JP6630884B2 - Substrate alignment device - Google Patents

Description

  The present invention relates to an alignment apparatus that detects a characteristic portion of a substrate (for example, a notch formed in a peripheral edge of the substrate) and corrects a rotational position of the substrate so that the substrate is arranged in a predetermined direction.

  2. Description of the Related Art In a substrate processing apparatus that performs various types of processing on a substrate, in many cases, correction of a rotational position of the substrate (so-called alignment) is performed prior to performing the processing on the substrate. The rotation position is corrected, for example, by detecting the position of a characteristic portion (specifically, a notch such as a notch or an orientation flat) formed on the peripheral edge of the substrate, and disposing the position in a predetermined direction. This is performed by changing the rotational position of the substrate (for example, Patent Documents 1 to 4). In addition, in the alignment, the horizontal position of the substrate may be corrected in addition to the correction of the rotational position of the substrate. The horizontal position is corrected, for example, by detecting the peripheral position of the substrate, specifying the amount of deviation (eccentricity) of the position of the substrate (for example, the center position of the substrate) from a predetermined position, and moving the substrate to a predetermined position. This is done by changing the horizontal position of the substrate to be placed.

  In the technique described in Patent Document 1, an element for holding a semiconductor substrate in an alignment apparatus (grip unit 1) and a hand (end effector 13) of a transfer robot that transfers semiconductor substrates to and from the element are all semiconductor devices. The semiconductor substrate is held by sucking a central portion of the lower surface of the substrate.

  In recent years, a wiring layer is often formed not only on one surface of a substrate but also on the other surface. In such a substrate, a central portion of a lower surface of the substrate is disposed as in Patent Document 1. No suction is allowed. In view of such circumstances, Patent Documents 2 to 5 propose an alignment device including a holding unit of a type that holds a substrate by abutting a plurality of positions on an end surface of the substrate.

JP 2010-199245 A JP 2000-21956 A JP 2002-151577 A JP 2003-282678 A JP 2006-19645 A

  In the alignment devices of Patent Documents 2 to 4, when the position where the holding portion contacts the semiconductor substrate overlaps with the notch formed on the peripheral edge of the semiconductor substrate, the notch may not be detected. In such a case, it becomes necessary to carry the semiconductor substrate again, and the tact time of the alignment becomes longer.

  Also, in this type of holding unit, when the semiconductor substrate is rotated (that is, when the holding unit is rotated about a vertical axis passing through the center of the semiconductor substrate held by the holding unit), the holding unit and the semiconductor are rotated. The substrate is easily shifted. Therefore, the rotation speed of the holding unit must be sufficiently reduced so that such a displacement does not occur, which is one of the factors that make it impossible to shorten the tact time.

  The problem to be solved by the present invention is to provide a technique capable of quickly performing alignment of a substrate that is not allowed to contact the center of the lower surface.

A substrate alignment device according to the present invention made in order to solve the above problems,
A holding unit that sucks the substrate and holds the substrate at a plurality of spaced first contact points in a peripheral region of a lower surface of the substrate, and a rotation driving unit that rotates the holding unit around a predetermined vertical rotation axis A rotation holding unit comprising:
A detection unit that detects a characteristic portion of the substrate held by the holding unit,
A substrate position correction unit configured to rotate the holding unit based on the detection result of the feature unit so that the feature unit of the board held by the holding unit is arranged in a predetermined direction.
Without changing the rotation position of the substrate, a holding unit position changing unit that changes the rotation position of the holding unit,
Is provided.

  The “peripheral region” of the substrate referred to here is a region (non-product region) of the substrate that is not cut out as a device. For example, a certain width from the periphery of the substrate (for example, a width of about one chip size) It is the area that you have.

The alignment apparatus according to this aspect includes a holding unit that suctions a peripheral area of the lower surface of the substrate and holds the substrate. The substrate transferred by a transfer robot disposed outside the alignment apparatus is provided in the holding unit. Is held. The method of suction may be any of vacuum suction, electrostatic suction, and electromagnetic suction. When the substrate is held by the holding unit, the detection unit detects a characteristic portion of the substrate held by the holding unit. Then, the substrate position correcting unit corrects the rotational position of the substrate by rotating the holding unit around a predetermined vertical rotation axis so that the characteristic portion of the substrate held by the holding unit is arranged in a predetermined direction. I do. At this time, the rotation angle of the holding unit differs for each substrate, and in some cases, the holding unit after rotation may be disposed at a position overlapping the entry path of the hand of the transfer robot when viewed from above, In addition, the transfer robot cannot receive the substrate held by the holding unit (that is, the substrate whose rotational position has been corrected). Here, the alignment device according to this aspect includes a holding portion position changing portion that changes the rotation position of the holding portion without changing the rotation position of the substrate. Move the robot to a position that does not overlap with the approach path of the robot hand. Therefore, the transfer robot can easily receive the substrate held by the holding unit without interfering with the holding unit.
Further, in this aspect, since the holding unit sucks the peripheral region of the lower surface of the substrate and holds the substrate, it is possible to stably hold the substrate, and when the holding unit is rotated, It is unlikely that a position shift occurs between the substrate and the substrate. Therefore, the substrate can be rotated at a sufficiently high speed. As a result, alignment can be performed quickly.

In the alignment apparatus according to the above aspect, the detection unit may detect not only a characteristic portion of the substrate held by the holding unit but also a peripheral position of the substrate, and the substrate position correction unit may move the holding unit, for example. Thereby, the horizontal position of the substrate is corrected so that the substrate held by the holding unit is arranged at a predetermined position, so that the center of the substrate held by the holding unit coincides with the rotation axis of the holding unit. Is also good.
In the conventional method of correcting the horizontal position of the substrate by sandwiching the peripheral edge of the substrate with a gripping member or the like, it is necessary to press the gripping member against the peripheral edge of the substrate with a constant pressure in consideration of the outer diameter dimension tolerance of the substrate. However, the pressing force causes the substrate to bend. In the case of a thin substrate, the amount of deflection is particularly large. If the substrate is bent by the pressing force, the substrate may be displaced when the gripping member retreats and separates from the substrate, and the alignment accuracy when correcting the horizontal position of the substrate may deteriorate. Was.
On the other hand, in the alignment device according to the above aspect, the substrate is not bent since the holding unit holds the substrate by sucking the peripheral region of the lower surface of the substrate. Therefore, when correcting the horizontal position of the substrate, the correction can be performed with high accuracy.

Preferably, the alignment device comprises:
The holding unit position changing unit,
A lifter comprising: an auxiliary holding unit that holds the substrate in contact with the substrate at a plurality of second contact points separated from each other in a peripheral region of a lower surface of the substrate; and a lifting drive unit that moves the auxiliary holding unit up and down.
A control unit that controls the rotation holding unit and the lifter,
Stopping the suction of the substrate in the holding unit, the state where the substrate is placed on the holding unit,
The auxiliary holding unit is moved relatively to the holding unit, and the auxiliary holding unit is positioned above the holding unit from a first state in which the auxiliary holding unit is disposed below the holding unit. By changing to the arranged second state, the substrate placed on the holding unit is held by the auxiliary holding unit to separate the substrate from the holding unit,
Rotating the holding unit separated from the substrate,
By moving the auxiliary holding unit relative to the holding unit and changing the state from the second state to the first state, the substrate held by the auxiliary holding unit is placed on the holding unit after rotation. A control unit for controlling the transfer,
Is provided.

  In this aspect, the positional relationship between the holding unit and the auxiliary holding unit is changed from the first state (that is, the first state in which the auxiliary holding unit is disposed below the holding unit) to the second state (that is, the auxiliary holding unit). Is changed to the second state in which the substrate is disposed above the holding unit), the substrate is changed from the holding unit to the auxiliary holding unit, and the holding unit is rotated in this state. When the holding unit is rotated, the substrate is transferred from the auxiliary holding unit to the holding unit by returning the positional relationship between the holding unit and the auxiliary holding unit from the second state to the first state. According to this configuration, it is possible to quickly change the rotation position of the holding unit without changing the rotation position of the substrate in a simple control mode.

Preferably, the alignment device comprises:
The holding unit includes a suction unit that vacuum-suctions the substrate at the first contact point,
The suction unit includes a suction port divided into two or more sections.

  In this aspect, the suction unit that suctions the substrate by vacuum suction includes a suction port divided into two or more sections. Therefore, even if the notch formed on the peripheral edge of the substrate is placed on a part of the suction port, the substrate can be sucked in another section. Thereby, the substrate can be held particularly stably.

The present invention is also directed to a substrate alignment method. The alignment method of the substrate according to the present invention,
a) a step of holding the substrate by sucking the substrate at a plurality of first contact points spaced apart from each other in a peripheral region of a lower surface of the substrate;
b) detecting a characteristic portion of the substrate held by the holding portion;
c) rotating the holding portion based on the detection result of the feature portion so that the feature portion of the substrate held by the holding portion is arranged in a predetermined direction;
d) changing the rotational position of the holding unit without changing the rotational position of the substrate after the characteristic portion of the substrate is arranged in a predetermined direction;
With
The step of changing the rotation position of the holding unit,
d1) rotating the holding unit that holds the substrate by suction in a predetermined direction by a predetermined rotation amount;
d2) separating the substrate from the holding portion without changing the rotational position of the substrate;
d3) rotating the holding portion separated from the substrate by the predetermined rotation amount in the predetermined direction;
d4) causing the holding unit after rotation to suck and hold the substrate again;
d5) rotating the holding unit that holds the substrate by suction in the direction opposite to the predetermined direction by the predetermined rotation amount;
Is provided.

In the alignment method of this aspect, the d1) step, the d2) step, the d3) step, the d4) step, and the d5) step are performed, so that the rotational position of the holding unit can be changed without changing the rotational position of the substrate. Can be changed. According to this configuration, in a state where the rotational position of the substrate is corrected (that is, a state immediately after the step c) is performed), the holding unit is located at a position overlapping the entrance path of the hand of the transfer robot when viewed from above. It is also possible to cope with a case where the holding unit is disposed at a position where the holding unit interferes with a mechanism (for example, the lifter) for separating the substrate from the holding unit. That is, in such a case, the holding unit holding the substrate is rotated by a predetermined amount of rotation (step d1), and the holding unit is arranged at a position that does not interfere with the hand's approach path or the mechanism. . After that, for example, the substrate is separated from the holding unit using the mechanism (the step d2), and the holding unit is further rotated in the same direction by the predetermined rotation amount (the step d3). Then, after the substrate is again held by the holding section (step d4), the holding section is rotated in the opposite direction by the predetermined rotation amount (step d5). As a result, the rotational position of the substrate returns to the initial state (a state in which the rotational position of the substrate is corrected). On the other hand, the rotation position of the holding unit is changed from the initial state to a position rotated by a predetermined rotation amount. That is, the rotation position of the holding unit moves to a position where the rotation position of the holding unit does not overlap with the approach path of the hand of the transfer robot when viewed from above. Therefore, the transfer robot can easily receive the substrate held by the holding unit without interfering with the holding unit.
Further, in this aspect, since the holding unit sucks the peripheral region of the lower surface of the substrate and holds the substrate, it is possible to stably hold the substrate, and when the holding unit is rotated, It is unlikely that a position shift occurs between the substrate and the substrate. Therefore, the substrate can be rotated at a sufficiently high speed. As a result, alignment can be performed quickly.

  Since the holding unit sucks the peripheral area of the lower surface of the substrate and holds the substrate, it is possible to stably hold the substrate, and when the holding unit is rotated, the position between the holding unit and the substrate is displaced. Is unlikely to occur. Therefore, the substrate can be rotated at a sufficiently high speed. As a result, alignment can be performed quickly.

FIG. 1 is a plan view schematically showing a substrate processing system. FIG. 1 is a side view schematically showing a substrate processing system. The figure which shows the flow of the process performed in a substrate processing system. FIG. 2 is a plan view schematically showing an alignment device. FIG. 5 is a cross-sectional view of the alignment apparatus taken along line AA of FIG. 4. FIG. 3 is a diagram showing a flow of processing performed by the alignment apparatus. FIG. 3 is a diagram showing a flow of processing performed by the alignment apparatus. FIG. 4 is a diagram for explaining the operation of the alignment device. FIG. 4 is a diagram for explaining the operation of the alignment device. FIG. 4 is a plan view for explaining a positional relationship in the first case. FIG. 9 is a plan view for explaining a positional relationship in the second case. The top view for explaining the positional relationship in a 3rd case. FIG. 9 is a plan view schematically showing an alignment device according to a modification. The figure which looked at the alignment apparatus concerning a modification from the AA line of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following embodiments are mere examples embodying the present invention, and do not limit the technical scope of the present invention.

<1. Configuration of Substrate Processing System 100>
Before describing the alignment apparatus according to the embodiment, an overall configuration of a substrate processing system on which the alignment apparatus is mounted will be described with reference to FIGS. FIG. 1 is a plan view schematically showing the configuration of the substrate processing system 100. FIG. 2 is a side view schematically showing the configuration of the substrate processing system 100. In FIG. 2, a part of the substrate processing system 100 is not illustrated for convenience of description.

  The substrate processing system 100 takes out the unprocessed semiconductor substrate W from the magazine rack M on which the magazine rack M in which a plurality of substrates (for example, substantially circular semiconductor substrates) W are stored in multiple stages is mounted. In addition, an indexer unit 10 in which a transfer robot 2 for storing the processed semiconductor substrate W in the magazine rack M and an alignment device 3 for correcting the rotational position of the semiconductor substrate W are provided. Further, the substrate processing system 100 includes a processing unit 4 connected to the indexer unit 10 via a gate valve 20. Further, the substrate processing system 100 includes a control unit 5 that controls each unit included therein.

  In the illustrated example, one processing unit 4 is connected to one indexer unit 10, but a plurality of processing units 4 may be connected to one indexer unit 10. In the illustrated example, two mounting tables 1 are provided in the indexer unit 10. However, the number of the mounting tables 1 provided in the indexer unit 10 may be one, or three or more. There may be. In the illustrated example, one indexing unit 3 is provided in the indexer unit 10, but the number of the alignment units 3 provided in the indexer unit 10 may be two or more.

<Transport robot 2>
The transfer robot 2 includes two transfer arms 21a and 21b arranged at predetermined intervals above and below, and a drive mechanism 22 that drives each transfer arm 21 independently. In the following, of the two transfer arms 21a and 21b, the upper one may be referred to as a "first transfer arm 21a" and the lower one may be referred to as a "second transfer arm 21b".

  Each of the two transfer arms 21a and 21b includes an elongated plate-like hand 211 that supports one semiconductor substrate W, and an articulated mechanism 212 connected to the hand 211. A pair of suction units 213 are formed on the upper surface of the hand 211. However, the suction port 2130 of each suction unit 213 (that is, the opening with respect to the upper surface of the hand 211) is divided into two or more sections (two sections in the illustrated example) 2130a and 2130b.

  In a state where the semiconductor substrate W is placed on the hand 211, each of the suction units 213 contacts the semiconductor substrate W at each of opposing positions in the peripheral region on the lower surface of the semiconductor substrate W. Each suction unit 213 is connected to a vacuum line (not shown) in which a valve is inserted. When this valve is opened, the vacuum line communicates with the suction unit 213 of the hand 211 and each suction unit 213 is connected. The semiconductor substrate W is vacuum-suctioned, and the semiconductor substrate W is fixedly held (suction-held) by the pair of suction units 213. When the valve is closed and the suction unit 213 of the hand 211 returns to the atmospheric pressure, the suction of each suction unit 213 is stopped, and the air flows between the semiconductor substrate W and each suction unit 213 to release the suction. Then, the semiconductor substrate W is placed on the hand 211.

  The drive mechanism 22 includes a shaft 221 connected to an end of the multi-joint mechanism 212 (an end opposite to the side to which the hand 211 is connected) in each of the two transfer arms 21a and 21b. Each shaft portion 221 extends vertically and is connected to the arm stage 222 at the lower end. Various drive mechanisms (specifically, a rotation drive mechanism 223 that rotates each shaft 221, an elevating drive mechanism 224 that expands and contracts each shaft 221, and a multi-joint mechanism 212 are bent on the arm stage 222. The bending / extension drive mechanism 225) is accommodated. When the rotation drive mechanism 223 rotates each shaft 221, each of the transfer arms 21 a and 21 b rotates around the shaft 221. The lifting / lowering drive mechanism 224 expands and contracts the respective shaft portions 221, whereby the respective transfer arms 21 a and 21 b move up and down. The bending / extension drive mechanism 225 causes each articulated mechanism 212 to bend and extend, so that the hand 211 of each of the transfer arms 21a and 21b moves in the turning radial direction of each of the transfer arms 21a and 21b in a horizontal plane (that is, close to or close to the shaft portion 221). In the direction of separation).

  With the above-described configuration, the transfer robot 2 can independently move each of the transfer arms 21a and 21b (elevating movement, turning movement in a horizontal plane, and moving forward and backward along the turning radial direction). The transfer robot 2 moves the transfer arms 21 a and 21 b under the control of the control unit 5 to move the hand 211 to the magazine rack M mounted on each mounting table 1, the alignment device 3, and the processing unit 4. And the semiconductor substrate W is transported between the respective parts M, 3, and 4.

<Alignment device 3>
The configuration of the alignment device 3 will be described later.

<Processing unit 4>
The processing unit 4 is a processing chamber that performs a process (for example, a plasma process in this embodiment) specified for the semiconductor substrate W, and is capable of processing two semiconductor substrates W at the same time. The processing section 4 includes a processing chamber 41 and two substrate mounting sections 40a and 40b disposed therein. In the following, of the two substrate mounting portions 40a and 40b, the one on the far side (that is, the side farther from the gate valve 20) is referred to as the “first substrate mounting portion 40a” and the near side (that is, the gate). The one near the valve 20) may be referred to as a “second substrate mounting part 40b”.

  Each of the two substrate mounting portions 40a and 40b has the same configuration. In other words, each of the two substrate mounting portions 40a and 40b is a circular plate-like stage 42 viewed from above, and a group (see FIG. In the example, three (3) lift pins 43 and a lift pin drive mechanism 44 that causes the group of lift pins 43 to protrude and retract from the mounting surface 420 in synchronization with each other.

  The group of lift pins 43 is preferably arranged at equal intervals in a region on the circumference concentric with the center of the stage 42 and overlapping the peripheral region on the lower surface of the semiconductor substrate W when viewed from above.

  The lift pin drive mechanism 44 raises and lowers each lift pin 43 to change the state of each lift pin 43 into a state in which the tip of each lift pin 43 protrudes from the mounting surface 420 (projected state) (a state shown), and The state is switched between a state in which the tip of 43 is at the same position as the mounting surface 420 or a position below the same (a retracted state). However, in the protruding state, the tip positions of the lift pins 43 provided on the first placement portion 40a are higher than the tip positions of the lift pins 43 provided on the second placement portion 40b.

  When each of the transfer arms 21a and 21b transfers the semiconductor substrate W to each of the substrate mounting portions 40a and 40b, the hand 211 of each of the transfer arms 21a and 21b is operated in a state where each of the lift pins 43 is in a protruding state. 41, the hand 211 of the upper transfer arm (first transfer arm) 21a is placed above the stage 42 of the farther substrate mounting portion (first substrate mounting portion) 40a, and the lower transfer arm The hands 211 of the (second transfer arm) 21b are respectively arranged above the stage of the substrate mounting portion (second substrate mounting portion) 40a on the near side. From this state, each hand 211 descends, and the semiconductor substrate W held by each hand 211 is transferred onto the group of lift pins 43. Then, after each hand 211 has retracted, each lift pin 43 is switched from the protruding state to the retracted state. Thereby, each semiconductor substrate W is mounted on each mounting surface 420.

  On the other hand, when each of the transfer arms 21a and 21b receives the semiconductor substrate W from each of the substrate mounting portions 40a and 40b, first, each of the lift pins 43 is switched from the retracted state to the projected state. Thus, the semiconductor substrate W mounted on each mounting surface 420 is supported by the group of lift pins 43 above the stage 42. In this state, the hands 211 of the transfer arms 21a and 21b are inserted into the processing chamber 41, and the hand 211 of the first transfer arm 21a is placed on the mounting surface 420 of the first substrate mounting portion 40a and the semiconductor substrate W ( The hand 211 of the second transfer arm 21b moves between the mounting surface 420 of the second substrate mounting part 40b and the semiconductor substrate W between the semiconductor substrate W supported by the group of lift pins 43 and the semiconductor substrate W). Be placed. From this state, each hand 211 rises, and each semiconductor substrate W supported by the group of lift pins 43 is transferred onto each hand 211.

  The processing unit 4 further includes a gas supply unit that supplies various processing gases into the processing chamber 41, a plasma generation unit that generates plasma in the processing chamber 41, an exhaust unit that adjusts the pressure in the processing chamber 41, (All are not shown). When processing is performed on the semiconductor substrate W mounted on the mounting surface 420 of each of the substrate mounting portions 40a and 40b, the gate valve 20 is closed, the processing chamber 41 is airtight, and the exhaust unit is closed. The inside of the processing chamber 41 is evacuated. Then, the gas supply unit supplies a predetermined processing gas into the processing chamber 41, and the plasma generation unit generates plasma in the processing chamber 41. Thus, plasma processing (for example, processing such as plasma etching, plasma ashing, plasma sputtering, plasma deposition, and plasma CVD) is performed on the semiconductor substrate W mounted on each mounting surface 420. However, the processing performed in the processing unit 4 is not necessarily a plasma processing, and various processings without using plasma (for example, processing such as etching, ashing, sputtering, vapor deposition, CVD, heating, cooling, application of a chemical solution, and cleaning) ) May be performed.

<2. Operation of Substrate Processing System 100>
Next, a flow of a series of processes executed in the substrate processing system 100 will be described with reference to FIG. FIG. 3 is a diagram showing the flow of the processing. A series of operations described below are performed under the control of the control unit 5.

  Step S1: First, the transfer robot 2 takes out unprocessed semiconductor substrates W one by one from each shelf of the magazine rack M mounted on the mounting portion 1 by each of the two transfer arms 21a and 21b. In addition, the transfer robot 2 may take out the semiconductor substrate W by each of the transfer arms 21a and 21b at the same time (that is, may take out two semiconductor substrates W at one time) or one transfer arm (for example, After the semiconductor substrate W is taken out by one transfer arm 21a, the semiconductor substrate W may be taken out by the other transfer arm (for example, the second transfer arm) 21b (that is, two semiconductor substrates W may be taken out in order). ).

  The magazine rack M is designed such that the inner wall thereof and the peripheral edge of the semiconductor substrate W accommodated therein have some play. For this reason, as described later, in a state where the semiconductor substrate W is carried into the alignment device 3 and held by the holding unit 61 of the rotation holding unit 6, the center of the semiconductor substrate W and the rotation shaft 621 of the rotation driving unit 62 May shift. As will be described later, in this embodiment, a process of correcting the horizontal position of the semiconductor substrate W is performed, and thereby, the shift is corrected.

  Step S2: Subsequently, the transfer robot 2 loads the semiconductor substrate W held by one transfer arm (for example, the first transfer arm) 21a into the alignment device 3. When the semiconductor substrate W is carried into the alignment device 3, a process of correcting the rotational position of the semiconductor substrate W (alignment process) is performed by the alignment device 3. The mode of the processing performed by the alignment device 3 will be described later.

  Step S3: When the alignment process for the semiconductor substrate W is completed by the alignment device 3, the transfer robot 2 unloads the aligned semiconductor substrate W from the alignment device 3 by the first transfer arm 21a and the second transfer arm 21b. The semiconductor substrate W held by the above is carried into the alignment device 3. When a new semiconductor substrate W is loaded into the alignment device 3, the alignment device 3 performs an alignment process on the semiconductor substrate W.

  Step S4: When the alignment process for the semiconductor substrate W is completed by the alignment device 3, the transfer robot 2 unloads the aligned semiconductor substrate W from the alignment device 3 by the second transfer arm 21b. As a result, the transfer robot 2 is in a state of holding the aligned semiconductor substrate W on each of the two transfer arms 21a and 21b.

  Step S5: Subsequently, the transfer robot 2 simultaneously loads the semiconductor substrate W held by each of the two transfer arms 21a and 21b into the processing unit 4. Specifically, of the two transfer arms 21a and 21b, the semiconductor substrate W held by the upper transfer arm (first transfer arm) 21a is moved to the substrate mounting portion (first substrate mounting portion) on the back side. ) The semiconductor substrate W placed on the mounting surface 420 of the 40a and held by the lower transfer arm (second transfer arm) 21b is placed on the front side of the substrate mounting portion (second substrate mounting portion) 40b. It is mounted on the mounting surface 420.

  Step S6: When the two semiconductor substrates W are carried into the processing unit 4, the plasma processing is performed on the two semiconductor substrates W. Specifically, after the gate valve 20 is closed, the pressure in the processing chamber 41 is reduced to a predetermined pressure. Further, the processing gas is supplied into the processing chamber 41, and the plasma generation unit is placed in the processing chamber 41. Generates plasma. Thereby, the plasma processing on the semiconductor substrate W mounted on each mounting surface 420 proceeds. When the plasma processing for each semiconductor substrate W is completed after a predetermined time has elapsed since the start of the plasma processing, the generation of plasma and the supply of the processing gas are stopped, and the processing chamber 41 is depressurized and the gate is released. The valve 20 is opened.

  Step S7: When the gate valve 20 is opened, the transfer robot 2 simultaneously unloads the two semiconductor substrates W in the processing unit 4 from the processing unit 4 with the two transfer arms 21a and 21b. Specifically, of the two transfer arms 21a and 21b, the semiconductor substrate W mounted on the stage 42 of the first substrate mounting portion 40a on the far side is taken out by the first transfer arm 21a on the upper side and taken out. The semiconductor substrate W mounted on the stage 42 of the second substrate mounting portion 40b on the near side is taken out by the second transfer arm 21b on the side.

  Step S8: Subsequently, the transfer robot 2 carries the two semiconductor substrates W carried out of the processing section 4 into the magazine rack M placed on the placement section 1. Thus, a series of processes on the two semiconductor substrates W ends. When there is an unprocessed semiconductor substrate W in the magazine rack M, the processing of steps S1 to S8 is subsequently performed on the unprocessed semiconductor substrate W.

<3. Configuration of Alignment Device 3>
The configuration of the alignment device 3 will be described with reference to FIGS. FIG. 4 is a plan view schematically showing the alignment device 3. FIG. 5 is a cross-sectional view of the alignment device 3 taken along line AA of FIG.

  The alignment device 3 includes a rotation holding unit 6, a lifter 7, a detection unit 8, and a control unit 9 that controls these components 6, 7, and 8.

<Rotation holder 6>
The rotation holding unit 6 includes a holding unit 61 that holds the semiconductor substrate W, a rotation driving unit 62 that rotates the holding unit 61, and a horizontal movement mechanism 63 that moves the holding unit 61 in a horizontal plane.

  The holding portion 61 has a configuration in which a plurality of (four in the example in the figure) horizontally extending arms 611 are radially arranged from the center. The lengths of the plurality of arms 611 are equal to each other. The arms 611 are preferably arranged at equal angular intervals. Here, the angle between the adjacent arms 611 is 90 degrees. The vicinity of the tip of each arm 611 is bent upward, and a suction part 612 is formed at the end. However, the suction port 6120 of each suction unit 612 (that is, the opening with respect to the distal end surface of the arm 611) is divided into two or more sections (two sections in the illustrated example) 6120a and 6120b.

  In a state in which the semiconductor substrate W is disposed substantially concentrically with a rotation shaft portion 621 described later, each of the suction portions 612 serves as a plurality of contact points (first contact points) separated from each other in a peripheral region on the lower surface of the semiconductor substrate W. At contact with the semiconductor substrate W. Each suction unit 612 is connected to a vacuum line 614 in which a valve 613 is inserted. When the valve 613 is opened and the vacuum line 614 communicates with each suction unit 612, each suction unit 612 is connected to the semiconductor substrate. The first contact point of W is vacuum-suctioned, and the semiconductor substrate W is fixedly held (suction-held) by the group of suction units 612. Further, when the valves 613 are closed and each suction unit 612 returns to the atmospheric pressure, the suction of each suction unit 612 is stopped, and the air flows between the semiconductor substrate W and each suction unit 612 to release the suction. In this state, the semiconductor substrate W is simply placed on the group of suction units 612. One end of the vacuum line 614 is connected to the vacuum pump P.

  The rotation drive unit 62 rotates the holding unit 61 around a vertical rotation axis passing through a substantially center of the semiconductor substrate W sucked and held by the holding unit 61. Specifically, the rotation drive unit 62 includes a rotation shaft 621 that extends in the vertical direction and is fixed at the upper end to the center of the holding unit 61, and a drive mechanism 622 that rotates the rotation shaft 621. The drive mechanism 622 is specifically configured to include, for example, a servomotor or a stepping motor capable of detecting and controlling the amount of rotation. When the driving mechanism 622 rotates the rotation shaft 621 in a state where the semiconductor substrate W is suction-held by the holding unit 61, the semiconductor substrate W rotates in a horizontal plane about a vertical axis passing substantially at the center thereof.

  The horizontal moving mechanism 63 moves the holding unit 61 in a horizontal plane. More specifically, the horizontal movement mechanism 63 includes a flat stage 631 on which the holding unit 61 and the rotation driving unit 62 are mounted, and two orthogonal axes (X axis and Y axis) defined in a horizontal plane. (Ie, an X drive mechanism 632 for moving the stage 631 along the X axis and a Y drive mechanism 633 for moving the stage 631 along the Y axis). Each of the drive mechanisms 632 and 633 is specifically configured to include, for example, a servomotor or a stepping motor capable of detecting and controlling the movement amount of the stage 631. When the X driving mechanism 632 (or the Y driving mechanism 633) moves the stage 631 in the X direction (or the Y direction) in a state where the semiconductor substrate W is suction-held by the holding unit 61, the semiconductor substrate W moves in a horizontal plane. To move in the X direction (or Y direction).

<Lifter 7>
The lifter 7 includes an auxiliary holding unit 71 that holds the semiconductor substrate W, and a lifting drive unit 72 that moves the auxiliary holding unit 71 up and down.

  The auxiliary holder 71 includes a pair of holders 710, 710 opposed to each other with the center of the holder 61 (preferably, in the middle). Each holder 710 includes two horizontally extending arms (auxiliary-side arms) 711 and a connecting portion 712 that connects the ends of the two auxiliary-side arms 711 to each other. However, each auxiliary side arm 711 is arranged at a position that does not overlap the arm 611 of the holding unit 61 when viewed from above. Each of the auxiliary arms 711 has a plurality of contact points (ends) of which ends (ends on the free end side) are spaced apart from each other in a peripheral region of a lower surface of the semiconductor substrate W held by the holding portion 61 when viewed from above. 2 contact points). However, the second contact point is a position different from the first contact point (that is, the contact point at which the holding unit 61 contacts the semiconductor substrate W). It is particularly preferable that the first contact point and the second contact point are defined so as to alternately appear along the circumferential direction of the semiconductor substrate W.

  The lifting drive unit 72 moves the auxiliary holding unit 71 up and down between a position (first position) P1 lower than the holding unit 61 and a position (second position) P2 higher than the holding unit 61. Specifically, the elevation drive unit 72 extends in the vertical direction, and is connected to a pair of holders 710, 710 (specifically, for example, a connecting unit 713 that connects the pair of holders 710, 710) at the upper end. A shaft portion 721 that is fixed and formed to be extendable and contractable, and an elevating drive mechanism 722 that extends and contracts the shaft portion 721 are provided. The lifting drive mechanism 722 is specifically configured to include, for example, a motor and a feed mechanism (for example, a ball screw mechanism) that changes the rotation of the motor into expansion and contraction of the shaft 721. When the lifting / lowering drive mechanism 722 expands / contracts the shaft portion 721, the auxiliary holding portion 71 (specifically, a pair of holding members 710) moves up and down.

<Detector 8>
The detecting unit 8 includes a characteristic portion (for example, a notch which is a kind of a notch formed in a peripheral edge of the semiconductor substrate W in this embodiment) suction-held by the holding unit 61, and a peripheral edge of the semiconductor substrate W. An element for detecting a position, specifically, for example, an optical sensor (light transmission type or light reflection type optical sensor) arranged at a position where the periphery of the semiconductor substrate W can be monitored, or a CCD. It is configured to include a camera and the like. Note that the characteristic portion of the semiconductor substrate W detected by the detection unit 8 is not limited to the notch. For example, an orientation flat formed on the periphery of the semiconductor substrate W or a mark (alignment mark) provided in the plane of the semiconductor substrate W may be used as the characteristic portion.

<Control unit 9>
The control unit 9 is configured by a computer, for example, and is electrically connected to each unit included in the alignment device 3 to control the operation of each unit. The control unit 9 may be realized by the control unit 5 of the substrate processing system 100.

  As will be clear later, in this embodiment, the control unit 9 corrects the position of the semiconductor substrate W (specifically, the holding unit 61 is moved in a horizontal plane and held (adsorbed and held) by this). The semiconductor substrate W is arranged at a predetermined horizontal position, and the holding portion 61 is rotated so that the notch of the semiconductor substrate W held (sucked and held) by the holding portion 61 is arranged in a predetermined direction. Function as a substrate position correction unit 101. Further, the control unit 9 and the lifter 7 cooperate to change the position of the holding unit 61 (specifically, change the rotation position of the holding unit 61 without changing the rotation position of the semiconductor substrate W). ) Functions as the holding unit position changing unit 102.

<4. Operation of alignment device 3>
The operation of the alignment device 3 will be described with reference to FIGS. FIG. 6 and FIG. 7 are diagrams showing the flow of the processing performed by the alignment apparatus 3. FIG. 8 and FIG. 9 are schematic diagrams for explaining the operation of the alignment device 3, and schematically show the positional relationship of each element in each step executed by the alignment device 3. FIGS. 10 to 13 are top views for explaining the positional relationship between the holding section 61 of the alignment apparatus 3, the approach path of the hand 211 of the transfer robot 2, and the tip of the auxiliary arm 711. FIG. 11 shows a positional relationship corresponding to a first case described later, FIG. 11 shows a positional relationship corresponding to a second case described later, and FIG. 12 shows a positional relationship corresponding to a third case described later.

  Step S11: First, the transfer robot 2 carries the semiconductor substrate W into the alignment device 3 (each upper stage in FIGS. 10 to 13).

  Specifically, the transfer robot 2 moves the hand 211 of one of the transfer arms (the first transfer arm 21 a in the illustrated example) horizontally along the approach path Q at a height H <b> 1 above the holding unit 61. And the hand 211 is moved into the alignment device 3, and the hand 211 is arranged at a position (entry position) where the center of the semiconductor substrate W sucked and held by the hand 211 substantially coincides with the rotating shaft 621 when viewed from above. I do.

  When the hand 211 is located at the approach position, the hand 211 descends to a height H2 between the suction unit 612 and the arm 611. However, in a state in which a new semiconductor substrate W is received, each suction unit 612 of the holding unit 61 is arranged at a position that does not interfere with the approach path Q of the hand 211 when viewed from above (upper part in FIG. 8). Therefore, the hand 211 does not collide with each suction unit 612 of the holding unit 61 during the movement. Immediately before (or immediately after) the lowering, the suction of the suction units 213 formed on the upper surface of the hand 211 is stopped (that is, the semiconductor substrate W is simply placed on the hand 211). In the course of this lowering, each suction unit 612 of the holding unit 61 comes into contact with a first contact point in the peripheral region on the lower surface of the semiconductor substrate W placed on the hand 211, and the semiconductor substrate W It is placed on the suction unit 612. When the hand 211 further descends therefrom, the hand 211 is completely separated from the semiconductor substrate W, and the semiconductor substrate W is transferred from the hand 211 to the holder 61. When the semiconductor substrate W is transferred to the holding unit 61, the control unit 9 opens the valve 613 inserted in the vacuum line 614. Thereby, each suction unit 612 is vacuum-sucked to the semiconductor substrate W (specifically, the first contact point on the semiconductor substrate W), and the semiconductor substrate W is fixedly held (suction-held) by the group of suction units 612. You. On the other hand, when the hand 211 reaches the height H2 below the suction unit 612, the hand 211 moves horizontally along the approach path Q at the height H2 and retreats from the alignment device 3.

  Step S12: Subsequently, the control section 9 controls the rotation drive section 62 to rotate the holding section 61 once. Thus, the semiconductor substrate W suction-held by the holding unit 61 makes one rotation around a vertical axis passing through the center of the rotation shaft 621. While the semiconductor substrate W makes one rotation, the control unit 9 causes the detection unit 8 to detect a notch formed on the periphery of the semiconductor substrate W. When detecting the notch, the detecting unit 8 notifies the control unit 9 of the position information of the notch. While the semiconductor substrate W makes one rotation, the control unit 9 causes the detecting unit 8 to detect the peripheral position of the semiconductor substrate W, and the amount of change in the peripheral position (specifically, the center of the rotation shaft 62). (The amount of change in the separation distance between the vertical axis passing through and the periphery of the semiconductor substrate W). The detection unit 8 notifies the control unit 9 of the detected fluctuation amount of the peripheral position.

  Step S13: When the amount of change in the peripheral position of the semiconductor substrate W is acquired from the detection unit 8, the control unit 9 specifies the center position of the semiconductor substrate W based on the amount of change. Then, the semiconductor substrate W is arranged at such a position that its center position is located at the center of the alignment device 3 and whose center position coincides with a vertical axis passing through the center of the rotating shaft portion 62 (the horizontal position). correction). Further, when the position information of the notch is obtained from the detection unit 8, the control unit 9 calculates the rotation amount (correction amount) of the semiconductor substrate W necessary to arrange the notch in the determined direction. Then, the rotation driving unit 62 rotates the holding unit 61 by the correction amount. Thereby, the notch of the semiconductor substrate W sucked and held by the holding unit 61 is arranged in the determined direction (correction of the rotational position). In step S13, the correction of the horizontal position is preferably performed prior to the correction of the rotational position.

  Here, a process for correcting the horizontal position of the semiconductor substrate W will be specifically described. When the center position of the semiconductor substrate W is specified, the control unit 9 controls the horizontal movement mechanism 63 to move the holding unit 61 to the position where the semiconductor substrate W held here is determined (specifically, (The position where the center of the semiconductor substrate W is located at the center of the alignment apparatus 3). Next, the control unit 9 controls the elevation drive unit 72 to move the auxiliary holding unit 71 from a position (first position) P1 lower than the holding unit 61 to a position higher than the holding unit 61 (second position). Then, the semiconductor substrate W is transferred from the holding unit 61 to the auxiliary holding unit 71. When the semiconductor substrate W is separated from the holding unit 61, the control unit 9 controls the horizontal moving mechanism 63 so that the holding unit 61 is rotated by the rotation shaft 621 of the rotation driving unit 62 (that is, the auxiliary shaft). It is moved to a position that matches the center of the semiconductor substrate W) held by the holding section 61. That is, the holding unit 61 is moved to a position where the rotating shaft 621 is arranged at the center of the alignment device 3. Thereafter, the control unit 9 controls the elevation drive unit 72 to lower the auxiliary holding unit 71 from the second position P2 to the first position P1. During this descent, each suction unit 612 comes into contact with a first contact point in the peripheral region of the lower surface of the semiconductor substrate W held by the auxiliary holding unit 71, and the semiconductor substrate W is mounted on the group of suction units 612. Is placed. When the auxiliary holding unit 71 is further lowered therefrom, the auxiliary holding unit 71 is separated from the semiconductor substrate W, and the semiconductor substrate W is transferred from the auxiliary holding unit 71 to the holding unit 61. Thereby, the semiconductor substrate W is arranged at a position such that its center position is located at the center of the alignment device 3 and its center position coincides with a vertical axis passing through the center of the rotating shaft portion 62. Become.

Step S14: Next, the control unit 9 holds when the processing of step S13 is completed (that is, when the holding unit 61 rotates and stops by the correction amount and the notch is arranged in the determined direction). The position of the unit 6 (specifically, each suction unit 612 of the holding unit 6) is detected, and it is determined which of the following three cases the position corresponds to.
(First case)
All the suction units 612 are at positions where they do not interfere with the intrusion path Q of the hand 211 and are also at positions where they do not interfere with the tip of the auxiliary side arm 711 (the lower part in FIG. 10).
(2nd case)
At least one suction unit 612 is located at a position where it interferes with the intrusion path Q of the hand 211, but all the suction units 612 are located at a position where they do not interfere with the tip of the auxiliary arm 711 (the middle part in FIG. 11).
(Third case)
At least one suction unit 612 is located at a position where it interferes with the intrusion path Q of the hand 211, and at least one suction unit 612 is located at a position where it also interferes with the tip of the auxiliary arm 711 (the middle part in FIG. 12). .

<I. In the case of the first case>
As shown in FIG. 10, when the position of the suction unit 612 when the process of step S13 is completed corresponds to the first case (YES in step S15), the processes of the next steps S16 to S17 are performed.

  Step S16: The control section 9 closes the valve 613 inserted in the vacuum line 614. Thereby, the suction of each suction unit 612 is stopped, and the semiconductor substrate W is simply placed on the holding unit 61 (specifically, on a group of the suction units 612).

  Step S17: Subsequently, the transfer arm 21 unloads the semiconductor substrate W from the alignment device 3.

  Specifically, the transfer robot 2 moves the hand 211 of one of the transfer arms (the first transfer arm 21a in the illustrated example) to the entry path Q at a height H2 between the suction unit 612 and the arm 611. The suction unit 213 formed at the tip of the hand 211 coincides with the periphery of the semiconductor substrate W held by the holding unit 61 when viewed from above. The hand 211 is arranged at the position (entry position). As described above, in the state of the first case, the holding unit 61 (specifically, each suction unit 621) is arranged at a position that does not interfere with the approach path Q of the hand 211. Therefore, the hand 211 does not collide with the holding unit 61 during the movement.

  When the hand 211 is located at the approach position, the hand 211 rises to a position at a height H1 above the holding unit 61. During this ascent, each suction part 213 of the hand 211 contacts the peripheral area of the lower surface of the semiconductor substrate W placed on the holding part 61, and the semiconductor substrate W is placed on the hand 211. Become. When the hand 211 further rises therefrom, the semiconductor substrate W is lifted by the hand 211, and the holding portion 61 is completely separated from the semiconductor substrate W. That is, the semiconductor substrate W is transferred from the holding unit 61 to the hand 211. When the semiconductor substrate W is transferred to the hand 211, the suction of the suction units 213 formed on the upper surface of the hand 211 is started, and the semiconductor substrate W is in a state of being suction-held by the pair of suction units 213. When the hand 211 reaches the height H1, the hand 211 moves horizontally along the approach path Q at the height H1 and retreats from the alignment device 3. As a result, the semiconductor substrate W is carried out of the alignment device 3, and the alignment process on the semiconductor substrate W is completed.

<Ii. In the case of the second case>
As shown in FIG. 11, when the position of the suction unit 612 at the time when the process of step S13 is completed corresponds to the second case (YES in step S18), the following processes of steps S19 to S21 are performed.

  Step S19: The control section 9 controls the elevation drive section 72 to move the auxiliary holding section 71 from a position (first position) P1 lower than the holding section 61 to a position higher than the holding section 61 (second position). Increase to P2. During the ascent, the tip of each auxiliary arm 711 contacts a second contact point in the peripheral area on the lower surface of the semiconductor substrate W placed on the holding portion 61, and the semiconductor substrate W is placed on the auxiliary arm 711. Is placed in the state of being held by the auxiliary holding unit 71. When the auxiliary holding portion 71 further rises from there, the semiconductor substrate W is lifted by the auxiliary side arm 711, and the holding portion 61 is completely separated from the semiconductor substrate W. That is, the semiconductor substrate W is transferred from the holding unit 61 to the auxiliary holding unit 71.

  Step S20: When the semiconductor substrate W is separated from the holding unit 61, the control unit 9 controls the rotation driving unit 62 to rotate the holding unit 61. That is, in this case, as a result of the processing in step S13, the holding unit 61 (specifically, at least one suction unit 612) is arranged at a position where it interferes with the approach path Q of the hand 211. (The middle part in FIG. 11), the control unit 9 controls the rotation driving unit 62 so that the suction units 612 of the holding unit 61 are arranged at positions where they do not interfere with the approach path Q of the hand 211. Is rotated (lower stage in FIG. 11). Since this processing is performed in a state where the semiconductor substrate W is separated from the holding unit 61, the notch position of the semiconductor substrate W is not changed even if the holding unit 61 is rotated. That is, the rotational position of the semiconductor substrate W is not changed, and only the rotational position of the holder 61 is changed.

  Step S21: When each suction unit 612 is arranged at a position where it does not interfere with the approach path Q of the hand 211, the control unit 9 controls the elevation drive unit 72 to move the auxiliary holding unit 71 from the second position P2 to the first position. Lower to position P1. During this downward movement, each suction unit 612 comes into contact with a first contact point in the peripheral area on the lower surface of the semiconductor substrate W held by the auxiliary holding unit 71, and the semiconductor substrate W is mounted on the group of suction units 612. Is placed. When the auxiliary holding unit 71 is further lowered therefrom, the auxiliary holding unit 71 is separated from the semiconductor substrate W, and the semiconductor substrate W is transferred from the auxiliary holding unit 71 to the holding unit 61.

  By performing the processing of steps S19 to S21, the suction unit 612 of the holding unit 61 holding the semiconductor substrate W arranged in the direction in which the notch is determined is moved by the invasion path Q of the hand 211 and the auxiliary arm 711. It is located at a position that does not interfere with either of the tip portions. That is, the state is the first case. In this state, the processes of steps S16 to S17 described above are performed, and the alignment process for the semiconductor substrate W is completed.

<Iii. In the case of the third case>
As shown in FIG. 12, when the position of the suction unit 612 when the process of step S13 is completed corresponds to the third case (step S22), the processes of the following steps S23 to S27 are performed.

  Step S23: The control section 9 controls the rotation drive section 62 to rotate the holding section 61. That is, in this case, as a result of the processing in step S13, the holding unit 61 (specifically, at least one suction unit 612) is disposed at a position where the holding unit 61 interferes with the intrusion path Q of the hand 211, In addition, since at least one suction unit 612 is disposed at a position where the suction unit 612 interferes with the distal end of the auxiliary arm 711 (the middle part in FIG. 12), the control unit 9 controls the rotation driving unit 62 to control the holding unit. The holding unit 61 is rotated so that each suction unit 612 of the hand 61 does not interfere with the invasion path Q of the hand 211 and the tip of the auxiliary arm 711 (the rotation amount at this time is θ). . When the holding unit 61 holding the semiconductor substrate W is rotated by the rotation amount θ, the notch of the semiconductor substrate W arranged in the direction determined in step S13 is determined by the angle θ equal to the rotation amount θ. It will be located at a position shifted from the direction.

  Step S24: Subsequently, the control section 9 controls the lifting drive section 72 to move the auxiliary holding section 71 from a position (first position) P1 lower than the holding section 61 to a position higher than the holding section 61 (first position). (Position 2) The semiconductor substrate W is raised to P2 and the semiconductor substrate W is transferred from the holding unit 61 to the auxiliary holding unit 71. This process is the same as the process in step S19 described above.

  Step S25: When the semiconductor substrate W is separated from the holding unit 61, the control unit 9 controls the rotation driving unit 62 to rotate the holding unit in the same rotation direction as in step S23 and the same rotation amount θ as in step S23. Rotate 61 further. By performing the processing of step S23 and step S25, the holding unit 61 rotates a total of 2θ. Since this processing is performed in a state where the semiconductor substrate W is separated from the holding unit 61, the position of the notch of the semiconductor substrate W is not changed even if the holding unit 61 is rotated. Therefore, the notch of the semiconductor substrate W remains in a position displaced from the direction determined by the angle θ equal to the rotation amount θ.

  Step S26: Subsequently, the control section 9 controls the elevation drive section 72 to lower the auxiliary holding section 71 from the second position P2 to the first position P1, and moves the semiconductor substrate W from the auxiliary holding section 71 to the holding section. Transfer to 61. This processing is the same as the processing in step S21 described above.

  Step S27: Subsequently, the control section 9 controls the rotation drive section 62 to rotate the holding section 61 in the rotation direction opposite to that of step S23 by the same rotation amount θ as in step S23. This process is performed in a state where the semiconductor substrate W is held by the holding unit 61. Therefore, when the holding unit 61 is rotated, the semiconductor substrate W is also rotated, and the rotation position of the semiconductor substrate W is determined by the process of step S23. The state returns to the state before the correction (that is, the state immediately after the correction of the rotational position of the semiconductor substrate W (step S13) is performed), and the notch is rearranged in the determined direction. At the same time, the rotational position of each suction unit 612 of the holding unit 61 returns to the state before the processing of step S25 is performed, and each suction unit 612 is connected to both the intrusion path Q of the hand 211 and the tip of the auxiliary arm 711. It is placed in a position that does not interfere.

  By performing the processes in steps S23 to S27, the suction unit 612 of the holding unit 61 holding the semiconductor substrate W arranged in the direction in which the notch is defined is moved to the entry path Q of the hand 211 and the auxiliary side arm 711. It is located at a position that does not interfere with either of the tip portions. That is, the state is the first case. In this state, the processes of steps S16 to S17 described above are performed, and the alignment process for the semiconductor substrate W is completed.

<5. Effect>
According to the above-described embodiment, the alignment device 3 includes the holding unit 61 that holds the semiconductor substrate W by sucking the peripheral region of the lower surface of the semiconductor substrate W, and the semiconductor substrate W transferred by the transfer robot 2 Is held in the holding unit 61 (step S11). When the semiconductor substrate W is held by the holding unit 61, the detection unit 8 detects a notch of the semiconductor substrate W held by the holding unit 61. Then, the substrate position correction unit 101 corrects the rotational position of the semiconductor substrate W by rotating the holding unit 61 such that the notch of the semiconductor substrate W held by the holding unit 61 is arranged in a predetermined direction. At this time, the rotation angle of the holding unit 61 differs for each semiconductor substrate W. In some cases, the rotated holding unit 61 is disposed at a position overlapping the entry path Q of the hand 211 of the transfer robot 2 when viewed from above. In this case, the transfer robot 2 cannot receive the semiconductor substrate W held by the holding unit 61 (that is, the semiconductor substrate W whose rotational position has been corrected). Would. Here, in the alignment device 3 according to the above-described embodiment, the lifter 7 and the control unit 9 cooperate to change the rotation position of the holding unit 61 without changing the rotation position of the semiconductor substrate W. The rotation position of 61 is moved to a position that does not overlap the approach path Q of the hand 211 when viewed from above. Therefore, the transfer robot 2 can easily receive the semiconductor substrate W held by the holding unit 61 without interfering with the holding unit 61.

  Further, in the above-described embodiment, since the holding unit 61 holds the semiconductor substrate W by sucking the peripheral area of the lower surface of the semiconductor substrate W, the semiconductor substrate W can be stably held. When is rotated, misalignment is unlikely to occur between the holding portion 61 and the semiconductor substrate W. Therefore, the semiconductor substrate W can be rotated at a sufficiently high speed. As a result, alignment can be performed quickly.

  Further, in the above-described embodiment, the substrate position correction unit 101 moves the holding unit 61 so that the semiconductor substrate W held by the holding unit 62 is disposed at a predetermined position, and moves the semiconductor substrate W horizontally. Is corrected so that the center of the semiconductor substrate W held by the holding unit 61 coincides with the rotation axis of the holding unit 61. Here, since the holding portion 61 holds the semiconductor substrate W by sucking the peripheral region of the lower surface of the semiconductor substrate W, the semiconductor substrate W does not bend. Therefore, the horizontal position of the semiconductor substrate W can be corrected with high accuracy, and high alignment accuracy can be secured.

  Further, in the above embodiment, the arrangement relationship between the holding unit 61 and the auxiliary holding unit 71 is changed from the first state (that is, the first state in which the auxiliary holding unit 71 is disposed below the holding unit 61). By changing to the two states (ie, the second state in which the auxiliary holding unit 71 is disposed above the holding unit 61), the semiconductor substrate W is changed from the holding unit 61 to the auxiliary holding unit 71 and held in this state. The part 61 is rotated. When the holder 61 is rotated, the semiconductor substrate W is transferred from the auxiliary holder 71 to the holder 61 by returning the positional relationship between the holder 61 and the auxiliary holder 71 from the second state to the first state. . According to this configuration, the rotation position of the holding unit 61 can be quickly changed in a simple control mode without changing the rotation position of the semiconductor substrate W.

  In the above embodiment, the suction unit 612 that suctions the semiconductor substrate W by vacuum suction includes the suction port 6120 divided into two or more sections. Therefore, even if the notch formed on the periphery of the semiconductor substrate W is placed on a part of the suction port 6120 (for example, the first section 6120a), another section (for example, the second section 6120b) The substrate W can be sucked by (). Thereby, the substrate W can be held particularly stably.

<6. Other embodiments>
In the above embodiment, the holding unit 61 has the horizontal moving mechanism 63, but the horizontal moving mechanism 63 is not an essential structure. When the horizontal movement mechanism 63 is not provided, the horizontal position of the semiconductor substrate W can be corrected (step S13), for example, as follows.

  That is, when the center position of the semiconductor substrate W is specified based on the fluctuation amount of the peripheral position of the semiconductor substrate W, the control unit 9 controls the rotation driving unit 62 so that all the suction units 612 of the holding unit 61 Then, the holding unit 61 is rotated so as to be at a rotational position where the hand 211 is located at a position that does not interfere with the invasion path Q of the hand 211.

  Subsequently, the transfer robot 2 moves the hand 211 of any of the transfer arms 21a horizontally along the approach path Q at the above-described height H2 to enter the alignment device 3, and moves the hand 211 to the above-described approach position. To place. When the hand 211 is located at the approach position, the hand 211 rises to the position at the height H1 described above. During this ascent, the semiconductor substrate W is placed on the hand 211, and when the hand 211 is further raised therefrom, the semiconductor substrate W is lifted by the hand 211, and the holding portion 61 is completely removed from the semiconductor substrate W. Separate. That is, the semiconductor substrate W is transferred from the holding unit 61 to the hand 211. When the semiconductor substrate W is transferred to the hand 211, the suction of the suction units 213 formed on the upper surface of the hand 211 is started, and the semiconductor substrate W is in a state of being suction-held by the pair of suction units 213.

  When the hand 211 reaches the height H1, the driving mechanism 22 is driven to move the hand 211 at the height H1 in a direction along the approach path Q and in a direction perpendicular to the extending direction of the shaft portion 221 (ie, , The direction perpendicular to the approach path Q) so that the center of the semiconductor substrate W held by the hand 211 coincides with the vertical axis passing through the center of the rotation shaft 621 of the rotation drive unit 62. Placed in the position. However, the holding portion 61 is previously arranged at a position where the vertical axis is located at the center of the alignment device 3.

  When the hand 211 is placed at the position, the hand 211 descends to the height H2 described above. Immediately before (or immediately after) the lowering, the suction of the suction portions 213 formed on the upper surface of the hand 211 is stopped, and the semiconductor substrate W is simply placed on the hand 211. During this lowering, the semiconductor substrate W is placed on the group of suction units 612, and when the hand 211 is further lowered therefrom, the hand 211 is completely separated from the semiconductor substrate W, and the semiconductor substrate W is It is transferred from 211 to the holding unit 61. When the semiconductor substrate W is transferred to the holding unit 61, the control unit 9 opens the valve 613 inserted in the vacuum line 614. Thereby, each suction unit 612 is vacuum-sucked to the semiconductor substrate W, and the semiconductor substrate W is fixedly held (sucked and held) by the group of suction units 612. On the other hand, when the hand 211 reaches the height H2, the hand 211 horizontally moves along the approach path Q at the height H2 and retreats from the alignment device 3. Thereby, the semiconductor substrate W is arranged at a position such that its center position is located at the center of the alignment device 3 and its center position coincides with a vertical axis passing through the center of the rotating shaft portion 62. Become.

  In the above embodiment, for example, between step S21 and step S17 (that is, after the semiconductor substrate W is delivered from the auxiliary holding unit 71 to the holding unit 61, the transfer arm 21 is moved from the holding unit 61 to the semiconductor substrate W). During the time period before W is received), a process of finely adjusting the rotational position of the semiconductor substrate W as necessary may be performed. Specifically, for example, after step S16, the detection unit 8 detects the notch of the semiconductor substrate W to check whether the notch of the semiconductor substrate W is arranged in a predetermined direction, and determines the notch of the semiconductor substrate W. If it is shifted from the given direction, the holding unit 61 may be rotated by a small amount so that the shift becomes zero. According to this configuration, even if the rotational position of the semiconductor substrate W is slightly shifted due to some reason (for example, vibration) during the processing of Steps S19 to S21, the minute shift is not changed. After the solution, the semiconductor substrate W can be transferred to the transfer robot 2.

  In the above-described embodiment, the auxiliary holding unit 71 is configured to include the pair of holding tools 710 and 710 that are arranged to face each other. However, the configuration of the auxiliary holding unit 71 is not limited thereto. For example, like the auxiliary holding portion 71a illustrated in FIG. 13 and FIG. 14, a configuration is provided in which a plurality of (four in the illustrated example) auxiliary side arms 711a extending horizontally are arranged radially from the center. May be. In this case, for example, a support portion 712a rising upward is provided at the tip of each auxiliary side arm 711a, and a plurality of contact points spaced apart from each other in the outer peripheral region of the lower surface of the semiconductor substrate W at the tip of the support portion 712a. (Second contact point).

  In the above embodiment, the holding unit 61 and the hand 211 suck and hold the semiconductor substrate W by suctioning (vacuum suction) the peripheral area of the lower surface of the semiconductor substrate W by a vacuum method (a so-called vacuum chuck). The manner in which the holding unit 61 and the hand 211 suck and hold the semiconductor substrate W is not limited to this. For example, the peripheral region of the lower surface of the semiconductor substrate W may be suctioned (electrostatically attracted) by an electrostatic method to hold the semiconductor substrate W by suction (a so-called electrostatic chuck), or the peripheral region of the lower surface of the semiconductor substrate W. May be sucked by an electromagnetic method (electromagnetic suction) to hold the semiconductor substrate W (a so-called electromagnetic chuck).

  In the above-described embodiment, the holding unit 61 is configured to include the four arms 611 each having the suction unit 612 at the distal end, but the number of the arms 611 having the suction unit 612 at the distal end is limited to four. However, for example, the number may be three or five or more. In addition, the auxiliary holding unit 71 is configured to include the four auxiliary arms 711, but the number of the auxiliary arms 711 is not limited to four, and may be, for example, three or five or more. There may be.

  In the above-described embodiment, the auxiliary holding unit 71 is moved up and down between the first position P1 and the second position P2, so that the auxiliary holding unit 71 is disposed below the holding unit 61 (the first state). ) And the state where the auxiliary holding unit 71 is disposed above the holding unit 61 (second state) has been switched. However, the mode of changing the positional relationship between the auxiliary holding unit 71 and the holding unit 61 is as follows. Not limited to this. For example, a switching mechanism may be provided between the first state and the second state by providing a mechanism for raising and lowering the holding unit 61 and moving the holding unit 61 up and down with respect to the stationary auxiliary holding unit 71. . Further, for example, the switching between the first state and the second state may be performed by moving both the auxiliary holding unit 71 and the holding unit 61 up and down in opposite directions.

  In the above embodiment, the lifter 7 and the control unit 9 cooperate to function as the holding unit position changing unit 102 that changes the rotation position of the holding unit 61 without changing the rotation position of the semiconductor substrate W. However, the mode of the holding unit position changing unit 102 is not limited to this. For example, the holding unit position changing unit may be configured to include a lifter that holds the central portion of the semiconductor substrate W, for example, on the upper surface in a non-contact manner, and lifts the semiconductor substrate W with a Bernoulli chuck, for example, and a control unit that rotates the lifter.

  In the above embodiment, the rotation holding unit 6 includes the horizontal movement mechanism 63, and the substrate position correction unit 101 corrects the horizontal position of the semiconductor substrate W. However, these configurations are not essential, and the configuration of the semiconductor substrate W The correction of the horizontal position may be omitted.

  In the above embodiment, the substrate to be processed is the semiconductor substrate W. However, the substrate to be processed is not limited to the semiconductor substrate W, and may be, for example, a glass substrate.

1 Placement Unit 2 Transfer Robots 21a, 21b Transfer Arm 211 Hand 212 Multi-joint Mechanism 213 Hand Suction Unit 3 Alignment Device 4 Processing Unit 5 Substrate Processing System Control Unit 6 Rotation Hold Unit 61 Hold Unit 611 Arm 612 Suction Unit 613 Valve 614 Vacuum line 62 Rotation drive unit 621 Rotation shaft unit 622 Drive mechanism 63 Horizontal movement mechanism 7 Lifter 71 Auxiliary holding unit 711 Auxiliary arm 712 Connecting unit 72 Elevation drive unit 8 Detector 9 Alignment control unit 100 Substrate processing system 101 Substrate Position correction unit 102 Holder position change unit

Claims (4)

A holding unit that sucks the substrate and holds the substrate at a plurality of spaced first contact points in a peripheral region of a lower surface of the substrate, and a rotation driving unit that rotates the holding unit around a predetermined vertical rotation axis A rotation holding unit comprising:
A detection unit that detects a characteristic portion of the substrate held by the holding unit,
A substrate position correction unit configured to rotate the holding unit based on the detection result of the feature unit so that the feature unit of the board held by the holding unit is arranged in a predetermined direction.
Without changing the rotation position of the substrate, a holding unit position changing unit that changes the rotation position of the holding unit,
A control unit that controls the rotation holding unit and the detection unit to execute an alignment operation of the substrate ,
The alignment operation is
a) a step of holding the substrate by sucking the substrate at a plurality of first contact points spaced apart from each other in a peripheral region of a lower surface of the substrate;
b) detecting a characteristic portion of the substrate held by the holding portion;
c) rotating the holding portion based on the detection result of the feature portion so that the feature portion of the substrate held by the holding portion is arranged in a predetermined direction;
d) changing the rotational position of the holding unit without changing the rotational position of the substrate after the characteristic portion of the substrate is arranged in a predetermined direction;
With
The step of changing the rotation position of the holding unit,
d1) rotating the holding unit that holds the substrate by suction in a predetermined direction by a predetermined rotation amount;
d2) separating the substrate from the holding portion without changing the rotational position of the substrate;
d3) rotating the holding portion separated from the substrate by the predetermined rotation amount in the predetermined direction;
d4) causing the holding unit after rotation to suck and hold the substrate again;
d5) rotating the holding unit that holds the substrate by suction in the direction opposite to the predetermined direction by the predetermined rotation amount;
And a substrate alignment apparatus. The apparatus for aligning a substrate according to claim 1,
The holding unit position changing unit,
Yes an auxiliary holding portion at a plurality of second contact points spaced from each other in the peripheral region of the lower surface of the substrate in contact with the substrate to hold the substrate, and the elevation driving unit for lifting the auxiliary holding portion, a lifter with a And
The control unit is configured to control the rotation holding unit, the detection unit, and the lifter,
The step of separating the substrate from the holding unit without changing the rotational position of the substrate,
Stopping the suction of the substrate in the holding unit, the state of the substrate is placed on the holding unit,
The auxiliary holding unit is moved relatively to the holding unit, and the auxiliary holding unit is positioned above the holding unit from a first state in which the auxiliary holding unit is disposed below the holding unit. by changing the arranged second state, has a step of a substrate placed on said holding part is held on the auxiliary holding portion Ru is separated the substrate from the holding portion,
The step of causing the holding unit after the rotation to suck and hold the substrate again,
By moving the auxiliary holding unit relative to the holding unit and changing the state from the second state to the first state, the substrate held by the auxiliary holding unit is placed on the holding unit after rotation. Transferring , and has a step of sucking the substrate to the holding unit to which the substrate has been transferred,
Substrate alignment device. The substrate alignment apparatus according to claim 1 or 2,
The holding unit includes a suction unit that vacuum-suctions the substrate at the first contact point,
The suction unit includes a suction port divided into two or more sections,
Substrate alignment device. a) a step of holding the substrate by sucking the substrate at a plurality of first contact points spaced apart from each other in a peripheral region of a lower surface of the substrate;
b) detecting a characteristic portion of the substrate held by the holding portion;
c) rotating the holding portion based on the detection result of the feature portion so that the feature portion of the substrate held by the holding portion is arranged in a predetermined direction;
d) changing the rotational position of the holding unit without changing the rotational position of the substrate after the characteristic portion of the substrate is arranged in a predetermined direction;
With
The step of changing the rotation position of the holding unit,
d1) rotating the holding unit that holds the substrate by suction in a predetermined direction by a predetermined rotation amount;
d2) separating the substrate from the holding portion without changing the rotational position of the substrate;
d3) rotating the holding portion separated from the substrate by the predetermined rotation amount in the predetermined direction;
d4) causing the holding unit after rotation to suck and hold the substrate again;
d5) rotating the holding unit that holds the substrate by suction in the direction opposite to the predetermined direction by the predetermined rotation amount;
A substrate alignment method comprising:

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