JP2013149840A - Wafer processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a novel wafer processing apparatus including a moving mechanism capable of moving a plurality of wafers simultaneously.SOLUTION: A wafer processing apparatus 1 includes a pedestal part 15 capable of moving up and down and rotating on a center axis C1, a first operation part 16 having a first hand part 16a and a first arm part 16b, a second operation part 17 having a second hand part 17a and a second arm part 17b, and a processing chamber 11. The first and second hand parts 16a and 17a extend radially from the side of the center axis C1 respectively. The first and second arm parts 16b and 17b move back the first or second hand part 16a or 17a radially. The second hand part 17a is positioned at a distance L above the first hand part 16a. A wafer installation surface of a second installation part 22 is provided at the distance L above a wafer installation surface of the first installation part 21.

Description

  The present invention relates to a wafer processing apparatus.

  For example, when manufacturing a semiconductor device including a semiconductor wafer, it is necessary to perform a plurality of treatments such as film formation, etching, and cleaning. For this reason, when manufacturing a semiconductor device, it is necessary to put a semiconductor wafer into and out of a treatment room for performing each treatment. For this reason, conventionally, for example, Patent Document 1 proposes a wafer treatment apparatus provided with various wafer transfer mechanisms.

  In the wafer treatment apparatus described in Patent Document 1, a tray on which a wafer is placed is provided in a comb-tooth shape. A plurality of wafers are placed on the tray along the direction in which the comb teeth extend. Then, a plurality of wafers placed along the extending direction of the comb teeth are simultaneously acquired using a comb-shaped hand portion having a shape inserted into the tray. Therefore, according to the wafer treatment apparatus described in Patent Document 1, a plurality of wafers placed on the tray can be simultaneously transferred to the treatment room. Therefore, the wafer treatment can be performed with high efficiency.

JP 2006-294786 A

  However, in the wafer treatment apparatus described in Patent Document 1, in order to acquire the wafer placed on the tray with the hand, the hand is accurately moved with respect to the tray to a position where the hand and the tray are interleaved with each other. It is necessary to let Therefore, there is a problem that control is difficult.

  The main object of the present invention is to provide a novel wafer treatment apparatus having a moving mechanism capable of simultaneously moving a plurality of wafers.

  A wafer treatment apparatus according to the present invention includes a pedestal part, a first operation part, a second operation part, a container, and a treatment room for treating a wafer. The pedestal portion is provided so as to be movable up and down and rotatable about a central axis. The first operation unit includes a first hand unit and a first arm unit. The first hand portion extends along the radial direction from the central axis side. The first arm portion is provided on the pedestal portion. The first arm part advances and retracts the first hand part in the radial direction. The second operation unit includes a second hand unit and a second arm unit. The second hand portion extends along the radial direction from the central axis side. The second hand part is located above the first hand part by a distance L. The second arm portion is provided on the pedestal portion. The second arm part advances and retracts the second hand part in the radial direction. In the container, a plurality of wafers are placed at intervals from each other along the direction in which the central axis extends. The treatment room has a first installation part and a second installation part. The second installation part is arranged on the outer side in the radial direction with the central axis as a center with respect to the first installation part. The wafer installation surface of the second installation unit is provided at a position higher than the wafer installation surface of the first installation unit by a distance L.

  In a specific aspect of the wafer treatment apparatus according to the present invention, in the container, the distance between adjacent wafers in the direction in which the central axis extends is equal to the distance L.

  In another specific aspect of the wafer treatment apparatus according to the present invention, the wafer treatment apparatus further includes a mounting table and a position adjustment mechanism. The mounting table is disposed between the container and the treatment room in the circumferential direction around the central axis. A wafer supported by the first hand unit and a wafer supported by the second hand unit are placed on the mounting table. The position adjusting mechanism adjusts the position of the wafer mounted on the mounting table.

  In another specific aspect of the wafer treatment apparatus according to the present invention, the wafer treatment apparatus further includes a control unit. The control unit drives the first and second arm units to advance and retract the first and second hand units in the radial direction, thereby allowing the first hand unit and the second hand unit to respectively Get the wafer that was installed in the. The control unit was acquired by the first hand unit by rotating the pedestal unit and then driving the first and second arm units to advance and retract the first and second hand units in the radial direction. An installation process is performed in which the wafer is installed in the first installation unit, and the wafer acquired by the second hand unit is installed in the second installation unit.

  In still another specific aspect of the wafer treatment apparatus according to the present invention, the control unit performs advance / retreat of the first hand unit and advance / retreat of the second hand unit in parallel in the installation process.

  ADVANTAGE OF THE INVENTION According to this invention, the novel wafer treatment apparatus provided with the moving mechanism which can move a some wafer simultaneously can be provided.

It is a typical top view of a wafer treatment device concerning one embodiment of the present invention. It is a typical side view of the wafer treatment apparatus concerning one embodiment of the present invention. It is a typical perspective view of the operating device at the time of acquisition process implementation in one Embodiment of this invention. It is a typical perspective view of the operating device at the time of installation process implementation in one Embodiment of this invention.

  Hereinafter, an example of the preferable form which implemented this invention is demonstrated. However, the following embodiment is merely an example. The present invention is not limited to the following embodiments.

  Moreover, in each drawing referred in embodiment etc., the member which has a substantially the same function shall be referred with the same code | symbol. The drawings referred to in the embodiments and the like are schematically described, and the ratio of the dimensions of the objects drawn in the drawings may be different from the ratio of the dimensions of the actual objects. The dimensional ratio of the object may be different between the drawings. The specific dimensional ratio of the object should be determined in consideration of the following description.

(Configuration of wafer treatment apparatus 1)
FIG. 1 is a schematic plan view of a wafer treatment apparatus 1 according to this embodiment. FIG. 2 is a schematic side view of the wafer treatment apparatus according to the present embodiment. FIG. 3 is a schematic perspective view of the operating device 13 during the acquisition process in the present embodiment. FIG. 4 is a schematic perspective view of the operating device 13 during the installation process in the present embodiment.

  A wafer treatment apparatus 1 shown in FIGS. 1 and 2 is an apparatus for performing treatment on a wafer, for example. The type of treatment applied to the wafer is not particularly limited. The wafer treatment apparatus 1 may be an apparatus that performs film formation, etching, patterning, cleaning, and the like on the wafer, for example.

  The wafer treatment apparatus 1 includes an installation chamber 10 and a treatment chamber 11. The installation room 10 and the treatment room 11 are provided adjacent to each other. When the treatment chamber 11 is in a reduced pressure atmosphere relative to the installation chamber 10 or when the atmosphere gas is different between the treatment chamber 11 and the installation chamber 10, the treatment chamber 11 is opened and closed between the treatment chamber 11 and the installation chamber 10. Possible doors may be provided.

  The installation chamber 10 is provided with a container 14 and an operation device 13. The operating device 13 includes a pedestal 15, a first operating unit 16, and a second operating unit 17. The pedestal portion 15 is provided such that the central axis C1 faces the vertical direction. The pedestal portion 15 can be raised and lowered. The pedestal portion 15 can be rotated in both directions around the central axis C1.

  The first operation unit 16 and the second operation unit 17 are provided on the pedestal unit 15. The first operation unit 16 includes a first hand unit 16a and a first arm unit 16b. The first hand portion 16a extends along the radial direction from the central axis C1 side. The first hand portion 16a is provided in a plate shape. A wafer can be placed on the first hand portion 16a.

  The first arm portion 16 b is provided on the pedestal portion 15. The first arm portion 16b advances and retracts the first hand portion 16a in the radial direction around the central axis C1. That is, the first arm portion 16b moves the first hand portion 16a in a direction away from the central axis C1 and a direction approaching the central axis C1, respectively.

  The second operation unit 17 includes a second hand unit 17a and a second arm unit 17b. The second hand portion 17a extends along the radial direction from the central axis C1. The second hand portion 17a is provided in a plate shape. A wafer can be placed on the second hand portion 17a.

  The second hand portion 17a and the first hand portion 16a are arranged so as to overlap when viewed from the vertical direction (the direction in which the central axis C1 extends). In the vertical direction (the direction in which the central axis C1 extends), the second hand portion 17a is located above the first hand portion 16a by a distance L. The distance L can be appropriately set according to the thickness of the hand portions 16a and 17a, for example. The distance L may be about 0.47 mm to 0.94 mm, for example.

  The second arm portion 17 b is provided on the pedestal portion 15. The second arm portion 17b advances and retracts the second hand portion 17a in the radial direction around the central axis C1. That is, the second arm portion 17b moves the second hand portion 17a in a direction away from the central axis C1 and a direction approaching the central axis C1, respectively.

  The container 14 is provided such that a plurality of wafers can be installed at intervals from each other along the vertical direction (direction in which the central axis C1 extends). In the container 14, the distance between adjacent wafers in the vertical direction (the direction in which the central axis C1 extends) is equal to the distance between the first hand portion 16a and the second hand portion 17a, and is preferably L. .

  The controller device 13 is controlled by the control unit 40. Specifically, the raising / lowering and rotation of the pedestal portion 15, the operation of the first and second arm portions 16 b and 17 b, etc. are performed by the control portion 40. In addition, a position adjustment mechanism 32 described later is also controlled by the control unit 40.

  The treatment room 11 is a room for performing treatment such as film formation on the wafer. The treatment room 11 is provided with a stage 20 and first and second installation parts 21 and 22 on which wafers are installed, respectively. The first installation part 21 and the second installation part 22 are arranged along a radial direction centered on the central axis C1. The second installation part 22 is arranged on the outer side in the radial direction with respect to the first installation part 21. That is, the first installation part 21 is arranged at a position relatively close to the central axis C1, and the second installation part 22 is arranged at a position relatively far from the central axis C1. The wafer installation surface of the second installation unit 22 is provided at a position higher than the wafer installation surface of the first installation unit 21 by a distance L.

  The configuration of the installation units 21 and 22 is not particularly limited as long as a wafer can be preferably installed on the installation units 21 and 22. The installation parts 21 and 22 can be constituted by, for example, a plurality of rod-like bodies that are arranged apart from each other and can be taken in and out of the stage 20.

  The wafer treatment apparatus 1 further includes a mounting table 31 and a position adjustment mechanism 32.

  The mounting table 31 is disposed between the container 14 and the treatment room 11 in the circumferential direction around the central axis C1. The mounting table 31 includes a first mounting unit on which a wafer supported by the first hand unit 16a is mounted, and a second mounting on which a wafer supported by the second hand unit 17a is mounted. Part. The wafer placement surface of the second placement section is provided at a position higher by a distance L than the wafer placement surface of the first placement section.

  The position adjustment mechanism 32 adjusts the positions of the two wafers mounted on the mounting table 31. Specifically, the position adjustment mechanism 32 substantially matches the positions of the two wafers mounted on the mounting table 31.

(Operation of wafer treatment apparatus 1)
Next, the operation of the wafer treatment apparatus 1 will be described in detail with reference to FIGS. 3 to 4 in addition to FIGS. 1 and 2.

(Wafer acquisition process)
First, the control unit 40 rotates the pedestal unit 15 so that the wafers installed in the container 14 are positioned on the extended lines of the first and second hand units 16a and 17a in plan view. The operation units 16 and 17 are positioned.

  Next, the control unit 40 drives the first arm unit 16b to insert the first hand unit 16a below the wafer. Thereafter, the control unit 40 raises the pedestal unit 15 to cause the first hand unit 16a to acquire a wafer. The control unit 40 drives the first arm unit 16b to pull out the first hand unit 16a from the container 14. Further, the control unit 40 drives the second arm portion 17b to insert the second hand portion 17a below the wafer. Thereafter, the control unit 40 raises the pedestal unit 15 to cause the second hand unit 17a to acquire a wafer. The controller 40 pulls out the second arm portion 17b from the container 14 by driving the second arm portion 17b.

  The acquisition of the wafer by the first hand unit 16a and the acquisition of the wafer by the second hand unit 17a may be performed simultaneously.

(Position adjustment process)
Next, the control unit 40 appropriately rotates and raises and lowers the pedestal unit 15 and moves the first and second hand units 16a and 17a appropriately, thereby loading the wafer acquired by the first hand unit 16a. The wafer placed on the first placement portion of the placement table 31 and the wafer acquired by the second hand unit 17 a are placed on the second placement portion of the placement table 31. Next, the position adjustment mechanism 32 adjusts the positions of the two mounted wafers. Thereafter, the control unit 40 drives the pedestal unit 15 and the first and second arm units 16b and 17b as appropriate to cause the first and second hand units 16a and 17a to acquire a wafer again.

  By performing this position adjustment process, it becomes possible to install two wafers on the installation parts 21 and 22 with high positional accuracy in the installation process described later.

(Installation process)
Next, the control unit 40 rotates the pedestal unit 15 to first position the first and second installation units 21 and 22 on the extension line of the first and second hand units 16a and 17a. The second hand portions 16a and 17a are moved. Next, the control unit 40 drives the first arm unit 16 b to move the first hand unit 16 a forward and backward, and obtains the first hand unit 16 a on the installation surface of the first installation unit 21. Install the wafer that had been used. Further, the control unit 40 drives the second arm unit 17b to advance and retract the second hand unit 17a, and is acquired by the second hand unit 17a on the installation surface of the second installation unit 22. Install the wafer.

  In the present embodiment, the control unit 40 is acquired by the first hand unit 16a by performing the advance / retreat of the first hand unit 16a and the advance / retreat of the second hand unit 17a in parallel in this installation step. The placed wafer is placed in parallel with the placement of the wafer acquired by the second hand unit 17a.

(Treatment process)
The first and second installation portions 21 and 22 are accommodated in the stage 20 so that the wafer is placed on the stage 20. Thereafter, the control unit 40 drives a treatment mechanism provided in the treatment chamber 11 to perform a treatment on each wafer placed on the stage 20.

  As described above, in the present embodiment, the wafer installation surface of the second installation unit 22 is arranged such that the first hand unit 16a and the second hand unit 17a are arranged on the wafer installation surface of the first installation unit 21. Is provided at a position higher by a distance L equal to the distance between. For this reason, the wafer acquired in the first hand unit 16a can be preferably installed in the first installation unit 21, and the wafer acquired in the second hand unit 17a is installed in the first view in plan view. It can be suitably installed in the second installation part 22 arranged at a position different from the part 21.

  Further, the installation of the wafer on the first installation unit 21 and the installation of the wafer on the second installation unit 22 can be performed in parallel. Therefore, the wafer can be treated with high efficiency.

  In this embodiment, the distance between the wafers in the container 14 is also equal to the distance L. Therefore, the wafer accommodated in the container 14 can be acquired in parallel by the first hand unit 16a and the second hand unit 17a. Therefore, the wafer can be treated more efficiently.

  Moreover, in the wafer treatment apparatus 1, it can acquire with the hand parts 16a and 17a, without adsorb | sucking a wafer. Therefore, the installation chamber 10 and the treatment chamber 11 can be in a reduced pressure atmosphere.

DESCRIPTION OF SYMBOLS 1 ... Wafer treatment apparatus 10 ... Installation room 11 ... Treatment room 13 ... Operation apparatus 14 ... Container 15 ... Base part 16 ... 1st operation part 16a ... 1st hand part 16b ... 1st arm part 17 ... 2nd Operation unit 17a ... second hand unit 17b ... second arm unit 20 ... stage 21 ... first installation unit 22 ... second installation unit 31 ... mounting table 32 ... position adjusting mechanism 40 ... control unit C1 ... center axis

Claims (5)

A pedestal that can be raised and lowered and rotatable about a central axis;
A first hand portion extending in a radial direction from the central axis side; and a first arm portion which is provided on the pedestal portion and advances and retracts the first hand portion in the radial direction. A first operation unit;
A second hand portion extending in a radial direction from the central axis side, positioned above the first hand portion by a distance L, and provided on the pedestal portion; A second operating portion having a second arm portion for moving the hand portion back and forth in the radial direction;
A container in which a plurality of wafers are spaced apart from each other along the direction in which the central axis extends;
A treatment chamber for treating the wafer;
With
The treatment room is
A first installation section;
A second installation part disposed on the outer side in the radial direction centered on the central axis with respect to the first installation part;
Have
The wafer treatment apparatus, wherein the wafer installation surface of the second installation unit is provided at a position higher by the distance L than the wafer installation surface of the first installation unit.   2. The wafer treatment apparatus according to claim 1, wherein in the container, a distance between adjacent wafers in the direction in which the central axis extends is equal to the distance L. 3. In the circumferential direction around the central axis, the wafer is disposed between the container and the treatment chamber, and is supported by the first hand unit and the wafer supported by the second hand unit, A mounting table on which is mounted;
A position adjusting mechanism for adjusting the position of the wafer placed on the mounting table;
The wafer treatment apparatus according to claim 1, further comprising: By driving the first and second arm portions to advance and retract the first and second hand portions in the radial direction, the first hand portion and the second hand portion respectively. Obtaining a wafer installed in the container;
Acquired by the first hand unit by rotating the pedestal unit and then driving the first and second arm units to advance and retract the first and second hand units in the radial direction. An installation step of installing the wafer that had been acquired by the second hand unit in the second installation unit, and installing the wafer that had been in the first installation unit;
The wafer treatment apparatus according to claim 1, further comprising a control unit that performs the operation.   5. The wafer according to claim 1, wherein in the installation step, the control unit performs advance / retreat of the first hand unit and advance / retreat of the second hand unit in parallel. Treatment device.

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