms 91b arranged on the lower side transfer and receive the substrates W, respectively. In such a configuration, the height range in which the transfer arm 91a that transfers the substrate W to the substrate mounting portion 93a on the back side moves is higher than the tip position of the lift pin 95b of the substrate mounting portion 93b on the near side. To prevent the transfer arm 91a from colliding with the lift pins 95b of the near-side substrate placement portion 93b when the transfer arm 91a is lowered to deliver the substrate W to the lift pins 95a and is further retracted from the processing portion 9. Yes.

  However, according to the configuration of Patent Document 1, when each of the transfer arms 91a and 91b enters the processing unit 9, it is held by the transfer arm 91b that transmits and receives the substrate W to and from the substrate mounting portion 93b on the near side. Above the substrate W, the transfer arm 91a for transferring the substrate W to the substrate mounting portion 93a on the back side is disposed (see step S91 in FIG. 8). Further, when the transfer arm 91a that has transferred the substrate W to the back substrate mounting portion 93a and the hand 92 thereof are retracted from the processing unit 9, they are supported by lift pins 95b of the front substrate mounting portion 93b. It passes over the substrate W (see step S92 in FIG. 8). From the members such as the transfer arm 91a and the hand 92, the generation of particles is unavoidable. However, according to this configuration in which the member passes above the substrate W, the substrate W may be contaminated by the particles generated from the member. There is.

  The problem to be solved by the present invention is to avoid a collision between a transfer device and a lift pin in a substrate processing apparatus of a type that simultaneously processes a plurality of substrates in one processing chamber without causing substrate contamination. Is to provide technology that can

In order to solve the above problems, a substrate processing apparatus according to the present invention comprises:
A first substrate platform and a second substrate platform arranged in a predetermined direction in the processing chamber;
A first hand that is provided on the second substrate mounting portion side and that transfers a substrate to and from the first substrate mounting portion; a second hand that transfers a substrate to and from the second substrate mounting portion; An elevating mechanism for elevating and lowering one hand and the second hand, and a horizontal moving mechanism for causing the first hand and the second hand to advance and retract in the predetermined direction at a position higher than the first hand. A substrate transport unit comprising:
It is provided in each of the first substrate placement unit and the second substrate placement unit, can be moved in and out of the placement surface, and the first hand and the second hand move forward and backward as viewed from above. A group of lift pins provided at a position that does not overlap the moving area at the time,
Is provided.

In this configuration, each lift pin included in each substrate platform is provided at a position that does not overlap with the movement area when each hand moves forward and backward as viewed from above, so that when the hand moves up and down or moves forward and backward There is no collision with the lift pin.
In addition, the height at which the hand (first hand) for transferring the substrate to the substrate placement unit (first substrate placement unit) on the back side (the side far from the substrate transport unit) moves forward and backward is the front side. Since the hand (second hand) that transfers the substrate to the substrate platform (second substrate platform) on the side that is relatively close to the substrate transport unit (second hand) is lower than the height that moves forward and backward, A member such as the first hand or a transfer arm connected to the first hand is located above the held substrate or above the substrate transferred from the second hand onto the lift pins (lift pins of the second substrate mounting portion). Arrangement can be avoided. Therefore, the substrate is not contaminated with particles generated from the member.
Thus, with this configuration, collision between the transfer device and the lift pins can be avoided without causing contamination of the substrate.

Preferably, the substrate processing apparatus includes:
In a state in which the group of lift pins provided on the first substrate platform and the group of lift pins provided on the second substrate platform protrude from the placement surface, the tips are at the same height. Be placed.

  In this configuration, in the state where the group of lift pins included in each substrate placement unit protrudes from the placement surface, the tips of the lift pins are arranged at the same height, so the lift pins of each substrate placement unit are removed from the projection state. The time required for the immersion state can be made equal. As a result, a board | substrate can be simultaneously mounted in each board | substrate mounting part. Thereby, the throughput in the processing unit can be improved. In addition, when the substrate placement unit is, for example, a hot plate (or cold plate) whose temperature is adjusted to a predetermined temperature, the substrate temperature adjustment process varies if the timing of placing the substrate on each substrate placement unit is shifted. However, such variation does not occur here.

  According to the present invention, each lift pin provided in each substrate mounting portion is provided at a position that does not overlap with the movement area when each hand moves forward and backward as viewed from above. Will not collide with. In addition, the height at which the hand (first hand) for transferring the substrate to the substrate placement unit (first substrate placement unit) on the back side (the side far from the substrate transport unit) moves forward and backward is the front side. Since the second hand for transferring the substrate to the substrate mounting portion (second substrate mounting portion) on the side (relative to the substrate transport portion) is lower than the moving height, the second hand is held by the second hand. The first hand and a member such as a transfer arm connected to the first hand are disposed above the substrate being transferred and above the substrate transferred from the second hand onto the lift pins (lift pins of the second substrate platform). You can avoid that. Therefore, the substrate is not contaminated with particles generated from the member. Thus, with this configuration, collision between the transfer device and the lift pins can be avoided without causing contamination of the substrate.

The top view which shows typically the substrate processing apparatus which concerns on embodiment. The side view which shows the said substrate processing apparatus typically. The figure which shows the flow of the process performed in the said substrate processing apparatus. The figure for demonstrating the process in which a conveyance robot carries a semiconductor substrate in a process part. The figure for demonstrating the process in which a conveyance robot carries a semiconductor substrate in a process part. The figure which shows the layout of the lift pin which concerns on a modification. The figure which shows the layout of the lift pin which concerns on a modification. The figure for demonstrating a prior art.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following embodiment is an example embodying the present invention, and does not limit the technical scope of the present invention.

<1. Configuration of Substrate Processing Apparatus 100>
The configuration of the substrate processing apparatus according to the embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view schematically showing the configuration of the substrate processing apparatus 100. FIG. 2 is a side view schematically showing the configuration of the substrate processing apparatus 100. In FIG. 2, illustration of a part of the substrate processing apparatus 100 is omitted for convenience of explanation.

  The substrate processing apparatus 100 removes an unprocessed semiconductor substrate W from the mounting table 1 on which a magazine rack M storing a plurality of substrates (here, for example, semiconductor substrates) W is placed, and the magazine rack M. An indexer unit 10 in which a transfer robot 2 for storing processed semiconductor substrates W in a magazine rack M and an alignment device 3 for correcting the rotational position of the semiconductor substrates W are provided. Further, the substrate processing apparatus 100 includes a processing unit 4 connected to the indexer unit 10 via the gate valve 20. Furthermore, the substrate processing apparatus 100 includes a control unit 5 that controls each unit included in the substrate processing apparatus 100.

  In the illustrated example, one processing unit 4 is connected to one indexer unit 10, but a plurality of processing units 4 may be connected to one indexer unit 10. In the example shown in the figure, two mounting tables 1 are provided in the indexer unit 10, but the number of mounting tables 1 provided in the indexer unit 10 may be one, or three or more. There may be. In the illustrated example, one alignment device 3 is provided in the indexer unit 10, but the number of alignment devices 3 provided in the indexer unit 10 may be two or more.

<Transport robot 2>
The transfer robot 2 includes two transfer arms 21a and 21b disposed at a predetermined interval in the vertical direction, and a drive mechanism 22 that drives each transfer arm 21 independently. In the following, of the two transfer arms 21a and 21b, the lower one may be referred to as “first transfer arm 21a” and the upper one may be referred to as “second transfer arm 21b”.

  Each of the two transfer arms 21 a and 21 b includes an elongated plate-like hand 211 that supports one semiconductor substrate W and an articulated mechanism 212 connected to the hand 211. A pair of suction portions 213 are formed on the upper surface of the hand 211. In a state where the semiconductor substrate W is placed on the hand 211, each suction part 213 contacts the semiconductor substrate W at each of the opposed positions in the peripheral region on the lower surface of the semiconductor substrate W. Each suction part 213 is connected to a vacuum line (not shown) in which a valve is inserted. When this valve is opened, each suction part 213 vacuums the semiconductor substrate W, and the semiconductor substrate W is paired. The suction part 213 is fixedly held (sucked and held). When this valve is closed, the suction of each suction part 213 is stopped, the air flows between the semiconductor substrate W and each suction part 213 and the suction is released, and the semiconductor substrate W is placed on the hand 211. Will be placed.

  The drive mechanism 22 includes a shaft portion 221 that is coupled to the end of the multi-joint mechanism 212 in each of the two transfer arms 21a and 21b (the end opposite to the side to which the hand 211 is connected). Each shaft portion 221 extends vertically and is connected to the arm stage 222 at the lower end. The arm stage 222 includes various drive mechanisms (specifically, a rotary drive mechanism 223 that rotates each shaft portion 221, an elevating drive mechanism 224 that expands and contracts each shaft portion 221, and each multi-joint mechanism 212. A bending / extension driving mechanism (horizontal driving mechanism) 225) is accommodated. When the rotation drive mechanism 223 rotates each shaft portion 221, each of the transfer arms 21 a and 21 b turns around the shaft portion 221. As the elevating drive mechanism 224 expands and contracts each shaft portion 221, each transfer arm 21a, 21b moves up and down. The bending / extension driving mechanism 225 bends and extends each multi-joint mechanism 212, so that the hand 211 of each transfer arm 21a, 21b moves in the turning radius direction of the transfer arm 21a, 21b in the horizontal plane (that is, close to the shaft portion 221 or Move forward and backward).

  With the above configuration, the transfer robot 2 can move the transfer arms 21a and 21b independently (elevating movement, turning movement in a horizontal plane, and advance / retreat movement along the turning radius direction). Under the control of the control unit 5, the transfer robot 2 moves the transfer arms 21 a and 21 b to move the hand 211 to the magazine rack M, the alignment device 3, and the processing unit 4 mounted on each mounting table 1. The semiconductor substrate W is transferred between the respective parts M, 3 and 4.

<Alignment device 3>
The alignment apparatus 3 holds the semiconductor substrate W in a horizontal posture and is held by the rotation holding unit 31 that rotates the held semiconductor substrate W around a vertical rotation axis that passes through the center thereof, and the rotation holding unit 31. And a detection unit 32 that detects a characteristic portion of the semiconductor substrate W (specifically, for example, a notch formed on the periphery of the semiconductor substrate W, an orientation flat, or the like).

  When correcting the rotation position of the semiconductor substrate W by the alignment apparatus 3, first, the transfer robot 2 delivers the semiconductor substrate W held by one of the transfer arms 21 a and 21 b to the rotation holding unit 31. When the rotation holding unit 31 receives the semiconductor substrate W, it rotates it once. While the semiconductor substrate W makes one rotation, the detection unit 32 detects a characteristic portion (for example, a notch) formed on the periphery of the semiconductor substrate W. When the notch is detected, the rotation holding unit 31 rotates the semiconductor substrate W so that the notch is arranged in the determined direction. As a result, the rotational position of the semiconductor substrate W held by the rotation holding unit 31 is corrected.

<Processing unit 4>
The processing unit 4 is a processing chamber for performing processing (for example, plasma processing in this embodiment) defined on the semiconductor substrate W, and can process two semiconductor substrates W simultaneously. The processing unit 4 includes a processing chamber 41 and two substrate placement units 40a and 40b disposed therein. In the following, of the two substrate mounting portions 40a and 40b, the one on the back side (that is, the side far from the gate valve 20) is referred to as the “first substrate mounting portion 40a” and the front side (that is, the gate). Those on the side close to the bulb 20 may be referred to as “second substrate placement portion 40b”.

  Each of the two substrate platforms 40a and 40b has the same configuration. That is, each of the two substrate mounting portions 40a and 40b is a group (see the figure) provided so as to be able to protrude and retract with respect to the circular flat plate stage 42 and its upper surface (mounting surface) 420 as viewed from above. In the example, three lift pins 43 and a lift pin drive mechanism 44 that moves the group of lift pins 43 in and out of the mounting surface 420 in synchronization are provided.

  The group of lift pins 43 are arranged on a circumference that is concentric with the center of the stage 42 and that overlaps the peripheral area of the lower surface of the semiconductor substrate W as viewed from above, preferably at equal intervals. However, as shown in FIG. 4, each lift pin 43 is provided at a position that does not overlap with the movement area Q when each hand 211 of each transfer arm 21 a, 21 b of the transfer robot 2 moves forward and backward as seen from above.

  The lift pin drive mechanism 44 moves each lift pin 43 up and down to change the state of each lift pin 43 in a state where the tip of each lift pin 43 protrudes from the placement surface 420 (protrusion state) (state shown in the figure) and each lift pin. The state is switched between a state (immersion state) in which the tip of 43 is located at the same position as or lower than the placement surface 420.

  The processing unit 4 further includes a gas supply unit for supplying various processing gases into the processing chamber 41, a plasma generating unit for generating plasma in the processing chamber 41, an exhaust unit for adjusting the pressure in the processing chamber 41, Etc. (both not shown). When processing is performed on the semiconductor substrate W mounted on the mounting surface 420 of each of the substrate mounting portions 40a and 40b, the gate valve 20 is closed and the processing chamber 41 is hermetically sealed, and then the exhaust portion is The inside of the processing chamber 41 is evacuated. The gas supply unit supplies a processing gas determined in the processing chamber 41, and the plasma generation unit generates plasma in the processing chamber 41. Thereby, plasma processing (for example, plasma etching, plasma ashing, plasma sputtering, plasma deposition, plasma CVD, or the like) is performed on the semiconductor substrate W mounted on each mounting surface 420. However, the process performed in the processing unit 4 is not necessarily a plasma process, and various processes that do not use plasma (for example, processes such as etching, ashing, sputtering, vapor deposition, CVD, heating, cooling, chemical application, and cleaning) ) May be performed.

<2. Operation of Substrate Processing Apparatus 100>
Next, a flow of a series of processes executed in the substrate processing apparatus 100 will be described with reference to FIG. FIG. 3 is a diagram showing the flow of the processing. A series of operations described below is performed under the control of the control unit 5.

  Step S1: First, the transfer robot 2 takes out the unprocessed semiconductor substrates W one by one from the magazine rack M mounted on the mounting unit 1 by each of the two transfer arms 21a and 21b. The transfer robot 2 may take out the semiconductor substrate W at the same time with each of the transfer arms 21a and 21b (that is, the two semiconductor substrates W may be taken out at a time), or one of the transfer arms (for example, the first transfer arm). The semiconductor substrate W may be taken out by the other transport arm (for example, the second transport arm) 21b after the semiconductor substrate W is taken out by the first transport arm 21a (that is, the two semiconductor substrates W may be taken out in order). ).

  Step S2: Subsequently, the transfer robot 2 carries the semiconductor substrate W held by one transfer arm (for example, the first transfer arm) 21a into the alignment apparatus 3. When the semiconductor substrate W is carried into the alignment apparatus 3, a process (alignment process) for correcting the rotational position of the semiconductor substrate W is performed by the alignment apparatus 3. Specifically, as described above, first, the rotation holding unit 31 rotates the semiconductor substrate W once, and during that time, the detection unit 32 detects a characteristic portion (for example, a notch) formed on the periphery of the semiconductor substrate W. To do. When the notch is detected, the rotation holding unit 31 rotates the semiconductor substrate W so that the notch is arranged in the determined direction.

  Step S3: When the alignment process for the semiconductor substrate W is completed in the alignment apparatus 3, the transport robot 2 unloads the semiconductor substrate W that has undergone the alignment process from the alignment apparatus 3 by the first transport arm 21a and the second transport arm 21b. The semiconductor substrate W held in step 1 is carried into the alignment apparatus 3. When a new semiconductor substrate W is carried into the alignment apparatus 3, alignment processing for the semiconductor substrate W is performed by the alignment apparatus 3.

  Step S4: When the alignment process on the semiconductor substrate W is completed in the alignment apparatus 3, the transfer robot 2 carries out the alignment-processed semiconductor substrate W from the alignment apparatus 3 by the second transfer arm 21b. As a result, the transfer robot 2 is in a state where each of the two transfer arms 21a and 21b holds the semiconductor substrate W that has undergone the alignment process.

  Step S5: Subsequently, the transfer robot 2 carries the semiconductor substrate W held by each of the two transfer arms 21a and 21b into the processing unit 4 at the same time, and places them on the substrate mounting units 40a and 40b. Put. This process will be specifically described later.

  Step S6: When two semiconductor substrates W are loaded into the processing unit 4, plasma processing is performed on the two semiconductor substrates W. Specifically, after the gate valve 20 is closed, the processing chamber 41 is depressurized to a predetermined pressure, and further, a processing gas is supplied into the processing chamber 41 and a plasma generation unit is placed in the processing chamber 41. Generate plasma. As a result, plasma processing is performed on the semiconductor substrate W placed on each placement surface 420. When the plasma processing for each semiconductor substrate W is completed after a predetermined time has elapsed since the plasma processing was started, the generation of plasma and the supply of the processing gas are stopped, the processing chamber 41 is decompressed, and the gate The valve 20 is opened.

  Step S7: When the gate valve 20 is opened, the transfer robot 2 uses the two transfer arms 21a and 21b, and the two semiconductor substrates W in the processing unit 4 (that is, the substrate mounting units 40a and 40b). The semiconductor substrate W) placed on 40b is simultaneously unloaded from the processing unit 4. This process will be specifically described later.

  Step S8: Subsequently, the transport robot 2 carries the two semiconductor substrates W carried out from the processing unit 4 into the magazine rack M placed on the placement unit 1. As a result, a series of processes for the two semiconductor substrates W is completed. When there is an unprocessed semiconductor substrate W in the magazine rack M, the processes of step S1 to step S8 are subsequently performed on the unprocessed semiconductor substrate W.

<3. Transfer of semiconductor substrate W between transfer robot 2 and processing unit 4>
<3-1. Carrying into processing unit 4>
Next, the process (step S5) in which the transfer robot 2 carries the semiconductor substrate W into the processing unit 4 will be specifically described with reference to FIGS. 4 and 5 are diagrams for explaining the processing.

  Step S51: When the gate valve 20 is opened, the transfer robot 2 extends the multi-joint mechanism 212 of each transfer arm 21a, 21b to place each hand 211 (that is, each hand 211 holding the semiconductor substrate W) in a horizontal plane. The substrate 211 is moved along the arrangement direction of the substrate placement units 40a and 40b to enter the processing chamber 41, and the hands 211 are arranged above the substrate placement units 40a and 40b. Specifically, the hand 211 of the lower transfer arm (first transfer arm) 21a out of the two transfer arms 21a and 21b arranged at a predetermined interval in the vertical direction is set to the first upper height. It is moved in the horizontal plane of Ha and placed above the stage 42 of the substrate mounting portion 40a on the back side. Further, the hand 211 of the upper transfer arm (second transfer arm) 21b is moved in a horizontal plane having a second upper height (that is, a second upper height higher than the first upper height Ha) Hb, It arrange | positions above the stage 42 of the board | substrate mounting part 40b of a near side. At this time, the group of lift pins 43 of the substrate mounting portions 40a and 40b are in a protruding state. In this state, the tip positions of the group of lift pins 43 provided in one substrate placement unit 40a and the tip positions of the group of lift pins 43 provided in the other substrate placement unit 40b have the same height. At this time, the first upper height Ha at which the hand 211 of the first transfer arm 21a moves is higher (preferably slightly higher) than the tip position of each lift pin 43.

  Step S52: When each hand 211 is arranged above each substrate placement unit 40a, 40b, the suction of each suction unit 213 of each hand 211 is stopped (that is, each semiconductor substrate W After being simply placed on the hand 211), the hand 211 of each transfer arm 21a, 21b is lowered. Specifically, the hand 211 of the first transfer arm 21a is lowered from the first upper height Ha to a first lower height La that is a predetermined distance lower than the first upper height Ha. Further, the hand 211 of the second transfer arm 21b is lowered from the second upper height Hb to the second lower height Lb which is lower by the predetermined distance than the second upper height Hb. However, the first lower height La and the second lower height Lb are both the height between the tip of the lift pin 43 and the mounting surface 420. In the middle of the lowering, each lift pin 43 comes into contact with the lower surface of the semiconductor substrate W placed on the hand 211, and the semiconductor substrate W is supported by the group of lift pins 43. When the transfer arms 21a and 21b are further lowered, the hand 211 is separated from the semiconductor substrate W. That is, the semiconductor substrate W held by the hand 211 of the first transfer arm 21a is transferred onto the group of lift pins 43 on the back side substrate mounting portion 40a and held by the second transfer arm 21b. W is transferred onto a group of lift pins 43 on the substrate mounting portion 40b on the front side.

  Step S53: When the first transfer arm 21a reaches the first lower height La and the second transfer arm 21b reaches the second lower height Lb, the transfer robot 2 increases the number of transfer arms 21a and 21b. The joint mechanism 212 is contracted, and each hand 211 is moved in the horizontal plane along the arrangement direction of the substrate placement units 40a and 40b (specifically, the hand 211 of the first transfer arm 21a is moved down to the first lower side). Each hand 211 is retreated from the processing chamber 41 by moving in a horizontal plane having a side height La and moving the hand 211 of the second transfer arm 21b in a horizontal plane having a second lower height Lb.

  Step S54: When the transfer arms 21a and 21b are retracted from the processing chamber 41, the gate valve 20 is closed. On the other hand, the lift pin drive mechanism 44 lowers the group of lift pins 43 of the substrate mounting portions 40a and 40b to switch from the protruding state to the immersed state. As a result, the substrate W is placed on the placement surface 420 of the stage 42 of each of the substrate placement portions 40a and 40b. Thus, the process of step S5 is completed.

<3-3. Unloading from processing unit 4>
Next, the process (step S7) in which the transfer robot 2 carries the semiconductor substrate W out of the processing unit 4 will be specifically described. Since the process of step S7 is performed by performing the operation opposite to that of step S5, FIGS. 4 and 5 will be continuously referred to in the following description.

  Step S71: First, the lift pin drive mechanism 44 raises the group of lift pins 43 of the substrate placement units 40a and 40b to switch from the immersed state to the protruding state. As a result, the semiconductor substrate W placed on the placement surface 420 of the stage 42 of each of the substrate placement portions 40 a and 40 b is supported by the group of lift pins 43.

  Step S72: Subsequently, when the gate valve 20 is opened, the transfer robot 2 extends the multi-joint mechanism 212 of the transfer arms 21a and 21b, and moves the hands 211 to the substrate placement units 40a and 40b in the horizontal plane. The hand 211 is moved above the stage 42 of each substrate platform 40a, 40b and lift pins of the substrate platform 40a, 40b. The semiconductor substrate W supported by 43 is disposed below the semiconductor substrate W. Specifically, the hand 211 of the lower transfer arm (first transfer arm) 21a out of the two transfer arms 21a and 21b arranged at a predetermined interval in the vertical direction is set to the first lower height. It is moved within a horizontal plane of La and is disposed between the mounting surface 420 of the stage 42 of the substrate mounting portion 40a on the back side and the semiconductor substrate W supported by the lift pins 43 of the substrate mounting portion 40a. . Further, the hand 211 of the upper transfer arm (second transfer arm) 21b is moved in a horizontal plane having the second lower height Lb, and the placement surface 420 of the stage 42 of the front substrate placement unit 40b It arrange | positions between the semiconductor substrates W currently supported by the lift pin 43 of the said board | substrate mounting part 40b.

  Step S73: When the respective hands 211 are arranged above the respective substrate placement units 40a and 40b, the hands 211 of the respective transport arms 21a and 21b are subsequently raised. Specifically, the hand 211 of the first transfer arm 21a rises from the first lower height La to a first upper height Ha that is higher than the first lower height La by a predetermined distance. Further, the hand 211 of the second transfer arm 21b rises from the second lower height Lb to the second upper height Hb that is higher by the predetermined distance. In the middle of the ascent, each suction portion 213 of each hand 211 comes into contact with the peripheral area of the lower surface of the semiconductor substrate W placed on the lift pins 43, and the semiconductor substrate W is placed on the hand 211. Become. When the transfer arms 21a and 21b are further lifted therefrom, the lift pins 43 are separated from the semiconductor substrate W. In other words, the semiconductor substrate W that has been placed on the back substrate placing portion 40a is transferred onto the hand 211 of the first transfer arm 21a, and the semiconductor substrate that has been placed on the front substrate placing portion 40b. W is transferred onto the hand 211 of the second transfer arm 21b. When the semiconductor substrate W is transferred onto each hand 211, the suction of each suction part 213 is started. As a result, each semiconductor substrate W is sucked and held by the hand 211.

  Step S74: When the first transfer arm 21a reaches the first upper height Ha and the second transfer arm 21b reaches the second upper height Hb, the transfer robot 2 is connected to the multi-joint mechanism of the transfer arms 21a and 21b. 212 is shortened, and each hand 211 is moved in the horizontal plane along the arrangement direction of the substrate mounting portions 40a and 40b (specifically, the hand 211 of the first transport arm 21a is moved to the first upper height). Each hand 211 is retreated from the processing chamber 41 by moving in the horizontal plane of Ha and moving the hand 211 of the second transfer arm 21b in the horizontal plane of the second upper height Hb).

  However, when the hand 211 (the hand 211 holding the semiconductor substrate W) of each of the transfer arms 21a and 21b is moved forward and backward in step S51 and step S74 to enter or retreat from the processing chamber 41. Are in a relative positional relationship such that the semiconductor substrates W held by the respective hands 211 do not overlap each other when viewed from above. Therefore, since the substrate W held by the hand 211 of the first transport arm 21a does not come below the hand 211 of the second transport arm 21b, the substrate W is not contaminated. Furthermore, the moving speed of the hand 211 of the first transfer arm 21a and the moving speed of the hand 211 of the second transfer arm 21b are the same (that is, the relative positional relationship of each hand 211 changes from the above-mentioned relative positional relationship). Preferably).

<4. Effect>
According to the above embodiment, each lift pin 43 provided in each substrate platform 40a, 40b is provided at a position that does not overlap with the movement area Q when each hand 211 moves forward and backward as viewed from above. When the hand 211 moves up and down or moves forward and backward, it does not collide with the lift pin 43.
Further, the height at which the hand (first hand) 211 for transferring the semiconductor substrate W to the substrate placing part (first substrate placing part) 40a on the back side (the side far from the transfer robot 2) moves forward and backward. However, from the height at which the hand (second hand) 211 for transferring the semiconductor substrate W to the substrate placing part (second substrate placing part) 40b on the front side (side relatively close to the transfer robot 2) moves forward and backward. Is lower than the semiconductor substrate W held by the second hand 211 or above the semiconductor substrate W transferred from the second hand 211 onto the lift pins 43 (the lift pins 43 of the second substrate mounting portion 40b). In addition, it is possible to avoid arranging the first hand 211 and the members such as the first transfer arm 21a connected thereto. Therefore, the semiconductor substrate W is not contaminated with particles generated from the member.
Thus, in this configuration, collision between the transfer robot 2 and the lift pins 43 can be avoided without causing contamination of the semiconductor substrate W.

  In addition, according to the above-described embodiment, the tips of the lift pins 43 are arranged at the same height in a state where the group of lift pins 43 provided in the substrate mounting portions 40a and 40b protrude from the mounting surface 420. The time required for the lift pins 43 of the substrate placement units 40a and 40b to be changed from the protruding state to the immersed state can be made equal. As a result, the semiconductor substrate W can be simultaneously mounted on each substrate mounting part 40a, 40b. Thereby, the throughput in the processing unit 4 can be improved.

<6. Other embodiments>
In the above embodiment, the layout of the lift pins 43 in each of the substrate platforms 40a and 40b is the same. However, for example, as shown in FIG. 6, the layout of the lift pins 43 of the first substrate platform 40a and the first The layout of the lift pins 43 of the two-substrate placement unit 40b may be different. However, also in this case, each lift pin 43 is provided at a position that does not overlap with the movement area Q when the hand 211 of each transfer arm 21a, 21b of the transfer robot 2 moves forward and backward as viewed from above.

  In the above embodiment, the three substrate mounting portions 40a and 40b are provided with the three lift pins 43. However, the number of the lift pins 43 is not limited to this. For example, as shown in FIG. 7, the number of lift pins 43 may be four. However, in this case as well, the four lift pins 43 are provided at positions that do not overlap with the moving area Q when the hands 211 of the transfer arms 21a and 21b of the transfer robot 2 move forward and backward as viewed from above.

  In the above embodiment, when each lift pin 43 is in a protruding state, the tip position of each lift pin 43 provided in one of the substrate platforms 40a and the tip position of each lift pin 43 provided in the other substrate platform 40b Are the same height, but are not necessarily the same height. For example, the tip position of each lift pin 43 provided in the rear substrate placement unit 40a may be lower than the tip position of each lift pin 43 provided in the front substrate placement unit 40b. Further, for example, the tip position of each lift pin 43 provided in the rear substrate placement unit 40a may be higher than the tip position of each lift pin 43 provided in the front substrate placement unit 40b.

  In the above embodiment, the processing unit 4 may heat or cool the semiconductor substrate W. In this case, the stage 42 may be constituted by, for example, a hot plate or a cold plate whose temperature is adjusted to a predetermined temperature. In this case, as in the substrate processing apparatus 100 according to the above-described embodiment, the tips of the lift pins 43 have the same height in a state where the group of lift pins 43 provided in the substrate placement portions 40a and 40b protrude from the placement surface 420. As described above, since the semiconductor substrate W can be simultaneously placed on each of the substrate placement portions 40a and 40b as described above, the semiconductor substrate W is placed on each of the substrate placement portions 40a and 40b. It is possible to avoid a situation in which the temperature adjustment processing of the semiconductor substrate W varies due to the shift of the placement timing.

  In the above embodiment, the hand 211 sucks and holds the semiconductor substrate W by vacuuming (vacuum suction) the peripheral region on the lower surface of the semiconductor substrate W (so-called vacuum chuck), but the hand 211 is a semiconductor. The mode of sucking and holding the substrate W is not limited to this. For example, the semiconductor substrate W may be sucked and held by electrostatic suction (electrostatic suction) of the peripheral area on the lower surface of the semiconductor substrate W (so-called electrostatic chuck), or the peripheral area on the lower surface of the semiconductor substrate W. May be held by an electromagnetic method (electromagnetic suction) to hold the semiconductor substrate W (so-called electromagnetic chuck).

  In the above embodiment, the substrate to be processed is the semiconductor substrate W. However, the substrate to be processed is not limited to the semiconductor substrate W, and may be a glass substrate, for example.

DESCRIPTION OF SYMBOLS 1 Placement part 2 Transfer robot 21a, 21b Transfer arm 211 Hand 212 Articulated mechanism 213 Hand suction part 3 Alignment device 4 Processing part 40a, 40b Substrate placement part 43 Lift pin 5 Control part 100 Substrate processing apparatus W Semiconductor substrate Q Transport Moving area M when the arm moves back and forth Magazine rack

Claims (2)

A first substrate platform and a second substrate platform arranged in a predetermined direction in the processing chamber;
A first hand that is provided on the second substrate mounting portion side and that transfers a substrate to and from the first substrate mounting portion; a second hand that transfers a substrate to and from the second substrate mounting portion; An elevating mechanism for elevating and lowering one hand and the second hand, and a horizontal moving mechanism for causing the first hand and the second hand to advance and retract in the predetermined direction at a position higher than the first hand. A substrate transport unit comprising:
It is provided in each of the first substrate placement unit and the second substrate placement unit, can be moved in and out of the placement surface, and the first hand and the second hand move forward and backward as viewed from above. A group of lift pins provided at a position that does not overlap the moving area at the time,
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
In a state in which the group of lift pins provided on the first substrate platform and the group of lift pins provided on the second substrate platform protrude from the placement surface, the tips are at the same height. Arranged,
Substrate processing equipment.

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